Wafer testing apparatus and methods

Abstract

This application relates to a wafer testing apparatus and method. The wafer testing apparatus includes a loading end and a machine end; the loading end includes a wafer tray loading mechanism and a wafer loading mechanism; the wafer tray loading mechanism is used to place a first-size wafer tray; the wafer loading mechanism is used to place a second-size wafer to be transferred to the machine end; the machine end includes a robotic arm, a pre-alignment unit, and a buffer zone; the machine end is configured such that: the robotic arm is used to transport the first-size wafer tray to the buffer zone; after transporting the first-size wafer tray to the buffer zone, the robotic arm is also used to transport the second-size wafer to the first-size wafer tray; the pre-alignment unit is used to align the second-size wafer with the first-size wafer tray. This wafer testing apparatus can reduce the number of manual operation steps required during wafer testing, avoid contamination or wafer breakage caused by manual operation, thereby improving the accuracy and reliability of the wafer inspection process.

Description

Technical Field

[0001] This application relates to the field of semiconductor integrated circuit manufacturing, and in particular to a wafer testing apparatus and method. Background Technology

[0002] Defect review in semiconductor inspection mainly involves confirming the existence of detected defects (location, size, and / or type) using an optical microscope (OM) or a scanning electron microscope (SEM).

[0003] Existing SEM machines can only automatically load and inspect wafers larger than eight inches during defect re-inspection. Six-inch wafers require an eight-inch wafer tray for re-inspection. Therefore, it is necessary to manually adjust the alignment angle of the six-inch wafer before placing it on the eight-inch wafer tray, and then place the tray on the machine end for re-inspection. After the re-inspection, the tray still needs to be manually removed, and the wafer manually placed back into the wafer cassette. This process involves too much manual operation and is prone to errors. Summary of the Invention

[0004] Therefore, it is necessary to provide a wafer testing device and method to address the aforementioned technical problems.

[0005] On one hand, according to some embodiments, this application provides a wafer testing apparatus, including a loading end and a machine platform end; wherein

[0006] The loading end includes a wafer tray loading mechanism and a wafer loading mechanism; the wafer tray loading mechanism is used to place a first-size wafer tray; the wafer loading mechanism is used to place a second-size wafer to be transferred to the machine end;

[0007] The machine tool end includes a robotic arm, a pre-alignment unit, and a buffer zone; the machine tool end is configured as follows:

[0008] The robotic arm is used to transport the first-size wafer tray to the buffer zone; after transporting the first-size wafer tray to the buffer zone, the robotic arm is also used to transport the second-size wafer to the first-size wafer tray;

[0009] The pre-alignment unit is used to align the second-size wafer with the first-size wafer tray.

[0010] The aforementioned wafer testing apparatus, by adding a pre-alignment unit at the machine end to align the second-size wafer with the first-size wafer tray, eliminates the need for manual alignment. This allows the first-size wafer tray, along with the second-size wafer, to be placed in the buffer zone, reducing manual steps during wafer testing and preventing contamination or wafer breakage caused by manual operation. This improves the accuracy and reliability of the wafer inspection process and enables automated re-inspection of the second-size wafer. Furthermore, pre-aligning the second-size wafer with the first-size wafer tray prevents angular misalignment when the second-size wafer enters the buffer zone, which could lead to mismatch and prevent defect location and identification.

[0011] In one embodiment, the robotic arm is configured to adjust the position of the second-sized wafer according to preset angle parameters during the process of transporting the second-sized wafer to the first-sized wafer tray.

[0012] In one embodiment, the pre-alignment unit includes a rotation mechanism, a light source assembly, and a sensor assembly corresponding to the light source assembly; wherein,

[0013] The rotating mechanism is used to place the first-size wafer tray and the second-size wafer to be pre-aligned; and to drive the first-size wafer tray or the second-size wafer to be pre-aligned to rotate.

[0014] The light source assembly and the sensor assembly are respectively disposed on opposite sides of the rotating mechanism, and the light source assembly is communicatively connected to the sensor assembly and the rotating mechanism; wherein,

[0015] The light source assembly is used to emit a first light source signal when the sensor assembly senses the wafer tray alignment mark, so that the rotation mechanism stops rotating the wafer tray to be pre-aligned; it is also used to emit a second light source signal when the sensor assembly senses the wafer alignment mark, so that the rotation mechanism stops rotating the wafer to be pre-aligned.

