Method for preparing side wire of display panel and display panel

Abstract

The embodiment of the present application discloses a method for preparing a side wire of a display panel and a display panel, the method for preparing the side wire of a display panel comprises the following preparation steps: providing a display panel body, the display panel body comprising a first surface and a second surface that are opposite to each other, and a side surface connecting the first surface and the second surface, wherein at least two terminal groups are provided on the display panel, each terminal group comprises a first terminal provided on the first surface and a second terminal provided on the second surface; preparing an insulating layer on the side surface, the first surface and the second surface of the display panel body, the insulating layer covering the terminal group, and the surface energy of the insulating layer being lower than 100mN / m; preparing grooves on the insulating layer, the grooves being provided on the first surface, the second surface and the side surface, and the terminal group being exposed in the grooves; preparing a conductive material on the insulating layer, the conductive material covering the insulating layer and filling the grooves; curing the conductive material, and the conductive material forming side wires in the grooves.

Description

Technical Field

[0001] The present application relates to the display field, and in particular to a method for preparing a side wire of a display panel and a display panel. Background Art

[0002] Micro-LED (micrometer-level LED) has the advantages of fast response, high color gamut, and low energy consumption, and has become a new direction and new track for the development of display technology. Large-sized Micro-LED products are limited by the bottleneck of mass transfer and are generally made of multiple small-sized Micro-LED screens. The existing splicing solutions include glass splicing and flexible splicing. Glass splicing is to connect the front wiring to the back of the substrate through the side wiring through technical means, and bind the driving components on the back. The current methods for making side wires are silver paste transfer and PVD (physical vapor deposition) + laser engraving. Both methods have some problems:

[0003] 1. The silver paste transfer method has the risk of poor accuracy between the conductive material and the metal terminal after multiple transfers, resulting in a risk of failure to conduct;

[0004] 2. The PVD laser engraving method requires a protective film to protect the non-conductive production area, and the protective film has high requirements for pasting accuracy. Summary of the invention

[0005] The embodiments of the present application provide a method for preparing a side wire of a display panel and a display panel, which can solve the technical problem of poor process precision of preparing the side wire in the prior art.

[0006] The present application provides a method for preparing a side wire of a display panel, comprising the following preparation steps:

[0007] A display panel body is provided, the display panel body comprising a first surface and a second surface which are separated from each other, and a side surface connecting the first surface and the second surface, wherein at least two terminal groups are provided on the display panel, each terminal group comprising a first terminal provided on the first surface and a second terminal provided on the second surface;

[0008] An insulating layer is prepared on the side surface, the first surface and the second surface of the display panel body, the insulating layer covers the terminal group, and the surface energy of the insulating layer is lower than 100 mN / m;

[0009] preparing grooves on the insulating layer, wherein the grooves are arranged on the first surface, the second surface and the side surface, and the terminal group is exposed in the grooves;

[0010] Preparing a conductive material on the insulating layer, wherein the conductive material covers the insulating layer and fills the groove;

[0011] The conductive material is solidified to form the side conductive lines in the grooves.

[0012] Optionally, in some embodiments of the present application, a laser process is used to prepare the grooves on the insulating layer.

[0013] Optionally, in some embodiments of the present application, the conductive material is solder paste.

[0014] Optionally, in some embodiments of the present application, the specific preparation steps of preparing the conductive material on the insulating layer are as follows:

[0015] The side surface of the display panel body is arranged upward, and a mask plate is sleeved on the display panel body, wherein the mask plate comprises an opening, the inner surface of the opening is attached to the outer surface of the insulating layer, and the inner surface of the mask plate and the outer surface of the insulating layer form a cavity;

[0016] The conductive material is filled in the cavity, and the conductive material is flattened by a scraper, and the conductive material is made to adhere to the surface of the insulating layer and fill the groove.

[0017] Optionally, in some embodiments of the present application, the distance between two adjacent grooves is 40 μm to 100 μm.

