Sensing device

Abstract

A sensing device includes a plurality of sensing pixels arranged in Y rows and M columns, a plurality of readout lines coupled to the sensing pixels, and a plurality of control lines, each of which is coupled to a subset of sensing pixels. Y*N sensing pixels in the subset of sensing pixels are arranged in N adjacent columns, where Y, M and N are positive integers, and N is less than M. Each control line is configured to control a row of sensing pixels in the subset of sensing pixels to output a signal via a corresponding readout line.

Description

Technical Field

[0001] The present disclosure relates to a sensing device, and more particularly to an image sensor. Background Art

[0002] Conventional image sensors transmit data to the backend system for processing in a sequential manner, and read out the data of the entire screen by means of a multiplexer, for example, writing the data of the three colors of red (R), green (G), and blue (B) into the pixel in the order of R→G→B. Therefore, if a large-area image sensor is to read out the data completely, but a multiplexer circuit is not designed, the backend system must use multiple integrated circuits (ICs), which has no cost advantage. However, according to the conventional multiplexer circuit design method, it takes a considerable amount of time to complete the data processing, which is very detrimental to the user experience.

[0003] The known multiplexer circuit design will directly affect the length of the bottom border of the image sensor. If the resolution of the image sensor is higher, the multiplexer wiring will be more, resulting in a relatively longer bottom border. If the image sensor is to be integrated into a mobile phone or other product, the border design is extremely important. If the bottom border length can be shortened, it will be conducive to diversified product design. Summary of the invention

[0004] One embodiment of the present disclosure is a sensing device, comprising a plurality of sensing pixels arranged in Y columns and M rows, a plurality of readout lines coupled to the sensing pixels, and a plurality of control lines, each of which is coupled to a subset of sensing pixels. Y*N sensing pixels in the subset of sensing pixels are arranged in N adjacent columns, where Y, M and N are positive integers, and N is less than M. Each control line is configured to control a row of sensing pixels in the subset of sensing pixels to output a signal via a corresponding readout line. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] In order to make the above-mentioned objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, wherein:

[0006] Figure 1 is a schematic diagram showing an exemplary sensing device.

[0007] Figure 2 A timing diagram showing Figure 1 The signal output of the sensing device when different control lines are enabled.

[0008] Figure 3FIG. 4 is a schematic diagram showing another exemplary sensing device.

[0009] Figure 4A FIG. 4 is a schematic diagram showing another exemplary sensing device.

[0010] Figure 4B is a schematic diagram showing an exemplary sensing pixel.

[0011] Figure 5 FIG. 4 is a schematic diagram showing another exemplary sensing device.

[0012] Figure 6 FIG. 4 is a schematic diagram showing another exemplary sensing device.

[0013] Figure 7 FIG. 4 is a schematic diagram showing another exemplary sensing device.

[0014] Figure 8 FIG. 4 is a schematic diagram showing another exemplary sensing device.

[0015] The same numbers in different drawings represent the same or similar components.

[0016] Data[1]-Data[9],Data[N]-Data[4N]: readout line

[0017] MUX[1]-MUX[X]: control line

[0018] SOUT[1]-SOUT[2N]: output line

[0019] Bank1-Bank(X): Block

[0020] BF1-BF9: Buffer circuit

[0021] SW11-SW33: Switch

[0022] PX: Sensing Pixel

[0023] FD:Node

[0024] RST[1],SW[1]: control signal

[0025] VDD[1], VDD[2], VDD[3]: control signals

[0026] 100:Sensing device

[0027] 102: Sensing area

[0028] 300,400:Sensing device

[0029] 402: Sensing area

[0030] 452: Photosensitive element

[0031] 454: first transistor

[0032] 456: Second transistor

[0033] 458:Switching transistor

[0034] 500,600,700,800:Sensing device

[0035] 810,820: Output line set DETAILED DESCRIPTION

[0036] Figure 1 An exemplary embodiment of a sensing device 100 according to the present disclosure is shown. In the exemplary embodiment of the present disclosure, the sensing device 100 is a fingerprint sensing device, but is not limited thereto. In other embodiments, the sensing device 100 includes a face sensing device, a palm print sensing device, an iris sensing device, a retina sensing device, or other suitable biometric sensing devices. In this embodiment, the sensing device 100 has a sensing area 102, including a plurality of sensing pixels (sensing pixels) (not shown), arranged in Y rows and M columns, where Y and M are positive integers. Each column of sensing pixels is controlled by an enable signal (not shown). The sensing area 102 can be divided into X banks Bank1 to Bank(X), each of which is a subset of sensing pixels among these sensing pixels, where X is a positive integer. Each block includes sensing pixels in adjacent N columns, where N is a positive integer and N is less than M. Therefore, the total number of columns M of sensing pixels in the sensing area 102 is the product of the number of columns in each block and the number of blocks:

[0037] M=X*N

[0038] The total number of sensing pixels Z is the product of the number of columns and the total number of columns:

[0039] Z=Y*M=Y*X*N

[0040] Each of the blocks Bank1 -Bank(X) includes a subset of the sensing pixels, where the subset of sensing pixels has Y*N sensing pixels arranged in the adjacent N columns.

[0041] In any of the blocks Bank1 to Bank(X), there is a readout line, and each sensing pixel in the same column is coupled to the readout line corresponding to the column. In this example (taking N equal to 3), block Bank1 has three adjacent readout lines, Data[1], Data[2], and Data[3], block Bank2 has three adjacent readout lines, Data[4], Data[5], and Data[6], block Bank3 has three adjacent readout lines, Data[7], Data[8], and Data[9], and so on. In addition, the sensing device 100 also includes a plurality of buffer circuits BF1 to BF9, etc., and each readout line is respectively coupled to a corresponding buffer circuit, such as a buffer amplifier. The power supply terminal of each of these buffer circuits (BF1 to BF9, etc.) is coupled to a power supply V DD The buffer circuits coupled to each readout line in the same block are also adjacent to each other, and these buffer circuits are a subset of buffer circuits. For example, the buffer circuits BF1, BF2, and BF3 coupled to the readout lines Data[1], Data[2], and Data[3] of block Bank1 are adjacent to each other and are a subset of buffer circuits. Each readout line includes a front section coupled to the input end of the buffer circuit and a rear section coupled to the output end of the buffer circuit.

[0042] The sensing device 100 further includes control lines MUX[1] to MUX[4] ... MUX[X-1], MUX[X]. Each of these control lines MUX[1] to MUX[X] is respectively coupled to a block of these sensing pixels. The rear end of the readout line is coupled to the control lines via switches. In other words, the switches are coupled between each of these control lines MUX[1] to MUX[X] and each buffer circuit in the subset of buffer circuits corresponding to the control line. In this example, these switches may be, for example, metal oxide semiconductor field effect transistors (MOSFETs), bipolar junction transistors (BJTs), etc. Among them, the three read lines (Data[1], Data[2] and Data[3]) of block Bank1 are coupled to the first control line MUX[1] through switches SW11~SW13 respectively, the three read lines (Data[4], Data[5] and Data[6]) of block Bank2 are coupled to the second control line MUX[2] through switches SW21~SW23 respectively, the three read lines (Data[7], Data[8] and Data[9]) of block Bank3 are coupled to the third control line MUX[3] through switches SW31~SW33 respectively, and so on. Each of these control lines MUX[1]-MUX[X] is configured to control a column of sensing pixels enabled in each corresponding block in the sensing region 102 to output signals via a corresponding readout line. For example, MUX[1] controls a column of sensing pixels enabled in block Bank1 to output signals via three readout lines (Data[1], Data[2], and Data[3]), MUX[2] controls a column of sensing pixels enabled in block Bank2 to output signals via three readout lines (Data[4], Data[5], and Data[6]), and so on. When data of a column in a block (e.g., block Bank1) is to be read, the control line (MUX[1]) corresponding to the block turns on the switches (SW11-SW13) after the column is enabled, so that the data of the column is outputted via the corresponding readout line.

[0043] The sensing device 100 further includes a plurality of output lines, for example, output lines SOUT[1] to SOUT[3]. In this embodiment, the number of output lines is equal to the number of columns N of sensing pixels in each block. Each block includes three columns of sensing pixels, so the number of output lines is also three, but in other implementations, the number of output lines may not be equal to the number of columns of sensing pixels in each block. In blocks Bank1 to Bank(X), the readout lines of each block further output sensing signals to these output lines through their corresponding switches. For example, the readout lines Data[1] to Data[3] of block Bank1 output sensing signals to output lines SOUT[1] to SOUT[3] through switches SW11 to SW13 controlled by control line MUX[1]; the readout lines Data[4] to Data[6] of block Bank2 output sensing signals to output lines SOUT[1] to SOUT[3] through switches SW21 to SW23 controlled by control line MUX[2], and so on. The sensing device 100 further includes a processor (not shown) configured to receive signals from the output lines SOUT[1]-SOUT[3]. The processor may be an integrated circuit for analyzing the signals and identifying the fingerprint.

