Storage device and method for detecting storage device installation status

Abstract

The present disclosure provides a memory device and a method for detecting the installation state of the memory device, the memory device is installed on a mainboard, comprising a body and a detection device, the body comprises two opposite sides, each side has a positioning groove, the positioning groove is used for cooperating with a positioning part of the mainboard to fix the memory device; the detection device is arranged in the positioning groove, and the detection device is used for detecting the installation state of the memory device. By arranging the detection device in the positioning groove of the side of the body of the memory device, the state of the detection device will change due to the cooperation state of the positioning groove and the positioning part of the mainboard during the installation process of the memory device, and the installation state of the memory device can be determined by the state of the detection device, and then the installation stability of the memory device can be quickly determined, thereby saving time cost.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of semiconductor technology, and in particular, to a memory device and a method for detecting an installation state of the memory device. BACKGROUND

[0002] When the memory device is installed in a terminal device, the memory device can temporarily store operation data in a CPU (central processing unit) and data exchanged with an external memory such as a hard disk.

[0003] In the related art, when checking the installation state of the memory device, the memory device needs to be powered on, and the installation state of the memory device can be determined only after checking on the terminal device. This process is relatively cumbersome. SUMMARY

[0004] The following is a summary of the subject matter of the detailed description of the present disclosure. This summary is not intended to limit the scope of protection of the claims.

[0005] The present disclosure provides a memory device and a method for detecting an installation state of the memory device.

[0006] According to a first aspect of some embodiments of the present disclosure, a memory device is provided, which is installed on a mainboard, and the memory device comprises:

[0007] a body, the body comprising two opposite sides, each of the sides having a positioning groove, the positioning groove being configured to cooperate with a positioning portion of the mainboard to fix the memory device;

[0008] a detection device, the detection device being arranged in the positioning groove, and the detection device being configured to detect an installation state of the memory device.

[0009] According to some embodiments of the present disclosure, the detection device comprises a trigger portion and a detection circuit, and in the assembled state, the positioning portion of the mainboard presses the trigger portion to adjust the relative position between the trigger portion and the detection circuit, so as to control the conduction state of the detection circuit.

[0010] According to some embodiments of the present disclosure, the detection circuit comprises a first branch and a second branch arranged in parallel;

[0011] When the trigger portion is in an untriggered position, the first branch is in a conduction state;

[0012] When the trigger portion is in a first position, the first branch and the second branch are both in an open circuit state;

[0013] When the trigger portion is in a second position, the second branch is in a conduction state;

[0014] The first position is between the untriggered position and the second position.

[0015] According to some embodiments of the present disclosure, the first branch includes a first indicator light, and the second branch includes a second indicator light, the color of the first indicator light being different from that of the second indicator light.

[0016] When the first branch is turned on, the first indicator light is lit.

[0017] When the second branch is turned on, the second indicator light is lit.

[0018] According to some embodiments of the present disclosure, the trigger part includes a trigger assembly and a press switch connected to the trigger assembly, the trigger assembly being moved from the untriggered position to the second position when the trigger assembly is pressed.

[0019] According to some embodiments of the present disclosure, the trigger assembly includes a moving piece and a push rod, one end of the push rod being connected to the moving piece, and the other end of the push rod being connected to the press switch.

[0020] According to some embodiments of the present disclosure, the trigger assembly further includes a reset piece connected to the moving piece, the reset piece being configured to provide a reset force to the moving piece.

[0021] According to some embodiments of the present disclosure, the reset piece includes a spring.

[0022] According to some embodiments of the present disclosure, the body further includes a top surface, at least one first notch being arranged on the top surface, and a second notch being arranged above the positioning groove.

[0023] According to some embodiments of the present disclosure, the first notch and the second notch are arc-shaped notches.

[0024] According to some embodiments of the present disclosure, the chord length of the first notch is 20-25 mm, and the arc height of the first notch is 4-6 mm.

[0025] According to some embodiments of the present disclosure, the chord length of the second notch is 7-9 mm, the arc height of the second notch is 2-4 mm, and the distance between the second notch and the top surface is the same as the distance between the second notch and the positioning groove.

[0026] According to a second aspect of the embodiments of the present disclosure, a storage device is provided, which includes a mainboard and the storage device as provided in the first aspect of the embodiments of the present disclosure, the storage device being mounted on the mainboard.

