Display device and method of manufacturing the same

CN115240543BActive Publication Date: 2026-10-20SAMSUNG DISPLAY CO LTD
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Patent Information

Application Number
CN202210127203.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2021-04-22
Filing Date
2022-02-11
Publication Date
2026-10-20
Estimated Expiration
2042-02-11

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Abstract

The present disclosure relates to a display apparatus and a manufacturing method thereof. The display apparatus includes a display panel having a first area, a second area spaced apart from the first area in a first direction, and a curved area between the first area and the second area; a polarization layer on the display panel in the first area; and a curved protection layer on the display panel and including a pre-formed curved protection layer spaced apart from the polarization layer in the first direction, a first post-formed curved protection layer between the polarization layer and the pre-formed curved protection layer, and a second post-formed curved protection layer spaced apart from the first post-formed curved protection layer, wherein the pre-formed curved protection layer is interposed between the first post-formed curved protection layer and the second post-formed curved protection layer.
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Description

Technical Field

[0001] Embodiments of the present invention relate to display devices and methods of manufacturing the same. Background Technology

[0002] Flat panel displays have replaced cathode ray tube (CRT) displays due to their lightweight and thin profile. Representative examples of these flat panel displays include liquid crystal displays (LCDs) and organic light-emitting diode (OLED) displays.

[0003] At least a portion of the display device can be curved. Therefore, the visibility of the display device from different angles can be improved, and the area of ​​the non-display region can be reduced. Methods for minimizing or reducing damage and manufacturing costs have been investigated in methods for manufacturing display devices that are at least partially curved.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background art, and therefore the information discussed in this background section does not necessarily constitute prior art. Summary of the Invention

[0005] Some aspects of embodiments of the present invention relate to display devices and methods of manufacturing the same. For example, some aspects of embodiments of the present invention relate to display devices having curved regions and methods of manufacturing the same.

[0006] Some aspects of embodiments of the present invention include display devices with relatively improved reliability.

[0007] Some embodiments of the present invention also provide a method for manufacturing a display device with improved reliability.

[0008] Additional features of some embodiments of the inventive concept will be set forth in the following description and will be apparent in part from the description, or may be learned by practicing the inventive concept.

[0009] A display device according to some embodiments may include: a display panel having a first region, a second region spaced apart from the first region in a first direction, and a curved region positioned between the first region and the second region; a polarizing layer on the display panel in the first region; and a bending protection layer on the display panel, comprising a pre-formed bending protection layer, a first subsequently formed bending protection layer, and a second subsequently formed bending protection layer. The pre-formed bending protection layer may be spaced apart from the polarizing layer in the first direction. The first subsequently formed bending protection layer may be positioned between the polarizing layer and the pre-formed bending protection layer. The second subsequently formed bending protection layer may be spaced apart from the first subsequently formed bending protection layer, and the pre-formed bending protection layer is interposed between the first subsequently formed bending protection layer and the second subsequently formed bending protection layer.

[0010] According to some implementations, at least a portion of the pre-formed bending protective layer may overlap with the bending region.

[0011] According to some embodiments, at least a portion of the first subsequently formed bending protective layer may overlap with the first region. At least a portion of the second subsequently formed bending protective layer may overlap with the second region.

[0012] According to some embodiments, the first subsequently formed bending protective layer can be in direct contact with the polarizing layer and the pre-formed bending protective layer. The second subsequently formed bending protective layer can be in direct contact with the pre-formed bending protective layer.

[0013] According to some implementations, the pre-formed bend protection layer, the first post-formed bend protection layer, and the second post-formed bend protection layer may include the same material.

[0014] According to some implementations, the average distance between the lower surface of the display panel and the upper surface of the bending protective layer can be smaller than the average distance between the lower surface of the display panel and the upper surface of the polarization layer.

[0015] According to some implementations, the pre-formed bending protective layer can extend in a second direction intersecting the first direction.

[0016] According to some embodiments, the edge of the first subsequently formed bending protective layer that contacts the pre-formed bending protective layer may extend in a second direction. The edge of the second subsequently formed bending protective layer that contacts the pre-formed bending protective layer may extend in the second direction and may be spaced apart from the edge of the first subsequently formed bending protective layer in a first direction.

[0017] A method of manufacturing a display device according to some embodiments may include: forming a display panel having a first region, a second region spaced apart from the first region in a first direction, and a curved region positioned between the first region and the second region; forming a polarizing layer on the display panel in the first region; forming a pre-formed curved protective layer on the display panel; and forming a subsequently formed curved protective layer on the display panel including a first subsequently formed curved protective layer and a second subsequently formed curved protective layer. The pre-formed curved protective layer may be formed to be spaced apart from the polarizing layer in the first direction. The first subsequently formed curved protective layer may be formed between the polarizing layer and the pre-formed curved protective layer. The second subsequently formed curved protective layer may be formed to be spaced apart from the first subsequently formed curved protective layer, and the pre-formed curved protective layer may be interposed between the first subsequently formed curved protective layer and the second subsequently formed curved protective layer.

[0018] According to some embodiments, forming a pre-formed bend protection layer may include: forming a first curable material layer on a display panel by applying a first curable material to a first forming region spaced apart from a polarization layer in a first direction; and forming a pre-formed bend protection layer by pre-curing the first curable material layer.

[0019] According to some embodiments, the post-formed bending protective layer may include: forming a second curable material layer and a third curable material layer on a display panel by applying a second curable material to a second forming region and a third forming region; and forming a first post-formed bending protective layer and a second post-formed bending protective layer by curing the second curable material layer and the third curable material layer. The second forming region may be positioned between the polarizing layer and the first forming region. The third forming region may be adjacent to the first forming region in a first direction.

[0020] According to some implementations, the third curable material layer may be formed before the second curable material layer.

[0021] According to some implementation methods, the second curable material may be the same as the first curable material.

[0022] According to some embodiments, the third curable material layer may be spaced apart from the second curable material layer, and a pre-formed bending protective layer may be inserted between the second curable material layer and the third curable material layer.

[0023] According to some implementations, at least a portion of the pre-formed bending protective layer may overlap with the bending region.

[0024] According to some embodiments, at least a portion of the first subsequently formed bending protective layer may overlap with the first region. At least a portion of the second subsequently formed bending protective layer may overlap with the second region.

[0025] According to some embodiments, the first subsequently formed bending protective layer can be in direct contact with the polarizing layer and the pre-formed bending protective layer. The second subsequently formed bending protective layer can be in direct contact with the pre-formed bending protective layer.

[0026] According to some embodiments, the average distance between the lower surface of the display panel and the upper surface of the bending protective layer, which includes a pre-formed bending protective layer and a post-formed bending protective layer, can be less than the average distance between the lower surface of the display panel and the upper surface of the polarization layer.

[0027] According to some implementations, the pre-formed bending protective layer can extend in a second direction intersecting the first direction.