[0044] Figure 2 A timing diagram showing Figure 1 The signal output of the sensing device 100 when different control lines are powered on. Figure 1 , in a certain period of time, when the control signal is applied to MUX[1] and other control lines are not applied, switches SW11-SW13 are turned on, and the sensing signals or data of a column of sensing pixels enabled in block 1 (i.e., the data of Data[1], Data[2], and Data[3]) can be output to output lines SOUT[1], SOUT[2], and SOUT[3], respectively. In another period of time, when the control signal is applied to MUX[2] and other control lines are not applied, switches SW21-SW23 are turned on, and the sensing signals or data of a column of sensing pixels enabled in block 2 (i.e., the data of Data[4], Data[5], and Data[6]) can be output to output lines SOUT[1], SOUT[2], and SOUT[3], respectively. In another period, when the control signal is applied to MUX[3] and other control lines are not applied, switches SW31-SW33 are turned on, and the sensing signal or data in block 3 (i.e., the data of Data[7], Data[8], and Data[9]) can be output to output lines SOUT[1], SOUT[2], and SOUT[3], respectively. Figure 2 It is known that the use Figure 1The configuration in can read the signal in one block at a time without reading the signals of all the blocks Bank1 to Bank(X) in the entire sensing area 102, and the signals in any of these blocks can be read at the same time without having to read them one by one in sequence. This feature can greatly reduce the readout time of the sensing device and can effectively improve the user experience.

[0045] Figure 3 An exemplary diagram of a sensing device 300 according to another embodiment of the present disclosure is shown below. Figure 3 The blocks of the sensing device 300 and their corresponding circuit structures are described below. Figure 1 The difference of the sensing device 100. Figure 3 , the readout lines Data[1], Data[2] and Data[3] of the block Bank1 of the sensing device 300 are respectively coupled to the output lines SOUT[1], SOUT[2] and SOUT[3] through the buffer circuits BF1 to BF3; each switch (SW11, SW12, SW13) controlled by the control line MUX[1] is respectively coupled to the power input terminals T1, T2, T3 of the corresponding buffer circuits (BF1, BF2, BF3) and a voltage source V DD Similarly, the readout lines Data[4], Data[5], and Data[6] of the block Bank2 of the sensing device 300 are coupled to the output lines SOUT[1], SOUT[2], and SOUT[3] respectively through the buffer circuits BF4-BF6; each switch (SW21, SW22, SW23) controlled by the control line MUX[2] is coupled to the power input terminals T4, T5, T6 of the buffer circuits (BF4, BF5, BF6) and the voltage source V DD between. Figure 3 In this example, the corresponding circuits of other blocks can be derived by analogy. In this example, rather than directly setting these switches at the output terminals of these buffer amplifiers to control whether the signal can be output, these switches are set at the power supply terminals of these buffer amplifiers to control the power supply of these buffer amplifiers to determine whether the signal can pass through the buffer amplifiers smoothly to the output line. This example configuration can achieve the same Figure 1 The configuration shown in Figure 1 has a similar effect.

[0046] Figure 4AAnother exemplary embodiment of a sensing device 400 according to the present disclosure is shown. The sensing device 400 includes a plurality of control lines MUX[1] to MUX[X], a plurality of buffer circuits (BF1 to BF9, etc.), output lines SOUT[1] to SOUT[3], and a sensing area 402; wherein the sensing area 402 is disposed between these plurality of control lines (MUX[1] to MUX[X]) and these buffer circuits (BF1 to BF9, etc.). The sensing area 402 is also divided into X blocks Bank1 to Bank(X). wherein each column in the same block is coupled to the same control line via its respective switch. For example (taking N as 3), the columns where Data[1], Data[2], and Data[3] are located in block Bank1 each correspond to a switch, and the three switches (SW11 to SW13) are coupled to the same control signal MUX[1].