[0027] According to a third aspect of an embodiment of the present disclosure, a method for detecting the installation status of a storage device is provided. The method is applied to the storage device provided in the first aspect of the embodiment of the present disclosure, and the method includes:

[0028] When the trigger portion of the detection device of the storage device is in an untriggered position, the detection device is in a first state, and the first state is used to indicate that the storage device is in an unmounted state;

[0029] When the trigger portion is in the first position, the detection device is in a second state, and the second state is used to indicate that the storage device is in an incorrect installation state;

[0030] When the trigger portion is in the second position, the detection device is in a third state, and the third state is used to indicate that the storage device is in an installed state;

[0031] Wherein, the first position is located between the untriggered position and the second position.

[0032] According to some embodiments of the present disclosure, when the detection device is in the first state, the first indicator light is on;

[0033] When the detection device is in the third state, the second indicator light is on;

[0034] When the detection device is in the second state, both the first indicator light and the second indicator light are off;

[0035] The first indicator light and the second indicator light have different colors.

[0036] The present disclosure provides a storage device and a method for detecting the installation status of a storage device. By setting a detection device in a positioning groove on the side of the main body of the storage device, during the installation process of the storage device, the state of the detection device will change due to the matching state between the positioning groove and the positioning portion of the mainboard. The installation status of the storage device can be determined by the state of the detection device, and the installation stability of the storage device can be quickly determined, saving time and cost.

[0037] Still other aspects will become apparent upon reading and understanding the accompanying drawings and detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The accompanying drawings, which are incorporated into and constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, are used to explain the principles of the embodiments of the present disclosure. In these drawings, similar reference numerals are used to represent similar elements. The drawings described below are some embodiments of the present disclosure, not all embodiments. For those skilled in the art, other drawings can be derived from these drawings without inventive effort.

[0039] Figure 1 is a structural diagram of a memory device according to an exemplary embodiment;

[0040] Figure 2 is an internal structural diagram of a detection device according to an exemplary embodiment;

[0041] Figure 3 is a detection circuit diagram of a detection device according to an exemplary embodiment;

[0042] Figure 4 is a structural diagram of a memory device according to an exemplary embodiment;

[0043] Figure 5 The figure is a flowchart showing a method for detecting the installation status of a storage device according to an exemplary embodiment. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present disclosure. It should be noted that, in the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be arbitrarily combined with each other.

[0045] When installed in a terminal device, a storage device can temporarily store CPU computation data and exchange data with external storage devices such as hard drives. In related technologies, checking the installation status of a storage device requires powering it on and performing an inspection on the terminal device to confirm its installation status. This process is cumbersome and complex.

[0046] Based on this, the present disclosure provides a storage device that is installed on a motherboard. The storage device includes a body and a detection device. The body includes two opposing side surfaces, each of which has a positioning groove. The positioning groove is used to cooperate with a positioning portion of the motherboard to secure the storage device. The detection device is disposed in the positioning groove and is used to detect the installation status of the storage device. By disposing the detection device in the positioning groove on the side of the storage device body, during the installation process of the storage device, the state of the detection device will change depending on the cooperation state of the positioning groove and the positioning portion of the motherboard. The installation status of the storage device can be determined based on the state of the detection device, thereby quickly determining the installation stability of the storage device, saving time and costs.

[0047] The present disclosure is described below with reference to the accompanying drawings and specific embodiments.

[0048] An exemplary embodiment of the present disclosure provides a memory device, such as Figure 1 As shown, Figure 1 A storage device 100 is shown according to an exemplary embodiment and is installed on a mainboard. The storage device 100 includes a main body 1 and a detection device 2. The main body 1 includes two opposite side surfaces 11. Each side surface 11 has a positioning groove 111. The positioning groove 111 is used to cooperate with the positioning portion of the mainboard to fix the storage device 100; the detection device 2 is arranged in the positioning groove 111, and the detection device 2 is used to detect the installation status of the storage device 100.

[0049] The memory device 100 is a computer component that can be addressed by the CPU of the terminal device through a bus and perform read and write operations. For example, it can be a memory stick. The memory stick may include DIMM (Dual-Inline-Memory-Modules), SO-DIMM (Small Outline DIMM), UDIMM (Unbuffered DIMM or Unregistered DIMM), RDIMM (Registered DIMM), FB-DIMM (Fully Buffered-DIMM), etc.

