Circuit boards and electronic devices

Abstract

The present application relates to a circuit board and electronic equipment, and relates to the technical field of communication equipment. The circuit board includes a signal line and a ground layer, and the circuit board is provided with a first via hole, and the signal line includes a first transmission line and a second transmission line, and the first transmission line and the second transmission line are arranged in the thickness direction of the circuit board, wherein: a connector and a first shielding member are provided in the first via hole, an insulating gap is provided between the connector and the first shielding member, the first transmission line and the second transmission line are connected by the connector, and the first shielding member is connected to the ground layer; or a connector is provided in the first via hole, a first end of the first transmission line and a second end of the second transmission line are connected by the connector, at least one of the first end and the second end is located between the two ends of the first via hole, one end of the connector is flush with the first transmission line, and the other end of the connector is flush with the second transmission line.

Description

Technical Field

[0001] The present application belongs to the technical field of communication equipment, and specifically relates to a circuit board and electronic equipment. Background Art

[0002] With the rapid development of communication technology, the circuit boards of electronic devices are becoming increasingly powerful. At the same time, the number of components on these boards is also increasing, leading to an increasing wiring density in the circuit board structure. However, this higher wiring density poses a significant challenge to the isolation design of the signal lines on the circuit board.

[0003] Currently, the most common wiring method for signal lines on most circuit boards is to isolate long parallel lines with a ground line. In this case, the energy on the signal line can easily pass through its edge and couple in the vertical direction, thereby affecting the isolation effect and causing signal crosstalk problems on the signal line. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a circuit board and an electronic device that can solve the problem of signal crosstalk existing in signal lines of current circuit boards.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a circuit board, the circuit board including a signal line and a ground layer, the circuit board having a first via, the signal line including a first transmission line and a second transmission line, the first transmission line and the second transmission line being arranged in a thickness direction of the circuit board, wherein:

[0007] A connector and a first shielding member are provided in the first via hole, an insulating gap is provided between the connector and the first shielding member, the first transmission line and the second transmission line are connected via the connector, and the first shielding member is connected to the ground layer; or

[0008] A connector is provided in the first via hole, and the first end of the first transmission line and the second end of the second transmission line are connected by the connector, at least one of the first end and the second end is located between the two ends of the first via hole, one end of the connector is flush with the first transmission line, and the other end of the connector is flush with the second transmission line.

[0009] In a second aspect, an embodiment of the present application further provides an electronic device comprising the above-mentioned circuit board.

[0010] In an embodiment of the present application, a connector and a first shielding member are provided in a first via hole, an insulating gap is provided between the connector and the first shielding member, a first transmission line and a second transmission line are connected via the connector to transmit a signal, and the first shielding member is connected to the ground layer, thereby shielding the signal from interference from adjacent structures; or, only a connector is provided in the first via hole, a first end portion of the first transmission line and a second end portion of the second transmission line are connected via the connector, one end of the connector is flush with the first transmission line, the other end of the connector is flush with the second transmission line, and at least one of the first end portion of the first transmission line and the second end portion of the second transmission line is located between the two ends of the first via hole, thereby eliminating an ineffective portion of the connector that is not used to connect the first transmission line and the second transmission line, thereby forming a height difference with adjacent via holes, reducing the coupling length between the via holes, and thus preventing interference with the signal transmitted on the signal line. Therefore, the embodiment of the present application can solve the problem of signal crosstalk in signal lines of current circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 A schematic diagram of a partial structure of a circuit board disclosed in an embodiment of the present application;

[0012] Figure 2 A schematic diagram of a partial structure of a circuit board disclosed in another embodiment of the present application;

[0013] Figure 3 A schematic diagram of a partial structure of a circuit board disclosed in yet another embodiment of the present application;

[0014] Figures 4 to 7 A comparison diagram of the local structure of the circuit board disclosed in different embodiments of the present application and the existing structure;

[0015] Figure 8 This is a schematic diagram of a partial structure of a circuit board disclosed in yet another embodiment of the present application;

[0016] Figure 9 This is a schematic diagram of a partial structure of a circuit board disclosed in yet another embodiment of the present application;

[0017] Figure 10 This is a schematic diagram of a partial structure of a circuit board disclosed in yet another embodiment of the present application;

[0018] Figure 11 This is a schematic diagram of the partial structure of a circuit board disclosed in yet another embodiment of the present application.

