Surface-mounted wireless multi-axis sensor structure and preparation method thereof

Abstract

The present invention discloses a surface-mount wireless multi-axis sensor structure and preparation method. The structure includes a first substrate and a first packaging structure. The first surface of the first substrate is provided with a circuit unit. The circuit unit includes at least a sensor unit. The sensor unit includes at least a multi-axis sensor. The multi-axis sensor is covered with a protective film. The circuit unit and the protective film are packaged to form a first packaging structure. The second surface of the first substrate is respectively mounted with a battery unit and one end of an elevated connecting plate. The first substrate is also provided with an antenna unit. The second substrate is provided with a magnetic isolation plate assembly and a charging coil. The first surface of the second substrate is connected to the other end of the elevated connecting plate. The elevated connecting plate, battery unit, and second substrate module are secondary packaged to form a second packaging structure. The present invention integrates various chips to achieve system control, wireless transmission, and multi-axis posture and motion information collection. Through FC and ultra-high-density SMT mounting, it saves volume, has a waterproof function, and has a compact structure.

Description

Technical Field

[0001] The present invention relates to the fields of sensor technology and packaging technology, and in particular to a surface-mounted wireless multi-axis sensor structure and a preparation method thereof. Background Art

[0002] In the existing technology, multi-axis sensors are being used more and more widely. They can provide high-precision posture data and acceleration information, and have positive significance and applications for the measurement of human movements and scientific sports training. However, multi-axis sensors currently require the support of a main control unit and a power management unit to work. Most of them are currently integrated into terminal devices such as smart bracelets, mobile phones, and smart clothes. The overall size is large, and their application scenarios and usage quantities are limited.

[0003] How to make it small enough and suitable for use in various fields, and how to design a wearable multi-purpose multi-axis sensor system-level product that supports surface mounting, this invention solves this technical problem. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the present invention provides a surface-mounted wireless multi-axis sensor structure and a preparation method thereof.

[0005] In order to solve the above technical problems, the present invention is solved by the following technical solutions:

[0006] A surface-mount wireless multi-axis sensor structure includes a first substrate module, a second substrate module, and a second packaging structure;

[0007] The first substrate module includes a first substrate and a first packaging structure. A circuit unit is provided on the first surface of the first substrate. The circuit unit includes at least a sensor unit. The sensor unit includes at least a multi-axis sensor. A protective film is covered on the multi-axis sensor. The circuit unit and the protective film are packaged to form a first packaging structure. A battery unit and one end of the elevated connecting plate are respectively mounted on the second surface of the first substrate. The first substrate is also provided with an antenna unit.

[0008] The second substrate module includes a second substrate, a magnetic isolation sheet assembly is provided on a first surface of the second substrate, a charging coil is provided on a second surface of the second substrate, and the first surface of the second substrate is connected to the other end of the elevated connecting plate;

[0009] The elevated connecting plate, the battery unit and the second substrate module are packaged twice to form a second packaging structure, and the second surface of the second substrate is exposed to the outside.

[0010] As an implementation method, the circuit unit further includes a chip unit, and the chip unit at least includes a main control chip, a radio frequency chip and a Flash chip.

[0011] As an implementable embodiment, the sensor unit at least includes a multi-axis sensor, a touch sensor or a vibration sensor.

[0012] As a possible implementation method, the antenna unit is arranged on the first substrate through an internal metal layer routing method, a mounting method, an AIP method, or a heterogeneous integration method.

[0013] As an implementation method, when the antenna unit adopts an internal metal layer routing method or a mounting method or a heterogeneous integration method, the second surface of the first substrate is provided with a first preset solder point, and one end of the elevated connecting plate is connected through the first preset solder point.

[0014] As an implementation method, the antenna unit is set on the first substrate through AIP integration, and the first packaging structure is provided with a conductive copper column and extends to the outside of the first packaging structure, and the conductive copper column connects the battery unit and one end of the elevated connecting plate.

[0015] As an implementation method, a second preset welding point is provided on the first surface of the second substrate, and the other end of the elevated connecting plate is connected via the second preset welding point.

[0016] As an implementation method, the height of the first packaging structure is not higher than 700 um, and the height of the second packaging structure is not higher than 3.6 mm.

[0017] As an implementation method, the second surface of the second substrate and the surface of the matched second packaging structure are provided with an adhesive film, and the thickness of the adhesive film is not greater than 1.0 mm.

[0018] As an implementable embodiment, the two ends of the elevated connecting plate have the same structure.

[0019] As an implementation method, a sputtering layer is provided on the outer side of the first packaging structure.

[0020] A method for preparing a surface-mount wireless multi-axis sensor comprises the following steps:

[0021] A first substrate is provided, wherein the first substrate is provided with an antenna unit. A circuit unit is provided on a first surface of the first substrate. The circuit unit includes at least a sensor unit, and the sensor unit includes at least a multi-axis sensor. The multi-axis sensor is covered with a protective film. The circuit unit and the protective film are packaged to form a first package structure. A battery unit and one end of an elevated connecting plate are mounted on the second surface of the first substrate.

