Camera module

Abstract

Disclosed is a camera module that utilizes a novel piezoelectric actuator as a driving element to meet the camera module's driving requirements. Specifically, the camera module utilizes the novel piezoelectric actuator as a driving element to move an optical lens for optical image stabilization. Furthermore, the piezoelectric actuator is positioned within the camera module using a reasonable layout scheme to simultaneously meet the camera module's structural and dimensional design requirements.

Description

Technical Field

[0001] The present application relates to the field of camera modules, and more particularly to a camera module that utilizes a novel piezoelectric actuator as a driving element to meet the driving requirements of the camera module. Specifically, the camera module utilizes the novel piezoelectric actuator as a driving element to move an optical lens for optical image stabilization. Furthermore, the piezoelectric actuator is disposed within the camera module using a reasonable layout scheme to simultaneously meet the structural and dimensional design requirements of the camera module. Background Art

[0002] With the popularization of mobile electronic devices, the relevant technologies of camera modules used in mobile electronic devices to help users obtain images (for example, videos or pictures) have developed and progressed rapidly. In recent years, camera modules have been widely used in many fields such as medical care, security, and industrial production.

[0003] To meet increasingly broad market demands, camera modules are increasingly moving towards higher pixels, larger chips, and smaller sizes. As photosensitive chips evolve towards higher pixels and larger chips, the size of the optical components they support (e.g., filters and lenses) is also increasing. This poses new challenges to the drivers used to control optical performance (e.g., focusing and image stabilization).

[0004] Specifically, the existing driving elements for driving optical components are electromagnetic motors, such as voice coil motors (VCMs) and shape memory alloy actuators (SMAs). However, as the size of optical components increases and the weight increases, existing electromagnetic motors are gradually unable to provide sufficient driving force to drive the optical components to move. Quantitatively speaking, existing voice coil motors and shape memory alloy actuators are only suitable for driving optical components weighing less than 100 mg. That is, if the weight of the optical lens exceeds 100 mg, the existing actuators will not be able to meet the application requirements of the camera module.

[0005] Furthermore, as mobile devices become increasingly smaller and thinner, the density of components within the driver element is also increasing. Consequently, existing voice coil motors (VCMs) contain coils and magnets. When the two magnets are too close together, their internal magnetic fields interact, causing displacement or vibration, reducing the stability of the drive control.

[0006] Therefore, a new driving solution suitable for the camera module is needed, and the new driver can not only meet the driving requirements of the camera module for optical performance adjustment, but also meet the development needs of lightweight and thin camera modules. Summary of the Invention

[0007] One advantage of the present application is that it provides a camera module, wherein the camera module adopts a new type of piezoelectric actuator as a driving element to not only provide a sufficiently large driving force, but also provide a driving performance with higher precision and longer stroke to meet the requirements of optical performance adjustment of the camera module, such as optical image stabilization.

[0008] Another advantage of the present application is that it provides a camera module, wherein the piezoelectric actuator has a relatively small size to better adapt to the development trend of lightweight and thin camera modules.

[0009] Another advantage of the present application is that it provides a camera module, wherein the piezoelectric actuator is arranged in the camera module using a reasonable layout scheme to meet the structural and size requirements of the camera module.

[0010] Other advantages and features of the present application will become apparent from the following description, and may be achieved by means of the means and combinations particularly pointed out in the claims.

[0011] To achieve at least one of the above advantages, the present application provides a camera module, comprising:

[0012] The photosensitive component includes: a circuit board and a photosensitive chip electrically connected to the circuit board;

[0013] A frame carrier assembly mounted on the photosensitive component, wherein the frame carrier assembly includes a first frame carrier;

[0014] an optical lens mounted in the first frame carrier and held on a light-sensing path of the light-sensing component, the optical lens having an optical axis; and

[0015] A drive assembly includes: a first drive element and a first pre-stressing component, wherein the first drive element is implemented as a piezoelectric actuator, wherein the first drive element is frictionally coupled to the first frame carrier through the first pre-stressing component and is configured to move along a two-dimensional trajectory in a plane perpendicular to the optical axis in a manner of bending vibration along two directions after being driven, thereby driving the first frame carrier through friction to drive the optical lens to move in a first direction perpendicular to the optical axis.

[0016] In the camera module according to the present application, the frame assembly further includes a second frame carrier external to the first frame carrier and an outer frame carrier external to the second frame carrier, wherein the driving assembly further includes a second driving element and a second pre-stressing component, and the second driving element is implemented as the piezoelectric actuator, wherein the second driving element is frictionally coupled to the second frame carrier through the second pre-stressing part and is configured to move along a two-dimensional trajectory in a plane perpendicular to the optical axis in a manner of bending vibration along two directions after being driven, thereby driving the second frame carrier by friction to drive the first frame carrier and then drive the optical lens to move in a second direction perpendicular to the optical axis, and the second direction is perpendicular to the first direction.

[0017] In the camera module according to the present application, the piezoelectric actuator includes: an actuation system and a driving circuit system, wherein the actuation system moves in a two-dimensional trajectory along a preset direction in a manner of bending vibration in two directions under the control of the driving circuit system.

[0018] In the camera module according to the present application, the actuation system includes: a piezoelectric plate structure and a friction driving part fixed to the piezoelectric plate structure, and the friction driving part is frictionally coupled to the first frame carrier or the second frame carrier.

[0019] In the camera module according to the present application, the piezoelectric plate structure has a first side surface extending along its depth direction and a second side surface extending along its height direction and adjacent to the first side surface, wherein the piezoelectric plate structure has a first resonant frequency along its depth direction and a second resonant frequency along its height direction, wherein the second resonant frequency is greater than the first resonant frequency.

[0020] In the camera module according to the present application, the piezoelectric plate structure includes a first piezoelectric region, a second piezoelectric region and a third piezoelectric region formed on the second side surface, and a fourth piezoelectric region formed on the first side surface, wherein the second piezoelectric region is located between the first piezoelectric region and the third piezoelectric region, and the fourth piezoelectric region is adjacent to the second piezoelectric region; wherein the piezoelectric plate structure further includes a first electrode pair electrically connected to the first piezoelectric region, a second electrode pair electrically connected to the second piezoelectric region, a third electrode pair electrically connected to the third piezoelectric region and a fourth electrode pair electrically connected to the fourth electrically connected region.

[0021] In the camera module according to the present application, the driving circuit system includes a first driving circuit and a second driving circuit, the first driving circuit is electrically connected to the first electrode pair and the third electrode pair, and the second driving circuit is electrically connected to the second electrode pair and the fourth electrode pair; wherein the vibration frequency of the circuit vibration signal output by the first driving circuit and the second driving circuit is equal to the first resonant frequency or the second resonant frequency.

[0022] In the camera module according to the present application, when the vibration frequency of the circuit vibration signal output by the first driving circuit is the first resonant frequency, the piezoelectric plate structure resonates in its height direction and partially resonates in its depth direction, so that the piezoelectric plate structure moves in a two-dimensional trajectory along the preset direction in a manner of bending vibration along two directions; wherein, when the vibration frequency of the circuit vibration signal input by the second driving circuit is the second resonant frequency, the piezoelectric plate structure resonates in its depth direction and partially resonates in its height direction, so that the piezoelectric plate structure moves in a two-dimensional trajectory along the preset direction in a manner of bending vibration along two directions.

[0023] In the camera module according to the present application, the driving component further includes a first friction actuating part and a second friction actuating part, the first friction actuating part is clamped between the friction driving part of the first driving element and the first frame carrier, so that the first driving element is frictionally coupled to the first frame carrier through the first friction actuating part and the first pre-pressing part; the second friction actuating part is clamped between the friction driving part of the second driving element and the second frame carrier, so that the second driving element is frictionally coupled to the second frame carrier through the second pre-pressing part and the second friction actuating part.

[0024] In the camera module according to the present application, the first driving element is located on the side of the first frame carrier.

[0025] In the camera module according to the present application, the first driving element is located on the upper part of the first frame carrier.

[0026] In the camera module according to the present application, the first driving element is located at the lower part of the first frame carrier.

[0027] In the camera module according to the present application, the second driving element is clamped between the second frame carrier and the outer frame carrier through the second pre-pressing component and the second friction actuating part. In this way, the second driving element is frictionally coupled to the second frame carrier, wherein the second driving element is located on the side of the second frame carrier.

[0028] In the camera module according to the present application, the second driving element is clamped between the second frame carrier and the lens carrier through the second pre-pressing component and the second friction actuating part. In this way, the second driving element is frictionally coupled to the second frame carrier, wherein the second driving element is located on the upper part of the second frame carrier.

[0029] In the camera module according to the present application, the driving component is further externally arranged on the outer frame carrier of the second frame carrier, wherein the second driving element is clamped between the second frame carrier and the outer frame carrier through the second pre-pressing component and the second friction actuating part. In this way, the second driving element is frictionally coupled to the second frame carrier, wherein the second driving element is located at the lower part of the second frame carrier.