[0016] In one embodiment, the sensor assembly includes a photoelectric sensor or a charge-coupled device (CCD) image sensor.

[0017] In one embodiment, the buffer zone has an adsorption mechanism and a support mechanism; wherein

[0018] The adsorption mechanism is used to adsorb the first-sized wafer tray transported to the buffer by the robotic arm;

[0019] The support mechanism is used to secure the second-sized wafer transported to the buffer by the robotic arm and to transport the second-sized wafer to the first-sized wafer tray.

[0020] In one embodiment, the support mechanism is a liftable support mechanism.

[0021] In one embodiment, the support mechanism is controlled to descend by a stepper motor.

[0022] On the other hand, according to some embodiments, this application also provides a wafer testing method, characterized in that it includes:

[0023] Provide a wafer testing apparatus as described in any of the above embodiments;

[0024] A robotic arm is used to transport the first-size wafer tray to the buffer zone;

[0025] The robotic arm is used to transport the second-size wafer to the first-size wafer tray, and the second-size wafer is aligned with the first-size wafer tray using a pre-alignment unit.

[0026] The above-described wafer testing method uses the wafer testing apparatus provided in the aforementioned embodiments. Therefore, the technical effects that the aforementioned wafer testing apparatus can achieve can also be achieved by this wafer testing method, and will not be described in detail here.

[0027] In one embodiment, the first-sized wafer tray has wafer tray alignment marks; the second-sized wafer has wafer alignment marks;

[0028] The step of aligning the second-size wafer with the first-size wafer tray via the pre-alignment unit includes: aligning the wafer tray alignment mark with the wafer alignment mark;

[0029] The step of using the robotic arm to transport the second-sized wafer to the first-sized wafer tray includes: adjusting the position of the second-sized wafer according to preset angle parameters.

[0030] In one embodiment, the pre-alignment unit includes a rotation mechanism, a light source assembly, and a sensor assembly corresponding to the light source assembly; the rotation mechanism is used to place the first-size wafer tray to be pre-aligned and the second-size wafer to be pre-aligned; and to drive the first-size wafer tray or the second-size wafer to be pre-aligned to rotate.

[0031] Aligning the wafer tray alignment mark with the wafer alignment mark includes:

[0032] The rotating mechanism drives the first-size wafer tray to be pre-aligned to rotate until the sensor component senses the wafer tray alignment mark and the light source component emits a first light source signal. At this point, the rotating mechanism stops driving the first-size wafer tray to be pre-aligned to rotate. After transporting the first-size wafer tray to the buffer, the rotating mechanism drives the second-size wafer to be pre-aligned to rotate until the sensor component senses the wafer alignment mark and the light source component emits a second light source signal. At this point, the rotating mechanism stops driving the second-size wafer to be pre-aligned to rotate, and the wafer tray alignment mark and the wafer alignment mark are aligned. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the structure of a wafer testing apparatus provided in one embodiment of this application;

[0035] Figure 2 A schematic diagram of the structure of the machine end in a wafer testing apparatus provided in one embodiment of this application;

[0036] Figure 3 A schematic diagram of the structure of a first-size wafer tray and a second-size wafer in a wafer testing apparatus provided in one embodiment of this application;

[0037] Figures 4 to 5 A schematic diagram of the structure of a pre-alignment unit used to align a second-size wafer with a first-size wafer tray in a wafer testing apparatus provided in one embodiment of this application;

[0038] Figure 6 This is a flowchart of a wafer testing method provided in one embodiment of this application.

[0039] Explanation of reference numerals in the attached figures:

[0040] 10. Loading end; 101. Wafer tray loading mechanism; 102. Wafer loading mechanism; 103. First-size wafer tray; 104. Second-size wafer; 113. Wafer tray alignment mark; 114. Wafer alignment mark; 123. Tray groove; 20. Machine end; 201. Robotic arm; 202. Pre-alignment unit; 203. Buffer zone; 213. Vacuum adsorption mechanism; 214. Vacuum support mechanism; 224. Stepper motor; 234. Vacuum support hole; 241. Light source assembly; 242. Sensor assembly; 243. Rotation mechanism; h. Preset height. Detailed Implementation

[0041] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0043] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0044] This application provides a wafer testing apparatus according to some embodiments. It should be noted that this wafer testing apparatus can be applied to at least OM (Operating Machine) and SEM (Search Engine Electron) machines.

