A drying device and its drying oven

Abstract

This invention discloses a drying device and its oven, relating to the field of silicon wafer manufacturing technology, to solve the problems of uneven airflow leading to wet wafers, long drying times, and high energy consumption in the current silicon wafer drying process. The oven is used to dry silicon wafers, which are arranged inside the oven along a first direction. The oven includes: a box body; the silicon wafers are inserted into and housed within the box body by means of a limiting member; the box body is provided with a first air inlet and an air outlet; the first air inlet extends along the first direction; in use, the oven delivers a drying medium through the first air inlet to at least the position where the silicon wafers are inserted into the limiting member. The drying device includes the oven described in the above technical solution.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer manufacturing technology, and more particularly to a drying device and its oven. Background Technology

[0002] In the photovoltaic industry, cut silicon wafers need to undergo a cleaning process to remove residual silicon powder, organic matter, metal ions, and other contaminants from their surface. After cleaning, they must be dried in a drying machine before being sent to the next stage. Drying equipment typically uses an oven to hold the silicon wafers and uses hot air to dry them. If the oven's air inlet or outlet structure is unreasonable, the internal airflow distribution will be poor, causing areas with low airflow to remain wet and unable to dry. Furthermore, temperature gradients can easily form within the oven, resulting in uneven internal temperatures. To dry the silicon wafers, the heating temperature must be increased, and excessively high set temperatures also exacerbate energy consumption. Summary of the Invention

[0003] The purpose of this invention is to provide a drying device and its oven to solve the problems of uneven airflow leading to wet wafers, long drying time, and high energy consumption in the current silicon wafer drying process.

[0004] In a first aspect, the present invention provides an oven for drying silicon wafers, the silicon wafers being disposed within the oven along a first direction; the oven includes: a box body; the silicon wafers being inserted into a limiting member and housed within the box body; the box body is provided with a first air inlet and an air outlet; the first air inlet extends along the first direction; in the oven's operating state, the drying medium is conveyed through the first air inlet to at least the position where the limiting member holds the silicon wafers.

[0005] In one possible implementation, the oven further includes a second air inlet on the oven body, the second air inlet extending along a first direction or a second direction, the second direction forming a first preset angle with the first direction; when the oven is in use, the drying medium is delivered to the silicon wafer through the second air inlet.

[0006] In one possible implementation, both the first air inlet and the second air inlet are located on the top of the enclosure; if there are multiple first air inlets, the second air inlet is located between two adjacent first air inlets; and / or, the first air inlet is located on a side of the enclosure adjacent to the top, and the second air inlet is located on the top of the enclosure.

[0007] In one possible implementation, the air outlet is located on the bottom surface of the housing and / or on the side near the bottom surface, and the cross section of the housing on the side near the air outlet is less than or equal to the cross section on the side near the first air inlet.

[0008] In one possible implementation, the enclosure includes at least one removable wall.

[0009] In one possible implementation, the limiting member is a flower basket, which includes insert members arranged opposite to each other. Silicon wafers are spaced apart in the insert members along a first direction. The length direction of the insert members is parallel to the first direction. The first air inlet covers the insert members along the orthographic projection of a third direction. The third direction forms a second preset angle with the first direction.

[0010] In one possible implementation, the first air inlet is located at the top of the housing, and the housing contains multiple flower baskets.

[0011] The top of the box is provided with multiple first air inlets, and each insert piece has a corresponding first air inlet above it; when multiple flower baskets are arranged in sequence along the second direction, the extension length of each first air inlet in the first direction is greater than or equal to the length of the insert piece, and the extension length of each first air inlet in the second direction is greater than or equal to the width of the insert piece.

[0012] Alternatively, the top of the box is provided with multiple first air inlets, and each first air inlet corresponds to one of the multiple insert pieces located on the same straight line. When multiple flower baskets are arranged in an array along the first and second directions, the extension length of each first air inlet in the first direction is greater than or equal to the sum of the lengths of the multiple insert pieces.

[0013] In one possible implementation, the second air inlet is located at the top of the housing, and the housing contains multiple flower baskets.

[0014] The top of the housing is provided with multiple second air inlets. The second air inlets extend along the first direction. Each basket corresponds to a second air inlet on the housing above the silicon wafer insertion position. When multiple baskets are arranged sequentially along the second direction, or when multiple baskets are arranged in an array along the first and second directions, the extension length of each second air inlet in the first direction is greater than or equal to the length of the insert.