[0030] In the camera module according to the present application, the first pre-stressing component includes a first elastic element, which is arranged between the piezoelectric plate structure of the first driving element and the second frame carrier, so that the friction driving part of the first driving element is forced to press against the first friction actuating part by the elastic force of the first elastic element, and in this way, the first driving element is frictionally coupled to the first frame carrier; the second pre-stressing element includes a second elastic element, which is arranged between the piezoelectric plate structure of the second driving element and the outer frame carrier, so that the friction driving part of the second driving element is forced to press against the second friction actuating part by the elastic force of the second elastic element, and in this way, the second driving element is frictionally coupled to the second frame carrier.

[0031] In the camera module according to the present application, the first pre-stressing component includes a first elastic element, which is arranged between the piezoelectric plate structure of the first driving element and the second frame carrier, so that the friction driving part of the first driving element is forced to press against the first friction actuating part by the elastic force of the first elastic element, and in this way, the first driving element is frictionally coupled to the first frame carrier; the second pre-stressing element includes a second elastic element, which is arranged between the piezoelectric plate structure of the second driving element and the lens carrier, so that the friction driving part of the second driving element is forced to press against the second friction actuating part by the elastic force of the second elastic element, and in this way, the second driving element is frictionally coupled to the second frame carrier.

[0032] In the camera module according to the present application, the first pre-stressing component includes a first elastic element, which is arranged between the piezoelectric plate structure of the first driving element and the second frame carrier, so that the friction driving part of the first driving element is forced to press against the first friction actuating part by the elastic force of the first elastic element, and in this way, the first driving element is frictionally coupled to the first frame carrier; the second pre-stressing element includes a second elastic element, which is arranged between the piezoelectric plate structure of the second driving element and the outer frame carrier, so that the friction driving part of the second driving element is forced to press against the second friction actuating part by the elastic force of the second elastic element, and in this way, the second driving element is frictionally coupled to the second frame carrier.

[0033] In the camera module according to the present application, the first elastic element and the second elastic element are implemented as elastic adhesives.

[0034] In the camera module according to the present application, the thickness of the first elastic element and the second elastic element is between 10um and 50um.

[0035] In the camera module according to the present application, the first pre-stressing component includes a first magnetic element arranged on the first frame carrier and a second magnetic element arranged on the second frame carrier and corresponding to the first magnetic element, so as to force the friction driving part of the first driving element to press against the first friction actuating part through the magnetic attraction between the first magnetic element and the second magnetic element, in this way, the first driving element is frictionally coupled to the first frame carrier; the second pre-stressing component includes a third magnetic element arranged on the second frame carrier and a fourth magnetic element arranged on the outer frame carrier and corresponding to the third magnetic element, so as to force the friction driving part of the second driving element to press against the second friction actuating part through the magnetic attraction between the third magnetic element and the fourth magnetic element, in this way, the second driving element is frictionally coupled to the second frame carrier.

[0036] In the camera module according to the present application, the first frame carrier includes a first groove concavely formed on its surface, and the first friction actuating part is arranged in the first groove, wherein the first groove forms a guide groove for guiding the movement of the friction driving part of the first driving element.

[0037] In the camera module according to the present application, the second frame carrier includes a second groove concavely formed on its surface, and the second friction actuating part is arranged in the second groove, wherein the second groove forms a guide groove for guiding the movement of the friction driving part of the second driving element.

[0038] In the camera module according to the present application, the first groove has a reduced aperture, and / or the second groove has a reduced aperture.

[0039] In the camera module according to the present application, the driving assembly further includes a first guiding mechanism arranged between the first frame carrier and the second frame carrier and a second guiding mechanism arranged between the second frame carrier and the outer frame carrier.

[0040] In the camera module according to the present application, the driving assembly further includes a first guiding mechanism arranged between the first frame carrier and the second frame carrier and a second guiding mechanism arranged between the second frame carrier and the outer frame carrier.

[0041] Further objectives and advantages of the present application will be fully reflected through understanding of the following description and drawings.

[0042] These and other objects, features and advantages of the present application are fully reflected in the following detailed description, drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The above and other purposes, features, and advantages of the present application will become more apparent through a more detailed description of the embodiments of the present application in conjunction with the accompanying drawings. The accompanying drawings are intended to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0044] Figure 1 The figure shows a schematic diagram of a camera module according to an embodiment of the present application.

[0045] Figure 2 The figure shows a schematic diagram of the photosensitive component of the camera module according to an embodiment of the present application.

[0046] Figure 3A The figure illustrates one of the schematic diagrams of the optical lens, frame carrier assembly and driving assembly of the camera module according to an embodiment of the present application.

[0047] Figure 3B The figure shows a second schematic diagram of the optical lens, frame carrier assembly and driving assembly of the camera module according to an embodiment of the present application.

[0048] Figure 3C The diagram illustrates a third schematic diagram of the optical lens, frame carrier assembly and drive assembly of the camera module according to an embodiment of the present application.

[0049] Figure 4AFIG2 shows a schematic diagram of a piezoelectric actuator according to an embodiment of the application.

[0050] Figure 4B FIG2 is a schematic diagram of a piezoelectric plate structure of the piezoelectric actuator according to an embodiment of the present application.

[0051] Figure 4C FIG2 is a schematic diagram illustrating an output signal of a driving circuit system of a piezoelectric actuator according to an embodiment of the present application.

[0052] Figures 4D to 4F FIG2 is a schematic diagram illustrating the piezoelectric actuator moving in a first mode according to an embodiment of the present application.

[0053] Figures 4G to 4I FIG2 is a schematic diagram illustrating the piezoelectric actuator moving in the second mode according to an embodiment of the present application.

[0054] Figure 4J FIG2 shows another schematic diagram of the piezoelectric plate structure of the piezoelectric actuator according to an embodiment of the present application.

[0055] Figure 4K FIG2 is a schematic diagram illustrating the piezoelectric actuator according to an embodiment of the present application acting on a moved object.

[0056] Figure 4L FIG2 shows a schematic diagram of the movement of the piezoelectric actuator according to an embodiment of the present application.

[0057] Figure 5 The figure shows a schematic diagram of a modified implementation of the camera module according to an embodiment of the present application.

[0058] Figure 6 The figure shows a schematic diagram of another modified implementation of the camera module according to an embodiment of the present application.

[0059] Figure 7 The figure shows a schematic diagram of another modified implementation of the camera module according to the embodiment of the present application.

[0060] Figure 8 The figure shows a schematic diagram of another modified implementation of the camera module according to the embodiment of the present application.

[0061] Figure 9 The figure shows a schematic diagram of another modified implementation of the camera module according to an embodiment of the present application. DETAILED DESCRIPTION

[0062] Below, the exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited to the exemplary embodiments described herein.

[0063] Exemplary camera module

[0064] like Figure 1 As shown, a camera module according to an embodiment of the present application is illustrated, which includes: a photosensitive component 10, an optical lens 20 held on the photosensitive path of the photosensitive component 10, a frame carrier component 30, and a driving component 40 for driving the optical lens 20 to perform optical image stabilization.

[0065] like Figure 2 As shown, in this embodiment, the photosensitive component 10 includes a circuit board 11, a photosensitive chip 12 electrically connected to the circuit board 11, and a filter element 13 held on the photosensitive path of the photosensitive chip 12, wherein the circuit board 11 forms a mounting substrate for the photosensitive component 10. The circuit board can be implemented as a printed circuit board (PCB), a software board, or a reinforced flexible printed circuit (PFC). In addition, in some examples, a reinforcement plate (not shown) can be provided below the circuit board 11, for example, a steel sheet can be provided below the circuit board to strengthen the strength of the circuit board and improve the heat dissipation performance of the photosensitive component through the steel sheet.

[0066] Furthermore, in Figure 2 In the illustrated example, the photosensitive component 10 further includes a bracket 14 provided on the circuit board 11, wherein the filter element 13 is mounted on the bracket 14 to be maintained on the photosensitive path of the photosensitive chip 12. In other examples of the present application, the specific implementation method of the filter element 13 being maintained on the photosensitive path of the photosensitive chip 12 is not limited to the present application. For example, the filter element 13 can be implemented as a filter film and coated on the surface of a certain optical lens of the optical lens to achieve a filtering effect. For another example, the photosensitive component 10 can further include a filter element bracket (not shown) mounted on the bracket 14, wherein the filter element 13 is maintained on the photosensitive path of the photosensitive chip 12 by being mounted on the filter element bracket.

[0067] In a specific example of the embodiment of the present application, the bracket 14 can be implemented as a plastic bracket, which is attached to the circuit board 11 by an adhesive. In other examples of the embodiment of the present application, the bracket 14 can also be implemented as an integrated bracket integrally formed with the circuit board 11, such as a molded bracket, which is not limited to this application.