[0045] Please see Figure 1 , Figure 1 The diagram shown is a schematic diagram of a wafer testing apparatus provided in one embodiment of this application. The wafer testing apparatus provided in this embodiment may include a loading end 10 and a machine end 20.

[0046] More specifically, the loading end 10 may include a wafer tray loading mechanism 101 and a wafer loading mechanism 102. The wafer tray loading mechanism 101 can be used to place a first-size wafer tray 103; the wafer loading mechanism 102 can be used to place a second-size wafer 104 to be transferred to the machine end 20.

[0047] Please see Figure 2 The machine end 20 may include a robotic arm 201, a pre-alignment unit 202, and a buffer zone 203. The robotic arm 201 can be used to transport a first-size wafer tray 103 to the buffer zone 203; after transporting the first-size wafer tray 103 to the buffer zone 203, the robotic arm 201 can also be used to transport a second-size wafer 104 to the first-size wafer tray 103. The pre-alignment unit 202 can be used to align the second-size wafer 104 with the first-size wafer tray 103.

[0048] The aforementioned wafer testing apparatus, by adding a pre-alignment unit 202 to the machine end 20 to align the second-size wafer 104 with the first-size wafer tray 103, eliminates the need for manual alignment. This allows the first-size wafer tray 103, along with the second-size wafer 104, to be placed in the buffer zone 203. This reduces manual operation steps during wafer testing, avoids contamination or wafer breakage caused by manual operation, and improves the accuracy and reliability of the wafer inspection process, enabling automatic re-inspection of the second-size wafer 104. Furthermore, pre-aligning the second-size wafer 104 with the first-size wafer tray 103 prevents angular misalignment when the second-size wafer 104 enters the buffer zone 203, which could lead to mismatch and prevent defect location and identification. It is understood that this application does not specifically limit the size of the first and second sizes; the first size can be different from or the same as the second size. Therefore, the above-mentioned wafer testing device uses only one size wafer tray (i.e., the first size wafer tray 103), and the pre-alignment unit 202 can achieve alignment of wafers of different sizes with the wafer tray.

[0049] This application does not limit the size of either the first or second dimension. As an example, the first dimension can be 8 inches and the second dimension can be 6 inches.

[0050] Existing SEM machines can only automatically load and re-inspect wafers larger than eight inches during defect re-inspection; six-inch wafers require an eight-inch wafer tray for re-inspection. The aforementioned wafer testing device, by adding a pre-alignment unit 202 to the machine end 20, aligns the 6-inch wafer with the 8-inch wafer tray. This eliminates the need for manual alignment, allowing the 8-inch wafer tray to be placed along with the 6-inch wafer in the buffer zone 203. This reduces manual steps during wafer testing, avoids contamination or wafer breakage caused by manual operation, and improves the accuracy and reliability of the wafer inspection process, enabling automatic re-inspection of 6-inch wafers. Furthermore, pre-aligning the 6-inch wafer with the 8-inch wafer tray prevents angular misalignment when the 6-inch wafer enters the buffer zone 203, which could lead to mismatch and prevent defect location and identification.

[0051] By re-inspecting defects, the defect type and root cause can be determined in a timely manner, thereby effectively monitoring the quality of the prepared wafers.

[0052] Please see Figure 3 , Figure 3 The diagram shows a structural schematic of a first-size wafer tray and a second-size wafer in some possible embodiments.

[0053] In one embodiment, the first-size wafer tray 103 may have a wafer tray alignment mark 113; meanwhile, the second-size wafer 104 may have a wafer alignment mark 114. Based on this, the pre-alignment unit 202 can align the second-size wafer 104 with the first-size wafer tray 103 by aligning the wafer tray alignment mark 113 with the wafer alignment mark 114.

[0054] Based on the above embodiments, the robotic arm 201 can adjust the position of the second-sized wafer 104 according to preset angle parameters during the process of transporting the second-sized wafer 104 to the first-sized wafer tray 103.

