Polishing device of processing equipment

Abstract

This invention proposes a polishing device for a processing equipment. The polishing device includes a base and polishing components. It can be integrated with a grinding device, a turning device, and a leveling device on a single production line, enabling high-precision processing, polishing, and leveling of target objects such as raised floors on a single production line, thereby accelerating production time and improving production efficiency.

Description

Technical Field

[0001] This invention relates to a mechanical device, and more particularly to a polishing apparatus for processing raised floors. Background Technology

[0002] Raised floor systems are now widely used in anti-static computer rooms or cleanrooms. Existing aluminum alloy die-cast raised floors undergo five main processes: mold opening, aluminum melting, die casting, forming, and trimming. During the forming process, the surface and bottom of the raised floor often have burrs. These imperfections prevent the raised floor panels from fitting tightly together or to the platform frame during installation. They also hinder installation by workers and pose certain safety risks.

[0003] Existing technologies mainly rely on manual methods to perform micro-processing on the various surfaces of the formed raised floor. Therefore, workers need to transport the raised floors in batches to the corresponding processing areas for processing. This not only results in a discontinuous production process and low production efficiency, but also wastes a lot of manpower and time and effort in each processing.

[0004] Therefore, overcoming the various shortcomings of the existing technologies has become a pressing problem for the industry. Summary of the Invention

[0005] In view of the deficiencies of the prior art, the present invention provides a polishing device for processing equipment, which can speed up the production process and improve production efficiency.

[0006] The polishing apparatus of the processing equipment of the present invention includes: a base for conveying an elevated floor as a target object, wherein the target object has opposing first and second surfaces, the first surface serving as a floor surface, and the second surface having a plurality of frames of different heights and feet provided at the corners of the second surface; and a polishing assembly disposed on the base for polishing the first surface of the target object as the target object passes through the polishing assembly.

[0007] In the aforementioned polishing device, the base has a cover for covering the polishing component and a support frame for mounting the cover to facilitate the transport of the target object, so that the polishing component is positioned above the target object, and the top of the cover is provided with a discharge end that communicates with the internal space of the cover to discharge impurities or foreign objects generated by the polishing component and the target object after polishing.

[0008] The aforementioned polishing device also includes a positioning component mounted on the base, which limits the target object so that the polishing component polishes the first surface of the target object. The positioning component supports a rotating rod in an adjustable height via two bases so that when the target object moves to the bottom of the rotating rod during the polishing operation, the rotating rod presses down on the target object and restricts the vertical displacement space of the target's end side.

[0009] In the aforementioned polishing apparatus, the polishing assembly includes a polishing tool, a support structure mounted on the base, and a movably mounted bracket on the support structure to hold the polishing tool, allowing the bracket to move the polishing tool to the desired position. For example, slide rails are arranged on opposite sides of the support structure, and the bracket is provided with at least one slider engaging the slide rails, allowing the slider on the bracket to slide in coordination with the slide rails, thus moving the polishing tool linearly up and down to the desired processing position. Furthermore, the bracket can be raised and lowered relative to the support structure by an adjustment assembly. For example, the adjustment assembly uses a driver to move a linkage rod to displace a fixed frame used to support the bracket, so that when the driver rotates the linkage rod via a reducer, the linkage rod drives the fixed frame and the bracket to rise and fall together, displacing the polishing tool to the desired height position.

[0010] Alternatively, the polishing tool may be in the form of a grinding wheel, having a main shaft assembly and a plurality of sandpapers arranged in a wheel-like pattern around the main shaft assembly. For example, a rotating shaft is internally connected to the main shaft assembly, and bearings are respectively engaged at both ends of the rotating shaft to allow the rotating shaft to rotate relative to the bearings, with the ends of the bearings fixed to the frame. Furthermore, one end of the rotating shaft extends out of the bearing and is connected to a motor, so that the motor drives the rotating shaft to rotate, causing the rotating sandpapers to contact and flip over a moving target object, allowing the abrasive surface of the sandpapers to rub against the target object and smooth out any unevenness on the first surface of the target object.