[0068] like Figure 1As shown, in the embodiment of the present application, the frame carrier assembly 30 is mounted on the photosensitive assembly 10, wherein the frame carrier assembly 30 includes an outer frame carrier 33 mounted on the bracket 14, a second frame carrier 32 accommodated in the outer frame carrier 33, and a first frame carrier 31 accommodated in the second frame carrier 32. That is, in this embodiment, the frame carrier assembly includes a first frame carrier 31, a second frame carrier 32 external to the first frame carrier 31, and an outer frame carrier 33 external to the second frame carrier 32.

[0069] In particular, in this embodiment, the optical lens 20 is mounted in the first frame carrier 31, so that the optical lens 20 is held on the light sensing path of the photosensitive component 10. That is, in this embodiment, the first frame carrier 31 forms a mounting carrier for the optical lens.

[0070] Furthermore, in the embodiment of the present application, there is a gap between the second frame carrier 32 and the outer frame carrier 33, and there is a gap between the first frame carrier 31 and the second frame carrier 32. That is, there is available space between the second frame carrier 32 and the outer frame carrier 33, wherein the available space can be used to install a driver for driving the movement of the second carrier frame 32; there is also available space between the first frame carrier 31 and the second frame carrier 32, wherein the available space can be used to install a driver for driving the movement of the first frame carrier 31. Here, the selection and installation of the driver will be expanded in more detail in the subsequent description.

[0071] like Figure 1 As shown, in the embodiment of the present application, the optical lens 22 includes a lens barrel 21 and at least one optical lens 22 installed in the lens barrel 21. Those skilled in the art should know that the resolution of the optical lens 20 is proportional to the number of optical lenses 22 within a certain range, that is, the higher the resolution, the more optical lenses 22 there are. In a specific implementation, the optical lens 20 can be implemented as an integrated lens or a split lens, wherein when the optical lens 20 is implemented as an integrated lens, the optical lens 20 includes a lens barrel 21, and all the optical lenses 22 are installed in the lens barrel 21; and when the optical lens 20 is implemented as a split optical lens, the optical lens 20 is assembled from at least two lens monomers.

[0072] As previously mentioned, to meet increasingly broad market demands, high pixels, large chips, and small sizes are the irreversible development trend of existing camera modules. As photosensitive chips evolve toward higher pixels and larger chips, the size of the optical components (e.g., filters, optical lenses) that adapt to these chips is also gradually increasing. This presents new challenges for the drivers used to drive these optical components for optical performance adjustments (e.g., optical focus, optical image stabilization, etc.).

[0073] Specifically, the existing driving elements for driving optical components are electromagnetic motors, such as voice coil motors (VCMs) and shape memory alloy actuators (SMAs). However, as the size of optical components increases and the weight increases, existing electromagnetic motors are gradually unable to provide sufficient driving force to drive the optical components to move. Quantitatively speaking, existing voice coil motors and shape memory alloy actuators are only suitable for driving optical components weighing less than 100 mg. That is, if the weight of the optical lens exceeds 100 mg, the existing actuators will not be able to meet the application requirements of the camera module.

[0074] Furthermore, as mobile devices become increasingly smaller and thinner, the density of components within the driver element is also increasing. Consequently, existing voice coil motors (VCMs) contain coils and magnets. When the two magnets are too close together (less than 7mm), their internal magnetic fields interact, causing the magnets to shift or vibrate, reducing the stability of the driver control.

[0075] Therefore, a new driving solution suitable for the camera module is needed, and the new driver can not only meet the driving requirements of the camera module for optical performance adjustment, but also meet the development needs of lightweight and thin camera modules.

[0076] Specifically, for camera modules, new drivers must meet the following requirements: relatively greater driving force and improved driving performance (specifically, higher-precision drive control and longer drive travel). Furthermore, in addition to finding a driver that meets the requirements of the new technology, the selection of a new driver must also consider its adaptability to the current trend of lightweight and thinner camera modules.

[0077] After research and testing, this application proposes a piezoelectric actuator with a novel structure that meets the technical requirements of the camera module for a driver. Furthermore, the piezoelectric actuator is appropriately positioned within the camera module to meet the structural and dimensional design requirements of the camera module.

[0078] Figures 4A to 4L FIG2 shows a schematic diagram of a piezoelectric actuator according to an embodiment of the application. Figure 4A As shown, the piezoelectric actuator 100 according to an embodiment of the present application includes an actuation system 110 and a drive circuit system 120. Under the control of the drive circuit system 120, the actuation system 110 moves along a two-dimensional trajectory along a preset direction in a manner of bending vibration along two directions. In particular, in this embodiment, the piezoelectric actuator 100 is a highly efficient semi-resonant drive system. When turned on, the actuation system 110 of the piezoelectric actuator 100 moves along a two-dimensional trajectory along a preset direction in a manner of bending vibration along two directions, thereby frictionally coupling and moving the object along the preset direction.

[0079] like Figure 4A As shown in FIG. 1 , in this embodiment, the actuation system 110 includes a piezoelectric plate structure 111 and a friction drive unit 112 fixed to the piezoelectric plate structure 111. Here, the piezoelectric plate structure 111 may be symmetrical or asymmetrical. The piezoelectric plate structure 111 has a first side surface extending along its depth direction and a second side surface extending along its height direction and adjacent to the first side surface, wherein the piezoelectric plate structure 111 extends along its depth direction (e.g., Figure 4A D) has a first resonant frequency and along its height direction (e.g., as Figure 4A Typically, the height dimension of the piezoelectric plate structure 111 is greater than its depth dimension, that is, the second resonant frequency is greater than the first resonant frequency.

[0080] like Figure 4B As shown, in this embodiment, the piezoelectric plate structure 111 includes at least one piezoelectric layer formed together. The thickness of the piezoelectric plate structure 111 ranges from 5um to 40um. In particular, in the embodiment of the present application, the at least one piezoelectric layer structure can be a single piezoelectric layer, or it can include multiple piezoelectric layers stacked together (for example, multiple parallel piezoelectric layers co-fired together). Here, compared with a single piezoelectric layer, multiple piezoelectric layers can achieve similar effects under the premise of applying a smaller voltage.

[0081] like Figure 4AAs shown, in this embodiment, the piezoelectric plate structure 111 includes a first piezoelectric region 1111, a second piezoelectric region 1112, and a third piezoelectric region 1113 formed on the second side surface, and a fourth piezoelectric region 1114 formed on the first side surface, wherein the second piezoelectric region 1112 is located between the first piezoelectric region 1111 and the third piezoelectric region 1113, and the fourth piezoelectric region 1114 is adjacent to the second piezoelectric region 1112. In addition, the piezoelectric plate structure 111 further includes a first electrode pair 1115 electrically connected to the first piezoelectric region 1111, a second electrode pair 1116 electrically connected to the second piezoelectric region 1112, a third electrode pair 1117 electrically connected to the third piezoelectric region 1113, and a fourth electrode pair 1118 electrically connected to the fourth piezoelectric region 1114. That is, in the embodiment shown in FIG. Figure 1 In the illustrated example, the piezoelectric plate structure 111 includes four piezoelectric regions and four electrode pairs electrically connected to the four piezoelectric regions. Of course, in other examples of the present application, the piezoelectric plate structure 111 may include other numbers of piezoelectric regions and electrode pairs, and this is not limited to the present application.

[0082] Furthermore, in some other examples of the present application, one of the first piezoelectric region 1111 and the third piezoelectric region 1113, and / or one of the second piezoelectric region 1112 and the fourth piezoelectric region 1114 can be passive, which can reduce the driving amplitude but does not change the operation of the actuation system 110.

[0083] Furthermore, in the embodiment of the present application, the first piezoelectric region 1111, the second piezoelectric region 1112, the third piezoelectric region 1113, and the fourth piezoelectric region 1114 have polarities generated by polarization during the manufacturing process, thereby forming positive and negative electrodes. Specifically, the first piezoelectric region 1111 is polarized during the manufacturing process so that one electrode of the first electrode pair 1115 corresponding to the first piezoelectric region 1111 forms a negative electrode (for example, Figure 4A A-), the other electrode forms the positive electrode (e.g., Figure 4A The third piezoelectric region 1113 is polarized during the manufacturing process so that one electrode of the third electrode pair 1117 corresponding to the third piezoelectric region 1113 forms a negative electrode (for example, Figure 4A The other electrode forms the positive electrode (e.g., Figure 4A The second piezoelectric region 1112 is polarized during the manufacturing process so that one electrode of the second electrode pair 1116 corresponding to the second piezoelectric region 1112 forms a negative electrode (for example, Figure 4AThe other electrode forms the positive electrode (e.g., Figure 4A The fourth piezoelectric region 1114 is polarized during the manufacturing process so that one electrode of the fourth electrode pair 1118 corresponding to the fourth piezoelectric region 1114 forms a negative electrode (for example, Figure 4A The other electrode forms the positive electrode (e.g., Figure 4A It should be noted that in this embodiment, each electrode in the first electrode pair 1115 and / or the second electrode pair 1116 and / or the third electrode pair 1117 and / or the second electrode pair 1116 has an "L" shape.