[0050] The motherboard is the core of the terminal device's hardware system. It houses the terminal device's primary circuitry, including components such as the BIOS (Basic Input / Output System) chip, I / O control chip, keyboard and panel control switch interface, indicator light connectors, expansion slots, and DC power connectors for the motherboard and add-in cards. The motherboard primarily transmits electronic signals. When the memory device 100 is installed on the motherboard, it acts as a bridge between external memory and the CPU. During terminal device operation, the operating system retrieves data from the memory device 100 and transfers it to the CPU for computation, before transmitting the results.

[0051] The main body 1 of the memory device 100 is mainly composed of a memory chip, a circuit board, a connecting finger (gold finger), etc. The main body 1 includes two opposite side surfaces 11, each of which is provided with a positioning groove 111. The positioning groove 111 on each side surface 11 can be provided with one or more. During the installation process of the memory device 100, the main body 1 is connected with the positioning part of the main board. The positioning part can be, for example, a memory slot on the main board. The bottom surface 12 of the main body 1 is inserted into the memory slot. The gold finger of the main body 1 cooperates with the pins in the memory slot, so that the memory device 100 is electrically connected to the terminal device. At the same time, the positioning groove 111 on the main body 1 cooperates with the positioning part, for example, with the fixing clips on both sides of the memory slot. The fixing clips can be pressed into the positioning groove 111 to fix the memory device 100, thereby ensuring the installation stability and reliability of the memory device 100.

[0052] The detection device 2 is arranged in the positioning groove 111. During the installation process of the storage device 100, since the positioning part of the mainboard will be pressed into the positioning groove 111, the detection device 2 will be in different states due to the different squeezing forces of the positioning part. If the positioning groove 111 does not cooperate with the positioning part, the detection device 2 will not be squeezed by the positioning part. At this time, the state of the detection device 2 can indicate that the storage device 100 is not installed; if the positioning groove 111 is fully matched with the positioning part, the detection device 2 will be fully squeezed by the positioning part. At this time, the state of the detection device 2 can indicate that the storage device 100 is in an installed state; if the main body 1 is skewed or not fully inserted during the process of inserting the main body 1 into the memory slot, the positioning groove 111 is not fully matched with the positioning part, and the detection device 2 will also be incompletely squeezed by the positioning part. At this time, the state of the detection device 2 can indicate that the storage device 100 is in an incorrectly installed state. Therefore, the detection device 2 can detect the installation state of the storage device 100 to quickly determine the installation stability of the storage device 100, improve installation reliability, and save time and cost.

[0053] For example, the detection device 2 may be a display device that can display different states depending on the force applied, or a voice prompt device that can emit different prompt sounds depending on the force applied, etc. The detection device 2 may be any device that displays different states depending on the force applied, so as to detect different installation states of the storage device 100, and this disclosure does not impose any limitation on this.

[0054] In an exemplary embodiment, Figure 2 As shown, the detection device 2 includes a trigger part 21 and a detection circuit 22. In the assembled state, the positioning part of the mainboard squeezes the trigger part 21 to adjust the relative position between the trigger part 21 and the detection circuit 22 to control the conduction state of the detection circuit 22.

[0055] The detection device 2 includes a trigger portion 21 and a detection circuit 22. The position of the detection circuit 22 is fixed. The detection circuit 22 can be connected to a power signal line inside the storage device 100, for example, so that the detection circuit 22 is powered on for detection. The position of the trigger portion 21 is set to be adjustable. The trigger portion 21 can include, for example, a component that can be retracted or rotated under force. The end of the trigger portion 21 that contacts the detection circuit 22 can be provided with a conductive material to control the conduction of the detection circuit 22. When the relative positions of the trigger portion 21 and the detection circuit 22 are different, the conduction state of the detection circuit 22 is also different. The detection circuit 22 may include an indicator device. When the conduction state of the detection circuit 22 is different, the indicator device can emit different indication signals. The different indication signals of the indicator device of the detection circuit 22 can be used to detect the installation state of the storage device 100.

[0056] During the installation of the memory device 100, the mainboard's positioning portion can cooperate with the positioning groove 111 to squeeze the detection device 2 in the positioning groove 111. Therefore, the trigger portion 21 is compressed or rotated by the different squeezing forces of the mainboard's positioning portion, thereby changing the relative position of the trigger portion 21 and the detection circuit 22, causing the detection circuit 22 to be in different conduction states, thereby representing different installation states of the memory device 100.

