Display module and display device

Abstract

The present invention discloses a display module and a display device, relating to the field of display technology. The display module includes a display panel; a cover plate located on the side of the display panel facing its light-emitting surface; a support layer located on the side of the display panel away from its light-emitting surface; and a heat dissipation layer located on the side of the support layer away from the display panel. The support layer includes a first portion and a second portion, wherein the first portion at least partially overlaps with the display panel in a direction perpendicular to the plane of the cover plate, and at least a portion of the second portion protrudes from the first portion toward a side away from the display panel, and the second portion contacts the heat dissipation layer. In the present invention, static electricity generated by the display module is conducted through the edges of the display module via the support layer and the heat dissipation layer, thereby improving the anti-static capability of the display module.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and more particularly, to a display module and a display device. Background Art

[0002] With the development of electronic technology, the manufacturing technology of display devices has also become mature. The display panel is the core component of the display device. The display panels provided by the existing technology include liquid crystal display panels, organic light-emitting diode (OLED) display panels, plasma display panels, etc. As a current-type light-emitting device, organic light-emitting display panels have been increasingly used in high-performance displays. OLED display panels have excellent characteristics such as self-luminescence, no need for backlight, wide color gamut, high contrast, thin thickness, wide viewing angle, fast response speed, can be used for flexible panels, wide operating temperature range, simple structure and process. Flexible OLED display panels have been increasingly used in mobile phone displays. Display devices made of flexible OLED display panels are prone to static electricity when subjected to external high-voltage charges. At the same time, the flexible OLED display panel itself has no effective static electricity conduction path. Changes in the external static electricity environment cause static electricity to enter the light-emitting layer of the flexible OLED display panel, causing the display inside the flexible OLED display panel to glow. Therefore, anti-static ability is also an important indicator of display device performance.

[0003] Therefore, there is an urgent need to provide a method for preventing a display module from being affected by external static electricity and improving the anti-static capability of the display module. Summary of the Invention

[0004] In view of this, the present invention provides a display module and a display device to improve the antistatic capability of the display module.

[0005] On the one hand, the present invention provides a display module, comprising: a display panel; a cover plate, located on the side of the display panel facing its light-emitting surface; a support layer, located on the side of the display panel away from its light-emitting surface; a heat dissipation layer, located on the side of the support layer away from the display panel; the support layer comprises a first portion and a second portion, the first portion at least partially overlapping with the display panel in a direction perpendicular to the plane of the cover plate, at least a portion of the second portion protruding from the first portion toward the side away from the display panel, and the second portion contacting the heat dissipation layer.

[0006] On the other hand, the present invention further provides a display device comprising the above-mentioned display panel.

[0007] Compared with the prior art, the display module and display device provided by the present invention achieve at least the following beneficial effects:

[0008] The display module of the present invention includes: a display panel; a cover plate located on the side of the display panel facing its light-emitting surface, a support layer located on the side of the display panel away from its light-emitting surface, and a heat dissipation layer located on the side of the support layer away from the display panel; the support layer includes a first portion and a second portion, the first portion at least partially overlaps with the display panel in a direction perpendicular to the plane where the cover plate is located, at least a portion of the second portion protrudes from the first portion toward the side away from the display panel, and the second portion is in contact with the heat dissipation layer. On the one hand, the heat dissipation layer in the present invention is grounded. When the cover plate is subjected to external high-voltage charges, the charges are conducted to the second portion of the support layer through the side of the display panel. Since the second portion is in contact with the heat dissipation layer and the heat dissipation layer is grounded, the charges are conducted through the second portion and the heat dissipation layer. In this way, the static electricity on the surface of the cover plate cannot be transmitted to the interior of the display panel, but is directly conducted from the heat dissipation layer, thereby improving the electrostatic protection capability of the display module. On the other hand, the support layer is an existing structure in the display module. It is only necessary to set the edge position of the support layer, that is, the second part, to be thicker than the middle position, that is, the first part, so that the second part of the support layer is in contact with the heat dissipation layer. No other structures need to be added. While improving the electrostatic protection capability, there is no need to improve the structure of the display module. The manufacturing process is simple and the cost is reduced.

[0009] Of course, any product implementing the present invention does not necessarily need to achieve all of the technical effects described above at the same time.