[0084] like Figure 4A and Figure 4B As shown, in this embodiment, one electrode of the first electrode pair 1115 is coupled to and interlaced with an internal electrode of each piezoelectric layer of the first piezoelectric region 1111, and the other electrode of the first electrode pair 1115 is interlacedly connected to an internal electrode of the first piezoelectric region 1111 opposite to each piezoelectric layer. During the polarization process, one electrode of the first electrode pair 1115 is determined as a positive electrode, and the other electrode is determined as a negative electrode. One electrode of the second electrode pair 1116 is coupled to and interlaced with an internal electrode of each piezoelectric layer of the second piezoelectric region 1112, and the other electrode of the second electrode pair 1116 is interlacedly connected to an internal electrode of the second piezoelectric region 1112 opposite to each piezoelectric layer. During the polarization process, one electrode of the second electrode pair 1116 is determined as a positive electrode, and the other electrode is determined as a negative electrode. One electrode of the third electrode pair 1117 is coupled to and interlaced with an internal electrode of each piezoelectric layer of the third piezoelectric region 1113, and the other electrode of the third electrode pair 1117 is interlaced with the internal electrode of the third piezoelectric region 1113 opposite each piezoelectric layer. During polarization, one electrode of the third electrode pair 1117 is determined as a positive electrode, and the other electrode is determined as a negative electrode. One electrode of the third electrode pair 1117 is coupled to and interlaced with an internal electrode of each piezoelectric layer of the third piezoelectric region 1113, and the other electrode of the third electrode pair 1117 is interlaced with the internal electrode of the third piezoelectric region 1113 opposite each piezoelectric layer. During polarization, one electrode of the third electrode pair 1117 is determined as a positive electrode, and the other electrode is determined as a negative electrode.

[0085] Further references Figure 4AIn this embodiment, the driving circuit system 120 includes a first driving circuit 121 and a second driving circuit 122, wherein the first driving circuit 121 is electrically connected to the first electrode pair 1115 and the third electrode pair 1117, and the second driving circuit 122 is electrically connected to the second electrode pair 1116 and the fourth electrode pair 1118, wherein the first driving circuit 121 and the second driving circuit 122 can be full-bridge driving circuits or other driving circuits. In particular, in this embodiment, the driving circuit system 120 has four output circuit vibration signals: 124(1)-124(4), wherein the output circuit vibration signals can be as follows: Figure 4C The ultrasonic square wave vibration signal shown may also be other signals, for example, a sinusoidal signal.

[0086] During operation of the piezoelectric actuator 100, the piezoelectric plate structure 111 has two bending modes: Mode 1 and Mode 2, wherein Mode 1 and Mode 2 each have a different resonant frequency. The vibration amplitude of the bending mode of the piezoelectric plate structure 111 depends on the vibration frequency of the output circuit vibration signal. Specifically, when the driving circuit system 120 applies a circuit vibration signal to the piezoelectric plate structure 111 at the resonant frequency for one of the two bending modes (for example, the resonant frequency of Mode 1), the vibration amplitude of the bending mode operating at its resonant frequency is fully amplified, and the vibration amplitude of the other bending modes operating at partial resonance is only partially amplified. More specifically, when the vibration frequency of the circuit vibration signal output by the first driving circuit 121 is the first resonant frequency, the piezoelectric plate structure 111 resonates in its height direction and partially resonates in its depth direction, so that the piezoelectric plate structure 111 moves in a two-dimensional trajectory along a preset direction in a manner of bending vibration along two directions; wherein, when the vibration frequency of the circuit vibration signal input by the second driving circuit 122 is the second resonant frequency, the piezoelectric plate structure 111 resonates in its depth direction and partially resonates in its height direction, so that the piezoelectric plate structure 111 moves in a two-dimensional trajectory along a preset direction in a manner of bending vibration along two directions.

[0087] More specifically, in Figure 4A and Figure 4CIn the illustrated example, the first drive circuit 121 and the second drive circuit 122 are capable of outputting four circuit vibration signals: 124(1)-124(4). In this embodiment, the voltage of the circuit vibration signal is 2.8V, and each of the four vibration signals has a vibration frequency that is substantially equal to the resonant frequency of any one of the two bending modes of the piezoelectric plate structure 111, that is, the vibration frequency is substantially equal to the first resonant frequency or the second resonant frequency. In addition, the circuit vibration signals from the outputs 124(1)-124(2) are phase-shifted by the drive circuit system 120 by approximately 0 degrees to 90 degrees relative to the circuit vibration signals from the outputs 124(3)-124(4), thereby moving in one of two directions. When the drive circuit system 120 adjusts the phase of the outputs 124(1)-124(2) relative to the outputs 124(3)-124(4) to be approximately -180 degrees to -90 degrees, the movable member is moved in the opposite direction (ie, the other direction opposite to the other direction).

[0088] Figures 4D to 4F FIG2 shows a schematic diagram of the piezoelectric actuator 100 according to an embodiment of the present application moving in a first mode. Figures 4D to 4F As shown, the bending mode is generated by applying circuit vibration signals from outputs 124(1)-124(2) of different stages to the first piezoelectric region 1111 and the third piezoelectric region 1113 having opposite polarities. When the piezoelectricity of all electrodes is 0, Figure 4D FIG2 shows the piezoelectric plate structure 111 at rest. When the voltage difference between the outputs 124(1) and 124(2) is positive, the length of the first piezoelectric region 1111 increases, while the length of the third piezoelectric region 1113 decreases, so that the piezoelectric plate structure 111 is in a state of being stationary. Figure 4E When the voltage difference between the outputs 124 (1) and 124 (2) is negative, the length of the first piezoelectric region 1111 decreases, while the length of the third piezoelectric region 1113 increases, so that the piezoelectric plate structure is as shown. Figure 4F Bend shown.

[0089] Figures 4G to 4I FIG2 shows a schematic diagram of the piezoelectric actuator 100 moving in the second mode according to an embodiment of the present application.

[0090] like Figures 4G to 4I As shown, the bending mode is generated by applying the vibration signals from the outputs 124(3)-124(4) of different stages to the second piezoelectric region 1112 and the fourth piezoelectric region 1114 having opposite polarities. When the piezoelectricity of all electrodes is 0, Figure 4GFIG. 1 shows the situation when the piezoelectric plate structure 111 is at rest. When the voltage difference between the outputs 124 (3) and 124 (4) is positive, the length of the second piezoelectric region 1112 decreases, while the length of the fourth piezoelectric region 1114 increases, so that the piezoelectric plate structure 111 is as shown in FIG. Figure 4H When the voltage difference between the outputs 124 (3) and 124 (4) is negative, the length of the second piezoelectric region 1112 increases, while the length of the fourth piezoelectric region 1114 decreases, so that the piezoelectric plate structure is as shown. Figure 4I Bend shown.

[0091] Accordingly, when Figure 4A When the output circuit vibration signal shown in the figure is applied to the actuating system 110, the actuating system 110 forms a two-dimensional trajectory in the shape of an elliptical orbit, that is, the driving circuit system 120 can control the direction of rotation of the actuating system 110 on the elliptical orbit path according to the phase difference value, so that the actuating system 110 can drive the object at a relatively smaller and more precise step speed.

[0092] Figure 4J FIG2 shows another schematic diagram of the piezoelectric plate structure 111 of the piezoelectric actuator 100 according to an embodiment of the present application. Figure 4J As shown, in the embodiment of the present application, the actuation system 110 further includes a friction driving portion 112 fixed to the piezoelectric plate structure 111, wherein the friction driving portion 112 is adapted to be frictionally coupled to the object to be acted upon so as to drive the object to move along a predetermined direction by friction. In order to enable the friction driving portion 112 to be frictionally coupled to the object to be acted upon, as shown in FIG. Figure 4K As shown, during the installation process, the piezoelectric actuator 100 is usually provided with a pre-compression component 43 / 46, which provides a pre-compression force between the piezoelectric actuator 100 and the object to be acted on, so that the friction driving portion 112 of the piezoelectric actuator 100 can be frictionally coupled to the object to drive the object to move along a predetermined direction by friction, as shown in FIG. Figure 4L shown.

[0093] Specifically, in this embodiment, the friction drive unit 112 includes at least one contact pad, which can be fixed to the piezoelectric plate structure 111 along the depth direction or along the height direction. In this embodiment, the at least one contact pad can have a hemispherical shape, but other shapes are also possible, such as a semi-cylindrical shape, a table shape, a rectangle, etc. Preferably, the at least one contact pad is made of a material with excellent friction and durability, such as a metal oxide material (e.g., zirconium oxide, aluminum oxide, etc.).