[0055] Please see Figure 4 and Figure 5In one embodiment, the pre-alignment unit 202 may include a rotation mechanism 243, a light source assembly 241, and a sensor assembly 242 corresponding to the light source assembly 241. The rotation mechanism 243 can be used to place a first-size wafer tray 103 and a second-size wafer 104 to be pre-aligned; and to rotate either the first-size wafer tray 103 or the second-size wafer 104. The light source assembly 241 and the sensor assembly 242 are respectively disposed on opposite sides of the rotation mechanism 243, and the light source assembly 241 is communicatively connected to the sensor assembly 242 and the rotation mechanism 243.

[0056] This application does not limit the specific method by which the pre-alignment unit 202 aligns the wafer tray alignment mark 113 and the wafer alignment mark 114. Based on the above embodiments, the pre-alignment unit 202 can align the wafer tray alignment mark 113 and the wafer alignment mark 114 in the following ways, for example:

[0057] The rotating mechanism 243 drives the first-size wafer tray 103 to be pre-aligned to rotate until the sensor assembly 242 senses the wafer tray alignment mark 113 and the first light source signal emitted by the light source assembly 241. The rotating mechanism 243 then stops driving the first-size wafer tray 103 to be pre-aligned to rotate. After transporting the first-size wafer tray 103 to the buffer zone 203, the rotating mechanism 243 drives the second-size wafer 104 to be pre-aligned to rotate until the sensor assembly 242 senses the wafer alignment mark 114 and the second light source signal emitted by the light source assembly 241. The rotating mechanism 243 then stops driving the second-size wafer 104 to be pre-aligned to rotate, and the wafer tray alignment mark 113 and the wafer alignment mark 114 are aligned.

[0058] In the wafer testing apparatus provided in the above embodiments, the positions of the sensor assembly 242 and the light source assembly 241 are fixed. Therefore, when the rotating mechanism 243 stops rotating the first-size wafer tray 103 to be pre-aligned, the position of the wafer tray alignment mark 113 is the same as the position of the wafer alignment mark 114 when the rotating mechanism 243 stops rotating the second-size wafer 104 to be pre-aligned (for example, both are directly below the light source assembly 241), thereby completing the alignment of the wafer tray alignment mark 113 and the wafer alignment mark 114.

[0059] It should be noted that the preset angle parameter involved in this application refers to the angle that should exist between the wafer tray alignment mark 113 and the wafer alignment mark 114 during the actual fabrication process. It is understood that the value of the preset angle parameter in this application can be adjusted according to actual needs.

[0060] The following is a more detailed explanation of the process by which the robotic arm 201 adjusts the position of the second-sized wafer 104 according to preset angle parameters when transporting the second-sized wafer 104 to the first-sized wafer tray 103:

[0061] The pre-alignment unit 202 can acquire the first position of the wafer tray alignment mark 113, the second position of the center of the first-size wafer tray 103, the third position of the wafer alignment mark 114, and the fourth position of the center of the second-size wafer 104. (See also...) Figure 3 An angle may be formed between the straight line connecting the first position of the wafer tray alignment mark 113 and the second position of the center of the first-sized wafer tray 103, and the straight line connecting the third position of the wafer alignment mark 114 and the fourth position of the center of the second-sized wafer 104. It is understood that this angle should be greater than or equal to 0° and less than or equal to 180°.

[0062] When the wafer tray alignment mark 113 and the wafer alignment mark 114 are aligned, the position of the wafer tray alignment mark 113 when the rotating mechanism 243 stops rotating the first-size wafer tray 103 to be pre-aligned is the same as the position of the wafer alignment mark 114 when the rotating mechanism 243 stops rotating the second-size wafer 104 to be pre-aligned. At this time, the aforementioned included angle is 0°.

[0063] As mentioned above, in the actual fabrication process, the wafer tray alignment mark 113 and the wafer alignment mark 114 should differ by a preset angle parameter. The angle that the wafer tray alignment mark 113 and the wafer alignment mark 114 should differ by, as referred to by the preset angle parameter, is defined as θ.