[0010] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0012] Figure 1 This is a schematic diagram of the planar structure of a display module provided by the present invention;

[0013] Figure 2 yes Figure 1 A cross-section taken along the A-A' direction;

[0014] Figure 3 is a cross-sectional view of a display panel provided by the present invention;

[0015] Figure 4 This is a schematic diagram of the planar structure of a support layer provided by the present invention;

[0016] Figure 5 This is a schematic diagram of the planar structure of another display module provided by the present invention;

[0017] Figure 6 yes Figure 1Another cross-sectional view in the A-A' direction;

[0018] Figure 7 This is a schematic diagram of the planar structure of another display module provided by the present invention;

[0019] Figure 8 yes Figure 1 Another cross-sectional view in the A-A' direction;

[0020] Figure 9 yes Figure 1 Another cross-sectional view in the A-A' direction;

[0021] Figure 10 yes Figure 1 Another cross-sectional view in the A-A' direction;

[0022] Figure 11 yes Figure 1 Another cross-sectional view in the A-A' direction;

[0023] Figure 12 It is a schematic diagram of the planar structure of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0024] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0025] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0026] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0027] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0028] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0029] Given that the display module is prone to generating static electricity when subjected to external high-voltage charges, changes in the external electrostatic environment cause static electricity to enter the light-emitting layer of the display panel, causing the display inside the display panel to glow. The present invention provides a display module and a display device to enhance the anti-static capability of the display module. Specific embodiments of the display module and the display device will be described in detail below.

[0030] Reference Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the planar structure of a display module provided by the present invention. Figure 2 yes Figure 1 In a cross-sectional view taken along the A-A' direction, the display module 100 of this embodiment includes: a display panel 110; a cover plate 120, located on the side of the display panel 110 facing its light-emitting surface K1; a support layer 130, located on the side of the display panel 110 away from its light-emitting surface K1; a heat dissipation layer 140, located on the side of the support layer 130 away from the display panel 110; the support layer 130 includes a first portion 1301 and a second portion 1302, the first portion 1301 at least partially overlapping with the display panel 110 in a direction perpendicular to the plane of the cover plate 120, at least a portion of the second portion 1302 protrudes from the first portion 1301 toward the side away from the display panel 110, and the second portion 1302 is in contact with the heat dissipation layer 140.

[0031] Specifically, the display panel 110 provided in this embodiment may be an organic light-emitting display panel 110. The organic light-emitting display panel 110 has the advantages of self-luminescence, high brightness, wide viewing angle, and fast response. It does not require a backlight and can use a thinner organic material coating and a glass substrate. When current passes through, these organic materials will emit light. In addition, the organic light-emitting display panel 110 can be made lighter and thinner, with a wider viewing angle, and can significantly save electricity. Figure 3 , Figure 3It is a cross-sectional view of a display panel provided by the present invention. The base substrate 10 of this embodiment can be used as a carrier to carry other structures of the display panel 110. The base substrate 10 is a flexible substrate, which is not specifically limited in this embodiment. The display panel 110 has a plurality of sub-pixels arranged in an array. The display panel 110 also includes an array layer 20 located on one side of the base substrate 10. The array layer 20 may include a gate metal layer, a source and drain metal layer, an active layer, and may also include an insulating layer (not shown in the figure) between each conductive film layer to make a light-emitting control unit of the sub-pixel to control whether the sub-pixel emits light. The planarization layer 30 is located on the side of the array layer 20 away from the base substrate 10. The planarization layer 30 flattens the surface of the array layer 20. The pixel definition layer 50 located on the side of the planarization layer 30 away from the base substrate 10 includes a plurality of openings 501, which are perpendicular to the direction of the base substrate 10 along the pixel definition layer 50. The opening can at least pass through the pixel definition layer 50. The sub-pixel P is located in the opening 501. The sub-pixel P in each opening has a different color. Figure 3 Only two sub-pixels, a first sub-pixel P1 and a second sub-pixel P2, are schematically shown. The orthographic projection of the sub-pixels onto the substrate 10 overlaps with the orthographic projection of the opening 501 onto the substrate 10. Each sub-pixel includes a first electrode 401a, a light-emitting portion 401b, and a second electrode 401c located on the side of the planarization layer 30 away from the substrate 10. Each opening in the pixel definition layer 50 is used to provide a sub-pixel. Optionally, the first electrode 401a may be an anode, and the second electrode 401c may be a cathode. When current flows through the first electrode 401a and the second electrode 401c and forms an electric field between the first electrode 401a and the second electrode 401c, the light-emitting portion 401b emits light. The principle of light emission can be understood by referring to the structure and principle of organic light-emitting devices in related technologies, and will not be described in detail in this embodiment. Figure 3 Also shown is an encapsulation layer 60 located on the side of the sub-pixel P away from the base substrate 10, which is used to encapsulate and protect the sub-pixel. Optionally, the encapsulation layer 60 may include an inorganic layer, an organic layer, and a stacked structure of multiple inorganic film layers. Figure 3 The base substrate 10 , the planarization layer 30 and the encapsulation layer 60 are not pattern-filled. Figure 3 It is also shown that the side of the encapsulation layer 60 away from the base substrate 10 includes a color resist 80. The color resists corresponding to different sub-pixels are different in color. The first sub-pixel P1 corresponds to the first color resist 81, and the second sub-pixel P2 corresponds to the second color resist 82. It can be understood that the color resist 80 can be in the same layer as the shading structure 70. Of course, the color resist can also be set in a different layer from the shading structure. No specific limitation is made here. In this embodiment, the display panel 110 does not need to be provided with a polarizer 150. It is known in the prior art that the yield of the display panel 110 that uses color resist to polarize light is much greater than that of the display panel 110 that is provided with a polarizer 150 to polarize light.

