Display panel, display panel preparation method and display device

Abstract

The application discloses a display panel, a display panel preparation method and a display device. The display panel comprises an array substrate, an organic layer arranged on one side of the array substrate, a pixel definition layer arranged on the side, away from the array substrate, of the organic layer, and an encapsulation layer arranged on the side, away from the array substrate, of the pixel definition layer, wherein the encapsulation layer comprises an organic encapsulation layer, and the organic encapsulation layer and the organic layer are communicated through a slot penetrating through the pixel definition layer. In the embodiment, the organic encapsulation layer and the organic layer of the encapsulation layer are communicated through the slot, so that the gas generated by the organic layer is released through the organic encapsulation layer of the encapsulation layer, that is, the excessive water vapor in the organic layer is introduced into the organic encapsulation layer of the encapsulation layer, the film layer peeling or bubbling problem is prevented, and the reliability and service life of the display panel are improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of electronic products, and particularly relates to a display panel, a display panel preparation method and a display device. BACKGROUND

[0002] With the progress of science and technology, digital display devices such as smart phones and tablet computers are widely used. The display panel is an indispensable interface for interpersonal communication in these display devices. For example, an organic light emitting diode (OLED) display panel has the advantages of self-luminous, energy saving, bendable, good flexibility, etc. The display device for realizing display does not need a backlight source, has the characteristics of fast response and good display effect, and is widely used in terminal products such as smart phones and tablet computers.

[0003] Due to the limitation of the film layer structure and the material of the existing display panel, under the condition of reliability experiment and ultraviolet irradiation, part of the film layer of the display panel will produce water vapor, which affects the reliability of the display panel.

[0004] Therefore, there is an urgent need for a new display panel, a display panel preparation method and a display device. SUMMARY

[0005] The display panel, the display panel preparation method and the display device provided by the embodiments of the present application can realize the communication between the organic encapsulation layer and the organic layer of the encapsulation layer through the slot, so that the gas generated by the organic layer is released through the organic encapsulation layer of the encapsulation layer, that is, the excessive water vapor in the organic layer is introduced into the organic encapsulation layer of the encapsulation layer, thereby preventing the film layer from peeling or bubbling, and improving the reliability and service life of the display panel.

[0006] The display panel provided by the embodiments of the present application comprises: an array substrate; an organic layer arranged on one side of the array substrate; a pixel definition layer arranged on the side of the organic layer away from the array substrate; and an encapsulation layer arranged on the side of the pixel definition layer away from the array substrate, wherein the encapsulation layer comprises an organic encapsulation layer, and the organic encapsulation layer and the organic layer are in communication through a slot penetrating the pixel definition layer.

[0007] According to an aspect of the present application, the encapsulation layer comprises a first inorganic encapsulation layer, the organic encapsulation layer and a second inorganic encapsulation layer which are stacked along the thickness direction of the display panel, the first inorganic encapsulation layer is arranged close to the organic layer relative to the second inorganic encapsulation layer; the first inorganic encapsulation layer on the array substrate and the slot on the array substrate are misaligned in orthographic projection; preferably, the pixel definition layer comprises at least one inorganic material layer; preferably, the display panel further comprises a first electrode layer arranged on the side of the organic layer away from the array substrate, the first electrode layer comprises a plurality of mutually insulated first electrode blocks; preferably, the pixel definition layer has a pixel opening which exposes at least part of the first electrode blocks.

[0008] According to an aspect of the present application, the display panel has a display area and a frame area adjacent to the display area, the organic layer, the pixel definition layer and the encapsulation layer all extend from the display area to the frame area; in the frame area, the pixel definition layer is provided with a first slot for the organic encapsulation layer and the organic layer to communicate; preferably, the organic encapsulation layer is partially filled in the first slot; preferably, the organic layer comprises a planarization layer; or, the organic layer comprises a planarization layer and a via layer which are stacked along the thickness direction of the display panel.

[0009] According to an aspect of the present application, the first slot is arranged around the display area; preferably, the first slot in the frame area has a continuous ring structure; or, the frame area has a plurality of first slots which are arranged at intervals.

[0010] According to an aspect of the present application, the first inorganic encapsulation layer in the frame area on the array substrate and the first slot on the array substrate are misaligned in orthographic projection.

[0011] According to an aspect of the present application, the display panel has a display area and a frame area adjacent to the display area, the organic layer, the pixel definition layer and the encapsulation layer all extend from the display area to the frame area; in the display area, the pixel definition layer is provided with a second slot for the organic encapsulation layer and the organic layer to communicate, the second slot on the array substrate and the pixel opening on the array substrate are misaligned in orthographic projection; preferably, the organic encapsulation layer is partially filled in the second slot; preferably, the pixel definition layer is provided with a spacer on the side away from the array substrate, the second slot penetrates the spacer and the organic layer to communicate; preferably, along the thickness direction of the display panel, the cross section of the spacer has at least one of an I-shaped cross section and a T-shaped cross section.

[0012] According to an aspect of the present application, the display panel further comprises sub-pixel units with different colors, the sub-pixel units are located in the pixel openings, each of the sub-pixel units comprises the first electrode block, the light-emitting material layer and the second electrode layer which are arranged in a stack, and the second slots are arranged between at least some of the adjacent sub-pixel units; preferably, at least in the display area, the first inorganic encapsulation layer comprises a plurality of inorganic encapsulation portions which are arranged in an interval and correspond to the sub-pixel units, and the orthographic projection of the inorganic encapsulation portions on the array substrate is staggered with the orthographic projection of the second slots on the array substrate; preferably, the inorganic encapsulation portions are arranged between the adjacent two isolation columns; preferably, at least some of the second slots are arranged around the entire sub-pixel unit; or, at least some of the second slots are arranged around part of the edge of the sub-pixel unit.