[0022] A second substrate is provided, wherein a magnetic isolation sheet assembly is provided on a first surface of the second substrate, a charging coil is provided on a second surface of the second substrate, and the first surface of the second substrate is connected to the other end of the elevated connecting plate;

[0023] The elevated connecting plate, the battery unit and the second substrate module are packaged twice to form a second packaging structure, and the second surface of the second substrate is exposed outward.

[0024] As an implementable method, the following steps are also included:

[0025] An adhesive film is attached to the second surface of the second substrate and the surface of the second packaging structure, and the thickness of the adhesive film is no more than 1.0 mm.

[0026] As an implementation method, after the second packaging structure is formed, a metal sputtering process is used to form a sputtering layer on the outer side of the first packaging structure, and the sputtering layer is partially grounded to achieve EMI shielding protection.

[0027] As a possible implementation method, the antenna unit is arranged on the first substrate through an internal metal layer routing method, a mounting method, or a heterogeneous integration method.

[0028] As an implementation method, when the antenna unit is set on the first substrate by routing through the internal metal layer or by mounting, a first preset solder point is set on the first surface of the second substrate, and a second preset solder point is set on the first surface of the second substrate, and the two ends of the elevated connecting plate are respectively connected through the first preset solder point and the second preset solder point.

[0029] As an implementation method, when the antenna unit is set on the first substrate using the AIP array antenna integration method, the first packaging structure is provided with a conductive copper column and extends to the surface of the first packaging structure, and the conductive copper column connects the battery unit and one end of the elevated connecting plate.

[0030] The present invention has significant technical effects due to the adoption of the above technical solutions:

[0031] The structure of the present invention integrates various chips, multi-axis sensors and touch sensors, and PMIC units or other units, and is equipped with an antenna unit and a charging coil to achieve system control, wireless transmission, multi-axis posture and motion information collection, external finger touch interaction and power control functions; the connection between the two substrates and the wireless charging function are achieved by raising the connecting plate;

[0032] The product adopts bare chip solution or WLCSP packaging, and uses FC and ultra-high-density SMT mounting to save volume. The plastic seal protection makes the whole product waterproof. The structure is compact and can be directly placed in swimming caps, wristbands, leggings, shoes and hats, golf clubs, and rackets.

[0033] The adhesive film can adhere well to the skin surface and is reliably mounted, allowing real-time uploading or storage of multi-axis posture and acceleration information for biological limb posture, sports and training;

[0034] It integrates relevant functional chips to realize system control, wireless communication management and data transmission, multi-axis posture and motion information collection, basic data compression, storage, preprocessing, touch or finger pressure control interaction, wireless charging and other functions; the present invention not only saves volume, but also has waterproof function due to secondary packaging, compact structure, and can be attached with an adhesive film for direct attachment to the human body surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0036] Figure 1 is a side view of an embodiment of the present invention;

[0037] Figure 2 yes Figure 1 Top view of;

[0038] Figure 3 is a side view of another embodiment of the present invention;

[0039] Figure 4 yes Figure 3 Top view of;

[0040] Figure 5 is a side view of yet another embodiment of the present invention;

[0041] Figure 6 yes Figure 5 Top view of;

[0042] Figure 7-13 is a schematic diagram of the process flow of preparing the first substrate module;

[0043] Figure 14-16 is a schematic diagram of the preparation process flow of the second substrate module;

[0044] Figure 17 is a schematic diagram of the connection between the first substrate and the second substrate;

[0045] Figure 18 It is a schematic diagram of a second packaging structure formed after secondary packaging;

[0046] Figure 19 It is continuous Figure 18 Schematic diagram of the structure cut and sputtered;

[0047] Figure 20is a schematic diagram of providing an adhesive film on the second surface of the second substrate;

[0048] Figures 21-27 yes Figure 5 Schematic diagram of the preparation process flow of the first substrate module in the structure;

[0049] Figure 28 is a schematic diagram of the connection between the first substrate and the second substrate;

[0050] Figure 29 It is a schematic diagram of a second packaging structure formed after secondary packaging;

[0051] Figure 30 It is a schematic diagram of providing an adhesive film on the second surface of the second substrate.

[0052] Description of the reference numerals in the accompanying drawings:

[0053] 1. First substrate; 2. Second substrate; 3. First packaging structure; 4. Second packaging structure; 5. Battery unit; 6. Elevated connecting plate; 7. Adhesive film; 8. Magnetic isolation plate assembly; 9. Sputtering layer; 11. Chip unit; 12. Touch sensor; 13. Power management chip; 14. Multi-axis sensor; 15. Antenna unit; 16. Protective film; 17. First preset solder joint; 18. Second preset solder joint; 19. Conductive copper column; 21. Charging coil. DETAILED DESCRIPTION

[0054] The present invention will be further described in detail below with reference to the examples. The following examples are intended to explain the present invention but the present invention is not limited to the following examples.

