A wireless charger
By employing a combined structure of an upper housing assembly, a lower housing assembly, a magnetic coil, and a heat dissipation ring in the wireless charger, and utilizing thermally conductive colloid to conduct heat, the problems of poor heat dissipation and structural instability in wireless chargers are solved, achieving more efficient charging and heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUAWEI DIGITAL POWER TECH CO LTD
- Filing Date
- 2022-07-07
- Publication Date
- 2026-07-03
AI Technical Summary
Existing wireless chargers suffer from defects such as flimsy structure, poor internal heat dissipation, and slow charging speed, which affect the promotion and use of the products.
The structure adopts a combination of an upper housing assembly, a lower housing assembly, a magnetic coil, and a heat dissipation ring. A cavity is formed by setting a groove structure on the lower housing assembly, the heat dissipation ring is nested in the magnetic coil, and heat is conducted from the upper housing assembly to the lower housing assembly through thermally conductive colloid, thereby increasing the heat dissipation area.
It improves the heat dissipation capacity of wireless chargers and electronic devices, enhances structural stability and charging efficiency, and reduces power loss.
Smart Images

Figure CN115208010B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of wireless charging technology, and more particularly to a wireless charger. Background Technology
[0002] With the development of wireless charging technology, electronic devices can be charged using wireless chargers. Wireless chargers convert electrical energy into wireless power signals and transmit them to the electronic device being charged, thus enabling wireless charging. However, existing wireless chargers suffer from drawbacks such as flimsy structures, poor internal heat dissipation, and slow charging speeds, which hinder their widespread adoption and use. Summary of the Invention
[0003] To address the aforementioned problems, embodiments of this application provide a wireless charger comprising an upper housing assembly, a lower housing assembly, a magnetic coil, and a heat dissipation ring. The upper surface of the lower housing assembly has a groove structure, which is coupled to the upper housing assembly to form a cavity structure. The cavity structure houses the magnetic coil and the heat dissipation ring. The heat dissipation ring is nested within the magnetic coil and in contact with it. The upper surface of the heat dissipation ring is coupled to the upper housing assembly. The lower surface of the heat dissipation ring is coupled to the bottom of the groove structure of the lower housing assembly. When heat from the electronic device is transferred to the upper housing assembly, the heat dissipation ring can transfer the heat from the upper housing assembly to the bottom of the lower housing assembly, increasing the heat dissipation area of the electronic device and improving the heat dissipation capacity of both the wireless charger and the electronic device.
[0004] Therefore, the following technical solutions are adopted in the embodiments of this application:
[0005] This application provides a wireless charger, characterized in that it includes: an upper housing assembly, a lower housing assembly, a magnetic coil, and a heat sink ring. The upper surface of the lower housing assembly has a groove structure, which is coupled with the upper housing assembly to form a cavity structure. The magnetic coil is nested outside the heat sink ring. The gap between the upper housing assembly, the groove structure, the magnetic coil, and the heat sink ring is filled with thermally conductive colloid. The upper surface of the heat sink ring is coupled with the lower surface of the upper housing assembly, and the lower surface of the heat sink ring is coupled with the bottom of the groove structure of the lower housing assembly. The outer surface of the heat sink ring is coupled with the magnetic coil. The upper surface of the heat sink ring is the surface of the heat sink ring closest to the upper housing assembly, and the lower surface of the heat sink ring is the surface of the heat sink ring closest to the bottom of the groove structure of the lower housing assembly. The lower surface of the upper housing assembly is the surface of the upper housing assembly that forms the cavity structure. The heat sink ring is used to conduct heat from the upper housing assembly and the magnetic coil to the bottom of the groove structure of the lower housing assembly.
[0006] In one embodiment, a limiting magnet is further included. The limiting magnet is disposed inside the heat dissipation ring. The upper surface of the limiting magnet is coupled to the lower surface of the upper housing assembly, and the lower surface of the limiting magnet is coupled to the bottom of the groove structure of the lower housing assembly. The upper surface of the limiting magnet is the surface of the limiting magnet near the upper housing assembly, and the lower surface of the limiting magnet is the surface of the limiting magnet near the bottom of the groove structure of the lower housing assembly. The limiting magnet is used to transfer heat from the upper housing assembly to the bottom of the groove structure of the lower housing assembly.
[0007] In one embodiment, a thermally conductive adhesive is disposed between the upper surface of the limiting magnet and the lower surface of the upper housing assembly, and a thermally conductive adhesive is disposed between the lower surface of the limiting magnet and the bottom of the groove structure of the lower housing assembly.
[0008] In one embodiment, a thermally conductive colloid is provided between the heat dissipation ring and the limiting magnet.
[0009] In one embodiment, a thermally conductive adhesive is disposed between the upper surface of the heat dissipation ring and the upper housing assembly, and a thermally conductive adhesive is disposed between the lower surface of the heat dissipation ring and the bottom of the groove structure of the lower housing assembly.
[0010] In one embodiment, the magnetic coil is coupled to the lower surface of the upper housing assembly, and a thermally conductive colloid is disposed between the magnetic coil and the lower surface of the upper housing assembly.
[0011] In one embodiment, the magnetic sheet coil includes a magnetic sheet assembly and a coil assembly. The magnetic sheet assembly has an annular groove for housing the coil assembly, and a thermally conductive colloid is disposed in the annular groove of the magnetic sheet assembly.
[0012] In one embodiment, the heat dissipation ring is made of a material with high thermal conductivity.
[0013] In one embodiment, the upper housing assembly is made of a material with high thermal conductivity. When the wireless charger wirelessly charges the electronic device, the upper housing assembly conducts the heat from the electronic device to the lower housing assembly through a heat dissipation ring.
[0014] In one embodiment, the upper housing assembly conducts heat from the electronic device to the lower housing assembly.
[0015] In one embodiment, the upper housing assembly conducts heat from the electronic device to the lower housing assembly via thermally conductive colloid.
[0016] In one embodiment, a heat dissipation ring conducts heat from the magnetic coil to the lower housing assembly.
[0017] In one embodiment, the limiting magnet conducts heat from the magnetic sheet coil to the lower housing assembly.
[0018] In one embodiment, the heat dissipation colloid conducts heat from the magnetic coil to the lower housing assembly and the upper housing assembly.
[0019] In one embodiment, the groove structure includes a coil support plane, on which a magnetic sheet coil is disposed, and the coil support plane conducts heat from the magnetic sheet coil to the lower housing assembly. Attached Figure Description
[0020] The accompanying drawings used in the description of the embodiments or prior art are briefly introduced below.
[0021] Figure 1 This is a schematic diagram illustrating a scenario where a wireless charger and an electronic device are being charged, as provided in an embodiment of this application.
[0022] Figure 2 This is a top view of a wireless charger provided in an embodiment of this application;
[0023] Figure 3 This is an exploded view of the structure of a wireless charger provided in the embodiments of this application;
[0024] Figure 4 This is a cross-sectional structural diagram of a wireless charger provided in an embodiment of this application;
[0025] Figure 5 This is a schematic diagram of the groove structure of the lower housing assembly of a wireless charger provided in an embodiment of this application;
[0026] Figure 6 This is a top view of the lower housing assembly of a wireless charger provided in an embodiment of this application.
[0027] Figure 7 This is a schematic diagram of the upper housing assembly of a wireless charger provided in an embodiment of this application;
[0028] Figure 8 This is a schematic diagram of the structure of a magnetic coil in a wireless charger provided in an embodiment of this application;
[0029] Figure 9 This is a schematic diagram of the cross-sectional structure of a magnetic coil in a wireless charger provided in an embodiment of this application;
[0030] Figure 10 This is a schematic diagram of the structure of an electronic device and its wireless charger provided in the embodiments of this application;
[0031] Figure 11 This is a schematic diagram of the structure of a limiting magnet for a wireless charger provided in an embodiment of this application;
[0032] Figure 12This is a schematic diagram of another limiting magnet of a wireless charger provided in the embodiments of this application;
[0033] Figure 13 This is a schematic diagram of another limiting magnet of a wireless charger provided in the embodiments of this application;
[0034] Figure 14 This is a schematic diagram showing the positional relationship between the magnetic sheet coil, the limiting magnet, and the heat dissipation ring of a wireless charger provided in an embodiment of this application.
[0035] Figure 15 This is a schematic diagram showing the positional relationship between the magnetic coil, the limiting magnet, and the heat dissipation ring of another wireless charger provided in this application embodiment;
[0036] Figure 16 This is a schematic diagram showing the positional relationship between the magnetic coil, the limiting magnet, and the heat dissipation ring of another wireless charger provided in this application embodiment;
[0037] Figure 17 This is a schematic diagram of a limiting magnet and shielding component of a wireless charger provided in an embodiment of this application;
[0038] Figure 18 This is a schematic diagram showing the combination of 18 types of limiting magnets 230, shielding components 280 and thermally conductive colloids provided in the embodiments of this application;
[0039] Figure 19 This is a schematic diagram of heat transfer in the heating components such as the magnetic coil and limiting magnet of the wireless charger provided in this embodiment of the application.
[0040] Figure 20 This is a schematic diagram of heat transfer in the wireless charger provided in the embodiments of this application. Detailed Implementation
[0041] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.
[0042] In the description of this application, the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0043] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, contact connections, or integral connections. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. In the embodiments of this application, "contact" or "coupling" can refer to direct contact between components or contact between components through adhesives or thermally conductive colloids.
[0044] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.
[0045] Figure 1 This is a schematic diagram illustrating a scenario where a charger and an electronic device are charging, as provided in this application embodiment. The electronic device 100 can be a smartwatch, smartphone, wireless earphones, tablet computer, or laptop computer, etc. The wireless charger 200 can be a portable wireless charger, a car-mounted wireless charger, etc. During wireless charging, the electronic device 100 can be positioned on the upper surface of the wireless charger 200, or the distance between the electronic device 100 and the wireless charger 200 can be less than or equal to the charging distance. The wireless charger 200 converts electrical energy into wireless power signals. After receiving the wireless power signals, the electronic device 100 converts the wireless power signals back into electrical energy to power itself.
[0046] In this embodiment, when the wireless charger 200 is placed on a desktop, the "upper surface" refers to the surface of the wireless charger 200 facing away from the desktop. The upper surface of the wireless charger 200 can be a substrate for supporting the electronic device 100, a housing of the wireless charger 200, or other structural components. In this embodiment, the surface can be flat or curved. Similarly, the upper surface of each component in the wireless charger 200 refers to the surface of that component facing away from the desktop. The "lower surface" refers to the surface opposite to the "upper surface." In this embodiment, "facing upwards" refers to the direction from the wireless charger 200 towards the electronic device 100 during wireless charging. "Facing downwards" refers to the opposite direction to "facing upwards."
[0047] Figures 2-4 This is a schematic diagram of a wireless charger provided in an embodiment of this application. Figures 2-4 As shown, the wireless charger 200 is cylindrical in shape. In other embodiments, the wireless charger 200 may also be an elliptical cylinder, a polygonal cylinder, or other shapes.
[0048] like Figure 3As shown, the wireless charger 200 includes an upper housing assembly 210, a magnetic coil 220, a limiting magnet 230, a heat dissipation ring 240, a lower housing assembly 250, a circuit board 260, and a cable 270. The upper housing assembly 210 and the lower housing assembly 250 are coupled to form the outer shell of the wireless charger 200. A groove structure is provided on the upper surface of the lower housing assembly 250. After the groove structure of the upper housing assembly 210 and the lower housing assembly 250 is coupled, a cavity structure is formed between the upper housing assembly 210 and the lower housing assembly 250. The cavity structure is used to house the magnetic coil 220, the limiting magnet 230, the heat dissipation ring 240, and the circuit board 260. The lower housing assembly 250 is provided with a through hole to allow the cable 270 to enter the cavity structure. The cable 270 is electrically connected to the circuit board 260.
[0049] like Figure 3 As shown, the upper housing assembly 210, the limiting magnet 230, and the lower housing assembly 250 have circular top views, while the magnetic coil 220 and the heat dissipation ring 240 have annular top views. In this embodiment, the top view shape of the lower housing assembly 250 is related to the shape of the wireless charger 200. The overall shape of the wireless charger 200 is cylindrical, and the shape of the lower housing assembly 250 is also cylindrical. The shapes of the upper housing assembly 210, the magnetic coil 220, the limiting magnet 230, the heat dissipation ring 240, and the lower housing assembly 250 can be other shapes.
[0050] The upper surface of the lower housing assembly 250 is provided with a groove structure. The upper housing assembly 210 is coupled to the outlet of the groove structure of the lower housing assembly 250, and a cavity structure is formed between the upper housing assembly 210 and the lower housing assembly 250. The cavity structure is used to house components such as the magnetic sheet coil 220, the limiting magnet 230, the heat sink ring 240, and the circuit board 260.
[0051] like Figure 3 As shown, the top view shape of the groove structure of the lower housing assembly 250 is circular. In other embodiments, the top view shape of the groove structure of the lower housing assembly 250 can also be rectangular, elliptical, polygonal, or other shapes. The radius of the groove structure of the lower housing assembly 250 is equal to or slightly larger than the radius of the upper housing assembly 210. The upper housing assembly 210 is disposed at the outlet of the groove structure of the lower housing assembly 250, and the upper housing assembly 210 is embedded in the groove structure of the lower housing assembly 250. The upper surface of the upper housing assembly 210 and the upper surface of the lower housing assembly 250 are on the same plane.
[0052] In one embodiment, the lower housing assembly 250 includes a side plate and a bottom plate. In this embodiment, the wireless charger 200 is cylindrical, the side plate of the lower housing assembly 250 is an annular cylinder, and the bottom plate of the lower housing assembly 250 is a circular flat plate. In other embodiments, the bottom plate of the lower housing assembly 250 has the same shape as the upper housing assembly 210.
[0053] During assembly, the bottom plate of the lower housing assembly 250 is fixed to a port on one side of the side plate of the lower housing assembly 250, forming a lower housing assembly 250 with a groove structure. The upper housing assembly 210 is fixed to a port on the other side of the side plate of the lower housing assembly 250. The upper housing assembly 210, the side plate of the lower housing assembly 250, and the bottom plate of the lower housing assembly 250 constitute a cavity structure. In this embodiment, the lower housing assembly 250 is divided into two parts: a bottom plate and a side plate. This allows for manufacturing as two separate components, reducing the manufacturing difficulty of the lower housing assembly 250.
[0054] Figures 5-6 This is a schematic diagram of the lower housing assembly of a wireless charger provided in an embodiment of this application. The groove structure of the lower housing assembly 250 of the wireless charger 200 provided in this embodiment of the application is provided with multiple supporting planes, which are respectively used to support multiple components in the upper housing assembly 210, magnetic coil 220, limiting magnet 230, heat dissipation ring 240 or circuit board 260.
[0055] The upper housing assembly 210, magnetic coil 220, limiting magnet 230, heat dissipation ring 240 or circuit board 260 respectively contact multiple support planes of the lower housing assembly 250, and transfer gas to the outside of the wireless charger 200 through the lower housing assembly 250 to improve the heat dissipation capacity of the wireless charger 200.
[0056] like Figure 5 As shown, the inner wall of the groove structure of the lower housing assembly 250 is provided with an upper housing support plane 251. The upper housing support plane 251 is close to the upper surface of the lower housing assembly 250 and close to the opening of the groove structure of the lower housing assembly 250. The upper housing support plane 251 is used to support the upper housing assembly 210.