[0013] According to another aspect of the present application, the display panel preparation method further comprises the following steps: providing an array substrate; forming an organic layer on one side of the array substrate; forming a pixel definition layer on the side of the organic layer away from the array substrate, the pixel definition layer is provided with slots penetrating through the pixel definition layer; forming an encapsulation layer on the side of the pixel definition layer away from the array substrate, the encapsulation layer comprises an organic encapsulation layer, and the organic encapsulation layer and the organic layer are connected through the slots.

[0014] According to another aspect of the present application, the pixel definition layer has pixel openings, and between the step of forming the pixel definition layer on the side of the organic layer away from the array substrate and the step of forming the encapsulation layer on the side of the pixel definition layer away from the array substrate, the method further comprises the following steps: forming a first sub-pixel unit in each of the pixel openings; forming a first photoresist on the side of at least one of the first sub-pixel units away from the array substrate; etching the first sub-pixel units which are not covered by the first photoresist; forming a second sub-pixel unit on the side of the first sub-pixel units which are not etched away from the array substrate and in the pixel openings where the first sub-pixel units are etched away; forming a second photoresist on the side of at least one of the second sub-pixel units located in the pixel openings away from the array substrate; etching the second sub-pixel units which are not covered by the second photoresist.

[0015] According to another aspect of the present application, the display device comprises the display panel described in any of the above embodiments.

[0016] Compared with the prior art, the display panel provided by the embodiment of the present application comprises an array substrate, an organic layer and a pixel definition layer. Since the organic layer is formed by using materials such as organic resin, before evaporation of the array substrate, in order to ensure the cleanliness of the product, the array substrate provided with the organic layer needs to be subjected to a pre-evaporation cleaning process. The organic layer will also absorb water in the cleaning process. Under the condition of reliability experiment and ultraviolet irradiation, the organic layer will release the absorbed water vapor and small molecule organic matter. However, since the pixel definition layer and the first electrode layer cover the organic layer, the gas generated by the organic layer cannot be released, which will cause problems such as bubbling and film peeling. In order to solve the above problems, the embodiment makes the organic encapsulation layer of the encapsulation layer and the organic layer communicate through the slot penetrating the pixel definition layer, so that the gas generated by the organic layer is released through the organic encapsulation layer of the encapsulation layer, that is, the excessive water vapor in the organic layer is introduced into the organic encapsulation layer of the encapsulation layer, to prevent the film peeling or bubbling problem, and improve the reliability and service life of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly introduced as follows. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0018] Figure 1 is a structural schematic diagram of a display panel provided by an embodiment of the present application;

[0019] Figure 2 is Figure 1 is a film layer structure diagram provided by an embodiment of the present application at B-B;

[0020] Figure 3 is Figure 1 is a film layer structure diagram provided by another embodiment of the present application at B-B;

[0021] Figure 4 is a pixel arrangement diagram of a display panel provided by an embodiment of the present application;

[0022] Figure 5 is Figure 4 is a film layer structure diagram provided by an embodiment of the present application at C-C;

[0023] Figure 6 is Figure 4 is a film layer structure diagram provided by an embodiment of the present application at D-D;

[0024] Figure 7 is a pixel arrangement diagram of a display panel provided by another embodiment of the present application;

[0025] Figure 8 is a flowchart of a display panel preparation method provided by an embodiment of the present application;

[0026] Figure 9 is a structural schematic diagram in a display panel preparation process provided by an embodiment of the present application;

[0027] Figure 10 is a structural schematic diagram in a display panel preparation process provided by another embodiment of the present application;

[0028] Figure 11 is a structural schematic diagram in a display panel preparation process provided by yet another embodiment of the present application;

[0029] Figure 12 is a structural schematic diagram in a display panel preparation process provided by yet another embodiment of the present application;

[0030] Figure 13 is a structural schematic diagram in a display panel preparation process provided by yet another embodiment of the present application;

[0031] Figure 14 is a structural schematic diagram in a display panel preparation process provided by yet another embodiment of the present application;

[0032] Figure 15 is a structural schematic diagram in a display panel preparation process provided by yet another embodiment of the present application;

[0033] Figure 16 is a structural schematic diagram in a display panel preparation process provided by yet another embodiment of the present application;

[0034] Figure 17 is a structural schematic diagram in a display panel preparation process provided by yet another embodiment of the present application.

[0035] In the drawings:

[0036] 1 - array substrate; 2 - planarization layer; 3 - first electrode layer; 4 - pixel definition layer; 5 - encapsulation layer; 51 - first inorganic encapsulation layer; 52 - organic encapsulation layer; 53 - second inorganic encapsulation layer; 6 - via layer; 7 - light emitting material layer; 8 - second electrode layer; 9 - light adjusting layer; 10 - protection layer; K1 - first slot; K2 - second slot; P1 - first sub-pixel unit; P2 - second sub-pixel unit; P3 - third sub-pixel unit; J1 - first photoresist; J2 - second photoresist; J3 - third photoresist; Z - dam; L - isolation column; TFT - thin film transistor; S - source electrode; D - drain electrode; G - gate electrode; Y - active layer; AA - display area; BA - frame area. DETAILED DESCRIPTION

[0037] The features and exemplary embodiments of the various aspects of the present application will be described in detail below with reference to the drawings. For the purpose of clarity, the description is divided into the following sections: technical scheme, advantages, and specific embodiments. The technical scheme section describes the technical solutions of the present application. The advantages section describes the advantages of the present application. The specific embodiments section describes specific embodiments of the present application. The description of the specific embodiments is merely provided to better illustrate the present application by showing examples of the present application. The present application can be implemented without some of the specific details.