[0015] Alternatively, the top of the box is provided with multiple second air inlets. Each basket corresponds to multiple second air inlets on the box above the silicon wafer insertion position. The second air inlets extend along the second direction. The length of each second air inlet extending along the second direction is less than or equal to the vertical distance between the two insert pieces included in the same basket.

[0016] Alternatively, the top of the box is provided with multiple second air inlets, which extend along the first direction. Each of the multiple flower baskets located on the same straight line corresponds to a second air inlet. When the multiple flower baskets are arranged in an array along the first and second directions, the extension length of each second air inlet in the first direction is greater than or equal to the sum of the lengths of the multiple insert pieces.

[0017] Alternatively, when the second air inlet extends along the second direction, the length of each second air inlet extending in the second direction is less than or equal to the vertical distance between the flower baskets located at both ends.

[0018] With the above technical solution, the chamber is equipped with a corresponding first air inlet at the location where the silicon wafer is inserted by the corresponding limiting component. The drying medium is delivered to the silicon wafer location through the first air inlet, thereby achieving targeted airflow to the original dead zones and further homogenizing the airflow distribution around the silicon wafer. Therefore, during the silicon wafer drying process in the oven, the drying quality of the silicon wafers can be guaranteed without increasing the drying temperature, preventing wet wafers and shortening the drying time. Simultaneously, since the drying temperature does not need to be increased, the energy consumption required for the drying process can be reduced.

[0019] In a second aspect, the present invention also provides a drying apparatus, comprising a drying medium supply device and an oven as described in the first aspect or any possible implementation thereof, wherein the air outlet pipe of the drying medium supply device is connected to a first air inlet included in the oven body; and the air inlet pipe of the drying medium supply device is connected to the air outlet included in the oven body.

[0020] In one possible implementation, a first filter assembly is provided in the air outlet duct, and / or a second filter assembly is provided in the air inlet duct.

[0021] In one possible implementation, the first filter assembly is a labyrinthine filter assembly, which includes a plurality of removable first filter plates; and / or, the second filter assembly includes at least one removable second filter plate.

[0022] When the above technical solution is adopted, the beneficial effects of the drying equipment provided by the present invention are the same as the beneficial effects of the drying oven described in the first aspect or any possible implementation of the first aspect, and will not be repeated here. Attached Figure Description

[0023] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0024] Figure 1 A schematic diagram of the structure of an oven provided for the prior art;

[0025] Figure 2 for Figure 1 The diagram shows the airflow distribution of the oven.

[0026] Figure 3 This is a schematic diagram of the structure of an oven provided in an embodiment of the present invention;

[0027] Figure 4a and Figure 4b for Figure 3 A cross-sectional schematic diagram;

[0028] Figures 5a to 5d for Figure 3 Top view;

[0029] Figure 6 for Figure 3 The diagram shows the airflow distribution of the oven.

[0030] Figure 7 This is a schematic diagram of the structure of a drying device provided in an embodiment of the present invention;

[0031] Figure 8 This is a schematic diagram of a drying medium supply device provided in an embodiment of the present invention.

[0032] Figure label:

[0033] 100-Oven, 101-Air inlet, 200-Oven, 210-Box body, 201-First air inlet, 202-Second air inlet, 220-Air outlet, 203-First air outlet, 204-Second air outlet, 300-Limiting component / basket, 301-Limiting part / insertion component, 302-Supporting part / basket bottom rod, 400-Silicon wafer, 500-Drying medium supply device, 501-First filter assembly, 502-Second filter assembly, 503-Induced air assembly, 504-Heating assembly, 505-First filter plate. Detailed Implementation

[0034] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0035] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified. "Several" means one or more, unless otherwise explicitly specified.