[0057] In this embodiment, the depth of the upper housing support plane 251 refers to the distance between the upper housing support plane 251 and the upper surface of the lower housing assembly 250.
[0058] In one embodiment, the depth of the upper housing support plane 251 is equal to the thickness of the upper housing assembly 210. The upper housing support plane 251 supports the upper housing assembly 210, and the upper surface of the upper housing assembly 210 and the upper surface of the lower housing assembly 250 are on the same plane.
[0059] In other embodiments, the depth of the upper housing support plane 251 may be slightly greater than the thickness of the upper housing assembly 210. Correspondingly, an adhesive may be added between the upper housing assembly 210 and the upper housing support plane 251, with the upper surfaces of the upper housing assembly 210 and the lower housing assembly 250 lying on the same plane. This alignment of the upper surfaces of the upper housing assembly 210 and the lower housing assembly 250 results in a flat upper surface for the wireless charger 200, which facilitates support of the electronic device on the upper surface of the wireless charger 200.
[0060] In this embodiment, the width of the upper housing support plane 251 refers to the difference between the inner radius and the outer radius of the upper housing support plane 251. In one embodiment, the inner radius of the upper housing support plane 251 is smaller than the radius of the upper housing assembly 210. The upper housing assembly 210 is disposed in the groove structure of the lower housing assembly 250, and the upper housing support plane 251 supports the upper housing assembly 210. In one embodiment, the inner radius of the upper housing support plane 251 is larger than the outer radius of the magnetic sheet coil 220. The magnetic sheet coil 220 is disposed in the groove structure of the lower housing assembly 250, and the magnetic sheet coil 220 can pass through the upper housing support plane 251.
[0061] like Figure 5 As shown, the recessed structure of the lower housing assembly 250 can also be provided with a coil support plane 252. The coil support plane 252 is used to support the magnetic sheet coil 220. The coil support plane 252 is located between the upper housing support plane 251 and the bottom of the recessed structure of the lower housing assembly 250. The gap between the bottom of the recessed structure of the lower housing assembly 250 and the magnetic sheet coil 220 is used to accommodate the circuit board 260.
[0062] In this embodiment, the depth of the coil support plane 252 refers to the distance between the coil support plane 252 and the upper surface of the lower housing assembly 250. The depth of the coil support plane 252 is greater than or equal to the sum of the thickness of the magnetic sheet coil 220 and the thickness of the upper housing assembly 210.
[0063] In one embodiment, the distance between the coil support plane 252 and the upper housing support plane 251 is slightly greater than the thickness of the magnetic sheet coil 220. The upper housing assembly 210 and the magnetic sheet coil 220 are disposed in the groove structure of the lower housing assembly 250, and a gap exists between the upper housing assembly 210 and the magnetic sheet coil 220. The gap between the upper housing assembly 210 and the magnetic sheet coil 220 can be filled with thermally conductive colloid, and the upper housing assembly 210, the magnetic sheet coil 220, and the coil support plane 252 can form a longitudinal limiting structure. In addition, when the upper surface of the upper housing assembly 210 is deformed by an external force, the deformation of the upper housing assembly 210 will not compress the magnetic sheet coil 220, thus avoiding damage to the magnetic sheet coil 220.
[0064] In one embodiment, the distance between the coil support plane 252 and the upper housing support plane 251 is equal to the thickness of the magnetic sheet coil 220. Accordingly, the upper housing assembly 210, the magnetic sheet coil 220, and the coil support plane 252 can form a longitudinal limiting structure.
[0065] like Figure 6 As shown, the top view shape of the coil support plane 252 is a fan-shaped ring. In one embodiment, the fan angle corresponding to the coil support plane 252 is greater than or equal to 180°.
[0066] In this embodiment, the width of the coil support plane 252 refers to the difference between the inner radius and the outer radius of the coil support plane 252. The outer radius of the magnetic sheet coil 220 is greater than or equal to the inner radius of the coil support plane 252. In one embodiment, the outer radius of the coil support plane 252 is equal to the inner radius of the upper housing support plane 251. In one embodiment, the inner radius of the coil support plane 252 is greater than the outer radius of the heat dissipation ring 240, and the outer radius of the heat dissipation ring 240 is not greater than the inner radius of the magnetic sheet coil 220. The heat dissipation ring 240 can pass through the magnetic sheet coil 220 and the coil support plane 252. The magnetic sheet coil 220 is nested within the heat dissipation ring 240.
[0067] like Figure 6 As shown, the coil support plane 252 is composed of a fence-shaped support. The fence-shaped support is disposed at the bottom of the recessed structure of the lower housing assembly 250, and its upper surface forms the coil support plane 252. The fence-shaped support is fixedly connected to the bottom and inner wall of the recessed structure of the lower housing assembly 250. In one embodiment, the lower housing assembly 250 includes a fence-shaped support, which comprises an arc-shaped fence and multiple columnar fences. The arc-shaped fence is fixed to the bottom of the recessed structure of the lower housing assembly 250, and is parallel to the inner wall of the recessed structure. Multiple columnar fences are fixed to the bottom of the recessed structure of the lower housing assembly 250. Each columnar fence connects the inner wall of the recessed structure of the lower housing assembly 250 to the arc-shaped fence. The multiple columnar fences provide radial support to the arc-shaped fence. The heat dissipation ring 240 is installed in the groove structure of the lower housing assembly 250. Under the radial support force provided by the multiple columnar fences, the position of the coil support plane 252 will not change due to the compression of the heat dissipation ring 240.
[0068] In one embodiment, the arc-shaped fence and the columnar fence of the fence-shaped support are of the same height, so that the support plane of the coil support plane 252 is on the same plane. The magnetic sheet coil 220 is disposed on the coil support plane 252, which can avoid damage caused by uneven force on the magnetic sheet coil 220.
[0069] In one embodiment, multiple columnar fences may be equally spaced between the inner wall of the groove structure of the lower housing assembly 250 and the arc-shaped fence. In other embodiments, the multiple columnar fences may be arranged in other ways between the inner wall of the groove structure of the lower housing assembly 250 and the arc-shaped fence.
[0070] In one embodiment, multiple columnar fences are separated, and gaps are formed between the columnar fences, the arc-shaped fences, and the inner sidewalls of the groove structure of the lower housing assembly 250 for the use of thermally conductive adhesive. Accordingly, the heat generated by the magnetic coil 220 can be transferred to the lower housing assembly 250 not only through the fence-shaped support of the coil support plane 252, but also through the thermally conductive adhesive, thereby improving the heat dissipation capacity of the wireless charger 200.
[0071] The coil support plane 252 of the wireless charger 200 provided in this application embodiment is composed of a fence-shaped support, which can reduce the material used in manufacturing the lower housing assembly 250 and reduce the cost and weight of the wireless charger 200. In addition, the fence-shaped support of the coil support plane 252 can prevent watermarks from forming on the lower surface of the lower housing assembly 250, thus avoiding affecting the appearance of the wireless charger 200.
[0072] In this embodiment, the wireless charger 200 may further include a limiting magnet 230 and / or a heat dissipation ring 240. For example... Figure 5 As shown, the groove structure of the lower housing assembly 250 can also be provided with a magnet support plane 253. In this embodiment, the middle area of the bottom surface of the groove structure of the lower housing assembly 250 can serve as a support plane for the limiting magnet 230 and / or the heat dissipation ring 240, hereinafter referred to as the magnet support plane 253.
[0073] In this embodiment, the depth of the magnet support plane 253 refers to the depth of the groove structure of the lower housing assembly 250. In one embodiment, the lower surface of the upper housing assembly 210 is a plane, and the depth of the magnet support plane 253 is greater than the sum of the height of the limiting magnet 230 and the thickness of the upper housing assembly 210. In another embodiment, the lower surface of the upper housing assembly 210 has a protruding structure, and the depth of the magnet support plane 253 is greater than the sum of the height of the limiting magnet 230, the thickness of the upper housing assembly 210, and the height of the protruding structure on the lower surface of the upper housing assembly 210.
[0074] In one embodiment, the lower surface of the upper housing assembly 210 is a plane, and the depth of the magnet support plane 253 is greater than the sum of the height of the heat dissipation ring 240 and the thickness of the upper housing assembly 210.
[0075] In one embodiment, the lower surface of the upper housing assembly 210 has a raised structure, and the depth of the magnet support plane 253 is greater than the sum of the height of the heat dissipation ring 240, the thickness of the upper housing assembly 210, and the height of the raised structure on the lower surface of the upper housing assembly 210.
[0076] In other embodiments, the height of the limiting magnet 230 is different from the height of the heat dissipation ring 240, and the depth of the portion supporting the limiting magnet 230 in the magnet support plane 253 may be different from the depth of the portion supporting the heat dissipation ring 240.
[0077] In this embodiment, the limiting magnet 230 has a cylindrical structure, and the magnetic sheet coil 240 has a ring structure. The magnetic sheet coil 240 is disposed on the coil support plane 252. The limiting magnet 230 is disposed on the magnet support plane 253. At least a portion of the limiting magnet 253 passes through the ring structure of the magnetic sheet coil 240.
[0078] In one embodiment, the limiting magnet 230 and the heat dissipation ring 240 are installed in the groove structure of the lower housing assembly 250, and there are gaps between the upper housing assembly 210 and the limiting magnet 230, and between the upper housing assembly 210 and the heat dissipation ring 240. When the upper surface of the upper housing assembly 210 is deformed by an external force, the deformation of the upper housing assembly 210 will not compress the limiting magnet 230 and the heat dissipation ring 240, thus avoiding damage to them. In another embodiment, the gaps between the upper housing assembly 210 and the limiting magnet 230, and between the upper housing assembly 210 and the heat dissipation ring 240, can be filled with thermally conductive colloid to improve the heat dissipation efficiency of the wireless charger 200.
[0079] like Figure 6 As shown, the magnet support plane 253 is provided with an isolation plate 254 to define the positions of the limiting magnet 230 and the heat dissipation ring 240. In one embodiment, the limiting magnet 230 is disposed on the magnet support plane 253, and the limiting magnet 230 is located inside the isolation plate 254. In another embodiment, the heat dissipation ring 240 is disposed between the side of the fence-shaped support of the coil support plane 252 and the isolation plate 254. The isolation plate 254 between the limiting magnet 230 and the heat dissipation ring 240 can prevent the heat dissipation ring 240 from absorbing heat and increasing in volume, thus preventing the compressive force generated by the heat dissipation ring 240 from damaging the limiting magnet 230.
[0080] In this embodiment, the shape of the isolation plate 254 is related to the space reserved between the limiting magnet 230 and the heat dissipation ring 240, and can be elliptical, polygonal, or other shapes, which are not limited herein. In one embodiment, the top view shape of the limiting magnet 230 is circular, the top view shape of the heat dissipation ring 240 is annular, and the top view shape of the isolation plate 254 is annular. The inner radius of the isolation plate 254 is greater than or equal to the radius of the limiting magnet 230, and the outer radius of the isolation plate 254 is less than or equal to the inner radius of the heat dissipation ring 240. In one embodiment, the magnet support plane 253 is provided with an annular protrusion 254 for isolating the limiting magnet 230 and the heat dissipation ring 240. In another embodiment, the magnet support plane 253 is provided with an annular isolation plate 254 for isolating the limiting magnet 230 and the heat dissipation ring 240.
[0081] like Figure 4 As shown, the magnetic coil 220, the bottom of the groove structure of the lower housing assembly 250, the inner sidewall of the groove structure of the lower housing assembly 250, and the heat dissipation ring 240 form a storage cavity for storing the circuit board 260 and the cable 270. In this application, the top view shape of the storage cavity and the top view shape of the coil support plane 252 form a ring.
[0082] The bottom of the recessed structure of the lower housing assembly 250 forms a receiving cavity, namely the circuit board support plane 256. The circuit board support plane 256 is located at the bottom of the recessed structure of the lower housing assembly 250 and at the edge of the bottom of the recessed structure. The circuit board support plane 256 is used to support the circuit board 260. Figure 6 As shown, the circuit board support plane 256 is located at the bottom of the recessed structure of the lower housing assembly 250 and at the edge of the magnet support plane 253. In this application, the top view shape of the circuit board support plane 256 and the top view shape of the coil support plane 252 form a ring.
[0083] The inner wall of the recessed structure of the lower housing assembly 250 corresponding to the storage cavity is provided with a through hole 255. A wire groove 257 is provided at the bottom of the recessed structure of the lower housing assembly 250 corresponding to the storage cavity. The wire groove 257 is connected to the through hole 255. The wires of the circuit board 260 are connected to the external circuit through the wire groove 257 and the through hole 255.
[0084] In this embodiment, the depth of the circuit board support plane 256 refers to the distance between the plane containing the circuit board support plane 256 and the upper surface of the lower housing assembly 250. In one embodiment, the lower surface of the upper housing assembly 210 is a plane, and the depth of the circuit board support plane 256 is greater than the sum of the thickness of the upper housing assembly 210, the thickness of the magnetic coil 220, and the thickness of the circuit board 260.
[0085] In one embodiment, the lower surface of the upper housing assembly 210 has a raised structure, and the depth of the circuit board support plane 256 is greater than the sum of the thickness of the upper housing assembly 210, the height of the raised structure on the lower surface of the upper housing assembly 210, the thickness of the magnetic coil 220, and the thickness of the circuit board 260.
[0086] In one embodiment, the depth of the circuit board support plane 256 may be different from the depth of the magnet support plane 253.
[0087] In one embodiment, the height difference between the circuit board support plane 256 and the coil support plane 252 is equal to or slightly greater than the thickness of the circuit board 260. After the circuit board 260 and the magnetic sheet coil 220 are respectively disposed on the circuit board support plane 256 and the coil support plane 252, there is a gap between the circuit board 260 and the magnetic sheet coil 220 to prevent the compressive force generated by the magnetic sheet coil 220 from damaging the circuit board 260.
[0088] like Figure 6 As shown, the lower housing assembly 250 is provided with a through hole 255. A cable 270 can pass through the through hole 255 into the recessed structure of the lower housing assembly 250. The cable 270 can be electrically connected to the circuit board 260, allowing the circuit board 260 to provide power to the wireless charger 200. In this application, the through hole 255 is located on the inner sidewall of the recessed structure of the lower housing assembly 250, and is situated within the portion of the inner sidewall of the recessed structure that forms the receiving cavity. In other embodiments, the through hole 255 can be circular, elliptical, or other shapes; this application does not limit its shape.
[0089] like Figure 6 As shown, the circuit board support plane 256 is provided with a wire groove 257. In this application, the through hole 255 is located at the bottom of the recessed structure of the lower housing assembly 250, and is located in the part of the recessed structure of the lower housing assembly 250 that forms a receiving cavity. The wire groove 257 is connected to the through hole 255, and the wires of the circuit board 260 are connected to the external circuit through the wire groove 257 and the through hole 255. Normally, the circuit board 260 is an independent component. The circuit board 260 is electrically connected to the cable 270, and the cable 270 is soldered to the end point on the surface of the circuit board 260, which will cause a protrusion on the surface of the circuit board 260. The circuit board 260 is disposed on the circuit board support plane 256, and the protrusion of the circuit board 260 and the cable 270 are embedded in the wire groove 257, so that the circuit board 260 is better disposed on the circuit board support plane 256.
