Light emitting device

Abstract

The present application provides a light emitting device with high reliability. The light emitting device comprises a substrate having an upper surface; a light emitting element disposed on the upper surface of the substrate; a joining member disposed on the upper surface of the substrate outside the light emitting element; a light-transmissive member joined with a portion of the upper surface of the substrate through the joining member; and a protective film covering the upper surface of the substrate and the light emitting element, wherein a gap is provided between the upper surface of the substrate and a lower surface of the light-transmissive member, the gap is communicated from a space for disposing the light emitting element to an outside of the light emitting device, and the gap is provided by the upper surface of the substrate, the lower surface of the light-transmissive member and the joining member, and the protective film continuously covers the light emitting element, the upper surface of the substrate, a side surface of the joining member and the lower surface of the light-transmissive member.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a light emitting device. BACKGROUND

[0002] A light emitting device provided with a package, a light emitting element disposed in the package, a joining member disposed on the upper surface of the package, and a light-transmissive member joined to the upper surface of the package by the joining member is proposed (see Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2018-6456

[0004] In such a light emitting device, further improvement in reliability is required. The present disclosure provides a light emitting device with high reliability. SUMMARY

[0005] A light emitting device according to an embodiment of the present disclosure is provided with: a substrate having an upper surface; a light emitting element placed on the upper surface of the substrate; a joining member disposed on the upper surface of the substrate outside the light emitting element; a light-transmissive member joined to a part of the upper surface of the substrate by the joining member; and a protective film covering the upper surface of the substrate and the light emitting element, the light emitting device having a gap between the upper surface of the substrate and the lower surface of the light-transmissive member, the gap being continuous from a space in which the light emitting element is disposed to the outside of the light emitting device, and the gap being provided by the upper surface of the substrate, the lower surface of the light-transmissive member, and the joining member, the protective film continuously covering the light emitting element, the upper surface of the substrate, the side surface of the joining member, and the lower surface of the light-transmissive member.

[0006] According to the present disclosure, a light emitting device with high reliability can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0007] Figure 1 is a schematic top view of a light emitting device according to Embodiment 1.

[0008] Figure 2 is a schematic bottom view of a light emitting device according to Embodiment 1.

[0009] Figure 3 is a schematic cross-sectional view of Figure 1 at the III-III line.

[0010] Figure 4 is a schematic end view of a cut surface at the IV-IV line of Figure 1

[0011] Figure 5 is a schematic cross-sectional view of a joining member and its surroundings in a light emitting device according to Embodiment 1, shown on an enlarged scale. ​

[0012] Figure 6 is a schematic top view showing a configuration of the joining member.

[0013] Figure 7 is a schematic bottom view of the light-transmissive member.

[0014] Figure 8 is a schematic top view showing another configuration example of the joining member 30.

[0015] Figure 9A is a schematic sectional view illustrating a manufacturing method of the light-emitting device according to Embodiment 1.

[0016] Figure 9B is a schematic sectional view illustrating a manufacturing method of the light-emitting device according to Embodiment 1.

[0017] Figure 10 is a schematic end view showing only a cut surface of the light-emitting device according to Embodiment 2.

[0018] REFERENCE SIGNS: 10, 210... substrate, 20... light-emitting element, 30... joining member, 40, 240... light-transmissive member, 51... first metal film, 52... second metal film, 60... protective film, 70... gap, 80... protective element, 100, 200... light-emitting device. DETAILED DESCRIPTION

[0019] Hereinafter, embodiments of the present application will be described appropriately with reference to the attached drawings. The modes described below are modes for embodying the technical idea of the present application, and the present application is not limited to the modes below unless specifically recited. In addition, the size, positional relation and the like of the components shown in the drawings are sometimes exaggerated in order to make the explanation clear.

[0020] Hereinafter, the present application will be described in detail based on the drawings. Furthermore, in the following description, terms indicating specific directions, positions (for example, "upper", "lower", and other terms including these terms) are used as necessary, but the use of these terms is for the purpose of facilitating understanding of the application with reference to the drawings, and does not limit the technical scope of the present application by the meaning of these terms. In addition, portions of the same reference numerals shown in multiple drawings represent the same or equivalent portions or components.

