Laminated coil component

Abstract

A laminated coil component (1) includes: a body (2), a coil (5), first and second terminal electrodes (3, 4), first and second connecting conductors (6, 7). The coil (5) includes: a first coil portion (8) having one end of the coil (5) and disposed on the main surface (2c) side; and a second coil portion (9) having the other end of the coil (5) and disposed on the main surface (2d) side. A distance (L2) between the first connecting conductor (6) and the second coil portion (9) is greater than a distance (L1) between the first connecting conductor (6) and the first coil portion (8).

Description

Technical Field

[0001] This invention relates to laminated coil components. Background Technology

[0002] As existing laminated coil components, components such as those described in Patent Document 1 (Japanese Patent Application Publication No. 2019-16642) are known. The laminated coil component described in Patent Document 1 comprises a laminated body having multiple units stacked on top of each other. Each unit has multiple substrate layers stacked on top of each other and has a first main surface and a second main surface. Each unit forms a groove on the first main surface with a depth of at least one substrate layer. At least one unit forms a hole at the bottom of the groove that reaches the second main surface. Conductors are filled into the groove and the hole, respectively. Through the stacking of multiple units, the conductors filling the hole of an adjacent unit and the conductors filling the groove of an adjacent unit are connected. Furthermore, the conductors inside the laminated body are connected in a spiral shape about the stacking direction of the units. Summary of the Invention

[0003] In multilayer coil components, increasing the coil diameter is desirable to improve performance. However, in structures where connecting conductors are housed within the coil body, increasing the coil diameter shortens the distance between the connecting conductors and the coil. Consequently, the stray capacitance (parasitic capacitance) formed by the coil and connecting conductors increases. When the stray capacitance between the coil and connecting conductors increases, the self-resonant frequency (SRF) and the Q (quality factor) value of the coil also decrease.

[0004] One objective of this invention is to provide a stacked coil component that suppresses the generation of stray capacitance and improves its characteristics.

[0005] One aspect of the present invention provides a stacked coil component comprising: a body formed by stacking multiple insulating layers, having: a pair of opposing end faces, a pair of opposing main faces, and a pair of opposing side faces, one main face being a mounting surface; a coil disposed within the body, the coil axis extending along opposing directions of the pair of main faces; a first terminal electrode and a second terminal electrode connected to the coil and disposed on the mounting surface; a first connecting conductor disposed outside the coil when viewed from opposing directions within the body, extending along opposing directions, and connecting one end of the coil located on the other main face side to the first terminal electrode; and a second connecting conductor connecting the other end of the coil located on one main face side to the second terminal electrode, the coil comprising: a first coil portion having one end of the coil and disposed on the other main face side, and a second coil portion having the other end of the coil and disposed on one main face side, the shortest distance between the first connecting conductor and the second coil portion being greater than the shortest distance between the first connecting conductor and the first coil portion.

[0006] In a multilayer coil assembly, the potential difference between the first terminal electrode and the second terminal electrode is the largest. When conductors with a large potential difference are facing each other, stray capacitance can be formed. In the multilayer coil assembly, the first connecting conductor connected to the first terminal electrode extends along the aforementioned opposing direction. In this structure, stray capacitance is formed between the first connecting conductor and the coil due to the potential difference between them. In particular, stray capacitance is easily formed between the coil connected to the second terminal electrode side and the first connecting conductor. Therefore, in the multilayer coil assembly, the shortest distance between the first connecting conductor and the second coil portion is made greater than the shortest distance between the first connecting conductor and the first coil portion. As a result, in the multilayer coil assembly, the second coil portion, which has a large potential difference with the first connecting conductor, is positioned further away from the first connecting conductor than the first coil portion. Therefore, in the multilayer coil assembly, the stray capacitance formed between the first connecting conductor and the second coil portion can be reduced. In addition, in the multilayer coil assembly, the diameter of the first coil portion can be increased. Therefore, the inductance of the coil can be increased. As described above, in the multilayer coil assembly, the generation of stray capacitance can be suppressed, and the performance can be improved.

[0007] In one embodiment, the first coil portion and the second coil portion may have different diameters, and when viewed from opposite directions, a portion of the outer edges of the first coil portion and the second coil portion may overlap. In this structure, by overlapping a portion of the outer edges of the first coil portion and the second coil portion, the distance between the first connecting conductor and the second coil can be ensured, and the diameter of the second coil portion can be increased.

[0008] In one embodiment, the first terminal electrode does not overlap with the second coil portion when viewed from opposite directions. This structure can suppress the formation of stray capacitance between the first terminal electrode and the second coil portion.

[0009] In one embodiment, the distance between the first connecting conductor and the coil can be set based on the potential difference between the first connecting conductor and the coil during use; the distance is longer where the potential difference is large than where the potential difference is small. In this structure, by setting the distance according to the potential difference, stray capacitance can be reduced.

[0010] According to one aspect of the present invention, the generation of stray capacitance can be suppressed, thereby improving performance. Attached Figure Description

[0011] Figure 1 This is a perspective view of the stacked coil component according to the first embodiment.

[0012] Figure 2 yes Figure 1 The side view of the stacked coil component shown.

[0013] Figure 3 yes Figure 1 An exploded perspective view of the stacked coil component shown.

[0014] Figure 4 This is a perspective view of the stacked coil component according to the second embodiment.

[0015] Figure 5 yes Figure 4 The side view of the stacked coil component shown.

[0016] Figure 6 yes Figure 4 An exploded perspective view of the stacked coil component shown.

[0017] Figure 7 This is a perspective view of the stacked coil component according to the third embodiment.

[0018] Figure 8 yes Figure 7 The side view of the stacked coil component shown.

[0019] Figure 9 yes Figure 7 An exploded perspective view of the stacked coil component shown.

[0020] Figure 10 yes Figure 7 A top view of the stacked coil component shown.

[0021] Figure 11 This is a perspective view of the stacked coil component according to the fourth embodiment.

[0022] Figure 12 yes Figure 11 The side view of the stacked coil component shown.

[0023] Figure 13 yes Figure 11 An exploded perspective view of the stacked coil component shown.

[0024] Figure 14 This is a perspective view of the stacked coil component according to the fifth embodiment.

[0025] Figure 15 yes Figure 14 The side view of the stacked coil component shown.

[0026] Figure 16 yes Figure 14 An exploded perspective view of the stacked coil component shown. Detailed Implementation

[0027] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, in the description of the drawings, the same or equivalent elements are labeled with the same symbols, and repeated descriptions are omitted.

[0028] [First Implementation Method] Refer to Figure 1 and Figure 2 The stacked coil component of the first embodiment is described. Figure 1 This is a perspective view of the stacked coil component according to the first embodiment. Figure 2 yes Figure 1 A side view of the stacked coil component shown. Figure 1 and Figure 2 As shown, the stacked coil component 1 of the first embodiment includes a body 2, a first terminal electrode 3 and a second terminal electrode 4, a coil 5, a first connecting conductor 6 and a second connecting conductor 7. Figure 1 and Figure 2 In the middle, for ease of explanation, the base body 2 is represented by a dashed line.

[0029] Substance 2 is rectangular in shape. The rectangular shape includes both cuboids with chamfered corners and edges, and cuboids with rounded corners and edges. Substance 2 has a pair of end faces 2a and 2b, a pair of main faces 2c and 2d, and a pair of side faces 2e and 2f as its outer surfaces. End faces 2a and 2b are opposite each other. Main faces 2c and 2d are opposite each other. Side faces 2e and 2f are opposite each other. Hereinafter, the relative direction of main faces 2c and 2d is designated as the first direction D1, the relative direction of end faces 2a and 2b as the second direction D2, and the relative direction of side faces 2e and 2f as the third direction D3. The first direction D1, the second direction D2, and the third direction D3 are approximately orthogonal to each other.

[0030] End faces 2a and 2b extend along a first direction D1, connecting to main faces 2c and 2d. End faces 2a and 2b also extend along a third direction D3, connecting to side faces 2e and 2f. Main faces 2c and 2d extend along a second direction D2, connecting to end faces 2a and 2b. Main faces 2c and 2d also extend along a third direction D3, connecting to side faces 2e and 2f. Side faces 2e and 2f extend along a first direction D1, connecting to main faces 2c and 2d. Side faces 2e and 2f also extend along a second direction D2, connecting to end faces 2a and 2b.

[0031] Main surface 2d (a main surface) is a mounting surface, for example, the surface opposite to other electronic devices (e.g., circuit substrates or stacked electronic components) when the laminated coil component 1 is mounted. End surfaces 2a and 2b are surfaces that are continuous from the mounting surface (i.e., main surface 2d).