[0028] According to some embodiments, the edge of the first subsequently formed bending protective layer that contacts the pre-formed bending protective layer may extend in a second direction. The edge of the second subsequently formed bending protective layer that contacts the pre-formed bending protective layer may extend in the second direction and may be spaced apart from the edge of the first subsequently formed bending protective layer in a first direction.

[0029] A display device according to some embodiments may include a display panel, a polarizing layer on the display panel, and a bending protective layer on the display panel covering a bending region. The bending protective layer may include a pre-formed bending protective layer spaced apart from the polarizing layer and a subsequently formed bending protective layer, the subsequently formed bending protective layer including a first subsequently formed bending protective layer and a second subsequently formed bending protective layer on opposite sides of the pre-formed bending protective layer, respectively. The pre-formed bending protective layer may be formed before the subsequently formed bending protective layer. Therefore, even when the bending protective layer has a relatively small thickness, the uniformity of the bending protective layer's thickness can be improved. Thus, the reliability of the display device can be improved.

[0030] It should be understood that the foregoing general description and the following detailed description are merely examples and are intended to provide further explanation of the claimed invention. Attached Figure Description

[0031] The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the inventive concept.

[0032] Figure 1 This is a plan view showing a display device according to some embodiments.

[0033] Figure 2 It is along Figure 1 The cross-sectional view taken from line I-I'.

[0034] Figure 3 It is shown that it includes Figure 2 A cross-sectional view of the display panel in a display device.

[0035] Figure 4 It shows along Figure 1 A cross-sectional view of an example taken from line II-II'.

[0036] Figure 5 It is shown Figure 4 A cross-sectional view of the curved structure of the display device.

[0037] Figure 6 It shows along Figure 1 Another example of a cross-sectional view taken from line II-II'.

[0038] Figure 7 It shows along Figure 1 Another example of a cross-sectional view taken from line II-II'.

[0039] Figures 8 to 14 This is a cross-sectional view illustrating a method for manufacturing a display device according to some embodiments.

[0040] Figure 15 This is a cross-sectional view showing a display device according to some embodiments.

[0041] Figure 16 This is a block diagram illustrating an electronic device according to some embodiments.

[0042] Figure 17 It shows that Figure 16 The diagram illustrates an example of an electronic device implemented as a television.

[0043] Figure 18 It shows that Figure 16 A diagram illustrating an example of an electronic device implemented as a smartphone. Detailed Implementation

[0044] The illustrative and non-limiting embodiments will be more clearly understood through the following detailed description taken in conjunction with the accompanying drawings.

[0045] Figure 1 This is a plan view showing a display device according to some embodiments. Figure 2 It is along Figure 1 The cross-sectional view taken from line I-I'. Figure 3 It is shown that it includes Figure 2 A cross-sectional view of the display panel in a display device. Figure 4 It shows along Figure 1 A cross-sectional view of an example taken from line II-II'. Figure 5 It is shown Figure 4 A cross-sectional view of the curved structure of the display device. Figure 6 It shows along Figure 1 Another example of a cross-sectional view taken from line II-II'.

[0046] refer to Figures 1 to 6 According to some embodiments, the display device 10 may include a display panel 100, a driving circuit chip 210, a flexible printed circuit board (FPCB) 220, a polarizing layer 300, a bending protection layer 400, a panel protection layer 520, a pad layer 530, and a metal layer 540.

[0047] Display panel 100 can generate or display images. Display panel 100 may include a plurality of pixels for generating images. Light emitted from each of the pixels can be combined to generate or display an image. Display panel 100 can provide an image generated toward upper surface 101.

[0048] The display panel 100 may have a flexible region in the form of a first region 1A, a second region 2A, and a curved region BA. For example, the first region 1A may be a display area for displaying images, while the second region 2A may be a non-display area.

[0049] According to some implementations, the second region 2A may be located on one side of the first region 1A and may be spaced apart from the first region 1A. For example, the second region 2A may be spaced apart from the first region 1A in the first direction DR1.

[0050] The curved region BA can be located between the first region 1A and the second region 2A. The curved region BA can be curved along a bending axis extending in a second direction DR2 that intersects the first direction DR1. For example, the second direction DR2 can be perpendicular to the first direction DR1.

[0051] According to some implementation methods, such as Figure 3 As shown, the display panel 100 may include a substrate 110, a transistor TR, a light-emitting element 150, and an encapsulation layer 160.

[0052] Substrate 110 may be a flexible and insulating substrate. For example, substrate 110 may include (or may be) a transparent resin substrate. For example, substrate 110 may include a polyimide substrate. In this case, substrate 110 may have a multilayer structure in which one or more polyimide layers are alternately stacked with one or more barrier layers.

[0053] The active layer 120 may be located on the substrate 110. The active layer 120 may include oxide semiconductors, silicon semiconductors, organic semiconductors, etc. For example, the oxide semiconductor may include at least one oxide selected from indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The silicon semiconductor may include amorphous silicon, polycrystalline silicon, etc. The active layer 120 may include a source electrode region, a drain electrode region, and a channel region positioned between the source electrode region and the drain electrode region.

[0054] According to some embodiments, a buffer layer may be located between the substrate 110 and the active layer 120. The buffer layer can prevent or reduce the diffusion of impurities from the substrate 110 into the active layer 120. The buffer layer can prevent or reduce the penetration of foreign substances such as oxygen or moisture through the substrate 110 into the active layer 120. The buffer layer may comprise an inorganic insulating material such as a silicon compound or a metal oxide. Examples of inorganic insulating materials that can be used for the buffer layer may include silicon oxide (SiO₂). x ), silicon nitride (SiN) x ), silicon oxynitride (SiO) x N y ), silicon dioxide (SiO2) x C y ), silicon carbonitride (SiC) x N y ), aluminum oxide (AlO) x ), aluminum nitride (AlN) x ), tantalum oxide (TaO) x ), Hafnium oxide (HfO) x Zirconium oxide (ZrO) x Titanium oxide (TiO) x These materials can be used alone or in combination. The buffer layer can have a single-layer structure or a multi-layer structure including multiple insulating layers.

[0055] The first insulating layer 111 may be located on the active layer 120. The first insulating layer 111 may cover the active layer 120 on the substrate 110. The first insulating layer 111 may include an inorganic insulating material such as a silicon compound or a metal oxide. The first insulating layer 111 may have a single-layer structure or a multilayer structure including multiple insulating layers.

