Plating equipment

Abstract

Provided is a plating device that can smoothly bring a plating liquid into contact with a surface to be plated and can suppress bubbles from remaining on the surface to be plated. The substrate holder of the plating device comprises: a head module for contacting and holding a substrate; a tilting module configured to tilt the head module; and a lifting module configured to lift and lower the head module. The tilting module comprises: a first component; a second component that supports the head module and is connected to the first component so as to be rotatable around a rotation axis; and an actuator for rotating the second component around the rotation axis. The rotation axis is offset from the center of the substrate held by the head module, and the lifting module is configured to lift and lower the substrate holder by lifting and lowering the first component of the tilting module.

Description

Technical Field

[0001] The present application relates to a plating device. Background Art

[0002] Conventionally, a so-called cup-type plating device is known as a plating device for plating a substrate (see, for example, Patent Document 1). Such a plating device comprises: a plating tank having an anode; a substrate holder disposed above the anode and holding the substrate as a cathode so that the plated surface of the substrate faces the anode; and a lifting mechanism for lifting the substrate holder.

[0003] However, in a cup-type plating device, when the substrate is immersed in the plating solution in the plating tank, bubbles may be generated on the surface of the plated surface of the substrate, and the bubbles are retained on the surface of the plated surface. When the substrate is plated in a state where bubbles are retained on the surface of the plated surface of the substrate, the plating quality may deteriorate. Therefore, the plating device involved in patent document 1 is equipped with a special mechanism (referred to as a "tilting mechanism") for tilting the substrate holder relative to the horizontal plane. According to such a plating device, in a state where the substrate holder is tilted by the tilting mechanism, the substrate holder is lowered by the lifting mechanism to immerse the substrate in the plating solution, so that the plated surface of the substrate can be immersed in the plating solution in a state tilted relative to the liquid level of the plating solution. Thus, the bubbles on the surface of the plated surface of the substrate can be removed from the surface of the plated surface by buoyancy, and the deterioration of the plating quality caused by bubbles can be suppressed.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2002-220692

[0005] As described above, when the substrate is immersed in the plating solution, the surface to be plated of the substrate is tilted relative to the liquid surface of the plating solution, so that the plating solution can smoothly contact the surface to be plated. Here, for the object of the plating treatment, that is, the substrate, the size or shape may be different depending on the desired use, etc. Therefore, as a mechanism for tilting the substrate to immerse it in the plating solution, it is considered that a mechanism suitable for the substrate can be adopted by developing various forms. Summary of the invention

[0006] The present invention has been made in view of the above circumstances, and one object of the present invention is to provide a plating device that can smoothly bring a plating solution into contact with a surface to be plated and suppress bubbles from remaining on the surface to be plated.

[0007] According to one embodiment, a plating device is proposed, which includes: a plating tank storing a plating solution and provided with an anode; and a substrate holder, which is arranged above the anode and is used to hold a substrate as a cathode facing the upper surface of the anode. The substrate holder has: a head module for contacting with the substrate to hold it; a tilting module configured to tilt the head module; and a lifting module configured to lift the head module. In addition, the tilting module has: a first component; a second component supporting the head module and connected to the first component so as to be rotatable around a rotation axis; and an actuator for rotating the second component around the rotation axis, the rotation axis being offset from the center of the substrate held by the head module, and the lifting module is configured to lift the substrate holder by lifting the first component of the tilting module. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a perspective view showing the overall structure of the plating apparatus according to the present embodiment.

[0009] Figure 2 It is a plan view showing the overall structure of the plating apparatus according to the present embodiment.

[0010] Figure 3 It is a longitudinal sectional view schematically showing the structure of the plating module according to the present embodiment.

[0011] Figure 4 1 is a diagram schematically showing a substrate holder according to the present embodiment, and shows a state in which the surface to be plated of a substrate held by the substrate holder is arranged along a horizontal plane.

[0012] Figure 5 This is a diagram schematically showing the substrate holder of the present embodiment, showing a state in which the plated surface of the substrate is inclined with respect to a horizontal plane.

[0013] Figure 6 It is a diagram schematically showing a substrate holder according to a modified example, in which the surface to be plated of the substrate held by the substrate holder is arranged along a horizontal plane.