[0032] The length of the sub-body 2 in the second direction D2 is longer than the length of the sub-body 2 in the first direction D1 and the length of the sub-body 2 in the third direction D3. The length of the sub-body 2 in the first direction D1 is longer than the length of the sub-body 2 in the third direction D3. That is, in this embodiment, the end faces 2a, 2b, the main faces 2c, 2d, and the side faces 2e, 2f are rectangular. The length of the sub-body 2 in the second direction D2 can be equal to or shorter than the length of the sub-body 2 in the first direction D1 and the length of the sub-body 2 in the third direction D3.

[0033] Furthermore, in this embodiment, "equal" can mean not only the same, but also values ​​that include minor differences or manufacturing errors within a predetermined range. For example, if multiple values ​​are within ±5% of the average of the multiple values, then the multiple values ​​are defined as equal.

[0034] Substrate 2 is constructed by passing multiple substrate layers (insulator layers) 10a to 10k (refer to...) Figure 3 The substrate 2 is formed by stacking layers in the first direction D1. That is, the stacking direction of the substrate 2 is the first direction D1. The specific stacking structure will be described later. In the actual substrate 2, multiple substrate layers 10a to 10k are integrated to the point that the boundaries between the layers are indistinguishable. Substrate layers 10a to 10k are made of, for example, magnetic materials (Ni-Cu-Zn ferrite materials, Ni-Cu-Zn-Mg ferrite materials, or Ni-Cu ferrite materials, etc.). Fe alloys may also be included in the magnetic materials constituting substrate layers 10a to 10k. Substrate layers 10a to 10k may also be made of non-magnetic materials (glass ceramic materials, dielectric materials, etc.).

[0035] The first terminal electrode 3 and the second terminal electrode 4 are each disposed on the body 2. The first terminal electrode 3 consists of a first terminal electrode layer 18k (refer to...). Figure 3 The second terminal electrode 4 is composed of a second terminal electrode layer 19k (refer to...). Figure 3 The substrate 2 is configured such that a first terminal electrode 3 and a second terminal electrode 4 are each disposed on the main surface 2d of the substrate 2. The first terminal electrode 3 and the second terminal electrode 4 are disposed on the substrate 2 away from each other in the second direction D2. Specifically, the first terminal electrode 3 is disposed on the end surface 2a side of the substrate 2. The second terminal electrode 4 is disposed on the end surface 2b side of the substrate 2.

[0036] The first terminal electrode 3 and the second terminal electrode 4 are each rectangular in shape. The first terminal electrode 3 and the second terminal electrode 4 are arranged such that their long sides are along the third direction D3 and their short sides are along the second direction D2. For example... Figure 2 As shown, the first terminal electrode 3 and the second terminal electrode 4 protrude from the main surface 2d. That is, in this embodiment, the surfaces of the first terminal electrode 3 and the second terminal electrode 4 are not flush with the main surface 2d.

[0037] By performing electrolytic plating or non-electrolytic plating on the first terminal electrode 3 and the second terminal electrode 4 respectively, a plating layer (not shown) containing, for example, Ni, Sn, Au, etc. may be formed. The plating layer may also have, for example, a Ni-plated film containing Ni and covering the first terminal electrode 3 and the second terminal electrode 4, and an Au-plated film containing Au and covering the Ni-plated film.

[0038] Coil 5 is disposed within body 2. Coil 5 consists of multiple coil conductor layers 12b to 12h (see reference). Figure 3 The coil 5 is constructed by interconnecting multiple coil conductor layers 12b to 12h within the body 2. The coil axis of the coil 5 is arranged along a first direction D1. The coil conductor layers 12b to 12h are configured such that at least a portion overlaps when viewed from the first direction D1. The multiple coil conductor layers 12b to 12h are made of a conductive material (e.g., Ag or Pd). The coil conductor layers 12b to 12h are arranged away from the end faces 2a, 2b, main faces 2c, 2d, and side faces 2e, 2f.

[0039] The coil 5 includes a first coil portion 8 and a second coil portion 9. The first coil portion 8 is composed of multiple coil conductor layers 12b to 12d. The first coil portion 8 is disposed on the main surface 2c side of the body 2. The first coil portion 8 has one end of the coil 5 connected to the first connecting conductor 6. The first coil portion 8 is connected to the first connecting conductor 6. The second coil portion 9 is composed of multiple coil conductor layers 12e to 12h. The second coil portion 9 is disposed on the main surface 2d side of the body 2. The second coil portion 9 has the other end of the coil 5 connected to the second connecting conductor 7. The second coil portion 9 is connected to the second connecting conductor 7.

[0040] A first connecting conductor 6 is disposed within the body 2. The first connecting conductor 6 connects the first terminal electrode 3 and the coil 5. The first connecting conductor 6 is a through-hole conductor. The first connecting conductor 6 extends along a first direction D1 and connects to one end of the first terminal electrode 3 and the coil 5. Specifically, the end of the first connecting conductor 6 on the main surface 2c (another main surface) side in the first direction D1 is connected to one end of the coil 5 located on the main surface 2c side. The first connecting conductor 6 consists of multiple first connecting conductor layers 14c to 14j (refer to...). Figure 3 The first connecting conductor 6 is positioned outside the coil 5 when viewed from the first direction D1. Specifically, when viewed from the first direction D1, the first connecting conductor 6 is positioned at a corner. More specifically, the first connecting conductor 6 is positioned at the corner formed by the end face 2a and the side face 2e. The cross-section of the first connecting conductor 6 orthogonal to the extending direction (first direction D1) (the cross-section along the second direction D2 and the third direction D3) is circular. That is, the first connecting conductor 6 is cylindrical. Circular shapes include, for example, perfect circles and ellipses.

[0041] The second connecting conductor 7 is disposed within the body 2. The second connecting conductor 7 connects the second terminal electrode 4 and the coil 5. The second connecting conductor 7 is a through-hole conductor. The second connecting conductor 7 extends along the first direction D1 and connects to the other end of the second terminal electrode 4 and the coil 5. Specifically, the end of the second connecting conductor 7 on the main surface 2c side of the first direction D1 is connected to the other end of the coil 5 located on the main surface 2d side. The second connecting conductor 7 consists of multiple second connecting conductor layers 16i, 16j (refer to...). Figure 3 The second connecting conductor 7 is positioned at a corner when viewed from the first direction D1. More specifically, the second connecting conductor 7 is positioned at the corner formed by the end face 2b and the side face 2f. That is, the second connecting conductor 7 is positioned diagonally opposite to the first connecting conductor 6. The cross-section of the second connecting conductor 7 orthogonal to the extending direction (first direction D1) (the cross-section along the second direction D2 and the third direction D3) is circular. That is, the second connecting conductor 7 is cylindrical.

[0042] Figure 3 yes Figure 1 An exploded perspective view of the stacked coil component is shown. Figure 3 As shown, the stacked coil component 1 has multiple layers La, Lb, Lc, Ld, Le, Lf, Lg, Lh, Li, Lj, and Lk. The stacked coil component 1 is constructed by, for example, stacking layers La to Lk sequentially from the main surface 2c side.

[0043] Layer La is composed of base layer 10a.

[0044] Layer Lb is formed by combining the base layer 10b and the coil conductor layer 12b. A defect Rb is provided on the base layer 10b, the defect Rb having a shape corresponding to the coil conductor layer 12b, allowing the coil conductor layer 12b to be embedded. The base layer 10b and the coil conductor layer 12b are complementary.

[0045] Layer Lc is constructed by combining the base layer 10c, the coil conductor layer 12c, and the first connecting conductor layer 14c. A defect Rc is provided on the base layer 10c, the defect Rc having a shape corresponding to the coil conductor layer 12c and the first connecting conductor layer 14c, allowing the coil conductor layer 12c and the first connecting conductor layer 14c to be embedded within it. The base layer 10c and the coil conductor layer 12c and the first connecting conductor layer 14c are complementary in overall structure.

[0046] Layer Ld is constructed by combining the base layer 10d, the coil conductor layer 12d, and the first connecting conductor layer 14d. A defect Rd is provided on the base layer 10d, and this defect Rd has a shape corresponding to the coil conductor layer 12d and the first connecting conductor layer 14d, allowing the coil conductor layer 12d and the first connecting conductor layer 14d to be embedded within it. The base layer 10d and the coil conductor layer 12d and the first connecting conductor layer 14d are complementary in overall structure.

[0047] Layer Le is constructed by combining the base layer 10e, the coil conductor layer 12e, and the first connecting conductor layer 14e. A defect Re is provided on the base layer 10e, the defect Re having a shape corresponding to the coil conductor layer 12e and the first connecting conductor layer 14e, allowing the coil conductor layer 12e and the first connecting conductor layer 14e to be embedded within it. The base layer 10e and the coil conductor layer 12e and the first connecting conductor layer 14e are complementary in overall structure.