[0055] A surface-mount wireless multi-axis sensor structure, such as Figure 1-Figure 2 As shown, in this embodiment, the antenna unit is arranged inside the first substrate by routing the wires in the internal metal layer, and clearance is required between the upper side, the lower side and the side away from the circuit unit inside the first substrate;

[0056] In this way, the surface-mount wireless multi-axis sensor structure includes a first substrate module, a second substrate module and a second packaging structure 4;

[0057] The first substrate module includes a first substrate 1 and a first packaging structure 3. An antenna unit 15 is provided within the first substrate 1 by means of internal metal routing. A circuit unit is provided on the first surface of the first substrate 1. This circuit unit is not provided above the antenna unit 15. The circuit unit includes at least a sensor unit and a chip unit 11, and a power management chip 13. The sensor unit includes at least a multi-axis sensor 14, a touch sensor 12, or may also include a pressure sensor or a thermal sensor, etc., while the chip unit 11 includes at least a main control chip, a radio frequency chip, and a flash chip. It should be emphasized that the circuit unit in this embodiment is not limited to the above sensor unit and chip unit, but should also include conventional chips and circuit designs that implement corresponding functions. Since the multi-axis sensor 14 is generally a cavity structure, and the subsequent plastic packaging pressure is generally greater than 3MPa, which will damage or affect it, a protective film 16 is covered on the surface of the multi-axis sensor 14 to improve its protection. The circuit unit and the protective film 16 are then packaged to form the first packaging structure 3. The battery unit 5 and one end of the elevated connecting plate 6 are respectively mounted on the second surface of the first substrate 1.

[0058] The second substrate module includes a second substrate 2, a first surface of the second substrate 2 is provided with a magnetic isolation plate assembly 8, a second surface of the second substrate 2 is provided with a charging coil 21, the first surface of the second substrate 2 is connected to the other end of the elevated connecting plate 6, the elevated connecting plate 6, the battery unit 5 and the second substrate module are secondary packaged to form a second packaging structure 4 to realize the assembly of the first substrate module and the second substrate module, and the lower surface of the second packaging structure 4 is flush with the second surface of the second substrate 2 or is not more than 100um higher than the second surface of the second substrate 2.

[0059] In this embodiment, different data are obtained through different sensors and fed back to the main control chip. The main control chip processes this data based on a preset data processing method, and then can generate different control signals. These control signals will be fed back to the corresponding modules in the circuit unit, which can realize more functions. The data can also be uploaded to the host server through wireless transmission for further analysis and processing.

[0060] The height of the second packaging structure 4 is mainly determined by the thickness of the battery 5. According to the requirements of the battery capacity for different product applications, batteries of corresponding specifications and thicknesses can be selected. In order to make the finished product smaller and easier to use, the height of the second packaging structure 4 should be as small as possible while meeting the battery thickness. In this embodiment, it is controlled within 3.6mm. Touch sensors generally require the packaging thickness of their upper surface to be around 70um. Too high will affect its sensitivity, and too low will affect the packaging reliability. There is no requirement for the packaging thickness of the upper surface of the multi-axis sensor. When the adhesive film adopts a thickness of 200um, the total thickness of the product can be controlled at 4.7mm, which is convenient for surface mounting. Of course, under the condition that further materials and processes are feasible, the product can be made as thinner and smaller as possible.

[0061] The surface-mount wireless multi-axis sensor structure of the present invention has numerous applications. It can be directly attached to the skin of limb joints or incorporated into swim caps, wristbands, shin guards, shoe caps, golf clubs, and smart rackets. If directly attached to the human body, the surface-mount wireless multi-axis sensor structure requires a medical adhesive film 7. This adhesive film 7 is positioned between the second packaging structure 4 and the second surface of the second substrate, allowing the product to be attached to the skin. To ensure wireless charging stability, the thickness of the adhesive film 7 should be no greater than 1.0 mm, preferably as thin as possible to meet both attachment and application requirements.

[0062] In this embodiment, in order to save more space and achieve better connectivity, the two ends of the elevated connecting plate 6 have the same structure. The shape of the elevated connecting plate 6 is not limited here, and it can be replaced by a device with an electrical connection function such as a copper column, a copper busbar, a package adapter plate, etc. In this embodiment, in order to make the connection between the first substrate 1, the second substrate 2 and the elevated connecting plate 6 more secure, a first preset solder point 17 is provided on the second surface of the first substrate 1, and a second preset solder point 18 is provided on the first surface of the second substrate 2. The first preset solder point 17 is welded to one end of the elevated connecting plate 6, and the second preset solder point 18 is welded to the other end of the elevated connecting plate 6.

[0063] Furthermore, after completing the secondary packaging process, since the first substrate 1 has been connected to the second substrate 2, a metal sputtering process is used to form a sputtered layer 9 on the outside of the first substrate 1 where the circuit unit is mounted and corresponding to the surface of the first plastic package structure 3. This sputtered layer 9 is locally grounded to achieve EMI shielding protection.

[0064] Therefore, the various limiting dimensions of the present invention are based on data under existing design and processing technology capabilities, and the smaller the dimension is, the better, provided that the material and process technology can meet the requirements.