[0018] Optionally, in some embodiments of the present application, the material of the insulating layer includes polytetrafluoroethylene.

[0019] Optionally, in some embodiments of the present application, the slot includes a first slot and a second slot, the first slot corresponds to the terminal group, and the second slot is provided between two adjacent first slots.

[0020] Optionally, in some embodiments of the present application, after the step of providing a display panel body, the following preparation steps are also included:

[0021] A protective layer is attached to both the first surface and the second surface of the display panel body, and the terminal group is exposed outside the protective layer.

[0022] Optionally, in some embodiments of the present application, the depth of the groove is less than the thickness of the side wire.

[0023] Correspondingly, an embodiment of the present application further provides a display panel, comprising side wires, wherein the side wires are prepared by the method for preparing the side wires of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 is a schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0026] Figure 2 is a flow chart of a method for preparing a side wire of a display panel provided in an embodiment of the present application;

[0027] Figure 3 is a structural diagram of the insulating layer prepared according to an embodiment of the present application;

[0028] Figure 4 It is a side view after the groove preparation provided in the embodiment of the present application is completed;

[0029] Figure 5 is a side view after the slotting preparation is completed provided in another preferred embodiment of the present application;

[0030] Figure 6 It is a schematic diagram of the structure after the groove is prepared according to the embodiment of the present application;

[0031] Figure 7 is a structural diagram of the preparation of a conductive material provided in an embodiment of the present application;

[0032] Figure 8 is a side view of the conductive material provided in the embodiment of the present application after being scraped flat;

[0033] Fig. 9 It is a side view of the conductive material after curing provided in an embodiment of the present application.

[0034] Description of reference numerals:

[0035] Display panel 10; Display panel body 110;

[0036] Terminal group 120; Insulation layer 130;

[0037] Side wire 140; First surface 111;

[0038] A second surface 112; A side surface 113;

[0039] A first terminal 121; A second terminal 122;

[0040] Slot 131; First slot 1311;

[0041] Second slot 1312; Protective layer 20;

[0042] Mask plate 30; Opening 31. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the directional words such as "upper" and "lower" used generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0044] The present application provides a method for preparing a side wire of a display panel and a display panel, which are described in detail below.

[0045] Example

[0046] This embodiment is mainly used to explain the method for preparing the side wires of the display panel of the present invention and the display panel 10 prepared by the method for preparing the side wires of the display panel. Specifically, Figure 1 As shown, the display panel 10 includes a display panel body 110 , a terminal group 120 , an insulating layer 130 and a side wire 140 .

[0047] The display panel body 110 is a glass substrate, which includes a first surface 111 and a second surface 112 that are opposite to each other, and also includes a side surface 113 connecting the first surface 111 and the second surface 112. The first surface 111 and the second surface 112 are both provided with wiring for transmitting electrical signals. The ends of the wiring extend to the edge close to the side surface 113 and are exposed on the first surface 111 or the second surface 112 to form a terminal group 120, wherein the terminal group 120 includes a first terminal 121 located at the edge of the first surface 111 and a second terminal 122 located at the edge of the second surface 112. The side wire 140 is used to connect the first terminal 121 and the second terminal 122 in each terminal group 120, so as to realize signal transmission of the wiring on the first surface 111 and the second surface 112.

[0048] Since the side wire 140 needs to bridge the first surface 111, the side surface 113 and the second surface 112, the prior art usually adopts transfer or laser engraving to prepare the side wire 140. However, due to poor precision, the side wire 140 cannot accurately connect to each terminal group 120, thereby causing technical problems of series connection and short circuit.