[0038] It should be noted that the relative terms, such as first and second, are used herein only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between such entities or operations. Moreover, the terms "comprising", "including", or any other variant thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements recited, but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without more limitations, an element defined by the phrase "comprising" does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0039] It should be understood that when describing the structure of a component, when one layer, one region is referred to as being "on" or "above" another layer, another region, it can mean being directly on or above the other layer, another region, or containing other layers or regions between it and the other layer, another region. Also, if the component is flipped, the layer, the region will be "below" or "below" the other layer, another region.

[0040] Various modifications and changes can be made to the present application in its implementation without departing from the spirit or scope of the present application, which will be apparent to those skilled in the art. Therefore, the present application is intended to cover modifications and variations of the present application that come within the scope of the corresponding claims (claimed technical solutions) and their equivalents. It should be noted that the embodiments provided by the present application can be combined with each other as long as they do not conflict.

[0041] The present application provides a display panel, a display panel preparation method and a display device, which will be described below in conjunction with the accompanying drawings Figures 1 to 17 The various embodiments of the display panel, the display panel preparation method and the display device will be described.

[0042] Please refer to Figures 1 to 2The display panel provided by the embodiment of the present application comprises an array substrate 1, an organic layer arranged on one side of the array substrate 1, a pixel definition layer 4 arranged on the side of the organic layer away from the array substrate 1, and an encapsulation layer 5 arranged on the side of the pixel definition layer 4 away from the array substrate 1, and the encapsulation layer 5 and the organic layer are communicated through a slot penetrating through the pixel definition layer 4.

[0043] The display panel provided by the embodiment of the present application comprises an array substrate 1, an organic layer, and a pixel definition layer 4. Since the organic layer is formed by using an organic resin material, in order to ensure the cleanliness of the product before evaporation of the array substrate, the array substrate provided with the organic layer needs to be cleaned before evaporation. The organic layer will absorb water in the cleaning process. However, under the condition of reliability experiment and ultraviolet irradiation, the organic layer will release the absorbed water vapor and small-molecule organic matter. However, since the pixel definition layer 4 and the first electrode layer 3 cover the organic layer, the gas generated by the organic layer cannot be released, which will cause problems such as bubbling and film peeling. In order to solve the above problems, the organic encapsulation layer 52 of the encapsulation layer 5 is communicated with the organic layer through the slot penetrating through the pixel definition layer 4, so that the gas generated by the organic layer is released through the organic encapsulation layer 52 of the encapsulation layer 5, that is, the excessive water vapor in the organic layer is introduced into the organic encapsulation layer 52 of the encapsulation layer 5, thereby preventing the film peeling or bubbling problem from occurring, and improving the reliability and service life of the display panel.

[0044] Since the organic encapsulation layer 52 is also made of an organic material, the organic encapsulation layer 52 is communicated with the organic layer through the slot, so that the gas generated by the organic layer is released through the organic encapsulation layer 52, that is, the excessive water vapor in the organic layer is introduced into the organic encapsulation layer 52, thereby preventing the film peeling or bubbling problem from occurring.

[0045] In the embodiment, the main advantages of the organic material for preparing the organic encapsulation layer 52 are better flatness, which can realize planarization and is conducive to the growth of inorganic film layers by subsequent methods such as chemical vapor deposition, physical vapor deposition or atomic layer deposition; the organic material can also be prepared by the existing process to have a larger thickness, the bending resistance of the organic material is better, and the preparation of the organic encapsulation layer 52 by the organic material can also improve the encapsulation effect, avoid the erosion of water and oxygen to the light-emitting material or the wiring of the display panel, and improve the reliability of the display panel.

[0046] The organic encapsulation layer 52 can be formed by IJP (Ink-Jet Printing, inkjet printing technology).

[0047] Optionally, the display panel further comprises a first electrode layer 3, the first electrode layer 3 is arranged on the side of the organic layer away from the array substrate 1, and the first electrode layer 3 comprises a plurality of mutually insulated first electrode blocks. Specifically, the pixel definition layer 4 is arranged on the side of the first electrode layer 3 away from the array substrate 1. The pixel definition layer 4 has a pixel opening, and the pixel opening exposes at least part of the first electrode blocks, so that the sub-pixel units corresponding to the first electrode blocks emit light through the pixel opening.

[0048] In the related art, the size of the sub-pixel unit is defined by the pixel opening (PDL, Pixel definition layer) of the pixel definition layer, which is formed by etching. In order to facilitate etching and peeling, the pixel definition layer is usually made of organic material, such as polyimide. In order to ensure product cleanliness before evaporation of the array substrate, the array substrate provided with the pixel definition layer needs to be subjected to a pre-evaporation cleaning process, which causes the pixel definition layer made of organic material to absorb water. Under the conditions of reliability experiments and ultraviolet irradiation, the pixel definition layer made of organic material releases the absorbed water vapor and small-molecule organic substances. Since the pixel definition layer is close to the organic light-emitting material, the water vapor released by the pixel definition layer causes the failure of the organic light-emitting material, resulting in the shrinkage of the pixel light-emitting area and affecting the reliability of the display panel.

[0049] In order to solve the above problems, in some optional embodiments, the pixel definition layer 4 in the display panel provided by the embodiments of the present application comprises at least one inorganic material layer, and the inorganic material layer has good water vapor blocking performance, thereby avoiding the pixel definition layer 4 made of organic material from releasing the absorbed water vapor and small-molecule organic substances under the conditions of reliability experiments and ultraviolet irradiation, and ensuring the reliability of the display panel.