[0019] Description of reference numerals:

[0020] 100 - signal line, 110 - first transmission line, 120 - second transmission line, 130 - first signal line, 140 - second signal line;

[0021] 200-stratum, 210-first stratum, 220-second stratum;

[0022] 300-connector;

[0023] 400 - first shielding member, 410 - first shielding portion, 420 - second shielding portion;

[0024] 500-ground wire;

[0025] 600- second shielding member;

[0026] 700-second via;

[0027] 800-grounding gap, 810-first grounding gap, 820-second grounding gap;

[0028] 900 - insulation layer, 901 - first electrical connector, 902 - second electrical connector. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0030] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects and are not used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate so that the embodiments of this application can be implemented in an order other than those illustrated or described herein. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0031] The circuit board and electronic device provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0032] refer to Figures 1 to 11The embodiment of the present application discloses a circuit board, which includes a signal line 100 and a ground layer 200. The ground layer 200 here specifically refers to a structure with a reference potential of zero. When a structure on the circuit board leaks electricity, the current passes through the ground layer 200 to prevent the circuit board from causing an electric shock accident due to leakage, thereby protecting the circuit board. The circuit board is provided with a first via hole. Optionally, the first via hole can be a through hole, a buried hole, or a blind hole, which is not specifically limited here. The signal line 100 includes a first transmission line 110 and a second transmission line 120. The first transmission line 110 and the second transmission line 120 are arranged in the thickness direction of the circuit board, that is, the first transmission line 110 and the second transmission line 120 are respectively arranged on different structural layers of the circuit board. The first via hole is provided with a connector 300 and a first shielding member 400. Optionally, the connector 300 and the first shielding member 400 can be made of the same material for ease of manufacture, or they can be made of different materials, without specific limitation. Furthermore, optionally, at least one of the connector 300 and the first shielding member 400 can be copper, or they can be other structures, without specific limitation. An insulating gap is defined between the connector 300 and the first shielding member 400. Optionally, the insulating gap can be filled with an insulating medium, which can reliably separate the connector 300 and the first shielding member 400, thereby improving the shielding effect of the first shielding member 400, and also enhance the structural strength of the first via hole. The first transmission line 110 and the second transmission line 120 are connected via the connector 300, and the first shielding member 400 is connected to the ground layer 200, so that the potential of the first shielding member 400 is zero, thereby providing a shielding effect.

[0033] In another embodiment, Figure 3 As shown, a connector 300 is provided in the first via hole. Optionally, the connector 300 may be a copper structure, or of course other structures, which are not specifically limited here. The first end of the first transmission line 110 and the second end of the second transmission line 120 are connected by the connector 300. At least one of the first end and the second end is located between the two ends of the first via hole. One end of the connector 300 is flush with the first transmission line 110, and the other end of the connector 300 is flush with the second transmission line 120. In other words, when processing the circuit board, a structure extending from one end of the first via hole to the other end is first prepared in the first via hole, and then the portion of the structure corresponding to the side of the second end facing away from the first end (i.e. Figure 3 The portion indicated by the dotted line is removed to form a connector 300 extending from the first end of the first transmission line 110 to the second end of the second transmission line 120. At this time, the length of the connector 300 is less than the depth of the first via hole.

[0034] In the embodiment of the present application, a connector 300 and a first shielding member 400 are provided in the first via hole, and an insulating gap is provided between the connector 300 and the first shielding member 400. The first transmission line 110 and the second transmission line 120 are connected through the connector 300 to transmit the signal, and the first shielding member 400 is connected to the stratum 200, thereby shielding the interference of the adjacent structure on the signal; or, only the connector 300 is provided in the first via hole, and the first end of the first transmission line 110 and the second end of the second transmission line 120 are connected through the connector 300. The connector 300 is connected to the first transmission line 110, with one end of the connector 300 flush with the first transmission line 110, and the other end of the connector 300 flush with the second transmission line 120. At least one of the first end of the first transmission line 110 and the second end of the second transmission line 120 is located between the two ends of the first via hole, thereby eliminating the ineffective portion of the connector 300 that is not used to connect the first transmission line 110 and the second transmission line 120. This further forms a height difference with adjacent via holes, thereby reducing the coupling length between the via holes, thereby preventing interference with the signal transmitted on the signal line 100. Therefore, the embodiments of the present application can solve the problem of signal crosstalk in signal lines of current circuit boards.

