Resin molding apparatus and method for manufacturing resin molded article

Abstract

The present application provides a resin molding device and a resin molding product manufacturing method capable of improving versatility. The resin molding device includes a molding die including an upper die and a lower die facing the upper die, which resin-molds a substrate; a die closing mechanism, which closes the molding die; and a useless resin removing mechanism, which removes useless resin formed on the resin-molded substrate, the useless resin removing mechanism including a plurality of removing portions, which remove the useless resin from the resin-molded substrate by pressing the useless resin of the resin-molded substrate, the plurality of removing portions being independently drivable.

Description

TECHNICAL FIELD

[0001] The present application relates to a resin molding device and a resin molded article manufacturing method. BACKGROUND

[0002] In Patent Literature 1, there is disclosed a degate device including left and right frame supports each of which holds two lead frames, left and right pressing members which face the two frame supports, and a pusher which is provided in the center and which clamps and moves a runner or the like useless resin. In the degate device, the two lead frames are clamped from above and below by the two frame supports and the two pressing members, respectively, and the useless resin in the center is clamped and moved by the pusher, whereby the useless resin can be removed from the lead frames.

[0003] [Related Art Documents]

[0004] [Patent Literature]

[0005] [Patent Literature 1] Japanese Patent Application Laid-Open No. 2012-231030 SUMMARY

[0006] [Problems to be Solved by the Invention]

[0007] However, the degate device described in Patent Literature 1 is configured such that the left and right pressing members are moved up and down at the same time to clamp the two lead frames, and therefore, as described in Patent Literature 1, it is possible to cope with only two lead frames connected by useless resin, and there is room for improvement in terms of low versatility.

[0008] The present application has been made in view of the above-described circumstances, and an object thereof is to provide a resin molding device and a resin molded article manufacturing method which can improve versatility.

[0009] [Means of Solving the Problems]

[0010] The object to be solved by the present application is as described above, and in order to solve the object, the resin molding device of the present application includes a molding die which includes an upper die and a lower die facing the upper die, and which performs resin molding on a substrate, a die clamping mechanism which clamps the molding die, and a useless resin removing mechanism which removes useless resin formed on a resin-molded substrate, the useless resin removing mechanism including a plurality of removing portions which remove the useless resin from the resin-molded substrate by pressing the useless resin of the resin-molded substrate, the plurality of removing portions being independently drivable.

[0011] Further, the resin molded article manufacturing method of the present application manufactures a resin molded article using the resin molding device.

[0012] [Effects of the Invention]

[0013] According to the present application, versatility of a resin molding apparatus can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is a plan view showing the overall structure of a resin molding apparatus according to an embodiment.

[0015] Figure 2 is a front view showing the overall structure of a resin molding apparatus according to an embodiment.

[0016] Figure 3 is a plan view showing the arrangement of a resin-molded completed substrate molded in a molding die.

[0017] Figure 4 is a perspective view showing the structure of a useless resin removing mechanism.

[0018] Figure 5 is a side view showing the structure of a useless resin removing mechanism.

[0019] Figure 6 is an enlarged side sectional view showing the structure of a useless resin removing mechanism.

[0020] Figure 7 is an enlarged side sectional view showing the situation of useless resin falling.

[0021] Figure 8 is a side view showing the situation of a removing section being driven.

[0022] Figure 9 (a) of FIG. 5 is a side view showing the positional relationship of useless resin, a useless resin placement section, and a resin pressing section. Figure 9 (b) of FIG. 5 is a plan view showing the positional relationship of useless resin and a useless resin placement section.

[0023] Figure 10 (a) of FIG. 6 is a side view showing a first modification example of a useless resin placement section. Figure 10 (b) of FIG. 6 is a side view showing a second modification example of a useless resin placement section. Figure 10 (c) of FIG. 6 is a side view showing a third modification example of a useless resin placement section.

[0024] [Explanation of Symbols]

[0025] 1: Resin molding apparatus

[0026] 2: Resin-molded completed substrate

[0027] 3: Substrate

[0028] 5: Rejection pool

[0029] 6: Flow channel

[0030] 10: Resin Molding Module

[0031] 20: Move out module

[0032] 100: Forming mold

[0033] 110: Lower mold

[0034] 120: Upper mold

[0035] 200: Mold closing mechanism

[0036] 500: Useless resin removal mechanism

[0037] 520: Loading unit

[0038] 521: Substrate mounting part

[0039] 522: Useless resin carrier

[0040] 550: Removal section

[0041] 551: Substrate pressing part

[0042] 552: Resin pressing part Detailed Implementation

[0043] The directions indicated by arrows U, D, L, R, F, and B in the diagram are defined as up, down, left, right, forward, and backward, respectively.

[0044] <Overall Structure of Resin Molding Device 1>

[0045] First, use Figure 1 and Figure 2 The structure of a resin molding apparatus 1 according to one embodiment of the present invention will be described. The resin molding apparatus 1 manufactures resin molded articles by sealing electronic components (hereinafter simply referred to as "chips") such as semiconductor chips, resistors, and capacitors with resin. In particular, in this embodiment, a resin molding apparatus 1 that performs resin molding using a transfer molding method is illustrated.

[0046] The resin molding apparatus 1 includes a resin molding module 10 and a transfer module 20 as components. Each component can be installed, removed, and replaced relative to the other components.

[0047] <Resin Molding Module 10>

[0048] Resin molding module 10 and substrate 3 (refer to) Figure 3) connected to the substrate 3. The resin molding module 10 mainly includes a molding die 100 (a lower die 110 and an upper die 120), a die closing mechanism 200, and a control section 300. Further, as the substrate 3, various substrates such as an epoxy glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and the like can be used in addition to a lead frame.

[0049] The molding die 100 resin-seals the chip connected to the substrate 3 using a molten resin material. The molding die 100 includes a pair of upper and lower dies, i.e., the lower die 110 and the upper die 120, facing each other. A heating section (not shown) such as a heater is provided in the molding die 100.

