A deep processing system and method

Abstract

The present invention discloses a controlled depth processing system and method, wherein the system comprises: a processing module, a detection module and a control module, wherein the detection module is connected to the processing module and is used to output a processing signal based on whether the processing module contacts a target conductive layer in a workpiece to be processed; and the control module is connected to the detection module and the processing module respectively and is used to control the processing module to process the workpiece to be processed according to the processing signal, the height position and the moving state of the processing module. Thus, it is not necessary to collect the position data of the point array before the controlled depth milling of the PCB, but the cutting depth is adjusted in real time according to the processing signal of the detection module, thereby saving processing time, improving production efficiency, and having good real-time performance and high responsiveness.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit board manufacturing, and in particular to a controlled depth processing system and method. Background Art

[0002] The PCB (Printed Circuit Board) controlled deep milling process is a process in which a specific area of ​​the PCB is milled with a tool to remove the surface insulation layer 101 and expose the internal copper layer 103. Figure 1 As shown. Generally, the amount of copper layer 102 with a thickness of 18μm is controlled within 5μm. If the amount of cutting exceeds 5μm, it is called overcutting, and if it is less than 0μm, it is called undercutting. Ideally, the internal copper layer 103 is flat. However, the top and bottom surfaces of the PCB board may be warped, so the internal copper layer is also uneven. If the plane is milled at the same cutting depth, some areas will be overcut and some areas will not be cut, such as Figure 2 Therefore, it is necessary to improve the process so that the system can adjust the milling depth according to the warping conditions at different locations.

[0003] In order to solve this problem, the existing controlled depth milling process adopts the method of first measuring the Z-axis coordinates Z(x,y) of each point on the copper layer inside the PCB board with a probe (such as Figure 3 For example, the Z coordinate of point (x0, y0) is z(0,0). The CNC system performs interpolation fitting operations based on the XYZ axis data to interpolate the surface (such as Figure 4 As shown). The CNC system moves in the XYZ axis according to the position coordinates of each point on this surface. The accuracy of this solution depends on: (1) the sampling position interval of the probe. The smaller the sampling point interval, the higher the accuracy. (2) The quality of the interpolation algorithm. The better the interpolation algorithm, the closer the calculated surface is to the surface contour of the actual copper layer. However, there is a problem that this method is time-consuming and reduces production efficiency. In addition, the processing accuracy depends on the sampling accuracy. The smaller the interval between the sampling points, the higher the accuracy, but it also increases the total sampling time. Summary of the invention

[0004] The present invention provides a controlled depth processing system and method to solve the problems of long processing time and low efficiency in related technologies.

[0005] To solve the above problems, on the one hand, the present invention proposes a controlled depth processing system, including: a processing module, a detection module and a control module, the detection module is connected to the processing module, and is used to output a processing signal based on whether the processing module is in contact with the target conductive layer in the workpiece to be processed; the control module is respectively connected to the detection module and the processing module, and is used to control the processing module to process the workpiece to be processed according to the processing signal, the height position and the moving state of the processing module.

[0006] According to one embodiment of the present invention, the detection module includes a constant voltage source with internal resistance and a conductive cover plate, the constant voltage source includes: an oscillation signal source unit, an oscillation power supply unit, and a detection unit, the output end of the oscillation signal source unit is connected to the input end of the detection unit, the connection point between the detection unit and the oscillation power supply unit serves as the output end of the detection unit, the detection end of the detection unit is connected to the processing module, the output end of the detection unit is connected to the control module, and the conductive cover plate is located below the workpiece to be processed.

[0007] According to one embodiment of the present invention, the oscillation signal source unit includes: a first resistor, a second resistor, a third resistor, a first capacitor, a second capacitor, a first inverter, a second inverter and a third inverter; one end of the first resistor is connected to the input end of the first inverter, the output end of the first inverter is connected to one end of the second resistor, and the other end of the first resistor is connected to the other end of the second resistor; the input end of the second inverter is connected to the output end of the first inverter, the output end of the second inverter is connected to one end of the first capacitor, and the other end of the first capacitor is connected to the other end of the second resistor; the input end of the third inverter is connected to the output end of the second inverter, the output end of the third inverter is connected to one end of the second capacitor, the other end of the second capacitor is connected to the input end of the detection unit, and the third resistor is connected in parallel to both ends of the second capacitor.