[0035] like Figure 1 As shown, in an optional embodiment, when a connector 300 and a first shielding member 400 are provided within the first via hole, the first end of the first transmission line 110 and the second end of the second transmission line 120 are connected via the connector 300, and at least one of the first end and the second end is located between the two ends of the first via hole. That is, in the thickness direction of the circuit board, the depth of the first via hole is greater than the length of the connector 300. In this case, the first transmission line 110 and / or the second transmission line 120 can be provided in the internal structural layer of the circuit board. At least a portion of the first shielding member 400 and the connector 300 are spaced apart in a direction parallel to the plane of the circuit board. That is, in a direction parallel to the plane of the circuit board, at least a portion of the first shielding member 400 is disposed opposite the connector 300, thereby preventing the transmission signal on the connector 300 from coupling with adjacent structures. Therefore, this embodiment not only facilitates the arrangement of the first transmission line 110 and the second transmission line 120, but also helps to improve the shielding effect of the first shielding member 400, thereby improving the signal transmission strength of the signal line 100.

[0036] In a further optional embodiment, the first shielding member 400 may include only a portion disposed opposite the connector 300 in a direction parallel to the plane of the circuit board. In this case, this portion can form a shielding wall, thereby shielding signal interference from structures on the side of the connector 300. However, the end of the connector 300 is susceptible to coupling with other adjacent structures through the first via. Therefore, optionally, the first shielding member 400 includes a first shielding portion 410 and a second shielding portion 420. The first shielding portion 410 surrounds the centerline of the first via, and the second shielding portion 420 is connected to the first shielding portion 410. The second shielding portion 420 and the connector 300 are arranged in a direction parallel to the plane of the circuit board. That is, the first shielding portion 410 is a cylindrical structure, thereby shielding the end of the connector 300 and improving the shielding effect of the first shielding member 400.

[0037] like Figure 2 As shown, in another optional embodiment, the end of the first transmission line 110 connected to the connector 300 is located at the first end of the first via, and the end of the second transmission line 120 connected to the connector 300 is located at the second end of the first via. That is, the connector 300 extends from the first end of the first via to the second end of the first via, and the length of the connector 300 is substantially equal to the depth of the first via. In this case, the connector 300 and the first shielding member 400 are both semi-cylindrical structures. The connector 300 and the first shielding member 400 are arranged in a direction parallel to the plane of the circuit board. The concave surface of the connector 300 is arranged opposite the concave surface of the first shielding member 400. In this case, the first shielding member 400 can serve as a shielding wall, thereby enhancing the isolation of the first shielding member 400 and reducing signal coupling on the connector 300. At the same time, the connector 300 and the first shielding member 400 are distributed on both sides of the internal space of the first via, which is easier to manufacture.

[0038] like Figures 4 to 7 As shown, in a specific embodiment, the number of signal lines 100 and first vias is at least two, the at least two signal lines include a first signal line 130 and a second signal line 140, and the at least two first vias include a first through-hole and a second through-hole. In the existing structure on the left, a first electrical connector 901 is provided in the first through-hole, and the first signal line 130 is connected to the first electrical connector 901. A second electrical connector 902 is provided in the second through-hole, and the second signal line 140 is connected to the second electrical connector 902. Because the first through-hole and the second through-hole are adjacent, the signals between the first signal line 130 and the second signal line 140 are easily coupled and interfere with each other.

[0039] In the embodiment of the present application, the connector 300 and the first shielding member 400 are disposed in both the first through hole and the second through hole, thereby shielding the signals between the first signal line 130 and the second signal line 140 to avoid mutual interference.

[0040] Optionally, when the number of first vias is at least two, the structure of the first shielding member 400 arranged in each first via can be the same or different, as long as it can shield the signal interference between the first signal line 130 and the second signal line 140. The embodiment of the present application does not impose any specific restrictions on this.

[0041] Further optionally, as Figure 4 As shown, the structure of the first shielding member 400 arranged in each first via can be the structure in an embodiment in which the first shielding member 400 includes a first shielding portion 410 and a second shielding portion 420. At this time, one of the signal input end and the signal output end of the first signal line 130 enters from a position between the two ends of the first through hole, and the other exits from the inner layer of the circuit board. One of the signal input end and the signal output end of the second signal line 140 enters from a position between the two ends of the second through hole, and the other exits from the inner layer of the circuit board. Without increasing the distance between adjacent first vias, the two adjacent first shielding members 400 form a shielding wall, thereby improving the isolation between the first signal line 130 and the second signal line 140 and reducing the signal coupling between the two.