[0094] It's worth noting that compared to traditional electromagnetic actuators, the piezoelectric actuator 100 offers advantages such as small size, high thrust, and high precision. Quantitatively, the piezoelectric actuator 100 according to the present embodiment can provide a driving force of 0.6N to 2N, sufficient to drive components weighing more than 100mg.

[0095] In addition to being able to provide relatively large driving force, the piezoelectric actuator 100 also has other advantages compared to traditional electromagnetic motor solutions and memory alloy motor solutions, including but not limited to: relatively small size (having a slender shape), better response accuracy, relatively simpler structure, relatively simpler drive control, high product consistency, no electromagnetic interference, relatively larger stroke, short stabilization time, relatively small weight, etc.

[0096] Specifically, the camera module requires that the driver it is equipped with has characteristics such as a long driving stroke and good alignment accuracy. In the existing voice coil motor solution, in order to ensure the linearity of movement, it is necessary to design additional guide rods or ball guides, and at the same time, it is necessary to adapt large-sized driving magnets / coils on the side of the lens, and at the same time, it is necessary to set auxiliary positioning devices such as balls, springs, and suspension wires. In order to accommodate more components, ensure structural strength and reserve structural gaps, the module's lateral dimensions are often large, the structural design is complex, and the module weight is heavy. The memory alloy motor solution is limited by the relatively small stroke that can be provided by the memory alloy solution of the same proportion, and there are potential reliability risks such as breakage.

[0097] The piezoelectric actuator 100 has a relatively simple structure and an even simpler assembly structure. In addition, the size of its components is basically unrelated to the motion stroke of the piezoelectric actuator 100. Therefore, in optical image stabilization products, the piezoelectric actuator 100 can achieve advantages such as high thrust, small size, and light weight. At the same time, it can be designed to match a larger stroke or heavier device weight, and the integration level in the design is also higher.

[0098] Furthermore, the piezoelectric actuator 100 pushes the object to be pushed to perform micron-level movement in a frictional contact manner. Compared with the electromagnetic solution, the non-contact method of driving the object to be pushed requires relying on electromagnetic force to offset gravity. The friction method has the advantages of greater thrust, greater displacement and lower power consumption, while having higher control accuracy and achieving high-precision optical image stabilization. Moreover, when there are multiple motor mechanisms, the piezoelectric actuator 100 does not have a magnet coil structure and there is no magnetic interference problem. In addition, the piezoelectric actuator 100 can rely on the friction between the components to self-lock, thereby reducing the shaking and abnormal noise of the camera module during optical image stabilization.

[0099] After the piezoelectric actuator 100 is selected as a driver to drive the photosensitive component 10 for optical image stabilization, specifically, as follows Figures 3A to 3C and Figure 7 As shown, in this embodiment, the drive assembly 40 includes: a first drive element 42 , a first pre-stressing component 43 , a second drive element 45 , and a second pre-stressing component 46 , wherein the first drive element 42 and the second drive element 45 are implemented as piezoelectric actuators 100 .

[0100] Accordingly, if Figures 3A to 3C and Figure 7 As shown, in this embodiment, the optical lens 20 is mounted on the first frame carrier 31. The first driving element 42 is frictionally coupled to the first frame carrier 31 via the first pre-stressing component 43. The first driving element 42 is configured to, when driven, move in a first direction in a plane perpendicular to the optical axis in a two-dimensional trajectory in a manner of bending vibration along two directions. This frictionally drives the first frame carrier 31 to drive the optical lens 20 to move in a plane perpendicular to the optical axis to perform optical image stabilization in the first direction. The second frame carrier 32 is external to the first frame carrier 31. The second driving element 45 is frictionally coupled to the second frame carrier 32 via the second pre-stressing component 46. The first driving element 45 is configured to, when driven, move in a second direction in a plane perpendicular to the optical axis in a two-dimensional trajectory in a manner of bending vibration along two directions. This frictionally drives the second frame carrier 32 to drive the first frame carrier 31 to move the optical lens 20 in a plane perpendicular to the optical axis to perform optical image stabilization in a second direction. The first direction is perpendicular to the second direction. In one example, the first direction is the X-axis direction, and the second direction is the Y-axis direction.

[0101] Here, the first drive element 42 is frictionally coupled to the first frame carrier 31, including: direct friction action between the first drive element 42 and the first frame carrier 31, and indirect friction action between the first drive element 42 and the first frame carrier 31 (that is, although there is no direct friction force between the first drive element 42 and the first frame carrier 31, the friction driving force generated by the first drive element 42 can act on the first frame carrier 31). Correspondingly, the second drive element 45 is frictionally coupled between the second frame carrier 32 and the outer frame carrier 33, including: direct friction action between the second drive element 45 and the second frame carrier 32, and indirect friction action between the second drive element 45 and the second frame carrier 32 (that is, although there is no direct friction force between the second drive element 45 and the second frame carrier 32, the friction driving force generated by the second drive element 44 can act on the second frame carrier 32).

[0102] More specifically, in this embodiment, Figures 3A to 3C As shown, the first driving element 42 is clamped between the first frame carrier 31 and the second frame carrier 32 by the first pre-pressing component 43 . In this way, the first driving element 42 is frictionally coupled to the first frame carrier 31 .

[0103] Accordingly, in this embodiment, the first pre-compression component 43 includes a first elastic element 431, which is disposed between the piezoelectric plate structure 111 of the first driving element 42 and the second frame carrier 32, so that the elastic force of the first elastic element 431 forces the first driving element 42 to be frictionally coupled to the first frame carrier 31. In this embodiment, the friction driving portion 112 of the first driving element 42 directly contacts the surface of the outer wall of the first frame carrier 31. Accordingly, the elastic force provided by the first elastic element 431 can force the friction driving portion 112 of the first driving element 42 to contact the surface of the outer wall of the first frame carrier 31, thereby forming a frictional contact relationship between the two. In this way, after the first driving element 42 is turned on, the friction driving portion 112 of the first driving element 42 can drive the first frame carrier 31 to move along the first direction in a friction-driven manner, thereby driving the optical lens 20 to move along the first direction to perform optical image stabilization in the first direction.

[0104] In a specific example of the present application, the first elastic element 431 is implemented as an elastic adhesive, that is, the first elastic element 431 is implemented as glue that has elasticity after curing. Accordingly, during the installation process, a layer of adhesive with a thickness of 10 to 50 μm can be applied between the surface of the inner side wall of the second frame carrier 32 and the piezoelectric plate structure 111 of the first driving element 42. After the adhesive is cured, the first elastic element 431 is formed between the piezoelectric plate structure 111 of the first driving element 42 and the second frame carrier 32. It should be understood that in this example, the first elastic element 431 can provide pre-pressure while also enabling the first driving element 42 to be fixed to the surface of the inner side wall of the second frame carrier 32. Preferably, the first elastic element 431 has a relatively high flatness, that is, when applying the adhesive, the applied adhesive is ensured to have a relatively high flatness and uniformity as much as possible. Using an adhesive with a thickness of 10um to 50um can improve the flatness of the adhesive, so that the first driving element 42 can be flatly fixed to the surface of the inner wall of the second frame carrier 32, thereby improving the driving stability of the first driving element 42.

[0105] Accordingly, in this embodiment, Figures 3A to 3C As shown, the second driving element 45 is clamped between the second frame carrier 32 and the outer frame carrier 33 by the second pre-pressing component 46 . In this way, the second driving element 45 is frictionally coupled to the second frame carrier 32 .

[0106] Further, if Figures 3A to 3C As shown, in this embodiment, the second pre-compression component 46 includes a second elastic element 461, which is disposed between the piezoelectric plate structure 111 of the second driving element 45 and the outer frame carrier 33. The elastic force of the second elastic element 461 forces the second driving element 45 to be frictionally coupled to the second frame carrier 32. Accordingly, in this embodiment, the friction driving portion 112 of the second driving element 45 directly contacts the surface of the outer wall of the second frame carrier 32. Accordingly, the elastic force provided by the second elastic element 461 can force the friction driving portion 112 of the second driving element 45 to contact the surface of the outer wall of the second frame carrier 32, thereby forming a frictional contact relationship between the two. In this way, after the second driving element 45 is turned on, the friction driving portion 112 of the second driving element 45 can drive the second frame carrier 32 to move along the second direction in a friction-driven manner, thereby driving the optical lens 20 to move along the second direction to perform optical image stabilization in the second direction.

[0107] In a specific example of the present application, the second elastic element 461 is implemented as an elastic adhesive, that is, the second elastic element 461 is implemented as glue that has elasticity after curing. Accordingly, during the installation process, a layer of adhesive with a thickness of 10 to 50 μm can be applied between the surface of the inner side wall of the outer frame carrier 33 and the piezoelectric plate structure 111 of the second driving element 45. After the adhesive is cured, the second elastic element 461 is formed between the piezoelectric plate structure 111 of the second driving element 45 and the outer frame carrier 33. It should be understood that in this example, the second elastic element 461 can provide pre-pressure while also enabling the second driving element 45 to be fixed to the surface of the inner side wall of the outer frame carrier 33. Preferably, the second elastic element 461 has a relatively high flatness, that is, when applying the adhesive, the applied adhesive is ensured to have a relatively high flatness and uniformity as much as possible. Using an adhesive with a thickness of 10um to 50um can improve the flatness of the adhesive, so that the second driving element 45 can be fixed flatly on the surface of the inner wall of the outer frame carrier 33, thereby improving the driving stability of the second driving element 45.