[0011] As can be seen from the above, the polishing device of the present invention mainly integrates it with the grinding device, the turning device and the leveling device on a production line, so that the first and second surfaces of the raised floor can be processed on a single production line, thereby speeding up the production process and improving production efficiency, while reducing the need for manpower.

[0012] Furthermore, by designing the polishing tool as a grinding wheel, after the target object passes through the positioning component, the rotating sandpaper will contact the moving target object and flip it over, causing the abrasive surface of the sandpaper to rub against the target object and smooth out the uneven parts of the first surface of the target object, thereby achieving the purpose of polishing. Therefore, it can avoid the problem of excessive removal of part of the first surface of the target object, which would cause dents. Attached Figure Description

[0013] Figure 1This is a front perspective perspective view of the polishing apparatus of the present invention configured on a processing device.

[0014] Figure 1A This is a perspective view of a target object to be processed by a processing device equipped with the polishing apparatus of the present invention.

[0015] Figure 1B for Figure 1A A three-dimensional diagram from another perspective.

[0016] Figure 1C for Figure 1A A side view diagram.

[0017] Figure 2A for Figure 1 A three-dimensional schematic diagram of the grinding device.

[0018] Figure 2B for Figure 2A A partial 3D schematic diagram.

[0019] Figure 2C for Figure 2A A three-dimensional schematic diagram of the grinding components.

[0020] Figure 2D for Figure 2C A schematic diagram of its breakdown.

[0021] Figure 2E for Figure 2D A three-dimensional schematic diagram of the grinding tool.

[0022] Figure 3A This is a perspective view of the polishing apparatus and its related configuration of the present invention.

[0023] Figure 3B for Figure 3A A schematic diagram of its breakdown.

[0024] Figure 3C for Figure 3B An exploded three-dimensional diagram of the polishing components.

[0025] Figure 4A for Figure 1 A three-dimensional schematic diagram of the flipping device and its surrounding configuration.

[0026] Figure 4B for Figure 1 A three-dimensional schematic diagram of the flipping device.

[0027] Figure 5A for Figure 1 A three-dimensional schematic diagram of the leveling device and its surrounding configuration.

[0028] Figure 5B for Figure 5AA partial three-dimensional exploded diagram.

[0029] The attached figures are labeled as follows:

[0030] 1: Processing equipment

[0031] 1a: Transport device

[0032] 1b: Human-machine interface

[0033] 1c: Control unit

[0034] 10, 10a, 10b, 10c: Conveying components

[0035] 100: Refining Structure

[0036] 100a, 101: Conveyor belt

[0037] 100b: Roller

[0038] 100c: Motor

[0039] 11,11c: Support components

[0040] 2: Grinding device

[0041] 2a: Grinding assembly

[0042] 20: Grinding tools

[0043] 20b: Passive axis

[0044] 200: Grinding wheel

[0045] 201: Rotation axis

[0046] 202: Gearbox

[0047] 21: First Abutment

[0048] 22: Positioning component

[0049] 22a: Stop lever

[0050] 23: First Support Structure

[0051] 23a: Seat

[0052] 230: Screw

[0053] 24: Bearing components

[0054] 240: Panel rack

[0055] 25: Sensors

[0056] 26: Guiding Structure

[0057] 260: Slide rail

[0058] 261: Slide

[0059] 27: Driver Group

[0060] 28: Power Unit

[0061] 29: Gear Set

[0062] 3: Polishing device

[0063] 3a: Polishing components

[0064] 30: Polishing tools

[0065] 30a: Main rod assembly

[0066] 300: Sandpaper

[0067] 302: Spindle

[0068] 303: Bearing

[0069] 304: Shaft

[0070] 31: Second Abutment

[0071] 31a: Cover

[0072] 31b: Support frame

[0073] 32: Positioning component

[0074] 320: base body

[0075] 321: Rotating member

[0076] 33: Second support structure

[0077] 330: Slide rail

[0078] 34: Stand

[0079] 340: Slider

[0080] 35: Adjust components

[0081] 350: Drive

[0082] 351: Fixture

[0083] 351a: Fixing plate

[0084] 352: Linkage rod

[0085] 353: Gearbox

[0086] 36: Motor

[0087] 37: Discharge end

[0088] 4: Tilting device

[0089] 40: Shaft structure

[0090] 401: Shaft

[0091] 402: Connector

[0092] 403: Bearing

[0093] 41: Third Abutment

[0094] 42: Flip-over part

[0095] 43: Third Support Structure

[0096] 44: Support Structure

[0097] 45: Adjust the structure

[0098] 47: Drive components

[0099] 470: rack and pinion

[0100] 471: Gear

[0101] 48: Power Unit

[0102] 480: Push-pull rod

[0103] 5: Leveling device

[0104] 50: Leveling parts

[0105] 50a: Pressing surface

[0106] 51: Fourth Abutment

[0107] 51a: First base

[0108] 51b: Second base

[0109] 51c: Top mount

[0110] 51d: Pads

[0111] 510: Pillar

[0112] 52: Work Platform

[0113] 53: Fourth Support Structure

[0114] 58: Power Unit

[0115] 580: Pressure Column

[0116] 9: Target object

[0117] 9a: First surface

[0118] 9b: Second surface

[0119] 9c: Side view

[0120] 9d: End face

[0121] 90:foot base

[0122] 900: Opening

[0123] 91: Flange

[0124] 92, 93: Skeleton

[0125] h: Height difference

[0126] X, Y, Z: Arrow direction Detailed Implementation

[0127] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0128] It should be understood that the structures, proportions, sizes, etc., shown in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and to facilitate understanding and reading of the invention. They are not intended to limit the scope of the invention and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and objectives of the invention, should still fall within the scope of the disclosed technical content. Furthermore, terms such as "upper," "lower," "front," "rear," "left," "right," "first," "second," "third," "fourth," and "a" used in this specification are merely for clarity and not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention.

[0129] Figure 1 This is a perspective view of the polishing apparatus 3 of the present invention disposed on a processing device 1. Figure 1 As shown, the processing equipment 1 includes: a transport device 1a, a grinding device 2, a polishing device 3, a flipping device 4, and a leveling device 5.

[0130] In this embodiment, the processing equipment 1 defines the direction of the production line as left and right (e.g., arrow Y), the direction perpendicular to the production line as front and back (e.g., arrow X), and the direction along the height of the processing equipment 1 as up and down (e.g., arrow Z). It should be understood that this orientation is used to illustrate the configuration of this embodiment and is not particularly limiting.

[0131] In addition, the processing equipment 1 can input processing values ​​via a human-machine interface 1b using a programmable logic controller (PLC) to control the processing operation.

[0132] The transport device 1a is used to transport the target object 9 to the processing position of the required production line. Therefore, the transport device 1a is configured to correspond to the grinding device 2, polishing device 3, flipping device 4 and leveling device 5 so that the target object 9 passes over the grinding device 2, polishing device 3, flipping device 4 and leveling device 5.

[0133] Please also refer to Figure 2A In this embodiment, the transport device 1a uses a conveyor belt to transport the target object 9. The transport device 1a includes a support assembly 11 and a conveying assembly 10 disposed on the support assembly 11, allowing the conveying assembly 10 to displace the target object 9 so that the target object 9 can reach each processing area. For example, the support assembly 11 is a leg structure erected on a base surface (such as a floor), and the conveying assembly 10 has at least one chain structure 100 and / or a long, straight conveyor belt 101. Therefore, when the target object 9 is placed on the chain structure 100 or the conveyor belt 101, the target object 9 can stably move along the chain structure 100 or the conveyor belt 101. It should be understood that there are many different configurations of conveying methods for production lines, such as... Figure 3A and Figure 4A The roller assembly shown, such as Figure 5A The chain-making components shown or other suitable methods are not limited to those described above.

[0134] Furthermore, target object 9 is an elevated floor, such as Figure 1A , Figure 1B and Figure 1C As shown, it has a first surface 9a (such as a floor surface) and a second surface 9b (such as a bottom end) and a side surface 9c adjacent to the first surface 9a and the second surface 9b. For example, the target object 9 is generally rectangular (such as a square plate). The bottom of the target object 9 (such as the side of the second surface 9b, which is the bottom of the raised floor) has skeletons 92, 93 of different heights to form a honeycomb shape, and feet 90 are formed at the four corners of the second surface 9b of the target object 9. Openings 900 are provided at the four feet 90 as needed for screws to fix the four feet 90 to the support frame for the raised floor. Specifically, the end face 9d of the foot 90 protrudes slightly (such as... Figure 1C The height difference h shown indicates the second surface 9b of the target object 9, and a flange 91 protruding from the side 9c is formed at the edge of the first surface 9a. In this embodiment, the target object 9 is a raised floor, so it will be referred to as a raised floor below.

