Touch detection device and detection method thereof, electronic device and readable storage medium

Abstract

A touch detection device, a detection method thereof, an electronic device and a computer readable storage medium. The touch detection device comprises a plurality of drive lines and a plurality of sensing lines intersecting the plurality of drive lines. The detection method comprises: respectively sending at least one encoded drive signal to at least one of the plurality of drive lines, each of the at least one encoded drive signal being a code division multiplexing signal and inputting a corresponding chip sequence; periodically sampling a signal transmitted by an object sensing line of the plurality of sensing lines to obtain a sensing signal of the object sensing line in at least two adjacent sampling periods; and combining at least one sensing chip sequence based on the sensing signal in the at least two adjacent sampling periods to determine a touch position based on the sensing chip sequence. The method can increase the measurement time of each chip, thereby reducing the measurement bandwidth, suppressing display noise interference, and shortening the cycle and improving the measurement reporting rate without increasing the bandwidth.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to a detection method of a touch detection device, a touch detection device, an electronic device and a computer readable storage medium. BACKGROUND

[0002] With the rapid development of computer technology, electronic devices such as mobile phones and computers are increasingly involved in people's life and work. Some electronic devices have touch display screens, which can realize display function and have touch detection function. The touch display screen can control the operation of the electronic device by detecting the touch operation of the user on the touch display screen, and realize better interactive experience. SUMMARY

[0003] At least one embodiment of the present disclosure provides a detection method of a touch detection device, the touch detection device comprising a plurality of drive lines and a plurality of sensing lines intersecting the plurality of drive lines, the method comprising: respectively sending at least one encoded drive signal to at least one drive line in the plurality of drive lines, wherein each of the at least one encoded drive signal is a code division multiplexing signal and respectively inputs a corresponding chip sequence; periodically sampling a signal transmitted by an object sensing line in the plurality of sensing lines to obtain a sensing signal of the object sensing line in at least two adjacent sampling periods; and combining at least one sensing chip sequence based on the sensing signal in the at least two adjacent sampling periods to determine a touch position based on the sensing chip sequence.

[0004] For example, in the detection method provided by an embodiment of the present disclosure, combining at least one sensing chip sequence based on the sensing signal in the at least two adjacent sampling periods comprises: obtaining part of the chips in a sensing chip sequence based on the sensing signal in each of the at least two adjacent sampling periods.

[0005] For example, in the detection method provided by an embodiment of the present disclosure, the number of the part of the chips is half or less than half of the number of chips contained in one of the sensing chip sequences.

[0006] For example, in the detection method provided by an embodiment of the present disclosure, the at least two adjacent sampling periods comprise a first sampling period and a second sampling period adjacent to the first sampling period and after the first sampling period, and each of the sampling periods can receive M chips. Combining at least one sensing chip sequence based on the sensing signal in the at least two adjacent sampling periods comprises: combining M chips of the first sampling period with N chips of M chips of the second sampling period to obtain one sensing chip sequence, M and N are integers greater than 1 and N is less than M.

[0007] For example, in the detection method provided by an embodiment of the present disclosure, the N chips in the second sampling period are the first N chips in the second sampling period.

[0008] For example, in the detection method provided by an embodiment of the present disclosure, the at least two adjacent sampling periods further include a third sampling period after and adjacent to the second sampling period. Based on the sensing signals in the at least two adjacent sampling periods, the at least one sensing chip sequence is combined by using N chips in the second sampling period and N chips in the M chips in the third sampling period.

[0009] For example, in the detection method provided by an embodiment of the present disclosure, in the other sensing chip sequence, the first N chips in the M chips of the second sampling period are taken as the last N chips in the other sensing chip sequence.

[0010] For example, in the detection method provided by an embodiment of the present disclosure, each of the sampling periods is less than or equal to 2 milliseconds.

[0011] For example, in the detection method provided by an embodiment of the present disclosure, the at least one driving line includes S driving lines, S is an integer greater than 1, and the at least one encoded driving signal sent to the at least one driving line in the plurality of driving lines includes corresponding encoded driving signals sent to the S driving lines respectively and simultaneously.

[0012] For example, in the detection method provided by an embodiment of the present disclosure, the touch detection device is a mutual capacitance touch detection device.

[0013] An embodiment of the present disclosure provides a touch detection device, which includes a plurality of driving lines and a plurality of sensing lines intersecting the plurality of driving lines, a driving module, a sensing module, and a combination module. The driving module is configured to send at least one encoded driving signal to at least one driving line in the plurality of driving lines, wherein each of the at least one encoded driving signal is a code division multiplexing signal and inputs a chip sequence respectively. The sensing module is configured to periodically sample a signal transmitted by an object sensing line in the plurality of sensing lines to obtain a sensing signal of the object sensing line in at least two adjacent sampling periods. The combination module is configured to combine at least one sensing chip sequence based on the sensing signal in the at least two adjacent sampling periods.

[0014] For example, the touch detection device provided by an embodiment of the present disclosure further includes a determination module configured to determine the touch position based on the sensing chip sequence.

[0015] The electronic device includes a processor, a memory including one or more computer program modules, wherein the one or more computer program modules are stored in the memory and configured to be executed by the processor, and the one or more computer program modules include instructions for implementing the detection method of the touch detection apparatus provided in any embodiment of the present disclosure.

[0016] The computer-readable storage medium stores non-transitory computer-readable instructions, which, when executed by a computer, can implement the detection method of the touch detection apparatus provided in any embodiment of the present disclosure.

[0017] The detection method of the touch detection apparatus provided in at least one embodiment of the present disclosure can increase the measurement time of each chip on the basis of ensuring that one sensing chip sequence is obtained in each sampling period, thereby reducing the measurement bandwidth, improving the suppression of display noise interference, or shortening the period without increasing the bandwidth, and improving the measurement reporting rate. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings described in the following description only relate to some embodiments of the present disclosure, but not limit the present disclosure.