[0032] It should be noted that, in this embodiment Figure 3 The structure of the display panel 110 is only schematically drawn. In specific implementation, the structure of the display panel 110 is not limited to this, and may also include other structures that can realize the functions of the organic display panel 110. For specific understanding, please refer to the structure of the display panel 110 in the relevant technology, and the present invention will not go into details here.

[0033] The cover plate 120 is located on a side of the display panel 110 facing the light emitting surface K1 thereof. The cover plate 120 is mainly used to protect the display panel 110 . The cover plate 120 may be a glass cover plate 120 or other transparent materials. Figure 2 The cover plate 120 is not patterned. In related art, cover plates are often exposed to external high-voltage charges, which can easily generate static electricity. This static electricity can enter the internal array layer along the sides of the display panel, affecting the performance of the display panel. Optionally, optical adhesive can be used to bond the cover plate 120 to the display panel 110. The composition of the optical adhesive is not specifically limited here, and it can be, for example, UV-curable optical adhesive.

[0034] The support layer 130 is located on the side of the display panel 110 away from the light-emitting surface K1. For the flexible display panel 110, its substrate is a flexible substrate, so its edges are prone to bending and its surface is also easily scratched. Providing the support layer 130 on the side of the substrate of the display panel 110 away from the light-emitting surface K1 can, on the one hand, prevent the substrate edge from bending and provide support, and on the other hand, prevent the substrate from being scratched. The support layer 130 is a structure that already exists in the display module 100. Optionally, the material of the support layer 130 can be polyimide (PI).

[0035] The heat dissipation layer 140 is located on the side of the support layer 130 away from the display panel 110 and is used to dissipate heat from the display panel 110, conduct static electricity, and shield signals, thereby ensuring the reliability of the display module 100. The heat dissipation layer 140 can be made of a conductive material or a metal material. The heat dissipation layer 140 is grounded. Optionally, the heat dissipation layer 140 uses SCF (Super-Composite-Film, copper foil tape), which is a composite of foam, PI (Polyimide, polyimide), and copper foil, to provide excellent heat dissipation, buffering, conductivity, and protection.

[0036] Reference Figure 2 , Figure 2It is shown in the figure that the supporting layer 130 includes a first part 1301 and a second part 1302. The first part 1301 at least partially overlaps with the display panel 110 in the direction perpendicular to the plane where the cover plate 120 is located, and at least a part of the second part 1302 protrudes from the first part 1301 to the side away from the display panel 110, and the second part 1302 is in contact with the heat dissipation layer 140. It should be noted that the first part 1301 can partially overlap with the display panel 110 in the direction perpendicular to the plane where the cover plate 120 is located, or it can completely overlap, and the orthographic projection of the display panel 110 on the plane where the cover plate 120 is located can also be located within the orthographic projection of the first part 1301 on the plane where the cover plate 120 is located, which is not specifically limited here. At least a part of the second part 1302 protrudes from the first part 1301 to the side away from the display panel 110 means that a part of the second part 1302 can protrude from the first part 1301, as long as it can be ensured that a part of the second part 1302 is in contact with the heat dissipation layer 140. Reference Figure 4 , Figure 4 This is a schematic diagram of the planar structure of a support layer provided by the present invention. Figure 4 The middle portion is the first portion 1301, and the edge is the second portion 1302. Figure 4 The second portion 1302 is schematically shown as being located on one side of the first portion 1301. Alternatively, the second portion 1302 may semi-enclose the first portion 1301, which is not specifically limited here. The thickness of the second portion 1302 is greater than the thickness of the first portion 1301 in a direction perpendicular to the plane of the cover plate 120, so that at least a portion of the second portion 1302 protrudes from the first portion 1301 toward the side away from the display panel 110, thereby contacting the heat dissipation layer 140.

