Metasurface optical device, method of manufacturing a metasurface optical device

Abstract

The present disclosure provides a metasurface optical device, a method of manufacturing a metasurface optical device, and an optical system. The metasurface optical device includes: a substrate including a first surface and a second surface opposite to each other in a thickness direction of the substrate; a first film layer located at the first surface of the substrate and including at least one set of films distributed at different positions of the first surface, each set of films including at least one layer of film stacked with each other in the thickness direction of the substrate, each layer of film including a material having a corresponding refractive index to enhance transmission and / or reflection of light; and an array of metasurface structures including a plurality of metasurface structures located at a side of the first film layer facing away from the substrate and extending in a direction away from the substrate.

Description

Technical Field

[0001] The present disclosure relates to the field of metasurface technology, and in particular to a metasurface optical device, a method for manufacturing a metasurface optical device, and an optical system. Background Art

[0002] A metasurface is an artificial material composed of subwavelength structural units arranged in a designed manner on a plane. In the visible light band, the basic structural units of a metasurface are nanostructured units, ranging in size from tens to hundreds of nanometers and smaller than the operating wavelength. Metasurfaces can flexibly and effectively control the polarization, amplitude, phase, and propagation mode of electromagnetic waves.

[0003] Metasurfaces are ultra-light and ultra-thin. Compared with traditional optical devices, metasurface optical devices made based on metasurfaces have the advantages of excellent optical performance, small size, and high integration. They have broad prospects for application in future portable miniaturized devices such as augmented reality wearable devices, virtual reality wearable devices, and mobile terminal lenses.

[0004] A common approach in optical thin film technology is to coat traditional optical devices with thin films via vacuum sputtering, thereby controlling the reflectivity and transmittance of incident light beams to meet varying needs. Surface coatings for traditional optical devices can be calculated and designed based on the principle of light interference, but this calculation is only suitable for smooth surfaces and cannot account for the effects of metasurface structural unit layers. Coating structures designed using traditional coating calculation methods can suffer from significant errors when directly applied to metasurfaces, and can even have the opposite effect. Therefore, new design methods and implementation processes are needed for anti-reflection and anti-reflection coatings for metasurfaces. Summary of the Invention

[0005] Embodiments of the present disclosure provide a metasurface optical device, a method for manufacturing a metasurface optical device, and an optical system.

[0006] According to one aspect of the present disclosure, a metasurface optical device is provided, comprising a substrate, the substrate comprising a first surface and a second surface opposite to each other in a thickness direction of the substrate; a first film layer, the first film layer being located on the first surface of the substrate and comprising at least one group of films distributed at different positions on the first surface, each group of films comprising at least one film layer stacked on each other in a thickness direction of the substrate, each film layer comprising a material having a corresponding refractive index to enhance the transmission and / or reflection of light; and a metasurface structure array, the metasurface structure array comprising a plurality of metasurface structures located on a side of the first film layer facing away from the substrate and extending in a direction facing away from the substrate.

[0007] According to one aspect of the present disclosure, a method for manufacturing a metasurface optical device is provided, comprising: forming a first film layer on a first surface of a substrate, the first film layer comprising at least one group of films distributed at different positions on the first surface, each group of films comprising at least one film layer stacked on each other in a thickness direction of the substrate, each film layer comprising a material having a corresponding refractive index to enhance the transmission and / or reflection of light; and forming a metasurface structure array on a side of the first film layer away from the substrate, the metasurface structure array comprising a plurality of metasurface structures extending in a direction away from the substrate.

[0008] According to another aspect of the present disclosure, an optical system is provided, comprising the above optical device.

[0009] These and other aspects of the disclosure will be apparent from and elucidated with reference to the embodiments described hereinafter. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Further details, features and advantages of the present disclosure are disclosed in the following description of exemplary embodiments in conjunction with the accompanying drawings, in which:

[0011] Figure 1 is a cross-sectional schematic diagram illustrating a metasurface optical device according to an exemplary embodiment;

[0012] Figure 2 is a cross-sectional schematic diagram illustrating a metasurface optical device according to an exemplary embodiment;

[0013] Figure 3 is a cross-sectional schematic diagram illustrating a metasurface optical device according to an exemplary embodiment;

[0014] Figure 4 is a cross-sectional schematic diagram illustrating a metasurface optical device according to an exemplary embodiment;

[0015] Figure 5 is a cross-sectional schematic diagram illustrating a metasurface optical device according to an exemplary embodiment;

[0016] Figure 6 is a cross-sectional schematic diagram illustrating a metasurface optical device according to an exemplary embodiment;

[0017] Figure 7 is a diagram illustrating a method for Figures 1 to 5 Schematic diagram of a metasurface structure in a metasurface optical device;

[0018] Figure 8 is a flow chart illustrating a method of manufacturing a metasurface optical device according to an exemplary embodiment;

[0019] Figure 9is a diagram illustrating a method for Figure 8 The method shown is formed as Figure 2 A flow chart of the steps of the first film layer is shown;

[0020] Figure 10 is a diagram illustrating a method for Figure 9 A schematic diagram of the steps shown;

[0021] Figure 11 is a diagram illustrating a method for Figure 9 A schematic diagram of the steps shown;

[0022] Figure 12 is a diagram illustrating a method for Figure 9 A schematic diagram of the steps shown;

[0023] Figure 13 is a diagram illustrating a method for Figure 9 A schematic diagram of the steps shown;