[0090] In one embodiment, the center of the through-hole 255 and the center of the wire groove 257 are aligned. In another embodiment, the center of the through-hole 255 and the center of the wire groove 257 are not aligned, requiring the cable 270 to be bent so that the circuit board 260 can be mounted on the circuit board support plane 256. Bending the cable 270 makes it prone to breakage, reducing the reliability of the wireless charger 200. Alternatively, even if the center of the through-hole 255 and the center of the wire groove 257 are not aligned, the distance between the extended center line of the through-hole 255 and the extended center line of the wire groove 257 can be less than a set threshold. The set threshold is the maximum range within which the cable 270 is less likely to break.
[0091] In this embodiment, the lower housing assembly 250 is provided with an upper housing support plane 251, a coil support plane 252, a magnet support plane 253, a circuit board support plane 256, etc. The upper housing support plane 251 supports the upper housing assembly 210. The coil support plane 252 supports the magnetic coil 220. The magnet support plane 253 supports the limiting magnet 230 and the heat dissipation ring 240. The circuit board support plane 256 supports the circuit board 260. The multiple support planes of the wireless charger 200 support each component in different positions, preventing the components from stacking together. If the wireless charger 200 is subjected to external force, all stacked components will be damaged, thereby reducing the reliability of the wireless charger 200.
[0092] Furthermore, the magnetic sheet coil 220 and the heat dissipation ring 240 have annular shapes when viewed from above, and the limiting magnet 230 has a circular shape when viewed from above. Constrained by the coil support plane 252 and the magnet support plane 253, the magnetic sheet coil 220, the limiting magnet 230, and the heat dissipation ring 240 can be nested together, improving the integration of each component and facilitating the miniaturization of the wireless charger 200. Correspondingly, the inner wall of the groove structure of the lower housing assembly 250 and the heat dissipation ring 240 constitute a lateral limiting structure for the magnetic sheet coil 220, which can improve the structural stability of the wireless charger 200.
[0093] Figure 7 This is a schematic diagram of the upper housing assembly of a wireless charger provided in an embodiment of this application. The upper housing assembly 210 is part of the outer shell of the wireless charger 200. During wireless charging, the upper surface of the upper housing assembly 210 contacts the lower surface of the electronic device 100. In this embodiment, the top view shape of the upper housing assembly 210 is related to the shape of the wireless charger 200. In one embodiment, the wireless charger 200 is cylindrical, and the top view shape of the upper housing assembly 210 is circular.
[0094] like Figure 7As shown, the upper surface of the upper housing assembly 210 is flat around its perimeter, and a groove structure 211 is provided in the center of the upper surface of the upper housing assembly 210. The groove structure 211 of the upper housing assembly 210 is used to support the electronic device 100 and limit the position of the electronic device 100. The bottom of the groove structure 211 of the upper housing assembly 210 is flat.
[0095] An electronic device 100 is disposed on a wireless charger 200, and a protruding structure on the lower surface of the electronic device 100 is embedded in a recessed structure on the upper surface of the upper housing assembly 210. The contact between the lower surface of the electronic device 100 and the upper surface of the upper housing assembly 210 reduces the distance between the wireless charging coil of the electronic device 100 and the coil assembly 222 of the wireless charger 200, thereby reducing power loss in the wireless charger. In other embodiments, the upper surface of the upper housing assembly 210 may be planar.
[0096] like Figure 7 As shown, the groove structure 211 of the upper housing assembly 210 is shaped like a frustum. In one embodiment, the groove structure of the upper housing assembly 210 is shaped like a frustum cylinder. The bottom radius of the groove structure 211 of the upper housing assembly 210 is smaller than the radius of the opening of the groove structure 211. In other embodiments, the groove structure 211 of the upper housing assembly 210 may also be cylindrical, cuboid, or other shapes, which are not limited herein.
[0097] The wireless charger 200 provided in this application embodiment has a groove structure 211 on its upper housing assembly 210. The groove structure 211 on the upper surface of the upper housing assembly 210 can couple with the protruding structure of the electronic device 100, which can shorten the distance between the electronic device 100 and the wireless charger 200 and reduce the power loss of wireless charging. In addition, the groove structure 211 on the upper surface of the upper housing assembly 210 can increase the surface area of the upper surface of the wireless charger 200 and increase the contact area between the wireless charger 200 and the electronic device 100, thereby improving the heat dissipation efficiency of the wireless charger 200.
[0098] Furthermore, during wireless charging, the electronic device 100 is positioned on the upper surface of the upper housing assembly 210 of the wireless charger 200. The protruding structure of the electronic device 100 is embedded in the recessed structure 211 of the upper housing assembly 210, allowing the protruding structure of the electronic device 100 to contact the recessed structure 211. The periphery of the upper surface of the upper housing assembly 210 contacts the lower surface of the electronic device 100. Heat from the electronic device 100 is transferred to the outer casing of the wireless charger 200, increasing the heat dissipation area of the electronic device 100 and accelerating the temperature reduction of the electronic device 100.
[0099] like Figure 7As shown, the lower surface of the upper housing assembly 210 may also be provided with a frustum-shaped protrusion 212. The lower surface of the upper housing assembly 210 refers to the surface of the upper housing assembly 210 that constitutes the cavity structure. In other embodiments, the shape of the protrusion 212 of the upper housing assembly 210 may also be cylindrical, cuboid, or other shapes, which are not limited herein.
[0100] In one embodiment, the protrusion 212 is disposed at the middle position of the lower surface of the upper housing assembly 210. The upper housing assembly 210 and the lower housing assembly 250 form a cavity structure, and the top of the protrusion 22212 of the upper housing assembly 210 is coupled to at least one of the limiting magnet 230 and the heat dissipation ring 240.
[0101] In one embodiment, the upper housing assembly is made of a material with high thermal conductivity. The top of the protrusion 212 of the upper housing assembly 210 is coupled to at least one of the limiting magnet 230 and the heat dissipation ring 240, and the upper housing assembly 210 conducts heat from the electronic device 100 to the lower housing assembly 250 through the heat dissipation ring 240 and the limiting magnet 230.
[0102] In one embodiment, the protrusion 212 of the upper housing assembly 210 is shaped like a frustum cylinder. The bottom radius of the protrusion 212 of the upper housing assembly 210 is greater than the top radius of the protrusion 212 of the upper housing assembly 210.
[0103] In one embodiment, the top of the protrusion 212 of the upper housing assembly 210 has a circular top view shape. The heat dissipation ring 240 has an annular top view shape. The radius of the top of the protrusion 212 of the upper housing assembly 210 is greater than or equal to the outer radius of the heat dissipation ring 240.
[0104] In one embodiment, the bottom of the protrusion 212 of the upper housing assembly 210 has a circular shape in plan view. The magnetic coil 220 has an annular shape in plan view. The radius of the bottom of the protrusion 212 of the upper housing assembly 210 is smaller than the inner radius of the magnetic coil 220.
[0105] In one embodiment, the thickness of the upper housing assembly 210 is less than the difference between the depth of the groove structure of the lower housing assembly 250 and the height of the limiting magnet 230. Alternatively, the thickness of the upper housing assembly 210 is less than the difference between the depth of the groove structure of the lower housing assembly 250 and the height of the heat dissipation ring 240.
[0106] like Figure 7As shown, the lower surface of the upper housing assembly 210 is also provided with an annular groove 213. The annular groove 213 is located around the protrusion 212 of the upper housing assembly 210 and is used to nest the magnetic sheet coil 220. The lower surface of the annular groove of the upper housing assembly 210 is coupled to the upper surface of the magnetic sheet coil 220. The upper surface of the magnetic sheet coil 220 is the surface of the magnetic sheet coil 220 close to the upper housing assembly 210.
[0107] In one embodiment, the annular groove 213 of the upper housing assembly 210 has a circular shape when viewed from above. The magnetic coil 220 also has a circular shape when viewed from above. The outer radius of the annular groove 213 of the upper housing assembly 210 is larger than the outer radius of the magnetic coil 220. The inner radius of the annular groove 213 of the upper housing assembly 210 is smaller than the inner radius of the magnetic coil 220.
[0108] In one embodiment, the height of the upper housing assembly 210 is greater on the inner side of the annular groove 213 than on the outer side of the annular groove 213.
[0109] The magnetic sheet coil 220 is used to convert electrical energy into wireless power signals. The magnetic sheet coil 220 is mounted on the coil support plane 252 of the lower housing assembly 250. During wireless charging, after converting electrical energy into wireless power signals, the magnetic sheet coil 220 radiates the wireless power signals along a predetermined direction.
[0110] Figure 8 This is a schematic diagram of the magnetic coil structure of a wireless charger provided in an embodiment of this application. Figure 8 As shown, the magnetic sheet coil 220 includes a magnetic sheet assembly 221 and a coil assembly 222. In this embodiment, the magnetic sheet assembly 221 is an annular cylinder. An annular groove is provided on the upper surface of the magnetic sheet assembly 221 for receiving the coil assembly 222. The opening of the annular groove points towards the upper housing assembly 210.
[0111] As shown in Figure 8, the annular groove of the magnetic sheet assembly 221 has a circular shape when viewed from above. The coil assembly 222 is disposed in the annular groove of the magnetic sheet assembly 221. The coil assembly 222 also has a circular shape when viewed from above. In this embodiment, the magnetic sheet assembly 221, the annular groove, and the coil assembly 222 are all circularly annular with the same center when viewed from above.
[0112] During the assembly of the magnetic sheet coil 220, the coil assembly 222 is bent into the shape of the annular groove of the magnetic sheet assembly 221. Then, the assembler places the coil assembly 222 into the annular groove of the magnetic sheet assembly 221. Finally, the assembler adds adhesive or thermally conductive colloid to the annular groove of the magnetic sheet assembly 221 to fix the coil assembly 222 in place. In this embodiment, fixing the coil assembly 222 within the annular groove of the magnetic sheet assembly 221 prevents changes in the shape and position of the coil assembly 222, which could lead to changes in the position and charging power of the wireless charger 200, thus reducing the stability of the wireless charger 200.
[0113] In this embodiment, the magnetic sheet assembly 221 is made of a magnetic material with low electrical conductivity. The coil assembly 222 is disposed in the annular groove of the magnetic sheet assembly 221. The magnetic sheet assembly 221 can shield the wireless power signals radiated by the coil assembly 222 to the central region, thereby preventing the limiting magnet 240 disposed in the middle of the annular structure of the magnetic sheet coil 220 from generating eddy currents. This not only improves the power conversion efficiency of the wireless charger 200, but also slows down the temperature rise rate inside the wireless charger 200.
[0114] In one embodiment, the inner radius of the magnetic sheet assembly 221 is greater than or equal to the outer radius of the heat dissipation ring 240, so that the heat dissipation ring 240 can pass through the magnetic sheet assembly 221 and be mounted on the magnet support plane 253.
[0115] In one embodiment, the inner radius of the magnetic sheet assembly 221 is greater than or equal to the radius of the protrusion structure 213 of the upper housing assembly 210, so that the protrusion structure 213 of the upper housing assembly 210 can contact the limiting magnet 230 and the heat dissipation ring 240.
[0116] In one embodiment, the outer radius of the magnetic sheet assembly 221 is less than or equal to the outer radius of the coil support plane 252 of the lower housing assembly 250, so that the magnetic sheet assembly 221 can be disposed on the coil support plane 252 of the lower housing assembly 250.
[0117] In one embodiment, the thickness of the magnetic sheet assembly 221 is less than or equal to the distance between the upper housing support plane 251 and the coil support plane 252 of the lower housing assembly 250, so that the magnetic sheet assembly 221 is disposed in the coil support plane 252 of the lower housing assembly 250, thereby avoiding affecting the upper housing assembly 210 being fixed on the upper housing support plane 251 of the lower housing assembly 250.
[0118] In this embodiment, the top-view cross-sectional area of the opening of the annular groove of the magnetic sheet assembly 221 is smaller than the top-view cross-sectional area of the bottom of the annular groove of the magnetic sheet assembly 221. Alternatively, the top-view cross-sectional area of the opening of the annular groove of the magnetic sheet assembly 221 is smaller than the top-view cross-sectional area at any position between the opening of the annular groove of the magnetic sheet assembly 221 and the bottom of the annular groove of the magnetic sheet assembly 221.
[0119] like Figure 9 As shown, the outer and inner wall surfaces of the annular groove of the magnetic sheet assembly 221 are inclined, making the annular groove of the magnetic sheet assembly 221 a truncated ring with a small opening and a large bottom. The coil assembly 222 is disposed in the annular groove of the magnetic sheet assembly 221, and the magnetic conductive material is wrapped around the coil assembly 222 as much as possible. The magnetic sheet coil 220 is installed in the wireless charger 200, and the opening of the annular groove of the magnetic sheet assembly 221 faces the upper housing assembly 210. When the wireless charger 200 performs wireless charging, the wireless power signal generated by the coil assembly 222 will only radiate the wireless power signal in the direction of the electronic device 100, thereby improving the power conversion efficiency of the wireless charger 200.
[0120] In other embodiments, the annular groove of the magnetic sheet assembly 221 can be a circular cylinder or other shapes. When the annular groove of the magnetic sheet assembly 221 is a circular cylinder, the outer wall surface of the annular groove is parallel to the outer wall surface of the magnetic sheet assembly 221, and the inner wall surface of the annular groove is parallel to the inner wall surface of the magnetic sheet assembly 221.
[0121] For example, electronic device 100 is an electronic watch. The middle region of the charging coil of electronic device 100 typically houses components such as a heart rate detection module and a temperature detection module. When electronic device 100 is wirelessly charged, these components are located in the middle region of the coil assembly 222 of the wireless charger 200. In the wireless charger 200 provided in this embodiment, the annular groove of the magnetic coil 220 can wrap around the coil assembly 22, limiting the direction of the wireless power signal radiated by the coil assembly 222 and preventing the vortices generated by the coil assembly 222 from affecting the heart rate detection module, temperature detection module, and other components of electronic device 100.
[0122] like Figure 8As shown, the magnetic sheet assembly 221 and its annular groove have a circular shape when viewed from above. In one embodiment, the ratio between the outer radius and the inner radius of the annular groove of the magnetic sheet assembly 221 is greater than 1.9. In another embodiment, the ratio is greater than 1.7. The smaller the ratio between the inner and outer radii of the annular groove of the magnetic sheet assembly 221 in the wireless charger 200 provided in this application, the wider the top-view shape of the annular groove of the magnetic sheet assembly 221 becomes, and the larger the top-view area of the coil assembly 222 housed in the annular groove of the magnetic sheet assembly 221, thus increasing the wireless charging area of the wireless charger 200. With the increased width of the annular groove of the magnetic sheet assembly 221, the more turns of the coil assembly 222 housed in the annular groove of the magnetic sheet assembly 221, the higher the wireless charging power of the wireless charger 200. The greater the depth of the annular groove of the magnetic sheet assembly 221, the more turns of the coil assembly 222 can be accommodated in the annular groove of the magnetic sheet assembly 221, and the higher the charging power of the wireless charger 200.
[0123] In one embodiment, the lower surface of the upper housing assembly 210 is a plane, and the heights of the magnetic sheet assemblies 221 on both sides of the annular groove of the magnetic sheet assembly 221 can be the same. The direction of the wireless power signal radiated outward by the magnetic sheet coil 220 is an upward direction perpendicular to the upper surface of the magnetic sheet coil 220.