[0050] The die closing mechanism 200 closes or opens the molding die 100 by moving the lower die 110 up and down.

[0051] The control section 300 controls the operation of each module of the resin molding apparatus 1. The operation of the resin molding module 10 and the carry-out module 20 is controlled by the control section 300. In addition, the operation of each module can be arbitrarily changed (adjusted) using the control section 300.

[0052] Further, in the present embodiment, an example in which the control section 300 is provided in the resin molding module 10 is shown, but the control section 300 can be provided in another module. In addition, a plurality of control sections 300 can be provided. For example, the control section 300 can be provided for each module or each apparatus, and the operation of each module and the like can be controlled individually while being interlocked with each other.

[0053] < Carry-out module 20 >

[0054] The carry-out module 20 receives the resin-sealed substrate 3 (resin-molded substrate 2) from the resin molding module 10 and carries it out. The carry-out module 20 is disposed in a manner that the right side thereof is adjacent to the resin molding module 10. The carry-out module 20 mainly includes an unloader 400, a useless resin removing mechanism 500, a transfer mechanism 600, and a substrate storage section 700.

[0055] The unloader 400 holds the resin-molded substrate 2 resin-sealed by the molding die 100 and carries it out to the useless resin removing mechanism 500. The unloader 400 is disposed in a manner that it can move left and right through the resin molding module 10 (molding die 100) and the carry-out module 20 (useless resin removing mechanism 500).

[0056] The useless resin removing mechanism 500 removes resin (useless resin) that is useless as a product from the resin-molded substrate 2. As will be described later in detail, the useless resin removing mechanism 500 includes a placement unit 520 that places the resin-molded substrate 2, a removing section 550 that removes the useless resin from the resin-molded substrate 2 placed on the placement unit 520, and the like.

[0057] The transfer mechanism 600 transfers the resin-molded finished substrate 2 from which the unnecessary resin has been removed from the unnecessary resin removal mechanism 500 to the substrate storage section 700. The transfer mechanism 600 is disposed to the right of the unnecessary resin removal mechanism 500 (the removal section 550).

[0058] The substrate storage section 700 stores the resin-molded finished substrate 2. The substrate storage section 700 is disposed below the transfer mechanism 600.

[0059] <Summary of the operation of the resin-molding apparatus 1>

[0060] Next, a summary of the operation of the resin-molding apparatus 1 configured as described above (a manufacturing method of a resin-molded product using the resin-molding apparatus 1) is described.

[0061] The substrate 3 that is the object of resin molding and the resin material (e.g., a small piece-shaped resin) used for molding are supplied in advance to the molding die 100. The substrate 3 or the resin material can be supplied to the molding die 100 using a supply mechanism not shown.

[0062] In the resin-molding module 10, the mold clamping mechanism 200 clamps the molding die 100. Then, the small piece-shaped resin is heated to be melted using a heating section (not shown) of the molding die 100, and the substrate 3 is resin-sealed using the generated flowable resin. Thus, a resin-sealed resin-molded finished substrate 2 is formed.

[0063] After the resin sealing is completed, the mold clamping mechanism 200 unclamps the molding die 100 to release the resin-molded finished substrate 2. Thereafter, the resin-molded finished substrate 2 is carried out from the molding die 100 by the unloader 400 and placed on the placement unit 520 of the unnecessary resin removal mechanism 500.

[0064] The placement unit 520 on which the resin-molded finished substrate 2 is placed is moved downward of the removal section 550. The removal section 550 removes the unnecessary resin of the resin-molded finished substrate 2 placed on the placement unit 520.

[0065] After the unnecessary resin is removed, the placement unit 520 is moved downward of the transfer mechanism 600. The transfer mechanism 600 transfers the resin-molded finished substrate 2 from which the unnecessary resin has been removed from the placement unit 520 to the substrate storage section 700. Thus, the resin-molded finished substrate 2 is manufactured and stored in the substrate storage section 700.

[0066] <About the resin-molded finished substrate 2>

[0067] Hereinafter, the structure of the unnecessary resin removal mechanism 500 is described in more detail, and as a premise thereof, the resin-molded finished substrate 2 of the present embodiment is described.

[0068] As shown in FIG. 1, in the molding die 100 of the present embodiment, three rows (row L1 to row L3) of resin-molded completed substrates 2 are arranged before and after molding. Specifically, the resin-molded completed substrates 2 are formed by resin-molding six pieces of the substrates 3 arranged in three rows before and after and two rows left and right on the lower mold 110. Resin (molded resin portion 4) that seals the chips is formed on the upper surface of the resin-molded substrates 3. Figure 3

[0069] In addition, resin (unwanted resin) that is not used as a product is formed on the side of the substrate 3. Specifically, the resin-molded completed substrate 2 of the row L1 closest to the front (front side) has a scupper 5 formed on the front side of the substrate 3. In addition, a flow channel 6 is formed so as to extend from the scupper 5 to the back surface (lower surface) of the substrate 3. The substrate 3 has a plurality of through-holes 3a for removing the flow channel 6 from the substrate 3 formed along the flow channel 6.

[0070] The resin-molded completed substrates 2 of the row L2 in the center before and after and the row L3 farthest to the back (rear side) are formed in a shape in which the resin-molded completed substrates 2 of the row L1 are reversed before and after. That is, the resin-molded completed substrates 2 of the row L2 and the row L3 have the scupper 5 formed on the back side of the substrate 3.

[0071] Thus, in the molding die 100 of the present embodiment, resin-molded completed substrates 2 having different configurations (positional relationship between the substrate 3 and the unwanted resin) are formed.

[0072] <Detail structure of unwanted resin removing mechanism 500>

[0073] Next, the structure of the unwanted resin removing mechanism 500 will be described in more detail. In the following description, the Figure 6 and Figure 7 are schematic diagrams for description, and there are parts in which the positions of the cross sections are not accurate.