[0050] It should be noted that the pixel definition layer 4 in the present embodiment comprises at least one inorganic material layer, and the inorganic material layer has good water vapor blocking performance. Therefore, when the array substrate 1 provided with the pixel definition layer 4 is subjected to a pre-evaporation cleaning process, the pixel definition layer 4 comprising at least one inorganic material layer does not have the problem of water absorption, thereby avoiding the pixel definition layer 4 from releasing the absorbed water vapor and small-molecule organic substances under the conditions of reliability experiments and ultraviolet irradiation, and ensuring the reliability of the display panel. At the same time, since the organic layer is made of organic material, the problem of water vapor release also occurs. In order to solve the above problems, the pixel definition layer 4 in the present embodiment comprises at least one inorganic material layer, and when the first electrode layer 3 is made of metal, the inorganic material layer can cooperate with the first electrode layer 3 to block the transmission of water vapor in the organic layer to the organic light-emitting material layer, thereby affecting the organic light-emitting material of the display panel, effectively avoiding the problem of shrinkage of the pixel light-emitting area after the reliability experiment and ultraviolet irradiation test, and improving the reliability and service life of the display panel.

[0051] In the embodiment, the pixel definition layer 4 includes at least one inorganic material layer, that is, the pixel definition layer 4 can include only one inorganic material layer or two inorganic material layers, and there is no special limitation. The inorganic material layer can specifically adopt at least one of silicon nitride, silicon oxynitride, and silicon oxide. Compared with the case where the pixel definition layer 4 in the prior art adopts an organic material such as polyimide, the water-oxygen blocking performance of the inorganic material layer of the pixel definition layer 4 is better, that is, water-oxygen will not enter the inorganic material layer in the cleaning process, and thus the inorganic material layer of the pixel definition layer 4 will not absorb water, avoiding the problem that the pixel definition layer 4 will release absorbed water vapor and small-molecule organic substances under the conditions of reliability experiments and ultraviolet irradiation.

[0052] The material of the first electrode layer 3 is generally a material with a high work function, so as to improve the hole injection efficiency. The material can be gold (Au), platinum (Pt), titanium (Ti), silver (Ag), indium tin oxide (ITO), zinc tin oxide (IZO), or a transparent conductive polymer (such as polyaniline). In the embodiment, the first electrode layer 3 can specifically adopt an ITO-Ag-ITO stacked structure.

[0053] Optionally, the array substrate 1 includes a pixel circuit, and the pixel circuit includes a thin film transistor TFT. The thin film transistor TFT includes an active layer Y, a gate electrode G, a source electrode S, and a drain electrode D. The materials of the drain electrode D, the source electrode S, and the gate electrode G can include one or a combination of molybdenum, titanium, aluminum, copper, or the like. The gate electrode G of the thin film transistor TFT is generally used to receive a control signal, so that the thin film transistor TFT is turned on or turned off under the control of the control signal. One of the source electrode S and the drain electrode D of the thin film transistor TFT is connected to the first electrode layer 3.

[0054] Please refer to Figures 2 to 3 In some optional embodiments, the encapsulation layer 5 includes a first inorganic encapsulation layer 51, an organic encapsulation layer 52, and a second inorganic encapsulation layer 53 which are stacked in the thickness direction of the display panel. The orthographic projection of the first inorganic encapsulation layer 51 on the array substrate 1 is staggered with the orthographic projection of the slot on the array substrate 1.

[0055] It should be noted that, since the first inorganic encapsulation layer 51 is made of inorganic material and has good water-oxygen blocking effect, in order to simplify the process, the first inorganic encapsulation layer 51 can be made to avoid the position where the slot needs to be arranged, so as to facilitate the direct communication between the organic layer and the organic encapsulation layer 52.

[0056] The first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53 can specifically adopt inorganic materials such as silicon oxide, silicon nitride, aluminum oxide, and titanium oxide. Among them, the refractive index (compactness) of silicon nitride and aluminum oxide is better than that of silicon oxide and titanium oxide, and thus the water-oxygen blocking performance of silicon nitride and aluminum oxide is better than that of silicon oxide and titanium oxide.

[0057] In some optional embodiments, the display panel has a display area AA and a frame area BA adjacent to the display area AA, the organic layer, the pixel definition layer 4 and the encapsulation layer 5 all extend from the display area AA to the frame area BA; in the frame area BA, the pixel definition layer 4 is provided with a first slot K1 for the organic encapsulation layer 52 and the organic layer to communicate.

[0058] It can be understood that, since the display area AA usually also includes other film layers such as the second electrode layer 8 and the like which are arranged in an integral layer, in order to facilitate the communication between the organic encapsulation layer 52 and the organic layer, the first slot K1 is arranged in the frame area BA of the display panel in this embodiment, so as to facilitate the arrangement of the first slot K1, by arranging the first slot K1 on the pixel definition layer 4, on the one hand, the organic encapsulation layer 52 and the organic layer can be communicated, on the other hand, by arranging the first slot K1 to make part of the organic encapsulation layer 52 flow into the first slot K1, so as to play a role of blocking the overflow of the organic encapsulation layer 52.

[0059] As shown in Figure 3 Optionally, the cross section of the first slot K1 along the thickness direction of the display panel can be rectangular, zigzag and the like, and is not limited in particular.

[0060] Optionally, the organic encapsulation layer 52 is partially filled in the first slot K1, when the organic encapsulation layer 52 is formed by IJP (Ink-Jet Printing), the organic encapsulation layer 52 has a certain fluidity, so that when the organic encapsulation layer 52 is formed on the pixel definition layer 4, part of the organic encapsulation layer 52 will automatically fill in the first slot K1 and contact the organic layer.