[0065] Example 2:

[0066] A surface-mount wireless multi-axis sensor structure, such as Figure 3-Figure 4As shown, in this embodiment, the antenna unit 15 is arranged inside the first substrate 1 by mounting a ceramic antenna or a heterogeneous antenna, and the antenna unit needs to be clear of the upper side, the lower side and the side away from the circuit unit inside the first substrate 1;

[0067] In this way, the surface-mount wireless multi-axis sensor structure includes a first substrate module, a second substrate module and a second packaging structure 4;

[0068] The first substrate module includes a first substrate 1 and a first packaging structure 3. An antenna unit 15 is arranged inside the first surface of the first substrate 1. This antenna unit 15 is set by mounting a ceramic antenna on a board or installing a heterogeneous antenna. A circuit unit is provided on the first surface of the first substrate 1. This circuit unit and the antenna unit 15 are arranged in a partitioned manner. The circuit unit includes at least a sensor unit and a chip unit 11, a power management chip 13, and the sensor unit includes at least a multi-axis sensor 14, a touch sensor 12, and may also include a pressure sensor or a thermal sensor, etc. The chip unit 11 includes at least a main control chip, a radio frequency chip and a Flash chip. It should be emphasized here that the circuit unit in this embodiment is not limited to the above sensor unit and chip unit, or also includes chips and circuit designs that implement corresponding functions. Since the multi-axis sensor 14 generally has a cavity structure, and the subsequent packaging process generally causes damage or damage to the multi-axis sensor due to the molding pressure exceeding 3 MPa, a protective film 16 is applied to the surface of the multi-axis sensor 14 to improve its protection. The circuit unit and the protective film 16 are then packaged to form a first packaging structure 3. The battery unit 5 and one end of the elevated connecting plate 6 are mounted on the second surface of the first substrate 1.

[0069] The second substrate module includes a second substrate 2, a first surface of the second substrate 2 is provided with a magnetic isolation plate assembly 8, a second surface of the second substrate 2 is provided with a charging coil 21, the first surface of the second substrate 2 is connected to the other end of the elevated connecting plate 6, the elevated connecting plate 6, the battery unit 5 and the second substrate module are secondary packaged to form a second packaging structure 4 to realize the assembly of the first substrate module and the second substrate module, and the lower surface of the second packaging structure 4 is flush with the second surface of the second substrate 2 or is not more than 100um higher than the second surface of the second substrate 2.

[0070] In this embodiment, different data are obtained through different sensors and fed back to the main control chip. The main control chip processes this data based on a preset data processing method, and then can generate different control signals. These control signals will be fed back to the corresponding modules in the circuit unit, which can realize more functions. The data can also be uploaded to the host server through wireless transmission for further analysis and processing.

[0071] The height of the second packaging structure 4 is mainly determined by the thickness of the battery 5. According to the requirements of the battery capacity for different product applications, batteries of corresponding specifications and thicknesses can be selected. In order to make the finished product smaller and easier to be applied to different fields, the height of the second packaging structure 4 should be as small as possible while meeting the battery thickness. In this design, it is controlled within 3.6mm. Touch sensors generally require the plastic sealing height of their upper surface to be around 70um. Too high will affect its sensitivity, and too low will affect the packaging reliability. There is no thickness requirement for the surface packaging of multi-axis motion sensors. When the adhesive film adopts a thickness of 200um, the total thickness of the product can be controlled at 4.7mm, which is convenient for surface mounting. Of course, under the condition that further materials and processes are feasible, the product can be made as thinner and smaller as possible.

[0072] The surface-mount wireless multi-axis sensor structure of the present invention has numerous applications. It can be directly attached to the skin of limb joints and can also be incorporated into swim caps, wristbands, shin guards, shoe caps, golf clubs, and smart rackets. If directly attached to the human body, a medical adhesive film 7 is required. This adhesive film 7 is positioned between the second packaging structure 4 and the second surface of the second substrate. Once the adhesive film 7 is applied, the product can be attached to human skin. To ensure wireless charging stability, the thickness of the adhesive film 7 should be no greater than 1.0 mm, preferably as thin as possible to meet both attachment and application requirements.

[0073] In this embodiment, in order to save space and achieve better connectivity, the two ends of the elevated connecting plate 6 have the same structure. The shape of the elevated connecting plate is not limited here, and it can be replaced by a device with an electrical connection function such as a copper column, a copper busbar, a package adapter plate, etc. In this embodiment, in order to make the connection between the first substrate 1, the second substrate 2 and the elevated connecting plate 6 more secure, a first preset solder point 17 is provided on the second surface of the first substrate 1, and a second preset solder point 18 is provided on the first surface of the second substrate 2. The first preset solder point 17 is welded to one end of the elevated connecting plate 6, and the second preset solder point 18 is welded to the other end of the elevated connecting plate 6.