[0108] It is worth mentioning that in other embodiments of the present application, the first elastic element 431 and the second elastic element 461 can also be implemented as non-viscous elastic elements, for example, rubber whose material itself has elasticity, or springs and leaf springs that generate elasticity due to deformation, etc., which are also not limited to the present application.

[0109] It is worth mentioning that in other modified embodiments of the present application, the structural configurations of the first pre-pressing component 43 and the second pre-pressing component 46 can also be adjusted. Specifically, Figure 5 As shown, in other examples of the present application, the first pre-stressing component 43 includes a first magnetic element 52 arranged on the first frame carrier 31 and a second magnetic element 53 arranged on the second frame carrier 44 and corresponding to the first magnetic element 52, so as to force the first driving element 42 to be frictionally coupled to the first frame carrier 31 through the magnetic attraction between the first magnetic element 52 and the second magnetic element 53.

[0110] Accordingly, in this modified implementation, the first magnetic element 52 and the second magnetic element 53 refer to magnetic components that can attract each other. For example, the first magnetic element 52 can be implemented as a magnet, and the second magnetic element 53 can be implemented as a magnetic component, for example, a material made of metals such as iron, nickel, and cobalt; for another example, the first magnetic element 52 can be implemented as a magnet, and the second magnetic element 53 can also be implemented as a magnet.

[0111] The second pre-stressing component 46 includes a third magnetic element 62 arranged on the second frame carrier 32 and a fourth magnetic element 63 arranged on the outer frame carrier 33 and corresponding to the third magnetic element 62, so as to force the second driving element 45 to be frictionally coupled to the second frame carrier 32 through the magnetic attraction between the third magnetic element 62 and the fourth magnetic element 63.

[0112] In this modified implementation, the third magnetic element 62 and the fourth magnetic element 63 refer to magnetic components that can attract each other. For example, the third magnetic element 62 can be implemented as a magnet, and the fourth magnetic element 63 can be implemented as a magnetic component, for example, a material made of metals such as iron, nickel, and cobalt; for another example, the third magnetic element 62 can be implemented as a magnet, and the fourth magnetic element 63 can also be implemented as a magnet.

[0113] In order to enable the first driving element 42 and the second driving element 45 to drive the first frame carrier 31 and the second frame carrier 32 more stably, as shown in FIG. Figures 3A to 3C As shown, the driving assembly 40 further includes a first guiding mechanism 48 arranged between the first frame carrier 31 and the second frame carrier 32, and a second guiding mechanism 49 arranged between the second frame carrier and the outer frame carrier 33, wherein the first guiding mechanism 48 is configured to guide the first frame carrier 31 to move along the first direction, and the second guiding mechanism 49 is configured to guide the second frame carrier 32 to move along the second direction.

[0114] More specifically, if Figures 3A to 3C As shown, in this embodiment, the first guide mechanism 48 and the second guide mechanism 49 are implemented as guide rod structures. Accordingly, the first guide mechanism 48 includes a first guide rod disposed on the outer wall of the first frame carrier 31 and extending along the first direction, wherein both ends of the first guide rod are fixed to the inner wall of the second frame carrier 32. Specifically, in this embodiment, the first guide rod is disposed opposite the first drive element 42. Thus, when the first drive element 42 is turned on, the first frame carrier 31 is guided to move along the direction in which the first guide rod extends, thereby improving the movement stability of the first frame carrier 31.

[0115] Accordingly, in this embodiment, the second guiding mechanism 49 includes a second guide rod disposed on the outer sidewall of the second frame carrier 32 and extending along the second direction, wherein both ends of the second guide rod are fixed to the inner sidewall of the outer frame carrier 33. In particular, in this embodiment, the second guide rod is disposed opposite the second driving element 45. Thus, after the second driving element 45 is turned on, the second frame carrier 32 is guided to move along the direction in which the second guide rod extends, thereby improving the movement stability of the second frame carrier 32.

[0116] It is worth mentioning that in other embodiments of the present application, the first guiding mechanism 48 and the second guiding mechanism 49 can also be implemented based on other principles, for example, through a ball-groove mechanism, a slider-groove mechanism, etc., which is not limited to the present application.

[0117] In order to optimize the driving performance of the first driving element 42 and the second driving element 45, in the embodiment of the present application, Figures 3A to 3C As shown, the driving assembly 40 further includes a first friction actuating part 131 and a second friction actuating part 132, wherein the first friction actuating part 131 is arranged between the first driving element 42 and the first frame carrier 31 and the friction driving part 112 of the first driving element 42 abuts against the first friction actuating part 131 under the action of the first pre-pressing component 43, and the first friction actuating part 131 abuts against the surface of the outer wall of the first frame carrier 31. In this way, the friction driving force provided by the first driving element 42 can act on the first frame carrier 31 through the first friction actuating part 131 to drive the first frame carrier 31 and the optical lens 20 to move along the first direction. That is, in this modified embodiment, the pre-pressure between the friction driving part 112 of the first driving element 42 and the first frame carrier 31 is an indirect pre-pressure, that is, although the friction driving part 112 of the first driving element 42 and the first frame carrier 31 are not in direct contact, there is still pre-pressure between the two so that the friction driving part 112 of the first driving element 42 can drive the first frame carrier 31 by friction driving.

[0118] Correspondingly, the second friction actuating part 132 is arranged between the second driving element 45 and the second frame carrier 32 and the friction driving part 112 of the second driving element 45 contacts the second friction actuating part 132 under the action of the second pre-pressing component 46, and the second friction actuating part 132 contacts the surface of the outer wall of the second frame carrier 32. In this way, the friction driving force provided by the second driving element 45 can act on the second frame carrier 32 through the second friction actuating part 132 to drive the second frame carrier 32, the first frame carrier 31 and the optical lens 20 to move along the second direction to perform optical image stabilization in the second direction.

[0119] More specifically, if Figures 3A to 3C In this embodiment, the first friction actuating part 131 has a first surface and a second surface opposite to the first surface, wherein, under the action of the first pre-pressing component 43, the first surface of the first friction actuating part 131 abuts against the surface of the outer wall of the first frame carrier 31, and its second surface abuts against the end face of the second end of at least one of the multiple friction driving elements 121. In this way, the friction driving part 112 of the first driving element 42 abuts against the first friction actuating part 131 and the first friction actuating part 131 abuts against the first frame carrier 31. In this way, the friction driving force provided by the first driving element 42 can act on the first frame carrier 31 through the first friction actuating part 131. Correspondingly, the second friction actuating part 132 has a third surface and a fourth surface opposite to the third surface, wherein, under the action of the second pre-pressing component 46, the third surface of the second friction actuating part 132 abuts against the surface of the outer wall of the second frame carrier 32, and the fourth surface abuts against the end face of the second end of at least one of the multiple friction driving elements 121. In this way, the friction driving part 112 of the second driving element 45 abuts against the second friction actuating part 132 and the second friction actuating part 132 abuts against the second frame carrier 32. In this way, the friction driving force provided by the second driving element 45 can act on the second frame carrier 32 through the second friction actuating part 132.

[0120] It is worth mentioning that although Figures 3A to 3CIn the illustrated embodiment, the first friction actuating portion 131 and the second friction actuating portion 132 are provided as separate components between the first drive element 42 and the first frame carrier 31, and between the second drive element 45 and the second frame carrier 32, respectively. For example, the first friction actuating portion 131 is implemented as a separate component and attached to the side surface of the first frame carrier 31, or the second friction actuating portion 132 is implemented as a separate component and attached to the side surface of the second frame carrier 32. For another example, the first friction actuating portion 131 is implemented as a coating applied to the side surface of the first frame carrier 31, or the second friction actuating portion 132 is implemented as a coating applied to the side surface of the second frame carrier 32. It should be understood that in other examples of the present application, the first friction actuating portion 131 may also be integrally formed on the surface of the outer side wall of the first frame carrier 31, that is, the first friction actuating portion 131 and the first frame carrier 31 have an integral structure. Of course, in other examples of the present application, the second friction actuating portion 132 may also be integrally formed on the surface of the outer side wall of the second frame carrier 32 , that is, the second friction actuating portion 132 and the second frame carrier 32 have an integral structure.