[0064] Based on this, during the process of transporting the second-sized wafer 104 to the first-sized wafer tray 103, the robotic arm 201 can adjust the position of the second-sized wafer 104 according to a preset angle parameter; that is, rotate the second-sized wafer 104 by a corresponding angle θ. In this way, when the second-sized wafer 104 is transported to the first-sized wafer tray 103, the wafer tray alignment mark 113 and the wafer alignment mark 114 can be out of phase by an angle θ.

[0065] Furthermore, this application does not specifically limit the form of the wafer tray alignment mark 113 and the wafer alignment mark 114. In one embodiment, both the first-size wafer tray 103 and the second-size wafer 104 may have notches, which are used as the wafer tray alignment mark 113 and the wafer alignment mark 114, respectively.

[0066] In one embodiment, the buffer 203 may have a wafer tray location; simultaneously, the wafer tray location may have a wafer tray location marker. Furthermore, the pre-alignment unit 202 can also be used to align the first-size wafer tray 103 with the wafer tray location.

[0067] The pre-alignment unit 202 of the aforementioned wafer testing apparatus can also be used to align the first-size wafer tray 103 with the wafer tray position, avoiding mismatch between the first-size wafer tray 103 and the buffer 203 due to the placement angle deviation when it enters the buffer 203, thereby further improving the accuracy and reliability of the wafer testing process.

[0068] This application does not specifically limit the form of sensor assembly 242. As an example, sensor assembly 242 may include, but is not limited to, photoelectric sensors or charge-coupled device (CCD) image sensors.

[0069] In one embodiment, the pre-alignment unit 202 may include a portion a for aligning the first-size wafer tray 103 with the wafer tray position and a portion b for aligning the wafer tray alignment mark 113 with the wafer alignment mark 114; portions a and b respectively include at least one light source assembly 241 and at least one sensor assembly 242.

[0070] Please continue reading. Figure 2 In one embodiment, the buffer 203 may have an adsorption mechanism 213 and a support mechanism 214.

[0071] The adsorption mechanism 213 can be used to adsorb the first-size wafer tray 103 transported to the buffer zone 203 by the robotic arm 201. The support mechanism 214 can be used to fix the second-size wafer 104 transported to the buffer zone 203 by the robotic arm 201 and transport the second-size wafer 104 to the first-size wafer tray 103.

[0072] This application does not specifically limit the type of adsorption mechanism 213. As an example, the adsorption mechanism 213 may include, but is not limited to, a vacuum adsorption mechanism. A vacuum adsorption mechanism can be used to vacuum adsorb a first-sized wafer tray 103 transported to the buffer zone 203 by the robotic arm 201.

[0073] This application does not specifically limit the type of support mechanism 214. As an example, support mechanism 214 may include, but is not limited to, vacuum support mechanisms.

[0074] The first-size wafer tray 103 is fixed by the vacuum adsorption mechanism 213, and the second-size wafer 104 is fixed by the vacuum support mechanism 214 and transported to the first-size wafer tray 103. This ensures that the first-size wafer tray 103 and the second-size wafer 104 are subjected to uniform force and are not easily damaged. At the same time, vacuum adsorption has relatively low environmental requirements.

[0075] In one embodiment, the support mechanism 214 is a liftable support mechanism 214.

[0076] Please continue reading. Figure 2 In one embodiment, the first-sized wafer tray 103 may have a tray recess 123.

[0077] Based on this, the support mechanism 214 can be configured to: lower the second-size wafer 104 to a preset height h above the tray groove 123, and detach the second-size wafer 104 by releasing the vacuum.

[0078] The support mechanism 214 of the aforementioned wafer testing apparatus can first lower the second-sized wafer 104 to a preset height h above the tray groove 123, and then release the vacuum to detach the second-sized wafer 104. This can prevent the vibration of the support mechanism 214 when the second-sized wafer 104 falls into the tray groove 123 from causing the position of the second-sized wafer 104 to shift, thereby further improving the accuracy and reliability of the wafer testing process.

[0079] Please continue reading. Figure 2 In one embodiment, the support mechanism 214 may be raised and lowered by a stepper motor 224.

[0080] The aforementioned wafer testing device can first control the stepper motor 224 to lower the second-sized wafer 104 to a preset height h above the tray groove 123. During this process, the second-sized wafer 104 descends at a relatively fast speed. When the second-sized wafer 104 reaches the preset height h above the tray groove 123, the second-sized wafer 104 is detached by releasing the vacuum, which can prevent relative sliding between the second-sized wafer 104 and the first-sized wafer tray 103 caused by air.