[0008] According to an embodiment of the present invention, the detection unit includes: a first switch tube, a second switch tube, a third capacitor, a fourth capacitor, a fourth resistor, a fifth resistor, a sixth resistor, a first diode, a second diode and a third diode; the control end of the first switch tube is connected to the output end of the oscillation signal source unit, the drain of the first switch tube is connected to the processing module, and the source of the first switch tube is grounded; the source of the second switch tube is grounded, the drain of the second switch tube is connected to the processing module, the control end of the second switch tube is connected to one end of the fourth resistor, and the other end of the fourth resistor is connected to the first power supply; one end of the third capacitor is grounded, and the other end of the third capacitor is respectively connected to the cathode of the third diode and the cathode of the first diode, and serves as the output end of the detection unit; the anode of the third diode is grounded, the anode of the first diode is connected to the anode of the second diode, the anode of the second diode is connected to the control end of the second switch tube, and the cathode of the second diode is connected to the processing module; one end of the fifth resistor is connected to the other end of the third capacitor, the other end of the fifth resistor is connected to one end of the sixth resistor, the other end of the sixth resistor is grounded, and the fourth capacitor is connected in parallel at both ends of the sixth resistor.

[0009] According to one embodiment of the present invention, the oscillation power supply unit includes: an analog switch, a seventh resistor, an eighth resistor, a ninth resistor and a tenth resistor, one end of the analog switch is connected to the output end of the detection unit, and the other end of the analog switch is respectively connected to one end of the seventh resistor, one end of the eighth resistor, one end of the ninth resistor, and one end of the tenth resistor, and the other end of the seventh resistor, the other end of the eighth resistor, the other end of the ninth resistor, and the other end of the tenth resistor are all grounded.

[0010] To solve the above problems, the present invention proposes a depth-controlled processing method on the other hand, which is implemented based on the depth-controlled processing system described in any embodiment of the present invention. The processing method includes the following steps:

[0011] In the process of the processing module processing the workpiece to be processed, the processing signal generated by the processing module is obtained in real time; as well as the height position and movement state of the processing module;

[0012] The processing module is controlled to process the workpiece to be processed according to the processing signal, the height position and the moving state.

[0013] According to an embodiment of the present invention, controlling the processing module to process the workpiece to be processed according to the processing signal and the height position includes:

[0014] S1, control the processing module to move downward, and when a first signal is generated in the processing signal, record the first height position z of the processing module when the first signal is generated d ;

[0015] S2, at the first height position z d As a reference, the processing module is controlled to move downward to a preset depth;

[0016] S3, controlling the processing module to move upward while translating;

[0017] S4, when a second signal is generated in the processing signal, recording a second height position z of the processing module when the second signal is generated ui , where i = 1, 2, 3, ...;

[0018] S5, at the second height position z ui As a reference, the processing module is controlled to move downward to a preset depth and translate horizontally by a preset distance;

[0019] S6, repeat S3 to S5 until the processing of the workpiece is completed.

[0020] According to one embodiment of the present invention, the first signal is a signal generated when the processing module moves down to contact the target conductive layer of the workpiece to be processed; the second signal is a signal generated when the processing module leaves the target conductive layer of the workpiece to be processed.

[0021] According to an embodiment of the present invention, the voltage of the first signal is lower than the voltage of the second signal.

[0022] According to the control depth processing system and method proposed in the embodiment of the present invention, the system includes: a processing module, a detection module and a control module, wherein the detection module is connected to the processing module and is used to output a processing signal based on whether the processing module is in contact with the target conductive layer in the workpiece to be processed; the control module is respectively connected to the detection module and the processing module and is used to control the processing module to process the workpiece to be processed according to the processing signal, the height position and the moving state of the processing module. As a result, there is no need to collect the position data of the point array before the PCB control depth milling, but the cutting depth is adjusted in real time according to the processing signal of the detection module, which saves processing time, improves production efficiency, and has good real-time performance and high responsiveness.

