Display panel, manufacturing method thereof, and display device

Abstract

Embodiments of the present application provide a display panel, a method for manufacturing the same, and a display device. The display panel includes a substrate, a pixel definition layer, and an organic layer. The pixel definition layer is located on one side of the substrate and includes an opening for arranging a light-emitting element. The organic layer is located between the substrate and the pixel definition layer and includes a porous material. In embodiments of the present application, by disposing the organic layer between the substrate and the pixel definition layer and disposing a porous material capable of absorbing air leakage in the organic layer, during the high-temperature bonding process of the light-emitting element, the porous material in the organic layer can quickly absorb air leakage generated by the pixel definition layer at high temperatures, thereby preventing the pixel definition layer from bulging or cracking, thereby improving the product yield of the display panel and saving costs.

Description

Technical field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. [Background Technology]

[0002] Micro light emitting diode (Micro LED) display panels have the advantages of long life, high brightness, low power consumption, and high resolution. They can be used in special environments such as high temperature or radiation, and have become a hot research topic in the panel industry.

[0003] In existing Micro LED display panels, Micro LEDs need to be bonded at high temperatures in the openings of the pixel definition layer. Due to the high temperature, the pixel definition layer will leak, causing the film layer to bulge or crack, affecting product yield.

[0004] Application Contents

[0005] In view of this, embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device to solve the above problems.

[0006] In a first aspect, an embodiment of the present application provides a display panel comprising a substrate, a pixel definition layer, and an organic layer; the pixel definition layer is located on one side of the substrate, the pixel definition layer comprising an opening, and the opening is used to set a light-emitting element; the organic layer is located between the substrate and the pixel definition layer, and the organic layer comprises a porous material.

[0007] In an implementation manner of the first aspect, the organic layer is a planarization layer.

[0008] In an implementation of the first aspect, the pixel definition layer includes a black solid portion; the display panel further includes an inorganic layer, which is disposed on a side of the pixel definition layer away from the substrate and covers the black solid portion.

[0009] In an implementation of the first aspect, the light-emitting element is a micro light-emitting diode.

[0010] In an implementation of the first aspect, the organic layer includes a first sublayer and a second sublayer, the second sublayer is located on a side of the first sublayer away from the substrate, and the porosity of the second sublayer is greater than the porosity of the first sublayer.

[0011] In an implementation of the first aspect, the porosity of the second sub-layer is 10%-30%, and the porosity of the first sub-layer is 0-10%.

[0012] In an implementation of the first aspect, the organic layer further includes a third sublayer, the third sublayer is located on a side of the second sublayer away from the substrate, and the porosity of the third sublayer is greater than the porosity of the second sublayer.

[0013] In an implementation of the first aspect, the difference between the porosity of the third sublayer and the porosity of the second sublayer is C1, and the difference between the porosity of the second sublayer and the porosity of the first sublayer is C2; wherein C1<C2.

[0014] In an implementation of the first aspect, the porous material is at least one of aluminum oxide, silicon oxide, and activated carbon.

[0015] In an implementation of the first aspect, the particle size of the porous material is 50 nm-500 nm.

[0016] In a second aspect, an embodiment of the present application provides a method for manufacturing a display panel, which is used to manufacture the display panel provided in the first aspect. The manufacturing method includes:

[0017] An organic layer and a pixel definition layer are sequentially prepared on one side of a substrate to form a first substrate;

[0018] heating the first substrate to remove the gas absorbed by the porous material in the organic layer;

[0019] A light emitting element is provided in the opening of the pixel definition layer.

[0020] In an implementation of the second aspect, the pixel definition layer includes a black solid portion, and the display panel further includes an inorganic layer, the inorganic layer is disposed on a side of the pixel definition layer away from the substrate, and the inorganic layer covers the black solid portion; the preparation method further includes:

[0021] preparing an inorganic layer on a first substrate;

[0022] Before preparing the inorganic layer, the first substrate is heated to remove the gas absorbed by the porous material in the organic layer.

[0023] In an implementation of the second aspect, heating the first substrate includes:

[0024] The first substrate is heated for 30 minutes to 180 minutes at a heating temperature of 150° C. to 230° C.

[0025] In a third aspect, an embodiment of the present application provides a display device, comprising the display panel provided in the first aspect.