[0081] This application does not specifically limit the relationship between the descent speed at which the second-sized wafer 104 is lowered to a preset height h above the tray groove 123 controlled by the stepper motor 224, and the drop speed at which the second-sized wafer 104 is detached by releasing a vacuum. As an example, the descent speed at which the second-sized wafer 104 is lowered to a preset height h above the tray groove 123 controlled by the stepper motor 224 can be 2 to 4 times the drop speed at which the second-sized wafer 104 is detached by releasing a vacuum; for example, the descent speed at which the second-sized wafer 104 is lowered to a preset height h above the tray groove 123 controlled by the stepper motor 224 can be 2, 3, or 4 times the drop speed at which the second-sized wafer 104 is detached by releasing a vacuum, etc.

[0082] In one embodiment, after the second-size wafer 104 and the first-size wafer tray 103 are initially positioned, the second-size wafer 104 and the first-size wafer tray 103 are precisely aligned by controlling the stepper motor 224 and the lead screw. This ultimately achieves the effect of a "first-size wafer" for subsequent automatic transfer and re-inspection.

[0083] This application does not specifically limit the value of the preset height h. As an example, the preset height h can be 2mm to 4mm from the surface of the tray groove 123 facing the second-size wafer 104; for example, the preset height h can be 2mm, 2.5mm, 3mm, 3.5mm or 4mm from the surface of the tray groove 123 facing the second-size wafer 104.

[0084] Please combine Figure 2 See Figure 3 In one embodiment, the first-size wafer tray 103 may have a vacuum support hole 234. Based on this, the support mechanism 214 can pass through the vacuum support hole 234 to fix the second-size wafer 104 and transport it to the first-size wafer tray 103.

[0085] This application also provides a wafer testing method according to some embodiments.

[0086] Please combine Figure 1 and Figure 2 See Figure 6 In one embodiment, the wafer testing method may include the following steps:

[0087] S10: Provide a wafer testing apparatus as described in any of the above embodiments.

[0088] S20: Use robotic arm 201 to transport the first-size wafer tray 103 to buffer zone 203.

[0089] S30: The second-size wafer 104 is transported to the first-size wafer tray 103 using the robotic arm 201, and the second-size wafer 104 is aligned with the first-size wafer tray 103 using the pre-alignment unit 202.

[0090] The above-described wafer testing method uses the wafer testing apparatus provided in the aforementioned embodiments. Therefore, the technical effects that the aforementioned wafer testing apparatus can achieve can also be achieved by this wafer testing method, and will not be described in detail here.

[0091] In one embodiment of the wafer testing method, the first size can be 8 inches and the second size can be 6 inches.

[0092] Please continue reading. Figure 3 In one embodiment, the first-size wafer tray 103 has a wafer tray alignment mark 113, and the second-size wafer 104 has a wafer alignment mark 114. Based on this, the step of aligning the second-size wafer 104 with the first-size wafer tray 103 using the pre-alignment unit 202 specifically includes: aligning the wafer tray alignment mark 113 with the wafer alignment mark 114; the step of transporting the second-size wafer 104 to the first-size wafer tray 103 using the robotic arm 201 specifically includes: adjusting the position of the second-size wafer 104 according to preset angle parameters.

[0093] In one embodiment, buffer 203 may have a wafer tray location; at the same time, the wafer tray location has a wafer tray location marker.

[0094] In the above wafer testing method, the first-size wafer tray can be aligned with the wafer tray position by the pre-alignment unit, avoiding the mismatch between the first-size wafer tray and the buffer due to the placement angle deviation when the first-size wafer tray enters the buffer, thereby further improving the accuracy and reliability of the wafer testing process.