[0021] Furthermore, the embodiments shown below are illustrative examples of backlight light sources used to concretize the technical concept of the present invention, and do not limit the present invention to the following. Also, unless specifically stated otherwise, the dimensions, materials, shapes, and relative arrangements of the constituent components described below are not intended to limit the scope of the present invention, but are merely illustrative. Furthermore, the content described in one embodiment or example can be applied to other embodiments or examples. Additionally, the size and positional relationships of the components shown in the drawings are sometimes exaggerated to make the explanation clearer.

[0022] [Implementation Method 1]

[0023] Figure 1 This is a schematic top view of the light-emitting device involved in this embodiment. Figure 2 This is a schematic bottom view of the light-emitting device involved in this embodiment. Figure 3 yes Figure 1 A schematic cross-sectional view at line III-III. Figure 4 Is only shown Figure 1 A schematic end view of the cross-section at line IV-IV. Figure 5 This is a schematic cross-sectional view showing the connecting member and its surroundings in the light-emitting device according to this embodiment, magnified.

[0024] Figure 3 The illustrated light-emitting device 100 includes: a substrate 10 having an upper surface 10a; a light-emitting element 20 mounted on the upper surface 10a; a bonding member 30 disposed on the upper surface 10a outside the light-emitting element 20; a light-transmitting member 40 bonded to a portion of the upper surface 10a via the bonding member 30; and a protective film 60 covering the upper surface 10a of the substrate 10 and the light-emitting element 20. A gap 70 extends from the space where the light-emitting element 20 is disposed to the outside of the light-emitting device 100 between the upper surface 10a of the substrate 10 and the lower surface 40b of the light-transmitting member 40. The gap 70 is formed by the upper surface 10a of the substrate 10, the lower surface 40b of the light-transmitting member 40, and the bonding member 30. The protective film 60 continuously covers the light-emitting element 20, the upper surface 10a of the substrate 10, the side surface 30c of the bonding member 30, and the lower surface 40b of the light-transmitting member 40.

[0025] exist Figure 1 In the example shown, the substrate 10 has a flat base 11 and a sidewall portion 12 disposed on the base 11. The base 11 and the sidewall portion 12 can be integral or separate. A first recess is defined by the base 11 and the sidewall portion 12. The first upper surface 11a of the base 11 is the bottom of the first recess. A light-emitting element 20 is disposed on the first upper surface 11a. The shape of the first upper surface 11a is, for example, rectangular when viewed from above. Figure 6As shown, the upper surface of the side wall portion 12, that is, the second upper surface 12a is located outward of the light emitting element 20 when viewed from above. The shape of the second upper surface 12a is, for example, a frame shape in which the outer shape is rectangular when viewed from above.

[0026] The first wiring 14 of which the polarity is positive or negative is arranged on the first upper surface 11a of the base 10. The light emitting element 20 is flip-chip mounted to the base 10. Specifically, the light emitting element 20 of which the electrodes are positive or negative is used, and the electrodes of the light emitting element 20 are electrically connected to the first wiring 14 of the base 10 via a conductive member, respectively. As the conductive member, for example, a eutectic solder in which gold and tin, tin and silver, and copper, or the like are used as main components, a conductive paste containing silver, gold, palladium, or the like, a bump containing silver or gold, or the like can be used. In addition, the light emitting element 20 can be connected to the first wiring 14 of the base 10 by a wire (mounting with the face upward). The second wiring 15 is arranged on the lower surface 10b of the base 10. The base portion 11 of the base 10 has a through-hole, and an internal wiring (not shown) is arranged in the through-hole. The first wiring 14 and the second wiring 15 are connected by the internal wiring, respectively. The second recess 16 can or can not be provided on the side surface 16c of the base 10 on the lower surface 10b side of the base 10. The second recess 16 is arranged from the lower surface 10b of the base 10 to the outer surface 10c. In the case where the second recess 16 is provided, the second wiring 15 is also arranged to the outer surface 16c of the base 10 that divides the second recess 16. When the second wiring 15 of the light emitting device 100 is joined to another mounting substrate or the like using solder or the like, the solder can enter the second recess 16. Thus, the second wiring 15 can be electrically connected more stably.