[0121] Further, if Figure 1 and Figures 3A to 3C As shown, in the embodiment of the present application, the first frame carrier 31 has a first groove 310 formed concavely on its surface, and the first friction actuating portion 131 is disposed in the first groove 310. Preferably, the first friction actuating portion 131 is adapted to the shape and size of the first groove 310, so that the first friction actuating portion 131 can be fitfully engaged in the first groove 310. Similarly, the second frame carrier 32 has a second groove 320 formed concavely on its surface, and the second friction actuating portion 132 is disposed in the first groove 320. Preferably, the second friction actuating portion 132 is adapted to the shape and size of the second groove 320, so that the second friction actuating portion 132 can be fitfully engaged in the second groove 320.

[0122] Figure 6 The figure shows a schematic diagram of a modified implementation of the camera module according to an embodiment of the present application. Figure 1 The examples shown are as follows: Figure 6As shown, in this modified embodiment, the first groove 310 has a relatively larger size so that the first driving element 42 can be partially accommodated in the first groove 310. More specifically, in this modified embodiment, the shape of the first groove 310 is adapted to the shape of the first driving element 42, and the piezoelectric plate structure 111 of the first driving element 42 is adapted to be at least partially accommodated in the first groove. In this way, when the first driving element 42 drives the first frame carrier 31 in the first groove 310, the first groove 310 itself forms a guide groove for guiding the movement of the first driving element 42. In other words, in this modified embodiment, the first groove 310 not only provides an installation space for the first driving element 42, but also forms a guide structure for guiding the movement of the first driving element 42 (or, in other words, regulating the movement of the first driving element 42).

[0123] Accordingly, in this modified embodiment, the second groove 320 has a relatively larger size so that the second driving element 45 can be partially accommodated within the second groove 320. More specifically, in this modified embodiment, the shape of the second groove 320 is adapted to the shape of the second driving element 45, and the piezoelectric plate structure 111 of the second driving element 45 is adapted to be at least partially accommodated within the first groove. Thus, when the second driving element 45 drives the first frame carrier 31 within the second groove 320, the second groove 320 itself forms a guide groove for guiding the movement of the second driving element 45. In other words, in this modified embodiment, the second groove 320 not only provides an installation space for the second driving element 45, but also forms a guide structure for guiding the movement of the second driving element 45 (or, in other words, regulating the movement of the second driving element 45).

[0124] Similarly, when the second driving element 45 drives the second frame carrier 32 within the second groove 320, the second groove 320 itself forms a guide groove for guiding the movement of the second frame carrier 32. That is, in this modified embodiment, the second groove 320 not only provides an installation space for the second driving element 45, but also forms a guide structure for guiding the movement of the second frame carrier 32 (or, in other words, regulating the movement of the second driving element 45).

[0125] Figure 7 FIG2 is a schematic diagram showing another variant implementation of the camera module according to an embodiment of the present application. Figure 7As shown, in this modified embodiment, the first frame carrier 31 has a first groove 310 concavely formed on a side surface thereof and extending laterally, and the second frame carrier 32 has a second groove 320 concavely formed on a side surface thereof and extending laterally.

[0126] In particular, compared to Figure 1 and Figure 6 In the example shown, in this modified embodiment, the shapes and dimensions of the first groove 310 and the second groove 320 are adjusted. Specifically, the dimensions and shape of the first groove 310 enable the friction driving portion 112 of the first driving element 42 to fit within the first groove 310. Simultaneously, the dimensions and shape of the second groove 320 enable the friction driving portion 112 of the second driving element 45 to fit within the second groove 451. That is, in this embodiment, the first groove 310 not only forms a receiving groove for accommodating the first friction actuating portion 131, but also forms a guide groove for guiding the friction driving portion 112 of the first driving element 42; and the second groove 320 not only forms a receiving groove for accommodating the second friction actuating portion 132, but also forms a guide groove for guiding the friction driving portion 112 of the second driving element 45.

[0127] Furthermore, in this modified embodiment, the first groove 441 has a reduced diameter, and / or the second groove 320 has a reduced diameter. That is, in this modified embodiment, the diameter of the first groove 310 gradually decreases along the width direction of the first frame carrier 31 in a direction away from the first driving element 42, and the diameter of the second groove 45 gradually decreases along the width direction of the second frame carrier 32 in a direction away from the second driving element 45.

[0128] It should be understood that after the first and second drive elements 42 and 45 have operated for a period of time, the friction drive portions 112 of the first and second drive elements 42 and 45 may wear out. Accordingly, under the action of the first and second pre-compression components 43 and 46, the friction drive portion 112 of the first and second drive elements 42 extends further into the first groove 310, and the friction drive portion 112 of the second drive element 45 extends further into the second groove 320. Thus, due to the reduced diameters of the first and second grooves 310 and 320, the friction drive portion 112 of the first and second drive elements 42 can re-engage with the first friction actuating portion 131 disposed within the first groove 310, and the friction drive portion 112 of the second drive element 45 can re-engage with the second friction actuating portion 132 disposed within the second groove 320. This extends the service life of the first and second drive elements 42 and 45, thereby extending the service life of the camera module.

[0129] Figure 8 FIG2 is a schematic diagram showing another variant implementation of the camera module according to an embodiment of the present application. Figure 1 As shown in the example, in this modified embodiment, the arrangement of the first driving element 42 and the second driving element 45 is adjusted.

[0130] Specifically, in Figure 1 In the illustrated example, the first driving element 42 is located on the side of the first frame carrier 31, and the second driving element 45 is located on the side of the second frame carrier 32. Figure 8 As shown, in this modified embodiment, the first driving element 42 is located on the upper part of the first frame carrier 31 , and the second driving element 45 is located on the upper part of the second frame carrier 32 .

[0131] In a specific example of this modified embodiment, the first drive element 42 is clamped and disposed between the first frame carrier 31 and the second frame carrier 32 via the first pre-pressing component 43. In this way, the first drive element 42 is frictionally coupled to the first frame carrier 31. The second drive element 45 is clamped and disposed between the second frame carrier 32 and the outer frame carrier 33 via the second pre-pressing component 46. In this way, the second drive element 45 is frictionally coupled to the second frame carrier 32.

[0132] In accordance therewith, the driving assembly 40 further comprises a first guide mechanism 48 disposed between the first frame carrier 31 and the second frame carrier 32 and a second guide mechanism 49 disposed between the second frame carrier and the outer frame carrier 33. Figures 3A to 3C and Figure 7 The difference from the illustrated example is that in this modified embodiment, the first guide mechanism 48 and the second guide mechanism 49 are implemented as ball-groove mechanisms, such as Figure 8 shown.

[0133] Figure 9 FIG2 is a schematic diagram showing another variant implementation of the camera module according to an embodiment of the present application. Figure 1 As shown in the example, in this modified embodiment, the arrangement of the first driving element 42 and the second driving element 45 is adjusted again.

[0134] Specifically, in this modified embodiment, the first driving element 42 is located at the lower portion of the first frame carrier 31 , and the second driving element 45 is located at the lower portion of the second frame carrier 32 .

[0135] In a specific example of this modified embodiment, the first drive element 42 is clamped and disposed between the first frame carrier 31 and the second frame carrier 32 via the first pre-pressing component 43. In this way, the first drive element 42 is frictionally coupled to the first frame carrier 31. The second drive element 45 is clamped and disposed between the second frame carrier 32 and the outer frame carrier 33 via the second pre-pressing component 46. In this way, the second drive element 45 is frictionally coupled to the second frame carrier 32.

[0136] In accordance therewith, the driving assembly 40 further comprises a first guide mechanism 48 disposed between the first frame carrier 31 and the second frame carrier 32 and a second guide mechanism 49 disposed between the second frame carrier and the outer frame carrier 33. Figures 3A to 3C and Figure 7 The difference from the illustrated example is that in this modified embodiment, the first guide mechanism 48 and the second guide mechanism 49 are implemented as ball-groove mechanisms, such as Figure 9 shown.

[0137] In summary, the camera module based on the embodiment of the present application is explained, wherein the camera module adopts the piezoelectric actuator 100 as a driver to not only meet the driving requirements of the camera module for optical performance adjustment, but also meet the development needs of lightweight and thin camera modules.

[0138] Although, in the embodiment of the present application, the camera module is taken as an example of a traditional upright camera module, a person skilled in the art should understand that the piezoelectric actuator 100 according to the embodiment of the present application can also be used as a driver in a periscope camera module, and this is not limited to the present application.

[0139] Those skilled in the art will appreciate that the embodiments of the present invention described above and shown in the accompanying drawings are intended to be illustrative only and are not intended to limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and illustrated in the embodiments. Any variations or modifications may be made to the embodiments of the present invention without departing from the principles described.