[0056] The gate electrode 130 may be located on the first insulating layer 111. The gate electrode 130 may overlap with the channel region of the active layer 120. The gate electrode 130 may include a conductive material such as a metal, alloy, conductive metal nitride, conductive metal oxide, transparent conductive material, etc. Examples of conductive materials that can be used for the gate electrode 130 may include gold (Au), silver (Ag), aluminum (Al), platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), aluminum-containing alloys, silver-containing alloys, copper-containing alloys, molybdenum-containing alloys, and aluminum nitride (AlN). x ), Tungsten nitride (WN) x Titanium nitride (TiN) x ), Chromium nitride (CrN) x ), Tantalum nitride (TaN) x), Strontium ruthenium oxide (SRO), zinc oxide (ZnO) x Indium tin oxide (ITO), tin oxide (SnO) x Indium oxide (InO) x Gallium oxide (GaO) x Materials such as indium zinc oxide (IZO) can be used individually or in combination. The gate electrode 130 can have a single-layer structure or a multilayer structure including multiple conductive layers.

[0057] The second insulating layer 112 may be located on the gate electrode 130. The second insulating layer 112 may cover the gate electrode 130 on the first insulating layer 111. The second insulating layer 112 may include an inorganic insulating material such as a silicon compound or a metal oxide. The second insulating layer 112 may have a single-layer structure or a multilayer structure including multiple insulating layers.

[0058] Source electrode 141 and drain electrode 142 may be located on the second insulating layer 112. Source electrode 141 and drain electrode 142 may be connected to the source electrode region and drain electrode region of active layer 120, respectively. Each of source electrode 141 and drain electrode 142 may include a conductive material such as a metal, alloy, conductive metal nitride, conductive metal oxide, transparent conductive material, etc. Each of source electrode 141 and drain electrode 142 may have a single-layer structure or a multilayer structure including multiple conductive layers. Active layer 120, gate electrode 130, source electrode 141, and drain electrode 142 may form a transistor TR.

[0059] The third insulating layer 113 may be located on the source electrode 141 and the drain electrode 142. The third insulating layer 113 may include an organic insulating material. Examples of organic insulating materials that can be used for the third insulating layer 113 may include photoresist, polypropylene-based resin, polyimide-based resin, polyamide-based resin, siloxane-based resin, acrolein-based resin, epoxy resin, etc. These materials may be used alone or in combination thereof. According to some embodiments, the third insulating layer 113 may have a multilayer structure comprising at least one organic insulating layer and at least one inorganic insulating layer.

[0060] Pixel electrode 151 may be located on the third insulating layer 113. Pixel electrode 151 may be connected to source electrode 141 or drain electrode 142. Pixel electrode 151 may include conductive materials such as metals, alloys, conductive metal nitrides, conductive metal oxides, transparent conductive materials, etc. Pixel electrode 151 may have a single-layer structure or a multilayer structure including multiple conductive layers.

[0061] A fourth insulating layer 114 may be located on the pixel electrode 151. The fourth insulating layer 114 may cover the peripheral region of the pixel electrode 151 and may include a pixel opening exposing the central region of the pixel electrode 151. The fourth insulating layer 114 may include an organic insulating material.

[0062] The emitting layer 152 may be located on the pixel electrode 151. The emitting layer 152 may be located in the pixel opening of the fourth insulating layer 114. According to some embodiments, the emitting layer 152 may include at least one of organic light-emitting materials and quantum dots.

[0063] According to some embodiments, organic light-emitting materials may include low-molecular-weight organic compounds or high-molecular-weight organic compounds. Examples of low-molecular-weight organic compounds may include copper phthalocyanine, N,N'-diphenylbenzidine, tris-(8-hydroxyquinoline)aluminum, etc. Examples of high-molecular-weight organic compounds may include poly(3,4-ethylenedioxythiophene), polyaniline, polyphenylenevinylene, polyfluorene, etc. These materials may be used alone or in combination thereof.

[0064] According to some embodiments, quantum dots may include a core containing group II-VI compounds, group III-V compounds, group IV-VI compounds, group IV elements, and / or group IV compounds. According to some embodiments, quantum dots may have a core-shell structure comprising a core and a shell surrounding the core. The shell may act as a protective layer to prevent nuclear chemical modification in order to maintain semiconductor properties, and may also act as a charging layer to impart electrophoretic properties to the quantum dots.

[0065] The auxiliary electrode 153 may be located on the emitting layer 152. The auxiliary electrode 153 may also be located on the fourth insulating layer 114. The auxiliary electrode 153 may include conductive materials such as metals, alloys, conductive metal nitrides, conductive metal oxides, transparent conductive materials, etc. The auxiliary electrode 153 may have a single-layer structure or a multilayer structure including multiple conductive layers. The pixel electrode 151, the emitting layer 152, and the auxiliary electrode 153 may form a light-emitting element 150.

[0066] The encapsulation layer 160 may be located on the auxiliary electrode 153. The encapsulation layer 160 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. According to some embodiments, the encapsulation layer 160 may include a first inorganic encapsulation layer 161 located on the auxiliary electrode 153, an organic encapsulation layer 162 located on the first inorganic encapsulation layer 161, and a second inorganic encapsulation layer 163 located on the organic encapsulation layer 162.

[0067] According to some embodiments, the driving circuit chip 210 may be located in the second region 2A on the display panel 100. The FPCB 220 may be located on the end portion of the second region 2A (e.g., the end portion in the first direction DR1). That is, the FPCB 220 may be spaced apart from the driving circuit chip 210 in the first direction DR1. Additionally, a printed circuit board (PCB) may be connected to the end portion of the FPCB 220. According to some embodiments, the driving circuit chip 210 may be located on the FPCB 220.

[0068] The driving circuit chip 210, FPCB 220, and PCB can provide driving signals to the display panel 100. The driving signals can include various signals used to drive the display panel 100, such as driving voltage, gate signals, and data signals.

[0069] The polarization layer 300 may be located in a first region 1A on the display panel 100. The polarization layer 300 can reduce the reflection of external light from the display device 10. For example, when external light that has passed through the polarization layer 300 is reflected from the lower portion of the polarization layer 300 (e.g., the upper portion of the display panel 100) and then passes through the polarization layer 300 again, the phase of the reflected external light can change because the incident external light passes through the polarization layer 300 twice. Therefore, the phase of the reflected external light may differ from the phase of the incident external light entering the polarization layer 300, resulting in destructive interference. Thus, the reflection of external light can be reduced to improve the visibility of the display device 10.

[0070] The adhesive layer 512 may be located between the display panel 100 and the polarizing layer 300. The adhesive layer 512 can attach the polarizing layer 300 to the upper surface 101 of the display panel 100. For example, the adhesive layer 512 may include any one of optically clear adhesive (OCA), pressure-sensitive adhesive (PSA), and optically clear resin (OCR), including acrolein-based adhesives, silicone-based adhesives, urethane-based adhesives, rubber-based adhesives, vinyl ether-based adhesives, etc.

[0071] A bend protection layer 400 may be located on the display panel 100. The bend protection layer 400 may cover the bend region BA on the upper surface 101 of the display panel 100. According to some embodiments, the bend protection layer 400 may cover a portion of the first region 1A (e.g., the end portion in the first direction DR1), the bend region BA, and a portion of the second region 2A (e.g., the end portion in the direction opposite to the first direction DR1).