[0026] In an embodiment of the present application, an organic layer is provided between the substrate and the pixel definition layer, and a porous material that can absorb gas leakage is provided in the organic layer. Therefore, during the high-temperature bonding of the light-emitting element, the porous material in the organic layer can quickly absorb the gas leakage generated by the pixel definition layer at high temperature, thereby avoiding the problem of bulging or cracking of the pixel definition layer, thereby helping to improve the product yield of the display panel and save costs.

[0027] Moreover, before high-temperature bonding of the light-emitting elements, part of the prepared display panel is heated to remove the gas absorbed by the porous material in the organic layer. This ensures that when the light-emitting elements are bonded at high temperature, the porous material has a greater adsorption capacity, thereby ensuring that the porous material can quickly absorb the gas leakage generated in the pixel definition layer, thereby avoiding bulging or rupture of the pixel definition layer.

Brief Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0029] Figure 1 A schematic structural diagram of a display panel provided in an embodiment of the present application;

[0030] Figure 2 A schematic structural diagram of another display panel provided in an embodiment of the present application;

[0031] Figure 3 A schematic structural diagram of another display panel provided in an embodiment of the present application;

[0032] Figure 4 A schematic structural diagram of another display panel provided in an embodiment of the present application;

[0033] Figure 5 A schematic structural diagram of another display panel provided in an embodiment of the present application;

[0034] Figure 6 A schematic structural diagram of another display panel provided in an embodiment of the present application;

[0035] Figure 7 A flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0036] Figure 8 A schematic diagram of a first substrate provided in an embodiment of the present application;

[0037] Figure 9 A process flow chart of a display panel provided in an embodiment of the present application;

[0038] Figure 10 A schematic diagram of a display device is provided in accordance with an embodiment of the present application. [Specific implementation method]

[0039] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0040] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0041] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0042] It should be understood that the term "and / or" as used herein is merely a description of the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0043] In the description of this specification, it is necessary to understand that the words "substantially", "approximately", "approximately", "about", "roughly", "generally" and the like described in the claims and embodiments of this application refer to what can be generally recognized within a reasonable process operation range or tolerance range, rather than an exact value.

[0044] It should be understood that although the terms "first," "second," etc. may be used in embodiments of the present application to describe eutectic layers, sublayers, etc., these eutectic layers, sublayers, etc. should not be limited to these terms. These terms are merely used to distinguish eutectic layers, sublayers, etc. from one another. For example, without departing from the scope of the embodiments of the present application, the first sublayer may also be referred to as the second sublayer, and similarly, the second sublayer may also be referred to as the first sublayer.

[0045] The applicant in this case has provided a solution to the problems existing in the prior art through careful and in-depth research.

[0046] Figure 1 A schematic structural diagram of a display panel provided in an embodiment of the present application is shown in FIG. Figure 2 A schematic structural diagram of another display panel provided in an embodiment of the present application.

[0047] The embodiment of the present application provides a display panel 100, such as Figure 1 and Figure 2As shown, the display panel 100 includes a substrate 10, a pixel definition layer 20 and an organic layer 30. The pixel definition layer 20 is located on one side of the substrate 10 and includes an opening 21 for arranging a light emitting element 40.

[0048] Optionally, the light emitting element 40 may be a micro light emitting diode.

[0049] The organic layer 30 is located between the substrate 10 and the pixel definition layer 20 , and the organic layer 30 includes a porous material M.

[0050] It should be noted that if Figure 1 As shown, in the display panel 100 provided by the embodiment of the present application, the pixel definition layer 20 and the organic layer 30 can be provided on the entire surface. Figure 2 As shown, the pixel definition layer 20 and the organic layer 30 can also be non-continuous structures. The display panel 100 includes a transparent area BB. Along the thickness direction Z of the display panel 100, the pixel definition layer 20 and the organic layer 30 at least partially overlap, and the transparent area BB does not overlap with the pixel definition layer 20 and the organic layer 30.

[0051] In such Figure 2 In the display panel 100 shown, part of the pixel definition layer 20 may extend to the side of the organic layer 30. In this application, when describing the position of the pixel definition layer 20, the position of the pixel definition layer 20 is represented by the plane where the opening 21 of the pixel definition layer 20 is located.

[0052] For further information, please refer to Figure 1 and Figure 2 The display panel 100 further includes a transistor array layer 50, which is located on the side of the substrate 10 facing the pixel definition layer 20. The transistor array layer 50 includes a plurality of driving circuits 51 and a first power signal line 52, which are electrically connected to the light-emitting element 40 through the eutectic layer 60.