[0027] The light-transmissive member 40 is a member having at least light-transmissivity to transmit light from the light emitting element 20, and transmits 60% or more of the light emitted from the light emitting element 20, and preferably transmits 90% or more. The shape of the light-transmissive member 40 is, for example, rectangular when viewed from above. The light-transmissive member 40 can be a lens shape in which the upper surface and / or the lower surface is a spherical surface or an aspherical surface, in addition to the flat plate shape as shown. Figure 1 and Figure 3 The light-transmissive member 40 can be a lens shape in which the upper surface and / or the lower surface is a spherical surface or an aspherical surface, in addition to the flat plate shape as shown.

[0028] The joining member 30 joins the second upper surface 12a of the side wall portion 12 of the base 10 and the light-transmissive member 40. When viewed from above, the side wall portion 12 is arranged so as to surround the light emitting element 20, and therefore the joining member 30 is preferably arranged so as to surround the light emitting element 20. The joining member 30 is arranged locally, not on the entire surface of the second upper surface 12a of the base 10. In the portion where the joining member 30 is not arranged, the light-transmissive member 40 is arranged so as to be in contact with the second upper surface 12a of the base 10. Figure 4As shown, a gap 70 is provided between the second upper surface 12a of the base 10 and the lower surface 40b of the light-transmissive member 40 by the second upper surface 12a of the base 10, the lower surface 40b of the light-transmissive member 40, and the joining member 30. The gap 70 penetrates from the space in which the light emitting element 20 is disposed to the outside of the light emitting device 100. That is, the space in which the light emitting element 20 is disposed becomes a non-airtight space with respect to the outside of the light emitting device 100.

[0029] In Figure 6 In the example shown, a plurality of joining members 30 are disposed. The joining members 30 are disposed at the four corners of the rectangular second upper surface 12a when viewed from the top. As such, in the case where a plurality of joining members 30 are disposed, the joining property of the base 10 and the light-transmissive member 40 can be improved by being disposed symmetrically with respect to the center point of the base 10 when viewed from the top or being disposed line-symmetrically with respect to the line connecting the centers of the respective two opposite sides of the base 10 when viewed from the top. Further, the number of joining members 30, the positions at which they are disposed, and the like are not particularly limited as long as it is possible to ensure that, when the light-transmissive member 40 is joined to the base 10, it is possible to supply a gaseous raw material from the gap 70 into the space in which the light emitting element 20 is disposed in the process of forming the protective film 60, which will be described later. In Figure 6 In the example shown, two joining members 30 are disposed on each side of the base 10. Alternatively, one or more than three joining members 30 can be disposed on each side of the base 10. The positions at which the joining members 30 are disposed can be, for example, positions other than the four corners of the base 10, such as the center of the side of the base 10. Alternatively, the joining members 30 can be disposed over two or more sides of the base 10. For example, one joining member 30 can be disposed over three or four sides of the base 10, and one gap can be provided. In the case where a plurality of joining members 30 are disposed, at least one joining member 30 can be disposed over two or more sides of the base 10.

[0030] In Figure 6In the example shown, a gap 70 is provided on each side of the substrate 10. There can be one gap 70 or multiple gaps 70. Two or more gaps 70 can also be provided on each side of the substrate 10. The height of the gap 70 (the thickness of the bonding member 30 between the second upper surface 12a and the lower surface 40b of the light-transmitting member 40) can be, for example, 1 μm to 100 μm. Preferably, the height of the gap 70 is 10 μm to 50 μm. Furthermore, in the case of having a first metal film 51 and a second metal film 52 described later, this refers to the thickness of the bonding member 30 between the first metal film 51 and the second metal film 52. The width of the gap 70 is not particularly limited as long as it can be ensured that gaseous raw materials can be supplied from the gap 70 to the space where the light-emitting element 20 is disposed during the process of forming the protective film 60 described later. Preferably, the width of the bonding member 30 in the direction perpendicular to the edge of the substrate 10 (…) Figure 5 The width of the second upper surface 12a of the substrate 10 is 30W. Figure 5 The proportion of 12W in the substrate is, for example, more than 50%. The width of the second upper surface 12a in the direction perpendicular to the edge of the substrate 10 can be, for example, more than 0.3 mm and less than 0.7 mm. The width of the joining member 30 in the direction perpendicular to the edge of the substrate 10 can be, for example, more than 0.2 mm and less than 0.5 mm.