[0074] As shown in FIG. 2 and FIG. 3, the unwanted resin removing mechanism 500 mainly includes a lower movable body 510, a placement unit 520, an upper base portion 530, an upper movable body 540, a removing portion 550, and a cooling portion 560. Figure 4 Figure 5 <Lower movable body 510>

[0075] The lower movable body 510 supports the placement unit 520 described later. The lower movable body 510 is movable in the left-right direction by a suitable moving mechanism (for example, a guide rail that guides the lower movable body 510 so as to be movable in the left-right direction, a servo motor that moves the lower movable body 510 to an arbitrary position along the guide rail, and the like).

[0076] The lower movable body 510 supports the placement unit 520 described later. The lower movable body 510 is movable in the left-right direction by a suitable moving mechanism (for example, a guide rail that guides the lower movable body 510 so as to be movable in the left-right direction, a servo motor that moves the lower movable body 510 to an arbitrary position along the guide rail, and the like). ​​

[0077] <Placement unit 520>

[0078] Figure 4 to Figure 6 The illustrated placement unit 520 places the resin-molded completed substrate 2. The placement unit 520 is provided to the lower movable body 510. The placement unit 520 is provided in a manner that three are aligned in front and back, so as to correspond to three rows of resin-molded completed substrates 2. Further, the following specific description is made for the placement unit 520 disposed closest in front (front side) for convenience of explanation, and detailed description is appropriately omitted for the other placement units 520.

[0079] The placement unit 520 mainly includes a substrate placement portion 521, a useless resin placement portion 522, and a guide plate 523.

[0080] The substrate placement portion 521 places the substrate 3 portion of the resin-molded completed substrate 2. The substrate placement portion 521 is formed in a rectangular parallelepiped shape having a substantially flat upper surface. The substrate placement portion 521 is fixed to the lower movable body 510. Although not illustrated, a groove corresponding to the shape of the useless resin (runner 6, etc.) of the resin-molded completed substrate 2 placed thereon is appropriately provided in the substrate placement portion 521. Thereby, interference of the useless resin with the substrate placement portion 521 when the resin-molded completed substrate 2 is placed on the substrate placement portion 521 can be prevented.

[0081] The useless resin placement portion 522 supports the useless resin portion (particularly, the sprue pool 5 formed in the side of the substrate 3) of the resin-molded completed substrate 2 from below. The useless resin placement portion 522 is disposed in front of the substrate placement portion 521. The useless resin placement portion 522 mainly includes a support portion 522a and a placement portion 522b.

[0082] The support portion 522a is a portion that supports the placement portion 522b described later. The support portion 522a is disposed in front of the substrate placement portion 521. The support portion 522a is disposed at an appropriate interval from the substrate placement portion 521. The support portion 522a is disposed in a manner that rises upward from the lower movable body 510. The support portion 522a is disposed with the longitudinal direction oriented in the left-right direction.

[0083] The placement portion 522b is a portion that places the useless resin of the resin-molded completed substrate 2. The placement portion 522b is formed in a cylindrical shape with the longitudinal direction (axial direction) oriented in the left-right direction. The placement portion 522b is fixed to the upper surface of the support portion 522a. The height of the upper end of the placement portion 522b is disposed in a manner that becomes substantially the same as the height of the upper surface of the substrate placement portion 521. The placement portion 522b is disposed at an appropriate interval from the substrate placement portion 521.

[0084] Figure 5 and Figure 6The guide plate 523 shown guides the unnecessary resin removed from the resin-molded substrate 2 in a suitable direction. The guide plate 523 is disposed between the substrate placement portion 521 and the unnecessary resin placement portion 522. The guide plate 523 is disposed so as to slope downward from the front (the unnecessary resin placement portion 522 side) toward the rear (the substrate placement portion 521 side). Thus, the guide plate 523 can guide the falling unnecessary resin to an unnecessary resin storage portion (not shown) formed in the lower portion of the substrate placement portion 521.

[0085] In the present embodiment, the placement units 520 described above are provided in three in the upper portion of the lower movable body 510. The three placement units 520 respectively correspond to the three columns of resin-molded substrates 2 (refer to FIG. 1). Figure 3 That is, the resin-molded substrate 2 of the foremost column Ll is placed in the placement unit 520 closest to the front (front side). Similarly, the resin-molded substrates 2 of the respective columns L2 and L3 are placed in the placement units 520 in the front and rear center and the innermost side (rear side), respectively. The three placement units 520 can be moved left and right integrally by the lower movable body 510.

[0086] Further, in the following, in order to distinguish the three placement units 520, the placement unit 520 closest to the front (front side) is sometimes referred to as the placement unit 520F, the placement unit 520 in the front and rear center is sometimes referred to as the placement unit 520M, and the placement unit 520 in the innermost side (rear side) is sometimes referred to as the placement unit 520B.

[0087] The orientation of each placement unit 520 is set in a manner corresponding to the orientation of the resin-molded substrate 2. More specifically, the placement unit 520M and the placement unit 520B are formed in a shape in which the orientation of the placement unit 520F closest to the front is reversed front and rear. That is, in the placement unit 520M and the placement unit 520B, the unnecessary resin placement portion 522 is disposed rearward of the substrate placement portion 521.

[0088] <Upper base portion 530>

[0089] Figure 5 The upper base portion 530 shown supports the upper movable body 540 described later. The upper base portion 530 is disposed at a prescribed height via a suitable support member.

[0090] <Upper movable body 540>

[0091] The upper movable body 540 supports the removal part 550, which will be described later. The upper movable body 540 is provided at the lower part of the upper base part 530. The upper movable body 540 can be moved relative to the upper base part 530 in the front-back direction by a suitable moving mechanism (e.g., a guide rail 541 that guides the upper movable body 540 so that it can move in the front-back direction, a servo motor that moves the upper movable body 540 to any position along the guide rail 541, etc.).

[0092] Furthermore, for convenience, in Figure 4 The illustrations of the upper base portion 530 and the upper movable part 540 are appropriately omitted in the above.