[0048] Layer Lf is constructed by combining the base layer 10f, the coil conductor layer 12f, and the first connecting conductor layer 14f. A defect Rf is provided on the base layer 10f, the defect Rf having a shape corresponding to the coil conductor layer 12f and the first connecting conductor layer 14f, allowing the coil conductor layer 12f and the first connecting conductor layer 14f to be embedded within it. The base layer 10f and the coil conductor layer 12f and the first connecting conductor layer 14f are complementary in overall structure.

[0049] Layer Lg is constructed by combining the base layer 10g, the coil conductor layer 12g, and the first connecting conductor layer 14g. A defect Rg is provided on the base layer 10g, the defect Rg having a shape corresponding to the coil conductor layer 12g and the first connecting conductor layer 14g, allowing the coil conductor layer 12g and the first connecting conductor layer 14g to be embedded within it. The base layer 10g and the coil conductor layer 12g and the first connecting conductor layer 14g are complementary in overall structure.

[0050] Layer Lh is constructed by combining the base layer 10h, the coil conductor layer 12h, and the first connecting conductor layer 14h. A defect Rh is provided on the base layer 10h, and this defect Rh has a shape corresponding to the coil conductor layer 12h and the first connecting conductor layer 14h, allowing the coil conductor layer 12h and the first connecting conductor layer 14h to be embedded within it. The base layer 10h and the coil conductor layer 12h and the first connecting conductor layer 14h are complementary in overall structure.

[0051] Layer Li is constructed by combining a base layer 10i, a first connecting conductor layer 14i, and a second connecting conductor layer 16i. A defect Ri is provided on the base layer 10i, the defect Ri having a shape corresponding to the first connecting conductor layer 14i and the second connecting conductor layer 16i, allowing the first connecting conductor layer 14i and the second connecting conductor layer 16i to be embedded within it. The base layer 10i and the first connecting conductor layer 14i and the second connecting conductor layer 16i are complementary in overall structure.

[0052] Layer Lj is constructed by combining the base layer 10j, the first connecting conductor layer 14j, and the second connecting conductor layer 16j. A defect Rj is provided on the base layer 10j, and this defect Rj has a shape corresponding to the first connecting conductor layer 14j and the second connecting conductor layer 16j, allowing the first connecting conductor layer 14j and the second connecting conductor layer 16j to be embedded within them. The base layer 10j and the first connecting conductor layer 14j and the second connecting conductor layer 16j are complementary in overall structure.

[0053] Layer Lk is constructed by combining a substrate layer 10k, a first terminal electrode layer 18k, and a second terminal electrode layer 19k. A defect Rk is provided on the substrate layer 10k, and this defect Rk has a shape corresponding to the first terminal electrode layer 18k and the second terminal electrode layer 19k, allowing the first terminal electrode layer 18k and the second terminal electrode layer 19k to be embedded within it. The substrate layer 10k and the first terminal electrode layer 18k and the second terminal electrode layer 19k are complementary in overall structure.

[0054] The width of the defective portions Rb to Rk (hereinafter, the width of the defective portion) is set to be substantially wider than the width of the coil conductor layers 12b to 12h, the first connecting conductor layers 14c to 14j, the second connecting conductor layers 16i and 16j, the first terminal electrode layer 18k, and the second terminal electrode layer 19k (hereinafter, the width of the conductor portion). To improve the adhesion between the base layers 10b to 10k and the coil conductor layers 12b to 12h, the first connecting conductor layers 14c to 14j, the second connecting conductor layers 16i and 16j, the first terminal electrode layer 18k, and the second terminal electrode layer 19k, the width of the defective portion may also be intentionally set to be narrower than the width of the conductor portion. The value of subtracting the width of the conductor portion from the width of the defective portion is preferably, for example, -3 μm or more and 10 μm or less, more preferably 0 μm or more and 10 μm or less.

[0055] like Figure 2As shown, in the stacked coil component 1, the distance L2 between the first connecting conductor 6 and the second coil portion 9 is greater than the distance L1 between the first connecting conductor 6 and the first coil portion 8 (L2 > L1). In other words, the distance L1 between the first connecting conductor 6 and the first coil portion 8 is less than the distance L2 between the first connecting conductor 6 and the second coil portion 9 (L1 < L2). That is, the second coil portion 9 is disposed further away from the first connecting conductor 6 than the first coil portion 8. Distance L1 is the shortest distance between the first connecting conductor 6 and the first coil portion 8 (coil conductor layers 12b to 12d). Distance L2 is the shortest distance between the first connecting conductor 6 and the second coil portion 9 (coil conductor layers 12e to 12h). Furthermore, in Figure 2 For convenience, distances L1 and L2 are shown as examples, which may differ from the actual shortest distance.

[0056] The diameters of the first coil portion 8 and the second coil portion 9 are different. The diameter of the first coil portion 8 is larger than the diameter of the second coil portion 9. In other words, the diameter of the second coil portion 9 is smaller than the diameter of the first coil portion 8. The coil axis of the first coil portion 8 and the coil axis of the second coil portion 9 are not aligned. The coil axis of the second coil portion 9 is located closer to the end face 2b than the coil axis of the first coil portion 8. Regarding the first coil portion 8 and the second coil portion 9, the edges of the body 2 on the end face 2b side are aligned in the first direction D1. Specifically, when viewed from the first direction D1, a portion of the coil conductor layer 12b constituting the first coil portion 8 overlaps with a portion of the coil conductor layers 12e and 12h constituting the second coil portion 9.

[0057] Viewed from the first direction D1, the second coil portion 9 does not overlap with the first terminal electrode 3. That is, the second coil portion 9 is not located above the first terminal electrode 3. Specifically, viewed from the first direction D1, the coil conductor layers 12e to 12h do not overlap with the first terminal electrode 3.

[0058] This describes an example of a method for manufacturing the laminated coil component 1 according to an embodiment.

[0059] First, a substrate paste containing the constituent materials of the substrate layers 10a to 10k and a photosensitive material is applied to a substrate (e.g., a PET film) to form a substrate forming layer. The photosensitive material contained in the substrate paste can be either negative or positive, and a known material can be used. Next, the substrate forming layer is exposed and developed using a photolithography method, for example, using a Cr mask, to form a substrate pattern on the substrate with the shape corresponding to the shape of the conductor forming layer described later removed. The substrate pattern becomes the substrate layers 10a to 10k after heat treatment. That is, a substrate pattern is formed with defect portions Rb to Rk. Furthermore, the "photolithography method" in this embodiment can be used to process the desired pattern by exposing and developing the layer containing the photosensitive material, and the type of mask is not limited.

[0060] On the other hand, a conductor forming layer is formed by coating a conductor paste containing the aforementioned coil conductor layers 12b-12h, first connecting conductor layers 14c-14j, second connecting conductor layers 16i, 16j, first terminal electrode layer 18k, and second terminal electrode layer 19k, and a photosensitive material onto a substrate (e.g., a PET film). The photosensitive material contained in the conductor paste can be either negative or positive, and known materials can be used. Next, the conductor forming layer is exposed and developed using, for example, a photolithography method using a Cr mask, to form a conductor pattern on the substrate. The conductor pattern becomes the coil conductor layers 12b-12h, first connecting conductor layers 14c-14j, second connecting conductor layers 16i, 16j, first terminal electrode layer 18k, and second terminal electrode layer 19k after heat treatment.

[0061] Next, the substrate forming layer is transferred from the substrate to the support. The substrate forming layer is a layer that becomes layer La after heat treatment.

[0062] Next, the conductor pattern and the substrate pattern are repeatedly transferred onto the support, and then laminated on the third-direction D3. Specifically, first, the conductor pattern is transferred from the substrate to the substrate forming layer. Then, the substrate pattern is transferred from the substrate to the substrate forming layer. The conductor pattern is then combined with the missing portions of the substrate pattern, and the substrate pattern and the conductor pattern become a single layer on the substrate forming layer. Furthermore, the transfer process of the conductor pattern and the substrate pattern is repeated, so that the conductor pattern and the substrate pattern are laminated in a combined state. Thus, layers Lb to Lk, which become layers after heat treatment, are laminated.

[0063] Next, the substrate forming layer is transferred from the substrate onto the layers stacked in the transfer process of the conductor pattern and the substrate pattern. The substrate forming layer becomes layer La after heat treatment.