[0024] Figure 14 is a diagram illustrating a method for Figure 9 A schematic diagram of the steps shown;

[0025] Figure 15 is a diagram illustrating a method for Figure 8 A flow chart of the steps of forming a metasurface array in the method shown;

[0026] Figure 16 is a diagram illustrating a method for Figure 15 A schematic diagram of the steps shown;

[0027] Figure 17 is a diagram illustrating a method for Figure 15 A schematic diagram of the steps shown;

[0028] Figure 18 is a diagram illustrating a method for Figure 15 A schematic diagram of the steps shown;

[0029] Figure 19 is a diagram illustrating a method for Figure 8 A flow chart of the steps of forming a metasurface array in the method shown;

[0030] Figure 20 is a diagram illustrating a method for Figure 19 A schematic diagram of the steps shown;

[0031] Figure 21 is a diagram illustrating a method for Figure 8A flow chart of the steps of forming a metasurface array in the method shown;

[0032] Figure 22 is a diagram illustrating a method for Figure 21 A schematic diagram of the steps shown;

[0033] Figure 23 is a diagram illustrating a method for Figure 21 A schematic diagram of the steps shown;

[0034] Figure 24 is a diagram illustrating a method for Figure 21 A schematic diagram of the steps shown;

[0035] Figure 25 is a diagram illustrating a method for Figure 21 A schematic diagram of the steps shown;

[0036] Figure 26 is a diagram illustrating a method for Figure 8 A flow chart of the steps of forming a metasurface array in the method shown;

[0037] Figure 27 is a diagram illustrating a method for Figure 26 A schematic diagram of the steps shown;

[0038] Figure 28 is a flow chart illustrating a method of manufacturing a metasurface optical device according to an exemplary embodiment;

[0039] Figure 29 is a diagram illustrating a method for Figure 28 Schematic diagram of a method for manufacturing a metasurface optical device;

[0040] Figure 30 is a diagram illustrating a method for Figure 28 A schematic diagram of a method for manufacturing a metasurface optical device is shown; and

[0041] Figure 31 is a schematic diagram illustrating a method of manufacturing a metasurface optical device according to an exemplary embodiment. DETAILED DESCRIPTION

[0042] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure. Therefore, the drawings and description are to be considered as illustrative in nature and not restrictive.

[0043] It will be understood that although the terms first, second, third, etc. may be used to describe various elements, components, areas, layers and / or parts in this article, these elements, components, areas, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer or part from another element, component, area, layer or part. Therefore, the first element, component, area, layer or part discussed below may be referred to as the second element, component, area, layer or part without departing from the teachings of the present disclosure.

[0044] Spatially relative terms such as "below," "beneath," "lower," "beneath," "above," "upper," and the like may be used herein for ease of description to describe the relationship of one element or feature to another element or feature as illustrated in the figures. It will be understood that these spatially relative terms are intended to encompass different orientations of the device in use or operation other than the orientation depicted in the figures. For example, if the device in the figures is flipped, an element described as "below" or "beneath" or "beneath" other elements or features would be oriented "above" the other elements or features. Thus, the exemplary terms "below" and "beneath" may encompass both orientations of "above" and "beneath." Terms such as "before" or "before" and "after" or "followed by" may similarly be used, for example, to indicate the order in which light passes through the elements. The device may be oriented otherwise (rotated 90 degrees or in other orientations) and the spatially relative descriptors used herein interpreted accordingly. Additionally, it will be understood that when a layer is referred to as being "between two layers," it may be the only layer between the two layers, or one or more intervening layers may also be present. As used herein, "downstream" or "optically downstream" is used to indicate the relative position of a second element that a light beam reaches after encountering a first element, where the first element is "upstream" or "optically upstream" of the second element.

[0045] The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. As used herein, the singular forms "one", "an" and "the" are intended to also include plural forms, unless the context clearly indicates otherwise. It will be further understood that the terms "include" and / or "comprise" specify the presence of the features, wholes, steps, operations, elements and / or parts when used in this specification, but do not exclude the presence of one or more other features, wholes, steps, operations, elements, parts and / or their groups or add one or more other features, wholes, steps, operations, elements, parts and / or their groups. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items, and the phrase "at least one of A and B" refers to only A, only B, or both A and B.

[0046] It will be understood that when an element or layer is referred to as being “on,” “connected to,” “coupled to,” or “adjacent to” another element or layer, it can be directly on, directly connected to, directly coupled to, or directly adjacent to another element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly connected to,” “directly coupled to,” or “directly adjacent to” another element or layer, no intervening elements or layers are present. However, in no case should “on” or “directly on” be interpreted as requiring that one layer completely cover the underlying layer.

[0047] Embodiments of the present disclosure are described herein with reference to schematic illustrations (and intermediate structures) of idealized embodiments of the present disclosure. Because of this, variations in the illustrated shapes, for example as a result of manufacturing techniques and / or tolerances, should be expected. Therefore, embodiments of the present disclosure should not be interpreted as being limited to the specific shapes of the regions illustrated herein, but should include shape deviations, for example, due to manufacturing. Therefore, the regions illustrated in the figures are schematic in nature, and their shapes are not intended to illustrate the actual shape of the regions of the device and are not intended to limit the scope of the present disclosure.