[0072] The bend protection layer 400 can protect the bend region BA of the display panel 100. For example, the bend protection layer 400 can protect the conductive layer in the bend region BA of the display panel 100. Wiring for transmitting drive signals to the display panel 100 can be located in the conductive layer. When the stacked structure is bent, there is a stress neutral plane in the stacked structure. If the bend protection layer 400 is omitted, excessive tensile stress may be applied to the conductive layer in the bend region BA when the display panel 100 is bent because the conductive layer may not be in the stress neutral plane. However, the bend protection layer 400 can be formed on the bend region BA, and the thickness and elastic modulus of the bend protection layer 400 can be controlled so that the position of the stress neutral plane in the stacked structure including the display panel 100, the bend protection layer 400, etc., can be around the conductive layer. By forming the bend protection layer 400, the position of the stress neutral plane can be around the conductive layer. Therefore, the tensile stress applied to the conductive layer can be minimized. In addition, the bend protection layer 400 can protect the bend region BA of the display panel 100 from the effects of static electricity introduced from the outside.

[0073] According to some embodiments, the bending protection layer 400 may include a pre-formed bending protection layer 410 and a subsequently formed bending protection layer 420. The pre-formed bending protection layer 410 may be formed before the subsequently formed bending protection layer 420. The subsequently formed bending protection layer 420 may include a first subsequently formed bending protection layer 422 and a second subsequently formed bending protection layer 424.

[0074] The pre-formed bending protective layer 410 may be spaced apart from the polarization layer 300 in the first direction DR1. According to some embodiments, at least a portion of the pre-formed bending protective layer 410 may overlap with the bending region BA. That is, the pre-formed bending protective layer 410 may cover or overlap with at least a portion of the bending region BA on the upper surface 101 of the display panel 100.

[0075] According to some implementation methods, such as Figure 1 As shown, the pre-formed bending protective layer 410 can extend in the second direction DR2. In addition, the upper surface of the pre-formed bending protective layer 410 can have a rounded shape.

[0076] The pre-formed bendable protective layer 410 may include a curable material. The curable material may include a photocurable material or a thermocurable material. Photocurable materials may include ultraviolet (UV) curable resins. Examples of photocurable materials may include epoxy acrylate resins, polyester acrylate resins, polyurethane acrylate resins, polyether acrylate resins, silicone acrylate resins, alkyl acrylate resins, etc. Examples of thermocurable materials may include epoxy resins, phenolic resins, urea-formaldehyde resins, melamine resins, polyurethane resins, etc. These materials may be used alone or in combination.

[0077] The first post-formed bending protective layer 422 can be located between the polarizing layer 300 and the pre-formed bending protective layer 410. According to some embodiments, at least a portion of the first post-formed bending protective layer 422 can overlap with the first region 1A. That is, the first post-formed bending protective layer 422 can cover a portion of the first region 1A on the upper surface 101 of the display panel 100. Figure 1 As shown, the first post-formed bending protective layer 422 can extend in the second direction DR2.

[0078] According to some embodiments, the first post-formed bending protective layer 422 can be in direct contact with the polarization layer 300 and the pre-formed bending protective layer 410. For example, the first end portion of the first post-formed bending protective layer 422 adjacent to the polarization layer 300 can be in direct contact with the sidewall of the polarization layer 300. Although not shown, the first end portion of the first post-formed bending protective layer 422 adjacent to the polarization layer 300 can cover a portion of the upper surface of the polarization layer 300. The second end portion of the first post-formed bending protective layer 422 adjacent to the pre-formed bending protective layer 410 and opposite to the first end portion can cover a portion of the upper surface of the pre-formed bending protective layer 410. That is, the edge 422a of the first post-formed bending protective layer 422 that contacts the pre-formed bending protective layer 410 can extend in the second direction DR2 and can be positioned on the upper surface of the pre-formed bending protective layer 410.

[0079] The second subsequently formed bending protective layer 424 can be positioned on the first direction DR1 of the pre-formed bending protective layer 410. For example, the second subsequently formed bending protective layer 424 can be spaced apart from the first subsequently formed bending protective layer 422 on the first direction DR1, and the pre-formed bending protective layer 410 is interposed between the first subsequently formed bending protective layer 422 and the second subsequently formed bending protective layer 424. That is, the subsequently formed bending protective layer 420 can expose a portion of the upper surface of the pre-formed bending protective layer 410. According to some embodiments, at least a portion of the second subsequently formed bending protective layer 424 can overlap with the second region 2A. That is, the second subsequently formed bending protective layer 424 can cover a portion of the second region 2A on the upper surface 101 of the display panel 100. Figure 1 As shown, the second subsequently formed bending protective layer 424 can extend in the second direction DR2.

[0080] According to some embodiments, the second subsequently formed bending protective layer 424 can be in direct contact with the pre-formed bending protective layer 410. For example, the first end portion of the second subsequently formed bending protective layer 424 adjacent to the pre-formed bending protective layer 410 can cover a portion of the upper surface of the pre-formed bending protective layer 410. That is, the edge 424a of the second subsequently formed bending protective layer 424 contacting the pre-formed bending protective layer 410 can extend in the second direction DR2 and can be positioned on the upper surface of the pre-formed bending protective layer 410. Figure 1 As shown, the edge 424a of the second subsequently formed bending protective layer 424 may be spaced apart from the edge 422a of the first subsequently formed bending protective layer 422 in the first direction DR1.

[0081] According to some implementation methods, such as Figure 4 As shown, the second end portion of the second subsequently formed bending protective layer 424, which is adjacent to the drive circuit chip 210 and opposite to the first end portion, can be spaced apart from the drive circuit chip 210. That is, the second subsequently formed bending protective layer 424 may not cover the drive circuit chip 210 and the FPCB 220.

[0082] According to some implementation methods, such as Figure 6 As shown, the second end portion of the second subsequently formed bending protective layer 424 can cover at least a portion of the driving circuit chip 210. Additionally, the second end portion of the second subsequently formed bending protective layer 424 can also cover a portion of the FPCB 220. In this case, the second subsequently formed bending protective layer 424 can prevent or reduce separation of the driving circuit chip 210 and / or the FPCB 220 from the display panel 100.

[0083] Each of the first subsequently formed bend protection layer 422 and the second subsequently formed bend protection layer 424 may include a curable material. The curable material may include a photocurable material or a thermocurable material. The first subsequently formed bend protection layer 422 and the second subsequently formed bend protection layer 424 may include substantially the same material.

[0084] According to some embodiments, the first subsequently formed bend protection layer 422 and the second subsequently formed bend protection layer 424 may include materials substantially the same as those of the pre-formed bend protection layer 410. For example, each of the pre-formed bend protection layer 410, the first subsequently formed bend protection layer 422, and the second subsequently formed bend protection layer 424 may include a photocurable material. As another example, each of the pre-formed bend protection layer 410, the first subsequently formed bend protection layer 422, and the second subsequently formed bend protection layer 424 may include a thermocurable material.