[0057] In an exemplary embodiment, Figure 2 As shown, the detection circuit 22 includes a first branch 221 and a second branch 222 arranged in parallel; when the trigger part 21 is in the untriggered position, the first branch 221 is turned on; when the trigger part 21 is in the first position, the first branch 221 and the second branch 222 are both in an open circuit state; when the trigger part 21 is in the second position, the second branch 222 is turned on; wherein the first position is located between the untriggered position and the second position.

[0058] The first branch 221 and the second branch 222 are arranged in parallel so that when the trigger part 21 is subjected to different squeezing forces and is in different positions, the first branch 221 and the second branch 222 can be in different conduction states, so that the detection circuit 22 sends different indication signals to characterize different installation states of the storage device 100.

[0059] When the trigger part 21 is in the untriggered position, which can be the default position of the trigger part 21 not being pressed by the pressing force of the positioning part, the first branch 221 is in the conducting state, and the detection circuit 22 sends a corresponding indication signal to indicate that the storage device 100 is in the uninstalled state. When the trigger part 21 is in the second position, which can be the position of the trigger part 21 being pressed by the full pressing force of the positioning part, the second branch 222 is in the conducting state, and the detection circuit 22 sends a corresponding indication signal to indicate that the storage device 100 is in the installed state. When the trigger part 21 is in the first position, which can be the position of the trigger part 21 being pressed by the incomplete pressing force of the positioning part due to the existence of the skew or incomplete insertion of the body 1, i.e., the trigger part 21 is in any position between the untriggered position and the second position, the first branch 221 and the second branch 222 are both in the open circuit state, i.e., both are not in the conducting state, and the detection circuit 22 does not send an indication signal to indicate that the storage device 100 is in the error installation state.

[0060] Exemplarily, the detection circuit 22 can further include a third branch (not shown in the figure) arranged in parallel with the first branch 221 and the second branch 222. When the trigger part 21 is in the first position, the third branch is in the conducting state, and the detection circuit 22 can send a corresponding indication signal when the third branch is in the conducting state to indicate that the storage device 100 is in the error installation state.

[0061] In some possible implementation manners, as shown in Figure 3 The first branch 221 includes a first indication lamp 2211, and the second branch 222 includes a second indication lamp 2221. The first indication lamp 2211 and the second indication lamp 2221 are different in color. When the first branch 221 is in the conducting state, the first indication lamp 2211 is lit. When the second branch 222 is in the conducting state, the second indication lamp 2221 is lit.

[0062] The first branch 221 can be provided with a first indication device for sending a first indication signal to indicate that the first branch 221 is in the conducting state. The first indication device can be, for example, the first indication lamp 2211 or a device that can send a first indication sound. For example, the first indication device is the first indication lamp 2211, which can be an LED (Light Emitting Diode) lamp. When the first branch 221 is in the conducting state, the first indication lamp 2211 is lit. The color of the first indication lamp 2211 can be, for example, one of red, green, blue, white, orange, yellow, and the like. When the first indication lamp 2211 is lit, the trigger part 21 of the detection device 2 is in the untriggered position, i.e., the storage device 100 is in the uninstalled state.

[0063] A second indicator device may be provided on the second branch 222, and the second indicator device is configured to emit a second indication signal, indicating that the second branch 222 is in the on state. The second indicator device may be, for example, a second indicator light 2221, or a device that can emit a second indication sound. For example, the second indicator device may be a second indicator light 2221, which may be an LED light. When the second branch 222 is in the on state, the second indicator light 2221 is illuminated. The color of the second indicator light 2221 may be, for example, red, green, blue, white, orange, yellow, or a different color from the first indicator light 2211. When the second indicator light 2221 is illuminated, the trigger portion 21 of the detection device 2 is in the second position, indicating that the storage device 100 is in the installed state.

[0064] When the first indicator light 2211 and the second indicator light 2221 are both in the unlit state, the first branch 221 and the second branch 222 are both in the open state, and the trigger part 21 of the detection device 2 is in the first position, that is, between the untriggered position and the second position, indicating that the storage device 100 is in an incorrect installation state.

[0065] For example, when the first indicator device and the second indicator device on the first branch 221 and the second branch 222 are the first indicator light 2211 and the second indicator light 2221, Figure 2 and Figure 3 , the interior and surface of the detection device 2 can be distinguished by point A and point B on the detection circuit 22. The first indicator light 2211 and the second indicator light 2221 are provided on the surface of the detection device 2, and the remaining portion is provided inside the detection device 2. The first indicator light 2211 and the second indicator light 2221 can, for example, be provided on a surface of the detection device 2 that is coplanar with the front or back surface of the body 1 of the storage device 100, or can be provided on both the front and back surfaces of the detection device 2. The first indicator light 2211 and the second indicator light 2221 are positioned close to each other, so that the lighting status of the first indicator light 2211 and the second indicator light 2212 of different colors on the detection circuit 2 can be observed, thereby quickly and accurately determining the installation status of the storage device 100.