[0037] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0038] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0039] like Figure 1 As shown, the oven 100 of existing drying equipment generally has a rectangular or inverted frustum shape. The air inlet 101 is usually located on the top surface of the oven 100, and the air inlet 101 is mostly an array of holes. That is to say, the air inlet 101 is arbitrarily set. At this time, due to the densely packed silicon wafers 400 inside, and the close contact between the limiting component and the silicon wafers, the air velocity distribution inside the oven 100 is uneven, such as... Figure 2 As shown, high airflow is concentrated around the perimeter of the oven, while the central area of ​​oven 100 is essentially windless. Silicon wafers in this windless area are difficult to dry, resulting in wet wafers and increased drying time. To address the wet wafer problem caused by uneven airflow, the temperature of oven 100 is typically increased, for example, by raising the temperature of the drying medium. However, this leads to high drying energy consumption. Furthermore, due to localized high temperatures, the limiting components near the heating elements can react with the silicon wafers, causing contamination.

[0040] like Figure 3 , Figure 4a and Figure 4b As shown, an embodiment of the present invention provides an oven 200. The oven 200 is used to dry silicon wafers 400, with multiple silicon wafers 400 arranged sequentially along a first direction X and disposed within the oven 200. The oven 200 includes: a housing 210; the silicon wafers 400 are inserted into a limiting member 300 and housed within the housing 210; the housing 210 is provided with a first air inlet 201 and an air outlet 220; the first air inlet 201 extends along the first direction X; in use, the oven 200 delivers a drying medium through the first air inlet 201 to at least the position where the limiting member 300 inserts the silicon wafers 400.

[0041] The aforementioned limiting member 300 can be any component, structure, or tooling that can confine the silicon wafer 400 within the oven 200. For example, the limiting member 300 can be a basket 300 or a slot. The basket 300 or slot can be placed inside the oven 200, detachably fixed inside the oven 200, or non-detachably fixed inside the oven 200. Its specific implementation is not limited. The limiting member 300 serves to support and limit the silicon wafer 400, generally including a supporting portion 302 at the bottom of the silicon wafer and a limiting portion 301 on the side. Generally, the contact area between the limiting member 300 and the silicon wafer 400 should be as small as possible. For example, contact with the bottom surface and two sides of the square silicon wafer 400 is sufficient to achieve the function of limiting and supporting the silicon wafer 400.

[0042] The aforementioned first air inlet 201 is connected to the air outlet duct of the drying medium supply device. When the drying medium is introduced into the first air inlet 201, it is guided by the first air inlet 201 and transported to the position where the limiting member 300 receives the silicon wafer 400, which may be the corresponding position of the limiting part 301. During this process, the drying medium is transported at least to the position where the limiting member 300 receives the silicon wafer 400. That is to say, the drying medium can sequentially contact the top surface and side surface of the silicon wafer 400, and enter the area between the silicon wafers 400 through the top surface and side surface, so that the drying medium is distributed among multiple silicon wafers 400. In short, the position of the first air inlet 201 ensures that the drying medium is transported to the limiting member 300, ensuring that the position where the silicon wafer 400 contacts the limiting member 300 has the function of drying medium.

[0043] The drying medium can be commonly used air, or other gases, such as inert gases like nitrogen. The drying medium is provided or generated by a drying medium supply device, for example, by heating air with a heating component and then conveying it to the first air inlet 201 using an induced draft assembly.

[0044] like Figure 3 , Figure 4a and Figure 4b As shown, in one possible implementation, the oven 200 may further include a second air inlet 202 formed on the chamber 210. The second air inlet 202 extends along a first direction X or a second direction Y, with the second direction Y forming a first preset angle with the first direction X. In use, the oven 200 delivers a drying medium to the silicon wafer 400 through the second air inlet 202. The aforementioned first preset angle can be from 80° to 100°, for example, 90° as shown in the figure.

[0045] The second air inlet 202 can be positioned on the top surface of the silicon wafer 400 to deliver the drying medium. The airflow direction of the second air inlet 202 is parallel to that of the silicon wafer 400. The drying medium exiting the second air inlet 202 is delivered to the top surface of the silicon wafer 400 and then flows to the area between the silicon wafers 400. Therefore, combined with the guiding effect of the first air inlet 201 and the second air inlet 202, the drying medium is delivered to at least five of the six surfaces of the silicon wafer 400, ensuring sufficient heat exchange between the silicon wafer 400 and the drying medium, and guaranteeing that each silicon wafer 400 is effectively dried.