[0093] <Removal Section 550>

[0094] Figure 4 to Figure 6 The removal section 550 shown removes waste resin from the resin-molded substrate 2 by pressing the waste resin on the resin-molded substrate 2. Two removal sections 550 are arranged in a row. Furthermore, for ease of explanation, the removal section 550 located near the front (front side) will be described in detail below, and a detailed description of the other removal section 550 is appropriate to be omitted.

[0095] The removal section 550 mainly includes a substrate pressing section 551 and a resin pressing section 552.

[0096] Figure 6 The substrate pressing part 551 shown presses the substrate 3 portion of the resin-molded substrate 2 placed on the substrate mounting part 521 from above. The substrate pressing part 551 mainly includes: a lifting part 551a, a substrate contact part 551b, an elastic member 551c, and a pin 551d.

[0097] Figure 5 and Figure 6 The lifting part 551a shown is capable of moving up and down (lifting). The lifting part 551a is provided at the lower part of the upper movable body 540. The lifting part 551a can be moved up and down relative to the upper movable body 540 by a suitable moving mechanism (e.g., a guide rail that guides the lifting part 551a to move in the up and down direction, a servo motor that moves the lifting part 551a to any position along the guide rail, etc.).

[0098] The substrate contact portion 551b is a portion that contacts the substrate 3 of the resin-molded substrate 2. The substrate contact portion 551b is formed in a substantially plate shape. The substrate contact portion 551b is disposed below the elevation portion 551a with the thickness direction oriented in the up-down direction. The substrate contact portion 551b is supported by a suitable member so as to be movable (elevatable) up and down with respect to the elevation portion 551a. A recess for avoiding interference with the molded resin portion 4 of the resin-molded substrate 2 is formed in the lower surface of the substrate contact portion 551b. A through-hole 551e for insertion of the pin 551d described later is formed in the substrate contact portion 551b.

[0099] Figure 6 The elastic member 551c shown imparts a force downward to the substrate contact portion 551b. The elastic member 551c is formed of, for example, a compression coil spring or the like. The elastic member 551c is disposed between the elevation portion 551a and the substrate contact portion 551b. A downward force is always imparted to the substrate contact portion 551b by the force exerted by the elastic member 551c.

[0100] The pin 551d presses the unnecessary resin (particularly, the runner 6) of the resin-molded substrate 2 from above. The pin 551d is formed in a substantially cylindrical shape with the length direction oriented in the up-down direction. The pin 551d is fixed to the lower portion of the elevation portion 551a. The pin 551d is disposed so as to extend downward from the elevation portion 551a. The pin 551d is provided in a plurality of positions on the resin-molded substrate 2 corresponding to the through-holes 3a. The lower portion of the pin 551d is inserted into the through-hole 551e of the substrate contact portion 551b.

[0101] The resin press portion 552 mainly presses the unnecessary resin (the scarp pool 5, the runner 6) of the resin-molded substrate 2 from above. The resin press portion 552 is disposed in front of the substrate press portion 551. The resin press portion 552 mainly includes a support portion 552a, a link portion 552b, and a resin contact portion 552c.

[0102] The support portion 552a is a portion that supports the resin contact portion 552c described later. The support portion 552a is fixed to the front portion of the elevation portion 551a.

[0103] The link portion 552b is a portion that links the support portion 552a and the resin contact portion 552c described later. The link portion 552b is formed in a substantially cylindrical shape with the length direction oriented in the up-down direction. The link portion 552b is disposed so as to extend downward from the support portion 552a. The link portion 552b is provided in a plurality of positions arranged left and right (see FIG. 6). Figure 4

[0104] ​The resin contact portion 552c is a portion that contacts the unnecessary resin of the resin-molded substrate 2. The resin contact portion 552c is formed in a substantially rectangular parallelepiped shape with the longitudinal direction oriented in the left-right direction. The resin contact portion 552c is formed in a shape in which the apex portions of the front lower portion and the rear lower portion are chamfered. Thus, inclined surfaces are formed in the front lower portion and the rear lower portion of the resin contact portion 552c. The resin contact portion 552c is fixed to the lower portion of the connecting portion 552b. The height of the lower end of the resin contact portion 552c is configured to be substantially the same as the height of the lower end of the substrate contact portion 551b (to be specific, the substrate contact portion 551b in the state of being moved to the lowermost position with respect to the lifting portion 551a). The cooling hole 552d is formed in the resin contact portion 552c.

[0105] The cooling hole 552d is a hole for ejecting gas (for example, cooling air) toward the resin-molded substrate 2. The cooling hole 552d is formed so as to be open in the inclined surface (chamfered portion) of the rear lower portion of the resin contact portion 552c. The cooling hole 552d is formed so as to be connected to the flow path of the cooling air formed in the inside of the resin contact portion 552c. By operating a blower not shown, the cooling air is sent to the flow path of the resin contact portion 552c. The cooling air is ejected from the resin contact portion 552c toward the rear lower portion via the cooling hole 552d.

[0106] In the present embodiment, the removal portion 550 described above is provided in two in the lower portion of the upper portion movable body 540. Further, in order to distinguish between the two removal portions 550, the removal portion 550 on the front (front side) is sometimes referred to as the removal portion 550F, and the removal portion 550 on the back (rear side) is sometimes referred to as the removal portion 550B.

[0107] The removal portion 550B is formed in a shape in which the removal portion 550F is reversed front and back. That is, in the removal portion 550B, the resin pressing portion 552 is disposed behind the substrate pressing portion 551.

[0108] In addition, the two removal portions 550 (lifting portions 551a) can be independently driven (lifted) from each other. Further, the structure for independently driving the two removal portions 550 from each other is not limited. For example, a structure in which a drive source (servo motor or the like) is provided for each of the two removal portions 550, the two drive sources are independently controlled, or a mechanism that independently switches whether the driving force can be transmitted from one (common) drive source to the two removal portions 550 is provided, or the like can be employed.