[0053] Specifically, the eutectic layer 60 includes a first eutectic layer 61 and a second eutectic layer 62. The driving circuit 51 is electrically connected to the positive electrode of the light-emitting element 40 through the first eutectic layer 61, and the first power signal line 52 is electrically connected to the negative electrode of the light-emitting element 40 through the second eutectic layer 62. When the light-emitting element 40 is driven to emit light, the driving circuit 51 transmits a first signal to the positive electrode of the light-emitting element 40 through the first eutectic layer 61, and the first power signal line 52 transmits a second signal to the negative electrode of the light-emitting element 40 through the second eutectic layer 62. The light-emitting element 40 emits light in response to the voltage difference between the first and second signals. The brightness of the light-emitting element 40 can be controlled by adjusting the voltage difference between the first and second signals.

[0054] The eutectic layer 60 may be made of metal or alloy material.

[0055] Optionally, the eutectic layer 60 includes at least one of copper, gold, indium, and tin. Optionally, the eutectic layer 60 includes an alloy formed by at least two of copper, gold, indium, and tin.

[0056] In the prior art, high-temperature bonding is typically used to connect the light-emitting element 40 to the eutectic layer 60. Since the pixel definition layer 20 is typically made of organic materials, during the high-temperature bonding process, gas leakage may occur in the pixel definition layer 20 due to the high temperature. If the gas leakage in the pixel definition layer 20 cannot be discharged in a timely manner, it may cause the pixel definition layer 20 to bulge or crack, affecting product yield.

[0057] In an embodiment of the present application, an organic layer 30 is provided between the substrate 10 and the pixel definition layer 20, and a porous material M capable of absorbing gas leakage is provided in the organic layer 30. Therefore, during the high-temperature bonding process of the light-emitting element 40, the porous material M in the organic layer 30 can quickly absorb the gas leakage generated by the pixel definition layer 20 at high temperature, thereby avoiding the problem of bulging or cracking of the pixel definition layer 20, thereby facilitating improving the product yield of the display panel 100 and saving costs.

[0058] Optionally, the porous material M is at least one of aluminum oxide, silicon oxide, and activated carbon.

[0059] Furthermore, the particle size of the porous material M is 50 nm-500 nm.

[0060] In one embodiment of the present application, the organic layer 30 is a planarization layer.

[0061] For details, please refer to Figure 1 and Figure 2 The driving circuit 51 includes a transistor T1, and a planarization layer is provided between the transistor T1 and the eutectic layer 60. The organic layer 30 may be a planarization layer provided between the transistor T1 and the eutectic layer 60.

[0062] Figure 3 This is a structural diagram of another display panel provided in an embodiment of the present application. Figure 4 A schematic structural diagram of another display panel provided in an embodiment of the present application.

[0063] like Figure 3 and Figure 4 As shown, in one embodiment of the present application, the pixel definition layer 20 includes a black solid portion 22 , and the black solid portion 22 surrounds the opening 21 .

[0064] The display panel 100 further includes an inorganic layer 70 . The inorganic layer 70 is disposed on a side of the pixel definition layer 20 away from the substrate 10 , and the inorganic layer 70 covers the black solid portion 22 .

[0065] It should be noted that, in Figure 4 In the display panel 100 shown, the inorganic layer 70 may extend to the side of the black solid portion 22. In this application, when describing the position of the inorganic layer 70, the portion of the inorganic layer 70 parallel to the plane of the substrate 10 represents the position of the inorganic layer 70.

[0066] In the embodiment of the present application, the black solid portion 22 has a low reflectivity, which helps to reduce the intensity of reflected light generated when external ambient light is incident on the display panel 100, thereby helping to avoid the influence of the reflected light on the display image.

[0067] Furthermore, after the pixel definition layer 20 is prepared, a stripping solution is typically required in subsequent processes for the display panel 100. In the embodiment of the present application, the inorganic layer 70 is provided to cover the black solid portion 22, thereby preventing the stripping solution from corroding the black solid portion 22 and preventing the black solid portion 22 from fading, thereby ensuring that the black solid portion 22 maintains a low reflectivity.

[0068] Figure 5 A schematic structural diagram of another display panel provided in an embodiment of the present application.