[0023] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 It is a structural schematic diagram of the PCB board controlled deep milling process in the related technology;

[0026] Figure 2 It is a schematic diagram of the controlled deep washing process of the PCB board in the related art;

[0027] Figure 3 It is a coordinate diagram for detecting the Z-axis coordinates of each point on the copper layer of a PCB board in the related art;

[0028] Figure 4 It is the basis of related technology Figure 3 The detected coordinate diagram fits the copper layer surface schematic diagram in the PCB board;

[0029] Figure 5 is a block diagram of a controlled depth processing system proposed in an embodiment of the present invention;

[0030] Figure 6 is a schematic diagram of the processing process of the depth control processing system proposed in an embodiment of the present invention;

[0031] Figure 7 is a block diagram of a controlled depth processing system proposed in one embodiment of the present invention;

[0032] Figure 8 It is a circuit schematic diagram of a constant voltage source in a controlled deep processing system proposed by an embodiment of the present invention;

[0033] Fig. 9 is a flow chart of a controlled depth processing method proposed in an embodiment of the present invention;

[0034] Fig.10 is a schematic diagram of a processing path of a depth-controlled processing method proposed in an embodiment of the present invention;

[0035] Fig.11 It is a schematic diagram of a processing path of a depth-controlled processing method proposed in one embodiment of the present invention. DETAILED DESCRIPTION

[0036] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0037] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0038] Figure 5 FIG. 1 is a block diagram of a control depth processing system according to an embodiment of the present invention. Figure 5 and Figure 6 As shown, the controlled deep processing system 200 includes: a processing module 201, a detection module 202 and a control module 203. The detection module 202 is connected to the processing module 201, and is used to output a processing signal based on whether the processing module 201 is in contact with the target conductive layer 110 in the workpiece 100 to be processed; the control module 203 is respectively connected to the detection module 202 and the processing module 201, and is used to control the processing module 201 to process the workpiece 100 according to the processing signal, the height position and the moving state of the processing module 201.

[0039] It should be noted that the processing module 201 includes a processing spindle 2011 and a tool 2012 mounted on the spindle, wherein the control module 203 can control the z-axis movement of the spindle to drive the spindle 2011 to move, thereby driving the tool 2012 to move. In the related art, the control module 203 can obtain the height position and movement state of the processing module 201. When the processing module 201 contacts the target conductive layer 110 of the workpiece 100 to be processed, the detection module 202 outputs a first processing signal, and when the processing module 201 does not contact the target conductive layer 110 of the workpiece 100 to be processed, the detection module 202 outputs a second processing signal, and the first processing signal and the second processing signal are different.

[0040] For example, the processing module 201 contacts the target conductive layer 110 of the workpiece 100 to be processed. At this time, the detection module 202 outputs a first processing signal. The control module 203 controls the processing module 201 to continue moving downward (the height position has not reached the controlled depth, and the moving state is a downward state), horizontal (the height position has reached the controlled depth, and the moving state is a downward state) or upward (the height position has reached the controlled depth, and the moving state is a downward state; or the height position has not reached the controlled depth, and the moving state is an upward state) according to the first processing signal and the current height position and moving state of the processing module 201.

[0041] Alternatively, the processing module 201 is not in contact with the target conductive layer 110 of the workpiece 100 to be processed. At this time, the detection module 202 outputs a second processing signal, and the control module 203 controls the processing module 201 to move downward according to the second processing signal and the current height position and movement state of the processing module 201 (the height position is higher than the height of the target conductive layer 110 of the workpiece 100 to be processed, and the movement state is an upward state or a downward state).

[0042] Therefore, the detection module 202 can output a real-time processing signal according to the real-time status of the processing module 201 to determine whether the tool 2012 of the processing module 201 is in contact with the target conductive layer 110, so that the control module 203 can control the processing of the processing module 201 according to the processing signal, the height position and the moving status of the processing module 201, without collecting the position data of the point array of the workpiece to be processed in advance, saving processing time and improving production efficiency.

[0043] According to one embodiment of the present invention, Figure 6 and Figure 7 As shown, the detection module 202 includes a constant voltage source 2021 with internal resistance and a conductive cover plate 2022, wherein the constant voltage source 2021 includes: an oscillation signal source unit 211, an oscillation power supply unit 212 and a detection unit 213, wherein the output end of the oscillation signal source unit 211 is connected to the input end of the detection unit 213, the connection point between the detection unit 213 and the oscillation power supply unit 212 serves as the output end of the detection unit 213, the detection end of the detection unit 213 is connected to the processing module 201, the output end of the detection unit 213 is connected to the control module 203, and the conductive cover plate 2022 is located below the workpiece 100 to be processed.