[0048] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the relevant art and / or the context of this specification, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0049] As used herein, the term "substrate" may refer to the substrate of a cut wafer or may indicate the substrate of an uncut wafer. Similarly, the terms chip and die may be used interchangeably unless such interchange would cause a conflict. It should be understood that the term "layer" includes thin films and should not be interpreted as indicating vertical or horizontal thickness unless otherwise specified.

[0050] Figure 1 1 is a schematic cross-sectional view illustrating a metasurface optical device 100 according to an exemplary embodiment. Figure 1 As shown, the optical device 100 includes a substrate 12 , a first film layer 11 and a metasurface structure array including a plurality of metasurface structures 10 .

[0051] The substrate 12 includes a first surface 115 and a second surface 116 that are opposite to each other in the thickness direction of the substrate 12 .

[0052] The first film layer 11 is located on the first surface 115 of the substrate 12 and includes at least one group of films distributed at different positions on the first surface 115, each group of films includes at least one layer of films stacked on each other in the thickness direction of the substrate 12, and each layer of the film includes a material with a corresponding refractive index to enhance the transmission and / or reflection of light.

[0053] exist Figure 1 , it is exemplarily shown that the first film layer 11 includes a film 101 and a film 102 stacked on each other in the thickness direction of the substrate 12. The stacked films 101 and 102 can be alternating layers of any combination of silicon dioxide, titanium dioxide, aluminum oxide, silicon nitride, aluminum nitride or amorphous silicon to reduce the reflectivity (enhance transmission) and / or transmittance (enhance reflection) of the interface between the multiple metasurface structures 10 and the substrate 12 and reduce the reflectivity (enhance transmission) and / or transmittance (enhance reflection) of the interface between the air and the substrate 12.

[0054] The metasurface structure array includes a plurality of metasurface structures 10 located on a side of the first film layer 11 facing away from the substrate 12 and extending in a direction facing away from the substrate.

[0055] It can be understood that in this example, the first film layer 11 includes two films (film 101 and film 102) stacked on each other in the thickness direction of the substrate 12. In other examples, the number of films stacked on each other in the thickness direction of the substrate 12 included in the first film layer 11 can be arbitrary and is not limited here.

[0056] The first film layer includes multiple groups of films distributed at different positions on the first surface 115. Such an embodiment will be combined later. Figure 2 Detailed description.

[0057] Figure 2 FIG is a schematic cross-sectional view illustrating a metasurface optical device 200 according to an exemplary embodiment. Figure 2 In the figure, the optical device 200 includes a substrate 12, a first film layer 11, and a metasurface array including a plurality of metasurface structures 10.

[0058] The first film layer 11 includes a first group of films (films 101 and 102) and a second group of films (films 103 and 104), wherein the second group of films (films 103 and 104) is made of a material different from that of the first group of films (films 101 and 102). Each of the plurality of metasurface structures 10 is directly on a corresponding portion of the first group of films (films 101 and 102).

[0059] In one example, the first set of films (films 101 and 102) are designed based on the refractive index of each metasurface structure 10 and the refractive index of the substrate 12 to reduce the reflectivity (enhance transmission) and / or transmittance (enhance reflection) of the interface between the multiple metasurface structures 10 and the substrate 12.

[0060] The second set of films (films 103 and 104 ) are designed based on the refractive index of air and the refractive index of substrate 12 to reduce the reflectivity (enhance transmission) and / or transmittance (enhance reflection) of the interface between air and substrate 12 .

[0061] In order to further reduce the reflectivity (enhance transmission) and / or transmittance (enhance reflection) of the interface between the air and the substrate and the reflectivity (enhance transmission) and / or transmittance (enhance reflection) of the interface between the metasurface structure and the air, corresponding film layers can be deposited on the surface of the first film layer facing away from the substrate and on the end of the multiple metasurface structures facing away from the substrate.

[0062] Figure 3 1 is a schematic cross-sectional view illustrating a metasurface optical device 300 according to an exemplary embodiment. The first film layer 11 is located on the first surface 115 of the substrate 12, and the first film layer 11 includes two films 101 and 102. The second film layer 13 is located on the surface of the first film layer 11 facing away from the substrate 12, and includes at least one group of films distributed at different positions on the surface. Similar to the first film layer 11, each group of films in the second film layer 13 includes at least one film stacked on each other in the thickness direction of the substrate 12, and each film includes a material with a corresponding refractive index to enhance the transmission and / or reflection of light. A plurality of metasurface structures 10 extend beyond the second film layer 13 in a direction away from the substrate 12.

[0063] like Figure 3 As shown, the second film layer 13 includes films 105 and 106 stacked on each other in the thickness direction of the substrate 12 to reduce the reflectivity (enhance transmission) and / or transmittance (enhance reflection) of the interface between air and the substrate 12 .

[0064] The third film layer 14 is located at one end of the plurality of metasurface structures 10 facing away from the substrate 12 and includes at least one group of films distributed across different metasurface structures 10. Similar to the first film layer 11 and the second film layer 13, the third film layer 14 includes at least one film layer stacked one on top of the other in the thickness direction of the substrate 12, each film layer including a material having a corresponding refractive index to enhance the transmission and / or reflection of light.

[0065] The third film layer 14 includes two films (film 107 and film 108) stacked on each other in the thickness direction of the substrate 12 to reduce the reflectivity (enhanced transmission) and / or transmittance (enhanced reflection) of the interface between the air and the plurality of metasurface structures 10. According to some embodiments, the third film layer 14 is made of the same material as the second film layer 13. For example, the material and thickness of film 107 are the same as those of film 105, and the material and thickness of film 108 are the same as those of film 106.