[0069] In one embodiment of the present application, Figure 5 As shown, the organic layer 30 includes a first sublayer 31 and a second sublayer 32 , wherein the second sublayer 32 is located on a side of the first sublayer 31 away from the substrate 10 . That is, the second sublayer 32 is closer to the pixel definition layer 20 than the first sublayer 31 .

[0070] The porosity of the second sub-layer 32 is greater than the porosity of the first sub-layer 31 .

[0071] Optionally, the porosity of the second sub-layer 32 is 10%-30%, and the porosity of the first sub-layer 31 is 0-10%.

[0072] It is understood that the greater the porosity of the film layer, the stronger its gas adsorption capacity is, and the closer the film layer is to the pixel definition layer 20 , the earlier the film layer absorbs gas leaks generated in the pixel definition layer 20 .

[0073] In the embodiment of the present application, the second sublayer 32, which is closer to the pixel definition layer 20, has a higher porosity. Therefore, when the light-emitting element 40 is bonded at high temperature, most of the gas leakage generated in the pixel definition layer 20 can be quickly absorbed by the porous material M in the second sublayer 32, thereby preventing the pixel definition layer 20 from bulging or cracking, and effectively improving the yield of the display panel 100. Of course, the gas leakage not absorbed by the second sublayer 32 can also be absorbed by the first sublayer 31, thereby preventing the gas leakage from accumulating in the pixel definition layer 20, further reducing the risk of bulging of the pixel definition layer 20.

[0074] Figure 6 A schematic structural diagram of another display panel provided in an embodiment of the present application.

[0075] like Figure 6 As shown, in one embodiment of the present application, the organic layer 30 further includes a third sublayer 33, which is located on a side of the second sublayer 32 away from the substrate 10. That is, the third sublayer 33 is closer to the pixel definition layer 20 than the second sublayer 32.

[0076] The porosity of the third sub-layer 33 is greater than that of the second sub-layer 32. Of course, the porosity of the third sub-layer 33 is also greater than that of the first sub-layer 31.

[0077] In the embodiment of the present application, the third sublayer 33, which is closer to the pixel definition layer 20, has a higher porosity. Therefore, when air leaks from the pixel definition layer 20, the porous material M in the third sublayer 33 can quickly absorb most of the leaked air, thereby preventing the pixel definition layer 20 from bulging or cracking. Of course, leaked air not absorbed by the third sublayer 33 can also be absorbed by the second sublayer 32 and the first sublayer 31, thereby preventing the leaked air from accumulating in the pixel definition layer 20 and further reducing the risk of bulging of the pixel definition layer 20.

[0078] It should be noted that the organic layer 30 may further include more sub-layers, and the sub-layer closer to the pixel definition layer 20 has a greater porosity.

[0079] In another embodiment of the present application, the difference between the porosity of the third sublayer 33 and the porosity of the second sublayer 32 is C1, and the difference between the porosity of the second sublayer 32 and the porosity of the first sublayer 31 is C2, where C1<C2.

[0080] That is, the reduction in the porosity of the first sublayer 31 relative to the porosity of the second sublayer 32 is greater than the reduction in the porosity of the second sublayer 32 relative to the porosity of the third sublayer 33 .

[0081] In the embodiment of the present application, the porosity of the third sublayer 33 is greater than that of the second sublayer 32, and the porosity of the second sublayer 32 is greater than that of the first sublayer 31. Furthermore, the reduction in the porosity of the second sublayer 32 relative to the porosity of the third sublayer 33 is less than the reduction in the porosity of the first sublayer 31 relative to the porosity of the second sublayer 32. Therefore, during the high-temperature bonding process of the light-emitting element 40, air leaks generated in the pixel definition layer 20 can be quickly absorbed by the porous material M in the third sublayer 33 and the second sublayer 32, thereby reducing the risk of bulging or cracking of the pixel definition layer 20.

[0082] Figure 7 A flow chart of a method for manufacturing a display panel provided in an embodiment of the present application is provided. Figure 8 A schematic diagram of a first substrate provided in an embodiment of the present application.

[0083] The present invention provides a method for manufacturing a display panel 100, which is used to manufacture the display panel 100 provided in the above embodiment. The structure of the display panel 100 can be as follows: Figures 1-6 shown.