[0124] In one embodiment, the lower surface of the upper housing assembly 210 has a protrusion structure 212, and the heights of the magnetic sheet assemblies 221 on both sides of the annular groove of the magnetic sheet assembly 221 may be different. The height of the magnetic sheet assembly 221 on the inner side of the annular groove is lower than the height of the magnetic sheet assembly 221 on the outer side of the annular groove. In other embodiments, the lower surface of the upper housing assembly 210 is provided with an annular groove 213. The annular groove 213 on the lower surface of the upper housing assembly 210 is located around the protrusion structure 212. During assembly, when the upper housing assembly 210 is mounted on the upper housing support plane 251, the magnetic sheet assembly 221 is embedded in the annular groove 213 on the lower surface of the upper housing assembly 210. In this embodiment, providing an annular groove 213 on the lower surface of the upper housing assembly 210 can increase the depth of the annular groove of the magnetic sheet assembly 221, thereby increasing the charging power of the wireless charger 200.
[0125] like Figure 8As shown, the magnetic sheet assembly 221 has multiple notches. Exemplarily, the magnetic sheet assembly 221 has notches 2211 and 2212. Notch 2211 defines the orientation of the magnetic sheet coil 220 mounted on the coil support plane 252. In this embodiment, the magnetic sheet assembly 221 is shaped like an annular cylinder, and notch 2211 is located on the magnetic sheet assembly 221 outside the annular groove. Correspondingly, a protrusion is provided on the outer edge of the coil support plane 252. The shape of the protrusion on the coil support plane 252 matches the shape of the notch 2211 in the magnetic sheet assembly 221. The magnetic sheet coil 220 is mounted on the coil support plane 252, and the notch 2211 of the magnetic sheet assembly 221 is coupled to the protrusion of the coil support plane 252. The notch 2211 of the magnetic sheet assembly 221 can limit the orientation of the magnetic sheet coil 220 mounted on the coil support plane 252, preventing the magnetic sheet coil 220 from rotating within the wireless charger 2000. In other embodiments, the positioning portion 2211 provided on the magnetic sheet assembly 221 can also be other structures, such as a protrusion structure, a snap-fit, etc.
[0126] The notch 2212 is located on the outer side of the annular groove of the magnetic sheet assembly 221. The circuit board 260 is generally located at the bottom of the magnetic sheet assembly 221 to prevent the coil assembly 222 from generating vortices on the circuit board 260. Both ends of the coil assembly 222 pass through the wire groove 2212 and are soldered to the ports of the circuit board 260. In other embodiments, the notch 2212 is located on the inner side of the annular groove of the magnetic sheet assembly 221. The notch 2211 and notch 2212 can be the same notch.
[0127] In this embodiment, the magnetic sheet assembly 221 of the magnetic sheet coil 220 can replace the limiting magnet 230. In one embodiment, the N pole of the limiting magnet of the electronic device 100 faces upward and the S pole faces downward. After the magnetic sheet assembly 221 is magnetized, the N pole of the magnetic sheet assembly 221 faces upward and the S pole faces downward. In another embodiment, the S pole of the limiting magnet of the electronic device 100 faces upward and the N pole faces downward. After the magnetic sheet assembly 221 is magnetized, the S pole of the magnetic sheet assembly 221 faces upward and the N pole faces downward. The electronic device 100 is disposed on the upper housing assembly 210 of the wireless charger 200. Through the limitation of the electronic device 100 and the limiting magnet of the wireless charger 200, the electronic device 100 is attached to a predetermined position on the upper housing assembly 210 of the wireless charger 200.
[0128] Figure 10 This is a schematic diagram illustrating the structure of an electronic device 100 and its wireless charger 200, provided in an embodiment of this application. The electronic device 100 can be a watch, mobile phone, earphones, tablet, or computer, etc. The charger 200 can be a portable wireless charger or a car wireless charger, etc. For ease of description of the charging coil and limiting magnet of the electronic device 100 or charger 200, Figure 10Other circuits or structures of the electronic device 100 and the wireless charger 200 are omitted.
[0129] like Figure 10 As shown, the electronic device 100 includes a wireless charging coil 110 and a limiting magnet 120. The wireless charger 200 includes a magnetic sheet coil 220. The magnetic sheet coil 220 includes a magnetic sheet assembly 221 and a coil assembly 222. The coil assembly 222 is disposed in an annular groove of the magnetic sheet assembly 221. The opening of the annular groove of the magnetic sheet assembly 221 faces upward.
[0130] like Figure 10 As shown, the wireless charger 200 is horizontally placed on a desktop, and the electronic device 100 is stacked on top of the wireless charger 200. The limiting magnet 120 of the electronic device 100 matches the magnetic sheet assembly 221 of the wireless charger 200, restricting the electronic device 100 to a predetermined position on the upper surface of the wireless charger 200. The charging coil 110 of the electronic device 100 can be wirelessly charged after matching with the coil assembly 222 of the wireless charger 200.
[0131] Figure 11 This is a schematic diagram of the structure of a limiting magnet for a wireless charger provided in this application embodiment. The limiting magnet 230 of the wireless charger provided in this application embodiment can be composed of a single magnet, such as a cylindrical magnet, a ring-shaped cylindrical magnet, etc. The limiting magnet 230 can also be composed of multiple magnets, such as a cylindrical magnet and multiple ring-shaped cylindrical magnets joined together to form a single cylindrical magnet.
[0132] like Figure 11 As shown, the limiting magnet 230 includes a first magnet 231 and a second magnet 232. The first magnet 231 and the second magnet 232 are disposed adjacent to each other on the same surface. The first magnet 231 has a cylindrical structure, and its top-view cross-section is circular. The second magnet 232 has an annular cylindrical structure, and its top-view cross-section is annular. The inner radial dimension of the second magnet 232 is greater than or equal to the radial dimension of the first magnet 231. The first magnet 231 is disposed inside the second magnet 232.
[0133] In this embodiment, the N pole of the first magnet 231 faces upward and the S pole faces downward. The N pole of the second magnet 232 faces the inner side of the ring, and the S pole faces the outer side of the ring. The magnetic fields of the first magnet 231 and the second magnet 232 reinforce each other on the upper side of the limiting magnet 230, enhancing the magnetic attraction between the upper side of the wireless charger 200 and the lower side of the electronic device 100. This better defines the contact position between the electronic device 100 and the wireless charger 200, facilitating the matching of the charging coil of the electronic device 100 and the charging coil of the wireless charger 200, thereby improving the convenience of wireless charging. The magnetic fields of the first magnet 231 and the second magnet 232 weaken each other on the lower side of the limiting magnet 230, reducing the magnetic field strength on the lower side of the limiting magnet 230. This not only reduces the influence of the limiting magnet 230 on other magnetically sensitive devices in the wireless charger 200, but also eliminates or reduces the use of soft magnetic materials, which is beneficial for the heat dissipation and miniaturization of the wireless charger 200.
[0134] like Figure 12 As shown, the second magnet 232 includes multiple permanent magnet modules, which are spliced together to form a ring-shaped cylindrical structure. In this embodiment, the top view cross-section of the multiple permanent magnet modules in the second magnet 232 is arc-shaped. The permanent magnet modules can be sector magnets with an angle of 360° / M. M is the number of permanent magnet modules spliced together to form a ring-shaped permanent magnet, and is greater than or equal to 2. In some embodiments, the top view cross-section of the permanent magnet modules can also be a polygon such as a triangle or quadrilateral. Depending on the internal space of the charger 200, the limiting magnet 230 can select permanent magnet modules of various shapes, thereby improving the applicability of the limiting magnet 230.
[0135] In some embodiments, the first magnet 231 of the limiting magnet 230 may include multiple permanent magnet modules, which are assembled to form a cylindrical structure. In some embodiments, the second magnet 232 of the limiting magnet 230 may include only one annular cylindrical permanent magnet module. In some embodiments, the first magnet 231 and the second magnet 232 of the limiting magnet 230 each include multiple permanent magnet modules. That is, the multiple permanent magnets in the limiting magnet 230 may each include one or more permanent magnet modules.
[0136] In one embodiment, the magnetic field direction inside the first magnet 231 is perpendicular to the surface, and the magnetic field direction inside the second magnet 232 is parallel to the surface. The magnetic field direction inside the first magnet 231 is perpendicular to the magnetic field direction inside the second magnet 232.
[0137] In one embodiment, the magnetic field direction inside the first magnet 231 is parallel to the surface, and the magnetic field direction inside the second magnet 232 is perpendicular to the surface. The magnetic field direction inside the first magnet 231 is perpendicular to the magnetic field direction inside the second magnet 232.
[0138] In one embodiment, the top-view cross-sectional shape of the first magnet 231 is either circular or polygonal, and the top-view cross-sectional shape of the second magnet 232 is annular. The annular shape includes circular rings and polygonal rings.
[0139] In one embodiment, the first magnet 231 and the second magnet 232 are fixedly connected.
[0140] In one embodiment, the first magnet 231 and the second magnet 232 are respectively fixed to the surface.
[0141] Figure 13 This is a schematic diagram of the structure of a limiting magnet provided in an embodiment of this application. Figure 13 As shown, the limiting magnet 230 includes a first component 231 and a second component 232. The first component 231 and the second component 232 are disposed on the same surface along a first direction. That is, the first component 231 and the second component 232 are disposed on the same surface along a horizontal direction. The first component 231 has a ring-shaped cross-section in plan view, and the second component 232 has a cylindrical structure. The inner radial dimension of the first component 231 is greater than or equal to the radial dimension of the second component 232. The second component 232 is disposed inside the first component 231. In one embodiment, the first component 231 and the second component 232 can be fixedly connected to form an integral structure. In other embodiments, the first component 231 and the second component 232 can be fixed to the same surface respectively, and there can be a gap or filling material between the first component 231 and the second component 232.
[0142] The first component 231 includes a first magnet 231-1 and a second magnet 231-2. The second component 232 includes a second component 232. The first magnet 231-1 and the second magnet 231-2 are stacked along a second direction. That is, the first magnet 231-1 and the second magnet 231-2 are stacked perpendicular to the surface. The top-view cross-section of both the first magnet 231-1 and the second magnet 231-2 is annular. In one embodiment, the first magnet 231-1 and the second magnet 231-2 can be fixedly connected to form an integral structure. In other embodiments, the first magnet 231-1 and the second magnet 231-2 can be fixed to the side of the second component 232 respectively, and there can be gaps or filling material between the first magnet 231-1 and the second magnet 231-2.
[0143] In this embodiment, the S pole of the first magnet 231-1 faces the inner side of the ring, and the N pole faces the outer side of the ring. The N pole of the second magnet 231-2 faces the inner side of the ring, and the S pole faces the outer side of the ring. The S pole of the second component 232 faces upward, and the N pole faces downward. The S poles of the first magnet 231-1 and the S pole of the second component 232 reinforce each other on the upper side of the magnetic attraction device 500, thereby enhancing the magnetic field strength on the upper side of the magnetic attraction device 500.
[0144] In one embodiment, the first component 231 may contain two or more magnets. The second component 232 may contain two or more magnets.
[0145] In one embodiment, the magnetic field direction inside the magnet of the first component 231 is perpendicular to the surface, and the magnetic field direction inside the magnet of the second component 232 is parallel to the surface. The magnetic field direction inside the magnet of the first component 231 is perpendicular to the magnetic field direction inside the magnet of the second component 232.
[0146] In one embodiment, the magnetic field direction inside the magnet of the first component 231 is parallel to the surface, and the magnetic field direction inside the magnet of the second component 232 is perpendicular to the surface. The magnetic field direction inside the magnet of the first component 231 is perpendicular to the magnetic field direction inside the magnet of the second component 232.
[0147] In one embodiment, the top view cross-sectional shape of the magnet of the first component 231 is either circular or polygonal, and the top view cross-sectional shape of the magnet of the second component 232 is annular. The annular shape includes circular rings and polygonal rings.
[0148] In one embodiment, the magnet in the first component 231 is fixedly connected to the magnet in the second component 232.
[0149] In one embodiment, the magnet in the first component 231 and the magnet in the second component 232 are respectively fixed to the surface.
[0150] In one embodiment, the magnet in the first component 231 is composed of one or more sub-magnet modules. The magnet in the second component 232 is composed of one or more sub-magnet modules.
[0151] The positional relationships between the magnetic coil 220, the limiting magnet 230, and the heat sink ring 240 in the wireless charger 200 provided in this application embodiment are not limited to... Figure 3 The positional relationship shown can also be other positional relationships. For example, Figures 14-16 This is a schematic diagram showing the positional relationship between the magnetic coil, the limiting magnet, and the heat dissipation ring of a wireless charger provided in this application embodiment.
[0152] like Figure 14As shown, the wireless charger 200 includes a magnetic coil 220, a limiting magnet 230, and a heat dissipation ring 240. The magnetic coil 220 has a ring-shaped top view. The limiting magnet 230 has a ring-shaped top view. The heat dissipation ring 240 has a circular or ring-shaped top view. In this case, the outer radius of the magnetic coil 220 is less than or equal to the inner radius of the coil support plane 252 of the lower housing assembly 250. The outer radius of the limiting magnet 230 is less than or equal to the inner radius of the magnetic coil 220. The inner radius of the limiting magnet 230 is greater than or equal to the outer radius of the magnetic coil 220. The height of the limiting magnet 230 is the same as the height of the heat dissipation ring 240, or the height of the limiting magnet 230 is different from the height of the heat dissipation ring 240.
[0153] A magnetic sheet coil 220 is disposed on the coil support plane 252 of the lower housing assembly 250. A heat dissipation ring 240 is embedded in the annular structure of the magnetic sheet coil 220 and fixed to the magnet support plane 253 of the lower housing assembly 250. A limiting magnet 230 is embedded in the heat dissipation ring 240 and fixed to the magnet support plane 253 of the lower housing assembly 250. Accordingly, the heat dissipation ring 240 is nested between the limiting magnet 230 and the magnetic sheet coil 220. In one embodiment, the gap between the heat dissipation ring 240, the limiting magnet 230, and the magnetic sheet coil 220 can be filled with thermally conductive adhesive to improve the heat dissipation efficiency of the wireless charger 200.
[0154] like Figure 15 As shown, the wireless charger 200 includes a magnetic sheet coil 220, a limiting magnet 230, and a heat dissipation ring 240. The magnetic sheet coil 220 has a ring-shaped top view. The limiting magnet 230 has a ring-shaped top view. The heat dissipation ring 240 has a circular or ring-shaped top view. In this configuration, the outer radius of the magnetic sheet coil 220 is less than or equal to the inner radius of the coil support plane 252 of the lower housing assembly 250. The outer radius of the limiting magnet 230 is less than or equal to the inner radius of the magnetic sheet coil 220. The inner radius of the limiting magnet 230 is greater than or equal to the outer radius of the heat dissipation ring 240. The height of the magnetic sheet coil 220 is the same as the height of the limiting magnet 230.
[0155] During the assembly of the wireless charger 200, the magnetic sheet coil 220 is disposed on the coil support plane 252 of the lower housing assembly 250. The limiting magnet 230 is embedded in the magnetic sheet coil 220 and fixed to the coil support plane 252 of the lower housing assembly 250. The heat dissipation ring 240 is embedded in the limiting magnet 230 and fixed to the magnet support plane 253 of the lower housing assembly 250.
