Surface acoustic wave filter package structure

CN115173829BActive Publication Date: 2026-08-28TIANTONG RUIHONG TECH CO LTD
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Patent Information

Application Number
CN202210817381.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-07-12
Publication Date
2026-08-28
Estimated Expiration
2042-07-12

AI Technical Summary

Technical Problem

此时会导致CSP封装基板的尺寸一定时，能够匹配的声表面波滤波器的尺寸减小

Benefits of technology

[0016]本发明实施例的技术方案，通过将滤波结构设置于凹槽内，且盖板覆盖凹槽，使得凹槽和盖板能够封装滤波结构。同时凹槽的尺寸可以根据滤波结构的尺寸进行调节，进而可以使得声表面波滤波器封装结构的尺寸接近于滤波结构的尺寸，从而有利于减小封装后的器件尺寸，有利于小型化和集成化。另外，声表面波滤波器封装结构不再使用CSP封装基板进行封装，避免了使用CSP封装基板进行封装时的芯片倒装工序。此外，在封装过程中，可以实现对一片晶圆上的多个滤波结构进行同时封装，从而可以批量形成声表面波滤波器封装结构，提高了封装效率。同时可以避免设置滤波结构的边缘和CSP封装基板之间的预留距离，从而有利于进一步地减小声表面波滤波器封装结构的尺寸，有利于小型化和集成化。

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Abstract

The application discloses a surface acoustic wave filter packaging structure. The surface acoustic wave filter packaging structure comprises a substrate, a filter structure, a connecting line, an external connection structure and a cover plate. The substrate is provided with a groove, the filter structure is arranged in the groove, and the cover plate covers the groove. The external connection structure is arranged outside the groove, and the filter structure and the external connection structure are electrically connected through the connecting line. The size of the groove can be adjusted according to the size of the filter structure, so that the size of the surface acoustic wave filter packaging structure can be adjusted according to the size of the filter structure, the size of the surface acoustic wave filter packaging structure is close to the size of the filter structure, thereby being beneficial to reducing the size of the surface acoustic wave filter packaging structure and being beneficial to the miniaturization and integration of the surface acoustic wave filter. In addition, the filter structure on the wafer can be packaged in batches in the packaging process, and the packaging efficiency is improved.
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Claims

1. A surface acoustic wave filter packaging structure, characterized in that, Includes substrate, filter structure, connecting lines, external structure and cover plate; The substrate is a wafer, and a groove is provided on the substrate. The filter structure is disposed in the groove, and the cover plate covers the groove. The external structure is disposed outside the groove, and the filter structure and the external structure are electrically connected through the connecting line. The connecting line is at least partially disposed at the junction between the cover plate and the substrate to achieve electrical connection between the filter structure and the external structure; It also includes a matching adjustment structure; the connecting line is at least partially disposed at the junction between the cover plate and the substrate to achieve electrical connection between the filter structure and the matching adjustment structure; The cover plate includes a first surface opposite to the groove and a second surface opposite to the first surface, and the matching adjustment structure is disposed on the first surface and / or the second surface.

2. The surface acoustic wave filter packaging structure according to claim 1, characterized in that, The connecting line includes at least one.

3. The surface acoustic wave filter packaging structure according to claim 1, characterized in that, The matching adjustment structure includes inductive elements and / or capacitive elements.

4. The surface acoustic wave filter packaging structure according to any one of claims 1-3, characterized in that, The substrate includes a third surface and a fourth surface disposed opposite to each other. The third surface is disposed opposite to the cover plate. The groove and a portion of the connecting lines are disposed on the third surface. The external structure is disposed on the side of the connecting lines away from the third surface, and the external structure is in contact with a portion of the connecting lines.

5. The surface acoustic wave filter packaging structure according to claim 4, characterized in that, The height of the external structure is greater than the thickness of the cover plate.

6. The surface acoustic wave filter packaging structure according to any one of claims 1-3, characterized in that, The substrate includes a third surface and a fourth surface disposed opposite to each other, the groove is disposed on the third surface, and the external structure is disposed on the fourth surface.

7. The surface acoustic wave filter packaging structure according to claim 6, characterized in that, When the surface acoustic wave filter packaging structure includes a matching adjustment structure, the connecting line extends through the sidewall of the groove to the cover plate and connects with the matching adjustment structure.

8. The surface acoustic wave filter packaging structure according to claim 1, characterized in that, The filtering structure includes an interdigital transducer and a reflective grating; The reflective grating is disposed on at least one side of the interdigital transducer, and the pads of the interdigital transducer are electrically connected to the external structure through the connecting line.

9. The surface acoustic wave filter packaging structure according to claim 1, characterized in that, The depth of the groove is greater than the height of the filter structure.

Citation Information

Patent Citations

  • Filter device

    CN222089540U

  • Packaged electronic element and method of producing electronic element package

    US20070108634A1