[0061] Optionally, a dam part Z is further arranged in the frame area BA, and the first slot K1 is arranged on the side of the first dam part Z close to the display area AA.

[0062] In some optional embodiments, the organic layer includes a planarization layer 2, the planarization layer 2 is made of organic material such as organic resin and the like, for improving the planarity of the film layer of the display panel, facilitating the preparation of the film layer such as the pixel definition layer 4 and the like.

[0063] Optionally, the organic layer includes the planarization layer 2 and the via layer 6 arranged in a stack along the thickness direction of the display panel, the via layer 6 and the planarization layer 2 can both be made of organic material, the via layer 6 is used for wiring the signal line on the one hand, and also plays a role of improving the planarity of the film layer on the other hand. In order to facilitate the release of water vapor of the planarization layer 2, in this embodiment, the first slot K1 can also penetrate the via layer 6, so that the organic encapsulation layer 52 communicates through the first slot K1 penetrating the pixel definition layer 4 and the via layer 6.

[0064] Optionally, the first slot K1 is arranged around the display area AA, i.e., the first slot K1 can be arranged in a circle to increase the contact area between the organic encapsulation layer 52 and the organic layer and improve the water vapor release effect of the organic layer, and also facilitate the communication between the organic layer and the organic encapsulation layer 52 at different positions.

[0065] Optionally, the first slot K1 in the frame area BA has a continuous annular structure, i.e., the first slot K1 is arranged around the entire display area AA. Alternatively, a plurality of first slots K1 can be arranged at intervals in the frame area BA, i.e., a plurality of separately arranged first slots K1 are arranged at intervals and around the display area AA to avoid adversely affecting the encapsulation effect of the display panel by the first slot K1.

[0066] In some optional embodiments, the orthogonal projection of the first inorganic encapsulation layer 51 in the frame area BA on the array substrate 1 and the orthogonal projection of the first slot K1 on the array substrate 1 are offset.

[0067] In order to facilitate the arrangement of the first slot K1 and avoid the influence of the first inorganic encapsulation layer 51 on the first slot K1, the orthogonal projection of the first inorganic encapsulation layer 51 in the frame area BA on the array substrate 1 and the orthogonal projection of the first slot K1 on the array substrate 1 can be offset, which can be achieved by inwardly retracting the first inorganic encapsulation layer 51 in the direction of the display area AA, i.e., the first inorganic encapsulation layer 51 does not cover the part of the pixel definition layer 4 where the first slot K1 is arranged. The part of the pixel definition layer 4 in the frame area is not covered by the first inorganic encapsulation layer 51. Of course, other ways can also be used to offset the orthogonal projection of the first inorganic encapsulation layer 51 on the array substrate 1 and the orthogonal projection of the first slot K1 on the array substrate 1, and there is no special limitation.

[0068] Please refer to Figures 4 to 6 In some optional embodiments, the display panel has a display area AA and a frame area BA adjacent to the display area AA. The organic layer, the pixel definition layer 4, and the encapsulation layer 5 all extend from the display area AA to the frame area BA. In the display area AA, the pixel definition layer 4 is provided with a second slot K2 for the communication between the organic encapsulation layer 52 and the organic layer. The orthogonal projection of the second slot K2 on the array substrate 1 and the orthogonal projection of the pixel opening on the array substrate 1 are offset. Optionally, the organic encapsulation layer 52 is partially filled in the second slot K2 to communicate with the organic layer.

[0069] It is understandable that, in addition to setting the first slot K1 in the border area BA, a second slot K2 can also be set in the display area AA to achieve communication between the organic encapsulation layer 52 and the organic layer. It is also understandable that, since the display area AA has sub-pixel units of different colors, and these sub-pixel units need to emit light in the display area AA, the second slot K2 should not interfere with the sub-pixel units. Furthermore, to facilitate the creation of the second slot K2, the second electrode layer 8 of the sub-pixel unit and the corresponding inorganic encapsulation layer can be patterned so that only the pixel definition layer 4 is set between adjacent sub-pixel units. By offsetting the orthographic projection of the second slot K2 on the array substrate 1 from the orthographic projection of the pixel opening on the array substrate 1, the second slot K2 can be prevented from affecting the light emission of the sub-pixel units within the pixel opening.

[0070] In some optional embodiments, an isolation pillar L is provided on the side of the pixel definition layer 4 facing away from the array substrate 1, and the second slot K2 simultaneously penetrates the isolation pillar L, the pixel definition layer 4 and the organic layer.

[0071] By setting isolation pillars L, the vapor-deposited material during the formation of the light-emitting layer of the display panel is isolated, meaning that each sub-pixel unit is independent of the others. This avoids the problem of lateral conduction between sub-pixel units caused by the entire film layer being vapor-deposited. The second slot K2 penetrates through the isolation pillar L and connects to the organic layer. That is, a slot also needs to be set on the isolation pillar L to facilitate communication between the organic layer and the organic encapsulation layer 52.

[0072] Optionally, along the thickness direction of the display panel, the cross-section of the isolation post L is either I-shaped or T-shaped. There is no particular limitation on the cross-section of the isolation post L, as long as it ensures the isolation effect on the vapor-deposited material.

[0073] like Figures 4 to 6 As shown, the display panel also includes sub-pixel units of different colors. These sub-pixel units are located within pixel openings. Each sub-pixel unit includes a stacked first electrode block, a light-emitting material layer 7, and a second electrode layer 8. A second slot K2 is provided between at least some adjacent sub-pixel units. Optionally, the sub-pixel unit includes a first sub-pixel unit P1, a second sub-pixel unit P2, and a third sub-pixel unit P3. The first sub-pixel unit P1, the second sub-pixel unit P2, and the third sub-pixel unit P3 are any of the three colors: red, blue, and green. Specifically, different colors of light emission can be achieved by adjusting the material of the light-emitting material layer 7. By placing the second slot K2 between adjacent sub-pixel units, the second slot K2 is prevented from adversely affecting the light emission display of the sub-pixel units.