[0031] The first metal film 51 can be disposed on the second upper surface 12a of the substrate 10, or it can be left undisposed. Figure 6 In the example shown, the first metal film 51 is located between the bonding member 30 and the second upper surface 12a of the substrate 10. The first metal film is a rectangular frame shape when viewed from above, with rounded corners at its four corners. With the first metal film 51, the bonding member 30 is disposed on the first metal film 51.

[0032] The second metal film 52 can be disposed on the outer periphery of the lower surface 40b of the light-transmitting component 40, or it can be omitted. Figure 7 In the example shown, the second metal film 52 is located between the bonding member 30 and the lower surface 40b of the light-transmitting member 40. The second metal film 52 is opposite to the second upper surface 12a of the substrate 10. The second metal film 52 is a rectangular frame shape when viewed from above from the lower surface 40b of the light-transmitting member 40, with rounded corners (a spoon-shaped surface). With the second metal film 52, the bonding member 30 is bonded to the second metal film 52.

[0033] The protective film 60 is made of inorganic material and continuously covers the substrate 10, the light-emitting element 20, the bonding component 30, and the light-transmitting component 40. Figure 3 as well as Figure 4In the example shown, the protective film 60 covers the lower surface 10b and outer side surface 10c of the substrate 10 (excluding the surface of the second wiring 15), the side surface 30c of the bonding member 30, and the surface of the light-transmitting member 40, constituting a portion of the lower surface and side surface, as well as the upper surface, of the outer surface of the light-emitting device 100. In the case of a second recess 16, the protective film 60 preferably also covers the downward-facing surface 16b of the substrate 10 that divides the second recess 16. Additionally, the protective film 60 covers the inner side surface 10d of the sidewall portion 12 of the substrate 10 that divides the first recess of the substrate 10, and the first upper surface 11a of the base 11. Furthermore, below the light-emitting element 20, the protective film 60 covers the lower surface of the light-emitting element 20, the side surface of the conductive member, and the first upper surface 11a of the substrate 10 located below the light-emitting element 20. Preferably, the protective film 60 covers the light-emitting element 20, the second upper surface 12a of the substrate 10, the side surface 30c of the bonding member 30 sandwiched between the second upper surface 12a of the substrate 10 and the lower surface of the light-transmitting member 40, and the lower surface 40b of the light-transmitting member 40 in a manner without gaps such as holes or cracks. Figure 3 as well as Figure 4 In the light-emitting device 100 shown, the protective film 60 covers the surface of the substrate 10, the surface of the light-emitting element 20, the side 30c of the bonding member 30, and the surface of the light-transmitting member 40, except for the surface of the second wiring 15.

[0034] The light-emitting device 100 may or may not have protective components such as Zener diodes. Figure 6 In the example shown, a protective element 80 is disposed on the first upper surface 11a of the substrate 10.

[0035] The elements constituting the light-emitting device 100 will be described below.

[0036] (Matrix 10)

[0037] The substrate 10 is used to mount the light-emitting element 20. Figure 3 In the example shown, the substrate 10 has a flat base 11 and a sidewall portion 12 disposed on the base 11. A light-emitting element 20 is disposed on a first upper surface 11a of the base 11, and a connecting member 30 is disposed on a second upper surface 12a of the sidewall portion 12. The shape of the first upper surface 11a of the base 11, divided by the sidewall portion 12, is, for example, rectangular when viewed from above.