[0019] Figure 1 A schematic diagram of a mutual capacitance touch detection apparatus is shown;

[0020] Figure 2 A schematic diagram of a chip sequence is shown;

[0021] Figure 3 A flowchart of a detection method of a touch detection apparatus provided in at least one embodiment of the present disclosure is shown;

[0022] Figure 4 A schematic diagram of chip recombination provided in at least one embodiment of the present disclosure is shown;

[0023] Figure 5 A schematic diagram of another chip recombination provided in at least one embodiment of the present disclosure is shown;

[0024] Figure 6 A schematic diagram of another chip recombination provided in at least one embodiment of the present disclosure is shown;

[0025] Figure 7 A schematic block diagram of a touch detection apparatus provided in at least one embodiment of the present disclosure is shown;

[0026] Figure 8A schematic block diagram of an electronic device is shown according to at least one embodiment of the present disclosure.

[0027] Figure 9 A schematic block diagram of another electronic device is shown according to at least one embodiment of the present disclosure; and

[0028] Figure 10 A schematic diagram of a computer-readable storage medium is shown according to at least one embodiment of the present disclosure. DETAILED DESCRIPTION

[0029] For the purpose of making the objects, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some but not all of the embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative effort fall within the scope of the present disclosure.

[0030] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the ordinary meanings as understood by a person of ordinary skill in the art to which the present disclosure pertains. The terms “first”, “second”, and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “one”, “a”, or “the” and similar terms do not denote a quantity of the preceding elements, but indicate the existence of at least one of the preceding elements. The terms “include”, “contain”, and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and equivalents thereof, and do not exclude other elements or objects. The terms “connected” or “linked” and similar terms do not limit to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper”, “lower”, “left”, “right”, and the like are merely used to indicate relative positional relationships, and when the absolute positions of the described objects are changed, the relative positional relationships can also be changed accordingly.

[0031] The touch screen can include a capacitive touch screen (also referred to as a capacitive screen), which includes self-capacitive and mutual-capacitive.

[0032] Figure 1 A schematic diagram of a mutual-capacitive touch detection apparatus is shown. As Figure 1As shown, the mutual capacitance touch detection device can include a plurality of drive lines T1-Ts (s is an integer greater than 1) extending in a first direction and a plurality of sense lines R1-Rm (m is an integer greater than 1) crossing the plurality of drive lines and extending in a second direction, for example, the first direction is perpendicular to the second direction. The drive lines T1-Ts and the sense lines R1-Rm can be made of ITO (Indium tin oxide), and the drive lines and the sense lines can be transverse electrodes and longitudinal electrodes, respectively. The position where each drive line crosses each sense line can form a capacitor, and the drive line and the sense line are the two poles of the capacitor. The touch detection device can also include a driver connected to the drive lines T1-Ts and a detector connected to the sense lines R1-Rm.

[0033] When a finger touches the capacitive screen, it will affect the coupling between the two poles of the capacitor near the touch point, thereby changing the capacitance between the two poles. When detecting the touch point, the driver excites the transverse electrodes (i.e., the drive lines T1-Ts) to emit excitation signals, and the longitudinal electrodes (i.e., the sense lines R1-Rm) simultaneously receive signals, and the detector detects the sensing signals of the longitudinal electrodes, and further determines the position of the touch point.

[0034] In one way, the drive lines T1-Ts can emit excitation signals in a time-division multiplexing (TDM) manner, for example, the driver can drive T1-Ts to emit excitation signals in a time-division manner, so that the detector can distinguish different drive lines by time. For example, as shown in Figure 1 As shown, the drive lines T1-Ts emit drive signals in turn at different times, and if the touch position is P, the sense line R4 corresponding to the touch point P can generate a sensing signal related to the touch operation during the scanning process of the drive lines T1-Ts. By analyzing the time information of the sensing signal, it can be determined that the sensing signal is generated during the drive signal emission period of the drive line T3, and further the touch position can be determined to include the intersection P of the drive line T3 and the sense line R4.

[0035] In another way, the drive lines T1-Ts can emit excitation signals in a code-division multiplexing (CDM) manner, for example, the driver can make the drive lines T1-Ts emit excitation signals encoded by different chip sequences, respectively, and the detector performs chip measurement based on the sensing signals of the sense lines R1-Rm, and distinguishes different drive lines by chip sequences. The code-division multiplexing manner allows multiple drive lines to emit signals that coexist in time and can be distinguished at the detector. For example, as shown in Figure 1As shown, the driving lines T1-Ts respectively and simultaneously emit driving signals encoded via corresponding chip sequences, the chip sequences corresponding to different driving lines are different, and the driving signals encoded via different chips can have different pulse waveforms. If the touch position is point P, the sensing line R4 corresponding to the touch point P can generate a sensing signal related to the touch operation, and the sensing signal can contain the chip information carried by the driving signal emitted by the driving line T3. By analyzing the sensing signal of the sensing line R4, the chip sequence can be obtained, and then the driving line corresponding to the current touch position can be determined according to the chip sequence, which contains the driving line T3, so that the touch position can be determined to include the intersection point P of the driving line T3 and the sensing line R4.

[0036] For example, the driving lines T1-Ts can respectively input corresponding chip sequences, each chip sequence may, for example, contain +1, -1 and 0 values, the +1 value may, for example, correspond to a square wave drive with a frequency of ω, and the -1 value may, for example, correspond to a square wave with the same frequency ω but with a π radian (180°) phase shift, and 0 may, for example, represent no drive.