[0037] On the one hand, the heat dissipation layer 140 of the present invention is grounded. When the cover plate 120 is subjected to an external high-voltage charge, the charge is conducted through the side of the display panel 110 to the second portion 1302 of the support layer 130. Since the second portion 1302 is in contact with the heat dissipation layer 140 and the heat dissipation layer 140 is grounded, the charge is conducted through the second portion 1302 and the heat dissipation layer 140. This prevents static electricity on the surface of the cover plate 120 from being transmitted to the interior of the display panel 110 and is conducted directly through the heat dissipation layer 140, thereby improving the electrostatic protection capability of the display module. On the other hand, the support layer 130 is an existing structure in the display module 100. It is only necessary to make the edge of the support layer 130, i.e., the second portion 1302, thicker than the middle portion, i.e., the first portion 1301, so that the second portion 1302 of the support layer 130 is in contact with the heat dissipation layer 140. No additional structures are required. While improving the electrostatic protection capability, it is also unnecessary to modify the structure of the display module 100. This simplifies the manufacturing process and reduces costs.

[0038] In some optional embodiments, continue to refer to Figure 2 and reference Figure 5, Figure 5 This is a schematic diagram of the planar structure of another display module provided by the present invention. Figure 5 In order to illustrate the positional relationship between the display panel 110 and the support layer 130, Figure 5 1 is a perspective view showing the positional relationship between the display panel 110 and the support layer 130. In this embodiment, the orthographic projection of the second portion 1302 on the plane where the cover plate 120 is located at least partially surrounds the orthographic projection of the display panel 110 on the plane where the cover plate 120 is located.

[0039] Figure 5 In the embodiment of the invention, the orthographic projection of the second portion 1302 on the plane where the cover plate 120 is located surrounds the orthographic projection of the display panel 110 on the plane where the cover plate 120 is located, that is, the area of ​​the first portion 1301 is greater than or equal to the area of ​​the display panel 110, so that the second portion 1302 surrounds the display panel 110. When the cover plate 120 is subjected to external high-voltage charge, it is conducted to the second portion 1302 of the support layer 130 through the side of the display panel 110. The second portion 1302 surrounds the display panel 110 and contacts the heat dissipation layer 140, thereby dissipating the heat. The thermal layer 140 is grounded, so the charge will be discharged through the second part 1302 and the heat dissipation layer 140. In this way, the static electricity on the surface of the cover plate 120 cannot be transmitted to the interior of the display panel 110, and is directly discharged from the heat dissipation layer 140, thereby improving the electrostatic protection capability of the display module. The orthographic projection of the second part 1302 on the plane where the cover plate 120 is located at least partially surrounds the orthographic projection of the display panel 110 on the plane where the cover plate 120 is located, which can further ensure that static electricity will not enter the interior of the display panel 110 from the display panel 110, but will be directly discharged from the second part 1302.

[0040] In some optional embodiments, continue to refer to Figure 2 The heat dissipation layer 140 includes a copper foil layer 1401 , and the second portion 1302 is in contact with the copper foil layer 1401 .

[0041] It is understandable that in order to achieve better heat dissipation and electrical conductivity, the outermost layer of the heat dissipation layer 140 is usually set to a metal material, such as a copper foil layer 1401. The copper foil layer 1401 has good heat dissipation performance and is also a good conductor of electricity. The second part 1302 is in contact with the copper foil layer 1401, and the static electricity transmitted from the second part 1302 can be conducted through the copper foil layer 1401. It should be noted that the copper foil layer 1401 itself also needs to be grounded. In this embodiment, when the cover plate 120 is subjected to external When a high-voltage charge acts, it is conducted through the side of the display panel 110 to the second portion 1302 of the support layer 130. The second portion 1302 surrounds the display panel 110 and is in contact with the copper foil layer 1401. The copper foil layer 1401 itself is grounded, so the charge is discharged through the second portion 1302 and the copper foil layer 1401. In this way, the static electricity on the surface of the cover plate 120 cannot be transmitted to the interior of the display panel 110, and is directly discharged from the copper foil layer 1401, thereby improving the electrostatic protection capability of the display module.