[0064] Through the above process, a laminated body constituting the laminated coil component 1 is formed on the support body after heat treatment. Next, the obtained laminated body is cut to a predetermined size. Then, the cut laminated body undergoes a debonding treatment followed by heat treatment. The heat treatment temperature is, for example, around 850–900°C. If necessary, electrolytic plating or non-electrolytic plating can be performed on the first terminal electrode 3 and the second terminal electrode 4 after heat treatment to form plating layers.

[0065] In the laminated coil component 1, the potential difference between the first terminal electrode 3 and the second terminal electrode 4 is the largest. When conductors with a large potential difference are facing each other, stray capacitance is formed. In the laminated coil component 1, the first connecting conductor 6, which is connected to the first terminal electrode 3, extends along the first direction D1. In this structure, stray capacitance is formed between the first connecting conductor 6 and the coil 5 due to the potential difference between them. In particular, stray capacitance is easily formed between the coil 5 connected to the second terminal electrode 4 side and the first connecting conductor 6. Therefore, in the laminated coil component 1, the distance L2 between the first connecting conductor 6 and the second coil portion 9 is made greater than the distance L1 between the first connecting conductor 6 and the first coil portion 8. As a result, in the laminated coil component 1, the second coil portion 9, which has a large potential difference with the first connecting conductor 6, is positioned further away from the first connecting conductor 6 than the first coil portion 8. Therefore, in the laminated coil component 1, the stray capacitance formed between the first connecting conductor 6 and the second coil portion 9 can be reduced. In addition, in the laminated coil component 1, the diameter of the first coil portion 8 can be increased. Therefore, the inductance of the coil 5 can be increased. As described above, in the stacked coil component 1, the generation of stray capacitance is suppressed, and the characteristics are improved.

[0066] In the stacked coil component 1 of this embodiment, the outer edges of the end face 2b side of the body 2 are aligned in the first direction D1, with respect to the first coil portion 8 and the second coil portion 9. This structure ensures the distance between the first connecting conductor 6 and the second coil portion 9, and increases the diameter of the second coil portion 9.

[0067] In the stacked coil component 1 of this embodiment, when viewed from the first direction D1, the first terminal electrode 3 does not overlap with the second coil portion 9. This structure can suppress the formation of stray capacitance between the first terminal electrode 3 and the second coil portion 9.

[0068] [Second Embodiment] Next, refer to Figure 4 and Figure 5 The stacked coil component of the second embodiment is described. Figure 4 This is a perspective view of the stacked coil component according to the second embodiment. Figure 5 yes Figure 4 A side view of the stacked coil component shown. Figure 4 and Figure 5As shown, the stacked coil component 1A of the second embodiment includes: a body 2, a first terminal electrode 3 and a second terminal electrode 4, a coil 5A, a first connecting conductor 6 and a second connecting conductor 7. Figure 4 and Figure 5 In the middle, for ease of explanation, the base body 2 is represented by a dashed line.

[0069] Base body 2 is constructed by using multiple base body layers 20a to 20k (refer to...) Figure 6 It is stacked on top of the first direction D1.

[0070] Coil 5A is housed within body 2. Coil 5A consists of multiple coil conductor layers 22b to 22h (see reference). Figure 6 The coil 5A is formed by interconnecting multiple coil conductor layers 22b to 22h within the body 2. The coil axis of the coil 5A is arranged along a first direction D1. The coil conductor layers 22b to 22h are configured such that at least a portion overlaps when viewed from the first direction D1. The multiple coil conductor layers 22b to 22h are made of a conductive material (e.g., Ag or Pd). The coil conductor layers 22b to 22h are arranged away from the end faces 2a, 2b, main faces 2c, 2d, and side faces 2e, 2f.

[0071] Coil 5A includes a first coil portion 8A and a second coil portion 9A. The first coil portion 8A is composed of multiple coil conductor layers 22b to 22d. The first coil portion 8A is disposed on the main surface 2c side of the body 2. The first coil portion 8A has one end connected to the first connecting conductor 6. The first coil portion 8A is connected to the first connecting conductor 6. The second coil portion 9A is composed of multiple coil conductor layers 22e to 22h. The second coil portion 9A is disposed on the main surface 2d side of the body 2. The second coil portion 9A has the other end connected to the second connecting conductor 7. The second coil portion 9A is connected to the second connecting conductor 7.

[0072] Figure 6 This is an exploded perspective view of the stacked coil components. For example... Figure 6 As shown, the stacked coil component 1A has multiple layers LAa, LAb, LAc, LAd, LAe, LAf, LAg, LAh, LAi, LAj, and LAk. The stacked coil component 1A is constructed by, for example, stacking layers LAa to LAk sequentially from the main surface 2c side.

[0073] Layer LAa consists of base layer 20a.

[0074] Layer LAb is formed by combining the base layer 20b and the coil conductor layer 22b. A defect RAb is provided on the base layer 20b. Layer LAc is formed by combining the base layer 20c, the coil conductor layer 22c, and the first connecting conductor layer 24c. A defect RAc is provided on the base layer 20c.

[0075] Layer LAd is constructed by combining the base layer 20d, the coil conductor layer 22d, and the first connecting conductor layer 24d. A defect RAd is provided on the base layer 20d. Layer LAe is constructed by combining the base layer 20e, the coil conductor layer 22e, and the first connecting conductor layer 24e. A defect RAe is provided on the base layer 20e.

[0076] Layer LAf is constructed by combining the base layer 20f, the coil conductor layer 22f, and the first connecting conductor layer 24f. A defect RAf is provided on the base layer 20f. Layer LAg is constructed by combining the base layer 20g, the coil conductor layer 22g, and the first connecting conductor layer 24g. A defect RAg is provided on the base layer 20g.

[0077] Layer LAh is constructed by combining the base layer 20h, the coil conductor layer 22h, and the first connecting conductor layer 24h. A defect RAh is provided on the base layer 20h. Layer LAi is constructed by combining the base layer 20i, the first connecting conductor layer 24i, and the second connecting conductor layer 26i. A defect RAi is provided on the base layer 20i.

[0078] Layer LAj is constructed by combining the base layer 20j, the first connecting conductor layer 24j, and the second connecting conductor layer 26j. A defect RAj is provided on the base layer 20j. Layer LAk is constructed by combining the base layer 20k, the first terminal electrode layer 28k, and the second terminal electrode layer 29k. A defect RAk is provided on the base layer 20k.

[0079] like Figure 5 As shown, in the laminated coil component 1A, the distance L2 between the first connecting conductor 6 and the second coil portion 9A is greater than the distance L1 between the first connecting conductor 6 and the first coil portion 8A. In other words, the distance L1 between the first connecting conductor 6 and the first coil portion 8A is less than the distance L2 between the first connecting conductor 6 and the second coil portion 9A. That is, the second coil portion 9A is disposed further away from the first connecting conductor 6 than the first coil portion 8A. Distance L1 is the shortest distance between the first connecting conductor 6 and the first coil portion 8A (coil conductor layers 22b-22d). Distance L2 is the shortest distance between the first connecting conductor 6 and the second coil portion 9A (coil conductor layers 22e-22h). Furthermore, in Figure 5 For convenience, distances L1 and L2 are shown as examples, which may differ from the actual shortest distance.

[0080] In the first coil section 8A, the distance between the first connecting conductor 6 and the coil conductor layer 22d is greater than the distance between the first connecting conductor 6 and the coil conductor layer 22c. That is, in the path of the first terminal electrode 3, the first connecting conductor 6, the coil 5A, the second connecting conductor 7, and the second terminal electrode 4, the coil conductor layer 22d on the second terminal electrode 4 side is positioned further away from the first connecting conductor 6 than the coil conductor layer 22c. In the second coil section 9A, the distance between the first connecting conductor 6 and the coil conductor layer 22g is greater than the distance between the first connecting conductor 6 and the coil conductor layer 22f. That is, in the aforementioned path, the coil conductor layer 22g on the second terminal electrode 4 side is positioned further away from the first connecting conductor 6 than the coil conductor layer 22f.

[0081] In the stacked coil component 1A, the distance between the first connecting conductor 6 and the coil conductor layers 22c and 22d of the first coil section 8A is set based on the potential difference generated when using the stacked coil component 1A. Specifically, in the stacked coil component 1A, the greater the potential difference with the first connecting conductor 6, the greater the distance between the first connecting conductor 6 and the coil conductor layers 22c and 22d is set. The potential difference between the first connecting conductor 6 and the coil conductor layer 22d is greater than the potential difference between the first connecting conductor 6 and the coil conductor layer 22c. Therefore, in the stacked coil component 1A, in the first coil section 8A, the distance between the first connecting conductor 6 and the coil conductor layer 22c increases in the order of distance between the first connecting conductor 6 and the coil conductor layer 22d. Similarly, in the stacked coil component 1A, in the second coil section 9A, the distance between the first connecting conductor 6 and the coil conductor layer 22f increases in the order of distance between the first connecting conductor 6 and the coil conductor layer 22g.