[0044] It should be noted that when the processing module 201 processes the workpiece 100 and contacts the target conductive layer 110, that is, when the tool 2012 of the processing module 201 contacts the target conductive layer 110, since the detection end of the detection unit 213 is connected to the processing module 201, the target conductive layer 110 is provided with power. At this time, the target conductive layer 110 is charged and forms a capacitor with the conductive cover plate 2022, so that the detection unit 213 is equivalent to being connected to a load; when the tool 2012 of the processing module 201 does not contact the target conductive layer 110, the target conductive layer 110 is not charged, and the load connected to the detection unit 213 disappears; whether the detection unit 213 is connected to a load or not will cause the voltage at the output end of the detection unit 213 to change; therefore, the voltage output from the output end of the detection unit 213 can determine whether the processing module 201 touches the target conductive layer 110. Then, by obtaining the height position and movement state of the processing module 201 through the control module 203 itself, the processing module 201 can be controlled to process the workpiece 100.

[0045] The circuit structure of the constant voltage source 2021 is introduced below.

[0046] According to one embodiment of the present invention, Figure 8 As shown, the oscillation signal source unit 211 includes: a first resistor R1, a second resistor R2, a third resistor R3, a first capacitor C1, a second capacitor C2, a first inverter 2111, a second inverter 2112 and a third inverter 2113; one end of the first resistor R1 is connected to the input end of the first inverter 2111, the output end of the first inverter 2111 is connected to one end of the second resistor R2, and the other end of the first resistor R1 is connected to the other end of the second resistor R2; the output end of the second inverter 2112 is connected to the input end of the first inverter 2111, and the output end of the first inverter 2111 is connected to the input end of the second resistor R2. The input end of the third inverter 2113 is connected to the output end of the second inverter 2112, the output end of the second inverter 2113 is connected to one end of the second capacitor C2, the other end of the second capacitor C2 is connected to the input end of the detection unit 213, and the third resistor R3 is connected in parallel to both ends of the second capacitor C2.

[0047] According to one embodiment of the present invention, Figure 8As shown, the detection unit 213 includes: a first switch tube Q1, a second switch tube Q2, a third capacitor C3, a fourth capacitor C4, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a first diode D1, a second diode D2 and a third diode D3; the control end of the first switch tube Q1 is connected to the output end of the oscillation signal source unit 211, the drain of the first switch tube Q1 is connected to the processing module 201, and the source of the first switch tube Q1 is grounded; the source of the second switch tube Q2 is grounded, the drain of the second switch tube Q2 is connected to the processing module 201, the control end of the second switch tube Q2 is connected to one end of the fourth resistor R4, and the other end of the fourth resistor R4 is connected to the first power supply VCC connection; one end of the third capacitor C3 is grounded, and the other end of the third capacitor C3 is respectively connected to the cathode of the third diode D3 and the cathode of the first diode D1, and serves as the output end of the detection unit 213; the anode of the third diode D3 is grounded, the anode of the first diode D1 is connected to the anode of the second diode D2, the anode of the second diode D2 is connected to the control end of the second switch tube Q2, and the cathode of the second diode D2 is connected to the processing module 201; one end of the fifth resistor R5 is connected to the other end of the third capacitor C3, the other end of the fifth resistor R5 is connected to one end of the sixth resistor R6, the other end of the sixth resistor R6 is grounded, and the fourth capacitor C4 is connected in parallel across the sixth resistor R6.

[0048] According to one embodiment of the present invention, the oscillation power supply unit 212 includes: an analog switch 2121, a seventh resistor R7, an eighth resistor R8, a ninth resistor R9 and a tenth resistor R10, one end of the analog switch 2121 is connected to the output end of the detection unit 213, and the other end of the analog switch 2121 is respectively connected to one end of the seventh resistor R7, one end of the eighth resistor R8, one end of the ninth resistor R9, and one end of the tenth resistor R10, and the other end of the seventh resistor R7, the other end of the eighth resistor R8, the other end of the ninth resistor R9, and the other end of the tenth resistor R10 are all grounded.