[0046] like Figure 3 , Figure 4a and Figure 4b As shown, in one possible implementation, both the first air inlet 201 and the second air inlet 202 are located on the top of the housing 210; when there are multiple first air inlets 201, the second air inlet 202 is located between two adjacent first air inlets 201; and / or, the first air inlet 201 is located on a side of the housing 210 adjacent to the top, and the second air inlet 202 is located on the top of the housing 210.

[0047] The aforementioned first air inlet 201 can be located either on the top of the housing 210 or on the side adjacent to the top, wherever it can deliver the drying medium to the limiting member 300 and the silicon wafer 400. In practical applications, to simplify the design of the drying medium delivery pipeline between the drying medium supply device 500 and the first air inlet 201, the connection between the oven 200 and the drying medium supply device 500 is simplest when both the first air inlet 201 and the second air inlet 202 are located on the top of the housing 210, and the resistance encountered during the delivery of the drying medium is minimized.

[0048] like Figure 3 , Figure 4a and Figure 4b As shown, in one possible implementation, the air outlet 220 is located on the bottom surface and / or the side surface near the bottom surface of the housing 210, and the cross-section of the housing 210 on the side near the air outlet 220 is less than or equal to the cross-section on the side near the first air inlet 201. For example, the housing 210 can be an inverted frustum structure, and the air outlet 220 is located on the bottom surface and / or the side surface near the bottom surface of the inverted frustum structure. When the housing 210 of the oven 200 is an inverted frustum structure, the portion of the housing 210 forming the air outlet 220 has a conical shape, such as... Figure 4aAs shown in the dashed conical frame A area, when the drying medium is conveyed to the side near the bottom, the side (the side where the second air outlet 204 is located) can cause the medium in the oven 200 to flow upwards, thereby conveying the drying medium to the bottom surface of the silicon wafer 400, so that all six sides of the silicon wafer 400 can exchange heat with the drying medium. The speed distribution inside the oven 200 is more uniform. The air outlet 220 may include a first air outlet 203 located on the bottom surface of the inverted cone structure and a second air outlet 204 located on the side. The second air outlet 204 may be an array of holes, with the holes protruding 0.1cm to 4cm from the side of the oven 200. The protruding second air outlet 204 facilitates the removal of impurities from the silicon wafer 400.

[0049] In practical applications, silicon wafers 400 are densely placed in the oven 200. To improve the efficiency of the oven 200, a basket 300 is typically used to hold the silicon wafers 400 before placing the basket 300 in the oven 200. In this case, the basket 300 can be understood as an implementation of the limiting member 300 described in the above technical solution. The basket 300 includes oppositely arranged insert members 301. The silicon wafers 400 are inserted into the basket 300 at intervals along the first direction X via the insert members 310. The length direction of the insert members 301 is parallel to the first direction X. The first air inlet 201, with its orthographic projection along the third direction Z, covers the insert members 301. The third direction Z forms a second preset angle with the first direction X. The second preset angle can be between 80° and 100°, for example, 90°. For ease of understanding, the following example uses a flower basket 300 as a limiting component 300. However, this is not a limitation on the limiting component 300 or the oven 200; the limiting component 300 can also be a detachable slot or other component. Therefore, when there are many silicon wafers 400, the number of flower baskets 300 placed inside the oven 200 will also be correspondingly large.

[0050] like Figure 4a and Figure 4b As shown, the first air inlet 201 is configured according to the placement density of the flower baskets 300 inside the oven 200, for example, as Figure 4a As shown, when multiple flower baskets 300 are placed inside the oven 200, the distance between two flower baskets 300 is small. In this case, the two first air inlets 201 corresponding to the two adjacent insert pieces 301 of the two flower baskets 300 can be merged to form a wider first air inlet 201. For example, as... Figure 4bAs shown, when fewer flower baskets 300 are placed in the oven 200, the distance between two flower baskets 300 is large. In this case, the two first air inlets 201 corresponding to the two adjacent insert pieces 301 of the two flower baskets 300 are independently set. Corresponding to the number of flower baskets 300, the wall in the oven 200 where the first air inlets 201 are located, such as the top plate, can be detachably connected. Depending on the specific arrangement of the flower baskets 300, multiple top plates with different first air inlets 201 can be replaced. Therefore, adjustments can be made according to the actual number of flower baskets 300 to obtain a better drying effect.