[0082] The diameters of the first coil portion 8A and the second coil portion 9A are different. The diameter of the first coil portion 8A is larger than the diameter of the second coil portion 9A. In other words, the diameter of the second coil portion 9A is smaller than the diameter of the first coil portion 8A. The coil axis of the first coil portion 8A and the coil axis of the second coil portion 9A are not aligned. The coil axis of the second coil portion 9A is located closer to the end face 2b than the coil axis of the first coil portion 8A. With regard to the first coil portion 8A and the second coil portion 9A, the edges of the body 2 on the end face 2b side are aligned in the first direction D1. Specifically, when viewed from the first direction D1, a portion of the coil conductor layer 22b constituting the first coil portion 8A overlaps with a portion of the coil conductor layers 22e and 22h constituting the second coil portion 9A.

[0083] Viewed from the first direction D1, the second coil portion 9A does not overlap with the first terminal electrode 3. That is, the second coil portion 9A is not located above the first terminal electrode 3. Specifically, viewed from the first direction D1, the coil conductor layers 22e to 22h do not overlap with the first terminal electrode 3.

[0084] As explained above, in the laminated coil component 1A of this embodiment, similar to the laminated coil component 1, the distance L2 between the first connecting conductor 6 and the second coil portion 9A is greater than the distance L1 between the first connecting conductor 6 and the first coil portion 8A. Therefore, in the laminated coil component 1A, the second coil portion 9A, which has a larger potential difference from the first connecting conductor 6, is positioned further away from the first connecting conductor 6 than the first coil portion 8A. Thus, in the laminated coil component 1A, stray capacitance formed between the first connecting conductor 6 and the second coil portion 9A can be reduced. Furthermore, in the laminated coil component 1A, the diameter of the first coil portion 8A can be increased. Therefore, the inductance of the coil 5A can be increased. As described above, in the laminated coil component 1A, the generation of stray capacitance can be suppressed, and improved characteristics can be achieved.

[0085] In the stacked coil component 1A of this embodiment, the distance between the first connecting conductor 6 and the coil conductor layers 22c and 22d of the first coil section 8A, and the distance between the first connecting conductor 6 and the coil conductor layers 22f and 22g of the second coil section 9A are set based on the potential difference generated when using the stacked coil component 1A. The potential difference between the first connecting conductor 6 and the coil conductor layer 22d is greater than the potential difference between the first connecting conductor 6 and the coil conductor layer 22c. Therefore, in the first coil section 8A, the distance between the first connecting conductor 6 and the coil conductor layer 22d is greater than the distance between the first connecting conductor 6 and the coil conductor layer 22c. Furthermore, the potential difference between the first connecting conductor 6 and the coil conductor layer 22g is greater than the potential difference between the first connecting conductor 6 and the coil conductor layer 22h. Therefore, in the second coil section 9A, the distance between the first connecting conductor 6 and the coil conductor layer 22g is greater than the distance between the first connecting conductor 6 and the coil conductor layer 22f. In this structure, by setting the distance based on the potential difference, stray capacitance is reduced.

[0086] [Third Embodiment] Next, refer to Figure 7 and Figure 8 The stacked coil component of the third embodiment is described. Figure 7 This is a perspective view of the stacked coil component according to the third embodiment. Figure 8 yes Figure 7 A side view of the stacked coil component shown. Figure 7 and Figure 8 As shown, the stacked coil component 1B of the third embodiment includes a body 2, a first terminal electrode 3 and a second terminal electrode 4, a coil 5B, a first connecting conductor 6 and a second connecting conductor 7. Figure 7 and Figure 8 In the middle, for ease of explanation, the base body 2 is represented by a dashed line.

[0087] Base body 2 is constructed by using multiple base body layers 30a to 30k (refer to...) Figure 9It is stacked on top of the first direction D1.

[0088] Coil 5B is disposed within body 2. Coil 5B consists of multiple coil conductor layers 32b to 32h (see reference). Figure 9 The coil 5B is formed by interconnecting multiple coil conductor layers 32b to 32h within the body 2. The coil axis of the coil 5B is arranged along a first direction D1. The coil conductor layers 32b to 32h are configured such that at least a portion overlaps when viewed from the first direction D1. The multiple coil conductor layers 32b to 32h are made of a conductive material (e.g., Ag or Pd). The coil conductor layers 32b to 32h are arranged away from the end faces 2a, 2b, main faces 2c, 2d, and side faces 2e, 2f.

[0089] Coil 5B comprises a first coil portion 8B and a second coil portion 9B. The first coil portion 8B is composed of multiple coil conductor layers 32b to 32f. The first coil portion 8B is disposed on the main surface 2c side of the body 2. The first coil portion 8B has one end connected to the first connecting conductor 6. The first coil portion 8B is connected to the first connecting conductor 6. The second coil portion 9B is composed of multiple coil conductor layers 32g and 32h. The second coil portion 9B is disposed on the main surface 2d side of the body 2. The second coil portion 9B has the other end connected to the second connecting conductor 7. The second coil portion 9B is connected to the second connecting conductor 7.

[0090] Figure 9 This is an exploded perspective view of the stacked coil components. For example... Figure 9 As shown, the stacked coil component 1B has multiple layers LBa, LBb, LBc, LBd, LBe, LBf, LBg, LBh, LBi, LBj, and LBk. The stacked coil component 1B is constructed by, for example, stacking layers LBa to LBk sequentially from the main surface 2c side.

[0091] Layer LBa consists of a base layer 30a.

[0092] Layer LBb is constructed by combining the base layer 30b and the coil conductor layer 32b. A defect RBb is provided on the base layer 30b. Layer LBc is constructed by combining the base layer 30c, the coil conductor layer 32c, and the first connecting conductor layer 34c. A defect RBc is provided on the base layer 30c.

[0093] Layer LBd is constructed by combining the base layer 30d, the coil conductor layer 32d, and the first connecting conductor layer 34d. A defect RBd is provided on the base layer 30d. Layer LBe is constructed by combining the base layer 30e, the coil conductor layer 32e, and the first connecting conductor layer 34e. A defect RBe is provided on the base layer 30e.

[0094] Layer LBf is constructed by combining the base layer 30f, the coil conductor layer 32f, and the first connecting conductor layer 34f. A defect RBf is provided on the base layer 30f. Layer LBg is constructed by combining the base layer 30g, the coil conductor layer 32g, and the first connecting conductor layer 34g. A defect RBg is provided on the base layer 30g.

[0095] Layer LBh is constructed by combining the base layer 30h, the coil conductor layer 32h, and the first connecting conductor layer 34h. A defect portion RBh is provided on the base layer 30h. Layer LBi is constructed by combining the base layer 30i, the first connecting conductor layer 34i, and the second connecting conductor layer 36i. A defect portion RBi is provided on the base layer 30i.

[0096] Layer LBj is constructed by combining the base layer 30j, the first connecting conductor layer 34j, and the second connecting conductor layer 36j. A defect RBj is provided on the base layer 30j. Layer LBk is constructed by combining the base layer 30k, the first terminal electrode layer 38k, and the second terminal electrode layer 39k. A defect RBk is provided on the base layer 30k.

[0097] like Figure 10 As shown, in the laminated coil component 1B, the distance L2 between the first connecting conductor 6 and the second coil portion 9B is greater than the distance L1 between the first connecting conductor 6 and the first coil portion 8B. In other words, the distance L1 between the first connecting conductor 6 and the first coil portion 8B is less than the distance L2 between the first connecting conductor 6 and the second coil portion 9B. That is, the second coil portion 9B is positioned further away from the first connecting conductor 6 than the first coil portion 8B. In the laminated coil component 1B, the portion of the coil conductor layer 32g constituting the second coil portion 9B opposite to the first connecting conductor 6 is set as a bevel. Therefore, in the laminated coil component 1B, the distance L2 between the first connecting conductor 6 and the second coil portion 9B is greater than the distance L1 between the first connecting conductor 6 and the first coil portion 8B. Distance L1 is the shortest distance between the first connecting conductor 6 and the first coil portion 8B (coil conductor layers 32b to 32f). Distance L2 is the shortest distance between the first connecting conductor 6 and the second coil portion 9B (coil conductor layers 32g and 32h). Furthermore, Figure 10 For convenience, distances L1 and L2 are shown as examples, which may differ from the actual shortest distance.

[0098] The diameters of the first coil section 8B and the second coil section 9B are approximately equal. The coil axis of the first coil section 8B and the coil axis of the second coil section 9B are approximately aligned. Viewed from the first direction D1, a portion of the coil conductor layer 32b and coil conductor layer 32e constituting the first coil section 8B overlaps with a portion of the coil conductor layer 32h constituting the second coil section 9B.