[0066] It is understandable that although Figure 3 , the second film layer 13 and the third film layer 14 both include two film layers stacked one on top of the other in the thickness direction of the substrate 12. In other embodiments, the second film layer 13 and the third film layer 14 may include any number of film layers stacked one on top of the other in the thickness direction of the substrate 12, without limitation herein.

[0067] It is understandable that the materials used to manufacture the second film layer 13 and the materials used to manufacture the third film layer 14 may also be different.

[0068] According to some embodiments, the third film layer 14 is made of a material different from that of the second film layer 13 .

[0069] Figure 4 is a schematic cross-sectional view illustrating a metasurface optical device 400 according to an exemplary embodiment. Figure 4 In the embodiment, the first film layer 11 is located on the first surface 115 of the substrate 12, and the first film layer 11 includes two films 101 and 102 stacked on each other in the thickness direction of the substrate 12. The second film layer 13 is located on the surface of the first film layer 11 facing away from the substrate 12, and the second film layer 13 includes films 105 and 106 stacked on each other in the thickness direction of the substrate 12 to reduce the reflectivity (enhance transmission) and / or transmittance (enhance reflection) of the interface between the air and the substrate 12.

[0070] Unlike the optical device 300, the optical device 400 includes a third film layer 14 made of a material different from that of the second film layer 13. The third film layer 14 includes films 109 and 110 stacked on each other in the thickness direction of the substrate 12.

[0071] In one example, the third film layer 14 including the film 109 and the film 110 is designed for the refractive index of air and the refractive index of the plurality of metasurface structures 10 to reduce the reflectivity (enhanced transmission) and / or transmittance (enhanced reflection) of the interface between the air and the metasurface structure 10. The material and thickness of the film 109 may be different from those of the film 106. The material and thickness of the film 110 may be different from those of the film 107.

[0072] Figure 5FIG is a schematic cross-sectional view illustrating a metasurface optical device 500 according to an exemplary embodiment. Figure 4 On the basis of the optical device 400 shown, a fourth film layer 15 and a protective material layer 16 are added.

[0073] like Figure 5 As shown, the fourth film layer 15 is located on the side of the multiple super-surface structures 10 away from the substrate 12, and includes at least one group of films, each group of films including at least one layer of films stacked on each other in the thickness direction of the substrate 12, and each layer of the film including a material with a corresponding refractive index to enhance the transmission and / or reflection of light.

[0074] The fourth film layer 15 includes two films (film 111 and film 112) stacked on each other in the thickness direction of the substrate 12. The protective material layer 16 is located between the fourth film layer 15 and the first film layer 11. Exemplarily, the fourth film layer 15 can be designed based on the refractive index of air and the refractive index of the protective material layer 16 to reduce the reflectivity (enhanced transmission) and / or transmittance (enhanced reflection) of the interface between the air and the protective material layer 16. The second film layer 13 can be designed based on the refractive index of the protective material layer 16 and the refractive index of the substrate 12 to reduce the reflectivity (enhanced transmission) and / or transmittance (enhanced reflection) of the interface between the protective material layer 16 and the substrate 12. The third film layer 14 can be designed based on the refractive index of the protective material layer 16 and the refractive index of the metasurface structure 10 to reduce the reflectivity (enhanced transmission) and / or transmittance (enhanced reflection) of the interface between the protective material layer 16 and the metasurface structure 10.

[0075] It is understandable that although Figure 5 It is shown that the fourth film layer 15 includes two films stacked on each other in the thickness direction of the substrate 12. In other embodiments, the number of films included in the fourth film layer 15 can be arbitrary and is not limited here.

[0076] Figure 6 FIG is a schematic cross-sectional view illustrating a metasurface optical device 600 according to an exemplary embodiment. Figure 5 Based on the illustrated optical device 500 , a fifth film layer 17 is added.

[0077] The fifth film layer 17 is located on the second surface 116 of the substrate 12 and includes at least one group of films distributed at different positions on the second surface 116, each group of films includes at least one layer of films stacked on each other in the thickness direction of the substrate 12, and each layer of the film includes a material with a corresponding refractive index to enhance the transmission and / or reflection of light.

[0078] The fifth film layer 17 includes two films (film 113 and film 114) stacked one on top of the other in the thickness direction of the substrate 12. The fifth film layer 17 can reduce the reflectivity (enhanced transmission) and / or transmittance (enhanced reflection) of the interface between the air and the substrate 12 based on the refractive index of the substrate 12 and the refractive index of air.

[0079] It is understandable that although Figure 6 It is shown that the fifth film layer 17 includes two films stacked on each other in the thickness direction of the substrate 12. In other embodiments, the number of films included in the fifth film layer 17 can be arbitrary and is not limited here.

[0080] In some embodiments, it is also possible to Figure 6 A group of metasurface optical arrays is added to the side of the fourth film layer 15 of the optical device 600 facing away from the protective material layer 16, and elements such as a second group of films, a third group of films, a protective material layer, etc. are added to the added metasurface optical array, so that the metasurface optical device can perform more complex control on the incident light and realize more functions.