[0066] For example, when the first indicator device and the second indicator device are devices capable of emitting an indication sound, the first indicator device and the second indicator device emit different first indication sounds to represent different installation states of the storage device 100 .

[0067] In some possible implementations, see Figure 2 The trigger portion 21 includes a trigger component 211 and a press switch 212 connected to the trigger component 211. When the trigger component 211 is squeezed, the trigger component 211 moves from the untriggered position toward the second position.

[0068] The trigger component 211 is a component that is deformed or moves in position under the extrusion force of the positioning part of the mainboard. The press switch 212 is a conductive object such as a metal sheet, a metal strip or a metal ball. The press switch 212 is connected to the trigger component 211, so that the press switch 212 can control the conduction of the detection circuit 22 along with the movement or deformation of the trigger component 211. In combination Figure 2 and Figure 3 When the trigger component 211 is not extruded, the trigger component 211 and the press switch 212 connected thereto are in an untriggered position. The press switch 212 is connected to the first branch 221, so that the first branch 221 is in conduction, the first indicator light 2211 is on, and the storage device 100 is in an uninstalled state.

[0069] When the trigger component 211 is extruded, the trigger component 211 moves from the untriggered position to a second position. When the trigger component 211 and the press switch 212 connected thereto are in any position between the untriggered position and the second position, i.e., a first position, the press switch 212 is not connected to the first branch 221 and the second branch 222, and the first branch 221 and the second branch 222 are both in an open circuit state. The first indicator light 2211 and the second indicator light 2221 are both not on, and the storage device 100 is in an incorrectly installed state. When the trigger component 211 and the press switch 212 connected thereto are in the second position, the press switch 212 is connected to the second branch 222, so that the first branch 221 is in conduction, the first indicator light 2211 is on, and the storage device 100 is in an installed state.

[0070] In some possible embodiments, as shown in Figure 2 The trigger component 211 includes a moving piece 2111 and a push rod 2112. One end of the push rod 2112 is connected to the moving piece 2111, and the other end of the push rod 2112 is connected to the press switch 212.

[0071] The moving piece 2111 can be an object that can move or deform under extrusion force, such as a spring or a slider. One end of the push rod 2112 is connected to the moving piece 2111. The moving piece 2111 is used to move under the extrusion force of the positioning part of the mainboard and drive the push rod 2112 to move synchronously. When the moving piece 2111 is extruded by the positioning part of the mainboard, the moving piece 2111 moves from the untriggered position to the direction of the second position, so that the relative positions of the press switch 212 connected to the other end of the push rod 2112 and the detection circuit 22 change, and the installation state of the storage device 100 can be quickly and accurately determined by observing the lighting of the first indicator light 2211 and the second indicator light 2212 of different colors on the detection circuit 22.

[0072] In some possible embodiments, as shown in Figure 2As shown, the trigger assembly 211 further comprises a reset member 2113 connected with the moving member 2111, and the reset member 2113 is configured to provide a reset force for the moving member 2111.

[0073] The reset member 2113 is connected with the moving member 2111, and the reset member 2113 can be an elastic member which is deformed and compressed under a force and returns to the original state after the force is removed. For example, the reset member 2113 can be a spring, a spring piece, or the like. During the installation of the memory device 100, the moving member 2111 is pressed by the positioning portion of the mainboard, and the reset member 2113 is compressed and deformed by the pressing force of the moving member 2111, and simultaneously pushes the position of the push rod 2112 and the press-fit switch 212 connected with the push rod 2112 to move; when the memory device 100 is removed from the mainboard, the reset member 2113 is restored to the original state without the external force, and the reset member 2113 applies an elastic force to the moving member 2111 in the direction of the opening of the positioning groove 111, so that the moving member 2111 is pushed to return to the position without being pressed when the reset member 2113 returns to the original state. At the same time, the moving member 2111 drives the push rod 2112 and the press-fit switch 212 to move from the second position or the first position to the non-trigger position, so as to detect the next installation state of the memory device 100. Figure 1 and Figure 2 As shown, the pressing force of the positioning portion of the mainboard applied to the moving member 2111 is removed, the reset member 2113 returns to the original state without the external force, and the reset member 2113 applies an elastic force to the moving member 2111 in the direction of the opening of the positioning groove 111, so that the moving member 2111 is pushed to return to the position without being pressed when the reset member 2113 returns to the original state. At the same time, the moving member 2111 drives the push rod 2112 and the press-fit switch 212 to move from the second position or the first position to the non-trigger position, so as to detect the next installation state of the memory device 100.