[0051] like Figure 3 , Figure 4a and Figure 4b As shown, when both the first air inlet 201 and the second air inlet 202 are located on the top of the housing 210, a basket 300 is correspondingly disposed on the two first air inlets 201 and at least one second air inlet 202. This ensures that the silicon wafers 400 on each basket 300 can be dried by the drying medium output from the first air inlet 201 and the second air inlet 202.

[0052] like Figures 5a to 5d As shown, in one possible implementation, the orthographic projection of the first air inlet 201 along its normal direction covers the insert 301. There are many shapes that can achieve the first air inlet 201 covering the insert 301, and the embodiments of the present invention are not limited thereto. For example, the shapes of the first air inlet 201 and the second air inlet 202 can be rectangular, wherein the length of the first air inlet 201 along the first direction X is slightly longer than the length of the insert 301 by 1cm-10cm. The width of the first air inlet 201 along the second direction Y is slightly wider than the width of the adjacent insert 301 by 0-10cm. The length of the second air inlet 202 along the first direction X is slightly longer than the length of the insert 301 by 0-5cm, and its width is greater than or equal to the width of the basket bottom rod 302. When the first air inlet 201 covers the insert 301 along its normal direction, it can ensure that the drying medium can be transported to the position where the insert 301 receives the silicon wafer 400, and also to the side of the silicon wafer 400, so that the contact part between the silicon wafer 400 and the basket 300 can contact the drying medium, thereby achieving overall drying of the silicon wafer 400.

[0053] like Figures 5a to 5d As shown, in one possible implementation, the first air inlet 201 can be opened on the top of the box 210, and the box 210 contains multiple flower baskets 300. In this case, the first air inlet 201, in each of the following cases, can achieve the effect of uniform wind speed in the above embodiment.

[0054] For example, such as Figure 5aAs shown, the top of the housing 210 is provided with multiple first air inlets 201, and each insert 301 has a corresponding first air inlet 201 above it. When multiple flower baskets 300 are arranged sequentially along the second direction Y, the extension length of each first air inlet 201 in the first direction X is greater than or equal to the length of the insert 301, and the extension length of each first air inlet 201 in the second direction Y is greater than or equal to the width of the insert 301. At this time, there is only one flower basket 300 along the first direction X, and multiple flower baskets 300 along the second direction Y.

[0055] For example, such as Figure 5b As shown, the top of the housing 210 is provided with multiple first air inlets 201. Each first air inlet 201 corresponds to a single insert 301 located on the same straight line. When multiple flower baskets 300 are arranged in an array along the first direction X and the second direction Y, the extension length of each first air inlet 201 in the first direction X is greater than or equal to the sum of the lengths of the multiple inserts 301. At this time, there are at least two single flower baskets 300 along the first direction X, and multiple flower baskets 300 along the second direction Y.

[0056] In one possible implementation, the second air inlet 202 is located at the top of the housing 210, which contains multiple flower baskets 300. The second air inlet 202 can be arranged in various ways; each of the following examples can achieve the effect of uniform airflow as described in the above embodiment.

[0057] For example, such as Figure 5a As shown, the top of the housing 210 is provided with multiple second air inlets 202. The second air inlets 202 extend along the first direction X. Each basket 300 corresponds to a second air inlet 202 on the housing 210 above the position of the silicon wafer 400. When the multiple baskets 300 are arranged sequentially along the second direction Y, or when the multiple baskets 300 are arranged in an array along the first direction X and the second direction Y, the extension length of each second air inlet 202 in the first direction X is greater than or equal to the length of the insert 301.

[0058] like Figure 5c As shown, the top of the housing 210 is provided with multiple second air inlets 202. Each basket 300 corresponds to a position above the silicon wafer 400 on the housing 210 with multiple second air inlets 202. The second air inlets 202 extend along the second direction Y, and the extension length of each second air inlet 202 along the second direction Y is less than or equal to the vertical distance between the two insert pieces 301 included in the same basket 300. At this time, there is only one basket 300 along the first direction X, and multiple baskets 300 along the second direction Y.