[0085] According to some embodiments, the first subsequently formed bend protection layer 422 and the second subsequently formed bend protection layer 424 may include materials different from those of the pre-formed bend protection layer 410. For example, the pre-formed bend protection layer 410 may include a photocurable material, while the first subsequently formed bend protection layer 422 and the second subsequently formed bend protection layer 424 may include a thermocurable material. According to some embodiments, the pre-formed bend protection layer 410 may include a thermocurable material, while the first subsequently formed bend protection layer 422 and the second subsequently formed bend protection layer 424 may include a photocurable material. As another example, the pre-formed bend protection layer 410 may include a material containing both photocurable and thermocurable functional groups, while the first subsequently formed bend protection layer 422 and the second subsequently formed bend protection layer 424 may include a photocurable material (or a thermocurable material).

[0086] According to some implementation methods, such as Figure 4 As shown, the average distance D1 between the lower surface 102 of the display panel 100 and the upper surface of the bending protective layer 400 can be smaller than the average distance D2 between the lower surface 102 of the display panel 100 and the upper surface of the polarizing layer 300. That is, the bending protective layer 400 can have a relatively small thickness T. For example, the thickness T of the bending protective layer 400 (e.g., the average thickness of the bending protective layer 400) can be determined based on the bending radius of the display panel 100. For example, to reduce the bending radius of the display panel 100, it may be necessary to form a bending protective layer 400 with a relatively small thickness. In addition, to effectively protect the bending region BA of the display panel 100, it may be necessary to form a bending protective layer 400 with a uniform thickness.

[0087] When a curable material is fully applied to the display panel 100 to form a curable material layer and the curable material layer immediately cures to form a bend protection layer 400, the uniformity of the thickness T of the bend protection layer 400 may be reduced. For example, the curable material layer may have flowability before curing. (See reference later.) Figure 8 In more detail, the first surface tension ST1 caused by the polarizing layer 300 and the second surface tension ST2 caused by the curable material layer itself can act on the curable material layer. Therefore, the portion of the curable material layer near the polarizing layer 300 can be pulled towards the polarizing layer 300 by the first surface tension ST1. Another portion of the curable material layer away from the polarizing layer 300 can be pulled towards the central portion of the curable material layer by the second surface tension ST2. Therefore, before the curable material layer cures, it is formed in the region where the first surface tension ST1 and the second surface tension ST2 overlap (e.g., Figure 8 The thickness of a portion of the first forming region FA1 may decrease. Therefore, the uniformity of the thickness T of the bending protective layer 400 may decrease. For example, as the thickness T of the bending protective layer 400 decreases, the uniformity may further decrease.

[0088] According to some embodiments, a pre-formed bending protective layer 410 spaced apart from the polarization layer 300 in a first direction DR1 can be first formed on the display panel 100. The pre-formed bending protective layer 410 can be formed by applying a curable material to a region spaced apart from the polarization layer 300 in the first direction DR1 (e.g., a region where the first surface tension ST1 and the second surface tension ST2 overlap) to form a curable material layer and then immediately pre-curing the curable material layer. Therefore, the thickness of the curable material layer formed in the region where the first surface tension ST1 and the second surface tension ST2 overlap can be prevented or reduced from being reduced by the first surface tension ST1 and the second surface tension ST2 before the curable material layer is cured. At least a portion of the pre-formed bending protective layer 410 can overlap with the bending region BA. After the pre-formed bending protective layer 410 is formed, a post-formed bending protective layer 420 including a first post-formed bending protective layer 422 and a second post-formed bending protective layer 424 can be formed on both sides of the pre-formed bending protective layer 410. Therefore, even when a bending protective layer 400 with a relatively small thickness T is formed on the display panel 100, the thickness T of the bending protective layer 400 can generally be uniform. Thus, the conductive layer in the bending region BA of the display panel 100 can be effectively protected, and the reliability of the display device 10 can be improved.

[0089] A panel protective layer 520 can be disposed below the display panel 100. The panel protective layer 520 can absorb external impacts from the lower part of the display device 10 to protect the display panel 100.

[0090] According to some embodiments, the panel protective layer 520 may include a first panel protective layer 522 overlapping with the first region 1A and a second panel protective layer 524 overlapping with the second region 2A. The second panel protective layer 524 may be spaced apart from the first panel protective layer 522 in a first direction DR1. Therefore, an opening OP may be formed between the first panel protective layer 522 and the second panel protective layer 524. The opening OP may overlap with the bending region BA. The opening OP may prevent or reduce the panel protective layer 520 from detaching from the lower surface 102 of the display panel 100 due to bending of the display panel 100.

[0091] The cushioning layer 530 may be located below the panel protective layer 520. The cushioning layer 530 may be located below the display panel 100 to reduce external impacts applied to the display panel 100. For example, the cushioning layer 530 may include acrylic resin, polyurethane, thermoplastic polyurethane, latex, polyurethane foam, polystyrene foam, etc. The cushioning layer 530 may be formed as a foam or gel.

[0092] The metal layer 540 can be located below the pad layer 530. The metal layer 540 can support the display panel 100. Furthermore, when the display device 10 is a foldable display device that can be folded or unfolded in the folding area, multiple holes overlapping the folding area can be formed in the metal layer 540. Therefore, even if the display device 10 is repeatedly folded or unfolded, the folding area of ​​the display device 10 will not be damaged.

[0093] According to some embodiments, the adhesive layer may be located between the display panel 100 and the panel protective layer 520, between the panel protective layer 520 and the pad layer 530, and between the pad layer 530 and the metal layer 540.

[0094] According to some embodiments, the padding layer 530 and the metal layer 540 may be located below the first panel protective layer 522. That is, the padding layer 530 and the metal layer 540 may not overlap with the bending region BA. Additionally, the spacer may be located below the metal layer 540. That is, when the display panel 100 is bent, the spacer may be located between the overlapping metal layer 540 and the second panel protective layer 524 (see reference). Figure 5 ).

[0095] According to some embodiments, the filler member 600 may be located in the opening OP formed between the first panel protective layer 522 and the second panel protective layer 524. The filler member 600 may include a photocurable or thermocurable material. The filler member 600 may be cured after the display panel 100 is bent. Therefore, the filler member 600 can prevent or reduce deformation of the display panel 100 by restoring the restoring force to a non-bent state.

[0096] Figure 7 This illustrates the following according to some implementation methods. Figure 1 A cross-sectional view of further detail taken from line II-II'.