[0014] Figure 7 This is a diagram schematically showing a substrate holder according to a modified example, in which the plated surface of the substrate is inclined with respect to a horizontal plane. DETAILED DESCRIPTION

[0015] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals and duplicate descriptions are omitted.

[0016] <Overall structure of plating equipment>

[0017] Figure 1 It is a perspective view showing the overall structure of the plating apparatus according to the present embodiment. Figure 2 1 is a top view showing the overall structure of the plating device of this embodiment. The plating device of this embodiment is used to perform plating treatment on a substrate. The substrate includes a square substrate and a circular substrate. Figure 1 , 2 As shown, the plating apparatus 1000 includes a loading / unloading module 100 , a conveying robot 110 , an aligner 120 , a pre-wetting module 200 , a pre-preg module 300 , a plating module 400 , a cleaning module 500 , a spin rinse dryer module 600 , a conveying device 700 , and a control module 800 .

[0018] The loading / unloading module 100 is a module for carrying substrates such as semiconductor wafers into the plating device 1000 or carrying out substrates from the plating device 1000, and is equipped with a box for accommodating substrates. In the present embodiment, 4 loading / unloading modules 100 are configured to be arranged in the horizontal direction, but the number and configuration of the loading / unloading modules 100 are arbitrary. The conveying robot 110 is a robot for conveying substrates, and is configured to hand over substrates between the loading / unloading module 100, the aligner 120 and the conveying device 700. When the substrate is handed over between the conveying robot 110 and the conveying device 700, the conveying robot 110 and the conveying device 700 can carry out the handover of the substrate via a temporary stand not shown in the figure. The aligner 120 is a module for aligning the position of the orientation flat (orientation flat), notch (notch), etc. of the substrate in a specified direction. In the present embodiment, 2 aligners 120 are configured to be arranged in the horizontal direction, but the number and configuration of the aligners 120 are arbitrary.

[0019] The pre-wetting module 200 is a module for making a treatment liquid (pre-wetting liquid) such as pure water or degassed water adhere to the plated surface of the substrate before the plating process. In the present embodiment, two pre-wetting modules 200 are arranged in the vertical direction, but the number and arrangement of the pre-wetting modules 200 are arbitrary. The pre-preg module 300 is a module for etching the oxide film on the plated surface of the substrate before the plating process. In the present embodiment, two pre-preg modules 300 are arranged in the vertical direction, but the number and arrangement of the pre-preg modules 300 are arbitrary.

[0020] The plating module 400 is a module for plating a substrate. In the present embodiment, there are two units of 12 plating modules 400, with 3 arranged in the vertical direction and 4 arranged in the horizontal direction, and a total of 24 plating modules 400 are provided, but the number and configuration of the plating modules 400 are arbitrary.

[0021] The cleaning module 500 is a module for cleaning a substrate after plating treatment. In the present embodiment, two cleaning modules 500 are arranged in an up-down direction, but the number and arrangement of the cleaning modules 500 are arbitrary. The spin-rinse-dry module 600 is a module for rotating a substrate after cleaning treatment at a high speed to dry it. In the present embodiment, two spin-rinse-dry modules are arranged in an up-down direction, but the number and arrangement of the spin-rinse-dry modules are arbitrary.

[0022] The transport device 700 is a device for transporting substrates between multiple modules in the plating apparatus 1000. The control module 800 is a module for controlling multiple modules of the plating apparatus 1000, and can be composed of, for example, a general computer or a dedicated computer having an input / output interface with an operator.

[0023] An example of a series of plating processes performed by the plating device 1000 is described. First, a substrate is carried into the loading / unloading module 100. Next, the conveying robot 110 takes out the substrate from the loading / unloading module 100 and conveys the substrate to the aligner 120. The aligner 120 aligns the positions of the orientation plane, the notch, etc. in a predetermined direction. The conveying robot 110 delivers the substrate aligned by the aligner 120 to the conveying device 700.