[0049] Among them, the oscillation signal source unit 211 is used to generate an oscillation signal, and the oscillation signal is divided into a high level and a low level. The oscillation signal enters from the first switch tube Q1. When the oscillation signal is at a high level, the first switch tube Q1 is turned on, and the signal of SPDL is pulled low; when the oscillation signal is at a low level, the first switch tube Q1 is turned off, and SPDL is divided by the fourth resistor R4 and four 3.9k resistors (the seventh resistor R7, the eighth resistor R8, the ninth resistor R9, and the tenth resistor R10), showing a high level. It should be noted that the signal at the output end of the detection unit 213 is a constant voltage obtained by deriving the signal from the SPDL end (the connection end of the processing module 201) and integrating it through the third capacitor C3.

[0050] It can be understood that the selection signal of the analog switch 2121 is always high. When the tool 2012 does not contact the target conductive layer 110, the signal at the output end of the detection unit 213 is grounded through the fifth resistor R5 and the sixth resistor R6, which is equivalent to a load loop of a 12V power supply including a third capacitor C3 and four 3.9k resistors (the seventh resistor R7, the eighth resistor R8, the ninth resistor R9, and the tenth resistor R10). So far, this part can be regarded as an oscillating power supply with a large internal resistance. At this time, the voltage of the signal at the output end of the detection unit 213 is about 11V. When the tool 2012 contacts the target conductive layer 110, that is, one more load is connected at the SPDL end, then the voltage allocated to the internal resistance part of the constant voltage source 2021 will decrease, that is, the voltage of the signal at the output end of the detection unit 213 will decrease, and the voltage of the signal at the output end of the detection unit 213 will drop to about 9V. According to this principle, according to the voltage of the signal at the output end of the detection unit 213, it can be judged that the tool 2012 contacts the target conductive layer 110.

[0051] In addition, it should be noted that the SPDL end in the detection unit 213 is connected to the PE end of the main shaft.

[0052] Based on the above principle, the present invention proposes a depth-controlled processing method on the other hand. The processing method is implemented based on the depth-controlled processing system of any embodiment of the present invention. The processing method includes the following steps:

[0053] When the processing module is processing the workpiece, the processing signal generated by the processing module is obtained in real time; as well as the height position and movement state of the processing module;

[0054] The processing module is controlled to process the workpiece according to the processing signal, height position and movement status.

[0055] It should be noted that the workpiece to be processed may be a PCB board.

[0056] Specifically, Fig. 9 As shown, the processing module is controlled according to the processing signal and the height position to process the workpiece, including:

[0057] S1, control the processing module to move downward, when the first signal is generated in the processing signal, record the first height position z of the processing module when the first signal is generated d ;

[0058] S2, at the first height position z d As a benchmark, control the processing module to move down to a preset depth;

[0059] S3, controlling the processing module to move horizontally and upward at the same time;

[0060] S4, when the second signal is generated in the processing signal, record the second height position z of the processing module when the second signal is generated ui , where i = 1, 2, 3, ...;

[0061] S5, at the second height position z ui As a reference, the processing module is controlled to move downward to a preset depth and horizontally to a preset distance;

[0062] S6, repeat S3 to S5 until the processing of the workpiece is completed.

[0063] The first signal is a signal generated when the processing module moves down to contact the target conductive layer of the workpiece to be processed; the second signal is a signal generated when the processing module leaves the target conductive layer of the workpiece to be processed. Based on the system embodiment, it can be known that the voltage of the first signal is lower than the voltage of the second signal.