[0084] like Figure 7 As shown, the preparation method includes:

[0085] Step S1: sequentially preparing an organic layer 30 and a pixel definition layer 20 on one side of a substrate 10 to form a first substrate 100 ′;

[0086] Step S2: heating the first substrate 100 ′ to remove the gas absorbed by the porous material M in the organic layer 30 ;

[0087] Step S3 : Disposing the light emitting element 40 in the opening 21 of the pixel definition layer 20 .

[0088] It should be noted that if Figure 8 As shown, the first substrate 100' further includes a transistor array layer 50, which is prepared before the pixel definition layer 20. When the organic layer 30 is prepared, a porous material M is already provided in the material of the organic layer 30.

[0089] Step S3 also includes preparing a eutectic layer 60, which is disposed in the opening 21. After the eutectic layer 60 is prepared, the light emitting element 40 is disposed in the opening 21 and connected to the eutectic layer 60 by high temperature bonding.

[0090] In the preparation method provided in the embodiment of the present application, an organic layer 30 is provided between the substrate 10 and the pixel definition layer 20, and a porous material M capable of absorbing gas leakage is provided in the organic layer 30. Therefore, during the high-temperature bonding process of the light-emitting element 40, the porous material M in the organic layer 30 can quickly absorb the gas leakage generated by the pixel definition layer 20 at high temperature, thereby avoiding the problem of bulging or cracking of the pixel definition layer 20, thereby facilitating improving the product yield of the display panel 100 and saving costs.

[0091] Moreover, before high-temperature bonding of the light-emitting element 40, the first substrate 100' is heated to remove the gas absorbed by the porous material M in the organic layer 30. This ensures that when the light-emitting element 40 is bonded at high temperature, the porous material M has a greater adsorption capacity, thereby ensuring that the porous material M can quickly absorb the leaked gas generated in the pixel definition layer 20, thereby preventing the pixel definition layer 20 from bulging or cracking.

[0092] Figure 9 A process flow chart of a display panel provided in an embodiment of the present application.

[0093] like Figure 3 and Figure 4 As shown, in one embodiment of the present application, the pixel definition layer 20 further includes a black solid portion 22 , and the black solid portion 22 surrounds the opening 21 .

[0094] The display panel 100 further includes an inorganic layer 70 . The inorganic layer 70 is disposed on a side of the pixel definition layer 20 away from the substrate 10 , and the inorganic layer 70 covers the black solid portion 22 .

[0095] like Figure 9 As shown, the preparation method also includes:

[0096] Step S2A: preparing an inorganic layer 70 on the first substrate 100 ′.

[0097] Before preparing the inorganic layer 70 , the first substrate 100 ′ is heated to remove the gas absorbed by the porous material M in the organic layer 30 .

[0098] That is, step S2A is performed after step S2. Of course, step S2A can be performed before step S3.

[0099] In the embodiment of the present application, the black solid portion 22 has a low reflectivity, which helps reduce the intensity of reflected light generated by external ambient light incident on the display panel 100, thereby helping to prevent the reflected light from affecting the displayed image. Furthermore, in the embodiment of the present application, the inorganic layer 70 is provided overlying the black solid portion 22, thereby preventing the stripping solution used in subsequent processes from corroding the black solid portion 22 and preventing the black solid portion 22 from fading, thereby ensuring that the black solid portion 22 maintains a low reflectivity.

[0100] It is understood that during the manufacture of the display panel 100, the porous material M in the organic layer 30 will absorb gases from the environment. When the porous material M has absorbed a sufficient amount of gas, it will lose its absorption capacity and no longer absorb gas. Therefore, to ensure that the porous material M can absorb gas leaks generated in the pixel definition layer 20 during high-temperature bonding of the light-emitting element 40, it is necessary to remove the gas adsorbed by the porous material M before high-temperature bonding of the light-emitting element 40. This ensures that the porous material M has a strong absorption capacity during high-temperature bonding of the light-emitting element 40, allowing it to quickly absorb gas leaks generated in the pixel definition layer 20 and prevent the pixel definition layer 20 from bulging or cracking.

[0101] Since the gas cannot be discharged through the inorganic layer 70, the embodiment of the present application heats the first substrate 100' before preparing the inorganic layer 70, so that the gas absorbed by the porous material M in the organic layer 30 can be removed, thereby ensuring that the porous material M has a greater absorption capacity when bonding the light-emitting element 40 at high temperature.

[0102] In one embodiment of the present application, heating the first substrate 100 ′ includes:

[0103] The first substrate 100 ′ is heated for 30 minutes to 180 minutes at a heating temperature of 150° C. to 230° C.