[0037] For example, the signal received by the sensing line can be detected by IQ demodulation, and the IQ demodulator can include a plurality of measurement channels, each measurement channel k can measure an IQ demodulation value.

[0038] For square wave driving, 0 radian phase (+1 drive), the IQ demodulation value measured by the measurement channel k can be calculated as follows:

[0039]

[0040] where N represents the number of ADC (Analog-to-digital converter) samples, T represents the ADC sampling period, y k (n) represents the nth ADC sample of channel k, and θ represents the phase change. In this scheme, the measurement bandwidth is proportional to the inverse of the measurement time.

[0041] For π phase shift driving (-1 drive), the IQ demodulation value of channel k is and will produce the same amplitude but opposite polarity as , as shown below:

[0042]

[0043] The chip sequences corresponding to the plurality of driving lines may, for example, be orthogonal. The chip sequences corresponding to the plurality of driving lines can be a row in a chip matrix C, and the chip matrix C may, for example, be a Hadamard matrix or a Circulant matrix.

[0044] Figure 2A schematic diagram of a chip sequence is shown. (For example...) Figure 2 As shown, for example, each chip sequence may include 8 chips (chip 1 to chip 8), and each chip can be +1, -1, or 0. For example, the chip sequence corresponding to drive line T1 is [0, 1, -1, -1, 1, -1, 1, -1], and the chip sequence corresponding to drive line T2 is [-1, 0, 1, 1, -1, -1, 1, -1], and so on. The above chip sequences are only examples. In practical applications, the number and value of chips in each chip sequence can be determined according to actual needs, and this disclosure does not impose any limitations on this.

[0045] For example, a chip sequence can be measured in each cycle. If a cycle is 2ms, then 8 chips (e.g., chips 1 to 8) are measured within 2ms, and after a short idle period, the measurement for the next cycle is performed. In this way, a complete chip sequence can be measured in each cycle. In this case, the measurement overlap rate is 0%, meaning that there is no overlap between measurements in consecutive cycles. Each cycle corresponds to one frame, which can be understood as, for example, one touch detection, and one touch detection corresponds to the generation of one touch report (or measurement report).

[0046] In display panels with integrated touch measurement systems, if the display noise harmonics match the driving frequency of the touch system, the display noise may interfere with touch measurement. In some cases, touch detection requires a high measurement report rate; however, a higher measurement report rate results in a shorter cycle time, leading to a shorter measurement time per chip and consequently a wider measurement bandwidth. This increases the risk of interference from display noise harmonics.

[0047] At least one embodiment of this disclosure provides a detection method for a touch detection device, a touch detection device, an electronic device, and a computer-readable storage medium. The touch detection device includes multiple drive lines and multiple sensing lines intersecting the drive lines. The detection method includes: sending at least one encoded drive signal to at least one of the multiple drive lines, wherein each of the at least one encoded drive signal is a code division multiplexing signal and is respectively input to a corresponding chip sequence; periodically sampling the signal transmitted by an object sensing line among the multiple sensing lines to obtain a sensing signal of the object sensing line within at least two adjacent sampling periods; and combining the sensing signals within the at least two adjacent sampling periods to obtain at least one sensing chip sequence, thereby determining a touch position based on the sensing chip sequence.

[0048] The detection method of the touch detection device can increase the measurement time of each chip on the basis of obtaining a sensing chip sequence in each sampling period, thereby reducing the measurement bandwidth, improving the suppression of display noise interference, or shortening the period and improving the measurement reporting rate without increasing the bandwidth.

[0049] Figure 3 A flowchart of a detection method of a touch detection device according to an embodiment of the present disclosure is shown.

[0050] As shown in Figure 3 The detection method can include steps S110-S130.

[0051] Step S110: at least one encoded driving signal is respectively sent to at least one driving line in the plurality of driving lines, each of the at least one encoded driving signal is a code division multiplexing signal and respectively inputs a corresponding chip sequence.

[0052] Step S120: periodically sample the signal transmitted by the object sensing line in the plurality of sensing lines to obtain the sensing signal of the object sensing line in at least two adjacent sampling periods.

[0053] Step S130: based on the sensing signal in at least two adjacent sampling periods, at least one sensing chip sequence is combined to determine the touch position based on the sensing chip sequence.

[0054] The detection method of the embodiment of the present disclosure can be applied to the mutual capacitance touch detection device described above, which includes a plurality of driving lines T1-Ts and a plurality of sensing lines R1-Rm intersecting the plurality of driving lines.

[0055] For example, in step S110, different chip sequences can be used to respectively encode the signals of the driving lines T1-Ts to form code division multiplexing signals, and the driving lines T1-Ts respectively output the encoded signals.

[0056] For example, the at least one driving line can include S driving lines, S is an integer greater than 1, and step S110 includes respectively and simultaneously sending corresponding encoded driving signals to the S driving lines. That is, the encoded driving signals can be respectively and simultaneously sent to the plurality of driving lines, and the driving signals corresponding to different driving lines can be encoded using different chip sequences to distinguish different driving lines using chip sequences.

[0057] For example, each chip sequence can contain multiple chips, and each drive line can cyclically use multiple chips in the corresponding chip sequence for encoding, for example, a chip sequence corresponding to a drive line contains chip 1-chip 8, and the signal of the drive line can be encoded by chip 1-chip 8 in turn, so that the drive line successively sends drive signals encoded by chip 1-chip 8, and then cycles back to chip 1 to cyclically send drive signals encoded by chip 1-chip 8. In the process of sending drive signals, an idle time can be included, for example, after continuously sending a group of drive signals, a certain idle time (no signal is sent in the idle time) is interval, and then a group of drive signals is continuously sent, and then a certain idle time is interval, and the process is repeated. The time of continuously sending a group of drive signals can be referred to as a drive period, and in the embodiments of the present disclosure, a group of drive signals sent in each drive period can contain signals encoded by K chips, where K is a positive integer and can be less than the number of chips contained in the chip sequence. For example, in the case of a chip sequence containing 8 chips, K can be less than 8, that is, a part of the chips in the corresponding chip sequence can be sent in each drive period.