[0074] In some embodiments, the trigger assembly 211 can not use the reset member 2113, and the moving member 2111 can be inclined relative to the body 1. During the installation of the memory device 100, the moving member 2111 is pressed by the positioning portion of the mainboard, and the moving member 2111 moves from the non-trigger position to the direction of the second position; when the memory device 100 is removed from the mainboard, the pressing force of the positioning portion of the mainboard applied to the moving member 2111 is removed, and the gravity of the moving member 2111 itself makes the moving member 2111 slide out and return to the position without being pressed, so as to detect the next installation state of the memory device 100.

[0075] In one exemplary embodiment, as shown in Figure 4 The body 1 further comprises a top surface 13, and at least one first notch 131 is arranged on the top surface 13. The upper portion of the positioning groove 111 is provided with a second notch 112.

[0076] In this embodiment, the top surface 13 of the body 1 is provided with one or more first notches 131. The first notches 131 can allow the fingers of the assembler to be positioned in the first notches 131 of the top surface 13 during the installation of the storage device 100, so as to facilitate the assembler to apply pressure to the storage device 100 and press the storage device 100 to be installed on the mainboard, thereby improving the installation efficiency of the storage device 100. For example, the number of first notches 131 on the top surface 13 is set to be two, four, or the like. The plurality of first notches 131 are evenly arranged on the top surface 13, so that the storage device 100 is subjected to more uniform pressure during the installation of the storage device 100, thereby improving the installation stability and reliability of the storage device 100 and the mainboard.

[0077] The second notches 112 are arranged above the positioning grooves 111. The second notches 112 can allow the fingers of the assembler to be positioned in the second notches 112 of the side surface 11 during the installation of the storage device 100, so as to facilitate the assembler to grasp the storage device 100, thereby improving the installation efficiency of the storage device 100. The second notches 112 can also facilitate the disassembly of the storage device 100. The fingers of the assembler can be respectively placed in the second notches 112 of the two side surfaces 11. The fingers apply pressure to the second notches 112 while applying force in the opposite direction of the installation direction, so as to quickly disassemble the storage device 100.

[0078] For example, the first notches 131 and the second notches 112 can be square notches, arc-shaped notches, or the like, so as to facilitate the grasping and pressing of the assembler. The first notches 131 and the second notches 112 can be arc-shaped notches. The arc-shaped notches are consistent with the shape of the fingers, so as to facilitate the fingers to apply pressure to the body 1 and improve the comfort of the assembler.

[0079] In some possible embodiments, the chord length of the first notches 131 is 20-25 mm, and the arc height of the first notches 131 is 4-6 mm. The first notches 131 with a chord length of 20-25 mm can be consistent with the finger width of different assemblers, and the first notches 131 with an arc height of 4-6 mm can be consistent with the finger thickness of different assemblers. Since the first notches 131 of the top surface 13 are used for the assembler to press the storage device 100, the chord length and the arc height of the first notches 131 are slightly larger than the size of a general finger, thereby improving the comfort of the assembler and the adaptability of different assemblers to the storage device 100. When the first notches 131 of the top surface 13 are two, the distance between the two first notches 131 and the side surface 11 is the same, for example, 2-4 mm, so as to facilitate the assembler to press the storage device 100.

[0080] Exemplarily, the chord length of the second notch 112 is 7-9mm, the arc height of the second notch 112 is 2-4mm, and the distance between the second notch 112 and the top surface 13 is the same as the distance between the second notch 112 and the positioning groove 111.

[0081] The second notch 112 with the chord length of 7-9mm can fit the finger width of different assembly personnel, and the second notch 112 with the arc height of 2-4mm can fit the finger thickness of different assembly personnel. Since the size of the side surface 11 is small, and the second notch 112 of the side surface 11 is used for assembly personnel to grasp and disassemble the storage device 100, the chord length and the arc height of the second notch 112 are slightly smaller than the chord length and the arc height of the first notch 131. The distance between the second notch 112 and the top surface 13 is the same as the distance between the second notch 112 and the positioning groove 111, so that the uniform force applied by the assembly personnel to the storage device 100 is avoided, and the storage device 100 is prevented from being deformed or damaged during installation or disassembly.