[0074] Furthermore, after completing the secondary packaging process, since the first substrate 1 has been connected to the second substrate 2, a metal sputtering process is used to form a sputtered layer 9 on the outside of the first substrate 1 where the circuit unit is mounted and corresponding to the surface of the first plastic package structure 3. This sputtered layer 9 is locally grounded to achieve EMI shielding protection.

[0075] Therefore, the various limiting dimensions of the present invention are based on data under existing design specifications and processing technology capabilities. The smaller the size, the better, provided that the material and process technology can meet the requirements.

[0076] Example 3:

[0077] In this embodiment, the antenna unit 15 is designed using an AIP antenna display method. The antenna unit 15 is implemented using the circuit unit line in the first substrate. In this embodiment, only the upper side of the antenna unit 15 inside the first substrate needs to be clear.

[0078] In this way, the surface-mount wireless multi-axis sensor structure includes a first substrate module, a second substrate module and a second packaging structure 4;

[0079] The first substrate module includes a first substrate 1 and a first packaging structure 3. An antenna unit 15 is arranged inside the first surface of the first substrate 1. This antenna unit 15 is arranged on the second surface of the first substrate by coupling and one side of the antenna unit 15 is exposed on the second surface of the first substrate 1. A circuit unit is provided on the first surface of the first substrate 1. This circuit unit is not mounted above the antenna unit 15. The circuit unit includes at least a sensor unit and a chip unit 11, a power management chip 13, the sensor unit includes at least a multi-axis sensor 14, a touch sensor 12, or also includes a pressure sensor or a thermal sensor, etc., and the chip unit 11 includes at least a main control chip, a radio frequency chip and a Flash chip. It should be emphasized here that the circuit unit in this embodiment is not limited to the above sensor unit and chip unit, but should also include conventional chips and circuit designs that realize corresponding functions. Since the multi-axis sensor 14 generally has a cavity structure, and the subsequent packaging process generally has a plastic sealing pressure greater than 3 MPa, which may damage or affect it, a protective film 16 is added. The protective film 16 covers the surface of the multi-axis sensor 14, and the circuit unit and the protective film 16 are encapsulated to form a first packaging structure 3. The battery unit 5 and one end of the elevated connecting plate 6 are respectively mounted on the second surface of the first substrate 1;

[0080] The second substrate module includes a second substrate 2, a first surface of the second substrate 2 is provided with a magnetic isolation plate assembly 8, a second surface of the second substrate 2 is provided with a charging coil 21, the first surface of the second substrate 2 is connected to the other end of the elevated connecting plate 6, the elevated connecting plate 6, the battery unit 5 and the second substrate module are secondary packaged to form a second packaging structure 4 to realize the assembly of the first substrate module and the second substrate module, and the second packaging structure 4 is consistent with the second surface of the second substrate 2 or is within 100um higher.

[0081] In this embodiment, the first packaging structure 3 is provided with a conductive copper pillar 19, one end of which is electrically connected to the first substrate, and the other end extends to the surface of the first packaging structure 3 and is connected to the battery cell 5 and one end of the elevated connecting plate 6; and the other end of the elevated connecting plate 6 is connected to the first surface of the second substrate 2 through a second preset solder point 18 provided on the first surface of the second substrate 2.

[0082] Since the antenna unit 15 in this embodiment is designed using an onboard AIP display antenna, the antenna unit 15 can be arranged above and below the circuit unit. The size of the first substrate 1 in this embodiment can be smaller than the size of the first substrate 1 in Examples 1 and 2, and the length and width of the second packaging structure 4 can also be reduced accordingly. Therefore, the size of the surface-mounted wireless multi-axis sensor structure in Example 3 is smaller than that of the other embodiments.

[0083] The height of the second packaging structure 4 is primarily determined by the thickness of the battery 5. Depending on the battery capacity requirements of different product applications, a battery of appropriate thickness can be selected. To minimize the finished product size and facilitate its application in various applications, the height of the second packaging structure 4 should be as small as possible while maintaining the required battery thickness. In this design, the height is controlled at 3.6mm. Touch sensors generally require a plastic seal height of approximately 70µm on their top surface. A height too high affects sensitivity, while a height too low affects package reliability. There are no thickness requirements for surface packaging of multi-axis motion sensors. The charging coil is integrated onto the second surface of the second substrate, separated from the charging base by only an adhesive film. Charging performance is generally not affected if the adhesive film is no thicker than 1.0mm. When the adhesive film is 200µm thick, the total product thickness can be controlled to 4.7mm, making it convenient for surface mounting. Of course, as long as the materials and processes are feasible, the product can be made as thin and compact as possible.

[0084] The surface-mount wireless multi-axis sensor structure of the present invention has numerous applications. It can be directly attached to human skin and incorporated into swim caps, wristbands, shin guards, shoe caps, golf clubs, and smart rackets. If directly attached to the human body, the surface-mount wireless multi-axis sensor structure requires a medical adhesive film 7, which is applied to the second surface of the second packaging structure 4 and the second substrate. Once the adhesive film 7 is applied, the product can be attached to human skin. To ensure wireless charging stability, the thickness of the adhesive film 7 should be no greater than 1.0 mm; the thinner the better, as long as it meets both attachment and application requirements.