[0038] The substrate 10 includes an insulating base material, a first wiring 14, and a second wiring 15. Examples of materials that can be used as the insulating base material include ceramics, glass epoxy resins, and resins. As a ceramic, ceramics with high heat resistance and weather resistance are preferred; examples of such ceramics include alumina, aluminum nitride, and mullite.

[0039] The first upper surface 11a of the base 10 has a first wiring 14. The lower surface 10b of the base 10 has a second wiring 15. The material of the first wiring 14 and the second wiring 15 can be formed by a material known in the art. The first wiring 14 and the second wiring 15 can use, for example, a metal such as copper, aluminum, gold, silver, or the like.

[0040] (Light emitting element 20)

[0041] The light emitting element 20 is disposed on the first upper surface 11a of the base portion 11 of the base 10. As the light emitting element 20, a light emitting diode, a laser diode, or the like can be used.

[0042] The light emitting peak wavelength of the light emitting element 20 is not particularly limited, and a light emitting element having a desired light emitting peak wavelength can be appropriately selected, and for example, a light emitting element having a light emitting peak wavelength of 250 nm or more and 600 nm or less can be used. For example, by using a light emitting diode that emits ultraviolet light, it can be used as a light source for sterilization or disinfection. The light emitting peak wavelength of the light emitting element 20 that emits ultraviolet light is, for example, 400 nm or less. The light emitting element 20 that emits ultraviolet light is in a tendency to easily deteriorate due to moisture or the like, so by being covered by the protective film 60, the effect of reducing deterioration is more significant.

[0043] It is preferable that the light emitting element 20 be, for example, a light emitting element using a nitride semiconductor layer containing In X Al Y Ga 1－X－Y N (0≤X, 0≤Y, X+Y≤1). In the case of using a light emitting element that emits light in the wavelength range from deep ultraviolet to ultraviolet, it is preferable to have a nitride semiconductor layer containing at least Al. The light emitting element 20 has at least a semiconductor layer including a light emitting layer, and positive and negative electrodes. The light emitting element 20 related to the present embodiment is provided with positive and negative electrodes on the same surface. Therefore, the light emitting element 20 and the base 10 can be flip-chip mounted, and the light emitting device 100 can be miniaturized compared to the case where the light emitting element 20 and the base 10 are electrically connected by a wire. Furthermore, the surface opposite to the surface having the electrodes can be joined to the first upper surface 11a of the base 10, and the positive and negative electrodes of the light emitting element 20 and the positive and negative first wirings 14 of the base 10 can be electrically connected by wires, respectively. Alternatively, a light emitting element having an electrode of either one of positive and negative on the upper surface and an electrode of the other on the lower surface can be used.

[0044] In addition to the semiconductor layer and electrodes described above, the light-emitting element 20 may also have a substrate for growing the semiconductor layer. Examples of substrates include insulating substrates such as sapphire, lithium niobate, and neodymium gallium oxide, or conductive substrates such as SiC, ZnO, Si, and GaAs. Preferably, the substrate is transparent. Furthermore, the substrate can be removed using methods such as laser lift-off.

[0045] exist Figure 6 In the example shown, the light-emitting element 20 is disposed at the center of the first upper surface 11a. Additionally, in Figure 6 In the example shown, the light-emitting device 100 is equipped with one light-emitting element 20. The light-emitting device 100 may also be equipped with multiple light-emitting elements 20. The light-emitting element 20, when viewed from above, can be, for example, rectangular in shape. In this case, it is preferable that the length of one side of the light-emitting element 20 when viewed from above is, for example, 50 μm to 3000 μm, more preferably 300 μm to 2000 μm. Furthermore, the shape of the light-emitting element 20 when viewed from above can also be, for example, a triangle, a hexagon, or a polygon.

[0046] (Jointing component 30)

[0047] The bonding member 30 bonds the substrate 10 to the light-transmitting member 40. When the light-emitting device 100 has a first metal film 51 and a second metal film 52, the bonding member 30 is disposed between the first metal film 51 and the second metal film 52. Examples of materials that can be used for the bonding member 30 include solder, low-melting-point glass, and resin. Examples of solder materials include Au-Sn and Au-In. Examples of resin materials include silicone resin and epoxy resin.