[0099] As explained above, in the laminated coil component 1B of this embodiment, similar to the laminated coil component 1, the distance L2 between the first connecting conductor 6 and the second coil portion 9B is greater than the distance L1 between the first connecting conductor 6 and the first coil portion 8B. Therefore, in the laminated coil component 1B, the second coil portion 9B, which has a larger potential difference from the first connecting conductor 6, is positioned further away from the first connecting conductor 6 than the first coil portion 8B. Thus, in the laminated coil component 1B, the stray capacitance formed between the first connecting conductor 6 and the second coil portion 9B can be reduced. Furthermore, in the laminated coil component 1B, the diameter of the first coil portion 8B can be increased. Therefore, the inductance of the coil 5B can be increased. As described above, in the laminated coil component 1B, the generation of stray capacitance is suppressed, and the performance is improved.

[0100] In the laminated coil component 1B of this embodiment, the portion of the coil conductor layer 32g constituting the second coil portion 9B opposite to the first connecting conductor 6 is provided as a bevel. Therefore, in the laminated coil component 1B, the distance L2 between the first connecting conductor 6 and the second coil portion 9B is increased compared to the distance L1 between the first connecting conductor 6 and the first coil portion 8B. This structure allows for an increase in the diameter of the second coil portion 9B. Therefore, in the laminated coil component 1B, improved characteristics can be achieved.

[0101] [Fourth Embodiment] Next, refer to Figure 11 and Figure 12 The stacked coil component of the fourth embodiment is described. Figure 11 This is a perspective view of the stacked coil component according to the fourth embodiment. Figure 12 yes Figure 11 A side view of the stacked coil component shown. Figure 11 and Figure 12 As shown, the laminated coil component 1C of the fourth embodiment includes a body 2, a first terminal electrode 3 and a second terminal electrode 4, a coil 5C, a first connecting conductor 6C and a second connecting conductor 7C. Figure 11 and Figure 12 In the middle, for ease of explanation, the base body 2 is represented by a dashed line.

[0102] Base body 2 is constructed by using multiple base body layers 40a to 40k (refer to...) Figure 13 It is stacked on top of the first direction D1.

[0103] Coil 5C is housed within body 2. Coil 5C consists of multiple coil conductor layers 42b to 42h (see reference). Figure 13The coil 5C is formed by multiple through-hole conductors 43a-43h. Multiple coil conductor layers 42b-42h are interconnected via through-hole conductors 43a-43h, forming a coil 5C within the body 2. The coil axis of the coil 5C is arranged along a first direction D1. The coil conductor layers 42b-42h are configured such that at least a portion overlaps when viewed from the first direction D1. The multiple coil conductor layers 42b-42h are made of a conductive material (e.g., Ag or Pd). The coil conductor layers 42b-42h are arranged away from the end faces 2a, 2b, main faces 2c, 2d, and side faces 2e, 2f.

[0104] Coil 5C includes a first coil portion 8C and a second coil portion 9C. The first coil portion 8C is composed of multiple coil conductor layers 42b to 42d. The first coil portion 8C is disposed on the main surface 2c side of the body 2. The first coil portion 8C has one end of the coil 5C connected to the first connecting conductor 6C. The first coil portion 8C is connected to the first connecting conductor 6C. The second coil portion 9C is composed of multiple coil conductor layers 42e to 42h. The second coil portion 9C is disposed on the main surface 2d side of the body 2. The second coil portion 9C has the other end of the coil 5C connected to the second connecting conductor 7C. The second coil portion 9C is connected to the second connecting conductor 7C.

[0105] The first connecting conductor 6C is disposed within the body 2. The first connecting conductor 6C connects the first terminal electrode 3 and the coil 5C. The first connecting conductor 6C is a through-hole conductor. The first connecting conductor 6C consists of multiple first through-hole conductor layers 44c~44j (refer to...). Figure 13 )constitute.

[0106] The second connecting conductor 7C is disposed within the body 2. The second connecting conductor 7C connects the second terminal electrode 4 and the coil 5C. The second connecting conductor 7C is a through-hole conductor. The second connecting conductor 7C consists of multiple second through-hole conductor layers 46i, 46j (see reference). Figure 13 )constitute.

[0107] Figure 13 This is an exploded perspective view of the stacked coil components. For example... Figure 13 As shown, the stacked coil component 1C has multiple layers LCa, LCb, LCc, LCd, LCE, LCf, LCg, LCh, LCI, LCj, and LCk. The stacked coil component 1C is constructed by, for example, stacking layers LCa to LCk sequentially from the main surface 2c side.

[0108] Layer LCa consists of base layer 40a.

[0109] Layer LCb is formed by providing a coil conductor layer 42b on the base layer 40b. Layer LCc is formed by providing a coil conductor layer 42c on the base layer 40c and providing a first through-hole conductor layer 44c. The coil conductor layer 42b and the first through-hole conductor layer 44c are connected by a through-hole conductor 43a. The coil conductor layer 42b and the coil conductor layer 42c are connected by a through-hole conductor 43b.

[0110] Layer LCd is constructed by providing a coil conductor layer 42d on the base layer 40d and a first through-hole conductor layer 44d. The coil conductor layer 42c and the coil conductor layer 42d are connected by a through-hole conductor 43c.

[0111] Layer LCe is constructed by providing a coil conductor layer 42e on the base layer 40e and a first through-hole conductor layer 44e. The coil conductor layer 42d and the coil conductor layer 42e are connected by a through-hole conductor 43d.

[0112] Layer LCf is constructed by providing a coil conductor layer 42f on the base layer 40f and a first through-hole conductor layer 44f. The coil conductor layer 42e and the coil conductor layer 42f are connected by a through-hole conductor 43e.

[0113] Layer LCg is constructed by providing a coil conductor layer 42g on the base layer 40g and a first through-hole conductor layer 44g. The coil conductor layer 42f and the coil conductor layer 42g are connected by a through-hole conductor 43f.

[0114] Layer LCh is constructed by providing a coil conductor layer 42h on the base layer 40h and a first through-hole conductor layer 44h. The coil conductor layer 42g and the coil conductor layer 42h are connected by a through-hole conductor 43g.

[0115] Layer LCI is constructed by providing a first through-hole conductor layer 44i and a second through-hole conductor layer 46i on the base layer 40i. The coil conductor layer 42h and the second through-hole conductor layer 46i are connected by a through-hole conductor 43h.

[0116] Layer LCj is formed by providing a first through-hole conductor layer 44j and a second through-hole conductor layer 46j on the substrate layer 40j. Layer LCk is formed by providing a first terminal electrode 3 and a second terminal electrode 4 on the substrate layer 40k.

[0117] like Figure 12As shown, in the laminated coil component 1C, the distance L2 between the first connecting conductor 6C and the second coil portion 9C is greater than the distance L1 between the first connecting conductor 6C and the first coil portion 8C. In other words, the distance L1 between the first connecting conductor 6C and the first coil portion 8C is less than the distance L2 between the first connecting conductor 6C and the second coil portion 9C. That is, the second coil portion 9C is disposed further away from the first connecting conductor 6C than the first coil portion 8C. Distance L1 is the shortest distance between the first connecting conductor 6C and the first coil portion 8C (coil conductor layers 42b to 42d). Distance L2 is the shortest distance between the first connecting conductor 6C and the second coil portion 9C (coil conductor layers 42e to 42h). Furthermore, Figure 12 For convenience, distances L1 and L2 are shown as examples, which may differ from the actual shortest distance.

[0118] The diameters of the first coil portion 8C and the second coil portion 9C are different. The diameter of the first coil portion 8C is larger than the diameter of the second coil portion 9C. In other words, the diameter of the second coil portion 9C is smaller than the diameter of the first coil portion 8C. The coil axis of the first coil portion 8C and the coil axis of the second coil portion 9C are not aligned. The coil axis of the second coil portion 9C is located closer to the end face 2b than the coil axis of the first coil portion 8C. With regard to the first coil portion 8C and the second coil portion 9C, the edge of the body 2 on the end face 2b side is aligned in the first direction D1. Specifically, when viewed from the first direction D1, a portion of the coil conductor layer 42b and coil conductor layer 42d constituting the first coil portion 8C overlaps with a portion of the coil conductor layer 42f and coil conductor layer 42h constituting the second coil portion 9C.

[0119] Viewed from the first direction D1, the second coil portion 9C does not overlap with the first terminal electrode 3. That is, the second coil portion 9C is not located above the first terminal electrode 3. Specifically, viewed from the first direction D1, the coil conductor layers 42e to 42h do not overlap with the first terminal electrode 3.