[0109] < Cooling portion 560 >

[0110] Figure 5The illustrated cooling section 560 ejects cooling air toward the resin-molded substrate 2 placed on the placement unit 520B. The cooling section 560 is disposed above the placement unit 520B. The cooling section 560 has substantially the same structure as the resin-contacting section 552c (see Figure 6 and the like) of the removal section 550. That is, the cooling section 560 is a member whose longitudinal direction is oriented in the left-right direction, and has a cooling hole for ejecting cooling air.

[0111] <Operation of the useless resin removal mechanism 500>

[0112] Hereinafter, a case where the useless resin removal mechanism 500 configured as described above removes useless resin from the resin-molded substrate 2 will be described.

[0113] As illustrated in Figure 2 , the resin-molded substrate 2 resin-sealed by the molding die 100 is placed on the placement unit 520 by the unloader 400. At this time, three rows (row LI to row L3) of resin-molded substrates 2 (see Figure 3 ) are placed on the corresponding placement units 520.

[0114] A state in which the resin-molded substrate 2 of the most recent row LI is placed on the placement unit 520F is illustrated in Figure 6 . In the resin-molded substrate 2, the substrate 3 portion is placed on the substrate placement section 521. In addition, in the resin-molded substrate 2, the scrap pool 5 portion is placed on the useless resin placement section 522. In this way, by supporting not only the substrate 3 portion but also the useless resin (scrap pool 5) formed on the side of the substrate 3, the resin-molded substrate 2 can be stably supported.

[0115] Further, although omitted from the illustration, the resin-molded substrates 2 of the other rows (row L2, row L3) are also placed on the placement unit 520M and the placement unit 520B, respectively, in the same manner. Hereinafter, a case where the useless resin of the resin-molded substrate 2 placed on the placement unit 520F is removed will be mainly described, and the description regarding the other resin-molded substrates 2 will be appropriately omitted.

[0116] When the resin-molded substrate 2 is placed on the placement unit 520, the lower movable body 510 (see Figure 4 ) moves to the right and stops below the removal section 550. At this time, as illustrated in Figure 4 and Figure 5 , the removal section 550F and the removal section 550B are positioned above the placement unit 520F and the placement unit 520M, respectively.

[0117] Next, as illustrated in Figure 5As shown, cooling air is ejected from the resin contact portion 552c of the removal section 550 and the cooling portion 560 at predetermined intervals. The cooling air ejected from the resin contact portion 552c cools the resin-molded substrate 2 placed in the mounting units 520F and 520M. Additionally, the cooling air ejected from the cooling portion 560 cools the resin-molded substrate 2 placed in the mounting unit 520B. Thus, by cooling the resin-molded substrate 2 to a certain extent, unwanted resin can be easily removed.

[0118] Next, removal sections 550F and 550B descend. More specifically, the lifting section 551a of each removal section 550 moves downward (descends) relative to the upper movable body 540. As the lifting section 551a descends, the substrate contact section 551b and the resin pressing section 552 also descend.

[0119] like Figure 7 As shown, when the removal section 550 descends to a certain extent, the substrate 3 portion of the resin-molded substrate 2 placed in the substrate mounting section 521 comes into contact with the substrate contact section 551b. Thus, the substrate 3 is held between the substrate contact section 551b and the substrate mounting section 521.

[0120] When the lifting portion 551a descends further in the aforementioned state, it descends relative to the substrate contact portion 551b. Consequently, the pin 551d provided in the lifting portion 551a protrudes downward from the substrate contact portion 551b and presses down the flow channel 6 portion via the through hole 3a formed in the substrate 3. Additionally, almost simultaneously, a resin pressing portion 552 is formed on the side of the substrate 3. Figure 7 Press down the waste resin pool 5 (front side). In this way, by pressing down the waste resin of the resin-molded substrate 2, the waste resin is peeled off from the resin-molded substrate 2.

[0121] Although a waste resin holding section 522 (holding section 522b) is disposed below the waste resin (rejection tank 5), the waste resin cannot be stably supported in the cylindrical holding section 522b. Therefore, the waste resin peeled off from the resin-molded substrate 2 will fall downwards due to its own weight. At this time, the waste resin is pressed down by the resin pressing section 552 disposed behind the waste resin holding section 522, and the waste resin falls to the rear side of the waste resin holding section 522. The falling waste resin is guided by the guide plate 523 and collected into the waste resin receiving section (not shown) and discharged.

[0122] Furthermore, although the illustration is omitted, not only the resin-molded substrate 2 placed in the mounting unit 520F, but also the resin-molded substrate 2 placed in the mounting unit 520M, has its useless resin removed by the removal unit 550B.

[0123] When the waste resin is removed from the resin-molded substrate 2 placed in the mounting units 520F and 520M, the removal sections 550F and 550B rise respectively. Thereafter, as... Figure 8 As shown, the upper movable body 540 moves rearward. Simultaneously, the two removal parts 550 move rearward as a single unit. When the removal part 550B reaches above the mounting unit 520, the upper movable body 540 stops.

[0124] Next, only removal section 550B of the two removal sections 550 descends. Thus, similar to the cases of mounting units 520F and 520M, unwanted resin is removed from the resin-molded substrate 2 mounted on the mounting unit 520B. When unwanted resin is removed from the resin-molded substrate 2, removal section 550B rises.

[0125] Subsequently, as described above, the mounting unit 520 (lower movable body 510) moves to the right, and the resin-molded substrate 2, from which waste resin has been removed, is transferred to the substrate receiving section 700 (see reference). Figure 2 ).

[0126] As described above, in the waste resin removal mechanism 500 of this embodiment, waste resin can be removed from three rows of resin-molded substrates 2 by using two removal units 550 that can be driven independently of each other. That is, by making the removal units 550 capable of being driven independently of each other, waste resin can be removed regardless of the number (rows) of resin-molded substrates 2. As a result, the versatility of the resin molding apparatus 1 can be improved.

[0127] In particular, in this embodiment, the two removal sections 550 are arranged in a configuration that is reversed from each other. By arranging multiple removal sections 550 with different configurations in this way, as in this embodiment, the resin-molded substrate 2 (columns L1, L2, and L3, as shown in the previous embodiment) can be removed appropriately and in turn. Figure 3 Useless resin.