[0081] Figure 7 is a diagram illustrating a method for Figures 1 to 5 Schematic diagram of a metasurface structure in a metasurface optical device. Figure 7 In the embodiment, each of the multiple metasurface structures 10 includes multiple distributed feedback (DFB) films stacked one on top of the other in the thickness direction of the substrate 12. In one example, the multiple distributed feedback films regulate the polarization, amplitude, phase, polarization mode, and propagation mode of the passing light, and also filter the light in a high-pass filtering, low-pass filtering, or band-pass filtering manner.

[0082] In practice, the anti-reflection and anti-reflection multilayer films on the surface of traditional optical devices can be calculated and designed by the interference principle of light, but the coating structure designed by this method is only applicable to smooth optical interfaces. The transmission and reflection characteristics of the subwavelength structure layer in the metasurface to electromagnetic waves are quite different from those of the smooth interface, and are closely related to the size and shape of the subwavelength structure unit and the incident wavelength. The coating structure designed using the traditional coating calculation method will have a large error when directly applied to the surface of the metalens, and may even have the opposite effect. Therefore, new design methods and implementation processes are needed for the anti-reflection and anti-reflection coatings of optical devices with metasurface structures. The following will combine Figure 8-Figure 31 Describe in detail the manufacture of Figures 1-6 The process of the optical device shown.

[0083] Figure 8is a flow chart illustrating a method 800 of fabricating a metasurface optical device according to an exemplary embodiment.

[0084] In step 801, a first film layer is formed on a first surface of a substrate, the first film layer including at least one group of films distributed at different positions on the first surface, each group of films including at least one layer of films stacked on each other in a thickness direction of the substrate, each layer of the film including a material having a corresponding refractive index to enhance the transmission and / or reflection of light.

[0085] Step 801 will be combined later Figures 9-14 Detailed description.

[0086] In step 802 , a metasurface structure array is formed on a side of a first film layer facing away from the substrate, where the metasurface structure array includes a plurality of metasurface structures extending in a direction facing away from the substrate.

[0087] Step 802 will be combined with Figures 15-27 Detailed description.

[0088] Figure 9 is a diagram illustrating a method for Figure 8 The method shown is formed as Figure 2 Flowchart of step 801 of the first film layer 11 is shown. Figure 10-14 is a diagram illustrating a process according to an exemplary embodiment in a sequential manner. Figure 9 The following is a schematic diagram of the steps shown. Figures 9-14 Step 801 is described in detail.

[0089] According to some embodiments, reference Figure 2 In the optical device 200 shown, in the optical device 200, at least one group of films of the first film layer 11 includes a first group of films (film 101 and film 102) and a second group of films (film 103 and film 104), and the first group of films (film 101 and film 102) is made of a material different from the material of the second group of films (film 103 and film 104).

[0090] In step 901 , a first film material layer, a sacrificial material layer, a mask material layer, and a photoresist material layer stacked on each other are sequentially formed on a first surface of a substrate.

[0091] First, a first film material layer 18 is formed on the first surface 115 of the substrate 12, and the first film material layer 18 includes a film 101 and a film 102. A sacrificial material layer 24 is deposited on the side of the first film material layer 18 facing away from the first surface 115. A mask material layer 22 is deposited on the side of the sacrificial material layer 24 facing away from the first film material layer 18. A photoresist material layer 23 is then deposited on the side of the mask material layer 22 facing away from the sacrificial material layer 24, to obtain the following: Figure 10Optical device 1000 is shown. Examples of sacrificial material layer 24 include, but are not limited to, silicon oxide, polysilicon, and photoresist. Examples of mask material layer 22 include, but are not limited to, titanium nitride, silicon nitride, and silicon oxide. Examples of photoresist material layer 23 include, but are not limited to, photoresist.

[0092] In step 902 , the photoresist material layer and the mask material layer are patterned by photolithography and etching to expose a portion of the sacrificial material layer.

[0093] The optical device 1000 is further processed to pattern the photoresist material layer 23 to form an array pattern on the side of the mask material layer 22 facing away from the sacrificial material layer 24. The array pattern includes a positive or negative copy of the metasurface structure array. Based on the array pattern, a portion of the sacrificial material layer 24 is exposed by etching the photoresist material layer 23 and the mask material layer 22, and finally the following is obtained: Figure 11 Optical device 1100 is shown.

[0094] In step 903 , the exposed portion of the sacrificial material layer and the corresponding portion of the first membrane material layer are etched to form a first set of membranes and expose a portion of the substrate, the corresponding portion of the first membrane material layer being below the exposed portion of the sacrificial material layer.

[0095] The optical device 1100 is further processed, and the sacrificial material 24 and the first film material layer 18 are further etched based on the array pattern to obtain the following: Figure 12 The optical device 1200 is shown. The optical device 1200 includes a first set of films 11, and the first set of films 11 includes a film 101 and a film 102.

[0096] The optical device 1200 is further processed to remove the photoresist material layer 23 and the mask material layer 22 to obtain the following: Figure 13 Optical device 1300 is shown.

[0097] In step 904, a second set of films is formed on the exposed portion of the substrate.

[0098] The optical device 1300 is further processed, and a second set of film material layers is anisotropically deposited on the first set of films 11 after etching, and the second set of film material layers includes films 103 and 104, to obtain the following: Figure 14 The optical device 1400-1 is shown on the left side. The sacrificial material layer 24 and the second set of films (films 103 and 104) on the side of the sacrificial material layer 24 facing away from the first set of films 11 are then removed, so that the first surface 115 of the substrate 12 is covered with the first set of films (films 101 and 102) and the second set of films (films 103 and 104) having substantially uniform thickness and distributed at different positions on the first surface 115, resulting in the following. Figure 14The optical device 1400-2 is shown on the right half.