[0097] refer to Figure 7 According to some embodiments, the subsequently formed bending protective layer 420 can completely span the pre-formed bending protective layer 410. That is, Figure 4 The first post-formed bending protective layer 422 and the second post-formed bending protective layer 424 shown can be integrally formed. According to some embodiments, the pre-formed bending protective layer 410 can be formed to have a thickness smaller than the target thickness of the bending protective layer 400. Subsequently, the post-formed bending protective layer 420 can be formed to cover the pre-formed bending protective layer 410. The thickness of the portion of the post-formed bending protective layer 420 that overlaps with the pre-formed bending protective layer 410 can be less than the thickness of another portion of the post-formed bending protective layer 420 that does not overlap with the pre-formed bending protective layer 410. Therefore, the thickness of the bending protective layer 400 can generally be uniform.

[0098] Figures 8 to 14 This is a cross-sectional view illustrating a method of manufacturing a display device according to some embodiments. For example, Figures 8 to 14 Manufacturing can be shown Figure 4 and Figure 5 Method for displaying device 10.

[0099] refer to Figure 8 According to some embodiments, a display panel 100 having a first region 1A, a second region 2A, and a curved region BA can be formed. A panel protective layer 520, a pad layer 530, and a metal layer 540 can be formed under the display panel 100, and a driving circuit chip 210, an FPCB 220, and a polarizing layer 300 can be attached to the display panel 100. Subsequently, a curved protective layer 400 can be formed on the display panel 100. According to some embodiments, the driving circuit chip 210 and the FPCB 220 can be attached to the display panel 100 after the curved protective layer 400 is formed.

[0100] A polarizing layer 300 can be formed in a first region 1A on the display panel 100. After forming the polarizing layer 300, a curable material can be used on the display panel 100 to form a bending protective layer 400 in the forming region FA. The forming region FA can be positioned on a first direction DR1 of the polarizing layer 300. The forming region FA can overlap with the bending region BA. The forming region FA can also overlap with a portion of the first region 1A and a portion of the second region 2A.

[0101] According to some embodiments, the forming region FA may include a first forming region FA1, a second forming region FA2, and a third forming region FA3. The first forming region FA1 may be spaced apart from the polarization layer 300 in a first direction DR1. The second forming region FA2 may be positioned between the first forming region FA1 and the polarization layer 300. The third forming region FA3 may be positioned in the first direction DR1 of the first forming region FA1. The third forming region FA3 may be spaced apart from the second forming region FA2, and the first forming region FA1 may be interposed between the second forming region FA2 and the third forming region FA3. The first forming region FA1 may overlap with the curved region BA. The second forming region FA2 may overlap with the first region 1A. The third forming region FA3 may overlap with the second region 2A.

[0102] As described above, according to some embodiments, it may be necessary to form a bending protective layer 400 with a relatively small and uniform thickness. When a curable material is fully applied to the forming region FA on the display panel 100 to form a curable material layer and the curable material layer immediately cures to form the bending protective layer 400, the uniformity of the thickness of the bending protective layer 400 may be reduced. For example, the curable material layer may have fluidity before curing. In addition, a first surface tension ST1 caused by the polarization layer 300 and a second surface tension ST2 caused by the curable material layer itself can act on the curable material layer. Therefore, the portion of the curable material layer near the polarization layer 300 may be pulled towards the polarization layer 300 by the first surface tension ST1. Another portion of the curable material layer away from the polarization layer 300 may be pulled towards the central portion of the curable material layer by the second surface tension ST2. Therefore, the thickness of the portion of the curable material layer formed in the first forming region FA1 where the first surface tension ST1 and the second surface tension ST2 overlap may be reduced before the curable material layer cures. Therefore, the uniformity of the thickness of the bending protective layer 400 may be reduced. For example, as the thickness of the bending protective layer 400 decreases, the uniformity may further decrease.

[0103] Therefore, in order to form a bending protective layer 400 with uniform thickness, a pre-formed bending protective layer 410 can be formed first in the first forming region FA1, and then a first post-formed bending protective layer 422 and a second post-formed bending protective layer 424 can be formed in the second forming region FA2 and the third forming region FA3, respectively.

[0104] refer to Figure 9 and Figure 10 A pre-formed bending protective layer 410 may be formed on the display panel 100 in a first forming region FA1, spaced apart from the polarizing layer 300 in a first direction DR1. At least a portion of the pre-formed bending protective layer 410 may overlap with the bending region BA.

[0105] First, refer to Figure 9 The first curable material layer 410' can be formed by applying a first curable material to the first forming region FA1 on the display panel 100. For example, the first curable material layer 410' can be formed by partially applying the first curable material to the first forming region FA1 on the display panel 100 using a nozzle N. The first curable material may include a photocurable material or a thermocurable material.

[0106] Subsequently, reference Figure 10 A first curable material layer 410' formed in the first forming region FA1 can be pre-cured to form a pre-formed bending protective layer 410. The first curable material layer 410' can be pre-cured by light (e.g., UV) or heat, depending on the type of the first curable material.

[0107] According to some embodiments, the first curable material layer 410' can be pre-cured by light or heat immediately after being formed on the display panel 100 in the first formation region FA1. For example, after forming the first curable material layer 410' by applying the first curable material to the display panel 100 using a nozzle N, the first curable material layer 410' can be pre-cured immediately by applying light or heat to the first curable material layer 410' using a curing device connected to the nozzle N. Therefore, since the time from the formation of the first curable material layer 410' to pre-curing is reduced, the thickness of the pre-formed bending protective layer 410 can be prevented or reduced by the reduction of the thickness by the first surface tension ST1 and the second surface tension ST2.

[0108] refer to Figures 11 to 13 After the pre-formed bending protective layer 410 is formed, a post-formed bending protective layer 420, including a first post-formed bending protective layer 422 and a second post-formed bending protective layer 424, can be formed. The first post-formed bending protective layer 422 and the second post-formed bending protective layer 424 can be formed on the display panel 100 in the second forming region FA2 and the third forming region FA3, respectively.

[0109] The second curable material layer 422' and the third curable material layer 424' can be formed by applying the second curable material to the second forming region FA2 and the third forming region FA3, respectively, on the display panel 100. Subsequently, the second curable material layer 422' and the third curable material layer 424' can be cured to form the first post-formed bending protective layer 422 and the second post-formed bending protective layer 424.

[0110] According to some implementation methods, refer to Figure 11The third curable material layer 424' can be formed before the second curable material layer 422'. For example, the third curable material layer 424' can be formed by partially applying the second curable material to the third forming region FA3 on the display panel 100 using a nozzle N. The second curable material may include a photocurable material or a thermocurable material. According to some embodiments, the second curable material may be the same as the first curable material used to form the first curable material layer 410'. According to some embodiments, the second curable material may be different from the first curable material.

[0111] A third curable material layer 424' can be formed on the pre-formed bending protective layer 410 in the first direction DR1. The third curable material layer 424' can be in direct contact with the pre-formed bending protective layer 410. For example, the third curable material layer 424' can cover a portion of the upper surface of the pre-formed bending protective layer 410.

[0112] Subsequently, reference Figure 12 The second curable material layer 422' can be formed by partially applying the second curable material to the second forming region FA2 on the display panel 100 using a nozzle N.