[0128] Furthermore, in the waste resin removal mechanism 500 of this embodiment, the waste resin removed from the resin-molded substrate 2 is not stably supported by the waste resin holding part 522, and therefore falls downwards and is collected due to its own weight. That is, in this embodiment, there is no need to provide a mechanism for discharging the removed waste resin (e.g., an adsorption mechanism for holding the waste resin, or a conveying mechanism for discharging, etc.), thus simplifying the structure of the device. Hereinafter, the structure of the waste resin holding part 522, etc., for causing the waste resin to fall due to its own weight will be specifically described.

[0129] <Details of the useless resin carrier 522, etc.>

[0130] exist Figure 9The resin forming completed substrate 2, the useless resin (scrap pool 5 and runner 6), the useless resin placement portion 522, and the resin pressing portion 552 are schematically shown in the cross-sectional view.

[0131] In the present embodiment, the placement portion 522b is formed in a cylindrical shape. Therefore, the placement portion 522b contacts the useless resin at one point of the side surface of the cylinder formed in a curved surface shape when viewed in the side view. Hereinafter, the portion where the placement portion 522b contacts the useless resin is referred to as a contact portion P1.

[0132] If the contact portion P1 is disposed at a position not overlapping the center of gravity G of the useless resin when viewed in the plan view, the useless resin placement portion 522 cannot stably support the useless resin, and thus the useless resin can fall due to its own weight. Therefore, it is preferable that the useless resin placement portion 522 be disposed so that the contact portion P1 does not overlap the center of gravity G of the useless resin when viewed in the plan view.

[0133] In addition, in order to easily cause the useless resin to fall, it is preferable to minimize the contact portion P1 (the portion where the placement portion 522b contacts the useless resin). For example, in the present embodiment, by forming the placement portion 522b in a cylindrical shape, the placement portion 522b is configured to contact the useless resin at one point (contact portion P1) of the upper end portion thereof when viewed in the side view. In this way, by minimizing the contact area with the useless resin, the useless resin placed on the useless resin placement portion 522 can be brought to an unstable state, and thus can easily fall due to its own weight.

[0134] In addition, in order to easily cause the useless resin to fall, it is preferable to dispose the resin pressing portion 552 that presses the useless resin to the side of the useless resin placement portion 522. More specifically, it is preferable that the portion where the resin pressing portion 552 (resin contact portion 552c) contacts the useless resin (hereinafter, referred to as a contact portion P2) be disposed at a position not overlapping the contact portion P1 of the useless resin placement portion 522 when viewed in the plan view. Further, in the present embodiment, the lower end surface of the resin contact portion 552c is the contact portion P2.

[0135] More specifically, in the present embodiment, the useless resin placement portion 522 is formed in a curved surface shape, and the resin pressing portion 552 is disposed to the side of the useless resin placement portion 522. In this way, the useless resin can be pressed by the resin pressing portion 552, and thus can be easily caused to fall due to its own weight.

[0136] Furthermore, the resin molding apparatus 1 does not necessarily need to have all the structures regarding the positional relationship between the useless resin placement part 522 and the center of gravity G, the size of the contact part P1, and the arrangement of the resin pressing part 552. That is, if the resin molding apparatus 1 has at least one of the structures mentioned above, the useless resin can fall due to its own weight.

[0137] The following uses Figure 10 A modified example of the useless resin mounting part 522 will be described.

[0138] exist Figure 10 In the first variation of the useless resin placement portion 522 shown in (a), the placement portion 522b is formed into a triangular shape when viewed from the side. Specifically, the placement portion 522b is formed with the corner (one vertex) formed by two inclined planes facing upwards. The corner becomes the contact portion P1 that contacts the useless resin. In the first variation, the useless resin placement portion 522 contacts the useless resin at one point of the vertex of the triangle when viewed from the side, thus allowing the useless resin to fall easily.

[0139] exist Figure 10 In the second variation of the useless resin placement portion 522 shown in (b), the placement portion 522b is formed into a trapezoidal shape when viewed from the side. Specifically, the placement portion 522b is formed such that the front-to-back width of its upper surface (upper base when viewed from the side) is smaller than the front-to-back width of its lower surface (lower base). Its upper surface becomes the contact portion P1 that contacts the useless resin. The upper surface of the useless resin placement portion 522 in the second variation is formed to be relatively small, so that the useless resin can fall more easily.

[0140] exist Figure 10 In the third variation of the useless resin placement portion 522 shown in (c), the placement portion 522b is formed into a rectangular shape when viewed from the side. In this case, the upper surface of the placement portion 522b becomes the contact portion P1 that contacts the useless resin. Although the upper surface of the useless resin placement portion 522 in the third variation is relatively large, by arranging the useless resin placement portion 522 in such a way that the center of gravity G of the useless resin does not overlap with the contact portion P1 when viewed from above, the useless resin can fall.

[0141] As described above, the resin molding apparatus 1 of this embodiment includes: a molding die 100, including an upper die 120 and a lower die 110 facing the upper die 120, for resin molding a substrate 3; a mold closing mechanism 200 for closing the molding die 100; and a waste resin removal mechanism 500 for removing waste resin formed on the resin-molded substrate 2. The waste resin removal mechanism 500 includes a plurality of removal parts 550, which remove the waste resin from the resin-molded substrate 2 by pressing the waste resin on the resin-molded substrate 2. The plurality of removal parts 550 can be driven independently of each other.

[0142] By so configuring, the versatility of the resin molding device 1 can be improved. That is, the arbitrary removal section 550 can be individually driven according to the number or arrangement of the resin-molded substrate 2, and thus the unnecessary resin can be appropriately removed regardless of the number or arrangement of the resin-molded substrate 2.

[0143] In addition, the plurality of removal sections 550 can be independently moved in the vertical direction.

[0144] By so configuring, the versatility of the resin molding device 1 can be improved. That is, the plurality of removal sections 550 can be individually moved in the vertical direction, and thus only the necessary removal section 550 can be operated according to the number of resin-molded substrates 2.