[0048] Figure 8 This is a schematic top view showing other configuration examples of the engaging member 30. Figure 8 In the example shown, multiple engaging members 30 are arranged in a ring shape at intervals. The engaging members 30 are located in areas other than the four corners of the base 10. Figure 8 In the example shown, each side of the substrate 10 is provided with three or more bonding members 30. This improves the bonding strength between the substrate 10 and the light-transmitting member 40.

[0049] (Light-transmitting component 40)

[0050] The light-transmissive member 40 has a function of transmitting light from the light emitting element 20 disposed in the base 10 and releasing the light to the outside of the light emitting device 100. The light-transmissive member 40 transmits 60% or more of the light emitted from the light emitting element 20, and preferably transmits 90% or more. As a material of the light-transmissive member 40, an inorganic material composed of at least one selected from the group consisting of sapphire, borosilicate glass, quartz glass, calcium fluoride glass, aluminum borosilicate glass, oxynitride glass, and chalcogenide glass can be exemplified. The thickness of the light-transmissive member 40 can be 0.1 mm or more and 7 mm or less.

[0051] (Protective film 60)

[0052] The protective film 60 has a function of protecting the light emitting element, the base, and the joining member from dirt, dust, and moisture. The protective film 60 has light-transmissivity and insulating properties, and as shown in FIG. 1, at least continuously covers the light emitting element 20, the upper surface 10a of the base 10, and the side surface of the joining member 30. As shown in FIG. 1, it is preferable that the protective film 60 cover substantially all of the surfaces of the light emitting device 100 except for the lower surface. In this way, peeling of the protective film 60 from the surfaces of the light emitting device 100 can be suppressed. Figure 2 Figure 2 As shown in FIG. 1, it is preferable that the protective film 60 cover substantially all of the surfaces of the light emitting device 100 except for the lower surface. In this way, peeling of the protective film 60 from the surfaces of the light emitting device 100 can be suppressed.

[0053] As a material of the protective film 60, for example, an inorganic material such as alumina, silica, tantalum oxide, niobium oxide, titanium oxide, aluminum nitride, silicon nitride, or the like can be exemplified. It is preferable that the protective film 60 be a film containing alumina or silica as a main component. The protective film 60 can be a single layer film based on one material or a multi-layer film based on two or more different materials. Specifically, it is preferable to use a film in which a film containing alumina and a film containing silica as a main component are each stacked in one layer or repeatedly stacked. In addition, the thickness of the protective film 60 is, for example, 3 nm or more and 250 nm or less. It is preferable that the thickness of the protective film 60 be 40 nm or more and 150 nm or less. Furthermore, in the case where the protective film 60 is a multi-layer film, it is preferable that the total thickness of all the layers be in the above range.

[0054] According to the light emitting device 100 according to the present embodiment, the light emitting element 20, the base 10, and the side surface of the joining member 30 are continuously covered by the protective film 60, so these members can be protected from dirt, dust, and moisture from the outside, and deterioration due to oxidation or the like can be prevented. Therefore, a light emitting device 100 with high reliability can be provided.

[0055] (Method of manufacturing light emitting device 100)

[0056] Figure 9A and Figure 9B is a schematic cross-sectional view illustrating a method of manufacturing the light emitting device 100 according to Embodiment 1. ​

[0057] (The process of preparing intermediate 110)

[0058] like Figure 9A As shown, an intermediate body 110 is prepared, comprising a substrate 10 having an upper surface 10a, a light-emitting element 20 mounted on the upper surface 10a, a bonding member 30 disposed on the upper surface 10a further outward than the light-emitting element 20, and a light-transmitting member 40 bonded to a portion of the upper surface 10a by the bonding member 30. The intermediate body 110 has a gap 70 extending from the space where the light-emitting element 20 is disposed to the outside of the intermediate body 110 between the upper surface 10a of the substrate 10 and the lower surface 40b of the light-transmitting member 40. This gap 70 is provided by the bonding member 30 sandwiched between the upper surface 10a of the substrate 10 and the lower surface 40b of the light-transmitting member 40.