[0042] In another optional embodiment, as Figure 5 As shown, the structure of the first shielding member 400 arranged in each first via can be the structure in the above-mentioned embodiment where the first shielding member 400 is a semi-cylindrical structure. At this time, the signal input end and the signal output end of the first signal line 130 and the second signal line 140 are both routed from the two ends of the first via. Without increasing the wiring space between adjacent first vias, the two adjacent first shielding members 400 form a shielding wall, thereby improving the isolation between the first signal line 130 and the second signal line 140 to reduce the signal coupling between the two.

[0043] In another optional embodiment, as Figure 6 As shown, the structure of the first shielding member 400 arranged in the first through hole can be the structure in the above-mentioned embodiment in which the first shielding member 400 includes the first shielding part 410 and the second shielding part 420. One of the signal input end and the signal output end of the first signal line 130 enters from a position between the two ends of the first through hole, and the other exits from the inner layer of the circuit board. The structure of the first shielding member 400 arranged in the second through hole can be the structure in the above-mentioned embodiment in which the first shielding member 400 is a semi-cylindrical structure. The signal input end and the signal output end of the second signal line 140 are both routed from the two ends of the second through hole. At this time, the structure of the first shielding member 400 arranged in the first through hole is different from the structure of the first shielding member 400 arranged in the second through hole to meet different signal line layout methods. This embodiment also improves the isolation between the first signal line 130 and the second signal line 140 without increasing the distance between adjacent first vias, and reduces the signal coupling between the two.

[0044] In another optional embodiment, as Figure 7 As shown, since one of the signal input end and the signal output end of the first signal line 130 enters from a position between the two ends of the first through hole, and the other exits from the inner layer of the circuit board, at this time, the part of the first electrical connector 901 located between the signal input end of the first signal line 130 and the signal output end of the first signal line 130 is used to transmit signals and is a valid part, that is, the above-mentioned connector 300, and the remaining part of the first electrical connector 901 is not used to transmit signals and is an invalid part, that is, a stump. At this time, the invalid part is removed to form a height difference between the connector 300 in the first through hole and the connector 300 in the second through hole, thereby reducing the signal coupling between the two.

[0045] like Figures 10 and 11 As shown, in another optional embodiment, the number of signal lines 100 is at least two, and the at least two signal lines include a first signal line 130 and a second signal line 140. The circuit board also includes a ground line 500 and a second shielding member 600. The ground line 500 is arranged between the first signal line 130 and the second signal line 140. The circuit board is also provided with a second via 700, and the second shielding member 600 is arranged in the second via 700, that is, the second shielding member 600 is arranged on the inner wall of the second via 700, and the second shielding member 600 is arranged around the center line of the second via. Optionally, the second shielding member 600 can be a copper structure, and of course it can also be other structures, which is not specifically limited here. Optionally, the second via 700 can be provided on the dielectric layer surrounding the ground wire 500. Furthermore, the second via 700 can be extended to the ground wire 500, so that after the entire circuit board is pressed together, drilling can be performed as needed to facilitate the provision of the second via 700. After the second via 700 is opened, the second shielding member 600 is fully connected to the ground wire 500. The ground wire 500 is connected to the ground layer 200 through the second shielding member 600.

[0046] Optionally, the circuit board also includes an insulating layer 900, which overlaps with the ground layer 200. The first signal line 130, the second signal line 140 and the ground line 500 can all be arranged on the side of the insulating layer 900 away from the ground layer 200. The second via 500 is opened in the insulating layer 900 and extends to the ground line 500. The insulating layer 900 can play an insulating role and at the same time protect the first signal line 130, the second signal line 140 and the ground line 500.

[0047] The second via 700 can be a circular hole, but the size of a circular hole is relatively large, requiring a wider ground wire 500 to meet the requirements. The width here refers to the dimension in the arrangement direction of the first signal line 130 and the second signal line 140. Therefore, optionally, the second via 700 has a curved surface with a curvature less than 2π, that is, the second via 700 is not a circular hole. In this case, the second via 700 occupies less space, and the width of the ground wire 500 can be set smaller, thereby reducing the space occupied by the ground wire 500 and further reducing the distance between the first signal line 130 and the second signal line 140. In this embodiment, by providing the second via 700 on the circuit board and disposing the second shielding member 600 within the second via 700, a shielding wall is formed between the first signal line 130 and the second signal line 140 without increasing the wiring space. This reduces signal coupling between the first signal line 130 and the second signal line 140, thereby preventing signal interference between the two. In addition, the smaller width of the ground wire 500 helps to reduce the difficulty of high-density wiring.