[0082] An example embodiment of the present disclosure provides a storage device, which comprises a mainboard and the storage device provided in the above embodiments, and the storage device is installed on the mainboard. Exemplarily, the storage device can be, for example, a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like.

[0083] An example embodiment of the present disclosure also provides a method for detecting the installation state of the storage device, which is applied to the storage device provided in the above embodiments, and the method comprises the following steps. Figure 5 As shown in the figure, the method for detecting the installation state of the storage device comprises the following steps.

[0084] S100, when the trigger part of the detection device of the storage device is in an untriggered position, the detection device is in a first state, and the first state is used to represent that the storage device is in an uninstalled state;

[0085] S200, when the trigger part is in a first position, the detection device is in a second state, and the second state is used to represent that the storage device is in an incorrectly installed state;

[0086] S300, when the trigger part is in a second position, the detection device is in a third state, and the third state is used to represent that the storage device is in an installed state;

[0087] The first position is between the untriggered position and the second position.

[0088] In the embodiment, during the mounting of the memory device and the mainboard, the positioning part of the mainboard cooperates with the positioning groove of the memory device to fix the memory device, and the detection device is arranged in the positioning groove of the memory device, so that the triggering part of the detection device is pressed by the positioning part and is in different positions, so that the detection device is in different states. By determining the state of the detection device, the mounting state of the memory device can be quickly and accurately determined, the mounting reliability of the memory device is improved, and the time and labor inspection cost are saved.

[0089] In step S100, when the triggering part of the detection device is in the untriggered position, the untriggered position can be the default position of the triggering part not being pressed by the positioning part, that is, the triggering part is not pressed by the positioning part, the detection device is in the first state, and the first state can represent that the memory device is in the uninstalled state. The first state can be a specific state set by a technician, for example, an indication device can be arranged in the detection device, and the indication device can be a display indication device, a sound indication device, etc. A specific state of the indication device is determined as the first state.

[0090] In step S200, the first position can be a position where the triggering part is incompletely pressed by the positioning part due to the existence of the body skew or incomplete insertion, and the cooperation between the positioning groove and the positioning part is not complete. The first position is between the untriggered position and the second position. When the triggering part is in the first position, the triggering part is incompletely pressed by the positioning part during the mounting of the memory device and the mainboard. The detection device is in the second state, and the second state can be a specific state different from the first state set by a technician, and the second state can represent that the memory device is in an error installation state.

[0091] In step S300, when the triggering part is in the second position, the second position can be a position where the triggering part is completely pressed by the positioning part, the detection device is in the third state, and the third state can be a specific state different from the first state and the second state set by a technician, and the third state can represent that the memory device is in an installed state.

[0092] In some possible embodiments, when the detection device is in the first state, the first indication lamp is lit; when the detection device is in the third state, the second indication lamp is lit; and when the detection device is in the second state, neither the first indication lamp nor the second indication lamp is lit; wherein the colors of the first indication lamp and the second indication lamp are different.

[0093] In the embodiment, the detection device can be provided with a detection circuit, the detection circuit includes a first branch and a second branch arranged in parallel, the first branch can be provided with a first indicator light, the second branch can be provided with a second indicator light, the first indicator light and the second indicator light are, for example, LED lights that can emit red, green, blue, white, orange, yellow and other color bright light, and the colors of the first indicator light and the second indicator light are different. When the detection device is in the first state, the first branch is turned on, so that the first indicator light is lit, at this time the storage device is in an uninstalled state; when the detection device is in the third state, the second branch is turned on, so that the second indicator light is lit, and the storage device is in an installed state; when the detection device is in the second state, the first branch and the second branch are both in an open circuit state, and the first indicator light and the second indicator light are both not lit, and the storage device is in an incorrectly installed state.

[0094] The embodiments or implementations in the specification are described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts between the embodiments can be mutually referred to.

[0095] In the description of the specification, the description of the terms "embodiment", "exemplary embodiment", "some implementations", "illustrative implementation", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the implementation or example are included in at least one implementation or example of the present disclosure.

[0096] In the specification, the illustrative description of the above terms does not necessarily refer to the same implementation or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more implementations or examples in a suitable manner.