[0120] Next, the manufacturing method of the laminated coil component 1C will be described.

[0121] An insulating resin and solvent are mixed to prepare a slurry. The prepared slurry is applied to a substrate (e.g., PET film) using a doctor blade method to form a green sheet as the base layer 40a to 40k. Next, through holes are formed at predetermined positions on the green sheet by laser processing for the through-hole conductors 43a to 43h, the first through-hole conductor layers 44b to 44j, and the second through-hole conductor layers 46i and 46j.

[0122] Next, a first conductive paste is filled into the through-holes of the green sheet. The first conductive paste is made by mixing conductive metal powder and adhesive resin. Then, conductors that serve as coil conductor layers 42b to 42h are placed on the green sheet. At this time, the conductors are connected to the conductive paste in the through-holes.

[0123] Next, the green sheets are stacked. Here, multiple green sheets with conductors are peeled from the substrate and stacked, and pressure is applied in the stacking direction to form a laminate. At this time, each green sheet is stacked in such a way that the conductors that become the conductor layers 42b to 42h of each coil overlap in the stacking direction.

[0124] Next, the stack of green wafers is cut into chips of a specified size using a cutting machine to obtain green wafer blanks. Then, after removing the binder resin contained in each part from the green wafer blanks, the green wafer blanks are fired. Thus, the base body 2 is obtained.

[0125] Next, a second conductive paste is applied to the main surface 2d of the substrate 2. The second conductive paste is made by mixing conductive metal powder, glass powder, and binder resin. Then, by heat treatment, the second conductive paste is sintered onto the substrate 2 to form the first terminal electrode 3 and the second terminal electrode 4. Alternatively, electrolytic plating or non-electrolytic plating can be performed on the first terminal electrode 3 and the second terminal electrode 4 as needed to form a plating layer. Through the above processes, the laminated coil component 1C is obtained.

[0126] As explained above, in the laminated coil component 1C of this embodiment, similar to the laminated coil component 1, the distance L2 between the first connecting conductor 6C and the second coil portion 9C is greater than the distance L1 between the first connecting conductor 6C and the first coil portion 8C. Therefore, in the laminated coil component 1C, the second coil portion 9C, which has a larger potential difference from the first connecting conductor 6C, is positioned further away from the first connecting conductor 6C than the first coil portion 8C. Thus, in the laminated coil component 1C, the stray capacitance formed between the first connecting conductor 6C and the second coil portion 9C can be reduced. Furthermore, in the laminated coil component 1C, the diameter of the first coil portion 8C can be increased. Therefore, the inductance of the coil 5C can be increased. As described above, in the laminated coil component 1C, the generation of stray capacitance is suppressed, and the performance is improved.

[0127] [Fifth Embodiment] Next, refer to Figure 14 and Figure 15 The stacked coil component of the fifth embodiment is described. Figure 14 This is a perspective view of the stacked coil component according to the fifth embodiment. Figure 15 yes Figure 14 A side view of the stacked coil component shown. Figure 14 and Figure 15As shown, the stacked coil component 1D of the fifth embodiment includes a body 2, a first terminal electrode 3 and a second terminal electrode 4, a coil 5D, a first connecting conductor 6D and a second connecting conductor 7D. Figure 14 and Figure 15 In the middle, for ease of explanation, the base body 2 is represented by a dashed line.

[0128] Base body 2 is constructed by using multiple base body layers 50a to 50k (refer to...) Figure 16 It is stacked on top of the first direction D1.

[0129] Coil 5D is disposed within body 2. Coil 5D consists of multiple coil conductor layers 52b to 52h (see reference). Figure 16 The coil 5D is formed by multiple through-hole conductors 53a-53h. Multiple coil conductor layers 52b-52h are interconnected via through-hole conductors 53a-53h, forming a coil 5D within the body 2. The coil axis of the coil 5D is arranged along a first direction D1. The coil conductor layers 52b-52h are configured such that at least a portion overlaps when viewed from the first direction D1. The multiple coil conductor layers 52b-52h are made of a conductive material (e.g., Ag or Pd). The coil conductor layers 52b-52h are arranged away from the end faces 2a, 2b, main faces 2c, 2d, and side faces 2e, 2f.

[0130] Coil 5D comprises a first coil section 8D, a second coil section 9D, and a third coil section 10D. The first coil section 8D is composed of multiple coil conductor layers 52b to 52d. The first coil section 8D is disposed on the main surface 2c side of the body 2. The first coil section 8D has one end connected to the coil 5D via the first connecting conductor 6D. The first coil section 8D is connected to the first connecting conductor 6D. The second coil section 9D is composed of multiple coil conductor layers 52g and 52h. The second coil section 9D is disposed on the main surface 2d side of the body 2. The second coil section 9D has the other end connected to the coil 5D via the second connecting conductor 7D. The second coil section 9D is connected to the second connecting conductor 7D. The third coil section 10D is composed of multiple coil conductor layers 52e and 52f. The third coil section 10D is disposed between the first coil section 8D and the second coil section 9D. One end of the third coil section 10D is connected to the first coil section 8D, and the other end of the third coil section 10D is connected to the second coil section 9D.

[0131] The first connecting conductor 6D is disposed within the body 2. The first connecting conductor 6D connects the first terminal electrode 3 and the coil 5D. The first connecting conductor 6D is a through-hole conductor. The first connecting conductor 6D consists of multiple first through-hole conductor layers 54c to 54j (see reference). Figure 16 )constitute.

[0132] The second connecting conductor 7D is disposed within the body 2. The second connecting conductor 7D connects the second terminal electrode 4 and the coil 5D. The second connecting conductor 7D is a through-hole conductor. The second connecting conductor 7D consists of multiple second through-hole conductor layers 56i, 56j (see reference). Figure 16 )constitute.

[0133] Figure 16 This is an exploded perspective view of the stacked coil components. For example... Figure 16 As shown, the stacked coil component 1D has multiple layers LDa, LDb, LDc, LDd, LDe, LDf, LDg, LDh, LDi, LDj, and LDk. The stacked coil component 1D is constructed by, for example, stacking layers LDa to LDk sequentially from the main surface 2c side.

[0134] Layer LDa consists of a base layer 50a.

[0135] Layer LDb is formed by providing a coil conductor layer 52b on the base layer 50b. Layer LDc is formed by providing a coil conductor layer 52c on the base layer 50c and providing a first through-hole conductor layer 54c. The coil conductor layer 52b and the first through-hole conductor layer 54c are connected by a through-hole conductor 53a. The coil conductor layer 52b and the coil conductor layer 52c are connected by a through-hole conductor 53b.

[0136] Layer LDd is constructed by providing a coil conductor layer 52d on the base layer 50d and a first through-hole conductor layer 54d. The coil conductor layer 52c and the coil conductor layer 52d are connected by a through-hole conductor 53c.

[0137] Layer LDe is constructed by providing a coil conductor layer 52e on the base layer 50e and a first through-hole conductor layer 54e. The coil conductor layer 52d and the coil conductor layer 52e are connected by a through-hole conductor 53d.

[0138] Layer LDf is constructed by providing a coil conductor layer 52f on the body layer 50f and a first through-hole conductor layer 54f. The coil conductor layer 52e and the coil conductor layer 52f are connected by a through-hole conductor 53e.

[0139] Layer LDg is constructed by providing a coil conductor layer 52g and a first through-hole conductor layer 54g on the base layer 50g. The coil conductor layer 52f and the coil conductor layer 52g are connected by a through-hole conductor 53f.

[0140] Layer LDh is constructed by providing a coil conductor layer 52h on the base layer 50h and a first through-hole conductor layer 54h. The coil conductor layer 52g and the coil conductor layer 52h are connected by a through-hole conductor 53g.

[0141] Layer LDi is constructed by providing a first through-hole conductor layer 54i and a second through-hole conductor layer 56i on the base layer 50i. The coil conductor layer 52h and the second through-hole conductor layer 56i are connected by a through-hole conductor 53h.

[0142] Layer LDj is formed by providing a first through-hole conductor layer 54j and a second through-hole conductor layer 56j on the substrate layer 50j. Layer LDk is formed by providing a first terminal electrode 3 and a second terminal electrode 4 on the substrate layer 50k.

[0143] like Figure 15 As shown, in the stacked coil component 1D, the distance L2 between the first connecting conductor 6D and the second coil portion 9D is greater than the distance L1 between the first connecting conductor 6D and the first coil portion 8D. In other words, the distance L1 between the first connecting conductor 6D and the first coil portion 8D is less than the distance L2 between the first connecting conductor 6D and the second coil portion 9D. That is, the second coil portion 9D is disposed further away from the first connecting conductor 6D than the first coil portion 8D. In addition, the distance L3 between the first connecting conductor 6D and the third coil portion 10D is greater than the distance L1 between the first connecting conductor 6D and the first coil portion 8D, and less than the distance L2 between the first connecting conductor 6D and the second coil portion 9D (L1 > L3 > L2).