[0135] The grinding device 2 is located at the very beginning of the processing flow of the entire production line. It is used to process the second surface 9b of the target object 9 and to grind the end faces 9d of the frame 92, 93 and the four feet 90 of the raised floor, so as to process the different height dimensions required by each frame 92, 93 and the same height dimension required by the four feet 90.

[0136] In this embodiment, as Figure 2A As shown, the grinding device 2 includes at least one (e.g., three sets) grinding assembly 2a, a first base 21 for configuring the grinding assembly 2a, and a plurality of positioning members 22 disposed on the first base 21. The grinding assembly 2a is configured to align with the positioning member 22 and rise and fall relative to the positioning member 22 to stably grind the target object 9 (raised floor). After the grinding of the target object 9 is completed, the positioning member 22 releases the target object 9, allowing the conveying assembly 10 to remove the target object 9. For example, the first base 21 is a frame structure, and the positioning member 22 has a pull-out stop bar 22a. Figure 2B As shown, it is positioned above the conveyor belt 101 so that, during use, the stop bar 22a can be lowered to position the raised floor at a predetermined position on the first base 21 (i.e., below the grinding assembly 2a). During the grinding operation, it restricts the displacement of the raised floor to prevent it from deviating from the positioning member 22. Therefore, after the grinding operation is completed, the stop bar 22a can be pulled up, allowing the conveyor assembly 10 to move the target object 9. Preferably, at least one sensor 25 can be arranged around the positioning member 22, which can be mounted on the first base 21 or the transport device 1a, to control the timing of lowering the stop bar 22a. Thus, when the sensor 25 senses the target object 9, the stop bar 22a can be lowered. It should be understood that there are many ways to control the positioning member 22, and it is not limited to sensing methods.

[0137] In addition, such as Figure 2C and Figure 2D As shown, each grinding assembly 2a includes multiple grinding tools 20, a support member 24 for mounting the multiple grinding tools 20, and multiple first support structures 23 mounted on the first base 21 and supporting the support member 24 in a displaceable manner. Each grinding assembly 2a has two independent first support structures 23 and one independent support member 24, such that the two first support structures 23 are respectively erected parallel to each other on opposite sides of the support member 24, allowing the multiple grinding tools 20 on the support member 24 to be simultaneously driven by the same power unit 28. Figure 2AAs shown, the skeletons 92, 93 and the feet 90 of the target object 9 are rapidly processed to the required height. For example, the support member 24 is a rectangular frame with multiple plates 240 for arranging multiple grinding tools 20, which are actuated by the power unit 28. Specifically, the power unit 28 is a motor located on top of the first base 21, which actuates a gear set 29 (such as...). Figure 2A The gear set 29 has a housing shell (shown) that drives multiple grinding tools 20 to rotate. The housing shell of the gear set 29 contains multiple synchronously rotating gears (not shown), which drive the grinding tools 20 to rotate via a flexible tube (not shown).

[0138] In addition, such as Figure 2C and Figure 2D As shown, the first support structure 23 has a base 23a on which a rotatable screw 230 and a nut (not shown) screwed to the screw 230 are disposed. The screw 230 drives the nut to move up and down by rotating a drive assembly 27, which is like a motor. Since the nut is fixed to the carrier 24, the screw 230 can drive the carrier 24 to rise and fall (as shown by arrow Z) and displace the grinding tool 20 to the required height position. For example, the carrier 24 can be displaced by a guide structure 26, which includes a slide rail 260 and a slide block 261. The slide rail 260 is fixed to opposite sides of a surface of the first support structure 23, and the slide block 261 is fixed to the carrier 24. When the screw 230 rotates and drives the nut to rise and fall, the guide structure 26 can drive the carrier 24 and the grinding tool 20 on it to move linearly along the slide rail 260 in the up and down direction (such as the direction of arrow Z) to the height position required for grinding the skeleton 92, 93 and the foot 90.