[0059] An example of a method for manufacturing such an intermediate 110 will be described. First, a light-emitting element 20 is placed on a first upper surface 11a of a substrate 10. A bonding member 30 is partially disposed on a second upper surface 12a, which is located outside the light-emitting element 20. Then, a portion of the second upper surface 12a is bonded to a light-transmitting member 40 via the bonding member 30, resulting in... Figure 9A The intermediate 110 shown. Such intermediate 110 can be prepared either by purchasing or by performing part or all of the intermediate preparation process.

[0060] (Process for forming protective film 60)

[0061] Next, as Figure 9B As shown, a protective film 60 is formed covering the upper surface 10a of the substrate 10 and the light-emitting element 20.

[0062] The protective film 60 is preferably formed by atomic layer deposition (ALD). By forming the protective film 60 using atomic layer deposition, a dense protective film 60 can be formed relatively thinly across the entire surface containing surfaces with different planar orientations. In addition, by using atomic layer deposition, the protective film 60 can be formed by supplying gaseous raw material from the gap between the upper surface 10a of the substrate 10 and the lower surface 40b of the light-transmitting member 40 into the space where the light-emitting element 20 is disposed.

[0063] Although the protective film 60 may be formed to at least continuously cover the upper surface 10a of the substrate 10, the light-emitting element 20, and the side surface of the bonding member 30, it is preferable to form as shown below. Figure 9BThe protective film 60 is formed so as to cover substantially the entire surface of the light emitting device except for the second wiring 15 as illustrated. As a method of selectively forming the protective film 60 as such, for example, a method of removing the protective film 60 located above the second wiring 15 by polishing or irradiation of laser after the protective film 60 is formed on the surface of the light emitting device 100, a method of forming the protective film 60 with a mask arranged so as to cover the second wiring 15, or the like can be exemplified.

[0064] [Embodiment 2]

[0065] Figure 10 is a schematic end view illustrating only a cross-sectional surface of the light emitting device 200 according to Embodiment 2.

[0066] The light emitting device 200 has the light emitting element 20 and the light-transmissive member 240 on the flat plate-shaped base 210. The light-transmissive member 240 has a flat plate portion 241 and a side wall portion 242 arranged below the flat plate portion 241. The lower surface 242b of the side wall portion 242 is joined to the base 210 via the joining member 30. The flat plate portion 241 and the side wall portion 242 of the light-transmissive member 240 can be integrally formed. The light emitting element is located in a recessed portion 243 divided by the flat plate portion 241 and the side wall portion 242. The opening shape of the recessed portion 243 is, for example, rectangular. A gap 70 through which a space for arranging the light emitting element 20 penetrates to the outside of the light emitting device 200 is provided between the base 210 and the lower surface 242b of the light-transmissive member 240. The gap 70 is provided by the upper surface 210a of the base 210, the lower surface 242b of the light-transmissive member 240, and the joining member 30. The protective film 60 covers the surface of the base 210, the surface of the light emitting element 20, the side surface of the joining member 30, and the surface of the light-transmissive member. In Figure 10 In the light emitting device 200 illustrated, the side surfaces of the light emitting element 20, the base 210, and the joining member 30 are continuously covered by the protective film 60, so these members can be protected from dirt, dust, moisture from the outside, and deterioration caused by oxidation or the like can be prevented.

Claims

1. A light emitting device, comprising: Possessing: a base having an upper surface; a light emitting element disposed on the upper surface of the base; a joining member disposed on the upper surface of the base outside the light emitting element; a light-transmissive member joined to a portion of the upper surface of the base by the joining member; and a protective film covering the upper surface of the base and the light emitting element, a gap is provided between the upper surface of the base and a lower surface of the light-transmissive member, the gap is communicated from a space in which the light emitting element is disposed to the outside of the light emitting device, and the gap is provided by the upper surface of the base, the lower surface of the light-transmissive member, and the joining member, the protective film continuously covers the light emitting element, the upper surface of the base, a side surface of the joining member, and the entire lower surface of the light-transmissive member.