[0085] In this embodiment, in order to save space and achieve better connectivity, the two ends of the elevated connecting plate 6 have the same structure. The shape of the elevated connecting plate is not limited here, and can be replaced by copper columns, copper bars, package adapter plates and other devices with electrical connectivity.

[0086] In this embodiment, different sensors acquire different data and feed it back to the main control chip. The main control chip processes this data based on a preset data processing method, generating different control signals. These control signals are fed back to the corresponding modules in the circuit unit, enabling more functions. The collected data can also be wirelessly transmitted to a host server for further analysis and processing. Therefore, the various size limits of the present invention are based on data within the existing design and processing technology capabilities. The smaller the size, the better, as long as the materials and process technology can meet the requirements.

[0087] It can be seen from the above embodiments that various chips are integrated on the first substrate, including a main control chip, a wireless communication chip, Flash, a multi-axis sensor, a touch sensor, a PMIC unit and other circuit functional units, and an antenna unit is provided to realize system control, wireless transmission, multi-axis posture and motion information collection functions, touch interaction and power control functions. The two substrates can be connected through an elevated connecting plate, and the charging coil can wirelessly charge the battery unit.

[0088] The chip used in the product adopts a bare chip solution or WLCSP packaging, and is mounted through FC and ultra-high-density SMT to save volume. The plastic encapsulation protection makes the entire product waterproof. The product structure is compact and can be directly placed in swimming caps, wristbands, shin guards, shoes and hats, golf clubs, and rackets. The adhesive film can adhere well to the skin surface and is reliably mounted. It can upload or store multi-axis posture and acceleration information in real time for biological limb posture, sports and training.

[0089] Example 4:

[0090] This embodiment is the preparation method corresponding to embodiment 1 and embodiment 2, such as Figure 7-20 As shown, a first substrate 1 is provided, and an antenna unit 15 is provided inside the first surface of the first substrate 1 or the antenna unit 15 is attached to the first surface, that is, the antenna unit 15 is provided inside the first substrate 1 by internal metal routing or the antenna unit 15 is provided inside the first substrate by mounting a ceramic antenna on a board or installing a heterogeneous antenna. A circuit unit is mounted on the first surface of the first substrate 1, and the circuit unit includes a multi-axis sensor 14, a touch sensor 12, a control chip, a radio frequency chip, and a power management chip 13;

[0091] The circuit unit and the first surface of the first substrate 1 are then packaged to form a first packaging structure 3. Because the multi-axis sensor 14 is very sensitive to the high pressure of the plastic package, it is necessary to separately cover the multi-axis sensor 14 with a protective film 16 or use a vacuum lamination process before packaging. In addition, considering the RF performance of the RF chip, a composite material with a low DKDF parameter should be selected for packaging.

[0092] A first preset welding point 17 is provided on the second surface of the first substrate 1, and the elevated connecting plate 6 and the battery cell 5 are mounted through the first preset welding point 17. During the connection process, laser spot welding can be used to achieve electrical connection. In addition, if space permits, the elevated connecting plate 6 can also increase the diameter and number of the conductive copper pillars 19 to improve the heat dissipation performance of the battery cell 5. Since the battery cell 5 operates at room temperature, but the plastic sealing conditions need to reach a high temperature and a preset pressure (the high temperature is 175°C, and the preset pressure is a high pressure greater than 3MPa) during plastic sealing, the main body of the battery cell 5 adopts a sturdy and pressure-resistant shell and is attached to the second surface of the first substrate 1 through a specific colloid to ensure the reliability of the fixation.

[0093] A second substrate 2 is provided. A charging coil 21 is provided inside the second substrate 2 near the second surface. A second preset solder joint 18 is provided on the first surface. A magnetic isolation plate assembly 8 is further provided. The material of the magnetic isolation plate assembly 8 can be iron oxide or other iron oxides.

[0094] Weld the second preset welding point 18 provided on the first surface of the second substrate 2 to the first preset welding point 17 and the elevated connecting plate 6 to complete the connection between the first substrate 1 and the second substrate 2;

[0095] The second surface of the first substrate 1 is used as the bottom surface for secondary packaging, and the second substrate 2, the elevated connecting plate 6, the battery unit 5, etc. are plastic-sealed together. The height of the secondary plastic sealing is controlled within 3.6 mm, and the total thickness is controlled within 4.7 mm. Under the conditions of feasible materials and processes, the thinner the better, which is convenient for surface mounting.

[0096] Generally, during the preparation process, a plate-forming process is adopted. After one plate-forming process is completed, multiple surface-mounted multi-axis sensor structures are produced. The structures are then cut after secondary packaging. After secondary packaging and cutting, since the first substrate has been connected to the second substrate, a metal sputtering process is adopted on the outside of the first substrate with a circuit unit, and a sputtering layer is formed on the surface corresponding to the first plastic package structure. The sputtering layer is locally grounded to achieve EMI shielding protection.