[0042] In some optional embodiments, continue to refer to Figure 2 The heat dissipation layer 140 further includes a support film 1402 located on a side of the copper foil layer 1401 close to the display panel 110 , and a buffer layer 1403 located on a side of the support film 1402 close to the display panel 110 ;

[0043] In a direction perpendicular to the plane where the cover plate 120 is located, the second portion 1302 surrounds the supporting film 1402 and the buffer layer 1403 .

[0044] Specifically, the heat dissipation layer 140 of this embodiment adopts SCF (Super-Composite-Film, copper foil tape), which is composed of foam, PI (Polyimide) and copper foil, and plays a good role in heat dissipation, buffering, conductivity and protection. The heat dissipation layer 140 includes a buffer layer 1403 (for example, foam) located on the side of the support layer 130 away from the display panel 110, a support film 1402 (for example, PI) located on the side of the buffer layer 1403 away from the display panel 110, and a copper foil layer 1401 located on the side of the buffer layer 1403 away from the display panel 110. The foam can play a buffering role, and the PI further plays a supporting role.

[0045] In this embodiment, in a direction perpendicular to the plane where the cover plate 120 is located, the second part 1302 surrounds the support film 1402 and the buffer layer 1403, that is, the second part 1302 wraps the support film 1402 and the buffer layer 1403. It is only necessary to increase the area of ​​the copper foil so that the second part 1302 can be in direct contact with the copper foil layer 1401. The copper foil layer 1401 itself is grounded. When the cover plate 120 is subjected to external high-voltage charge, it is conducted to the second part 1302 of the support layer 130 through the side of the display panel 110. The second part 1302 surrounds the display panel 110 and is in contact with the copper foil layer 1401. The copper foil layer 1401 itself is grounded, so the charge will be discharged through the second part 1302 and the copper foil layer 1401. In this way, the static electricity on the surface of the cover plate 120 cannot be transmitted to the interior of the display panel 110, and is directly discharged from the copper foil layer 1401, thereby improving the electrostatic protection capability of the display module.

[0046] In some optional embodiments, referring to Figure 6 , Figure 6 yes Figure 1 In another cross-sectional view taken along the A-A' direction, the copper foil layer 1401 includes a third portion 14011 and a fourth portion 14012. In a direction perpendicular to the plane of the cover plate 120, the third portion 14011 overlaps with the display panel 110, and in a direction perpendicular to the plane of the cover plate 120, the fourth portion 14012 surrounds the display panel 110. The fourth portion 14012 protrudes from the third portion 14011 toward one side of the display panel 110, and the third portion 14011 contacts the second portion 1302.

[0047] Reference Figure 6 In the embodiment, the copper foil layer 1401 is designed with unequal thickness. The portion overlapping with the display panel 110 is the third portion 14011. The fourth portion 14012 surrounds the display panel 110 in a direction perpendicular to the plane of the cover plate 120. The fourth portion 14012 protrudes from the third portion 14011 toward one side of the display panel 110. This makes it easier for the third portion 14011 to contact the second portion 1302. Therefore, the thickness of the second portion 1302 does not need to be much greater than that of the first portion 1301 to achieve contact with the copper foil layer 1401. When the cover plate 120 is subjected to external high-voltage charges, the charges are conducted to the second portion 1302 of the support layer 130 through the side of the display panel 110. The second portion 1302 is in contact with the fourth portion 14012 of the copper foil layer 1401. The copper foil layer 1401 itself is grounded, so the charges are conducted through the second portion 1302, the fourth portion 14012, and the third portion 14011. This prevents the static electricity on the surface of the cover plate 120 from being transmitted to the interior of the display panel 110, and the charges are directly conducted from the copper foil layer 1401, thereby improving the electrostatic protection capability of the display module.

[0048] In some optional embodiments, the display panel 110 includes a display area AA and a non-display area BB that at least partially surrounds the display area AA, the non-display area BB includes a left frame BB1 ​​and a right frame BB2 arranged opposite to each other along a first direction, and an upper frame BB3 and a lower frame BB4 arranged opposite to each other along a second direction, and in a direction perpendicular to the plane where the cover plate 120 is located, the second portion 1302 at least partially surrounds the upper frame BB3, the left frame BB1 ​​and / or the right frame BB2.