[0047] The sensing area 402 is composed of a plurality of sensing pixels arranged in an array. Figure 4B 1 is a circuit diagram of an exemplary sensing pixel PX, but is not limited thereto. Taking a sensing pixel PX on Data[1] as an example, it includes a first transistor (e.g., a MOS transistor) 454, a photosensitive element (e.g., a photodiode) 452, a second transistor (e.g., a MOS transistor) 456, and a switch transistor (e.g., a MOS transistor) 458. The first transistor 454 and the photosensitive element 452 are set at a first potential V CC1 and the second potential V EE During the reset period, the first potential V CC1 The write photosensitive element 452 is coupled to the node FD of the second transistor 456. During the sensing period, in conjunction with the non-conducting operation of the first transistor 454, the photosensitive element 452 generates a photocurrent after being illuminated, changing the potential of the node FD. The second transistor 456 acts as a source follower and is coupled to the power input terminal T1. During the readout period, in conjunction with the conduction operation of the switch transistor 458 (when the control signal SW[1] is enabled), the sensing signal (data) related to the potential of the node FD is output to the readout line (e.g., Data[1]). Here, the sensing pixels in the same column are enabled to output the sensing signal. In addition, the readout lines of each block, such as the readout lines Data[1] to Data[9] of blocks Bank1 to Bank3, are respectively coupled to the output lines SOUT[1] to SOUT[3] through the buffer circuit. The power input terminal T1 of the sensing pixel PX in each column of each block is respectively coupled to the power supply V through the switch controlled by the control lines MUX[1] to MUX[X]. CC0Thus, (taking block Bank1 as an example, the rest can be deduced by analogy) when the control line MUX[1] is enabled and the corresponding switches SW11-SW13 are turned on, the sensing pixels PX in the sensing area 402 correspondingly coupled to the switches SW11-SW13 are supplied with power V CC0 , so that data reading can be performed.

[0048] Figure 4A and Figure 4B The example configuration shown in Figure 1 In addition, since the control circuit (including control lines MUX[1]~MUX[X] and switches SW11~SW13, SW21~SW23, etc., a total of X control lines and M switches) is located above these sensing pixels, it is possible to Figure 1 and Figure 3 The circuit layout that was once concentrated on the lower frame is changed to be dispersed between the upper frame and the lower frame, which can shorten the length of the lower frame and facilitate diversified product design.

[0049] Figure 5 Another exemplary embodiment of a sensing device 500 according to the present disclosure is shown. Figure 5 The blocks of the sensing device 500 and their corresponding circuit structures are described below. Figure 3 The difference of the sensing device 300. Figure 5 , the readout lines Data[1], Data[2] and Data[3] of the block Bank1 of the sensing device 500 are respectively coupled to the output lines SOUT[1], SOUT[2] and SOUT[3] through the buffer circuits BF1-BF3; each switch (SW11, SW12, SW13) controlled by the control line MUX[1] is respectively coupled to the power input terminals T1, T2, T3 of the corresponding buffer circuits (BF1, BF2, BF3) and a voltage source V DD Similarly, the readout lines Data[4], Data[5], and Data[6] of the block Bank2 of the sensing device 500 are coupled to the output lines SOUT[1], SOUT[2], and SOUT[3] respectively through the buffer circuits BF4-BF6; each switch (SW21, SW22, SW23) controlled by the control line MUX[2] is coupled to the power input terminals T4, T5, T6 of the buffer circuits (BF4, BF5, BF6) and the voltage source V DD between. Figure 5 In this example, since the control circuit (including control lines MUX[1]~MUX[X] and switches SW11~SW13, SW21~SW23, etc., a total of X control lines and M switches) and the buffer circuit are located above these sensing pixels, the corresponding circuits of other blocks can be obtained by analogy. Figure 3 The circuit layout that was concentrated in the lower frame is now distributed between the upper frame and the lower frame. In addition, the coupling points of the readout lines Data[1] to Data[9] and the output lines SOUT[1] to SOUT[3] are set in the component area that forms these sensing pixels. This configuration can shorten the length of the lower frame and facilitate diversified product design.