[0058] For example, in step S120, the object sensing line can be any one of the multiple sensing lines R1-Rm, and the object sensing line can be the triggered sensing line, that is, the sensing line corresponding to the touch position. The embodiments of the present disclosure take the object sensing line as an example to illustrate steps S120 and S130, and in actual use, steps S120 and S130 can also be performed on other sensing lines in addition to the object sensing line. For example, in each sampling period, a group of sensing signals can be sampled from the object sensing line, and the sensing signals can contain chip information. In the process of collecting sensing signals, an idle time can be included, for example, after continuously collecting a group of sensing signals, a certain idle time is interval, and then a group of sensing signals is continuously collected, and then a certain idle time is interval, and the process is repeated. The time of continuously collecting a group of sensing signals each time can be referred to as a sampling period. The sampling period of the sensing signal corresponds to the drive period of the drive signal. If a drive signal encoded by K chips is sent in a drive period, a group of sensing signals collected in the corresponding sampling period can contain information of the K chips. In the idle time, the collected sensing signals can be analyzed to obtain the corresponding chip sequence and determine the touch point and generate the touch report according to the chip sequence.

[0059] In step S130, a sensing chip sequence can be determined according to the sensing signals in each adjacent two (or more) sampling periods. In order to distinguish from the chip sequence used for encoding the drive signal, the chip sequence obtained according to the sensing signal is referred to as a sensing chip sequence.

[0060] For example, step S130 can include obtaining a number of partial chips in a sensing chip sequence based on the induced signal of each of the at least two adjacent sampling periods. For example, the number of partial chips can be half of the number of chips contained in a sensing chip sequence.

[0061] Figure 4 A schematic diagram of chip recombination is shown. As shown, for example, during encoding, each driving period can employ a number of partial chips (e.g., K chips) in a chip sequence for encoding. During detection, a number of partial chips in the chip sequence can be detected corresponding to each sampling period, and the chips corresponding to two or more sampling periods can be combined to form a complete chip sequence (sensing chip sequence). For example, a chip sequence contains chip 1-chip 8, if the chip sequence is evenly divided into two parts (i.e., two code segments) during encoding, the first half and the second half of the chip sequence are alternately employed for encoding. During detection, four chips can be obtained corresponding to each sampling period, for example, chip 1-chip 4 can be obtained corresponding to the i-th (i is a positive integer) sampling period; chip 5-chip 8 can be obtained corresponding to the i+1-th sampling period; chip 1-chip 4 can be obtained corresponding to the i+2-th sampling period; and so on. The chips corresponding to each adjacent two sampling periods can be combined to obtain a complete chip sequence, for example, the chips corresponding to the i-th sampling period and the chips corresponding to the i+1-th sampling period can be combined to obtain a complete chip sequence (chip 1-chip 8); a chip sequence can be obtained by combining the chips corresponding to the i+1-th sampling period and the i+2-th sampling period; and so on. In this case, the chip sequence obtained in the previous period and the chip sequence obtained in the next period have 4 chips in common, and in the case of a chip sequence containing 8 chips, the overlap rate is 4 / 8=50%, that is, the two adjacent chip sequences obtained by successive measurement have overlapping chips, and the proportion of overlap is 50%. Figure 4 For example, in some other embodiments, the number of partial chips corresponding to each sampling period in step S130 can be less than half of the number of chips contained in a sensing chip sequence. For example, a chip sequence can be divided into a plurality of code segments, for example, three or more, and the chips corresponding to adjacent three or more sampling periods can be combined to obtain a complete chip sequence. For example, if a chip sequence contains 8 chips, the chip sequence can be divided into 4 code segments, 2 chips can be measured in each sampling period, and 2 chips in each sampling period and the chips in the previous three periods can be combined to obtain a sensing chip sequence.

[0062]

[0063] ​According to the detection method of the embodiments of the present disclosure, part of the chips (for example, half) in each sampling period can be measured, and the part of the chips in the current sampling period is combined with the chips in one or more previous sampling periods to obtain a sensing chip sequence. Figure 2 In the case of measuring a whole chip sequence in each sampling period (0% overlap rate, that is, there is no overlap between two adjacent chip sequences measured in sequence), if the measurement time of a chip sequence is 2 ms, and each chip sequence contains 8 chips, the measurement time of each chip is 2 / 8=0.25 ms. According to the detection method of the embodiments of the present disclosure, if half of the chips in each sampling period are obtained (50% overlap rate), the measurement time of each chip is 2 / 4=0.5 ms, and the measurement time of a chip sequence is increased to 4 ms, and the measurement time of a chip is increased to twice that of the original (0% overlap rate). For another example Figure 6 In the example shown, the overlap rate is 25%, the measurement time of each chip is 2 / 6≈0.333 ms, and the measurement time of each chip is about 1.33 times that of the original (0% overlap rate). Therefore, if the overlap rate is increased from 0% to C (C is a value greater than 0 and less than 1) according to the embodiments of the present disclosure while keeping the sampling period unchanged, the measurement time of each chip can be 1 / (1-C) times the measurement time of each chip in the case of 0% overlap rate, and 1 / (1-C) is a value greater than 1.

[0064] Therefore, compared with the scheme of 0% overlap rate, the detection method of the embodiments of the present disclosure can increase the measurement time of each chip (for example, double) while keeping the sampling period unchanged (for example, the sampling period is 2 ms), and further reduce the measurement bandwidth and improve the suppression of display noise interference.