[0074] Optionally, at least in the display area AA, the first inorganic encapsulation layer 51 comprises a plurality of inorganic encapsulation portions arranged at intervals and corresponding to the sub-pixel units, and the orthographic projection of the inorganic encapsulation portions on the array substrate 1 is staggered with the orthographic projection of the second slot K2 on the array substrate 1.

[0075] It can be understood that the first inorganic encapsulation layer 51 can be subjected to a patterning process such as etching to form a plurality of inorganic encapsulation portions arranged at intervals and corresponding to the sub-pixel units. It can be understood that the orthographic projection of the inorganic encapsulation portions on the array substrate 1 at least partially overlaps with the orthographic projection of the sub-pixel units on the array substrate 1. The first inorganic encapsulation layer 51 is divided into a plurality of inorganic encapsulation portions to avoid interference between the inorganic encapsulation portions and the second slot K2.

[0076] Optionally, the inorganic encapsulation portions are arranged between the adjacent two isolation columns L, and the inorganic encapsulation portions are arranged corresponding to the sub-pixel units. Therefore, independent encapsulation of the sub-pixel units can be achieved by cooperation of the inorganic encapsulation portions and the isolation columns L, the encapsulation of the display panel is not affected by the arrangement of the second slot K2, and the reliability of the encapsulation of the display panel is improved.

[0077] Optionally, as shown in Figure 7 The second slot K2 is arranged around the entire sub-pixel unit, that is, the second slot K2 has a continuous annular structure such as a circular ring or a square ring. It can be understood that when the second slot K2 is arranged around the entire sub-pixel unit, the connected area of the organic encapsulation layer 52 and the organic layer can be effectively increased, and the water vapor release effect of the organic layer can be improved.

[0078] Of course, the second slot K2 can also be arranged around part of the edges of the sub-pixel unit, that is, a plurality of intermittently arranged second slots K2 can be arranged around the sub-pixel unit. Each second slot K2 can be arranged opposite to the edges of the sub-pixel unit at different positions to avoid adverse effects of the first slot K1 on the light-emitting display of the sub-pixel unit.

[0079] Optionally, a light-adjusting layer 9 and a protective layer 10 are further stacked between the second electrode layer 8 and the first inorganic encapsulation layer 51. The light-adjusting layer 9 can be a CPL (cappling layer, light extraction layer) and is mainly used to reduce light waveguide effect and improve the overall light extraction performance of the device. The protective layer 10 can be made of LiF (lithium fluoride) material and serves to protect the CPL layer.

[0080] Please refer to Figure 8 The present application further provides a display panel preparation method, comprising the following steps:

[0081] S110: providing an array substrate 1;

[0082] S120: forming an organic layer on the side of the array substrate 1;

[0083] S130: forming a pixel definition layer 4 on the side of the organic layer away from the array substrate 1, the pixel definition layer 4 being provided with a slot penetrating through the pixel definition layer 4;

[0084] S140: forming an encapsulation layer 5 on the side of the pixel definition layer 4 away from the array substrate 1, the encapsulation layer 5 comprising an organic encapsulation layer 52 and being in communication with the organic layer through the slot.

[0085] In this embodiment, the organic encapsulation layer 52 of the encapsulation layer 5 is in communication with the organic layer through the slot, so that the gas generated by the organic layer is released through the organic encapsulation layer 52 of the encapsulation layer 5, i.e., the excessive water vapor in the organic layer is introduced into the organic encapsulation layer 52 of the encapsulation layer 5, thereby preventing the film layer from peeling or bubbling and improving the reliability and service life of the display panel.

[0086] In step S110, the array substrate 1 specifically comprises a substrate and a pixel circuit formed on the substrate. The substrate can be a hard substrate such as a glass substrate, or a flexible substrate made of polyimide, polystyrene, polyethylene terephthalate, parylene, polyethersulfone or polyethylene naphthalate. The film layers such as the active layer Y, the gate electrode G, the source electrode S and the drain electrode D of the pixel circuit can be formed by evaporation, photolithography and other processes.

[0087] In step S120, the organic layer can be formed on the side of the array substrate 1 by an evaporation process. The material of the organic layer can be hexamethyl disiloxane, epoxy resin or polyimide (PI), or other silicon-based glue materials with a light transmittance of more than 90%.

[0088] In step S130, the material of the pixel definition layer 4 can be first evaporated on the side of the organic layer away from the array substrate 1, and then the evaporated material is subjected to a patterning process such as etching to form the pixel opening and the slot of the pixel definition layer 4. The pixel opening and the slot can be formed by the same process or separately formed without any special limitation.

[0089] In step S140, the encapsulation layer 5 comprises a first inorganic encapsulation layer 51, an organic encapsulation layer 52 and a second inorganic encapsulation layer 53. Since the first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53 are made of inorganic materials, the first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53 can be formed by a deposition process, while the organic encapsulation layer 52 can be formed by an inkjet printing technology. Since the pixel definition layer 4 is provided with the slot, the material of the inkjet-printed organic encapsulation layer 52 can fill the slot to realize the communication with the organic layer.

[0090] Optionally, a light-emitting layer is further provided on the pixel definition layer 4, and the light-emitting layer is at least partially located in the pixel opening, and a spacer L is further provided on the pixel definition layer 4, and the spacer L is used to separate the evaporation material when the light-emitting layer is formed by evaporation, so that each sub-pixel unit is independent of each other, thereby avoiding the problem that the whole surface evaporation is used to form part of the film layer, and the side conduction between the sub-pixel units occurs.