[0050] Figure 6 Another exemplary embodiment of a sensing device 600 according to the present disclosure is shown. Figure 6 The blocks of the sensing device 600 and their corresponding circuit structures are described below. Figure 3 The difference of the sensing device 300. Figure 6 , the readout lines Data[1], Data[2], and Data[3] of the block Bank1 of the sensing device 600 are coupled to the output lines SOUT[1], SOUT[2], and SOUT[3] respectively through the buffer circuits BF1-BF3; the power input terminals of the buffer circuits BF1-BF3 are coupled to a control signal VDD[1] to control the power supply of BF1-BF3. Similarly, the readout lines Data[4], Data[5], and Data[6] of the block Bank2 of the sensing device 600 are coupled to the output lines SOUT[1], SOUT[2], and SOUT[3] respectively through the buffer circuits BF4-BF6; the power input terminals of the buffer circuits BF4-BF6 are coupled to a control signal VDD[2] to control the power supply of BF4-BF6. Figure 6 In this embodiment, the sensing device 600 can selectively output the signals or data in the blocks Bank1 to Bank(X) through the output lines SOUT[1] to SOUT[3] by controlling the control signals VDD[1] to VDD[3], etc.

[0051] Figure 7 Another exemplary embodiment of a sensing device 700 according to the present disclosure is shown. Figure 7 The blocks of the sensing device 700 and their corresponding circuit structures are described below. Figure 6 The difference of the sensing device 600. Figure 7, the readout lines Data[1], Data[2], and Data[3] of the block Bank1 of the sensing device 700 are coupled to the output lines SOUT[1], SOUT[2], and SOUT[3] respectively through the buffer circuits BF1-BF3; the power input terminals of the buffer circuits BF1-BF3 are coupled to a control signal VDD[1] to control the power supply of BF1-BF3. Similarly, the readout lines Data[4], Data[5], and Data[6] of the block Bank2 of the sensing device 700 are coupled to the output lines SOUT[1], SOUT[2], and SOUT[3] respectively through the buffer circuits BF4-BF6; the power input terminals of the buffer circuits BF4-BF6 are coupled to a control signal VDD[2] to control the power supply of BF4-BF6. Figure 7 In this example, since the buffer circuit is located above these sensing pixels, the corresponding circuits of other blocks can be obtained by analogy. Figure 6 The circuit layout that was concentrated in the lower frame is now distributed between the upper frame and the lower frame. In addition, the coupling points of the readout lines Data[1] to Data[9] and the output lines SOUT[1] to SOUT[3] are set in the component area that forms these sensing pixels. This configuration can shorten the length of the lower frame and facilitate diversified product design.

[0052] Figure 8 Another exemplary embodiment of a sensing device 800 according to the present disclosure is shown. In this embodiment, for simplicity, the sensing area of ​​the sensing device 800 is described as having 4 blocks (Bank1-Bank4) and each block having a plurality of sensing pixels arranged in N columns. Figure 8, the control line MUX[1] of the sensing device 800 is coupled to the readout lines Data[1] to Data[N] of the block Bank1. The readout lines Data[1] to Data[N] of the block Bank1 are respectively coupled to the output lines SOUT[1] to SOUT[N]. The control line MUX[2] of the sensing device 800 is coupled to the readout lines Data[N+1] to Data[2N] of the block Bank2. The readout lines Data[N+1] to Data[2N] of the block Bank2 are respectively coupled to the output lines SOUT[N+1] to SOUT[2N]. The control line MUX[3] of the sensing device 800 is coupled to the readout lines Data[2N+1] to Data[3N] of the block Bank3. The readout lines Data[2N+1] to Data[3N] of the block Bank3 are respectively coupled to the output lines SOUT[1] to SOUT[N]. The control line MUX[4] of the sensing device 800 is coupled to the readout lines Data[3N+1] to Data[4N] of the block Bank4. The readout lines Data[3N+1] to Data[4N] of the block Bank4 are respectively coupled to the output lines SOUT[N+1] to SOUT[2N], and so on. Figure 8 In the circuit shown, the buffer circuit corresponding to each readout line is omitted. The output lines SOUT[1]-SOUT[N] are collectively referred to as an output line set 810, and are coupled to control lines MUX[1] and MUX[3], while the output lines SOUT[N+1]-SOUT[2N] are collectively referred to as an output line set 820, and are coupled to control lines MUX[2] and MUX[4].