[0024] The conveying device 700 conveys the substrate received from the conveying robot 110 to the pre-wetting module 200. The pre-wetting module 200 performs a pre-wetting process on the substrate. The conveying device 700 conveys the substrate subjected to the pre-wetting process to the pre-preg module 300. The pre-preg module 300 performs a pre-preg process on the substrate. The conveying device 700 conveys the substrate subjected to the pre-preg process to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0025] The conveying device 700 conveys the substrate subjected to the plating process to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The conveying device 700 conveys the substrate subjected to the cleaning process to the spin rinse and dry module 600. The spin rinse and dry module 600 performs a drying process on the substrate. The conveying device 700 delivers the substrate subjected to the drying process to the conveying robot 110. The conveying robot 110 conveys the substrate received from the conveying device 700 to the loading / unloading module 100. Finally, the substrate is unloaded from the loading / unloading module 100.

[0026] In addition, Figure 1 , Figure 2 The structure of the plating apparatus 1000 described in the figure is merely an example, and the present invention is not limited to the structure of such an example.

[0027] <Structure of the plating module>

[0028] Next, the structure of the plating module 400 will be described. Since the 24 plating modules 400 in the present embodiment have the same structure, only one plating module 400 will be described. Figure 3 1 is a longitudinal sectional view schematically showing the structure of the plating module 400 of the first embodiment. The plating module 400 of the present embodiment is a cup type.

[0029] like Figure 3 As shown, the plating module 400 is provided with a plating tank 410 for accommodating a plating solution. The plating tank 410 is configured to include: a cylindrical inner tank, the upper surface of which is open; and an outer tank, not shown, which is arranged around the inner tank so as to accumulate the plating solution overflowing from the upper edge of the inner tank. The plating solution is stored inside the plating tank 410. As the plating solution Ps, any solution containing ions of metal elements constituting the plated film can be used, and its specific example is not particularly limited. In this embodiment, a copper plating process is used as an example of a plating process, and a copper sulfate solution is used as an example of a plating solution Ps.

[0030] The plating module 400 includes a diaphragm 420 that separates the interior of the inner tank of the plating tank 410 in the up-down direction. The interior of the inner tank is divided into a cathode region 422 and an anode region 424 by the diaphragm 420. The plating solution Ps is filled in the cathode region 422 and the anode region 424, respectively. In addition, in the present embodiment, an example of providing the diaphragm 420 is shown, but the diaphragm 420 may not be provided.

[0031] An anode 430 is provided on the bottom surface of the inner groove of the anode region 424. In addition, an anode cover 426 for adjusting electrolysis between the anode 430 and the substrate Wf is arranged in the anode region 424. The anode cover 426 is, for example, a substantially plate-shaped member made of a dielectric material, and is provided in front of (above) the anode 430. The anode cover 426 has an opening for the current flowing between the anode 430 and the substrate Wf to pass through. In addition, the above-mentioned diaphragm 420 may also be provided at the opening of the anode cover 426. In addition, the plating module 400 is not limited to having the anode cover 426, and may not have the anode cover 426.

[0032] A resistor 490 is disposed in the cathode region 422 and is opposite to the diaphragm 420. The resistor 490 is a component for achieving uniform plating treatment on the plated surface of the substrate Wf. As an example, the resistor 490 can be composed of a porous plate-like component or a plate-like component having a plurality of through holes connecting the anode side and the substrate side. In addition, the plating module 400 is not limited to having the resistor 490, and may not have the resistor 490. In addition, in the present embodiment, a paddle 492 is provided above the resistor 490. The paddle 492 is made of, for example, titanium (Ti) or resin. The paddle 492 stirs the plating solution by reciprocating in parallel with the plated surface of the substrate Wf, which is the object of the plating treatment, so as to uniformly supply sufficient metal ions to the surface of the substrate Wf during the plating of the substrate Wf.

[0033] The plating module 400 includes a substrate holder 440 for holding the substrate Wf in a state where the plated surface faces downward. The substrate holder 440 includes a head module 450 for contacting and holding the substrate Wf. As an example, the head module 450 is configured to hold the substrate Wf by vacuum adsorption of the substrate Wf and / or physically clamping and holding the substrate Wf. In addition, the substrate holder 440 includes a power supply contact for supplying power to the substrate Wf from a power supply not shown in the figure. In addition, in one embodiment, the substrate holder 440 includes a rotating module 480 for rotating the head module 450 around a vertical axis. The rotating module 480 can be implemented, for example, by a known mechanism such as a motor.