[0156] like Figure 16As shown, the wireless charger 200 includes a magnetic sheet coil 220, a limiting magnet 230, and a heat dissipation ring 240. The magnetic sheet coil 220 has a ring-shaped top view. The limiting magnet 230 has a ring-shaped top view. The heat dissipation ring 240 has a circular or ring-shaped top view. In this case, the outer radius of the limiting magnet 230 is less than or equal to the inner radius of the coil support plane 252 of the lower housing assembly 250. The outer radius of the magnetic sheet coil 220 is less than or equal to the inner radius of the limiting magnet 230. The inner radius of the magnetic sheet coil 220 is greater than or equal to the outer radius of the heat dissipation ring 240. The height of the magnetic sheet coil 220 is the same as the height of the limiting magnet 230.
[0157] During the assembly of the wireless charger 200, the limiting magnet 230 is fixed to the coil support plane 252 of the lower housing assembly 250. The magnetic sheet coil 220 is embedded in the limiting magnet 230 and fixed to the coil support plane 252 of the lower housing assembly 250. The heat dissipation ring 240 is embedded in the magnetic sheet coil 220 and fixed to the magnet support plane 253 of the lower housing assembly 250.
[0158] The circuit board 260 of the wireless charger 200 provided in this embodiment may include an AC / DC converter, a protection circuit, and other circuits. The AC / DC converter converts AC power to DC power or vice versa. The protection circuit keeps the wireless charger 200 in an open-circuit state when a short circuit occurs. In this embodiment, the input terminal of the circuit board 260 is electrically connected to the cable 270, and the output terminal of the circuit board 260 is electrically connected to the coil assembly 222 of the magnetic coil 220. In this embodiment, the circuit board 260 may also be referred to as a printed circuit board assembly (PCBA).
[0159] like Figure 4 As shown, the circuit board 260 is disposed in the receiving cavity of the lower housing assembly 250. In this embodiment, the distance between the plane containing the circuit board support plane 256 and the plane containing the coil support plane 253 is greater than the thickness of the circuit board 260.
[0160] In one embodiment, a magnetic sheet coil 220 is disposed on a coil support plane 252 of the lower housing assembly 250, and a circuit board 260 is disposed on a circuit board support plane 256 of the lower housing assembly 250. A gap exists between the upper surface of the circuit board 260 and the lower surface of the magnetic sheet coil 220. When the upper surface of the magnetic sheet coil 220 is deformed by an external force, the deformation of the magnetic sheet coil 220 will not compress the circuit board 260, thus avoiding damage to the circuit board 260.
[0161] In one embodiment, the magnetic sheet coil 220 is disposed on the coil support plane 252 of the lower housing assembly 250, and the circuit board 260 is fixed to the lower surface of the magnetic sheet coil 220 by an adhesive, thereby improving the stability of the circuit board 260.
[0162] Figure 17 This is a schematic diagram of a limiting magnet and shielding component of a wireless charger provided in an embodiment of this application. In this embodiment, the wireless charger 200 also includes a shielding component 280. The shielding component 280 is made of a highly conductive material, such as copper or aluminum. The thickness of the shielding component 280 is greater than the skin depth. The skin depth refers to the thickness at which most of the charge resides when it propagates within a conductor. If the thickness of the shielding component 280 is less than the skin depth, the shielding component 280 cannot effectively isolate wireless power signals.
[0163] The shape of the shielding component 280 is related to the shape of the limiting magnet 230. In one embodiment, the limiting magnet 230 is cylindrical, and the shielding component 280 is a hollow cylinder, an annular cylinder, or the like. In another embodiment, the limiting magnet 230 is a frustum-shaped cylinder, and the shielding component 280 is a hollow frustum-shaped cylinder, a frustum-shaped annular cylinder, or the like. The shielding component 280 can also have other shapes.
[0164] The shape of the shielding component 280 is related to the shielding method. Taking the limiting magnet 230 as an example, the limiting magnet 230 is cylindrical. The shielding component 280 shields the entire surface of the limiting magnet 230, and the shielding component 280 is hollow cylindrical. The shielding component 280 shields the sides of the limiting magnet 230, and the shielding component 280 is an annular cylinder. The shielding component 280 can also have other shapes.
[0165] In this embodiment, the limiting magnet 230 is cylindrical, the heat dissipation ring 240 is annular, and the shielding component 280 disposed on the outer surface of the limiting magnet 230 is in contact with the inner surface of the heat dissipation ring 240. In another embodiment, the limiting magnet 230 is cylindrical, the heat dissipation ring 240 is annular, and the shielding component 280 disposed on the side of the limiting magnet 230 is in contact with the inner surface of the heat dissipation ring 240.
[0166] In one embodiment, the shielding component 280 is disposed in the middle of the heat dissipation ring 240, and the shielding component 280 and the heat dissipation ring 240 are fixed together by an adhesive, thereby improving the stability of the wireless charger 200. In another embodiment, the shielding component 280 is disposed in the middle of the heat dissipation ring 240, and thermally conductive adhesive fills the gap between the heat dissipation ring 240 and the shielding component 280, thereby improving the heat transfer efficiency between the various components of the wireless charger 200.
[0167] like Figure 17 As shown, the shielding component 280 of the wireless charger 200 is disposed on the outer surface of the limiting magnet 230. In this embodiment, the limiting magnet 230 is cylindrical, and the shielding component 280 is disposed on the side of the limiting magnet 230. The shielding component 280 prevents wireless power signals from being reflected to the limiting magnet 230, blocks the formation of vortices in the limiting magnet 230 by the wireless power signals generated by the coil assembly 222, and prevents the internal temperature of the wireless charger 200 from rising.
[0168] In one embodiment, the shielding component 280 is further disposed on at least a portion of the upper surface of the limiting magnet 230. In one embodiment, the shielding component 280 is further disposed on at least a portion of the lower surface of the limiting magnet 230. In one embodiment, the shielding component 280 is further disposed on at least a portion of both the upper and lower surfaces of the limiting magnet 230. The upper surface of the limiting magnet 230 is the surface of the limiting magnet 230 adjacent to the upper housing assembly 210. The lower surface of the limiting magnet 230 is the surface of the limiting magnet 230 adjacent to the bottom of the groove structure of the lower housing assembly 250.
[0169] In one embodiment, the shielding component 280 is further disposed on at least a portion of the upper surface of the heat dissipation ring 240. In one embodiment, the shielding component 280 is further disposed on at least a portion of the lower surface of the heat dissipation ring 240. In one embodiment, the shielding component 280 is further disposed on at least a portion of both the upper and lower surfaces of the heat dissipation ring 240. The upper surface of the heat dissipation ring 240 is the surface of the heat dissipation ring 240 near the bottom of the groove structure of the lower housing assembly 250.
[0170] In one embodiment, the shielding component 280 disposed on the upper surface of the limiting magnet 230 is in contact with the lower surface of the upper housing component 210. In another embodiment, the shielding component 280 disposed on the upper surface of the heat dissipation ring 240 is in contact with the lower surface of the upper housing component 210.
[0171] In one embodiment, the shielding component 280 disposed on the lower surface of the limiting magnet 230 contacts the bottom of the groove structure of the lower housing assembly 250. In another embodiment, the shielding component 280 disposed on the lower surface of the heat dissipation ring 240 contacts the bottom of the groove structure of the lower housing assembly 250.
[0172] In one embodiment, the shielding component 280 disposed on the upper surface of the limiting magnet 230 and the shielding component 280 disposed on the upper surface of the heat dissipation ring 240 are on the same plane. In another embodiment, the shielding component 280 disposed on the lower surface of the limiting magnet 230 and the shielding component 280 disposed on the lower surface of the heat dissipation ring 240 are on the same plane.
[0173] like Figure 18 As shown in (a), the shielding component 280 is installed between the heat dissipation ring 240 and the limiting magnet 230. The shielding component 280 is a ring-shaped cylinder, with its outer edge also ring-shaped when viewed from above. The upper port of the shielding component 280 has an outer edge, the outer radius of which is less than or equal to the inner radius of the magnetic coil 220. The outer edge of the shielding component 280 is located on the upper surface of the heat dissipation ring 240, facilitating installation by assembly personnel. The outer edge of the shielding component 280 can contact the magnetic coil 220, forming a heat-conducting circuit between the magnetic coil 220 and the limiting magnet 230, thus improving the heat transfer efficiency between the various components of the wireless charger 200. The gap between the heat dissipation ring 240 and the shielding component 280 can be filled with thermally conductive colloid, thereby improving the heat transfer efficiency between the various components of the wireless charger 200.
[0174] Figure 18 (b) and Figure 18 (a) The same parts will not be repeated. For example... Figure 18 As shown in (b), the gap between the limiting magnet 230 and the magnet support plane 253 of the lower housing assembly 250 can also be filled with thermally conductive colloid to improve the heat transfer efficiency between the limiting magnet 230, the heat dissipation ring 240 and the lower housing assembly 250 in the wireless charger 200.
[0175] Figure 18 (c) and Figure 18 (a) The same parts will not be repeated. For example... Figure 18 As shown in (c), the shielding component 280 is also disposed on a portion of the upper surface of the limiting magnet 230 to facilitate the installation of the shielding component 280 by the assembly personnel.
[0176] Figure 18 (d) and Figure 18 (c) The same parts will not be repeated. For example... Figure 18 As shown in (d), the gap between the limiting magnet 230 and the magnet support plane 253 of the lower housing assembly 250 can also be filled with thermally conductive colloid to improve the heat transfer efficiency between the limiting magnet 230, the heat dissipation ring 240 and the lower housing assembly 250 in the wireless charger 200.
[0177] Figure 18 (e) and Figure 18 (c) The same parts will not be repeated. For example... Figure 18As shown in (e), the outer edge of the shielding component 280 can also be disposed on the entire upper surface of the heat dissipation ring 240. Correspondingly, the side surface of the shielding component 280 can be an annular cylinder, and the top surface can be circular in plan view.
[0178] Figure 18 (f) and Figure 18 (e) The same parts will not be repeated. For example... Figure 18 As shown in (f), the gap between the limiting magnet 230 and the magnet support plane 253 of the lower housing assembly 250 can also be filled with thermally conductive colloid to improve the heat transfer efficiency between the limiting magnet 230, the heat dissipation ring 240 and the lower housing assembly 250 in the wireless charger 200.
[0179] Figure 18 (g) and Figure 18 (a) The same parts will not be repeated. For example... Figure 18 As shown in (g), the shielding component 280 is also disposed on a portion of the lower surface of the limiting magnet 230. The shielding component 280 does not completely cover the lower surface of the limiting magnet 230, thus preventing the shielding component 280 from blocking the downward heat transfer of the limiting magnet 230.
[0180] Figure 18 (h) and Figure 18 (g) The same parts will not be repeated. For example Figure 18 As shown in (h), the gap between the shielding component 280, the limiting magnet 230, and the magnet support plane 253 of the lower housing component 250, which are disposed on the lower surface of the limiting magnet 230, can also be filled with thermally conductive colloid to improve the heat transfer efficiency between the limiting magnet 230, the shielding component 280, and the lower housing component 250 in the wireless charger 200.
[0181] Figure 18 (i) with Figure 18 (g) The same parts will not be repeated. For example Figure 18 As shown in (i), the shielding component 280 is also disposed on a portion of the upper surface of the limiting magnet 230 to facilitate the installation of the shielding component 280 by the assembly personnel.
[0182] Figure 18 (j) and Figure 18 (i) The same parts will not be repeated. For example Figure 18 As shown in (j), the gap between the shielding component 280, the limiting magnet 230, and the magnet support plane 253 of the lower housing component 250, which are disposed on the lower surface of the limiting magnet 230, can also be filled with thermally conductive colloid to improve the heat transfer efficiency between the limiting magnet 230, the shielding component 280, and the lower housing component 250 in the wireless charger 200.
[0183] Figure 18 (k) and Figure 18(i) The same parts will not be repeated. For example Figure 18 As shown in (k), the shielding component 280 is also disposed on the entire upper surface of the limiting magnet 230 to prevent the wireless power signal radiated by the coil assembly 222 from being reflected to the upper surface of the limiting magnet 230.
[0184] Figure 18 (l) and Figure 18 (k) The same parts will not be repeated. For example Figure 18 As shown in (l), the gap between the shielding component 280, the limiting magnet 230, and the magnet support plane 253 of the lower housing component 250, which are disposed on the lower surface of the limiting magnet 230, can also be filled with thermally conductive colloid to improve the heat transfer efficiency between the limiting magnet 230, the shielding component 280, and the lower housing component 250 in the wireless charger 200.
[0185] Figure 18 (m) and Figure 18 (a) The same parts will not be repeated. For example... Figure 18 As shown in (m), the shielding component 280 is also disposed on the entire lower surface of the limiting magnet 230 to prevent the wireless power signal radiated by the coil assembly 222 from being reflected to the lower surface of the limiting magnet 230. In one embodiment, the gap between the shielding component 280 disposed on the lower surface of the limiting magnet 230 and the limiting magnet 230 can also be filled with thermally conductive colloid to improve the heat transfer efficiency between the limiting magnet 230 and the shielding component 280 in the wireless charger 200.
[0186] Figure 18 (n) and Figure 18 (m) The same parts will not be repeated. For example Figure 18 As shown in (n), the gap between the shielding component 280 and the magnet support plane 253 of the lower housing component 250, which are disposed on the lower surface of the limiting magnet 230, can also be filled with thermally conductive colloid to improve the heat transfer efficiency between the limiting magnet 230, the shielding component 280 and the lower housing component 250 in the wireless charger 200.
[0187] Figure 18 (o) and Figure 18 (m) The same parts will not be repeated. For example Figure 18 As shown in (o), the shielding component 280 is also disposed on a portion of the upper surface of the limiting magnet 230 to prevent the wireless power signal radiated by the coil assembly 222 from being reflected to the upper surface of the limiting magnet 230.
[0188] Figure 18 (p) and Figure 18 (o) The same parts will not be repeated. For example Figure 18As shown in (p), the gap between the shielding component 280 on the lower surface of the limiting magnet 230 and the magnet support plane 253 of the lower housing component 250 can also be filled with thermally conductive colloid to improve the heat transfer efficiency between the limiting magnet 230, the shielding component 280 and the lower housing component 250 in the wireless charger 200.
[0189] Figure 18 (q) and Figure 18 (m) The same parts will not be repeated. For example Figure 18 As shown in (q), the shielding component 280 is also disposed on the entire upper surface of the limiting magnet 230 to prevent the wireless power signal radiated by the coil assembly 222 from being reflected to the upper surface of the limiting magnet 230.
[0190] Figure 18 (r) and Figure 18 (q) The same parts will not be repeated. For example Figure 18 As shown in (r), the gap between the shielding component 280 on the lower surface of the limiting magnet 230 and the magnet support plane 253 of the lower housing component 250 can also be filled with thermally conductive colloid to improve the heat transfer efficiency between the limiting magnet 230, the shielding component 280 and the lower housing component 250 in the wireless charger 200.