[0097] Because the finished product will be used in a variety of fields, including even attached to the human body, a medical adhesive film 7 is required on the surface-mount wireless multi-axis sensor structure. This adhesive film 7 is placed between the second packaging structure 4 and the second surface of the second substrate. After the adhesive film 7 is applied, the product can be attached to the skin. To ensure wireless charging stability, the thickness of the adhesive film 7 should not exceed 1.0 mm. It is best to use a medical-grade material. The thinner the film, the better, as long as it meets the required adhesive strength, for better adhesion to the skin surface.

[0098] Example 5:

[0099] like Figure 21-30 As shown, this preparation method is a preparation method for the structure of Example 3, and the specific process is:

[0100] A first substrate 1 is provided. The first substrate module includes the first substrate 1 and a first packaging structure 3. An antenna unit 15 is provided inside the first surface of the first substrate 1 using the AIP technology. The antenna unit 15 is provided on the second surface of the first substrate by coupling, and one side of the antenna unit 15 is exposed on the second surface of the first substrate 1. Due to the reduction in size of the first substrate, the size of the finished product can be further compressed, and the length and width can be compressed by about one-quarter. At this time, a circuit unit is mounted on the first surface of the first substrate 1. The circuit unit includes a multi-axis sensor 14, a touch sensor 12, a control chip, a radio frequency chip, a flash chip, and a power management chip 13, and may also include other functional chips.

[0101] The circuit unit and the first surface of the first substrate 1 are then protected by plastic encapsulation to form a first packaging structure 3. A conductive copper pillar 19 is provided in the first packaging structure 3. Since the multi-axis sensor 14 is very sensitive to the high pressure of the plastic encapsulation, it is necessary to separately cover the multi-axis sensor 14 with a protective film 16 or use a vacuum lamination process for lamination before plastic encapsulation.

[0102] After the first packaging structure 3 is formed, the first packaging structure is ground and thinned to expose the conductive copper pillars 19;

[0103] The elevated connecting plate 6 and the battery cell 5 are mounted through the exposed conductive copper pillars 19, and laser spot welding can be used to achieve electrical connection during the connection process; in addition, the elevated connecting plate 6 can also increase the diameter and number of the conductive copper pillars 19 if space permits to improve the heat dissipation performance of the battery cell 5. Since the battery cell 5 works at room temperature, but the molding conditions need to reach high temperature and high pressure (about 175°C, pressure greater than 3MPa) during molding, the main body of the battery cell 5 adopts a sturdy and pressure-resistant shell, and is attached to the second side of the first substrate 1 through a specific colloid to ensure the reliability of the fixation.

[0104] A second substrate 2 is provided. A charging coil 21 is provided inside the second substrate 2 near the second surface. A second preset solder joint 18 is provided on the first surface. A magnetic isolation plate assembly 8 is further provided. The material of the magnetic isolation plate assembly 8 can be iron oxide or other iron oxides.

[0105] Weld the second preset welding point 18 on the first surface of the second substrate 2 to the first preset welding point 17 and the elevated connecting plate 6 to complete the connection between the first substrate 1 and the second substrate 2;

[0106] The second surface of the first substrate 1 is used as the bottom surface for secondary packaging, and the second substrate 2, the elevated connecting plate 6, the battery unit 5, etc. are plastic-sealed together. Considering the battery volume (batteries of different specifications and thicknesses can be selected according to application requirements), the height of the secondary plastic packaging is controlled within 3.6 mm.

[0107] Generally, during the preparation process, plate-making is adopted. After one plate is processed, multiple surface-mount multi-axis sensor structures are produced, which are then cut after secondary packaging.

[0108] Because the finished product will be used in a variety of fields, including even attached to the human body, a medical adhesive film 7 is required on the surface-mount wireless multi-axis sensor structure. This adhesive film 7 is placed between the second packaging structure 4 and the second surface of the second substrate. After the adhesive film 7 is applied, the product can be attached to the skin. To ensure wireless charging stability, the thickness of the adhesive film 7 should not exceed 1.0 mm. It is best to use a medical-grade material. The thinner the film, the better, as long as it meets the required adhesive strength, for better adhesion to the skin surface.

[0109] Furthermore, it should be noted that the specific embodiments described in this specification may vary in the shapes and names of their components. Any equivalent or simple variations based on the structure, features, and principles described in the patented concept of this invention are included within the scope of protection of this patent. Persons skilled in the art may make various modifications, additions, or substitutions to the described specific embodiments, and these modifications, as long as they do not deviate from the structure of the invention or exceed the scope defined by the claims, shall fall within the scope of protection of this invention.

Claims

1. A surface-mount wireless multi-axis sensor structure, characterized in that: It includes a first substrate module, a second substrate module and a second packaging structure; The first substrate module includes a first substrate and a first packaging structure. A circuit unit is provided on the first surface of the first substrate. The circuit unit includes at least a sensor unit. The sensor unit includes at least a multi-axis sensor. A protective film is covered on the multi-axis sensor. The circuit unit and the protective film are packaged to form a first packaging structure. A battery unit and one end of the elevated connecting plate are respectively mounted on the second surface of the first substrate. The first substrate is also provided with an antenna unit. The second substrate module includes a second substrate, a magnetic isolation sheet assembly is provided on a first surface of the second substrate, a charging coil is provided on a second surface of the second substrate, and the first surface of the second substrate is connected to the other end of the elevated connecting plate; The elevated connecting plate, the battery unit and the second substrate module are packaged twice to form a second packaging structure, and the second surface of the second substrate is exposed to the outside.