[0048] In an optional embodiment, the second via 700 may be an arc-shaped gap, and the second shielding member 600 may be disposed on the inner wall of the arc-shaped gap by electroplating, or may be disposed in the arc-shaped gap by pouring, thereby filling the arc-shaped gap.

[0049] In another optional embodiment, the second via 700 can be a fan-shaped structure, the second shielding member 600 can be set on the inner wall of the arc-shaped gap by electroplating, and a medium is filled in the central area of the fan-shaped structure to improve the structural strength of the second via 700.

[0050] Optionally, when the radian of the arc-shaped surface is less than 2π, milling can be used to process the second via hole 700 . Of course, other processing techniques can also be used, which is not specifically limited here.

[0051] The radian of the curved surface can be less than 2π and greater than π. In this case, the curved surface of the second via 700 is a major arc, and the space occupied by the second via 700 is still large, requiring a wider ground line 500 to meet the setting requirements. Optionally, the radian of the curved surface is π or π / 2. In this case, the curved surface of the second via 700 is a minor arc, which can further reduce the space occupied by the second via 700. At the same time, the width of the ground line 500 can be reduced, and the distance between the first signal line 130 and the second signal line 140 can be reduced to meet the requirements of high-density wiring design. Moreover, when the second via extends to the ground line 500, the radian of the curved surface of the second via 700 is π or π / 2. In this case, the opening of the second via 700 is less affected by the width of the ground line 500, so as to facilitate processing and manufacturing. Further optionally, the second via 700 can be a semicircular hole or a quarter-circular hole, which is convenient for processing.

[0052] Optionally, the number of second vias 700 can be one. Due to the long length of the ground wire 500, to ensure the shielding effect of the second shielding member 400, the size of the second via 700 needs to be larger. In this case, the second via 700 is similar to a long and narrow strip structure, which will reduce the structural strength of the circuit board. Based on this, in an optional embodiment, the number of second vias 700 and second shielding members 600 is at least two. In this case, the size of each second via 700 can be set smaller, and each second shielding member 600 is correspondingly arranged in each second via 700 to form a mesh shielding wall. In this case, while ensuring the shielding effect of the second shielding member 600, the structural strength of the circuit board is improved.

[0053] like Figures 8 and 9 As shown, in another optional embodiment, the number of signal lines 100 is at least two, and the at least two signal lines include a first signal line 130 and a second signal line 140. The circuit board also includes a ground line 500 and a second shielding member 600. The ground line 500 is arranged between the first signal line 130 and the second signal line 140. The circuit board is further provided with a ground gap 800. Here, the ground gap 800 can be a gap with a length much greater than a width. The second shielding member 600 is poured into the ground gap 800, and the ground line 500 passes through the second shielding member 600. The shielding member 600 is connected to the ground layer 200. At this time, the width of the ground wire 500 can be set to be smaller. The width here is the size in the arrangement direction of the first signal line 130 and the second signal line 140. The ground wire 500 covers the grounding gap 800 to facilitate the arrangement of the first signal line 130 and the second signal line 140; and the second shielding member 600 is directly poured into the grounding gap 800, which is not only convenient for production, but also the second shielding member 600 in the grounding gap 800 forms a shielding wall, and its shielding effect is better.

[0054] Optionally, the circuit board also includes an insulating layer 900, which overlaps with the ground layer 200. The first signal line 130, the second signal line 140 and the ground line 500 can all be arranged on the side of the insulating layer 900 away from the ground layer 200. The grounding gap 800 is opened in the insulating layer 900. The insulating layer 900 can play an insulating role and at the same time protect the first signal line 130, the second signal line 140 and the ground line 500.

[0055] Optionally, the number of grounding slots 800 can be one. However, due to the long length of the ground wire 500, to ensure the shielding effect of the second shielding member 600, the grounding slot 800 needs to be larger, which will reduce the structural strength of the circuit board. Therefore, in an optional embodiment, the number of grounding slots 800 and the number of second shielding members 600 are at least two. In this case, the size of each grounding slot 800 can be smaller, and each second shielding member 600 is disposed in a one-to-one correspondence within each grounding slot 800 to form a mesh shielding wall. In this case, the grounding slots 800 are sequentially spaced along the extension direction of the ground wire 500. While ensuring the shielding effect of the second shielding member 600, this not only helps to enhance the structural strength of the circuit board, but also reduces the number of second shielding members 600, thereby saving costs.