[0139] In addition, the grinding wheel 200 on the grinding tool 20 has multiple sandpapers, such as Figure 2EAs shown, the grinding tools 20 are arranged in a wheel shape along the axis of rotation. The grinding tool 20 is connected to a driven shaft 20b via a gearbox 202. The grinding tool 20 drives the driven shaft 20b to rotate via the gear set 29. The driven shaft 20b drives the gear structure of the gearbox 202 to rotate the rotating shaft 201, thereby driving multiple sandpapers to rotate. Therefore, when the grinding tool 20 rotates, the sandpaper of the grinding wheel 200 will come into contact with the stationary target object 9 and flip over, so that the sandpaper surface slides over the target object 9 and lightly grinds the skeletons 92, 93 and the feet 90 of the target object 9. For example, since the heights of the skeleton 92, 93 and the foot 90 of the target object 9 are different, multiple sets of grinding components 2a can be configured to grind the skeleton 92, 93 and the foot 90 at different heights. That is, a single grinding component 2a only grinds a single height. Therefore, in this embodiment, the second surface 9b of the target object 9 has three heights, so three sets of grinding components 2a can be configured.

[0140] The polishing apparatus 3 of the present invention operates in conjunction with the transport device 1a to process the first surface 9a (i.e., the floor surface) of the target object 9, and as follows: Figure 3A , Figure 3B and Figure 3C As shown, the polishing device 3 includes at least one (e.g., two sets) polishing component 3a, a second base 31 for configuring the polishing component 3a, and a plurality of (e.g., three) positioning components 32 disposed on the second base 31.

[0141] The second base 31 has a cover 31a for covering the polishing component 3a and a support frame 31b for supporting the cover 31a, so as to cooperate with the transport device 1a and place the polishing component 3a on the transport device 1a. A plurality of positioning components 32 are respectively provided on the left and right sides of the cover 31a (as shown by the arrow Y) and inside the cover 31a.

[0142] In this embodiment, the transport device 1a uses a roller assembly (long-range type) as the transport assembly 10a, so that the motor 100c drives multiple rollers 100b to rotate a conveyor belt 100a, and the friction of the conveyor belt 100a is used to stably grip the target object 9, thereby effectively preventing the target object 9 from shifting during the polishing process.

[0143] The positioning component 32 includes a plurality of seats 320 disposed on the second base 31 and at least one rotating rod 321 spanning the seats 320.

[0144] In this embodiment, the two ends of a single rotating rod 321 are mounted between two seats 320 in an adjustable height manner. During the polishing process of the target object 9, when the target object 9 moves to the bottom of the rotating rod 321, the rotating rod 321 presses the target object 9 and restricts the vertical displacement space of the end side of the target object 9, thus preventing the target object 9 from shaking up and down.

[0145] The polishing assembly 3a is located between the two positioning assemblies 32. It includes a polishing tool 30, a second support structure 33 disposed on the second base 31, and a bracket 34 disposed on the second support structure 33 to support the polishing tool 30. The bracket 34 is movably disposed on the second support structure 33 to move the polishing tool 30 vertically to the desired position.

[0146] In this embodiment, a combination of guide rail and slide block is adopted. A slotted slide rail 330 is arranged on the second support structure 33, and at least one slider 340 engaging the slide rail 330 is provided on the frame 34. The slide rail 330 is fixed on the surfaces of opposite sides of the second support structure 33, so that the slider 340 on the frame 34 slides in coordination with the track 330, so that the polishing tool 30 moves up and down a short distance in a straight line to the required processing position.

[0147] Furthermore, the stand 34 can be raised and lowered relative to the second support structure 33 by means of an adjustment component 35 (moving up and down in the direction of arrow Z). For example, the adjustment component 35 uses a driver 350, such as a motor, to drive a connecting rod 352, such as a lifting screw, to displace a fixed frame 351 used to support the stand 34. Specifically, a fixed plate 351a is fixed to the fixed frame 351, and a nut (not shown) or internal thread (not shown) is provided on the fixed plate 351a so that when the driver 350 rotates the connecting rod 352 via a reducer 353, the connecting rod 352 drives the nut on the fixed plate 351a to move up and down, so that the connecting rod 352 can drive the fixed frame 351 and the stand 34 to rise and fall together (as in the direction of arrow Z), and displace the polishing tool 30 to the desired height position.