[0191] The heat dissipation ring 240 in the wireless charger 200 provided in this application embodiment is made of a material with high thermal conductivity and low electrical conductivity. The heat dissipation ring 240 is disposed on the magnet support plane 253. The heat dissipation ring 240 is in contact with one or more components such as the upper housing assembly 210, the magnetic coil 220, the limiting magnet 230, and the circuit board 260, so as to transfer the heat of the upper housing assembly 210, the magnetic coil 220, the limiting magnet 230, the circuit board 260, etc. to the lower housing assembly 250, thereby increasing the heat dissipation area of the wireless charger 200 and improving the heat dissipation capacity of the wireless charger 200.
[0192] In one embodiment, the heat dissipation ring 240 may be part of the lower housing assembly 250. The heat dissipation ring 240 and the lower housing assembly 250 are manufactured as a single piece. The heat dissipation ring 240 is located on the magnet support plane 253 of the lower housing assembly 250. The heat dissipation ring 240 and the lower housing assembly 250 are a single structure, which can reduce the number of components in the wireless charger 200 and reduce the assembly difficulty of the wireless charger 200.
[0193] In one embodiment, the heat dissipation ring 240 and the lower housing assembly 250 are an integral structure, and the isolation plate 254 may not be required on the magnet support plane 253 of the lower housing assembly 250. During the manufacturing process of the heat dissipation ring 240 and the lower housing assembly 250, the inner radius of the heat dissipation ring 240 is made larger than the outer radius of the limiting magnet 230. In one embodiment, the groove structure of the lower housing assembly 250 does not contain the isolation plate 254, which can greatly reduce the manufacturing difficulty of the lower housing assembly 250.
[0194] In one embodiment, the heat dissipation ring 240 and the lower housing assembly 250 of the wireless charger 220 provided in this application can be independent components. The assembly process of the wireless charger 200 is as follows:
[0195] Step 1: Place the heat dissipation ring 240 on the magnet support plane 253 of the lower housing assembly 250. Specifically, the heat dissipation ring 240 contacts and is fixed to the magnet support plane 253 of the lower housing assembly 250, and the heat dissipation ring 240 contacts and is fixed to the inner wall of the annular cylindrical part of the coil support plane 252 of the lower housing assembly 250.
[0196] Step 2: Place the limiting magnet 230 inside the heat dissipation ring 240. Specifically, the limiting magnet 230 contacts and is fixed to the magnet support plane 253 of the lower housing assembly 250, and the limiting magnet 230 contacts and is fixed to the inner surface of the heat dissipation ring 240. Accordingly, the limiting magnet 230 and the heat dissipation ring 240...
[0197] Step 3: Cable 270 passes through the through hole 255 of the lower housing assembly 250 and is electrically connected to the circuit board 260. Specifically, cable 270 can be fixed to the endpoints on the outer surface of the circuit board 260 by means of soldering or the like.
[0198] Step 4: Place the circuit board 260 on the circuit board support plane 256 of the lower housing assembly 250. Specifically, the surface of the circuit board 260 connected to the cable 270 contacts and is fixed to the circuit board support plane 256, and the protrusions of the cable 270 and the circuit board 260 are embedded in the wire groove 257 of the circuit board support plane 256.
[0199] Step 5: Place the magnetic sheet coil 220 on the coil support plane 252 of the lower housing assembly 250. Specifically, the magnetic sheet coil 220 contacts and is fixed to the coil support plane 252 of the lower housing assembly 250, and the coil port of the magnetic sheet coil 220 is electrically connected to the port of the circuit board 260. The magnetic sheet coil 220 is nested between the outer surface of the heat dissipation ring 240 and the inner wall of the groove structure of the lower housing assembly 250. The limiting magnet 230, the heat dissipation ring 240, the magnetic sheet coil 220, and the inner wall of the groove structure of the lower housing assembly 250 constitute a lateral limiting structure.
[0200] Step 6: Place the upper housing assembly 210 on the upper housing support plane 251 of the lower housing assembly 250. Specifically, the upper housing assembly 210 contacts and is fixed to the upper housing support plane 251 of the lower housing assembly 250, and the upper surface of the upper housing assembly 210 and the upper surface of the lower housing assembly 250 are on the same plane. The lower surface of the upper housing assembly 210 contacts the upper surface of the magnetic sheet coil 220, and the upper housing assembly 210, the magnetic sheet coil 220, and the coil support plane 252 constitute a longitudinal limiting structure.
[0201] In the assembly process of the wireless charger 200 in this embodiment, the heat dissipation ring 240, the limiting magnet 230, the circuit board 260, the magnetic coil 220 and the upper housing assembly 210 are sequentially fixed on the magnet support plane 253, the circuit board support plane 256, the coil support plane 252 and the upper housing support plane 251 of the lower housing assembly 250 in a bottom-up order, thereby realizing the assembly of the wireless charger 200.
[0202] In one embodiment, the heat dissipation ring 240 is part of the lower housing assembly 250. The aforementioned "first step" can be omitted during the assembly of the wireless charger 200. In this application, the heat dissipation ring 240 and the lower housing assembly 250 are an integral structure, which can reduce the number of components in the wireless charger 200, making the wireless charger 200 easier to assemble and improving assembly efficiency.
[0203] In one embodiment, the heat dissipation ring 240 and the lower housing assembly 250 are independent components. The lower housing assembly 250 is composed of a base plate and side plates. The assembly process of the wireless charger 200 is as follows:
[0204] Step 1: Place the heat dissipation ring 240 on the base plate of the lower housing assembly 250. Specifically, the heat dissipation ring 240 contacts and is fixed to the base plate of the lower housing assembly 250. At this time, the base plate of the lower housing assembly 250 is also the magnet support plane 253 of the lower housing assembly 250.
[0205] Step 2: Place the limiting magnet 230 inside the heat dissipation ring 240. Specifically, the limiting magnet 230 contacts and is fixed to the bottom plate of the lower housing assembly 250, and the limiting magnet 230 contacts and is fixed to the inner surface of the heat dissipation ring 240.
[0206] Step 3: Cable 270 passes through the through hole 255 of the side plate of the lower housing assembly 250 and is electrically connected to the circuit board 260. Specifically, cable 270 can be fixed to the endpoints on the outer surface of the circuit board 260 by means of soldering or the like.
[0207] Step 4: Place the circuit board 260 on the circuit board support plane 256 of the lower housing assembly 250. Specifically, the surface of the circuit board 260 connected to the cable 270 contacts and is fixed to the circuit board support plane 256, and the protrusions of the cable 270 and the circuit board 260 are embedded in the wire groove 257 of the circuit board support plane 256.
[0208] Step 5: Place the magnetic sheet coil 220 on the coil support plane 252 of the side plate of the lower housing assembly 250. Specifically, the magnetic sheet coil 220 contacts and is fixed to the coil support plane 252 of the side plate of the lower housing assembly 250, and the coil port of the magnetic sheet coil 220 is electrically connected to the port of the circuit board 260.
[0209] It should be noted that in the assembly process of the wireless charger 200, the "first step" and "second step" are performed using the bottom plate of the lower housing assembly 250 as the assembly line, while the "third step," "fourth step," and "fifth step" are performed using the side plates of the lower housing assembly 250 as the assembly line. During the assembly process, the assembly lines of the bottom plate and the side plates of the lower housing assembly 250 are not sequential; they can be assembled simultaneously or sequentially. This application does not impose any limitations on this.
[0210] Step 6: Place the side plate of the lower housing assembly 250 onto the bottom plate of the lower housing assembly 250. Specifically, the side plate of the lower housing assembly 250 is nested into the bottom plate of the lower housing assembly 250, so that the heat dissipation ring 240 contacts and is fixed to the inner wall of the annular cylindrical part of the coil support plane 252 of the side plate of the lower housing assembly 250, and the side plate of the lower housing assembly 250 contacts and is fixed to the bottom plate of the lower housing assembly 250.
[0211] Step 7: Place the upper housing assembly 210 on the upper housing support plane 251 of the side plate of the lower housing assembly 250. Specifically, the upper housing assembly 210 contacts and is fixed to the upper housing support plane 251 of the side plate of the lower housing assembly 250, and the upper surface of the upper housing assembly 210 and the upper surface of the lower housing assembly 250 are on the same plane.
[0212] In this embodiment, during the wireless charger assembly process, the lower housing assembly 250 is split into a base plate and a side plate, reducing the complexity of the lower housing assembly 250 structure and making the wireless charger 200 easier to assemble, thus improving assembly efficiency. The lower housing assembly 250 is split into a base plate and a side plate. The heat dissipation ring 240 and the limiting magnet 230 are fixed to the base plate of the lower housing assembly 250, while the circuit board 260 and the magnetic coil 220 are fixed to the coil support plane 252 of the side plate of the lower housing assembly 250. During assembly, the lower housing assembly 250 is assembled along two assembly lines—the base plate and the side plate—before the final assembly, which reduces the time required for the wireless charger 200 and increases manufacturing productivity.
[0213] In addition, the heat-conducting components of the wireless charger 200 are divided into the upper housing assembly 210, the side plate of the lower housing assembly 250, the bottom plate of the lower housing assembly 250, and the heat dissipation ring 240. According to actual needs, each component is made of different materials, so that the wireless charger 200 can improve heat dissipation performance and optimize costs at specific points.
[0214] In the wireless charger 200 provided in this application embodiment, the upper housing assembly 210, magnetic coil 220, limiting magnet 230, heat dissipation ring 240, lower housing assembly 250, and circuit board 260 can be fixed to preset positions with adhesive, enhancing the structural strength of the wireless charger 200 and improving the product's durability. The gaps between the upper housing assembly 210, magnetic coil 220, limiting magnet 230, heat dissipation ring 240, lower housing assembly 250, and circuit board 260 in the wireless charger 200 can also be filled with thermally conductive adhesive, improving the structural strength and heat dissipation performance of the wireless charger 200.
[0215] In this embodiment, the upper surface of the lower housing assembly 250 of the wireless charger 200 is provided with a groove structure, which is coupled to the upper housing assembly 210 through an adhesive to form a cavity structure. A heat dissipation ring 240 is nested within a limiting magnet 230, and a magnetic coil 220 is nested within the heat dissipation ring 240.
[0216] In one embodiment, the upper housing assembly 210 is fixed to the upper housing support plane 251 of the lower housing assembly 250 by an adhesive. Specifically, the upper housing support plane 251 or the lower surface of the upper housing assembly 210 is provided with adhesive, the upper housing assembly 210 is disposed on the upper housing support plane 251, and the lower surface of the upper housing assembly 210 and the upper housing support plane 251 are fixedly connected by adhesive. In this embodiment, the upper housing assembly 210 and the lower housing assembly 250 of the wireless charger 200 are fixed together by adhesive, which makes the outer shell of the wireless charger 200 more aesthetically pleasing compared to the existing screw fixing method.
[0217] In the embodiments of this application, the adhesive may also be AB glue, double-sided tape, etc., and this application does not limit it. AB glue can be materials such as acrylic, epoxy, and polyurethane.
[0218] In one embodiment, at least one of the limiting magnet 230 or the heat dissipation ring 240 is fixed to the bottom of the recessed structure of the lower housing assembly 250 by an adhesive. In another embodiment, at least one of the limiting magnet 230 or the heat dissipation ring 240 is fixed to the lower surface of the upper housing assembly 210 by an adhesive.
[0219] In one embodiment, the heat dissipation ring 240 is fixed to the magnet support plane 253 of the lower housing assembly 250 by an adhesive. Specifically, an adhesive is provided on the bottom of the heat dissipation ring 240, and the heat dissipation ring 240 is positioned at a predetermined position on the magnet support plane 253 of the lower housing assembly 250. The adhesive fixes the heat dissipation ring 240 to the magnet support plane 253 of the lower housing assembly 250, preventing the heat dissipation ring 240 from shaking and causing abnormal noise inside the wireless charger 200.
[0220] The heat dissipation ring 240 is fixed to the magnet support plane 253 of the lower housing assembly 250. A gap may exist between the side of the heat dissipation ring 240 and the inner wall of the groove structure of the lower housing assembly 250. This gap can be filled with thermally conductive adhesive to improve the heat dissipation capacity of the wireless charger 200. Correspondingly, the inner wall of the groove structure of the lower housing assembly 250, the magnetic coil 220, and the heat dissipation ring 240 constitute a lateral limiting structure, preventing the magnetic coil 220 and the heat dissipation ring 240 from laterally shaking inside the wireless charger 200 and causing abnormal noise, thus improving the structural reliability of the wireless charger 200.
[0221] In one embodiment, the limiting magnet 230 is fixed to the magnet support plane 253 of the lower housing assembly 250 by an adhesive. Specifically, the adhesive is applied to the bottom surface of the limiting magnet 230, the limiting magnet 230 is embedded in the heat dissipation ring 240, and the limiting magnet 230 is in contact with the magnet support plane 253 of the lower housing assembly 250. The adhesive fixes the limiting magnet 230 to the magnet support plane 253 of the lower housing assembly 250, preventing the limiting magnet 230 from shaking and causing abnormal noise inside the wireless charger 200.
[0222] In one embodiment, the limiting magnet 230 is nested within the heat dissipation ring 240, with a gap between the outer surface of the limiting magnet 230 and the inner surface of the heat dissipation ring 240. This gap can be filled with thermally conductive adhesive. Correspondingly, the inner wall of the groove structure of the lower housing assembly 250, the magnetic coil 220, the heat dissipation ring 240, and the limiting magnet 230 constitute a lateral limiting structure, preventing the magnetic coil 220, the limiting magnet 230, and the heat dissipation ring 240 from shaking and causing abnormal noise inside the wireless charger 200, thus improving the structural reliability of the wireless charger 200. Furthermore, the thermally conductive adhesive can fill the gap between the outer surface of the limiting magnet 230 and the inner surface of the heat dissipation ring 240, improving the heat dissipation capacity of the wireless charger 200.
[0223] In one embodiment, the circuit board 260 is fixed to the housing cavity by thermally conductive adhesive. Specifically, the magnetic coil 220 is disposed on the coil support plane 252, and the circuit board 260 is disposed between the magnetic coil 220 and the bottom of the recessed structure of the lower shell assembly 250. The magnetic coil 220 and the bottom of the recessed structure of the lower shell assembly 250 form the housing cavity. The gap between the magnetic coil 220, the bottom of the recessed structure of the lower shell assembly 250, and the circuit board 260 is filled with thermally conductive adhesive. The thermally conductive adhesive fixes the circuit board 260 in the housing cavity, preventing the circuit board 260 from shaking and causing abnormal noise inside the wireless charger 200, and also preventing the circuit board 260 from moving in the housing cavity and causing open circuit problems, thereby improving the reliability of the wireless charger 200.
[0224] In one embodiment, the circuit board 260 is fixed to the lower surface of the magnetic coil 220 using an adhesive. Specifically, an adhesive is applied to the surface of the circuit board 260 or the lower surface of the magnetic coil 220. The adhesive fixes the circuit board 260 to the lower surface of the magnetic coil 220, preventing the circuit board 260 from shaking and causing abnormal noise inside the wireless charger 200. It also prevents the circuit board 260 from moving within the storage cavity and causing open circuit problems, thus improving the reliability of the wireless charger 200.
[0225] In this embodiment, the lower housing assembly 250 has a groove structure with a coil support plane 252. The coil support plane 252 is used to support the magnetic sheet coil 220. The coil support plane 252 is located near the upper surface of the lower housing assembly 250.