[0099] It will be understood that in some embodiments, the metasurface structure array can be directly formed on the first group of films (film 101 and film 102) on the first film layer 11 to obtain Figure 2 The optical device 200 shown in FIG. The steps of forming the metasurface structure array will be described in detail later. Figures 15-27 Detailed description.

[0100] The following will be combined Figures 15-20 , describes in detail the process of performing step 802 by photolithography and combining Figure 21-Figure 27 , performing step 802 by the stripping method is described in detail.

[0101] Figure 15 is a diagram illustrating a method for Figure 8 A flow chart of step 802 of forming a metasurface array in method 800 is shown. Figure 16-Figure 18 is a diagram illustrating a process according to an exemplary embodiment in a sequential manner. Figure 15 A schematic diagram of step 802 is shown.

[0102] In step 1501, a supersurface material layer, a mask material layer, and a photolithography material layer stacked on each other are sequentially formed on a side of the first film layer facing away from the substrate.

[0103] A metasurface material layer 21 for manufacturing a metasurface structure array is deposited on the side of the first film layer 11 facing away from the substrate 12, and the first film layer may include a film 101 and a film 102. A mask material layer 22 is then deposited on the side of the metasurface material layer 21 facing away from the first film layer 11. Finally, a photolithography material layer 23 is deposited on the side of the mask material layer 22 facing away from the metasurface material layer 21, to obtain the following: Figure 16 Optical device 1600 is shown.

[0104] In step 1502, the photoresist material layer and the mask material layer are patterned by photolithography and etching to expose a portion of the metasurface material layer.

[0105] The optical device 1600 is processed to pattern the photolithography material layer 23 to form an array pattern on the side of the mask material layer 22 facing away from the metasurface material layer 21. The array pattern includes a positive or negative copy of the metasurface structure array. Based on the array pattern, the photolithography material layer 23 and the mask material layer 22 are etched to obtain the following: Figure 17 Optical device 1700 is shown.

[0106] In step 1503 , the exposed portion of the metasurface material layer is etched to form a metasurface structure array.

[0107] The optical device 1700 is processed, and the exposed portion of the metasurface material layer 21 is further etched to form a metasurface structure 10, as shown in FIG. Figure 18 Optical device 1800-1 is shown on the left half.

[0108] The optical device 1800-1 is processed to remove the mask material layer 22 and the photoresist material layer 23, so that after removing the mask material layer 22 and the photoresist material layer 23, a metasurface structure array 10 is formed on the side of the first film layer 11 away from the substrate 12, as shown in FIG. Figure 18 The optical device 1800-2 is shown on the right half.

[0109] It is understood that the optical device 1800-2 and Figure 1 In some embodiments, the optical device 1800-2 can be further processed to obtain the following Figure 3 Optical device 300 is shown.

[0110] Figure 19 is a diagram illustrating a method for Figure 8 A flow chart of step 802 of forming a metasurface array in method 800 is shown. Figure 20 is a diagram illustrating a method for Figure 19 A schematic diagram of step 802 is shown.

[0111] In step 1901, a supersurface material layer, a mask material layer, and a photolithography material layer stacked on each other are sequentially formed on a side of the first film layer facing away from the substrate.

[0112] In step 1902, the photoresist material layer and the mask material layer are patterned by photolithography and etching to expose a portion of the metasurface material layer.

[0113] Step 1901-Step 1902 and Figure 15 Steps 1501 and 1502 are identical, and therefore are not described here for the sake of brevity.

[0114] In step 1903 , the exposed portion of the metasurface material layer is etched to form a metasurface structure array.

[0115] According to some embodiments, the exposed portion of the metasurface material layer 21 is etched so that the exposed portion of the metasurface material layer 21 is etched to expose a portion of the first film layer 11, obtaining, for example Figure 18 The optical device 1800-1 is shown. The optical device 1800-2 is obtained by removing the mask material layer 22 and the photoresist material layer 23 from the optical device 1800-1.

[0116] In step 1904, a second film material layer is deposited on an exposed portion of the first film layer and an end of the multiple super-surface structures facing away from the substrate, the second film material layer deposited on the exposed portion of the first film layer forms a second film layer, and the second film material layer deposited on an end of the multiple super-surface structures facing away from the substrate forms a third film layer, the second film layer and the third film layer each include at least one group of films, each group of films includes at least one film stacked on each other in the thickness direction of the substrate, and each film includes a material with a corresponding refractive index to enhance the transmission and / or reflection of light.

[0117] The optical device 1800-2 is further processed, and a second film material layer is anisotropically deposited on the plurality of metasurface structures 10. The second film material layer deposited on the exposed portion of the first film layer 11 forms a second film layer 13 (film 105 and film 106), and the second film material layer deposited on the end of the plurality of metasurface structures 10 away from the substrate 12 forms a third film layer 14 (film 107 and film 108), and the following is obtained: Figure 20 Optical device 2000 is shown. Exemplarily, the material and thickness of film 107 are the same as those of film 105 , and the material and thickness of film 108 are the same as those of film 106 .

[0118] It is understood that the optical device 2000 and Figure 3 The structure of the optical devices 300 shown is the same.