[0145] In addition, the plurality of removal sections 550 can be integrally moved in the horizontal direction.

[0146] By so configuring, the structure of the resin molding device 1 can be simplified. That is, by being configured so that the plurality of removal sections 550 are collectively moved in the horizontal direction, the structure for moving the removal section 550 in the horizontal direction can be simplified.

[0147] In addition, the removal section 550 includes a substrate pressing section 551 that presses and holds the substrate 3 portion of the resin-molded substrate 2, and a resin pressing section 552 that is formed on the side of the substrate pressing section 551 and presses and removes the unnecessary resin from the resin-molded substrate 2.

[0148] By so configuring, the unnecessary resin formed on the side of the resin-molded substrate 2 can be easily removed.

[0149] In addition, the plurality of removal sections 550 includes a removal section 550F (first removal section) in which the resin pressing section 552 is arranged on one side (front) of the substrate pressing section 551, and a removal section 550B (second removal section) in which the resin pressing section 552 is arranged on the other side (rear) of the substrate pressing section 551.

[0150] By so configuring, the versatility of the resin molding device 1 can be improved. That is, by using the removal section 550F and the removal section 550B in distinction according to the shape of the resin-molded substrate 2 (particularly, the position of the unnecessary resin with respect to the substrate 3), the plurality of resin-molded substrates 2 can be corresponded to.

[0151] Further, the resin-molded substrate 2 includes a resin-molded substrate 2 of the column L1 (first resin-molded substrate) in which the useless resin is formed on the one side (front) of the substrate 3 portion, and resin-molded substrates 2 of the columns L2 and L3 (second resin-molded substrates) in which the useless resin is formed on the other side (rear) of the substrate 3 portion.

[0152] With this configuration, the versatility of the resin-molding apparatus 1 can be improved. That is, the useless resin of the resin-molded substrate 2 having a different shape (particularly, the position of the useless resin with respect to the substrate 3) can be removed.

[0153] Further, the resin-pressing portion 552 can cool the resin-molded substrate 2 by jetting gas to the resin-molded substrate 2.

[0154] With this configuration, the resin-molded substrate 2 is cooled to some extent, and thus the useless resin can be easily removed. Further, by using the structure for cooling the useless resin or the like as the resin-pressing portion 552, the simplification of the structure of the resin-molding apparatus 1 can be achieved.

[0155] Further, the resin-molding method of the present embodiment manufactures a resin-molded product using the resin-molding apparatus 1.

[0156] With this configuration, the versatility of the resin-molding apparatus 1 can be improved.

[0157] Further, the resin-molding apparatus 1 of the present embodiment includes a molding die 100 including an upper die 120 and a lower die 110 facing the upper die 120, which resin-molds a substrate 3, a die-clamping mechanism 200 which clamps the molding die 100, and a useless resin-removing mechanism 500 which removes the useless resin formed in a resin-molded substrate 2, the useless resin-removing mechanism 500 including a substrate-locating portion 521 which locates the substrate 3 portion of the resin-molded substrate 2, and a useless resin-locating portion 522 which is disposed on the side of the substrate-locating portion 521, locates the useless resin of the resin-molded substrate 2, and causes the useless resin removed from the resin-molded substrate 2 to fall due to gravity.

[0158] With this configuration, the simplification of the structure of the resin-molding apparatus 1 can be achieved. That is, a mechanism (for example, a suction mechanism which suctions the useless resin, or the like) for discharging the useless resin removed from the resin-molded substrate 2 is not needed, and thus the simplification of the structure of the resin-molding apparatus 1 and the reduction of cost can be achieved.

[0159] Further, the useless resin-locating portion 522 supports the position, which does not overlap the center of gravity G of the useless resin removed from the resin-molded substrate 2 in a plan view, of the useless resin from below.

[0160] By so configuring, the unnecessary resin is easily caused to fall down by self-weight. That is, the unnecessary resin placement portion 522 does not support the center of gravity G of the unnecessary resin, so the unnecessary resin becomes unstable, and thus is easily caused to fall down.

[0161] Further, the unnecessary resin placement portion 522 is formed in a manner that a portion (contact portion Pl) which comes into contact with the unnecessary resin placed thereon is curved (see Figure 9 ), or a corner portion (see Figure 10 (a)) in which a plurality of surfaces intersect.

[0162] By so configuring, the unnecessary resin is easily caused to fall down by self-weight. That is, by reducing the contact portion Pl of the unnecessary resin placement portion 522, the unnecessary resin becomes unstable, and thus is easily caused to fall down.

[0163] Further, the unnecessary resin placement portion 522 (placement portion 522b) is formed in a cylindrical shape, and is disposed in a manner that a side surface formed in a curved shape comes into contact with the unnecessary resin.

[0164] By so configuring, the unnecessary resin is easily caused to fall down by self-weight. That is, by reducing the contact portion Pl of the unnecessary resin placement portion 522, the unnecessary resin becomes unstable, and thus is easily caused to fall down.

[0165] Further, the unnecessary resin removal mechanism 500 includes a resin pressing portion 552 which is disposed at a side of the unnecessary resin placement portion 522, and removes the unnecessary resin from the substrate 3 portion by pressing the unnecessary resin from above.

[0166] By so configuring, the unnecessary resin is easily caused to fall down by self-weight. That is, by pressing the unnecessary resin at a side of the unnecessary resin placement portion 522, the unnecessary resin is easily caused to fall down from the unnecessary resin placement portion 522.

[0167] Further, the resin pressing portion 552 is disposed in a manner that, when the unnecessary resin is pressed, a portion (contact portion P2) which comes into contact with the unnecessary resin does not overlap with a portion (contact portion Pl) which comes into contact with the unnecessary resin of the unnecessary resin placement portion 522 in plan view.

[0168] By so configuring, the unnecessary resin is easily caused to fall down by self-weight. That is, the unnecessary resin is prevented from being held by being sandwiched between the unnecessary resin placement portion 522 and the resin pressing portion 552, and is easily caused to fall down.