[0226] In one embodiment, the magnetic sheet coil 220 is fixed to the coil support plane 252 of the lower housing assembly 250 by an adhesive. Specifically, the coil support plane 252 is provided with adhesive, and the magnetic sheet coil 220 is disposed on the coil support plane 252. The adhesive fixes the magnetic sheet coil 220 to the coil support plane 252 of the lower housing assembly 250, preventing the magnetic sheet coil 220 from shaking and causing abnormal noise inside the wireless charger 200.
[0227] In one embodiment, the upper surface of the magnetic sheet coil 220 is in contact with the lower surface of the upper housing assembly 210. The upper surface of the magnetic sheet coil 220 is the surface of the magnetic sheet coil 220 closest to the upper housing assembly 210, and the lower surface of the upper housing assembly 210 is the surface of the upper housing assembly 210 that forms the cavity structure. The coil support plane 252 supports the magnetic sheet coil 220, and the upper housing assembly 210, the magnetic sheet coil 220, and the coil support plane 252 form a longitudinal limiting structure to prevent the magnetic sheet coil 220 from shaking and causing abnormal noise inside the wireless charger 200.
[0228] In one embodiment, thermally conductive colloid is filled in the gap between the lower surface of the upper housing assembly 210, the groove structure of the lower housing assembly 250, and the magnetic coil 220. The upper housing assembly 210, the magnetic coil 220, and the coil support plane 252 constitute a longitudinal limiting structure to prevent the magnetic coil 220 from shaking inside the wireless charger 200 and causing abnormal noise, and to improve the heat dissipation efficiency of the wireless charger 200.
[0229] In one embodiment, the coil support plane 252 is a fence-shaped structure, with thermally conductive adhesive filling the spaces between the multiple fences. Specifically, the coil support plane 252 includes a fence-shaped support body. The fence-shaped support body includes one arc-shaped fence and multiple columnar fences. The gaps between the columnar fences, the arc-shaped fences, and the inner walls of the groove structure of the lower housing assembly 250 are filled with thermally conductive adhesive to improve the heat dissipation capability of the wireless charger 200.
[0230] In one embodiment, the lower housing assembly 250 includes a base plate and a side plate. The side plate of the lower housing assembly 250 is fixed to the base plate of the lower housing assembly 250 by an adhesive. Specifically, the adhesive used between the base plate and the side plate of the lower housing assembly 250 is generally AB glue. The heat dissipation ring 240 and the limiting magnet 230 are fixed to the base plate of the lower housing assembly 250 by double-sided adhesive.
[0231] In the wireless charger 200 provided in this application embodiment, multiple components are fixed together with adhesive, which enhances the structural strength of the wireless charger 200 and improves the durability of the product. In addition, thermally conductive colloid is filled into the gaps between the multiple components of the wireless charger 200 to improve the heat dissipation capacity of the wireless charger 200.
[0232] In this embodiment, the wireless charger 200 uses ceramic material powder as a binder, eliminating the need for other types of adhesives such as white glue and double-sided tape. This reduces the variety of adhesives used and lowers the manufacturing cost of the wireless charger 200. Furthermore, the ceramic material powder has excellent thermal conductivity, further improving the heat dissipation capability of the wireless charger 200.
[0233] In this embodiment, the magnetic coil 220 generates a large amount of heat during wireless charging. The wireless power signal generated by the wireless charger 200 induces eddies in the limiting magnet 230, which in turn generates a large amount of heat within the limiting magnet 230. During prolonged operation, the various components of the circuit board 260 generate heat.
[0234] In this embodiment, the heat-generating devices in the wireless charger 200 are mainly the sheet coil 220 and the circuit board 260. The sheet coil 220 generates a significant amount of heat during the conversion of electrical energy into wireless power signals. The heat generated by the circuit board 260 is far less than that generated by the sheet coil 220 and the limiting magnet 230. Therefore, the main problem addressed in this application is the heat generated by the sheet coil 220 and the limiting magnet 230.
[0235] To improve the heat dissipation capability of the wireless charger 200, the upper housing assembly 210 and the lower housing assembly 250 of the wireless charger 200 can be made of materials with high thermal conductivity. In the embodiments of this application, materials with high thermal conductivity include ceramics, thermally conductive plastics, etc.
[0236] In one embodiment, the upper housing assembly 210 and the lower housing assembly 250 may be made of materials with low conductivity. During the process of the magnetic coil 220 converting electrical energy into wireless power signals, the wireless charger 200 housing cannot transmit electrical energy, thus preventing leakage.
[0237] Figure 19 This diagram illustrates heat transfer in the magnetic coil, limiting magnet, and other heat-generating components of the wireless charger provided in this embodiment. In this embodiment, the wireless charger 200 includes an upper housing assembly 210, a magnetic coil 230, a heat dissipation ring 240, and a lower housing assembly 250. The upper surface of the lower housing assembly 250 has a groove structure, which couples with the upper housing assembly 210 to form a cavity structure. The magnetic coil 230 is nested outside the heat dissipation ring 240. The gaps between the groove structures of the upper housing assembly 210 and lower housing assembly 250, the magnetic coil 230, and the heat dissipation ring 240 are filled with thermally conductive colloid.
[0238] like Figure 19As shown, the lower housing assembly 250 of the wireless charger 200 has a recessed structure in which a magnetic coil 220 and a heat sink ring 240 are provided. The heat sink ring 240 is disposed within the annular structure of the magnetic coil 220, with the magnetic coil 220 nested outside the heat sink ring. The outer surface of the heat sink ring 240 is coupled to the magnetic coil 220, and the outer surface of the heat sink ring 240 is in contact with the inner surface of the magnetic coil 220. The upper surface of the heat sink ring 240 is coupled to the lower surface of the upper housing assembly 210, and the lower surface of the heat sink ring 240 is coupled to the bottom of the recessed structure of the lower housing assembly 250. The upper surface of the heat sink ring 240 is the surface of the heat sink ring 240 near the upper housing assembly 210, and the lower surface of the heat sink ring 240 is the surface of the heat sink ring 240 near the bottom of the recessed structure of the lower housing assembly 250. The lower surface of the upper housing assembly 210 is the surface of the upper housing assembly 10 that forms the cavity structure.
[0239] In one embodiment, the heat dissipation ring 240 is fixed between the lower surface of the upper housing assembly 210 and the bottom of the recessed structure of the lower housing assembly 250. In another embodiment, a thermally conductive adhesive is disposed between the upper surface of the heat dissipation ring 240 and the upper housing assembly 210, and a thermally conductive adhesive is disposed between the lower surface of the heat dissipation ring 240 and the bottom of the recessed structure of the lower housing assembly 250. The heat dissipation ring 210 is used to conduct heat from the upper housing assembly 210 and the magnetic coil 220 to the bottom of the recessed structure of the lower housing assembly 250.
[0240] In one embodiment, the heat dissipation ring 240 and the lower housing assembly 250 are made of a material with high thermal conductivity. Heat generated on the inner surface of the magnetic coil 220 can be transferred to the heat dissipation ring 240 via a thermally conductive colloid. Heat from the heat dissipation ring 240 is then transferred to the lower housing assembly 250 via the thermally conductive colloid. The lower housing assembly 250 exchanges heat with the external gas, transferring the heat from the magnetic coil 220 to the external gas, thereby reducing the temperature of the wireless charger 200.
[0241] like Figure 19 As shown, the recessed structure of the lower housing assembly 250 is provided with a coil support plane 252. A magnetic sheet coil 220 is disposed on the coil support plane 252. In one embodiment, the outer surface of the magnetic sheet coil 220 contacts the inner wall of the recessed structure of the lower housing assembly 250, and the lower surface of the magnetic sheet coil 220 contacts the coil support plane 252 of the lower housing assembly 250. The heat generated by the magnetic sheet coil 220 can be quickly transferred to the lower housing assembly 250.
[0242] In one embodiment, the lower housing assembly 250 is made of a material with high thermal conductivity. Heat generated on the outer and lower surfaces of the magnetic coil 220 can be transferred to the lower housing assembly 250 via a thermally conductive colloid. The lower housing assembly 250 exchanges heat with the external gas, transferring the heat from the magnetic coil 220 to the external gas, thereby reducing the temperature of the wireless charger 200.
[0243] In one embodiment, the magnetic coil 220 is coupled to the lower surface of the upper housing assembly 210, and a thermally conductive adhesive is disposed between the magnetic coil 220 and the lower surface of the upper housing assembly 210. In another embodiment, the lower surface of the upper housing assembly 210 of the wireless charger 200 is in contact with the upper surface of the magnetic coil 220. The heat generated on the upper surface of the magnetic coil 220 can be transferred to the upper housing assembly 210 through the thermally conductive adhesive. The upper housing assembly 210 exchanges heat with the external gas, transferring the heat of the magnetic coil 220 to the external gas, thereby reducing the temperature of the wireless charger 200.
[0244] like Figure 19 As shown, the wireless charger 200 also includes a limiting magnet 230. The limiting magnet 230 is disposed inside the heat dissipation ring 240. The upper surface of the limiting magnet 230 is coupled to the lower surface of the upper housing assembly 210, and the lower surface of the limiting magnet 230 is coupled to the bottom of the groove structure of the lower housing assembly 250. The upper surface of the limiting magnet 230 is the surface of the limiting magnet 230 near the upper housing assembly 210, and the lower surface of the limiting magnet 230 is the surface of the limiting magnet 230 near the bottom of the groove structure of the lower housing assembly 250.
[0245] In one embodiment, the limiting magnet 230 is fixed between the lower surface of the upper housing assembly 210 and the bottom of the groove structure of the lower housing assembly 250. In another embodiment, a thermally conductive adhesive is disposed between the upper surface of the limiting magnet 230 and the lower surface of the upper housing assembly 210, and between the lower surface of the limiting magnet 230 and the bottom of the groove structure of the lower housing assembly 250. A thermally conductive adhesive is disposed between the heat dissipation ring 240 and the limiting magnet 230. The limiting magnet 230 is used to transfer heat from the upper housing assembly 210 to the bottom of the groove structure of the lower housing assembly 250, greatly improving the heat dissipation capacity of the wireless charger 200 and reducing the temperature of the wireless charger 200.
[0246] In one embodiment, the side of the limiting magnet 230 contacts the inner surface of the heat dissipation ring 240, and the heat generated by the limiting magnet 230 can be quickly transferred to the heat dissipation ring 240.
[0247] like Figure 6As shown, the magnet support plane 253 of the lower housing assembly 250 is provided with multiple heat dissipation holes 258. The heat dissipation holes 258 are located at the positions of the fixed limiting magnets 230 on the magnet support plane 253. The heat of the limiting magnets 230 can be exchanged with the external gas through the heat dissipation holes 258, transferring the heat of the limiting magnets 230 to the external gas, thereby reducing the temperature of the wireless charger 200. In other embodiments, the number of heat dissipation holes 258 can be arbitrary. The shape of the heat dissipation holes 258 can be elliptical, polygonal, or other shapes.
[0248] In one embodiment, the radius of the protrusion on the lower surface of the upper housing assembly 210 is not greater than the inner radius of the magnetic sheet assembly 221 of the magnetic sheet coil 220, and the radius of the protrusion on the lower surface of the upper housing assembly 210 is not less than the radius of the limiting magnet 230. The upper housing assembly 210 is disposed on the upper housing support plane 251 of the lower housing assembly 250. The upper housing assembly 210 not only contacts the upper surface of the magnetic sheet coil 220, but the bottom of the protrusion on the upper housing assembly 210 also contacts the upper surface of the limiting magnet 230, and the heat of the limiting magnet 230 is transferred to the upper housing assembly 210. The upper housing assembly 210 exchanges heat with the external gas, thereby reducing the temperature of the wireless charger 200.
[0249] In one embodiment, the radius of the protrusion structure on the lower surface of the upper housing assembly 210 is not less than the radius of the heat dissipation ring 240. The upper housing assembly 210 is disposed on the upper housing support plane 251 of the lower housing assembly 250. The upper housing assembly 210 not only contacts the upper surface of the magnetic coil 220, but also contacts the limiting magnet 230 and the heat dissipation ring 240. Heat from the limiting magnet 230 and the heat dissipation ring 240 is transferred to the upper housing assembly 210. The upper housing assembly 210 exchanges heat with the external air, thereby reducing the temperature of the wireless charger 200.
[0250] In this embodiment, the upper surfaces of the limiting magnet 230 and the heat dissipation ring 240 are in contact with the upper housing assembly 210. The lower surfaces of the limiting magnet 230 and the heat dissipation ring 240 are in contact with the bottom of the groove structure of the lower housing assembly 250. The heat generated by the limiting magnet 230 can be transferred to the upper housing assembly 210 and the lower housing assembly 250, which can further improve the heat dissipation capability of the wireless charger 200.
[0251] As shown in Figure 19, the lower surface of the circuit board 260 contacts the magnet support plane 253 of the lower housing assembly 250, or the upper surface of the circuit board 260 contacts the magnetic coil 220. Heat generated by the circuit board 260 is transferred to the magnetic coil 220, the heat sink ring 240, and the lower housing assembly 250. In one embodiment, the temperature of the magnetic coil 220 is higher than the temperature of the circuit board 260, and the circuit board 260 does not transfer heat to the magnetic coil 220 but instead absorbs heat from it. In this case, the heat generated by the circuit board 260 is transferred to the lower housing assembly 250. In another embodiment, the temperature of the circuit board 260 is higher than the temperature of the magnetic coil 220, and the heat generated by the circuit board 260 is transferred to both the magnetic coil 220 and the lower housing assembly 250. The heat generated by the circuit board 260 and the heat generated by the magnetic coil 220 are exchanged through the housing of the wireless charger 200, thereby reducing the temperature of the wireless charger 200.
[0252] In this embodiment, the upper surface of the magnetic sheet coil 220 of the wireless charger 200 contacts the upper housing assembly 210, and the outer and lower surfaces of the magnetic sheet coil 220 contact the lower housing assembly 250. The inner surface of the magnetic sheet coil 220 indirectly contacts the upper housing assembly 210 and the lower housing assembly 250 through the limiting magnet 230 and the heat dissipation ring 240. The heat generated by the magnetic sheet coil 220 can be transferred from all sides to the outer casing of the wireless charger 200, greatly improving the heat dissipation capacity of the wireless charger 200. The outer casing of the wireless charger 200 exchanges heat with the external air, thereby reducing the temperature of the wireless charger 200.
[0253] Figure 20 This is a schematic diagram illustrating heat transfer in the wireless charger of the electronic device provided in this embodiment of the application. Figure 20 As shown, the wireless charger 200 wirelessly charges the electronic device 100, causing the electronic device 100 to generate heat. The electronic device 100 has many components and a complex structure, requiring measures to prevent it from overheating. Therefore, if the electronic device 100 overheats, the wireless charging power needs to be reduced or wireless charging stopped, thus affecting the wireless charging speed.
[0254] like Figure 20As shown, during wireless charging, the electronic device 100 is positioned on the upper surface of the upper housing assembly 210 of the wireless charger 200. The protruding structure of the electronic device 100 is embedded in the recessed structure 211 of the upper housing assembly 210, allowing the protruding structure of the electronic device 100 to contact the recessed structure 211. The periphery of the upper surface of the upper housing assembly 210 contacts the lower surface of the electronic device 100. Heat from the electronic device 100 is transferred to the outer casing of the wireless charger 200, increasing the heat dissipation area of the electronic device 100 and accelerating the temperature reduction of the electronic device 100.