[0049] Continue to refer to Figure 5 and Figure 7 , Figure 7 This is a schematic diagram of the planar structure of another display module provided by the present invention. Figure 5 In the direction perpendicular to the plane where the cover plate 120 is located, the second portion 1302 surrounds the upper frame BB3, the left frame BB1 ​​and the right frame BB2. Figure 7 In the direction perpendicular to the plane where the cover plate 120 is located, the second portion 1302 only surrounds the upper frame BB3. Of course, in the direction perpendicular to the plane where the cover plate 120 is located, the second portion 1302 can also only surround the left frame BB1, or only surround the right frame BB2 in the direction perpendicular to the plane where the cover plate 120 is located, or surround the left frame BB1 ​​and the right frame BB2 in the direction perpendicular to the plane where the cover plate 120 is located, or surround the left frame BB1 ​​and the upper frame BB3 in the direction perpendicular to the plane where the cover plate 120 is located, or surround the right frame BB2 and the upper frame BB3 in the direction perpendicular to the plane where the cover plate 120 is located. No specific limitation is made here. The embodiment of the second portion 1302 is applicable to any of the above embodiments and will not be repeated here.

[0050] It can be understood that the second part 1302 cannot surround the lower frame BB4 in the direction perpendicular to the plane of the cover plate 120, because the lower frame BB4 of the flexible display panel 110 needs to be bent to the back side, and the supporting layer 130 needs to dig a hole at the position of the lower frame BB4, so the second part 1302 cannot be set corresponding to the position of the lower frame BB4.

[0051] In a direction perpendicular to the plane where the cover plate 120 is located, the second part 1302 at least partially surrounds the upper frame BB3, the left frame BB1 ​​and / or the right frame BB2. When the cover plate 120 is subjected to external high-voltage charge, it is conducted through the side of the display panel 110 to the second part 1302 surrounding the upper frame BB3, the left frame BB1 ​​and / or the right frame BB2. The second part 1302 is in contact with the copper foil layer 1401, and the copper foil layer 1401 itself is grounded, so the charge will be discharged through the second part 1302 and the copper foil layer 1401. In this way, the static electricity on the surface of the cover plate 120 cannot be transmitted to the interior of the display panel 110, and is directly discharged from the copper foil layer 1401, thereby improving the electrostatic protection capability of the display module.

[0052] In some optional embodiments, referring to Figure 8 and Figure 9 , Figure 8 yes Figure 1 Another cross-sectional view in the A-A' direction, Figure 9 yes Figure 1 In another cross-sectional view taken along the A-A' direction, the second portion 1302 includes a first sub-portion 13021 and a second sub-portion 13022. The first sub-portion 13021 protrudes from the first portion 1301 toward the side away from the display panel 110, and the second sub-portion 13022 protrudes from the first portion 1301 toward the side of the display panel 110. The second sub-portion 13022 contacts the cover plate 120.

[0053] Figure 8 and Figure 9 The middle supporting layer 130 is designed with unequal thickness. The second part 1302 has a first sub-part 13021 and a second sub-part 13022. The first sub-part 13021 protrudes from the first part 1301 on the side away from the display panel 110. The first sub-part 13021 contacts the heat dissipation layer 140. The second sub-part 13022 protrudes from the first part 1301 on the side of the display panel 110. The second sub-part 13022 contacts the cover plate 120. This ensures that the side edges of the supporting layer 130 are in contact with the cover plate 120 and the heat dissipation layer 140 respectively. When the cover plate 120 is subjected to external high-voltage charge, the charge is conducted to the heat dissipation layer 140 through the second sub-part 13022 and the first sub-part 13021. The heat dissipation layer 140 itself is grounded, so the charge is discharged through the heat dissipation layer 140. In this way, static electricity on the surface of the cover plate 120 cannot be transmitted to the interior of the display panel 110, and is directly discharged from the heat dissipation layer 140, further improving the electrostatic protection capability of the display module.

[0054] Figure 9In the embodiment, the copper foil layer 1401 is designed with unequal thickness. The portion overlapping with the display panel 110 is the third portion 14011. The fourth portion 14012 surrounds the display panel 110 in a direction perpendicular to the plane where the cover plate 120 is located. The fourth portion 14012 protrudes from the third portion 14011 toward one side of the display panel 110. This makes it easier for the third portion 14011 to contact the first sub-portion 13021. Therefore, the thickness of the first sub-portion 13021 does not need to be much greater than that of the first portion 1301 to achieve sufficient contact with the copper foil layer 140. 1, when the cover plate 120 is subjected to external high-voltage charge, the charge is conducted to the fourth portion 14012 of the copper foil layer 1401 through the second sub-portion 13022 and the first sub-portion 13021. The copper foil layer 1401 itself is grounded, so the charge is conducted through the second sub-portion 13022, the first sub-portion 13021, the fourth portion 14012, and the third portion 14011. In this way, the static electricity on the surface of the cover plate 120 cannot be transmitted to the interior of the display panel 110, and is directly conducted from the copper foil layer 1401, further improving the electrostatic protection capability of the display module.