[0065] For example, in some examples, as described above, the sampling period can be kept unchanged, the measurement time of each chip is increased by the detection method of the embodiments of the present disclosure, and further the bandwidth is reduced and the noise is suppressed. In other embodiments, the measurement time of each chip can be kept unchanged, the sampling period is shortened by the detection method of the embodiments of the present disclosure, and the reporting rate is improved.

[0066] Figure 5 Another schematic diagram of chip recombination provided by at least one embodiment of the present disclosure is shown. As shown in Figure 5 As shown, each chip sequence includes, for example, 8 chips, 4 chips are measured in each sampling period, and the overlap rate is 50%. Compared with Figure 2The scheme shown with a 0% overlap rate can, in some embodiments, keep the measurement time per chip constant while shortening the measurement cycle, thus improving the touch reporting rate. For example, with a 0% overlap rate, the measurement time per chip is 0.25 ms. If the chip measurement time is kept constant, increasing the overlap rate... Figure 5 In the example shown, with an overlap rate of 50%, each cycle can be shortened to half its original length (when the overlap rate is 0%), and the reporting rate increases to twice its original length. If the overlap rate is increased to 25%, the duration of each cycle can be shortened to three-quarters of its original length (when the overlap rate is 0%), and the reporting rate increases to four-thirds of its original length. Therefore, while keeping the chip measurement time constant, if the overlap rate is increased from 0% to C (where C is a value greater than 0 and less than 1) according to the embodiments of this disclosure, the reporting rate can be 1 / (1-C) times that of the case with an overlap rate of 0%, where 1 / (1-C) is a value greater than 1. Since the chip measurement time is not increased, there is no increase in bandwidth, and therefore no increase in the risk of interference from display noise harmonics. Therefore, compared to the scheme with an overlap rate of 0%, the detection method of the embodiments of this disclosure can also shorten the cycle and improve the measurement reporting rate without increasing the bandwidth.

[0067] Therefore, the detection method of the touch detection device provided in this disclosure combines the sensing signals (or chips) in at least two adjacent sampling periods to obtain a complete sensing chip sequence. This can increase the measurement time of each chip while ensuring that a sensing chip sequence is obtained in each sampling period, thereby reducing the measurement bandwidth and improving the suppression of display noise interference. Alternatively, it can shorten the period and improve the measurement reporting rate without increasing the bandwidth.

[0068] For example, the embodiments described above are all examples of uniformly dividing the chip sequence and combining all the chips of the current sampling period with all the chips of the previous one or more sampling periods. In addition, in some other embodiments, some chips of the multiple chips obtained in the current sampling period can be combined with chips of the previous sampling period, or all the chips of the current sampling period can be combined with some chips of the multiple chips obtained in the previous sampling period.

[0069] For example, the at least two adjacent sampling periods in step S130 include a first sampling period and a second sampling period that follows and is adjacent to the first sampling period. Each sampling period can receive M chips. A sensing chip sequence can be obtained by combining the M chips from the first sampling period with N chips from the M chips in the second sampling period, where M and N are integers greater than 1 and N is less than M. For example, the N chips in the second sampling period can be the first N chips in the second sampling period. It should be noted that "before" and "after" mentioned in the embodiments of this disclosure can be understood as sequential in time. For example, the first N chips refer to the N chips that are earlier in the measurement time, and the second sampling period that follows the first sampling period refers to the second sampling period that is later in time than the first sampling period.

[0070] Figure 6 A schematic diagram illustrating another chip reassembly provided by at least one embodiment of this disclosure is shown. For example... Figure 6 As shown, the first sampling period is, for example, the first sampling period T1, and the second sampling period is, for example, the second sampling period T2. A chip sequence contains, for example, 8 chips (chip 1 to chip 8), which can be used cyclically. Each sampling period can detect, for example, 6 chips. For example, the first sampling period T1 can correspond to chips 1 to 6, and the second sampling period can correspond to chips 7, chips 8, and chips 1 to 4 of the next cycle. After obtaining the corresponding chips in the second sampling period T2, the first two chips (chip 7 and chip 8) of the second sampling period T2 can be combined with all the chips (chip 1 to chip 6) of the previous first sampling period T1 to obtain a sensing chip sequence.

[0071] For example, the at least two adjacent sampling periods also include a third sampling period that is after the second sampling period and adjacent to the second sampling period. Another sensing chip sequence can be obtained by combining M chips in the second sampling period with N chips from the M chips in the third sampling period.

[0072] For example, the third sampling period is, for example, Figure 6 The third sampling period T3 is shown, which corresponds to chips 5 to 8 and chips 1 and 2 in the next cycle. After obtaining the corresponding chips in the third sampling period T3, the first two chips (chips 5 and 6) of the third sampling period T2 can be combined with the chips (chips 7 to 4) of the preceding second sampling period T2 to obtain another sensing chip sequence.

[0073] For example, after combining some chips from the current period with chips from the previous period, the chips can be reordered to obtain chips 1 to 8 arranged in sequence.

[0074] For example, in the other sensing chip sequence, the first N chips of the M chips in the second sampling period are taken as the last N chips in the other sensing chip sequence. For example, after combining the 6 chips in the second sampling period T2 with the first two chips in the third sampling period T3, the chip combination of chips 7, 8, 1, 2, 3, 4, 5 and 6 is obtained, which can be reordered, for example, chips 7 and 8 in the second sampling period T2 are placed behind chip 6 in the third sampling period T3, and the chips 1-8 in sequence are obtained, which are taken as the other sensing chip sequence.