[0034] Figure 4 and Figure 5 It is a diagram schematically showing a substrate holder 440 according to this embodiment. Figure 4 The plated surface of the substrate Wf held by the substrate holder 440 is arranged along the horizontal plane Hp. Figure 5 The plated surface of the substrate Wf is tilted relative to the horizontal plane Hp. Figure 4 and Figure 5 As shown, the plating module 400 includes a tilting module 460 configured to tilt the head module 450 and a lifting module 470 configured to lift and lower the head module 450 .

[0035] like Figure 4 and Figure 5 As shown, the tilt module 460 includes: a first component 462 connected to the lifting module 470; and a second component 464 connected to the first component 462 so as to be rotatable around the rotation axis Ra. The first component 462 and the second component 464 are not limited and can be formed of metal or resin. Figure 4 and Figure 5In the example shown, the first component 462 is a plate-shaped component extending in the vertical direction (i.e., the plate surface faces the vertical direction). Figure 4 and Figure 5 The first component 462 is connected to the first component 462 in a rotatable manner (in the example shown, the right end). That is, in the tilt module 460 of this embodiment, the rotation axis Ra of the first component 462 and the second component 464 is offset from the center Cw of the substrate Wf. In other words, the rotation axis Ra does not pass through the center of the substrate Wf, but deviates from the center of the substrate Wf. In addition, the first component 462 is connected to the lifting module 470 and is lifted and lowered by the lifting module 470, and the second component 464 supports the head module 450 and the rotation module 480.

[0036] The tilt module 460 also includes an actuator 466 for rotating the second component 464 around the rotation axis Ra. In the present embodiment, the actuator 466 is configured such that one end 466a is connected to the first component 462, and the other end 466b is connected to the second component 464, and the second component 464 rotates due to the extension and retraction of the actuator 466. Although not limited to this, in the present embodiment, one end 466a of the actuator 466 is connected to a position vertically above the rotation axis Ra in the first component 462, and the other end 466b is connected to an end (left end) on the side opposite to the end (right end) on the side of the rotation axis Ra in the second component 464. In addition, the actuator 466 is not limited to Figure 3 and Figure 4 The example shown, for example, can adopt a known mechanism using one or more of a fluid actuator, a solenoid, a ball screw or a motor. In addition, in the present embodiment, although not limited, the center of gravity of the second component 464 is located between the center of the substrate Wf and the rotation axis Ra in the horizontal direction. Thus, the force used to rotate the second component 464 can be reduced. In addition, in the present embodiment, as an example, the rotation module 480 has a motor 480a, and the rotation axis of the motor 480a is offset from the center Cw of the substrate Wf. Moreover, the motor 480a is arranged between the center Cw of the substrate Wf and the rotation axis Ra in the horizontal direction. Thus, the force used to rotate the second component 464 can be reduced.

[0037] Thus, in the tilt module 460, the second member 464 rotates around the rotation axis Ra due to the operation of the actuator 466, thereby making it possible to tilt the head module 450 and the substrate Wf (see FIG. 1 ). Figure 4 and Figure 5 ). In addition, the lifting module 470 can lift the head module 450 and the substrate Wf in a tilted state by lifting the first component 462 of the tilting module 460. In addition, the specific structure of the lifting module 470 is not particularly limited, and for example, a known mechanism such as a lifting mechanism having a ball screw and a rotary motor can be used.

[0038] In the present embodiment, the substrate holder 440 is provided with a position adjustment module 474 for compensating the horizontal and vertical positions of the substrate Wf when the head module 450 is tilted by the tilt module 460. The position adjustment module 474 has: a first mechanism 476 for compensating for the horizontal movement; and a second mechanism 477 for compensating for the vertical movement. The specific structure of the first mechanism 476 and the second mechanism 477 is not particularly limited, for example, a known mechanism such as a position adjustment mechanism having a ball screw and a rotary motor can be used. In addition, in the present embodiment, the first mechanism 476 and the second mechanism 477 are respectively configured to move the lifting module 470 supporting the tilt module 460, but are not limited to such an example. In addition, the conveying device 700 or the lifting module 470 may also constitute at least one of the first mechanism 476 and the second mechanism 477. Preferably, when the head module 450 is tilted by the tilt module 460, the position adjustment module 474 moves the head module 450 in the horizontal and vertical directions so that the center of the substrate Wf does not move. In addition, the substrate holder 440 may include only one of the first mechanism 476 and the second mechanism 477 as the position adjustment module 474 , or may not include the position adjustment module 474 .