[0064] That is to say, when the processing module processes the workpiece, the control module controls the processing module to move downward, and the detection module detects in real time whether the processing module contacts the target conductive layer. When the processing signal output by the detection module generates a first signal, that is, the processing signal output by the detection module when the processing module contacts the target conductive layer (for example, 9V). At this time, the control module believes that the processing module contacts the target conductive layer and records the current first height position z of the processing module. d。 Then the processing module is controlled to move down to a preset depth (the preset depth is set in advance in the control module, relative to the first height position z d Then move down to the preset depth). After moving down to the preset depth, the processing module is controlled to move up while being translated. When the second signal is generated in the processing signal, that is, the processing signal (for example, 12V) output when the detection module detects that the processing module leaves the target conductive layer. At this time, the control module believes that the processing module has left the target conductive layer and needs to control the processing module to move down. And it is necessary to record the second height position z of the processing module when the second signal is generated. u1 , with the second height position z u1 As a reference, the processing module is controlled to move down to a preset depth, and at the same time, the processing module is controlled to translate along a preset path for a preset distance. Then, the processing module is controlled to move up and translate at the same time. When a second signal is generated in the processing signal, the control module considers that the processing module has left the target conductive layer, and needs to control the processing module to move down and translate at the same time. It is also necessary to record the second height position z of the processing module when the second signal is generated. u2 , with the second height position z u2 As a benchmark, the processing module is controlled to move down to a preset depth, and this is repeated until the workpiece is processed.

[0065] More specifically, if Fig.10 and Fig.11As shown, when the tool just contacts or leaves the target conductive layer 110, the voltage at the output end of the detection unit will jump, and the detection module can immediately sense it and inform the control module in the CNC system. The control module in the CNC system can determine the position of the tool when it just contacts the target conductive layer 110 and memorize the position data. The control process is as follows: Assuming that the milling depth is d microns, the spindle descends, and the Z-axis position when the tool just contacts the target conductive layer 110 is used as a reference, and d microns are cut downward; then the spindle is controlled to cut s millimeters horizontally and slowly lift the tool. When the tool leaves the target conductive layer 110, the control module in the CNC system remembers the position at this time, and then cuts down d microns first, and controls the spindle to cut s millimeters horizontally. According to this logic, depth milling is performed.

[0066] During this process, the control module controls the height position and movement status of the processing module. The detection module detects whether the processing module contacts the target conductive layer and transmits the processing signal to the control module. The control module can ensure that the processing module is always processing on the target conductive layer. There is no need to collect the position data of the point array of the workpiece to be processed in advance, which saves processing time and improves production efficiency.

[0067] According to the control-deep processing system and method proposed in the embodiment of the present invention, the system includes: a processing module, a detection module and a control module, the detection module is connected to the processing module, and is used to output a processing signal based on whether the processing module contacts the target conductive layer in the workpiece to be processed; the control module is respectively connected to the detection module and the processing module, and is used to control the processing module to process the workpiece to be processed according to the processing signal, the height position and the moving state of the processing module. As a result, there is no need to collect the position data of the point array before the PCB control-deep milling, but the cutting depth is adjusted in real time according to the processing signal of the detection module, which saves processing time, improves production efficiency, and has good real-time performance and high responsiveness.

[0068] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0069] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A controlled deep processing system, characterized in that: include: A processing module, a detection module and a control module, wherein the detection module is connected to the processing module and is used to output a processing signal based on whether the processing module is in contact with a target conductive layer in a workpiece to be processed; the control module is respectively connected to the detection module and the processing module and is used to control the processing module to process the workpiece to be processed according to the processing signal, the height position and the moving state of the processing module; Among them, the height position includes the Z-axis coordinate position of the processing module in the spatial coordinate system at the moment when the processing module contacts the target conductive layer in the workpiece to be processed; and the Z-axis coordinate position of the processing module in the same spatial coordinate system at the moment when the processing module changes from the contact state with the target conductive layer to the state of leaving the target conductive layer during the subsequent processing process.

2. The controlled depth processing system according to claim 1, characterized in that: The detection module includes a constant voltage source with internal resistance and a conductive cover plate, the constant voltage source includes: an oscillation signal source unit, an oscillation power supply unit and a detection unit, the output end of the oscillation signal source unit is connected to the input end of the detection unit, the connection point between the detection unit and the oscillation power supply unit serves as the output end of the detection unit, the detection end of the detection unit is connected to the processing module, the output end of the detection unit is connected to the control module, and the conductive cover plate is located below the workpiece to be processed.