[0091] The spacer L can be made of the same material as the pixel definition layer 4, so as to reduce the production cost.

[0092] Optionally, between the steps of forming the pixel definition layer 4 on the side of the organic layer away from the array substrate 1 and forming the encapsulation layer 5 on the side of the pixel definition layer 4 away from the array substrate 1, further comprising: forming a first sub-pixel unit P1 in each pixel opening; forming a first photoresist J1 on the side of at least one first sub-pixel unit P1 away from the array substrate 1; etching the first sub-pixel unit P1 not covered by the first photoresist J1; forming a second sub-pixel unit P2 on the side of the first sub-pixel unit P2 not etched away from the array substrate 1 and in the pixel opening in which the first sub-pixel unit P1 is etched away; forming a second photoresist J2 on the side of at least one second sub-pixel unit P2 located in the pixel opening away from the array substrate 1; etching the second sub-pixel unit P2 not covered by the second photoresist J2.

[0093] The present embodiment utilizes the photolithography technology, so that the first sub-pixel unit P1 and the second sub-pixel unit P2 are separately formed, and the second slot K2 is formed between the adjacent first sub-pixel unit P1 and the second sub-pixel unit P2. The thickness of each film layer of the first sub-pixel unit P1 and the second sub-pixel unit P2, such as the light-emitting material layer 7, the second electrode layer 8 and the like, can be adjusted separately, for example, the thickness of the second electrode layer 8 of the first sub-pixel unit P1 and the second sub-pixel unit P2 can be different.

[0094] Specifically, the present embodiment takes the preparation of each first sub-pixel unit P1, second sub-pixel unit P2 and third sub-pixel unit P3 as an example, and provides a preparation method, comprising:

[0095] The organic layer and the pixel definition layer 4 are provided in a stacked manner, the pixel definition layer 4 has three pixel openings, and a first electrode block is formed in each pixel opening;

[0096] The light-emitting material layer 7, the second electrode layer 8, the light-adjusting layer 9, the protective layer 10 and the inorganic encapsulation part of the first sub-pixel unit P1 are sequentially formed in each pixel opening, as shown in Figure 9

[0097] The first photoresist J1 is formed on the side of the inorganic encapsulation part of any pixel opening of the first sub-pixel unit P1 away from the light-emitting material layer 7, as shown in​Figure 10 as shown in FIG. 6B;

[0098] The layers of the first sub-pixel unit P1, the second electrode layer 8, the light modulation layer 9, the protective layer 10 and the inorganic encapsulation portion in the pixel opening not covered by the first photoresist J1 are removed by etching, as shown in FIG. 6C. Figure 11

[0099] The first photoresist J1 is removed, and the layers of the first sub-pixel unit P1, the second electrode layer 8, the light modulation layer 9, the protective layer 10 and the inorganic encapsulation portion on the side of the inorganic encapsulation portion of the first sub-pixel unit P1 facing away from the light emitting material layer 7 and in the other two pixel openings are formed, as shown in FIG. 6D. Figure 12

[0100] The second photoresist J2 is formed on the side of the inorganic encapsulation portion in any pixel opening provided with only the second sub-pixel unit P2 facing away from the light emitting material layer 7, as shown in FIG. 6E. Figure 13

[0101] The layers of the second sub-pixel unit P2, the second electrode layer 8, the light modulation layer 9, the protective layer 10 and the inorganic encapsulation portion in the pixel opening not covered by the second photoresist J2 are removed by etching, as shown in FIG. 6F. Figure 14

[0102] The second photoresist J2 is removed, and the layers of the first sub-pixel unit P1, the second electrode layer 8, the light modulation layer 9, the protective layer 10 and the inorganic encapsulation portion on the side of the inorganic encapsulation portion of the first sub-pixel unit P1 facing away from the light emitting material layer 7, on the side of the inorganic encapsulation portion of the second sub-pixel unit P2 facing away from the light emitting material layer 7 and in the other pixel opening are formed, as shown in FIG. 6G. Figure 15

[0103] The third photoresist J3 is formed on the side of the inorganic encapsulation portion in the pixel opening provided with only the third sub-pixel unit P3 facing away from the light emitting material layer 7, as shown in FIG. 6H. Figure 16

[0104] The layers of the third sub-pixel unit P3, the second electrode layer 8, the light modulation layer 9, the protective layer 10 and the inorganic encapsulation portion in the pixel opening not covered by the third photoresist J3 are removed by etching, and the third photoresist J3 is removed, as shown in FIG. 61. Figure 17

[0105] The second slot K2 is formed in the pixel defining layer 4 between at least part of the first sub-pixel unit P1, the second sub-pixel unit P2 and the third sub-pixel unit P3 adjacent to each other.

[0106] The organic encapsulation layer 52 is formed on the side of the inorganic encapsulation portion facing away from the light emitting material layer 7, and part of the organic encapsulation layer 52 is filled in the second slot K2 to communicate with the organic layer.

[0107] ​​​​​​​The application further provides a display device, comprising the display panel.

[0108] Therefore, the display device provided by the embodiments of the application has the technical effects of the technical solutions of the display panel in any of the above embodiments, and the same or corresponding structures and explanations of terms are not described herein again.

[0109] The display device provided by the embodiments of the application can be applied to a mobile phone, and can also be any electronic product with a display function, including but not limited to the following categories: a television, a notebook computer, a desktop display, a tablet computer, a digital camera, a smart bracelet, smart glasses, a vehicle-mounted display, medical equipment, industrial control equipment, a touch interaction terminal, and the like, and the embodiments of the application are not specially limited to any of the above.