[0039] <Plating treatment>

[0040] Here, the plating process in the plating module 400 of the present embodiment is described in more detail. In the plating module 400 of the present embodiment, first, the plated surface of the substrate Wf is tilted by the tilting module 460 to the horizontal plane Hp at a tilt angle α (see Figure 5 ). In addition, it is preferred that the inclination angle α is an angle selected from a range of more than 1 degree (°) and less than 5 degrees (°). In addition, at this time, the position adjustment module 474 is used to adjust so that the center position of the substrate Wf does not move. In this state, the lifting module 470 is used to immerse the substrate Wf in the plating solution of the cathode area 422, so that the substrate Wf is exposed to the plating solution. As a result, the plated surface of the substrate Wf is tilted at an inclination angle α relative to the liquid surface of the plating solution Ps (the liquid surface is a surface parallel to the horizontal plane Hp, which is a kind of horizontal plane), and the substrate Wf is exposed to the plating solution. Therefore, the plating solution can smoothly contact the plated surface, and bubbles can be suppressed from remaining on the plated surface.

[0041] In addition, in the present embodiment, although not limited thereto, when the substrate Wf is immersed in the plating solution Ps, the rotating module 480 rotates the head module 450. That is, while the plated surface of the substrate Wf is tilted relative to the horizontal plane Hp by the tilting module 460 and the substrate Wf is rotated by the rotating module 480, the lifting module 470 lowers the substrate Wf to immerse it in the plating solution Ps. Thus, it is possible to further suppress bubbles from remaining on the plated surface of the substrate Wf.

[0042] Then, if the substrate Wf is immersed in the plating liquid Ps, the tilting module 460 rotates the second component 464 so that the plated surface of the substrate Wf is configured along the horizontal plane Hp. At this time, the position adjustment module 474 is used again to adjust so that the center position of the substrate Wf does not move. Then, the plating module 400 applies a voltage between the anode 430 and the substrate Wf in a state where the substrate Wf has been immersed in the plating liquid Ps, so that the plated surface of the substrate Wf can be plated. In addition, in one embodiment, the substrate Wf (head module 450) is rotated while the plating process is performed using the rotating module 480. Through the plating process, a conductive film (plating film) is precipitated on the plated surface of the substrate.

[0043] <Modification>

[0044] Figure 6 and Figure 7 It is a diagram schematically showing a substrate holder according to a modified example. Figure 6 The plated surface of the substrate held by the substrate holder is arranged along a horizontal plane. Figure 7 This is a state in which the plated surface of the substrate is inclined relative to the horizontal plane. In addition, regarding the substrate holder 440A of the modification example, description of the parts that overlap with the substrate holder 440A of the above-described embodiment will be omitted.

[0045] like Figure 6 and Figure 7 As shown, the substrate holder 440A of the modified example has a tilting module 460A. The tilting module 460A has: a first component 462A connected to the lifting module 470; and a second component 464A connected to the first component 462A so as to be rotatable around the rotation axis Ra2. In the above-mentioned embodiment, the second component 464 is at its end (at Figure 4 The first component 462 is connected to the second component 464A in a rotatable manner, but in a modified example, the second component 464A is connected to the second component 464A in a rotatable manner at a position substantially in the center in the horizontal direction. However, the rotation axis Ra2 of the second component 464A is located vertically above the substrate Wf held by the head module 450. That is, the rotation axis Ra2 of the second component 464A intersects with an axis extending vertically through the center of the plated surface of the substrate Wf, and is offset from the center of the substrate Wf.

[0046] In addition, the tilt module 460A of the modified example includes an actuator 466A for rotating the second member 464A. As an example, the actuator 466A is configured such that one end 466Ab and the end portion of the second member 464A (at Figure 6 and Figure 7 The other end 466Aa is connected to the first component 462A, and the second component 464A rotates due to the extension and contraction of the actuator 466A. In addition, in the tilt module 460A of the modified example, the actuator 466A is not limited to such an example, and various mechanisms can be used.