[0049] like Figure 4 As shown, in this embodiment, a low surface energy material is used as an insulating layer 130 and is disposed on the first surface 111, the second surface 112 and the side surface 113 of the display panel body 110. A plurality of slots 131 are provided on the insulating layer 130 and are spaced apart from each other, wherein the slots 131 correspond to the terminal groups 120, that is, the first terminals 121 and the second terminals 122 in each terminal group 120 are exposed in the same slot 131, and the side wires 140 are disposed in the slots 131 and are connected to the first terminals 121 and the second terminals 122 in the slots 131. In another preferred embodiment of the present invention, since the spacing between two adjacent terminal groups 120 is too large (greater than 100 μm), as shown in FIG. Figure 5 As shown, the slot 131 includes a first slot 1311 and a second slot 1312, wherein the first slot 1311 corresponds to the terminal group 120 one by one, and the second slot 1312 is arranged between the two first slots 1311, thereby ensuring that the distance between two adjacent first slots 1311 and second slots 1312 is between 40μm and 100μm.

[0050] In order to better explain the present invention, this embodiment also provides a method for preparing the side wires of the display panel, which is used to prepare the side wires 140. Figure 2 As shown, the specific steps are as follows:

[0051] S1) Provide a display panel body 110, the display panel body 110 includes a first surface 111 and a second surface 112 that are opposite to each other, and a side surface 113 connecting the first surface 111 and the second surface 112. The display panel body 110 is a glass substrate, and the first surface 111 and the second surface 112 are both provided with wiring for transmitting electrical signals. The ends of the wiring extend to the edge close to the side surface 113 and are exposed on the first surface 111 or the second surface 112 to form a terminal group 120, and each terminal group 120 includes a first terminal 121 and a second terminal 122 that are opposite to each other.

[0052] S2) A protective layer 20 is prepared on the display panel body 110. The protective layer 20 is respectively arranged on the first surface 111 and the second surface 112 to protect other wirings on the display panel body 110 except the terminal group 120. The terminal group 120 is exposed outside the protective layer 20 so that the insulating layer 130 can be prepared later.

[0053] S3) Figure 3 As shown, a layer of high temperature resistant insulating material is coated or soaked on the display panel body 110 to form an insulating layer 130. In this embodiment, the high temperature resistant insulating material is a polytetrafluoroethylene material. In other preferred embodiments of the present invention, the high temperature resistant insulating material is a low surface energy material with a surface energy lower than 100mN / m. The conductive material has a low adhesion ability on the insulating layer 130 and tends to move away from the insulating layer 130 under the action of surface tension.

[0054] S4) Figure 6 As shown, a plurality of slots 131 are formed on the insulating layer 130 by laser engraving, so that each terminal group 120 is exposed in a slot 131, and the spacing between two adjacent terminal groups 120 is 40μm to 100μm. In another preferred embodiment of the present invention, the spacing between two adjacent terminal groups 120 is greater than 100μm. In order to avoid the short circuit problem of the side wire 140 during the molding process, a second slot 1312 is added between two adjacent terminal groups 120, so that the spacing between the first slot 1311 of the corresponding terminal group 120 and the adjacent second slot 1312 is maintained between 40μm and 100μm, so as to facilitate the subsequent molding of the side wire 140.

[0055] S5) Figure 7 and Figure 8 As shown, the side surface 113 of the display panel body 110 is set upward, and a mask plate 30 is mounted on the display panel body 110. The mask plate 30 includes an opening 31, wherein the size of the opening 31 is adapted to the size of the display panel body 110 and the insulating layer 130, that is, the inner surface of the opening 31 is in contact with the outer surface of the insulating layer 130, so that a cavity is formed between the insulating layer 130 and the mask plate 30 to accommodate the conductive material.

[0056] S6) Fill the cavity with a conductive material. In this embodiment, the conductive material is molten solder paste. In other preferred embodiments of the present invention, the conductive material may also be other molten metal materials. Use a scraper to flatten the conductive material and ensure that the conductive material fills each slot 131, thereby ensuring that the conductive material is connected to each terminal group 120.