[0097] In the description of the present disclosure, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0098] It can be understood that the terms "first", "second", etc. used in the present disclosure can be used in the present disclosure to describe various structures, but these structures are not limited by these terms. These terms are only used to distinguish the first structure from another structure.

[0099] In this disclosure, the terms "comprises," "comprising," or any other variations thereof are intended to encompass non-exclusive inclusion, such that an article or device comprising a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such article or device. In the absence of further limitations, an element defined by the phrase "comprising..." does not preclude the presence of additional identical elements in the article or device comprising the element.

[0100] Although the preferred embodiments of the present disclosure have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present disclosure.

[0101] In one or more of the accompanying drawings, identical elements are represented by similar reference numerals. For clarity, many parts in the accompanying drawings are not drawn to scale. In addition, certain well-known parts may not be shown. For simplicity, a structure obtained after several steps may be described in a single figure. Many specific details of the present disclosure, such as device structure, materials, dimensions, processing techniques, and technologies, are described below to facilitate a clearer understanding of the present disclosure. However, as will be appreciated by those skilled in the art, the present disclosure may be practiced without following these specific details.

[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A memory device, characterized in that: Installed on the mainboard, the storage device includes: A body, the body comprising two opposite side surfaces, each of the side surfaces having a positioning groove, the positioning groove being used to cooperate with a positioning portion of the mainboard to fix the storage device; a detection device, the detection device being disposed in the positioning groove and being used to detect the installation status of the storage device; The detection device includes a trigger part and a detection circuit. In the assembled state, the positioning part of the mainboard squeezes the trigger part to adjust the relative position between the trigger part and the detection circuit to control the conduction state of the detection circuit.

2. The memory device according to claim 1, wherein: The detection circuit includes a first branch and a second branch arranged in parallel; When the trigger portion is in the untriggered position, the first branch is conductive; When the trigger portion is in the first position, the first branch and the second branch are both in an open circuit state; When the trigger portion is in the second position, the second branch is conductive; The first position is located between the untriggered position and the second position.

3. The memory device according to claim 2, wherein: The first branch includes a first indicator light, the second branch includes a second indicator light, and the first indicator light and the second indicator light have different colors; When the first branch is conductive, the first indicator light is on; When the second branch is conductive, the second indicator light is on.

4. The memory device according to claim 2, wherein: The trigger portion includes a trigger component and a press switch connected to the trigger component. When the trigger component is squeezed, the trigger component moves from the untriggered position toward the second position.

5. The memory device according to claim 4, wherein: The trigger assembly includes a moving part and a push rod, one end of the push rod is connected to the moving part, and the other end of the push rod is connected to the press switch.

6. The memory device according to claim 5, wherein: The trigger assembly further includes a reset member connected to the moving member, and the reset member is used to provide a reset force for the moving member.

7. The memory device according to claim 6, wherein: The return member includes a spring.

8. The memory device according to any one of claims 1 to 5, wherein: The body further includes a top surface, on which at least one first notch is provided, and a second notch is provided above the positioning groove.

9. The memory device according to claim 8, wherein: The first notch and the second notch are arc-shaped notches.

10. The memory device according to claim 9, wherein: The chord length of the first notch is 20-25 mm, and the arc height of the first notch is 4-6 mm.

11. The memory device according to claim 9, wherein: The chord length of the second notch is 7-9 mm, the arc height of the second notch is 2-4 mm, and the distance between the second notch and the top surface is the same as the distance between the second notch and the positioning groove.

12. A storage device, characterized in that: The storage device includes a mainboard and the storage device according to any one of claims 1 to 11, wherein the storage device is mounted on the mainboard.

13. A method for detecting the installation status of a storage device, characterized in that: The method is applied to the memory device according to any one of claims 1 to 11, and the method includes: When the trigger portion of the detection device of the storage device is in an untriggered position, the detection device is in a first state, and the first state is used to indicate that the storage device is in an unmounted state; When the trigger portion is in the first position, the detection device is in a second state, and the second state is used to indicate that the storage device is in an incorrect installation state; When the trigger portion is in the second position, the detection device is in a third state, and the third state is used to indicate that the storage device is in an installed state; The first position is located between the untriggered position and the second position.

14. The method for detecting the installation status of a storage device according to claim 13, wherein: When the detection device is in the first state, the first indicator light is on; When the detection device is in the third state, the second indicator light is on; When the detection device is in the second state, both the first indicator light and the second indicator light are off; The first indicator light and the second indicator light have different colors.

Images