[0047] In addition, the tilting module 460A of the modified example has a force applying member 468 that applies force to the second member 464A so that the plated surface of the substrate Wf is along the horizontal plane Hp. In this embodiment, a coil spring is used as the force applying member 468, but it is not limited to such an example, and various mechanisms such as a leaf spring and a force applying member using magnetic force can be used. By providing such a force applying member 468, the tilting and release of the head module 450 can be smoothly performed. In addition, in the tilting module 460 of the above-mentioned embodiment, such a force applying member can also be provided.

[0048] In the substrate holder 440A of the modified example described above, the substrate Wf can be brought into contact with the plating solution Ps in an inclined state, similarly to the substrate holder 440 of the above-described embodiment. Therefore, the plating solution Ps can smoothly contact the surface to be plated, and bubbles can be suppressed from remaining on the surface to be plated.

[0049] The present invention can also be described in the following aspects.

[0050] [Method 1] According to method 1, a plating device is proposed, which includes: a plating tank storing a plating solution and provided with an anode; and a substrate holder, which is arranged above the anode and is used to face the upper surface of the anode to hold the substrate as a cathode. The substrate holder includes: a head module for contacting with the substrate to hold it; a tilting module configured to tilt the head module; and a lifting module configured to lift the head module. In addition, the tilting module includes: a first component; a second component supporting the head module and connected to the first component so as to be rotatable around a rotation axis; and an actuator for rotating the second component around the rotation axis, wherein the rotation axis is offset from the center of the substrate held by the head module, and the lifting module is configured to lift the substrate holder by lifting the first component of the tilting module.

[0051] According to aspect 1, the plating solution can smoothly contact the surface to be plated, and bubbles can be suppressed from remaining on the surface to be plated.

[0052] [Method 2] According to Method 2, on the basis of Method 1, there is also a position adjustment module configured to move the above-mentioned head module in the horizontal direction. When the above-mentioned head module is tilted by the above-mentioned tilting module, the above-mentioned position adjustment module moves the above-mentioned head module in the horizontal direction so as to compensate for the horizontal movement of the center of the substrate held on the above-mentioned head module.

[0053] According to aspect 2, when the head module is tilted by the tilt module, it is possible to compensate for the horizontal movement of the center of the substrate.

[0054] [Method 3] According to Method 3, on the basis of Method 2, the position adjustment module is configured to move the head module in the horizontal direction and the vertical direction, and when the head module is tilted by the tilt module, the head module is moved in the horizontal direction and the vertical direction, so as to compensate for the horizontal and vertical movement of the center of the substrate held on the head module.

[0055] According to aspect 3, when the head module is tilted by the tilt module, it is possible to compensate for the movement of the center of the substrate in the horizontal direction and the vertical direction.

[0056] [Mode 4] According to Mode 4, based on Modes 1 to 3, the first member is a plate-like member extending vertically, and the second member is rotatably connected to the first member at an end in the horizontal direction.

[0057] [Mode 5] According to Mode 5, based on Modes 1 to 4, the second component is rotatably connected to the first component at one end side in the horizontal direction, and is connected to the actuator at the other end side in the horizontal direction.

[0058] [Mode 6] According to Mode 6, based on Modes 1 to 3, the above-mentioned rotation axis intersects with an axis extending vertically through the center of the plated surface of the above-mentioned substrate.

[0059] [Mode 7] According to Mode 7, in addition to Modes 1 to 6, the tilt module includes a biasing member that biases the second member in a direction in which the plated surface of the substrate becomes horizontal.

[0060] According to aspect 7, the tilt module can drive the head module more smoothly.

[0061] [Mode 8] According to Mode 8, in addition to Modes 1 to 7, a rotation module is further provided, wherein the rotation module is configured to rotate the substrate around a rotation axis extending vertically through the center of the plated surface.

[0062] According to aspect 8, the plating process can be performed while the substrate is rotated and immersed in the plating solution and / or while the substrate is rotated.

[0063] [Mode 9] According to Mode 9, based on Mode 8, the above-mentioned rotating module is supported by the above-mentioned second component.

[0064] [Mode 10] According to Mode 10, based on Modes 1 to 9, the tilt module tilts the head module at an angle of not less than 1 degree and not more than 5 degrees.