[0056] Optionally, the number of ground layers 200 can be one, in which case the circuit board has a microstrip line structure, which has the characteristics of small size, light weight, high reliability, low cost, and easy connection with electronic devices. Optionally, the number of ground layers 200 can also be at least two, and the ground gaps 800 are arranged in a one-to-one correspondence with the ground layers 200. The ground layers 200 include a first ground layer 210 and a second ground layer 220. The ground gaps 800 include a first ground gap 810 and a second ground gap 820. The ground wire 500 is simultaneously connected to the first ground gap 810 and the second ground gap 820, and the first ground gap 810 and the second ground gap 820 are respectively located on both sides of the ground wire 500. The first ground layer 210 is connected to the ground wire 500 through the first ground gap 810, and the second ground layer 220 is connected to the ground wire 500 through the second ground gap 820. In this case, the circuit board has a stripline structure, which has the characteristics of easy impedance control and good shielding effect.

[0057] Based on the circuit board disclosed in the embodiments of the present application, the embodiments of the present application further disclose an electronic device, which includes the circuit board of any of the above embodiments.

[0058] The electronic devices disclosed in the embodiments of the present application may be smart phones, tablet computers, e-book readers, wearable devices (such as smart watches), electronic game consoles, and other electronic devices. The embodiments of the present application do not impose specific restrictions on the types of electronic devices.

[0059] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A circuit board, characterized in that: The circuit board comprises a signal line (100) and a ground layer (200), the circuit board is provided with a first via hole, the signal line (100) comprises a first transmission line (110) and a second transmission line (120), the first transmission line (110) and the second transmission line (120) are arranged in a thickness direction of the circuit board, wherein: A connecting member (300) and a first shielding member (400) are provided in the first via hole, an insulating gap is provided between the connecting member (300) and the first shielding member (400), the first transmission line (110) and the second transmission line (120) are connected via the connecting member (300), the first shielding member (400) is connected to the ground layer (200), the first shielding member (400) comprises a first shielding portion (410) and a second shielding portion (420), the first shielding portion (410) surrounds the center line of the first via hole, the second shielding portion (420) is connected to the first shielding portion (410), and the second shielding portion (420) and the connecting member (300) are arranged at intervals in a direction parallel to the plane where the circuit board is located.

2. The circuit board according to claim 1, wherein: The first end of the first transmission line (110) and the second end of the second transmission line (120) are connected via the connector (300), and at least one of the first end and the second end is located between two ends of the first via.

3. The circuit board according to claim 1, wherein: One end of the first transmission line (110) connected to the connector (300) is located at the first end of the first via hole, and one end of the second transmission line (120) connected to the connector (300) is located at the second end of the first via hole. The connector (300) and the first shielding member (400) are both semi-cylindrical structures. The connector (300) and the first shielding member (400) are arranged at intervals in a direction parallel to the plane where the circuit board is located.

4. The circuit board according to claim 1, wherein: The number of the signal lines (100) is at least two, and the at least two signal lines include a first signal line (130) and a second signal line (140). The circuit board also includes a ground line (500) and a second shielding component (600). The ground line (500) is arranged between the first signal line (130) and the second signal line (140). The circuit board is also provided with a second via hole (700). The second shielding component (600) is arranged in the second via hole (700). The ground line (500) is connected to the ground layer (200) through the second shielding component (600). The second via hole (700) has an arcuate surface, and the curvature of the arcuate surface is less than 2π.

5. The circuit board according to claim 4, characterized in that The radian of the arc-shaped surface is π or π / 2.

6. The circuit board according to claim 4, wherein: The number of the second via holes (700) and the number of the second shielding members (600) are both at least two, and each second shielding member (600) is arranged in a one-to-one correspondence within each second via hole (700) to form a mesh shielding wall.

7. The circuit board according to claim 1, wherein: The number of the signal lines is at least two, and the at least two signal lines include a first signal line (130) and a second signal line (140). The circuit board also includes a ground line (500) and a second shielding component (600). The ground line (500) is arranged between the first signal line (130) and the second signal line (140). The circuit board is also provided with a grounding gap (800). The second shielding component (600) is poured into the grounding gap (800). The ground line (500) is connected to the ground layer (200) through the second shielding component (600).

8. The circuit board according to claim 7, wherein: The number of the grounding gaps (800) and the number of the second shielding members (600) are both at least two, and each of the second shielding members (600) is arranged in a one-to-one correspondence within each of the grounding gaps (800) to form a mesh shielding wall.

9. An electronic device, characterized in that: A circuit board comprising the circuit board according to any one of claims 1 to 8.

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