[0055] In some optional embodiments, referring to Figure 10 , Figure 10 yes Figure 1 In another cross-sectional view taken along the A-A' direction, the display module 100 further includes a polarizer 150 located on the light-emitting surface K1 side of the display panel 110, and an optical adhesive layer 160 located on the side of the polarizer 150 close to the cover plate 120. In a direction perpendicular to the plane of the cover plate 120, the second sub-portion 13022 surrounds the display panel 110, the polarizer 150, and the optical adhesive layer 160.

[0056] It is understood that a polarizer 150 is required to be provided on one side of the light-emitting surface K1 of the display panel 110. Natural light from the environment, when it strikes the OLED display panel 110, is reflected back from the metal cathode, resulting in a high reflectivity of the display panel 110. Therefore, the polarizer 150 is provided to reduce the effect of ambient light on the reflectivity of the display panel 110. The polarizer 150 is located on the side of the light-emitting surface K1 of the display panel 110. Optionally, the display panel 110 with the polarizer 150 provided can be bonded to the cover plate 120 using optical adhesive.

[0057] In this embodiment, in a direction perpendicular to the plane where the cover plate 120 is located, the second sub-portion 13022 surrounds the display panel 110, the polarizer 150 and the optical adhesive layer 160, that is, the second sub-portion 13022 wraps the display panel 110, the polarizer 150 and the optical adhesive layer 160. When the cover plate 120 is subjected to external high-voltage charge, it is conducted to the heat dissipation layer 140 through the second sub-portion 13022 and the first sub-portion 13021. The heat dissipation layer 140 itself is grounded, so the charge will be discharged through the heat dissipation layer 140. In this way, the static electricity on the surface of the cover plate 120 cannot be transmitted to the interior of the display panel 110, and is directly discharged from the heat dissipation layer 140, thereby further improving the electrostatic protection capability of the display module.

[0058] In some optional embodiments, continue to refer to Figure 2 and Figure 4 , the first part 1301 and the second part 1302 are integrally formed.

[0059] It is understandable that the materials of the first part 1301 and the second part 1302 of the supporting layer 130 can be the same, and the first part 1301 and the second part 1302 can be integrally formed. During production, it is only necessary to cut the material of the supporting layer 130 into different thicknesses. The anti-static ability of the display module 100 can be improved without adding additional structural components.

[0060] In some optional embodiments, referring to Figure 11 , Figure 11 yes Figure 1 In another cross-sectional view taken along line AA′, the cover plate 120 includes a central area CA and a light-shielding area ZA surrounding the central area CA. In a direction perpendicular to the plane of the display panel 110 , the second portion 1302 is located in the light-shielding area ZA.

[0061] It can be understood that the shading area ZA of the cover plate 120 is set around the central area CA. In the shading area ZA, a shading layer 1201 needs to be set on the side of the cover plate 120 close to the display panel 110 to prevent light leakage from the edge of the display panel 110. Optionally, the shading layer 1201 is ink.

[0062] In this embodiment, the second portion 1302 is located in the shading area ZA in a direction perpendicular to the plane of the display panel 110. The second portion 1302 is set corresponding to the existing shading area ZA position in the cover plate 120. That is, the second portion 1302 cannot be seen through the cover plate 120, and the width of the cover plate 120 will not be increased, which is conducive to achieving a narrow frame of the display module 100.

[0063] In some alternative embodiments, please refer to Figure 12 , Figure 122 is a schematic diagram of a planar structure of a display device provided in an embodiment of the present invention. The display device 200 provided in this embodiment includes the display module 100 provided in the above embodiment. Figure 12 This embodiment uses a mobile phone as an example to illustrate the display device 200. It should be understood that the display device 200 provided in this embodiment of the present invention may be a computer, television, vehicle-mounted display device, or other display device 200 having a display function, and the present invention does not impose any specific limitations thereon. The display device 200 provided in this embodiment of the present invention has the beneficial effects of the display module 100 provided in this embodiment of the present invention. For details, please refer to the detailed description of the display module 100 in the above embodiments, and this embodiment will not be repeated here.