[0075] For example, a further sensing chip sequence can also be obtained by combining the M chips (for example, 6 chips) in the third sampling period with N chips (for example, 2 chips) of the M chips in the fourth sampling period T4. After the fourth sampling period T4, the next sampling period can cycle back to the code segment corresponding to the first sampling period T1. Figure 6 The way of combining the first two chips in the current sampling period with all 6 chips in the previous sampling period shown corresponds to an overlap rate of 2 / 8 = 25%, that is, there are overlapping chips between the two adjacent chip sequences measured in succession, and the proportion of overlap is 25%.

[0076] For example, in some other embodiments, all chips in the current sampling period can be combined with part of the chips in the previous sampling period to obtain a sensing chip sequence. For example, taking the chips shown above as an example, all chips in the second sampling period T2 (chips 7-chip 4) can be combined with the last two chips (chips 1 and 2) in the first sampling period T1 to obtain a sensing chip sequence; all chips in the third sampling period T3 (chips 5-chip 2) can be combined with the last two chips (chips 3 and 4) in the previous second sampling period T2 to obtain another sensing chip sequence; and so on. Figure 6 For example, taking the chips shown above as an example, all chips in the second sampling period T2 (chips 7-chip 4) can be combined with the last two chips (chips 1 and 2) in the first sampling period T1 to obtain a sensing chip sequence; all chips in the third sampling period T3 (chips 5-chip 2) can be combined with the last two chips (chips 3 and 4) in the previous second sampling period T2 to obtain another sensing chip sequence; and so on.

[0077] For example, the above combination of part of the chips in the current sampling period with all chips in the previous sampling period, or the combination of all chips in the current sampling period with part of the chips in the previous sampling period, makes the chip combination mode more flexible, and any overlap rate can be set according to actual needs, and then the required bandwidth is obtained.

[0078] For example, for the overlapped measurement approach, there is a risk that the touch position can move between adjacent measurement periods, which can cause touch position detection errors, but if the reporting rate is high enough, the position error can be controlled within a small range. For example, each sampling period can be less than or equal to 2 ms, and the reporting rate corresponding to this period condition can ensure a small position error. In high noise conditions, a trade-off between position accuracy and filtering of display noise can be made, and the overlapped measurement approach allows this trade-off between position accuracy and filtering of display noise while maintaining a high reporting rate.

[0079] For example, according to the above description, the chip corresponding to the current sampling period can be obtained according to the sensing signal of the current sampling period, and then the chips of the current sampling period and one or more previous sampling periods are combined to obtain a sensing chip sequence. In addition, in some other embodiments, the sensing signals of the current sampling period and one or more previous sampling periods can be combined first, and then the sensing chip sequence is obtained according to the combined sensing signals. Based on this approach, the measurement time of each chip can also be increased, the measurement bandwidth can be reduced, the suppression of display noise interference can be improved, and the measurement reporting rate can be improved without increasing the bandwidth.

[0080] The at least one embodiment of the present disclosure also provides a touch detection device.

[0081] Figure 7 A schematic block diagram of a touch detection device 200 provided by at least one embodiment of the present disclosure is shown.

[0082] For example, as shown in Figure 7 The touch detection device 200 includes a plurality of drive lines 210 and a plurality of sensing lines 220 intersecting the plurality of drive lines, a drive module 230, a sensing module 240, and a combination module 250.

[0083] The drive module 230 is configured to respectively send at least one encoded drive signal to at least one drive line in the plurality of drive lines, wherein each of the at least one encoded drive signal is a code division multiplexing signal and respectively inputs a chip sequence. The drive module 230 may, for example, perform Figure 3 The step S110 described.

[0084] The sensing module 240 is configured to periodically sample the signal transmitted by the object sensing line in the plurality of sensing lines to obtain the sensing signal of the object sensing line in at least two adjacent sampling periods. The sensing module 240 may, for example, perform Figure 3 The step S120 described.

[0085] The combination module 250 is configured to combine the sensing signals in at least two adjacent sampling periods to obtain at least one sensing chip sequence. For example, the combination module 250 can perform Figure 3 The step S130 is described.

[0086] For example, the plurality of drive lines 210 are, for example, the drive lines T1-Ts as shown in the figure, and the plurality of sensing lines 220 are, for example, the sensing lines R1-Rm as shown in the figure. Figure 1 Figure 1

[0087] For example, the drive module 230, the sensing module 240, and the combination module 250 can be hardware, software, firmware, and any feasible combination thereof. For example, the drive module 230, the sensing module 240, and the combination module 250 can be special-purpose or general-purpose circuits, chips, or devices, or a combination of a processor and a memory. The specific implementation forms of the above-mentioned units are not limited in the embodiments of the present disclosure.

[0088] It should be noted that in the embodiments of the present disclosure, the part modules (the drive module 230, the sensing module 240, and the combination module 250) of the touch detection apparatus 200 correspond to the steps of the detection method of the touch detection apparatus, and the specific functions of the touch detection apparatus 200 can be referred to the related description of the detection method of the touch detection apparatus, which will not be described here. Figure 7 The components and structures of the touch detection apparatus 200 shown are only exemplary and are not limited, and the touch detection apparatus 200 can further include other components and structures as needed.

[0089] For example, the touch detection apparatus provided by an embodiment of the present disclosure further includes a determination module configured to determine the touch position based on the sensing chip sequence.

[0090] For example, in the touch detection apparatus provided by an embodiment of the present disclosure, the combination module 250 can be further configured to obtain part of the chips in one sensing chip sequence based on the sensing signals in each of the at least two adjacent sampling periods.

[0091] For example, in the touch detection apparatus provided by an embodiment of the present disclosure, the number of the part of the chips is half or less than half of the number of the chips included in one sensing chip sequence.