[0148] The polishing tool 30 is in the form of a grinding wheel, which has a main rod assembly 30a and multiple sandpapers 300, such as Figure 3C As shown, the multiple sandpapers 300 are arranged in a wheel shape around the frame 34.

[0149] In this embodiment, the main shaft assembly 30a includes a main shaft 302 on which the plurality of sandpapers 300 are disposed. A rotating shaft 304 is connected through the central position of the main shaft 302, and a bearing 303 is engaged at both ends of the rotating shaft 304 so that the rotating shaft 304 can rotate relative to the bearing 303. For example, the end housing of the bearing 303 is fixed to the bracket 34, and one end of the rotating shaft 304 extends out of the bearing 303 and is connected to a motor 36 so that the motor 36 drives the rotating shaft 304 to rotate the main shaft 302.

[0150] Therefore, after the roller assembly moves the target object 9 past the rotating rod 321, the rotating sandpaper 300 will contact the moving target object 9 and flip it over, so that the sanding surface of the sandpaper 300 will rub against the target object 9 and flatten the non-flat part of the first surface 9a of the target object 9, so as to achieve the purpose of micro-processing (or polishing).

[0151] Preferably, the top of the cover 31a may be provided with a discharge end 37 communicating with the internal space of the cover 31a, so as to discharge impurities or foreign objects (such as sand dust) generated after the sandpaper 300 rubs against the target object 9, such as by suction.

[0152] The flipping device 4 works in conjunction with the transport device 1a to flip the first surface 9a or the second surface 9b of the target object 9, for example, flipping the polished raised floor so that its first surface 9a faces upward.

[0153] In this embodiment, as Figure 4A and Figure 4B As shown, the flipping device 4 includes a third base 41, a shaft structure 40 disposed on the third base 41, a flipping member 42 disposed on the third base 41, and a third support structure 43 connected to the flipping member 42. One end of the flipping member 42 is pivotally connected to the shaft structure 40 disposed on the third base 41 to flip relative to the third base 41, so that the third support structure 43 is flipped under force and positioned above the conveyor belt 100a of the conveying assembly 10a of the polishing device 3. For example, the conveying device 1a uses another roller assembly (short-range type) as the conveying assembly 10c, and its support assembly 11c is a seat-shaped body disposed on the third base 41 to transfer the target object 9 from the conveying assembly 10 of the grinding device 2 to the conveying assembly 10c of the flipping device 4.

[0154] Furthermore, the flipping component 42 is a horseshoe-shaped or U-shaped plate, and at least one third support structure 43 can be configured on its opposite sides as needed to act as floor clamps to limit the displacement of the target object 9 and prevent it from deviating from the flipping component 42. For example, the third support structure 43 is in the form of an U-shaped slide rail or a clamping type, so that when the conveying assembly 10c moves the target object 9 to a certain distance, the third support structure 43 can be moved by an adjustment structure 45 such as a pneumatic cylinder or a hydraulic cylinder, so that the third support structure 43 can stably engage the opposite two sides 9c of the target object 9 to clamp and support the target object 9.

[0155] Additionally, a stop structure 44 can be configured on the third base 41 as needed to abut against the target object 9. For example, the stop structure 44 is in the form of a baffle and is fixed to the flipping member 42 so that when the conveying assembly 10c moves the target object 9 to a certain distance, the stop structure 44 abuts against the other side 9c of the target object 9, causing the conveying assembly 10c to stop operating and positioning the target object 9.