[0059] For example, such as Figure 5bAs shown, the top of the housing 210 is provided with multiple second air inlets 202. Each second air inlet 202 extends along a first direction X. Above each of the multiple flower baskets 300 located on the same straight line corresponds to a second air inlet 202. When the multiple flower baskets 300 are arranged in an array along the first direction X and the second direction Y, the extension length of each second air inlet 202 in the first direction X is greater than or equal to the sum of the lengths of the multiple insert pieces 301. At this time, along the first direction X, there are at least two single-piece flower baskets 300, and along the second direction Y, there are multiple flower baskets 300.

[0060] like Figure 5d As shown, when the second air inlet 202 extends along the second direction Y, the length of each second air inlet 202 extending along the second direction Y is less than or equal to the vertical distance between the flower baskets 300 at both ends. At this time, there are at least two single flower baskets 300 along the first direction X, and multiple flower baskets 300 along the second direction Y.

[0061] like Figures 5a to 5d As shown, it should be understood that the above description of the arrangement of the first air inlet 201 and the second air inlet 202 is only presented as a possible implementation and does not limit the specific shape, size, etc. of the first air inlet 201 and the second air inlet 202.

[0062] like Figure 6 As shown, with the above technical solution, the chamber 210 has a corresponding first air inlet 201 at the position where the silicon wafer 400 is inserted by the corresponding limiting member 300. The drying medium is delivered to the position where the silicon wafer 400 is inserted by the limiting member 300 through the first air inlet 201, thereby achieving targeted air delivery to the original dead zone of airflow and further homogenizing the airflow distribution around the silicon wafer 400. Therefore, when the silicon wafer 400 is dried in the oven 200, the drying quality of the silicon wafer 400 can be guaranteed without increasing the drying temperature, preventing wet wafers and shortening the drying time required for the silicon wafer 400. At the same time, since the drying temperature does not need to be increased, the energy consumption required for the drying process can be reduced.

[0063] like Figure 7 As shown, this embodiment of the invention also provides a drying device, including an oven 200 and a drying medium supply device 500 as described in any of the above possible implementations. The air outlet pipe of the drying medium supply device 500 is connected to the first air inlet 201 included in the box body 210; the air inlet pipe of the drying medium supply device 500 is connected to the air outlet 220 included in the box body 210.

[0064] The aforementioned drying medium supply device 500 provides drying medium to the oven 200. The drying medium supply device 500 may include a heating element 504, an exhaust fan 503, and corresponding piping. To save energy, the drying medium at the oven 200's outlet 220 is recycled, thereby reducing the energy consumption of the drying medium supply device 500. The oven 200 can be understood as the inner structure of the drying equipment. The drying equipment may also include an outer shell, which connects the oven 200's inlet / outlet 220 to the drying medium supply device 500. The bottom plate of the drying equipment shell can be detachably connected, facilitating the cleaning of silicon powder deposited on the bottom plate.

[0065] like Figure 7 and Figure 8 As shown, in one possible implementation, a first filter assembly 501 is provided in the outlet duct of the drying medium supply device 500, and / or a second filter assembly 502 is provided in the inlet duct of the drying medium supply device 500. After cleaning, residual silicon powder or broken silicon wafers may adhere to the silicon wafer 400. During the drying process, the silicon powder floats with the drying medium. If silicon powder still adheres to the surface of the silicon wafer 400 after drying, small black spots may easily form on the silicon wafer 400. To overcome this problem, the drying medium supply device 500 is equipped with a first filter assembly 501 and a second filter assembly 502 to filter the silicon powder. This ensures that silicon powder is not mixed in the drying medium, thereby avoiding the problem of small black spots.

[0066] like Figure 8 As shown, in one possible implementation, the first filter assembly 501 is a labyrinth-type filter assembly, comprising a plurality of alternately staggered and detachable first filter plates 505; and / or, the second filter assembly 502 comprises at least one detachable second filter plate. The mesh size of the first filter plate 505 and the second filter plate can be selected from 30 mesh to 1000 mesh as needed. The angle between the first filter plate 505 and the horizontal plate can be approximately 2° to 30° upwards.

[0067] The aforementioned detachable first filter plate 505 and second filter plate can be disassembled after the drying process is completed, allowing operators to clean the silicon powder or broken silicon wafers 400, thereby reducing the labor intensity of cleaning the drying equipment. This enables operators to perform more silicon wafer 400 drying processes per unit time, improving the efficiency of silicon wafer 400 drying.