Claims

1. A camera module, characterized in that: include: The photosensitive component includes: a circuit board and a photosensitive chip electrically connected to the circuit board; A frame carrier assembly mounted on the photosensitive component, wherein the frame carrier assembly includes a first frame carrier and a second frame carrier external to the first frame carrier; an optical lens mounted in the first frame carrier and held on a light-sensing path of the light-sensing component, the optical lens having an optical axis; and A drive assembly includes: a first drive element and a first pre-stressing component, wherein the first drive element is implemented as a piezoelectric actuator, wherein the first drive element is frictionally coupled to the first frame carrier via the first pre-stressing component and is configured to, after being driven, move in a two-dimensional trajectory in a plane perpendicular to the optical axis in a manner of bending vibration along two directions, thereby driving the first frame carrier through friction to drive the entire optical lens to move in a first direction perpendicular to the optical axis; the piezoelectric actuator includes: an actuation system and a drive circuit system, wherein the actuation system, under the control of the drive circuit system, moves in a two-dimensional trajectory along a preset direction in a manner of bending vibration along two directions; the actuation system includes: a piezoelectric plate structure and a friction drive portion fixed to the piezoelectric plate structure, wherein the friction drive portion, implemented as the first drive element of the piezoelectric actuator, is frictionally coupled to the first frame carrier; The drive assembly further includes a first friction actuating portion, the first friction actuating portion being clamped between the friction driving portion of the first drive element and the first frame carrier, so that the first drive element is frictionally coupled to the first frame carrier via the first friction actuating portion and the first pre-compression component; The first frame carrier includes a first groove concavely formed on a surface thereof, and the first friction actuating portion is disposed in the first groove, wherein the first groove forms a guide slot for guiding the first driving element.

2. The camera module according to claim 1, wherein: The frame carrier assembly further includes an outer frame carrier external to the second frame carrier, wherein the drive assembly further includes a second drive element and a second pre-stressing component, and the second drive element is implemented as the piezoelectric actuator, wherein the second drive element is frictionally coupled to the second frame carrier through the second pre-stressing component and is configured to move in a two-dimensional trajectory in a plane perpendicular to the optical axis in a manner of bending vibration along two directions after being driven, thereby driving the second frame carrier through friction to drive the first frame carrier and then drive the optical lens to move in a second direction perpendicular to the optical axis, and the second direction is perpendicular to the first direction.

3. The camera module according to claim 2, wherein: The friction drive portion of the second drive element, which is implemented as a piezoelectric actuator, is frictionally coupled to the second frame carrier.

4. The camera module according to claim 3, wherein: The piezoelectric plate structure has a first side surface extending along its depth direction and a second side surface extending along its height direction and adjacent to the first side surface, wherein the piezoelectric plate structure has a first resonant frequency along its depth direction and a second resonant frequency along its height direction, wherein the second resonant frequency is greater than the first resonant frequency.

5. The camera module according to claim 4, wherein: The piezoelectric plate structure includes a first piezoelectric region, a second piezoelectric region and a third piezoelectric region formed on the second side surface, and a fourth piezoelectric region formed on the first side surface, wherein the second piezoelectric region is located between the first piezoelectric region and the third piezoelectric region, and the fourth piezoelectric region is adjacent to the second piezoelectric region; wherein the piezoelectric plate structure further includes a first electrode pair electrically connected to the first piezoelectric region, a second electrode pair electrically connected to the second piezoelectric region, a third electrode pair electrically connected to the third piezoelectric region and a fourth electrode pair electrically connected to the fourth piezoelectric region.

6. The camera module according to claim 5, wherein: The driving circuit system includes a first driving circuit and a second driving circuit, the first driving circuit is electrically connected to the first electrode pair and the third electrode pair, and the second driving circuit is electrically connected to the second electrode pair and the fourth electrode pair; wherein the vibration frequency of the circuit vibration signal output by the first driving circuit and the second driving circuit is equal to the first resonant frequency or the second resonant frequency.

7. The camera module according to claim 6, wherein: When the vibration frequency of the circuit vibration signal output by the first driving circuit is the first resonant frequency, the piezoelectric plate structure resonates in its height direction and partially resonates in its depth direction, so that the piezoelectric plate structure moves in a two-dimensional trajectory along the preset direction in a manner of bending vibration along two directions; wherein, when the vibration frequency of the circuit vibration signal input by the second driving circuit is the second resonant frequency, the piezoelectric plate structure resonates in its depth direction and partially resonates in its height direction, so that the piezoelectric plate structure moves in a two-dimensional trajectory along the preset direction in a manner of bending vibration along two directions.

8. The camera module according to claim 7, wherein: The drive assembly further includes a second friction actuating portion, which is clamped between the friction driving portion of the second drive element and the second frame carrier, so that the second drive element is frictionally coupled to the second frame carrier through the second pre-pressing component and the second friction actuating portion.

9. The camera module according to claim 8, wherein: The first driving element is located on a side of the first frame carrier.

10. The camera module according to claim 8, wherein: The first driving element is located on an upper portion of the first frame carrier.

11. The camera module according to claim 8, wherein: The first driving element is located at the lower portion of the first frame carrier.

12. The camera module according to claim 9, wherein: The second drive element is clamped between the second frame carrier and the outer frame carrier by the second pre-pressing component and the second friction actuating portion, in such a way that the second drive element is frictionally coupled to the second frame carrier, wherein the second drive element is located on the side of the second frame carrier.

13. The camera module according to claim 10, wherein: The second drive element is clamped between the second frame carrier and the outer frame carrier by the second pre-pressing component and the second friction actuating part, in this way, the second drive element is frictionally coupled to the second frame carrier, wherein the second drive element is located at the upper part of the second frame carrier.

14. The camera module according to claim 11, wherein: The second drive element is clamped between the second frame carrier and the outer frame carrier by the second pre-pressing component and the second friction actuating part, in this way, the second drive element is frictionally coupled to the second frame carrier, wherein the second drive element is located at the lower part of the second frame carrier.

15. The camera module according to claim 12, wherein: The first pre-stressing component includes a first elastic element, which is arranged between the piezoelectric plate structure of the first driving element and the second frame carrier, so that the friction driving part of the first driving element is forced to press against the first friction actuating part by the elastic force of the first elastic element, so that the first driving element is frictionally coupled to the first frame carrier; the second pre-stressing component includes a second elastic element, which is arranged between the piezoelectric plate structure of the second driving element and the outer frame carrier, so that the friction driving part of the second driving element is forced to press against the second friction actuating part by the elastic force of the second elastic element, so that the second driving element is frictionally coupled to the second frame carrier.

16. The camera module according to claim 13, wherein: The first pre-stressing component includes a first elastic element, which is arranged between the piezoelectric plate structure of the first driving element and the second frame carrier, so that the friction driving part of the first driving element is forced to press against the first friction actuating part by the elastic force of the first elastic element, so that the first driving element is frictionally coupled to the first frame carrier; the second pre-stressing component includes a second elastic element, which is arranged between the piezoelectric plate structure of the second driving element and the outer frame carrier, so that the friction driving part of the second driving element is forced to press against the second friction actuating part by the elastic force of the second elastic element, so that the second driving element is frictionally coupled to the second frame carrier.

17. The camera module according to claim 14, wherein: The first pre-stressing component includes a first elastic element, which is arranged between the piezoelectric plate structure of the first driving element and the second frame carrier, so that the friction driving part of the first driving element is forced to press against the first friction actuating part by the elastic force of the first elastic element, and in this way, the first driving element is frictionally coupled to the first frame carrier; the second pre-stressing component includes a second elastic element, which is arranged between the piezoelectric plate structure of the second driving element and the outer frame carrier, so that the friction driving part of the second driving element is forced to press against the second friction actuating part by the elastic force of the second elastic element, and in this way, the second driving element is frictionally coupled to the second frame carrier.

18. The camera module according to any one of claims 15 to 17, wherein: The first elastic element and the second elastic element are implemented as adhesives having elasticity.

19. The camera module according to claim 18, wherein: The thickness of the first elastic element and the second elastic element is between 10 μm and 50 μm.

20. The camera module according to any one of claims 11 to 13, wherein: The first pre-stressing component includes a first magnetic element arranged on the first frame carrier and a second magnetic element arranged on the second frame carrier and corresponding to the first magnetic element, so as to force the friction driving part of the first driving element to press against the first friction actuating part through the magnetic attraction between the first magnetic element and the second magnetic element. In this way, the first driving element is frictionally coupled to the first frame carrier; the second pre-stressing component includes a third magnetic element arranged on the second frame carrier and a fourth magnetic element arranged on the outer frame carrier and corresponding to the third magnetic element, so as to force the friction driving part of the second driving element to press against the second friction actuating part through the magnetic attraction between the third magnetic element and the fourth magnetic element. In this way, the second driving element is frictionally coupled to the second frame carrier.

21. The camera module according to claim 8, wherein: The second frame carrier includes a second groove concavely formed on a surface thereof, and the second friction actuating portion is disposed in the second groove, wherein the second groove forms a guide slot for guiding the movement of the second driving element.

22. The camera module according to claim 21, wherein: The first groove has a reduced diameter, and / or the second groove has a reduced diameter.

23. The camera module according to claim 8, wherein: The driving assembly further includes a first guide mechanism disposed between the first frame carrier and the second frame carrier and a second guide mechanism disposed between the second frame carrier and the outer frame carrier.

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