[0053] For example, if it is desired to read the blocks Bank1 and Bank2, the corresponding control signals MUX[1] and MUX[2] of the two blocks are turned on. At this time, the signals of the read lines Data[1] to Data[N] of Bank1 are output from SOUT[1] to SOUT[N], and the signals of the read lines Data[N+1] to Data[2N] of Bank2 are output from SOUT[N+1] to SOUT[2N]. If it is desired to read Bank2 and Bank3, the corresponding control signals MUX[2] and MUX[3] of the two blocks are turned on. At this time, the signals of the read lines Data[N+1] to Data[2N] of Bank2 are output from SOUT[N+1] to SOUT[2N], and the signals of the read lines Data[2N+1] to Data[3N] of Bank3 are output from SOUT[1] to SOUT[N]. The same applies to the rest.

[0054] The sensing device 800 uses an output line set 810 and an output line set 820, and couples Bank1, Bank3, ... to the output line set 810, and Bank2, Bank4, ... to the output line set 820. This configuration allows any two adjacent blocks to use different output line sets to output signals of the two adjacent blocks simultaneously.

[0055] Coupling can be direct or indirect. Two components can be coupled by direct contact to transmit electrical signals without any other components between them. Alternatively, two components can be coupled by bridging the connection between them to transmit electrical signals.

[0056] Although the terms first, second, third, etc. can be used to describe a variety of components, the components are not limited to these terms. These terms are only used to distinguish a single component from other components in the specification. The same terms may not be used in the claims, but may be replaced by first, second, third, etc. according to the order in which the components are declared in the claims. Therefore, in the following description, the first component may be the second component in the claims.

[0057] It should be noted that the above embodiments may replace, reorganize, or mix the technical features in several different embodiments to complete other embodiments without departing from the spirit of the present disclosure.

[0058] The embodiments described or illustrated in this specification are used as examples and are not intended to limit the scope of the present disclosure. Unless otherwise stated, singular words such as "one", "an", "the" are intended to include plural words such as "multiple", "multiple", "these", and vice versa. The words "including", "comprising", "having", "having" and the like used in the "implementation method" and / or the claims are intended to refer to open-ended (inclusive) connotations, similar to the word "comprising". Those skilled in the art can think of related equivalent or improved structures after reading this specification and the accompanying drawings without departing from the spirit and scope of the present disclosure. The features disclosed in each embodiment can be used in combination in any combination without departing from the spirit and scope of the present disclosure.

Claims

1. A sensing device, comprising: A plurality of sensing pixels are arranged in Y rows and M columns; A plurality of readout lines (readoutlines) coupled to the plurality of sensing pixels; as well as a plurality of control lines, wherein each of the plurality of control lines is respectively coupled to a subset of the plurality of sensing pixels, the subset of sensing pixels having Y*N sensing pixels arranged in N adjacent columns, wherein Y, M and N are positive integers, and N is less than M; as well as a first set of output lines and a second set of output lines; Each of the plurality of control lines is configured to control a column of sensing pixels in the sensing pixel subset to output a signal via a corresponding readout line; and The plurality of control lines include a first control line and a second control line, which are respectively coupled to the first output line set and the second output line set.

2. The sensing device according to claim 1, characterized in that The first control line and the second control line are configured to control a column of sensing pixels in different sensing pixel subsets to output signals via corresponding readout lines at different time periods.

3. The sensing device according to claim 1, characterized in that A plurality of output lines is also included, coupled to the plurality of readout lines, and the number of the plurality of output lines is N.

4. The sensing device according to claim 3, characterized in that Also included is a processor configured to receive signals from the plurality of output lines.

5. The sensing device according to claim 1, wherein: Also included are a plurality of buffer circuits respectively coupled to the plurality of readout lines, wherein each of the plurality of control lines is respectively coupled to a different subset of buffer circuits in the plurality of buffer circuits, and the buffer circuits in each of the plurality of buffer circuit subsets are adjacent to each other.

6. The sensing device according to claim 5, characterized in that The plurality of sensing pixels are disposed between the plurality of control lines and the plurality of buffer circuits.

7. The sensing device according to claim 5, characterized in that: Also included are a plurality of switches coupled between each control line of the plurality of control lines and each buffer circuit of the subset of buffer circuits corresponding to the control line.

8. The sensing device according to claim 1, wherein: Each of the plurality of sensing pixels includes a source follower, and each of the plurality of control lines is respectively coupled to the source followers of the plurality of sensing pixels arranged in adjacent N columns.

9. The sensing device according to claim 1, wherein: Also included are a plurality of output lines coupled to the plurality of readout lines; The coupling points of the plurality of output lines and the plurality of readout lines are arranged in a device region where the plurality of sensing pixels are formed.

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