[0092] ​​For example, in the touch detection apparatus provided by an embodiment of the present disclosure, the at least two adjacent sampling periods include a first sampling period and a second sampling period adjacent to the first sampling period and following the first sampling period, and each sampling period can receive M chips. The combination module 250 can be further configured to combine the M chips of the first sampling period with N chips of the M chips of the second sampling period to obtain a sensing chip sequence, M and N being integers greater than 1 and N being less than M.

[0093] For example, in the touch detection apparatus provided by an embodiment of the present disclosure, the N chips in the second sampling period are the first N chips in the second sampling period.

[0094] For example, in the touch detection apparatus provided by an embodiment of the present disclosure, the at least two adjacent sampling periods further include a third sampling period adjacent to the second sampling period and following the second sampling period. The combination module 250 is further configured to combine the M chips of the second sampling period with N chips of the M chips of the third sampling period to obtain another sensing chip sequence.

[0095] For example, in the touch detection apparatus provided by an embodiment of the present disclosure, in the other sensing chip sequence, the first N chips of the M chips of the second sampling period are taken as the last N chips in the other sensing chip sequence.

[0096] For example, in the touch detection apparatus provided by an embodiment of the present disclosure, each sampling period is less than or equal to 2 ms.

[0097] For example, in the touch detection apparatus provided by an embodiment of the present disclosure, the at least one driving line includes S driving lines, S being an integer greater than 1. The driving module 230 can be further configured to respectively and simultaneously send corresponding encoded driving signals to the S driving lines.

[0098] For example, in the touch detection apparatus provided by an embodiment of the present disclosure, the touch detection apparatus is a mutual capacitance touch detection apparatus.

[0099] At least one embodiment of the present disclosure further provides an electronic device including a processor and a memory, the memory including one or more computer program modules. The one or more computer program modules are stored in the memory and configured to be executed by the processor, and the one or more computer program modules include instructions for implementing the detection method of the touch detection apparatus described above. The electronic device can increase the measurement time of each chip on the basis of ensuring that one sensing chip sequence is obtained in each sampling period, thereby reducing the measurement bandwidth, improving the suppression of display noise interference, or shortening the period without increasing the bandwidth, and improving the measurement reporting rate.

[0100] Figure 8 A schematic block diagram of an electronic device is provided for some embodiments of the present disclosure. As shown, the electronic device 300 includes a processor 310 and a memory 320. The memory 320 stores non-transitory computer-readable instructions (e.g., one or more computer program modules). The processor 310 is configured to execute the non-transitory computer-readable instructions, which, when executed by the processor 310, perform one or more steps of the detection method of the touch detection apparatus described above. The memory 320 and the processor 310 can be interconnected by a bus system and / or other forms of connection mechanisms (not shown). Figure 8 For example, the processor 310 can be a central processing unit (CPU), a graphics processing unit (GPU), or other forms of processing units having data processing and / or program executing capabilities. For example, the central processing unit (CPU) can be of X86 or ARM architecture, etc. The processor 310 can be a general purpose processor or a special purpose processor, and can control other components in the electronic device 300 to perform desired functions.

[0101] For example, the memory 320 can include any combination of one or more computer program products, which can include various forms of computer-readable storage media, for example, volatile memory and / or non-volatile memory. For example, the volatile memory can include random access memory (RAM), cache memory, etc. The non-volatile memory can include read-only memory (ROM), hard disk, erasable programmable read-only memory (EPROM), compact disc read-only memory (CD-ROM), USB memory, flash memory, etc. One or more computer program modules can be stored on the computer-readable storage media, and the processor 310 can execute the one or more computer program modules to implement various functions of the electronic device 300. Various application programs and various data used and / or generated by the application programs, etc. can also be stored in the computer-readable storage media.

[0102] It should be noted that, in the embodiments of the present disclosure, the specific functions and technical effects of the electronic device 300 can refer to the description of the detection method of the touch detection apparatus above, which will not be described here again.

[0103]

[0104] A schematic block diagram of another electronic device is provided for some embodiments of the present disclosure. The electronic device 400 is suitable for implementing the detection method of the touch detection apparatus provided by the embodiments of the present disclosure, for example. The electronic device 400 can be a terminal device, etc. It should be noted that, Figure 9 Figure 9 The electronic device 400 shown is only an example, which will not bring any limitation to the functions and use range of the embodiments of the present disclosure.​

[0105] like Figure 9 As shown, electronic device 400 may include a processing device (e.g., a central processing unit, a graphics processor, etc.) 410, which can perform various appropriate actions and processes according to a program stored in read-only memory (ROM) 420 or a program loaded from storage device 480 into random access memory (RAM) 430. RAM 430 also stores various programs and data required for the operation of electronic device 400. Processing device 410, ROM 420, and RAM 430 are interconnected via bus 440. Input / output (I / O) interface 450 is also connected to bus 440.

[0106] Typically, the following devices can be connected to I / O interface 450: input devices 460 including, for example, touchscreens, touchpads, keyboards, mice, cameras, microphones, accelerometers, gyroscopes, etc.; output devices 470 including, for example, liquid crystal displays (LCDs), speakers, vibrators, etc.; storage devices 480 including, for example, magnetic tapes, hard disks, etc.; and communication devices 490. Communication device 490 allows electronic device 400 to communicate wirelessly or wiredly with other electronic devices to exchange data. Although Figure 9 An electronic device 400 with various devices is shown, but it should be understood that it is not required to implement or have all of the devices shown, and the electronic device 400 may alternatively implement or have more or fewer devices.