[0110] The above is merely a specific implementation of the application, and those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described system, modules and units can refer to the corresponding processes in the foregoing method embodiments, which are not described herein again. It should be understood that the protection scope of the application is not limited to this, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the application, and these modifications or replacements should be covered within the protection scope of the application.

[0111] It should be further noted that the exemplary embodiments mentioned in the application describe some methods or systems based on a series of steps or devices. However, the application is not limited to the order of the above steps, that is, the steps can be executed in the order mentioned in the embodiments, or in an order different from the embodiments, or several steps can be executed simultaneously.

Claims

1. A display panel, characterized by, The display panel has a display area and a frame area adjacent to the display area, and comprises: an array substrate; an organic layer arranged on one side of the array substrate; a pixel definition layer arranged on a side of the organic layer away from the array substrate, the pixel definition layer having a pixel opening; an encapsulation layer arranged on a side of the pixel definition layer away from the array substrate, the encapsulation layer comprising a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer stacked along a thickness direction of the display panel, the organic encapsulation layer and the organic layer being in communication through a slot penetrating the pixel definition layer, the first inorganic encapsulation layer being arranged closer to the organic layer relative to the second inorganic encapsulation layer, and part of the pixel definition layer in the frame area not being covered by the first inorganic encapsulation layer; an isolation column arranged on a side of the pixel definition layer away from the array substrate; the display panel further comprises sub-pixel units of different colors, the sub-pixel units being located in the pixel opening, each of the sub-pixel units comprising a first electrode block, a light-emitting material layer and a second electrode layer stacked, and further comprising a light modulation layer between the second electrode layer and the first inorganic encapsulation layer, a side surface of the second electrode layer, the light modulation layer and a side surface of the adjacent isolation column being in contact; the organic layer, the pixel definition layer and the encapsulation layer all extend from the display area to the frame area; in the display area, the pixel definition layer is provided with a second slot for the organic encapsulation layer and the organic layer to communicate, the second slot being in communication with the isolation column and the organic layer, the second slot being offset from a projection of the array substrate and a projection of the pixel opening on the array substrate, the second slot being arranged between at least part of the adjacent sub-pixel units, and in at least the display area, the first inorganic encapsulation layer comprises a plurality of inorganic encapsulation portions arranged at intervals and corresponding to the sub-pixel units, a projection of the inorganic encapsulation portion on the array substrate being offset from a projection of the second slot on the array substrate, and the inorganic encapsulation portion being arranged between two adjacent isolation columns.

2. The display panel of claim 1, wherein, The pixel definition layer comprises at least one inorganic material layer.

3. The display panel of claim 1, wherein, The display panel further comprises a first electrode layer arranged on a side of the organic layer away from the array substrate, the first electrode layer comprising a plurality of first electrode blocks insulated from each other.

4. The display panel of claim 3, wherein, The pixel opening exposes at least part of the first electrode blocks.

5. The display panel of claim 1, wherein, In the frame area, the pixel definition layer is provided with a first slot for the organic encapsulation layer and the organic layer to communicate.

6. The display panel of claim 5, wherein, The organic encapsulation layer partially fills the first slot.

7. The display panel of claim 5, wherein, The organic layer comprises a planarization layer; or the organic layer comprises a planarization layer and a via layer stacked along a thickness direction of the display panel.

8. The display panel of claim 5, wherein, The first slot is arranged around the display area.

9. The display panel of claim 5, wherein, The first slot in the frame area has a continuous ring structure; or the frame area has a plurality of first slots arranged at intervals.

10. The display panel of claim 5, wherein, A projection of the first inorganic encapsulation layer in the frame area on the array substrate is offset from a projection of the first slot on the array substrate.

11. The display panel of claim 1, wherein, The organic encapsulation layer is partially filled in the second groove.

12. The display panel of claim 1, wherein, In a thickness direction of the display panel, a cross section of the isolation column is at least one of an I-shaped cross section or a T-shaped cross section.

13. The display panel of claim 1, wherein, At least part of the second groove is arranged around the entire sub-pixel unit; or, at least part of the second groove is arranged around part of an edge of the sub-pixel unit.

14. A display panel manufacturing method for manufacturing the display panel according to any one of claims 1 to 13, characterized by, The method comprises the following steps: Providing an array substrate; Forming an organic layer on one side of the array substrate; Forming a pixel definition layer on a side of the organic layer away from the array substrate, the pixel definition layer being provided with a groove penetrating through the pixel definition layer; Forming an encapsulation layer on a side of the pixel definition layer away from the array substrate, the encapsulation layer comprising an organic encapsulation layer, and the organic encapsulation layer and the organic layer being in communication through the groove.

15. The display panel manufacturing method according to claim 14, wherein The pixel definition layer has pixel openings, and between the step of forming the pixel definition layer on the side of the organic layer away from the array substrate and the step of forming the encapsulation layer on the side of the pixel definition layer away from the array substrate, the method further comprises: Forming a first sub-pixel unit in each of the pixel openings; Forming a first photoresist on a side of at least one of the first sub-pixel units away from the array substrate; Etching the first sub-pixel units that are not covered by the first photoresist; Forming a second sub-pixel unit on a side of the first sub-pixel units that are not etched away from the array substrate and in the pixel openings in which the first sub-pixel units are etched away; Forming a second photoresist on a side of at least one of the second sub-pixel units located in the pixel openings away from the array substrate; Etching the second sub-pixel units that are not covered by the second photoresist.

16. A display device, characterized in that, The display panel is any one of the display panels according to claims 1 to 13. ​

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