2. The surface-mount wireless multi-axis sensor structure according to claim 1, characterized in that: The circuit unit further includes a chip unit, and the chip unit at least includes a main control chip, a radio frequency chip and a Flash chip.

3. The surface-mount wireless multi-axis sensor structure according to claim 1, characterized in that: The sensor unit at least includes a multi-axis sensor, a touch sensor or a vibration sensor.

4. The surface-mount wireless multi-axis sensor structure according to any one of claims 1 to 3, characterized in that: The antenna unit is arranged on the first substrate by an internal metal layer routing method, a mounting method, or a heterogeneous integration method.

5. The surface-mount wireless multi-axis sensor structure according to claim 4, characterized in that: When the antenna unit adopts an internal metal layer routing method or a mounting method, a first preset soldering point is provided on the second surface of the first substrate, and one end of the elevated connecting plate is connected through the first preset soldering point.

6. The surface-mount wireless multi-axis sensor structure according to claim 4, characterized in that: The antenna unit is set on the first substrate through AIP integration, and the first packaging structure is provided with a conductive copper column, one end of the conductive copper column is electrically connected to the first substrate, and the other end of the conductive copper column extends to the surface of the first packaging structure and is connected to the battery unit and one end of the elevated connecting plate.

7. The surface-mount wireless multi-axis sensor structure according to claim 5 or 6, characterized in that: A second preset welding point is provided on the first surface of the second substrate, and the other end of the elevated connecting plate is connected via the second preset welding point.

8. The surface-mount wireless multi-axis sensor structure according to claim 1, characterized in that: The height of the first packaging structure is not higher than 700um, and the height of the second packaging structure is not higher than 3.6mm.

9. The surface-mount wireless multi-axis sensor structure according to claim 1, characterized in that: An adhesive film is provided on the second surface of the second substrate and the surface of the matched second packaging structure. The thickness of the adhesive film is no more than 1.0 mm.

10. The surface-mount wireless multi-axis sensor structure according to claim 1, characterized in that: The two ends of the elevated connecting plate have the same structure.

11. The surface-mount wireless multi-axis sensor structure according to claim 1, characterized in that: A sputtering layer is provided on the outer side of the first packaging structure.

12. A method for preparing a surface-mount wireless multi-axis sensor, characterized in that: The method comprises the following steps: providing a first substrate, the first substrate being provided with an antenna unit, a first surface of the first substrate being provided with a circuit unit, the circuit unit at least including a sensor unit, the sensor unit at least including a multi-axis sensor, the multi-axis sensor being covered with a protective film, the circuit unit and the protective film being packaged to form a first package structure, and a battery unit and one end of a raised connection plate being mounted on the second surface of the first substrate; A second substrate is provided, wherein a magnetic isolation sheet assembly is provided on a first surface of the second substrate, a charging coil is provided on a second surface of the second substrate, and the first surface of the second substrate is connected to the other end of the elevated connecting plate; The elevated connecting plate, the battery unit and the second substrate module are packaged twice to form a second packaging structure, and the second surface of the second substrate is exposed outward.

13. The method for preparing a surface-mount wireless multi-axis sensor according to claim 12, wherein: The following steps are also included: An adhesive film is attached to the second surface of the second substrate and the surface of the second packaging structure, and the thickness of the adhesive film is no more than 1.0 mm.

14. The method for preparing a surface-mount wireless multi-axis sensor according to claim 12, wherein: After the second packaging structure is formed, a sputtering layer is formed on the outer side of the first packaging structure by using a metal sputtering process. The sputtering layer is partially grounded to achieve EMI shielding protection.

15. The method for preparing a surface-mount wireless multi-axis sensor according to claim 12, wherein: The antenna unit is arranged on the first substrate through an internal metal layer routing method, a mounting method, or a heterogeneous integration method.

16. The method for preparing a surface-mount wireless multi-axis sensor according to claim 15, wherein: When the antenna unit is set on the first substrate by internal metal layer routing, mounting or heterogeneous integration, a first preset solder point is set on the first surface of the second substrate, and a second preset solder point is set on the first surface of the second substrate, and the two ends of the elevated connecting plate are respectively connected through the first preset solder point and the second preset solder point.

17. The method for preparing a surface-mount wireless multi-axis sensor according to claim 15, wherein: When the antenna unit is set on the first substrate using the AIP array antenna integration method, the first packaging structure is provided with a conductive copper column, one end of the conductive copper column is electrically connected to the first substrate, and the other end of the conductive copper column extends to the surface of the first packaging structure and is connected to the battery unit and one end of the elevated connecting plate.

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