2. The light emitting device according to claim 1, wherein the light emitting device has a plurality of the joining members.

3. The light emitting device according to claim 1, wherein a first metal film is provided between the joining member and the upper surface of the base, the protective film continuously covers the joining member, the first metal film, and the base.

4. The light emitting device according to claim 2, wherein a first metal film is provided between the joining member and the upper surface of the base, the protective film continuously covers the joining member, the first metal film, and the base.

5. The light emitting device according to claim 1, wherein a second metal film is provided between the joining member and the lower surface of the light-transmissive member, the protective film continuously covers the joining member, the second metal film, and the light-transmissive member.

6. The light emitting device according to claim 2, wherein a second metal film is provided between the joining member and the lower surface of the light-transmissive member, the protective film continuously covers the joining member, the second metal film, and the light-transmissive member.

7. The light emitting device according to claim 3, wherein a second metal film is provided between the joining member and the lower surface of the light-transmissive member, the protective film continuously covers the joining member, the second metal film, and the light-transmissive member.

8. The light emitting device according to claim 4, wherein a second metal film is provided between the joining member and the lower surface of the light-transmissive member, the protective film continuously covers the joining member, the second metal film, and the light-transmissive member.

9. The light emitting device according to claim 1, wherein the base has a base portion in a flat plate shape and a side wall portion disposed above the base portion, a recess is partitioned by the base portion and the side wall portion, the light emitting element is disposed in the recess, the protective film covers an inner side surface of the side wall portion partitioning the recess and an upper surface of the base portion.

10. The light emitting device according to claim 2, wherein the base has a base portion in a flat plate shape and a side wall portion disposed above the base portion, a recess is partitioned by the base portion and the side wall portion, the light emitting element is disposed in the recess, ​ The protective film covers the inner side surface of the side wall portion and the upper surface of the base portion that divide the recess.

11. The light emitting device according to claim 3, wherein The base body has a flat plate-shaped base portion and a side wall portion disposed above the base portion, The recess is divided by the base portion and the side wall portion, The light emitting element is disposed in the recess, The protective film covers the inner side surface of the side wall portion and the upper surface of the base portion that divide the recess.

12. The light emitting device according to claim 4, wherein The base body has a flat plate-shaped base portion and a side wall portion disposed above the base portion, The recess is divided by the base portion and the side wall portion, The light emitting element is disposed in the recess, The protective film covers the inner side surface of the side wall portion and the upper surface of the base portion that divide the recess.

13. The light emitting device according to claim 5, wherein The base body has a flat plate-shaped base portion and a side wall portion disposed above the base portion, The recess is divided by the base portion and the side wall portion, The light emitting element is disposed in the recess, The protective film covers the inner side surface of the side wall portion and the upper surface of the base portion that divide the recess.

14. The light emitting device according to claim 6, wherein The base body has a flat plate-shaped base portion and a side wall portion disposed above the base portion, The recess is divided by the base portion and the side wall portion, The light emitting element is disposed in the recess, The protective film covers the inner side surface of the side wall portion and the upper surface of the base portion that divide the recess.

15. The light emitting device according to claim 7, wherein The base body has a flat plate-shaped base portion and a side wall portion disposed above the base portion, The recess is divided by the base portion and the side wall portion, The light emitting element is disposed in the recess, The protective film covers the inner side surface of the side wall portion and the upper surface of the base portion that divide the recess.

16. The light emitting device according to claim 8, wherein The base body has a flat plate-shaped base portion and a side wall portion disposed above the base portion, The recess is divided by the base portion and the side wall portion, The light emitting element is disposed in the recess, The protective film covers the inner side surface of the side wall portion and the upper surface of the base portion that divide the recess.

17. The light emitting device according to any one of claims 1 to 16, wherein The protective film is composed of an inorganic material.

18. The light emitting device according to any one of claims 1 to 16, wherein The protective film is a multilayer film.

19. The light emitting device according to claim 17, wherein The protective film is a multilayer film.

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