[0068] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0069] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An oven for drying silicon wafers, characterized in that, The silicon wafer is disposed inside the oven along a first direction; The oven includes: a chamber; the silicon wafer is inserted into and housed within the chamber by a limiting member; the chamber is provided with a first air inlet and an air outlet; The first air inlet extends along a first direction; when the oven is in use, it delivers drying medium through the first air inlet to at least the position where the silicon wafer is inserted into the limiting member; The air outlet is located on the bottom surface of the housing and / or on the side near the bottom surface, and the cross section of the housing on the side near the air outlet is smaller than the cross section on the side near the first air inlet. The oven further includes a second air inlet on the oven body, the second air inlet extending along the first direction or the second direction, the second direction forming a first preset angle with the first direction, the first preset angle being 80° to 100°; in the oven's operating state, the drying medium is supplied to the silicon wafer through the second air inlet. Both the first and second air inlets are located on the top of the housing.

2. The drying oven according to claim 1, characterized in that, When there are multiple first air inlets, the second air inlet is located between two adjacent first air inlets.

3. The drying oven according to claim 1, characterized in that, The enclosure includes at least one removable wall.

4. The drying oven according to any one of claims 1 to 3, characterized in that, The limiting component is a flower basket, which includes oppositely arranged inserts. The silicon wafers are spaced apart in the inserts along the first direction. The length direction of the inserts is parallel to the first direction. The first air inlet's orthographic projection along a third direction covers the inserts. The third direction forms a second preset angle with the first direction.

5. The drying oven according to claim 4, characterized in that, The first air inlet is located at the top of the box, and the box contains a plurality of the flower baskets. The top of the box is provided with a plurality of first air inlets, and each of the insert pieces corresponds to a first air inlet above it; when the plurality of flower baskets are arranged in sequence along the second direction, the extension length of each first air inlet in the first direction is greater than or equal to the length of the insert piece, and the extension length of each first air inlet in the second direction is greater than or equal to the width of the insert piece. Alternatively, the top of the box is provided with multiple first air inlets, and each of the multiple insert pieces located on the same straight line corresponds to a first air inlet. When the multiple flower baskets are arranged in an array along the first direction and the second direction, the extension length of each first air inlet in the first direction is greater than or equal to the sum of the lengths of the multiple insert pieces.

6. The drying oven according to claim 4, characterized in that, The second air inlet is located at the top of the housing, and the housing contains multiple flower baskets. The top of the box is provided with a plurality of second air inlets. The second air inlets extend along the first direction. Each flower basket corresponds to a second air inlet on the box above the position where the silicon wafer is inserted. When the plurality of flower baskets are arranged sequentially along the second direction, or when the plurality of flower baskets are arranged in an array along the first and second directions, the extension length of each second air inlet in the first direction is greater than or equal to the length of the insert. Alternatively, the top of the box is provided with multiple second air inlets, and each flower basket corresponds to multiple second air inlets on the box above the position where the silicon wafer is inserted. The second air inlets extend along the second direction, and the length of each second air inlet extending along the second direction is less than or equal to the vertical distance between the two insert pieces included in the same flower basket. Alternatively, the top of the box is provided with a plurality of second air inlets, the second air inlets extending along the first direction, and a second air inlet corresponding to the top of a plurality of flower baskets located on the same straight line. When the plurality of flower baskets are arranged in an array along the first direction and the second direction, the extension length of each second air inlet in the first direction is greater than or equal to the sum of the lengths of the plurality of insert pieces. Alternatively, when the second air inlet extends along the second direction, the length of each second air inlet extending in the second direction is less than or equal to the vertical distance between the flower baskets located at both ends.

7. A drying device, characterized in that, The device includes a drying medium supply device and an oven as described in any one of claims 1 to 6, wherein the air outlet pipe of the drying medium supply device is connected to a first air inlet included in the oven body; and the air inlet pipe of the drying medium supply device is connected to an air outlet included in the oven body.

8. The drying equipment according to claim 7, characterized in that, A first filter assembly is provided in the air outlet duct, and / or a second filter assembly is provided in the air inlet duct.

9. The drying equipment according to claim 8, characterized in that, The first filter assembly is a labyrinth filter assembly, and the first filter assembly includes a plurality of removable first filter plates; and / or, the second filter assembly includes at least one removable second filter plate.

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