[0113] A second curable material layer 422' may be formed between the polarizing layer 300 and the pre-formed bendable protective layer 410. The second curable material layer 422' may be in direct contact with each of the polarizing layer 300 and the pre-formed bendable protective layer 410. For example, a first end portion of the second curable material layer 422' adjacent to the polarizing layer 300 may be in direct contact with a sidewall of the polarizing layer 300. Although not shown, the first end portion of the second curable material layer 422' adjacent to the polarizing layer 300 may cover a portion of the upper surface of the polarizing layer 300. A second end portion of the second curable material layer 422' adjacent to the pre-formed bendable protective layer 410 and opposite to the first end portion may cover a portion of the upper surface of the pre-formed bendable protective layer 410.

[0114] Each of the second curable material layer 422' and the third curable material layer 424' may extend in the second direction DR2. According to some embodiments, the second curable material layer 422' may be spaced apart from the third curable material layer 424', and a pre-formed bend protection layer 410 may be interposed between the second curable material layer 422' and the third curable material layer 424'. That is, the second curable material layer 422' and the third curable material layer 424' may expose a portion of the upper surface of the pre-formed bend protection layer 410.

[0115] Subsequently, reference Figure 13The second curable material layer 422' and the third curable material layer 424' can be cured to form a post-formed bend protection layer 420 including a first post-formed bend protection layer 422 and a second post-formed bend protection layer 424. The second curable material layer 422' and the third curable material layer 424' can be cured by light or heat, depending on the type of the second curable material.

[0116] According to some embodiments, when the second curable material layer 422' is formed later than the third curable material layer 424', the time from the formation of the second curable material layer 422' to its curing can be reduced. Therefore, the second curable material layer 422' can be pulled less towards the polarizing layer 300 by the first surface tension ST1. Thus, the difference in thickness of the first subsequently formed bending protective layer 422 can be minimized or reduced.

[0117] According to some embodiments, a pre-cured, pre-formed bend protection layer 410 can be additionally cured during the curing of the second curable material layer 422' and the third curable material layer 424'. For example, when both the first and second curable materials comprise photocurable materials, the pre-cured, pre-formed bend protection layer 410 can be additionally cured by light during the curing of the second and third curable material layers 422' and 424'. As another example, when the first curable material comprises photocurable and thermocurable functional groups and the second curable material comprises a photocurable material, the pre-cured, pre-formed bend protection layer 410 can be additionally cured by light during the curing of the second and third curable material layers 422' and 424'. In this case, the first curable material layer 410' can be pre-cured by heat and additionally cured by light. However, this is merely an example, and embodiments according to this disclosure are not limited thereto.

[0118] refer to Figure 14 The display panel 100 is bendable. The bending region BA of the display panel 100 can be bent along a bending axis extending in the second direction DR2. When the display panel 100 is bent, the bending protective layer 400 covering the bending region BA on the display panel 100 can be bent together.

[0119] The filler member 600 may be formed in the opening OP of the plate protective layer 520 located below the surface display panel 100, which overlaps with the bending region BA. According to some embodiments, the filler member 600 may be formed before the display panel 100 is bent and may be cured after the display panel 100 is bent. According to some embodiments, the filler member 600 may be injected into the opening OP after the display panel 100 is bent and then cured.

[0120] According to some embodiments, a pre-formed bending protective layer 410 can be first formed on the display panel 100 in a first forming region FA1 spaced apart from the polarizing layer 300 along a first direction DR1. The pre-formed bending protective layer 410 can be formed by applying a first curable material to the first forming region FA1 to form a first curable material layer 410' and then immediately pre-curing the first curable material layer 410'. Therefore, the thickness of the first curable material layer 410' formed in the first forming region FA1, where a first surface tension ST1 and a second surface tension ST2 overlap, can be prevented or reduced by the reduction in thickness due to the first surface tension ST1 and the second surface tension ST2 before the first curable material layer 410' is cured. At least a portion of the pre-formed bending protective layer 410 can overlap with the bending region BA. After forming the pre-formed bending protective layer 410, a post-formed bending protective layer 420, including a first post-formed bending protective layer 422 and a second post-formed bending protective layer 424, can be formed on both sides of the pre-formed bending protective layer 410. Therefore, even when a relatively thin bending protective layer 400 is formed on the display panel 100, the thickness of the bending protective layer 400 can generally be uniform. Thus, the conductive layer in the bending region BA of the display panel 100 can be effectively protected, and the reliability of the display device 10 can be improved.

[0121] Figure 15 This is a cross-sectional view showing a display device according to some embodiments.

[0122] refer to Figure 15 According to some embodiments, the display device 10 may also include a cover glass 700 and a shelf 800.

[0123] The cover glass 700 can be disposed on the polarizing layer 300. The cover glass 700 can be attached to the polarizing layer 300 by an adhesive layer 514. The cover glass 700 can protect the display panel 100 from external impurities, impacts, etc. The cover glass 700 can include transparent glass, transparent plastic, etc.

[0124] The mounting bracket 800 can accommodate the display panel 100, polarizing layer 300, etc. The mounting bracket 800 can protect the display panel 100 from external impurities, impacts, etc. According to some embodiments, the inner sidewall of the mounting bracket 800 can have a shape corresponding to the curved display panel 100 and the curved protective layer 400. The inner sidewall of the mounting bracket 800 can be spaced apart from adjacent curved protective layers 400 while maintaining a predetermined gap G. According to some embodiments, as the thickness T of the curved protective layer 400 decreases, the gap G between the mounting bracket 800 and the curved protective layer 400 can be increased. Therefore, the reliability of the display device 10 can be improved.

[0125] Figure 16 This is a block diagram illustrating an electronic device according to some embodiments. Figure 17 It shows that Figure 16 The diagram illustrates an example of an electronic device implemented as a television. Figure 18 It shows that Figure 16 A diagram illustrating an example of an electronic device implemented as a smartphone.

[0126] refer to Figures 16 to 18 According to some embodiments, the electronic device DD may include a processor 910, a memory device 920, a storage device 930, an input / output (I / O) device 940, a power supply 950, and a display device 960. Here, the display device 960 may be related to the reference... Figures 1 to 8 The described display device 10 corresponds to this. The electronic device DD may also include multiple ports for communication with video cards, sound cards, memory cards, Universal Serial Bus (USB) devices, etc. For example... Figure 17 As shown, according to some embodiments, the electronic device DD can be implemented as a television. For example... Figure 18 As shown, according to some embodiments, the electronic device DD can be implemented as a smartphone. However, the embodiments according to this disclosure are not limited to this, and according to some embodiments, the electronic device DD can be implemented as a portable phone, video phone, smart board, smartwatch, tablet PC, car navigation system, computer monitor, laptop computer, head-mounted display (HMD), etc.