[0064] It can be seen from the above embodiments that the display module and display device provided by the present invention achieve at least the following beneficial effects:

[0065] The display module of the present invention includes: a display panel; a cover plate located on the side of the display panel facing its light-emitting surface, a support layer located on the side of the display panel away from its light-emitting surface, and a heat dissipation layer located on the side of the support layer away from the display panel; the support layer includes a first portion and a second portion, the first portion at least partially overlaps with the display panel in a direction perpendicular to the plane where the cover plate is located, at least a portion of the second portion protrudes from the first portion toward the side away from the display panel, and the second portion is in contact with the heat dissipation layer. On the one hand, the heat dissipation layer in the present invention is grounded. When the cover plate is subjected to external high-voltage charges, the charges are conducted to the second portion of the support layer through the side of the display panel. Since the second portion is in contact with the heat dissipation layer and the heat dissipation layer is grounded, the charges are conducted through the second portion and the heat dissipation layer. In this way, the static electricity on the surface of the cover plate cannot be transmitted to the interior of the display panel, but is directly conducted from the heat dissipation layer, thereby improving the electrostatic protection capability of the display module. On the other hand, the support layer is an existing structure in the display module. It is only necessary to set the edge position of the support layer, that is, the second part, to be thicker than the middle position, that is, the first part, so that the second part of the support layer is in contact with the heat dissipation layer. No other structures need to be added. While improving the electrostatic protection capability, there is no need to improve the structure of the display module. The manufacturing process is simple and the cost is reduced.

[0066] Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It should be understood by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A display module, characterized in that: include: Display panel; a cover plate, located on a side of the display panel facing the light emitting surface thereof; A supporting layer is located on a side of the display panel away from the light emitting surface thereof; a heat dissipation layer, located on a side of the support layer away from the display panel; The support layer includes a first portion and a second portion, wherein the first portion at least partially overlaps the display panel in a direction perpendicular to the plane of the cover plate, at least a portion of the second portion protrudes from the first portion toward a side away from the display panel, and the second portion contacts the heat dissipation layer; The orthographic projection of the support layer on the plane where the display panel is located is located within the orthographic projection of the cover plate on the plane where the display panel is located.

2. The display module according to claim 1, wherein: The orthographic projection of the second portion on the plane where the cover plate is located at least partially surrounds the orthographic projection of the display panel on the plane where the cover plate is located.

3. The display module according to claim 1, wherein: The heat dissipation layer includes a copper foil layer, and the second portion contacts the copper foil layer.

4. The display module according to claim 3, wherein: The heat dissipation layer further includes a support film located on a side of the copper foil layer close to the display panel, and a buffer layer located on a side of the support film close to the display panel; In a direction perpendicular to the plane where the cover plate is located, the second portion surrounds the supporting film and the buffer layer.

5. The display module according to claim 3, wherein: The copper foil layer includes a third portion and a fourth portion. In a direction perpendicular to the plane where the cover plate is located, the third portion overlaps with the display panel, and in a direction perpendicular to the plane where the cover plate is located, the fourth portion surrounds the display panel. The fourth portion protrudes from the third portion toward one side of the display panel, and the third portion contacts the second portion.

6. The display module according to claim 1, wherein: The display panel includes a display area and a non-display area that at least partially surrounds the display area. The non-display area includes a left frame and a right frame arranged opposite to each other along a first direction, and an upper frame and a lower frame arranged opposite to each other along a second direction. In a direction perpendicular to the plane where the cover plate is located, the second part at least partially surrounds the upper frame, the left frame and / or the right frame.

7. The display module according to claim 1, wherein: The second portion includes a first sub-portion and a second sub-portion. The first sub-portion protrudes from the first portion toward a side away from the display panel. The second sub-portion protrudes from the first portion toward a side of the display panel. The second sub-portion contacts the cover plate.

8. The display module according to claim 7, wherein: The display module also includes a polarizer located on the light-emitting side of the display panel and an optical adhesive layer located on the side of the polarizer close to the cover plate. In a direction perpendicular to the plane of the cover plate, the second sub-part surrounds the display panel, the polarizer and the optical adhesive layer.

9. The display module according to claim 1, wherein: The first part and the second part are integrally formed.

10. The display module according to claim 1, wherein: The cover plate includes a central area and a light-shielding area surrounding the central area. In a direction perpendicular to the plane where the display panel is located, the second portion is located in the light-shielding area.

11. A display device, characterized in that: A display module comprising any one of claims 1 to 10.

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