[0169] Further, the unnecessary resin is formed at one side of the substrate 3 portion.

[0170] With such a configuration, in the resin molding device 1 in which the unnecessary resin formed on one side of the substrate 3 is removed, simplification of the structure can be achieved.

[0171] Further, the resin molding product manufacturing method of the present embodiment is a method of manufacturing a resin molding product using the resin molding device 1.

[0172] With such a configuration, simplification of the structure of the resin molding device 1 can be achieved.

[0173] The above describes the embodiments of the present application, but the present application is not limited to the embodiments, and appropriate changes can be made within the scope of the technical idea of the application recited in the claims.

[0174] For example, the constituent members (the resin molding module 10 and the like) used in the resin molding device 1 of the embodiment are examples, and can be appropriately attached and detached or replaced. For example, a supply module for supplying the substrate 3 or the small piece-shaped resin to the resin molding module 10, or the number of resin molding modules 10 can be further provided, and the like. Further, the structure or the operation of the constituent members used in the resin molding device 1 of the present embodiment is an example, and can be appropriately changed.

[0175] Further, in the present embodiment, a structure in which the two removal sections 550 are integrally moved in the horizontal direction is exemplified, but the present application is not limited thereto, and for example, a structure in which the two removal sections 550 are independently moved in the horizontal direction can be provided. Thereby, the versatility of the resin molding device 1 can be further improved.

[0176] Further, in the present embodiment, the resin molding device 1 having two removal sections 550 is exemplified, but the present application is not limited thereto, and for example, a structure in which three or more removal sections 550 are provided and independently driven can be provided.

[0177] Further, in the present embodiment, the removal section 550F in which the resin pressing section 552 is disposed in the "front" of the substrate pressing section 551 and the removal section 550B in which the resin pressing section 552 is disposed in the "rear" of the substrate pressing section 551 are exemplified, but the present application is not limited thereto, and the positional relationship of the resin pressing section 552 and the substrate pressing section 551 can be arbitrarily changed. For example, a removal section in which the resin pressing section 552 is disposed in the "left" of the substrate pressing section 551, a removal section in which the resin pressing section 552 is disposed in the "right" of the substrate pressing section 551, and the like can be used.

[0178] In addition, in the present embodiment, the resin-molded substrate 2 in which the column L1 of the unnecessary resin is formed "in front of" the substrate 3 and the resin-molded substrates 2 in which the columns L2 and L3 of the unnecessary resin are formed "behind" the substrate 3 are exemplified, but the present application is not limited thereto, and the positional relationship of the substrate 3 and the unnecessary resin can be arbitrarily changed. For example, it is also possible to use the resin-molded substrate 2 in which the unnecessary resin is formed "on the left of" the substrate 3, the resin-molded substrate 2 in which the unnecessary resin is formed "on the right of" the substrate 3, or the like.

[0179] Thus, by arbitrarily setting the orientation of the removal section 550 and the resin-molded substrate 2, the versatility of the resin-molding apparatus 1 can be improved.

[0180] In addition, the number or arrangement of the resin-molded substrates 2 exemplified in the present embodiment and the number or arrangement of the placement units 520 corresponding thereto are examples, and can be arbitrarily changed.

[0181] In addition, in the present embodiment, the shape of the several unnecessary resin placement sections 522 (placement section 522b) is exemplified (see Figure 9 and Figure 10 ), but the present application is not limited thereto, and the shape of the placement section 522b can be arbitrarily changed. That is, the shape of the unnecessary resin placement section 522 (placement section 522b) is not particularly limited as long as the unnecessary resin removed from the resin-molded substrate 2 can fall due to gravity. For example, it is also possible to form the placement section 522b not in a cylindrical shape (circular shape in side view, see Figure 9 ), but in a semi-cylindrical shape (semicircular shape in side view) in which a curved surface faces upward.

Claims

1. A resin molding apparatus comprising: a molding die including an upper die and a lower die facing the upper die, which performs resin molding on a substrate; a die closing mechanism that closes the molding die; and a useless resin removing mechanism that removes useless resin formed on a resin-molded substrate, the useless resin removing mechanism including: two removing sections that remove the useless resin from the resin-molded substrate by pressing the useless resin of the resin-molded substrate, a substrate placement section that places a substrate section of the resin-molded substrate, a useless resin placement section that is disposed laterally to the substrate placement section, places useless resin of the resin-molded substrate, the two removing sections being independently movable in a vertical direction; and a guide plate that guides the useless resin to a useless resin housing section formed in a lower portion of the substrate placement section, the two removing sections being movable in a horizontal direction, the two removing sections each including: a substrate pressing section that presses and holds the substrate section of the resin-molded substrate placed on the substrate placement section; and a resin pressing section that is formed laterally to the substrate pressing section, and presses a different portion from a portion that, in plan view, is in contact with the useless resin and the useless resin placement section, with respect to the useless resin, each of three or more useless resins of the resin-molded substrate being removed by the resin pressing section of one of the two removing sections pressing the useless resin, and the removed useless resin falling due to gravity, the guide plate being disposed between the substrate placement section and the useless resin placement section, inclined downward from the useless resin placement section side toward the substrate placement section side, and guiding the useless resin falling due to gravity to the useless resin housing section.

2. The resin molding apparatus according to claim 1, wherein the two removing sections include: a first removing section whose resin pressing section is disposed laterally to the substrate pressing section; and a second removing section whose resin pressing section is disposed laterally to the substrate pressing section.

3. The resin molding apparatus according to claim 2, wherein the resin-molded substrate includes: a first resin-molded substrate having the useless resin formed laterally to the substrate section; and a second resin-molded substrate having the useless resin formed laterally to the substrate section.

4. The resin molding apparatus according to any one of claims 1 to 3, wherein the resin pressing section is capable of cooling the resin-molded substrate by jetting gas to the resin-molded substrate.

5. A resin molded article manufacturing method that manufactures a resin molded article using the resin molding apparatus according to any one of claims 1 to 4.

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