[0057] S7) Fig. 9As shown, the conductive material is cured. In this embodiment, the conductive material is cured by heating the display panel body 110. Since the conductive material is a molten solder paste, it is not compatible with the insulating layer 130 and cannot adhere to the insulating layer 130. At the same time, under the action of surface tension, the conductive material will move away from the insulating layer 130. Therefore, the formed conductive material will automatically gather in the slot 131 to form the side wire 140. Since the conductive material originally on the insulating layer 130 is gathered in the adjacent slot 131, the thickness of the formed side wire 140 is greater than the depth of the slot 131. The part of the side wire 140 protruding from the slot 131 can achieve the subsequent binding effect. Therefore, in this embodiment, there is no need to remove the insulating layer 130 additionally. It is worth noting that the method and structure for removing the insulating layer 130 still fall within the scope of protection of the present invention.

[0058] The beneficial effect of the present embodiment lies in that a method for preparing side wires of a display panel and a display panel of the present embodiment prepare an insulating layer on the side of the display panel, utilize the low surface energy of the insulating layer and the non-affinity of the conductive material and the surface tension of the conductive material itself, so as to automatically form side wires in the grooves of the insulating layer, thereby avoiding technical problems such as short circuit and series connection of the side wires during the preparation process.

[0059] The above is a detailed introduction to a method for preparing a side wire of a display panel and a display panel provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for preparing a side wire of a display panel, It is characterized in that The method comprises the following preparation steps: A display panel body is provided, the display panel body comprising a first surface and a second surface which are separated from each other, and a side surface connecting the first surface and the second surface, wherein at least two terminal groups are provided on the display panel, each terminal group comprising a first terminal provided on the first surface and a second terminal provided on the second surface; An insulating layer is prepared on the side surface, the first surface and the second surface of the display panel body, wherein the insulating layer covers the terminal group; preparing grooves on the insulating layer, wherein the grooves are arranged on the first surface, the second surface and the side surface, and the terminal group is exposed in the grooves; Preparing a conductive material on the insulating layer, wherein the conductive material covers the insulating layer and fills the groove; The conductive material is solidified to form the side conductive wire in the groove, wherein the surface energy of the insulating layer is lower than 100 mN / m, so as to reduce the adhesion of the conductive material on the insulating layer. Under the action of surface tension, the conductive material tends to move away from the insulating layer and gather in the adjacent groove, so that the thickness of the side conductive wire after forming is greater than the depth of the groove; The conductive material is solder paste.

2. The method for preparing the side wire of the display panel according to claim 1, It is characterized in that The grooves are prepared on the insulating layer by using a laser process.

3. The method for preparing the side wire of the display panel according to claim 1, It is characterized in that The specific preparation steps of preparing the conductive material on the insulating layer are as follows: The side surface of the display panel body is arranged upward, and a mask plate is sleeved on the display panel body, wherein the mask plate comprises an opening, the inner surface of the opening is attached to the outer surface of the insulating layer, and the inner surface of the mask plate and the outer surface of the insulating layer form a cavity; The conductive material is filled in the cavity, and the conductive material is flattened by a scraper, and the conductive material is made to adhere to the surface of the insulating layer and fill the groove.

4. The method for preparing the side wire of the display panel according to claim 1, It is characterized in that The distance between two adjacent slots is 40µm to 100µm.

5. The method for preparing the side wire of the display panel according to claim 1, It is characterized in that The material of the insulating layer is polytetrafluoroethylene.

6. The method for preparing the side wire of the display panel according to claim 1, It is characterized in that The slots include a first slot and a second slot, the first slot corresponds to the terminal group, and the second slot is arranged between two adjacent first slots.

7. The method for preparing the side wire of the display panel according to claim 1, It is characterized in that After the step of providing a display panel body, the following preparation steps are also included: A protective layer is attached to both the first surface and the second surface of the display panel body, and the terminal group is exposed outside the protective layer.

8. The method for preparing the side wire of the display panel according to claim 1, It is characterized in that The depth of the groove is smaller than the thickness of the side wire.

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