[0095] In one embodiment of the wafer testing method, the step of aligning the wafer tray alignment mark 113 with the wafer alignment mark 114 may specifically include:

[0096] The rotating mechanism 243 drives the first-size wafer tray 103 to be pre-aligned to rotate until the sensor assembly 242 senses the wafer tray alignment mark 113 and the first light source signal emitted by the light source assembly 241. The rotating mechanism 243 then stops driving the first-size wafer tray 103 to be pre-aligned to rotate. After transporting the first-size wafer tray 103 to the buffer zone 203, the rotating mechanism 243 drives the second-size wafer 104 to be pre-aligned to rotate until the sensor assembly 242 senses the wafer alignment mark 114 and the second light source signal emitted by the light source assembly 241. The rotating mechanism 243 then stops driving the second-size wafer 104 to be pre-aligned to rotate, and the wafer tray alignment mark 113 and the wafer alignment mark 114 are aligned.

[0097] It should be noted that the wafer testing apparatuses in the embodiments of this application can all be used to implement the corresponding wafer testing methods. Therefore, the technical features between the method embodiments and the apparatus embodiments can be substituted and supplemented for each other without conflict, so that those skilled in the art can understand the technical content of the present invention.

[0098] It should also be noted that, although Figure 6 The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order in which these steps are executed, and they can be performed in other orders. Figure 6 At least some of the steps in the process may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but may be executed at different times. The execution order of these steps or stages is not necessarily sequential, but may be executed in turn or alternately with other steps or at least some of the steps or stages in other steps.

[0099] In the description of this specification, the references to terms such as "some embodiments," "other embodiments," "ideal embodiments," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example that are included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0100] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0101] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A wafer testing apparatus, characterized by comprising: The wafer testing device comprises a loading end and a machine end. The loading end comprises a wafer tray loading mechanism and a wafer loading mechanism; the wafer tray loading mechanism is used for placing a wafer tray of a first size; the wafer loading mechanism is used for placing a wafer of a second size to be transmitted to the machine end; the first size is not less than the second size; The machine end comprises a mechanical arm, a pre-alignment unit and a buffer area; the machine end is configured to: The pre-alignment unit comprises a rotating mechanism, a light source assembly and a sensor assembly arranged correspondingly to the light source assembly; The first size wafer tray comprises a wafer tray alignment mark, and the second size wafer comprises a wafer alignment mark, wherein, The rotating mechanism is used for placing the first size wafer tray to be pre-aligned and the second size wafer to be pre-aligned, and driving the first size wafer tray to be pre-aligned or the second size wafer to be pre-aligned to rotate; The light source assembly and the sensor assembly are arranged on the upper and lower sides of the rotating mechanism respectively, and the light source assembly and the sensor assembly are communicatively connected with the rotating mechanism; wherein, The light source assembly is used for emitting a first light source signal when the sensor assembly senses the wafer tray alignment mark, so that the rotating mechanism stops driving the first size wafer tray to be pre-aligned to rotate; after the mechanical arm transports the first size wafer tray to the buffer area, the rotating mechanism drives the second size wafer to be pre-aligned to rotate; the light source assembly is also used for emitting a second light source signal when the sensor assembly senses the wafer alignment mark, so that the rotating mechanism stops driving the second size wafer to be pre-aligned to rotate; the position of the wafer tray alignment mark when the rotating mechanism stops driving the first size wafer tray to be pre-aligned to rotate is the same as the position of the wafer alignment mark when the rotating mechanism stops driving the second size wafer to be pre-aligned to rotate, so that the wafer tray alignment mark and the wafer alignment mark are aligned; After alignment, the mechanical arm is also used for transporting the second size wafer to the first size wafer tray, and adjusting the position of the second size wafer according to a preset angle parameter during transportation; the preset angle parameter refers to the angle difference between the wafer tray alignment mark and the wafer alignment mark in actual preparation process.

2. The wafer testing apparatus of claim 1, wherein The sensor assembly comprises a photoelectric sensor.

3. The wafer testing apparatus of claim 1, wherein The buffer area has an adsorption mechanism and a supporting mechanism; wherein The adsorption mechanism is used for adsorbing the first size wafer tray transported to the buffer area by the mechanical arm; The supporting mechanism is used for fixing the second size wafer transported to the buffer area by the mechanical arm, and transporting the second size wafer to the first size wafer tray.

4. The wafer testing apparatus of claim 3, wherein The supporting mechanism is a liftable supporting mechanism.

5. The wafer testing apparatus of claim 4, wherein The supporting mechanism is controlled by a stepping motor to lift.

6. A wafer testing method characterized by, The wafer testing device is used for wafer testing. The wafer testing device is used for wafer testing.

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