[0119] Figure 21 is a diagram illustrating a method for Figure 8 A flow chart of step 802 of forming a metasurface array in method 800 is shown. Figure 22-Figure 25 is a diagram illustrating a process according to an exemplary embodiment in a sequential manner. Figure 21 A schematic diagram of step 802 is shown.

[0120] In step 2101, a second film material layer, a sacrificial material layer, a mask material layer and a photoresist material layer stacked on each other are formed in sequence on the side of the first film layer facing away from the substrate, the second film layer includes at least one group of films, each group of films includes at least one layer of films stacked on each other in the thickness direction of the substrate, and each layer of the film includes a material with a corresponding refractive index to enhance the transmission and / or reflection of light.

[0121] A second film material layer 18 is deposited on the side of the first film layer 11 facing away from the substrate 12, and the second film material layer 18 includes two films (film 105 and film 106) stacked in the thickness direction of the substrate 12. A sacrificial material layer 24 is deposited on the side of the second film material layer 18 facing away from the first film layer 11 (the first film layer 11 includes film 101 and film 102). A mask material layer 22 is deposited on the side of the sacrificial material layer 24 facing away from the second film material layer 18. A photoresist material layer 23 is deposited on the side of the mask material layer 22 facing away from the sacrificial material layer 24, to obtain the following: Figure 22Optical device 2200 is shown.

[0122] In step 2102 , the photoresist material layer and the mask material layer are patterned by photolithography and etching to expose a portion of the sacrificial material layer.

[0123] The optical device 2200 is further processed to pattern the photoresist layer to form an array pattern on the side of the mask material layer 22 facing away from the sacrificial material layer 24. The array pattern includes a positive or negative copy of the metasurface structure array. Based on the array pattern, the photoresist layer 23 and the mask material layer 22 are etched to form a plurality of gaps and raised features corresponding to the array pattern in the mask material layer 22 and the photoresist layer 23, to obtain the following: Figure 23 Optical device 2300 is shown.

[0124] In step 2103 , the exposed portion of the sacrificial material layer and the corresponding portion of the second film material layer are etched to form the second film layer and expose a portion of the first film layer, the corresponding portion of the second film material layer being below the exposed portion of the sacrificial material layer.

[0125] The optical device 2300 is further processed. First, the sacrificial material layer 24 and the second film material layer 18 are etched along the extension direction of the plurality of gaps to obtain the second film layer 13. Then the photoresist material layer 23 and the mask material layer 22 are removed, and finally the following is obtained: Figure 24 Optical device 2400 is shown.

[0126] In step 2104 , a plurality of metasurface structures are formed on the exposed portion of the first film layer, wherein the plurality of metasurface structures extend beyond the second film layer in a direction away from the substrate.

[0127] The optical device 2400 is further processed to deposit a metasurface material layer 21 in the plurality of gaps so that the metasurface material layer 21 fills the gaps in the sacrificial material layer 24, thereby obtaining the following: Figure 25 The left half shows the optical device 2500-1.

[0128] The optical device 2500-1 is further processed to remove the redundant portion of the metasurface material layer 21, and to form a plurality of metasurface structures 10 on the side of the first film layer 11 away from the substrate 12, as shown in FIG. Figure 25 The optical device 2500-2 is shown on the right half.

[0129] Figure 26 is a diagram illustrating a method for Figure 8 Flowchart of the steps in forming a metasurface array in the method shown. Figure 27 is a diagram illustrating a method for Figure 26 Schematic diagram of the steps shown.

[0130] In step 2601 , a second film material layer, a sacrificial material layer, a mask material layer, and a photoresist material layer stacked on each other are sequentially formed on a side of the first film layer facing away from the substrate.

[0131] In step 2602 , the photoresist material layer and the mask material layer are patterned by photolithography and etching to expose a portion of the sacrificial material layer.

[0132] In step 2603 , the exposed portion of the sacrificial material layer and the corresponding portion of the second film material layer are etched to form the second film layer and expose a portion of the first film layer.

[0133] In step 2604, a plurality of metasurface structures are formed on the exposed portion of the first film layer.

[0134] Steps 2601-2604 and Figure 21 Steps 2101 to 2104 are identical and therefore are not described here for the sake of brevity.

[0135] In step 2605, a third film layer is formed at one end of the multiple metasurface structures facing away from the substrate, the third film layer includes at least one group of films, each group of films includes at least one layer of films stacked on each other in the thickness direction of the substrate, and each layer of the film includes a material with a corresponding refractive index to enhance the transmission and / or reflection of light.

[0136] right Figure 25 The multiple metasurface structures in the optical device 2500-2 are anisotropically deposited with a third film material layer (the third film material layer includes film 109 and film 110), and the following is obtained: Figure 27 The left half of the optical device 2700-1 is shown.

[0137] The optical device 2700-1 is further processed to remove the sacrificial material layer 24 and the third film material layer covering the side of the sacrificial material layer 24 away from the second film layer 13, so as to form a third film layer 14 (the third film material layer 14 includes the film 109 and the film 110) on the end of the multiple metasurface structures 10 away from the substrate 12, and obtain the following Figure 27 The right half of the optical device 2700-2 is shown.

[0138] It is understood that the optical device 2700-2 and Figure 4 The optical devices 400 shown are of the same structure.

[0139] Figure 28 is a flow chart illustrating a method 2800 of manufacturing a metasurface optical device according to an exemplary embodiment. Figure 29-30 is a diagram illustrating sequentially the steps of Figure 28 A schematic diagram of method 2800 is shown.