[0255] After the upper housing assembly 210 exchanges heat with the electronic device 100, some of the heat from the upper housing assembly 210 is directly exchanged with the surrounding gas, transferring the heat of the electronic device 100 to the gas surrounding the upper housing assembly 210, thereby reducing the temperature of the electronic device 100. The upper housing assembly 210 can also transfer heat to the lower housing assembly 250. The lower housing assembly 250 has a relatively large outer surface area, which allows it to quickly transfer the heat of the electronic device 100 to the surrounding gas, thereby rapidly reducing the temperature of the electronic device 100.
[0256] In one embodiment, the upper housing assembly 210 and the lower housing assembly 250 are made of highly thermally conductive materials. The thermal conductivity of the upper housing assembly 210 and the lower housing assembly 250 is higher than that of the electronic device 100, and their thermal resistance is lower than that of the electronic device 100. The upper housing assembly 210 can quickly absorb heat from the electronic device 100 and transfer it to the surrounding air and the lower housing assembly 250, thereby improving the heat dissipation capacity of the electronic device 100. The heat from the electronic device 100 is dissipated through a heat dissipation channel of "electronic device 100 → upper housing assembly 210 of wireless charger 200 → lower housing assembly 250 of wireless charger 200," achieving a rapid reduction in the temperature of the electronic device 100, thereby improving the wireless charging speed of the electronic device 100.
[0257] In one embodiment, the gaps between the upper housing assembly 250, the limiting magnet 230, the heat dissipation ring 240, and the lower housing assembly 250 of the wireless charger 200 are filled with thermally conductive adhesive. The upper housing assembly 210 absorbs heat from the electronic device 100, and the heat from the upper housing assembly 210 can be transferred to the side and bottom plate of the lower housing assembly 250 through the thermally conductive adhesive. In this embodiment, the heat from the electronic device 100 is dissipated through the heat dissipation channel of "electronic device 100 → upper housing assembly 210 of wireless charger 200 → thermally conductive adhesive → lower housing assembly 250 of wireless charger 200", thereby rapidly reducing the temperature of the electronic device 100 and improving the wireless charging speed of the electronic device 100.
[0258] In one embodiment, the protrusion structure 212 of the upper housing assembly 210 contacts the upper surface of the limiting magnet 230 and the upper surface of the heat dissipation ring 240 through thermally conductive colloid or directly; the lower surface of the limiting magnet 230 contacts the bottom of the groove structure of the lower housing assembly 250; and the lower surface of the heat dissipation ring 240 contacts the bottom of the groove structure of the lower housing assembly 250.
[0259] After absorbing heat from the electronic device 100, the upper housing assembly 210 transfers the heat to the limiting magnet 230 and the heat dissipation ring 240. The heat from the limiting magnet 230 and the heat dissipation ring 240 is then transferred to the bottom of the recessed structure of the lower housing assembly 250. In other embodiments, the upper housing assembly 210 may utilize either the limiting magnet 230 or the heat dissipation ring 240 to transfer heat to the bottom of the recessed structure of the lower housing assembly 250.
[0260] In this embodiment, the heat of the electronic device 100 is dissipated through a heat dissipation channel of “electronic device 100 → upper housing assembly 210 of wireless charger 200 → limiting magnet 230 and / or heat dissipation ring 240 → lower housing assembly 250 of wireless charger 200”, thereby rapidly reducing the temperature of the electronic device 100 and improving the wireless charging speed of the electronic device 100.
[0261] The wireless charger 200 provided in this application embodiment can also dissipate heat from the electronic device 100 when wirelessly charging it, thereby improving the heat dissipation capacity of the electronic device 100 and thus increasing the wireless charging speed of the electronic device 100. In experimental simulations, when the wireless charger 200 provided in this application embodiment wirelessly charges the electronic device 100, the charging time from 0 to 100% can be reduced by 25 minutes, significantly improving the charging speed.
[0262] The wireless charger provided in this embodiment includes an upper housing assembly and a lower housing assembly. Multiple support planes are provided in the lower housing assembly, such as an upper housing support plane, a coil support plane, a magnet support plane, and a circuit board support plane. The upper housing support plane supports the upper housing assembly. The coil support plane supports the magnetic coil. The magnet support plane supports the limiting magnet and the heat dissipation ring. The circuit board support plane supports the circuit board 260. The multiple support planes of the wireless charger support the various components in different positions, preventing the components from stacking together. If the wireless charger is subjected to external force, all stacked components will be damaged, thereby reducing the reliability of the wireless charger 200.
[0263] The wireless charger provided in this application includes an upper housing assembly, a lower housing assembly, and a magnetic sheet coil. A groove structure is provided on the upper surface of the lower housing assembly, and the groove structure is coupled to the upper housing assembly to form a cavity structure. The cavity structure houses the magnetic sheet coil. The magnetic sheet coil includes a magnetic sheet assembly and a coil assembly. An annular groove is provided on the upper surface of the magnetic sheet assembly for housing the coil assembly. After the coil assembly converts electrical energy into wireless power signals, it radiates the wireless power signals in all directions. Under the constraint of the magnetic sheet assembly, the wireless power signals are radiated along a predetermined direction. The magnetic sheet assembly restricts the radiation direction of the wireless power signals, preventing the wireless power signals generated by the coil assembly from forming eddies on other components of the wireless charger, which would cause the wireless charger's temperature to rise.
[0264] The wireless charger provided in this application includes an upper housing assembly, a lower housing assembly, a magnetic coil, a limiting magnet, and a shielding assembly. A groove structure is provided on the upper surface of the lower housing assembly, and the groove structure is coupled to the upper housing assembly to form a cavity structure. The cavity structure houses the magnetic coil, the limiting magnet, and the shielding assembly. The shielding assembly is disposed between the magnetic coil and the limiting magnet. The shielding assembly can prevent the wireless power signal generated by the coil assembly from forming eddies on the limiting magnet, thus preventing the temperature of the wireless charger from rising.
[0265] The wireless charger provided in this application includes an upper housing assembly, a lower housing assembly, and a heat dissipation ring. A groove structure is provided on the upper surface of the lower housing assembly, and the groove structure is coupled to the upper housing assembly to form a cavity structure. The cavity structure houses the heat dissipation ring. The upper surface of the heat dissipation ring is coupled to the upper housing assembly. The lower surface of the heat dissipation ring is coupled to the bottom of the groove structure of the lower housing assembly. The heat dissipation ring can transfer heat from the wireless charger through the upper and lower housing assemblies, thereby improving the heat dissipation capacity of the wireless charger.
[0266] The wireless charger provided in this application includes an upper housing assembly, a lower housing assembly, and a heat dissipation ring. A groove structure is provided on the upper surface of the lower housing assembly, and the groove structure is coupled to the upper housing assembly to form a cavity structure. The cavity structure houses the heat dissipation ring. The upper surface of the heat dissipation ring is coupled to the upper housing assembly. The lower surface of the heat dissipation ring is coupled to the bottom of the groove structure of the lower housing assembly. Heat from the electronic device is transferred to the upper housing assembly, and the heat dissipation ring can transfer the heat from the upper housing assembly to the bottom of the lower housing assembly, increasing the heat dissipation area of the electronic device and improving its heat dissipation capacity.
[0267] The wireless charger provided in this application includes an upper housing assembly, a lower housing assembly, a magnetic coil, and a heat sink ring. The upper surface of the lower housing assembly has a groove structure, which is coupled to the upper housing assembly to form a cavity structure. The cavity structure houses the magnetic coil and the heat sink ring. The heat sink ring is nested within the magnetic coil and in contact with it. The upper surface of the heat sink ring is coupled to the upper housing assembly. The lower surface of the heat sink ring is coupled to the bottom of the groove structure of the lower housing assembly. Heat from the electronic device is transferred to the upper housing assembly, and the heat sink ring can transfer this heat to the bottom of the lower housing assembly, increasing the heat dissipation area of the electronic device and improving the heat dissipation capacity of both the wireless charger and the electronic device.
[0268] The wireless charger provided in this application includes an upper housing assembly, a lower housing assembly, a magnetic coil, and a limiting magnet. A groove structure is provided on the upper surface of the lower housing assembly, and the groove structure is coupled to the upper housing assembly to form a cavity structure. The cavity structure houses the magnetic coil and the limiting magnet. The magnetic coil and the limiting magnet are fixed to the upper and lower housing assemblies to prevent the components from shaking and causing abnormal noise inside the wireless charger. Furthermore, the magnetic coil, limiting magnet, and other components of the wireless charger are fixed together with adhesive, enhancing the structural strength of the wireless charger and improving the product's durability. Additionally, thermally conductive adhesive is filled into the gaps between the various components of the wireless charger to improve its heat dissipation capacity.
[0269] The wireless charger provided in this application includes an upper housing assembly, a lower housing assembly, a magnetic coil, a limiting magnet, and a heat dissipation ring. The upper surface of the upper housing assembly has a groove structure. The lower surface of the upper housing assembly has a protrusion structure. The lower surface of the upper housing assembly also has an annular groove.
[0270] In this embodiment, a groove structure is provided on the upper surface of the upper housing assembly, allowing the groove structure to couple with the protruding structure of the electronic device. This shortens the distance between the electronic device and the wireless charger, reducing power loss during wireless charging. A protruding structure is provided on the lower surface of the upper housing assembly, allowing the upper housing assembly to contact the heat dissipation ring and the limiting magnet, improving the heat dissipation capacity of the wireless charger. An annular groove is also provided on the lower surface of the upper housing assembly, allowing the magnetic coil to be embedded in the annular groove, increasing the height of the magnetic coil. This allows for a greater number of coil turns in the magnetic coil, increasing the power of the wireless charger.
[0271] The wireless charger provided in this application includes an upper housing assembly, a lower housing assembly, a magnetic coil, and a limiting magnet. The lower housing assembly includes a side plate and a bottom plate. The bottom plate of the lower housing assembly is fixed to one port of the side plate of the lower housing assembly, forming a groove structure. The upper housing assembly is fixed to the other port of the side plate of the lower housing assembly, forming a cavity structure. The cavity structure houses the magnetic coil and the limiting magnet. In this application, the lower housing assembly is divided into two parts, the bottom plate and the side plate, which can be manufactured as two separate components, reducing the manufacturing difficulty of the lower housing assembly.
[0272] The types, quantities, shapes, installation methods, and structures of the components of the wireless charger provided in this application are not limited to the above embodiments. All technical solutions implemented under the principles of this application are within the protection scope of this solution. Any one or more embodiments or illustrations in the specification, combined in a suitable manner, are within the protection scope of this solution.
[0273] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application. Those skilled in the art should understand that although this application has been described in detail with reference to the foregoing embodiments, modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to depart from the spirit and scope of the technical solutions in the embodiments of this application.
Claims
1. A wireless charger, characterized in that, include: The assembly comprises an upper housing assembly (210), a lower housing assembly (250), a magnetic sheet coil (220), a limiting magnet (230), and a heat dissipation ring (240). The upper surface of the lower housing assembly is provided with a groove structure, which is coupled with the upper housing assembly to form a cavity structure. The magnetic sheet coil includes a magnetic sheet assembly (221) and a coil assembly (222). The magnetic sheet assembly is provided with an annular groove for housing the coil assembly. The magnetic sheet assembly is nested outside the heat dissipation ring. The gap between the upper housing assembly, the groove structure, the magnetic sheet assembly and the heat dissipation ring is filled with thermally conductive colloid. The limiting magnet is disposed inside the heat dissipation ring, and an isolation plate is provided between the limiting magnet and the heat dissipation ring. The isolation plate is used to limit the positions of the limiting magnet and the heat dissipation ring. The inner radius of the isolation plate is greater than or equal to the radius of the limiting magnet, and the outer radius of the isolation plate is less than or equal to the inner radius of the heat dissipation ring. The upper surface of the heat dissipation ring is coupled to the lower surface of the upper housing assembly, the lower surface of the heat dissipation ring is coupled to the bottom of the groove structure of the lower housing assembly, and the outer surface of the heat dissipation ring is coupled to the magnetic sheet assembly; the upper surface of the heat dissipation ring is the surface of the heat dissipation ring near the upper housing assembly, the lower surface of the heat dissipation ring is the surface of the heat dissipation ring near the bottom of the groove structure of the lower housing assembly, and the lower surface of the upper housing assembly is the surface of the upper housing assembly that constitutes the cavity structure; The heat dissipation ring is used to conduct heat from the upper housing assembly and the magnetic coil to the bottom of the groove structure of the lower housing assembly.
2. The wireless charger according to claim 1, characterized in that, The upper surface of the limiting magnet is coupled to the lower surface of the upper housing assembly, and the lower surface of the limiting magnet is coupled to the bottom of the groove structure of the lower housing assembly; the upper surface of the limiting magnet is the surface of the limiting magnet near the upper housing assembly, and the lower surface of the limiting magnet is the surface of the limiting magnet near the bottom of the groove structure of the lower housing assembly. The limiting magnet is used to transfer the heat of the upper housing assembly to the bottom of the groove structure of the lower housing assembly.
3. The wireless charger according to claim 2, characterized in that, A thermally conductive colloid is provided between the upper surface of the limiting magnet and the lower surface of the upper housing assembly, and a thermally conductive colloid is provided between the lower surface of the limiting magnet and the bottom of the groove structure of the lower housing assembly.
4. The wireless charger according to claim 2, characterized in that, A thermally conductive colloid is provided between the heat dissipation ring and the limiting magnet.
5. The wireless charger according to claim 2, characterized in that, A thermally conductive colloid is provided between the upper surface of the heat dissipation ring and the upper housing assembly, and a thermally conductive colloid is provided between the lower surface of the heat dissipation ring and the bottom of the groove structure of the lower housing assembly.
6. The wireless charger according to claim 2, characterized in that, The magnetic sheet coil is coupled to the lower surface of the upper housing assembly, and a thermally conductive colloid is disposed between the magnetic sheet coil and the lower surface of the upper housing assembly.
7. The wireless charger according to claim 6, characterized in that, Thermally conductive colloid is disposed in the annular groove of the magnetic sheet assembly.
8. The wireless charger according to claim 1, characterized in that, The heat dissipation ring is made of a high thermal conductivity material.
9. The wireless charger according to claim 1, characterized in that, The upper housing assembly is made of a high thermal conductivity material. When the wireless charger wirelessly charges the electronic device, the upper housing assembly conducts the heat from the electronic device to the lower housing assembly through the heat dissipation ring.
10. The wireless charger according to claim 9, characterized in that, The upper housing assembly conducts heat from the electronic device to the lower housing assembly.
11. The wireless charger according to claim 9, characterized in that, The upper housing assembly conducts the heat of the electronic device to the lower housing assembly through the thermally conductive colloid.
12. The wireless charger according to claim 1, characterized in that, The heat dissipation ring conducts the heat from the magnetic coil to the lower housing assembly.
13. The wireless charger according to claim 1, characterized in that, The limiting magnet conducts the heat from the magnetic sheet coil to the lower housing assembly.
14. The wireless charger according to claim 1, characterized in that, The thermally conductive colloid conducts the heat from the magnetic coil to the lower housing assembly.
15. The wireless charger according to any one of claims 1-14, characterized in that, The groove structure includes a coil support plane, on which the magnetic sheet coil is disposed, and the coil support plane conducts the heat of the magnetic sheet coil to the lower housing assembly.