3. The controlled depth processing system according to claim 2, characterized in that: The oscillation signal source unit includes: a first resistor, a second resistor, a third resistor, a first capacitor, a second capacitor, a first inverter, a second inverter and a third inverter; one end of the first resistor is connected to the input end of the first inverter, the output end of the first inverter is connected to one end of the second resistor, and the other end of the first resistor is connected to the other end of the second resistor; the input end of the second inverter is connected to the output end of the first inverter, the output end of the second inverter is connected to one end of the first capacitor, and the other end of the first capacitor is connected to the other end of the second resistor; the input end of the third inverter is connected to the output end of the second inverter, the output end of the third inverter is connected to one end of the second capacitor, and the other end of the second capacitor is connected to the input end of the detection unit, and the third resistor is connected in parallel to both ends of the second capacitor.

4. The controlled depth processing system according to claim 2, characterized in that: The detection unit includes: a first switch tube, a second switch tube, a third capacitor, a fourth capacitor, a fourth resistor, a fifth resistor, a sixth resistor, a first diode, a second diode and a third diode; the control end of the first switch tube is connected to the output end of the oscillation signal source unit, the drain of the first switch tube is connected to the processing module, and the source of the first switch tube is grounded; the source of the second switch tube is grounded, the drain of the second switch tube is connected to the processing module, the control end of the second switch tube is connected to one end of the fourth resistor, and the other end of the fourth resistor is connected to the first power supply; one end of the third capacitor is grounded, and the other end of the third capacitor is respectively connected to the cathode of the third diode and the cathode of the first diode, and serves as the output end of the detection unit; the anode of the third diode is grounded, the anode of the first diode is connected to the anode of the second diode, the anode of the second diode is connected to the control end of the second switch tube, and the cathode of the second diode is connected to the processing module; one end of the fifth resistor is connected to the other end of the third capacitor, the other end of the fifth resistor is connected to one end of the sixth resistor, the other end of the sixth resistor is grounded, and the fourth capacitor is connected in parallel to both ends of the sixth resistor.

5. The controlled depth processing system according to claim 2, characterized in that: The oscillation power supply unit includes: an analog switch, a seventh resistor, an eighth resistor, a ninth resistor and a tenth resistor, one end of the analog switch is connected to the output end of the detection unit, and the other end of the analog switch is respectively connected to one end of the seventh resistor, one end of the eighth resistor, one end of the ninth resistor, and one end of the tenth resistor, and the other ends of the seventh resistor, the eighth resistor, the ninth resistor, and the tenth resistor are all grounded.

6. A controlled depth processing method, characterized in that: Based on the controlled depth processing system according to any one of claims 1 to 5, the processing method comprises the following steps: In the process of the processing module processing the workpiece to be processed, the processing signal generated by the processing module is obtained in real time; as well as the height position and movement state of the processing module; Controlling the processing module to process the workpiece to be processed according to the processing signal, the height position and the moving state; Among them, the height position includes the Z-axis coordinate position of the processing module in the spatial coordinate system at the moment when the processing module contacts the target conductive layer in the workpiece to be processed; and the Z-axis coordinate position of the processing module in the same spatial coordinate system at the moment when the processing module changes from the contact state with the target conductive layer to the state of leaving the target conductive layer during the subsequent processing process.

7. The controlled depth processing method according to claim 6, characterized in that: The controlling the processing module to process the workpiece to be processed according to the processing signal and the height position comprises: S1, control the processing module to move downward, and when a first signal is generated in the processing signal, record the first height position z of the processing module when the first signal is generated d ; S2, at the first height position z d As a reference, the processing module is controlled to move downward to a preset depth; S3, controlling the processing module to move upward while translating; S4, when a second signal is generated in the processing signal, recording a second height position z of the processing module when the second signal is generated ui , where i = 1, 2, 3, ...; S5, at the second height position z ui As a reference, the processing module is controlled to move downward to a preset depth and translate horizontally by a preset distance; S6, repeat S3 to S5 until the processing of the workpiece is completed.

8. The depth-controlled processing method according to claim 7, characterized in that: The first signal is a signal generated when the processing module moves down to contact the target conductive layer of the workpiece to be processed; the second signal is a signal generated when the processing module leaves the target conductive layer of the workpiece to be processed.

9. The depth-controlled processing method according to claim 8, characterized in that: A voltage of the first signal is lower than a voltage of the second signal.

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