[0127] Processor 910 can perform various computing functions. According to some embodiments, processor 910 can be a microprocessor, central processing unit (CPU), application processor (AP), etc. Processor 910 can be connected to other components via address bus, control bus, data bus, etc. According to some embodiments, processor 910 can be connected to an expansion bus such as a peripheral component interconnect (PCI) bus.

[0128] The memory device 920 can store data for the operation of the electronic device DD. According to some embodiments, the memory device 920 may include at least one non-volatile memory device (such as an erasable programmable read-only memory (EPROM) device, an electrically erasable programmable read-only memory (EEPROM) device, a flash memory device, a phase-change random access memory (PRAM) device, a resistive random access memory (RRAM) device, a nano-floating gate memory (NFGM) device, a polymer random access memory (PoRAM) device, a magnetic random access memory (MRAM) device, a ferroelectric random access memory (FRAM) device, etc.) and / or at least one volatile memory device (such as a dynamic random access memory (DRAM) device, a static random access memory (SRAM) device, a mobile DRAM device, etc.).

[0129] According to some embodiments, storage device 930 may include solid-state drive (SSD) devices, hard disk drive (HDD) devices, CD-ROM devices, etc. According to some embodiments, I / O device 940 may include input devices such as keyboards, keypads, mice, touchpads, touchscreens, etc., and output devices such as printers, speakers, etc.

[0130] Power supply 950 can provide power for the operation of electronic device DD. Display device 960 can be connected to other components via a bus or other communication link. According to some embodiments, display device 960 may be included in I / O device 940.

[0131] Although specific embodiments and implementations have been described herein, other embodiments and modifications will be apparent from that description. Therefore, the inventive concept is not limited to these embodiments, but rather to the broader scope of the appended claims and their equivalents, and various apparent modifications and equivalent arrangements are included within the scope of embodiments according to this disclosure.

Claims

1. A display device, including: The display panel has a first region, a second region spaced apart from the first region in a first direction, and a curved region between the first region and the second region; A polarizing layer on the display panel in the first region; as well as A curved protective layer is provided on the display panel and includes: A pre-formed curved protective layer is spaced apart from the polarizing layer in the first direction; A first, subsequently formed bending protective layer is positioned between the polarizing layer and the pre-formed bending protective layer; and The second subsequently formed bending protective layer is spaced apart from the first subsequently formed bending protective layer, and the pre-formed bending protective layer is inserted between the first subsequently formed bending protective layer and the second subsequently formed bending protective layer, wherein the second subsequently formed bending protective layer contacts the upper surface of the pre-formed bending protective layer.

2. The display device according to claim 1, wherein, At least a portion of the pre-formed bending protective layer overlaps with the bending region.

3. The display device according to claim 1, wherein, At least a portion of the first subsequently formed bending protective layer overlaps with the first region, and In this case, at least a portion of the second subsequently formed bending protective layer overlaps with the second region.

4. The display device according to claim 1, wherein, The first subsequently formed bending protective layer is in direct contact with the polarizing layer and the pre-formed bending protective layer, and The second subsequently formed bending protective layer is in direct contact with the pre-formed bending protective layer.

5. The display device according to claim 1, wherein, The pre-formed bend protection layer, the first post-formed bend protection layer, and the second post-formed bend protection layer all comprise the same material.

6. The display device according to claim 1, wherein, The average distance between the lower surface of the display panel and the upper surface of the bending protective layer is less than the average distance between the lower surface of the display panel and the upper surface of the polarization layer.

7. The display device according to claim 1, wherein, The pre-formed curved protective layer extends in a second direction intersecting the first direction.

8. The display device according to claim 7, wherein, The edge of the first subsequently formed curved protective layer that contacts the pre-formed curved protective layer extends in the second direction, and Wherein, the edge of the second subsequently formed bending protective layer that contacts the pre-formed bending protective layer extends in the second direction and is spaced apart from the edge of the first subsequently formed bending protective layer in the first direction.

9. A method for manufacturing a display device, comprising: A display panel is formed, the display panel having a first region, a second region spaced apart from the first region in a first direction, and a curved region between the first region and the second region; A polarization layer is formed in the first region on the display panel; A pre-formed curved protective layer is formed on the display panel, wherein the pre-formed curved protective layer is spaced apart from the polarizing layer in the first direction; and A post-formed bending protective layer is formed on the display panel, wherein the post-formed bending protective layer includes a first post-formed bending protective layer between the polarizing layer and the pre-formed bending protective layer and a second post-formed bending protective layer spaced apart from the first post-formed bending protective layer, wherein the pre-formed bending protective layer is inserted between the first post-formed bending protective layer and the second post-formed bending protective layer, wherein the second post-formed bending protective layer contacts the upper surface of the pre-formed bending protective layer.

10. The method according to claim 9, wherein, The formation of the pre-formed bend protective layer includes: A first curable material layer is formed on the display panel by applying a first curable material to a first forming region spaced apart from the polarization layer in the first direction; and The pre-formed bend protection layer is formed by pre-curing the first curable material layer.

11. The method according to claim 10, wherein, The formation of the subsequently formed bend protective layer includes: A second curable material layer and a third curable material layer are formed on the display panel by applying a second curable material to a second forming region between the polarizing layer and the first forming region and to a third forming region adjacent to the first forming region in the first direction; and The first post-formed flexural protective layer and the second post-formed flexural protective layer are formed by curing the second curable material layer and the third curable material layer.

12. The method according to claim 11, wherein, The third curable material layer is formed before the second curable material layer.

13. The method according to claim 11, wherein, The second curable material is the same as the first curable material.

14. The method according to claim 11, wherein, The third curable material layer is spaced apart from the second curable material layer, and the pre-formed bending protective layer is inserted between the second curable material layer and the third curable material layer.

15. The method according to claim 9, wherein, At least a portion of the pre-formed bending protective layer overlaps with the bending region.

16. The method according to claim 9, wherein, At least a portion of the first subsequently formed bending protective layer overlaps with the first region, and In this case, at least a portion of the second subsequently formed bending protective layer overlaps with the second region.

17. The method according to claim 9, wherein, The first subsequently formed bending protective layer is in direct contact with the polarizing layer and the pre-formed bending protective layer, and The second subsequently formed bending protective layer is in direct contact with the pre-formed bending protective layer.

18. The method according to claim 9, wherein, The average distance between the lower surface of the display panel and the upper surface of the bending protective layer, which includes the pre-formed bending protective layer and the post-formed bending protective layer, is less than the average distance between the lower surface of the display panel and the upper surface of the polarization layer.

19. The method according to claim 9, wherein, The pre-formed curved protective layer extends in a second direction intersecting the first direction.

20. The method according to claim 19, wherein, The edge of the first subsequently formed curved protective layer that contacts the pre-formed curved protective layer extends in the second direction, and Wherein, the edge of the second subsequently formed bending protective layer that contacts the pre-formed bending protective layer extends in the second direction and is spaced apart from the edge of the first subsequently formed bending protective layer in the first direction.

Citation Information

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