[0144] In the stacked coil component 1D, the distances L1, L2, and L3 between the first connecting conductor 6D and the first coil portion 8D, the second coil portion 9D, and the third coil portion 10D are set based on the potential difference generated when using the stacked coil component 1D. Specifically, in the stacked coil component 1D, the distances L1, L2, and L3 between the first connecting conductor 6D and the first coil portion 8D, the second coil portion 9D, and the third coil portion 10D are set such that the greater the potential difference with the first connecting conductor 6D, the greater the distance between the first connecting conductor 6D and the first coil portion 8D. The potential difference is greatest between the first connecting conductor 6D and the second coil portion 9D, and smallest between the first connecting conductor 6D and the first coil portion 8D. The potential difference increases in the following order: between the first connecting conductor 6D and the first coil portion 8D, between the first connecting conductor 6D and the third coil portion 10D, and between the first connecting conductor 6D and the second coil portion 9D. Therefore, in the stacked coil component 1D, the distance L1 between the first connecting conductor 6D and the first coil portion 8D, the distance L3 between the first connecting conductor 6D and the third coil portion 10D, and the distance L2 between the first connecting conductor 6D and the second coil portion 9D increase in that order.

[0145] Distance L1 is the shortest distance between the first connecting conductor 6D and the first coil section 8D (coil conductor layers 52b-52d). Distance L2 is the shortest distance between the first connecting conductor 6D and the second coil section 9D (coil conductor layers 52g, 52h). Distance L3 is the shortest distance between the first connecting conductor 6D and the third coil section 10D (coil conductor layers 52e, 52f). Furthermore, Figure 15 For convenience, distances L1, L2, and L3 are shown as a single example, which may differ from the actual shortest distance.

[0146] The diameters of the first coil section 8D, the second coil section 9D, and the third coil section 10D are different. The diameter of the first coil section 8D is larger than the diameters of the second coil section 9D and the third coil section 10D. The diameter of the third coil section 10D is larger than the diameter of the second coil section 9D. The coil axes of the first coil section 8D, the second coil section 9D, and the third coil section 10D are not aligned. The coil axis of the second coil section 9D is located closer to the end face 2b than the coil axes of the first coil section 8D and the third coil section 10D. The coil axis of the third coil section 10D is located closer to the end face 2b than the coil axis of the first coil section 8D.

[0147] In the first coil section 8D, the second coil section 9D, and the third coil section 10D, the edge of the end face 2b side of the body 2 is aligned in the first direction D1. Specifically, when viewed from the first direction D1, a portion of the coil conductor layer 52b and coil conductor layer 52d constituting the first coil section 8D, a portion of the coil conductor layer 52h constituting the second coil section 9D, and a portion of the coil conductor layer 52f constituting the third coil section 10D overlap.

[0148] Viewed from the first direction D1, the second coil portion 9D and the third coil portion 10D do not overlap with the first terminal electrode 3. That is, the second coil portion 9D and the third coil portion 10D are not located above the first terminal electrode 3. Specifically, viewed from the first direction D1, the coil conductor layers 52e to 52h do not overlap with the first terminal electrode 3.

[0149] As explained above, in the laminated coil component 1D of this embodiment, similar to the laminated coil component 1, the distance L2 between the first connecting conductor 6D and the second coil portion 9D is greater than the distance L1 between the first connecting conductor 6D and the first coil portion 8D, and the distance L3 between the first connecting conductor 6D and the third coil portion 10D. Therefore, in the laminated coil component 1D, the second coil portion 9D and the third coil portion 10D, which have a larger potential difference from the first connecting conductor 6D, are positioned further away from the first connecting conductor 6D than the first coil portion 8D. Thus, in the laminated coil component 1D, the stray capacitance formed between the first connecting conductor 6D and the second coil portion 9D can be reduced. Furthermore, in the laminated coil component 1D, the diameter of the first coil portion 8D can be increased. Therefore, the inductance of the coil 5D can be increased. As described above, in the laminated coil component 1D, the generation of stray capacitance is suppressed, and improved characteristics are achieved.

[0150] In the stacked coil component 1D of this embodiment, the distances L1, L2, and L3 between the first connecting conductor 6D and the first coil portion 8D, the second coil portion 9D, and the third coil portion 10D are set based on the potential difference generated when using the stacked coil component 1D. Specifically, in the stacked coil component 1D, the distances L1, L2, and L3 between the first connecting conductor 6D and the first coil portion 8D, the second coil portion 9D, and the third coil portion 10D are set such that the greater the potential difference with the first connecting conductor 6D, the greater the distance between the first connecting conductor 6D and the first connecting conductor 6D. In this structure, by setting the distance based on the potential difference, stray capacitance is reduced.

[0151] The embodiments of the present invention have been described above, but the present invention is not necessarily limited to the above embodiments, and various modifications can be made without departing from its spirit.

[0152] In the above embodiment, the first terminal electrode 3 and the second terminal electrode 4 are each rectangular in shape as an example. However, the shapes of the first terminal electrode 3 and the second terminal electrode 4 are not limited to this.

[0153] In the above embodiment, the arrangement of the first connecting conductors 6, 6C, 6D and the second connecting conductors 7, 7C, 7D in diagonal positions is described as an example. However, the first connecting conductors 6, 6C, 6D and the second connecting conductors 7, 7C, 7D may also be arranged in other positions.

[0154] In the above embodiment, the first connecting conductors 6, 6C, 6D and the second connecting conductors 7, 7C, 7D are described as cylindrical as an example. However, the shapes of the first connecting conductors 6, 6C, 6D and the second connecting conductors 7, 7C, 7D are not limited to this, and may also be triangular prisms, prismatic shapes, etc.

[0155] In the above embodiment, an example was described where coil 5 is composed of multiple coil conductor layers 12b to 12h, first coil section 8 is composed of coil conductor layers 12b to 12d, and second coil section 9 is composed of coil conductor layers 12e to 12h. However, the number of coil conductor layers constituting coil 5 is not limited to the values ​​described above. Furthermore, the number of coil conductor layers constituting first coil section 8 and second coil section 9 may be the same or different. Additionally, coil 5 may also include other coil sections. The same applies to coils 5A, 5B, 5C, and 5D.

Claims

1. A laminated coil component, comprising: The body is formed by stacking multiple insulating layers and has: a pair of opposing end faces, a pair of opposing main faces, and a pair of opposing side faces, one of the main faces being a mounting surface; A coil, disposed within the body, with the coil axis extending along the opposite directions of a pair of main surfaces; The first terminal electrode and the second terminal electrode are connected to the coil and are disposed on the mounting surface; A first connecting conductor, which is disposed outside the coil when viewed from the opposite direction within the body, extends along the opposite direction, and connects one end of the coil located on the other side of the main surface to the first terminal electrode; and A second connecting conductor connects the other end of the coil located on one of the main surfaces to the second terminal electrode. The first connecting conductor is positioned outside the winding area of ​​the coil, and the length of a pair of main surfaces of the first connecting conductor in the opposite direction is longer than that of the second connecting conductor. The second connecting conductor is positioned at a location overlapping the winding area of ​​the coil, and the length of a pair of main surfaces of the second connecting conductor in the opposite direction is shorter than that of the first connecting conductor. The coil includes: a first coil portion having one end of the coil and disposed on the other main surface side, and a second coil portion having the other end of the coil and disposed on one main surface side. The diameter of the first coil portion is larger than the diameter of the second coil portion. The shortest distance between the first connecting conductor and the winding area of ​​the second coil portion is greater than the shortest distance between the first connecting conductor and the winding area of ​​the first coil portion.

2. The laminated coil component according to claim 1, wherein, Viewed from the relative directions, the outer edges of the first coil portion and the second coil portion partially overlap.

3. The laminated coil component according to claim 1 or 2, wherein, Viewed from the relative direction, the first terminal electrode does not overlap with the second coil portion.

4. The laminated coil component according to claim 1 or 2, wherein, The distance between the first connecting conductor and the coil is set based on the potential difference between the first connecting conductor and the coil during use. The distance is longer at locations with a larger potential difference than at locations with a smaller potential difference.

5. The laminated coil component according to claim 3, wherein, The distance between the first connecting conductor and the coil is set based on the potential difference between the first connecting conductor and the coil during use. The distance is longer at locations with a larger potential difference than at locations with a smaller potential difference.

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