[0065] [Mode 11] According to Mode 11, in addition to Modes 1 to 10, there is further provided a resistor, which is arranged above the anode and below the substrate holder in the interior of the plating tank.

[0066] The above has been described the embodiments of the present invention, but the embodiments of the invention described above are intended to make the present invention easy to understand and do not limit the present invention. Of course, the present invention can be changed and improved without departing from its main purpose, and the present invention includes its equivalents. In addition, within the scope of at least a part of the above-mentioned problems that can be solved or within the scope of at least a part of the effect, any combination of the embodiments and variations can be performed, and any combination or omission of the various constituent elements recorded in the technical solution and the specification for protection of this application can be performed.

[0067] Description of Reference Numerals

[0068] 400…plating module; 410…plating tank; 420…diaphragm; 430…anode; 440, 440A…substrate holder; 450…head module; 460, 460A…tilt module; 462, 462A…first component; 464, 464A…second component; 466, 466A…actuator; 468…force-applying component; 470…lifting module; 474…position adjustment module; 476…first mechanism; 477…second mechanism; 480…rotation module; 490…resistor; 800…control module; 1000…plating device; Wf…substrate; Cs…center of substrate; Ra, Ra2…rotation axis.

Claims

1. A plating device, characterized in that: have: a plating tank storing a plating solution and provided with an anode; and a substrate holder disposed above the anode and used to face the upper surface of the anode to hold the substrate serving as the cathode, The substrate holder has: A head module, used for contacting with the substrate to hold it; a tilting module configured to tilt the head module; and A lifting module is configured to lift the head module. The tilt module comprises: a first component; a second component supporting the head module and connected to the first component so as to be rotatable around a rotation axis; and an actuator for rotating the second component around the rotation axis. The rotation axis is offset from the center of a base plate held by the head module, The lifting module is configured to lift the substrate holder by lifting the first member of the tilting module. The first component has a vertically extending portion extending in the vertical direction, and the lifting module is connected to one end side of the vertically extending portion in the horizontal direction. The rotation axis extends perpendicularly relative to a direction in which the lifting modules are connected in the first component.

2. The plating device according to claim 1, characterized in that: further comprising a position adjustment module configured to move the head module in a horizontal direction, When the head module is tilted by the tilting module, the position adjustment module moves the head module in a horizontal direction so as to compensate for the horizontal movement of the center of the substrate held by the head module.

3. The plating device according to claim 2, characterized in that: The position adjustment module is configured to move the head module in the horizontal and vertical directions. When the head module is tilted by the tilt module, the head module is moved in the horizontal and vertical directions so as to compensate for the horizontal and vertical movement of the center of the substrate held on the head module.

4. The plating device according to claim 1, characterized in that: The actuator has a first end connected to the first component and a second end connected to the second component, and is configured to rotate the second component relative to the first component by extending and retracting.

5. The plating device according to claim 1, characterized in that: The first member has a horizontal extension portion extending from the vertical extension portion in a direction opposite to the one end side. The second component has a portion extending in the horizontal direction and is rotatably connected to the horizontally extending portion of the first component. The first end of the actuator is connected to the vertically extending portion of the first member, and the second end of the actuator is connected to one end side of the second member.

6. The plating device according to claim 1, characterized in that: The rotation axis intersects an axis extending perpendicularly through a center of a plated surface of the substrate.

7. The plating device according to any one of claims 1 to 6, characterized in that: The tilt module includes a biasing member disposed between a portion of the second member connected to the actuator and a portion of the second member connected to the first member, and biasing the second member in a direction in which a plated surface of the substrate becomes horizontal.

8. The plating device according to any one of claims 1 to 6, characterized in that: A rotating module is further provided, the rotating module being configured to rotate the substrate around a rotating axis extending perpendicularly through the center of the surface to be plated.

9. The plating device according to claim 8, characterized in that: The rotating module is provided vertically above the center of the surface to be plated of the substrate in a state in which the surface to be plated of the substrate is horizontal, and is supported by the second member.

10. The plating device according to any one of claims 1 to 6, characterized in that: The tilt module tilts the head module at a tilt angle of not less than 1 degree and not more than 5 degrees.

11. The plating device according to any one of claims 1 to 6, characterized in that: A resistor is further provided. The resistor is arranged above the anode and below the substrate holder in the plating tank.

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