[0156] Additionally, a driving member 47 is provided on the front or rear side of the third base 41 to drive the flipping member 42 to perform a flipping action. For example, the driving member 47 includes a gear 471 and a rack 470, with the rack 470 meshing with the gear 471. The gear 471 is shafted to a shaft 401, with a bearing 403 at each end of the shaft 401, allowing the shaft 401 to pass through the bearings 403 and connect to a connecting member 402. The shaft 401 is fixed to the flipping member 42 via the connecting member 402, so that when the rack 470 moves linearly, it drives the gear 471 to rotate, causing the gear 471 to rotate the shaft 401, thereby flipping the flipping member 42. Specifically, a push-pull rod 480 of a power unit 48 (such as a pneumatic or hydraulic cylinder) drives the rack 470 to move linearly forward and backward, thereby rotating the gear 471.

[0157] Preferably, at least one inductive switch (not shown) can be configured on the third base 41 to control the extension distance of the push-pull rod 480, so that the rack 470 drives the gear 471 to rotate at an angle (the rotation angle in this embodiment is 180 degrees) to stably flip the flipping member 42.

[0158] The leveling device 5 is used to press the first surface 9a and the second surface 9b of the target object 9 together.

[0159] In this embodiment, as Figure 5A and Figure 5BAs shown, the leveling device 5 includes a fourth base 51, at least one working platform 52 disposed on the fourth base 51 to support the target object 9, a fourth support structure 53 disposed on the fourth base 51 to support the working platform 52, and at least one leveling member 50 disposed on the fourth support structure 53, so that the leveling member 50 is displaced relative to the fourth base 51 and moves toward the working platform 52, so that the leveling member 50 presses the target object 9. For example, the fourth base 51 has a first base 51a placed on an environmental surface (such as a factory floor), a second base 51b stacked on the first base 51a by a plurality of (such as four) pillars 510, and a top seat 51c supported on the second base 51b by the fourth support structure 53, and the working platform 52 is located on the second base 51b, and the leveling member 50 is located above the working platform 52. Specifically, the fourth support structure 53 serves as a guide rail and is equipped with a hydraulic or pneumatic assembly (such as another power unit 58 located on the top seat 51c). The power unit 58 drives a pressure column 580, one end of which is fixed to the leveling member 50, while the other end is movably connected to the power unit 58. This allows the pressure column 580 to drive the leveling member 50 to move vertically. By extending and retracting the pressure column 580, the downward pressure distance of the leveling member 50 can be controlled, causing the leveling member 50 to move closer to or further away from the first surface 9a of the raised floor, thereby pressing against the first surface 9a of the raised floor.

[0160] In another embodiment, in order to save the bearing volume between the first base 51a and the second base 51b, a support pad 51d can be added in the middle between the first base 51a and the second base 51b. The volume and material structure of the support pad 51d can be selected according to the requirements.

[0161] Furthermore, the fourth base 51 and the working platform 52 are static (or non-movable) structures, and the leveling component 50 is a movable rectangular block with a flat pressing surface 50a. It should be understood that the pressure tonnage of the leveling component 50 and the flatness of the pressing surface can be adjusted as needed without any particular limitation.

[0162] In addition, the transport device 1a uses a chain assembly as the conveying assembly 10b, which is convenient to be arranged on the side of the working platform 52, so that the transport device 1a can smoothly transport the target object 9 through the leveling device 5.

[0163] In addition, the processing equipment 1 may also be equipped with a control machine 1c to independently control the operation of the leveling device 5 (or the leveling component 50).

[0164] When the processing equipment 1 is used on the production line, the target object 9 is transported to the grinding device 2 by the conveying component 10 of the transport device 1a, so that the grinding device 2 can perform grinding operations on the four feet 90 and multiple frames 92, 93 of the target object 9. After the grinding operation is completed, the target object 9 is transported from the grinding device 2 to the flipping device 4 by the conveying components 10, 10c of the transport device 1a. Since the initial operation is performed on the bottom of the raised floor (the second surface 9b of the target object 9), while the later operation is performed on the floor surface of the raised floor (the first surface 9a of the target object 9), the raised floor must be flipped before the polishing operation.

[0165] Therefore, the target object 9 is transported to the third support structure 43 of the flipping device 4 by the conveying assembly 10c, and then the shaft structure 40 is rotated by the driving member 47 so that the flipping member 42 flips along the shaft structure 40, so that the target object 9 is flipped 180 degrees and placed on the conveyor belt 100a of the conveying assembly 10a.