[0107] For example, according to embodiments of this disclosure, the detection method of the touch detection device described above can be implemented as a computer software program. For instance, embodiments of this disclosure include a computer program product comprising a computer program carried on a non-transitory computer-readable medium, the computer program including program code for executing the detection method of the touch detection device described above. In such embodiments, the computer program can be downloaded and installed from a network via a communication device 490, or installed from a storage device 480, or installed from a ROM 420. When the computer program is executed by the processing device 410, the functions defined in the detection method of the touch detection device provided in embodiments of this disclosure can be implemented.

[0108] At least one embodiment of this disclosure also provides a computer-readable storage medium storing non-transitory computer-readable instructions. When executed by a computer, these instructions can implement the detection method of the touch detection device described above. Using this computer-readable storage medium, while ensuring that a sensing chip sequence is obtained in each sampling cycle, the measurement time for each chip can be increased, thereby reducing the measurement bandwidth and improving the suppression of display noise interference. Alternatively, the cycle can be shortened and the measurement reporting rate improved without increasing the bandwidth.

[0109] Figure 10 A schematic diagram of a storage medium provided for some embodiments of the present disclosure is shown. As shown, the storage medium 500 stores non-transitory computer readable instructions 510. For example, when the non-transitory computer readable instructions 510 are executed by a computer, one or more steps in the detection method of the touch detection apparatus according to the above are performed. Figure 10

[0110] For example, the storage medium 500 can be applied in the electronic device 300 described above. For example, the storage medium 500 can be the memory 320 in the electronic device 300 shown. Figure 8 For example, the relevant description about the storage medium 500 can refer to the corresponding description of the memory 320 in the electronic device 300 shown, which will not be repeated here. Figure 8

[0111] The following points need to be explained:

[0112] (1) The drawings of the embodiments of the present disclosure only involve the structures involved in the embodiments of the present disclosure, and other structures can refer to the general design.

[0113] (2) In the case of no conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0114] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure should be subject to the protection scope of the claims.​​

Claims

1. A method for detecting a touch detection device, the touch detection device comprising a plurality of drive lines and a plurality of sense lines crossing the plurality of drive lines, the method comprising: transmitting at least one encoded drive signal to at least one drive line of the plurality of drive lines, respectively, wherein each of the at least one encoded drive signal is a code division multiplexing signal and inputs a corresponding chip sequence, respectively; periodically sampling a signal transmitted by a target sense line of the plurality of sense lines to obtain a sense signal of the target sense line in at least two adjacent sampling periods; combining at least one sensing chip sequence based on the sense signal in the at least two adjacent sampling periods, so that adjacent sensing chip sequences measured successively have overlapping chips to determine a touch position based on the at least one sensing chip sequence.

2. The detection method according to claim 1, wherein, combining one sensing chip sequence based on the sense signal in the at least two adjacent sampling periods comprises: obtaining part of chips in one sensing chip sequence based on the sense signal in each of the at least two adjacent sampling periods. 3.The method of claim 2, wherein: a number of the part of chips is half or less than half of a number of chips contained in one of the sensing chip sequences.

4. The detection method of claim 1, wherein, the at least two adjacent sampling periods comprise a first sampling period and a second sampling period adjacent to the first sampling period and following the first sampling period, and each of the sampling periods can receive M chips, combining at least one sensing chip sequence based on the sense signal in the at least two adjacent sampling periods comprises: combining one sensing chip sequence using M chips of the first sampling period and N chips of M chips of the second sampling period, M and N are integers greater than 1 and N is less than M. 5.The method of claim 4, wherein: the N chips in the second sampling period are the first N chips in the second sampling period.

6. The detection method according to claim 4, wherein, the at least two adjacent sampling periods further comprise a third sampling period adjacent to the second sampling period and following the second sampling period, combining at least one sensing chip sequence based on the sense signal in the at least two adjacent sampling periods further comprises: combining another sensing chip sequence using M chips in the second sampling period and N chips of M chips in the third sampling period.

7. The detection method according to claim 6, wherein, in the another sensing chip sequence, the first N chips of the M chips of the second sampling period are the last N chips in the another sensing chip sequence.

8. The assay of any one of claims 1-7, wherein, each of the sampling periods is less than or equal to 2 milliseconds.

9. The assay of any one of claims 1-7, wherein, the at least one drive line comprises S drive lines, S is an integer greater than 1, transmitting at least one encoded drive signal to at least one drive line of the plurality of drive lines, respectively, comprises: transmitting corresponding encoded drive signals to the S drive lines, respectively and simultaneously.

10. The assay of any one of claims 1-7, wherein, the touch detection device is a mutual capacitance touch detection device. 11.A touch detection device comprising: a plurality of drive lines and a plurality of sense lines crossing the plurality of drive lines. a driving module configured to respectively send at least one encoded driving signal to at least one driving line of the plurality of driving lines, wherein each of the at least one encoded driving signal is a code division multiplexing signal and respectively inputs a chip sequence; a sensing module configured to periodically sample a signal transmitted by an object sensing line of the plurality of sensing lines to obtain sensing signals of the object sensing line in at least two adjacent sampling periods; and a combining module configured to combine the sensing signals in the at least two adjacent sampling periods to obtain at least one sensing chip sequence, such that adjacent sensing chip sequences measured successively have overlapping chips.

12. The touch detection apparatus of claim 11, further comprising: a determining module configured to determine a touch position based on the sensing chip sequence.

13. An electronic device, comprising: a processor; a memory including one or more computer program modules; wherein the one or more computer program modules are stored in the memory and configured to be executed by the processor, and the one or more computer program modules include instructions for implementing the detection method of the touch detection apparatus of any one of claims 1-10.

14. A computer-readable storage medium storing non-transitory computer-readable instructions that, when executed by a computer, implement the detection method of the touch detection apparatus of any one of claims 1-10.

Images