[0104] The embodiment of the present application can effectively remove the gas absorbed by the porous material M in the organic layer 30 , thereby ensuring that the porous material M has a greater absorption capacity when bonding the light-emitting element 40 at a high temperature.

[0105] Figure 10 A schematic diagram of a display device is provided in accordance with an embodiment of the present application.

[0106] like Figure 10 As shown, the embodiment of the present application provides a display device 200, which includes the display panel 100 provided in the above embodiment. The display device 200 provided in the embodiment of the present application can be a mobile phone. In addition, the display device 200 provided in the embodiment of the present application can also be an electronic device such as a computer or a television.

[0107] In the display device 200, an organic layer 30 is provided between the substrate 10 and the pixel definition layer 20, and a porous material M capable of absorbing gas leakage is provided in the organic layer 30. Thus, during the high-temperature bonding process of the light-emitting element 40, the porous material M in the organic layer 30 can quickly absorb gas leakage generated by the pixel definition layer 20 at high temperature, thereby avoiding the problem of bulging or cracking of the pixel definition layer 20, thereby facilitating improving the product yield of the display panel 100 and saving costs.

[0108] Moreover, before high-temperature bonding of the light-emitting element 40, a portion of the prepared display device 200 is heated to remove the gas absorbed by the porous material M in the organic layer 30. This ensures that when the light-emitting element 40 is bonded at a high temperature, the porous material M has a greater adsorption capacity, thereby ensuring that the porous material M can quickly absorb the gas leakage generated in the pixel definition layer 20, thereby preventing the pixel definition layer 20 from bulging or cracking.

[0109] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A display panel, characterized in that: The display panel includes: substrate; a pixel definition layer, the pixel definition layer being located on one side of the substrate, the pixel definition layer comprising an opening, the opening being used for arranging a light-emitting element; an organic layer, the organic layer being located between the substrate and the pixel definition layer, the organic layer being in contact with the pixel definition layer, and the organic layer comprising a porous material; The organic layer includes a first sublayer and a second sublayer. The second sublayer is located on a side of the first sublayer away from the substrate. The porosity of the second sublayer is greater than that of the first sublayer.

2. The display panel according to claim 1, wherein: The organic layer is a planarization layer.

3. The display panel according to claim 1, wherein: The pixel definition layer includes a black solid portion; The display panel further includes an inorganic layer, which is arranged on a side of the pixel definition layer away from the substrate, and covers the black solid portion.

4. The display panel according to claim 1, wherein: The light emitting element is a micro light emitting diode.

5. The display panel according to claim 1, wherein: The porosity of the second sub-layer is 10%-30%, and the porosity of the first sub-layer is 0-10%.

6. The display panel according to claim 1, wherein: The organic layer further includes a third sublayer, which is located on a side of the second sublayer away from the substrate. The porosity of the third sublayer is greater than the porosity of the second sublayer.

7. The display panel according to claim 6, wherein: The difference between the porosity of the third sub-layer and the porosity of the second sub-layer is C1, and the difference between the porosity of the second sub-layer and the porosity of the first sub-layer is C2; Among them, C1<C2.

8. The display panel according to claim 1, wherein: The porous material is at least one of aluminum oxide, silicon oxide, and activated carbon.

9. The display panel according to claim 1, wherein: The particle size of the porous material is 50nm-500nm.

10. A method for preparing a display panel, for preparing the display panel according to any one of claims 1 to 9, characterized in that: The preparation method comprises: Sequentially preparing the organic layer and the pixel definition layer on one side of the substrate to form a first substrate; heating the first substrate to remove the gas absorbed by the porous material in the organic layer; The light emitting element is disposed in the opening of the pixel definition layer.

11. The preparation method according to claim 10, characterized in that: The pixel definition layer includes a black solid portion, and the display panel further includes an inorganic layer, wherein the inorganic layer is disposed on a side of the pixel definition layer away from the substrate and covers the black solid portion; the preparation method further includes: preparing the inorganic layer on the first substrate; Before preparing the inorganic layer, the first substrate is heated to remove the gas absorbed by the porous material in the organic layer.

12. The preparation method according to claim 10, characterized in that The heating of the first substrate includes: The first substrate is heated for 30 minutes to 180 minutes at a heating temperature of 150° C. to 230° C.

13. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 9.

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