[0166] Subsequently, the target object 9 is moved through the processing area of ​​the second base 31 of the polishing device 3 by the conveyor belt 100a of the conveying assembly 10a for polishing. That is, when the target object 9 passes the polishing tool 30, the polishing tool 30 will use the abrasive surface of its sandpaper 300 to micro-grind the first surface 9a of the target object 9. After the polishing operation is completed, the target object 9 is transported to the working platform 52 of the leveling device 5 by the conveying assembly 10b of the transport device 1a.

[0167] Finally, the leveling device 5 is used to perform a leveling operation, so that the leveling component 50 presses down on the first surface 9a of the target object 9. After the leveling operation is completed, the conveying component 10 of the conveying device 1a pushes the processed target object 9 to the next processing area or discharge area.

[0168] In summary, the polishing device 3 of the present invention is mainly integrated with the grinding device 2, the flipping device 4 and the leveling device 5 on the production line of a processing equipment 1, so that the raised floor can be ground, polished and leveled on a single production line, thereby speeding up the production process and improving production efficiency, while reducing manpower.

[0169] Furthermore, by designing the polishing tool 30 as a grinding wheel, after the target object 9 passes the rotating rod 321, the rotating sandpaper 300 will contact the moving target object 9 and flip it over, causing the abrasive surface of the sandpaper 300 to rub against the target object 9 and smooth out the uneven parts of the first surface 9a of the target object 9, thereby achieving the purpose of polishing. Therefore, it can avoid the problem of excessive removal of part of the first surface 9a of the target object 9, which would cause dents.

[0170] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Those skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as described in the claims.

Claims

1. A polishing device for a processing equipment, characterized in that, include: A platform for conveying an elevated floor as a target object, wherein the target object has a first surface and a second surface opposite each other, the first surface serving as a floor surface, and the second surface having multiple frames of different heights, and feet provided at the corners of the second surface. A polishing assembly, disposed on a base, includes a polishing tool, a support structure on the base, and a stand movably mounted on the support structure to support the polishing tool and raised or lowered relative to the support structure by an adjustment assembly. The adjustment assembly uses a driver to move a linkage rod to displace a fixed frame supporting the stand. When the driver rotates the linkage rod via a reducer, the linkage rod drives the fixed frame and the stand to rise or fall together, thereby moving the stand to move the polishing tool to the desired height and polishing the first surface of the target object as it passes through the polishing assembly. A positioning component is provided on the base to limit the target object, so that the polishing component polishes the first surface of the target object. The positioning component supports a rotating rod in an adjustable height by means of two bases. During the polishing operation of the target object, when the target object moves to the bottom of the rotating rod, the rotating rod presses the target object and can limit the vertical displacement space of the end side of the target object. The base has a cover for covering the polishing component and a support frame for mounting the cover to facilitate the transport of the target object, so that the polishing component is positioned above the target object, and the top of the cover is provided with a discharge end that communicates with the internal space of the cover to discharge impurities or foreign objects generated by the polishing component and the target object after polishing.

2. The polishing apparatus of the processing equipment as described in claim 1, characterized in that, The support structure has slide rails on its opposite sides, and the frame has at least one slider that engages with the slide rails, so that the slider on the frame slides in coordination with the slide rails, allowing the polishing tool to move vertically up and down to the desired processing position.

3. The polishing apparatus of the processing equipment as described in claim 1, characterized in that, The polishing tool is in the form of a grinding wheel, which has a main shaft assembly and multiple sandpapers arranged in a wheel shape around the main shaft assembly.

4. The polishing apparatus of the processing equipment as described in claim 3, characterized in that, A rotating shaft is internally connected to the main rod assembly, and bearings are respectively engaged at both ends of the rotating shaft so that the rotating shaft can rotate relative to the bearings, and the end of the bearing is fixed to the frame.

5. The polishing apparatus of the processing equipment as described in claim 4, characterized in that, One end of the shaft extends out of the bearing and is connected to a motor, which drives the shaft to rotate, causing the rotating sandpaper to come into contact with the moving target and flip it over, so that the sandpaper's abrasive surface rubs against the target and smooths out the uneven parts of the target's first surface.

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