[0140] In step 2801 , a first film layer is formed on a first surface of a substrate.

[0141] In step 2802, a metasurface structure array is formed on a side of the first film layer facing away from the substrate.

[0142] Step 2801-step 2802 are the same as step 801-step 802, so for the sake of brevity, they are not repeated here.

[0143] In step 2803 , a protective material layer is deposited so that each of the plurality of metasurface structures is surrounded by the protective material layer.

[0144] by Figure 27 Taking the optical device 2700-2 as an example, the optical device 2700-2 is further processed and a protective material layer 16 is deposited on the multiple metasurface structures 10 in the optical device 2700-2.

[0145] In step 2804, the protective material layer is planarized.

[0146] The surface of the deposited protective material layer 16 is polished by chemical mechanical polishing (CMP) to obtain Figure 29 Optical device 2900 is shown.

[0147] In step 2805, a fourth film layer is formed on the side of the protective material layer facing away from the substrate, the fourth film layer includes at least one group of films, each group of films includes at least one layer of films stacked on each other in the thickness direction of the substrate, and each layer of the film includes a material with a corresponding refractive index to enhance the transmission and / or reflection of light.

[0148] The optical device 2900 is further processed to form a fourth film layer 15 on the side of the protective material layer 16 facing away from the substrate 23. The fourth film layer 15 includes two films (film 111 and film 112) stacked on each other in the thickness direction of the substrate 12, and the following is obtained: Figure 30 Optical device 3000 is shown.

[0149] It is understood that the optical device 3000 and Figure 5 The optical devices 500 shown are of the same structure.

[0150] According to some embodiments, method 800 may further include forming a fifth film layer on a second surface of the substrate, the second surface being opposite to the first surface in the thickness direction of the substrate, the fifth film layer including at least one group of films distributed at different positions on the second surface, each group of films including at least one film stacked on each other in the thickness direction of the substrate, each film including a material having a corresponding refractive index to enhance the transmission and / or reflection of light.

[0151] Figure 31is a schematic diagram illustrating a method for manufacturing a metasurface optical device according to an exemplary embodiment. For example, the optical device 3000 is processed, and a fifth film layer 17 is deposited on the second surface 116 of the substrate. The fifth film layer 17 includes two films (film 113 and film 114) stacked on each other in the thickness direction of the substrate 12, to obtain the following: Figure 31 Optical device 3100 is shown.

[0152] It is understood that the optical device 3100 and Figure 6 The optical devices 600 shown are of the same structure.

[0153] According to some embodiments, each of the plurality of metasurface structures includes a plurality of distributed feedback films stacked on one another in a thickness direction of a substrate.

[0154] Exemplarily, the above-mentioned metasurface structures can include multiple distributed feedback membranes stacked on each other in the thickness direction of the substrate, which are used to regulate the polarization, amplitude, phase, polarization mode, propagation mode and other characteristics of the incident light, and at the same time filter the light, and the filtering method can be high-pass filtering, low-pass filtering or band-pass filtering.

[0155] According to an embodiment of the present disclosure, there is further provided an optical system, comprising the optical device according to any one of the embodiments described above.

[0156] Although the present disclosure has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative and exemplary and not restrictive; the disclosure is not limited to the disclosed embodiments. Variations to the disclosed embodiments will be understood and effected by those skilled in the art in practicing the claimed subject matter by studying the drawings, the disclosure and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps that are not listed, the indefinite article "a" or "an" does not exclude a plurality, and the term "plurality" means two or more. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

Claims

1. A metasurface optical device, comprising: a substrate including a first surface and a second surface opposite to each other in a thickness direction of the substrate; a first film layer, the first film layer being located on a first surface of the substrate and comprising at least one group of films distributed at different positions on the first surface, each group of films comprising at least one film stacked one on another in a thickness direction of the substrate, each film comprising a material having a corresponding refractive index to enhance light transmission and / or reflection, wherein the at least one group of films of the first film layer comprises a first group of films and a second group of films, the second group of films being made of a material different from that of the first group of films; as well as A supersurface structure array, wherein the supersurface structure array includes a plurality of supersurface structures located on a side of the first film layer away from the substrate and extending in a direction away from the substrate, each of the plurality of supersurface structures being directly on a corresponding portion of the first group of films.

2. The metasurface optical device according to claim 1, further comprising a second film layer, the second film layer being located on a surface of the first film layer facing away from the substrate, and comprising at least one group of films distributed at different positions on the surface, each group of films comprising at least one film layer stacked one on another in the thickness direction of the substrate, each film layer comprising a material having a corresponding refractive index to enhance the transmission and / or reflection of light, wherein: The plurality of super-surface structures extend beyond the second film layer in a direction away from the substrate.

3. The metasurface optical device as described in claim 2 further includes a third film layer, which is located at one end of the multiple metasurface structures away from the substrate, and includes at least one group of films distributed on different metasurface structures, each group of films includes at least one layer of films stacked on each other in the thickness direction of the substrate, and each layer of film includes a material with a corresponding refractive index to enhance the transmission and / or reflection of light.

4. The metasurface optical device according to claim 3, wherein: The third film layer is made of the same material as that of the second film layer.

5. The metasurface optical device according to claim 3, wherein: The third film layer is made of a material different from that of the second film layer.

6. The metasurface optical device according to any one of claims 1 to 5, further comprising: a fourth film layer, the fourth film layer being located on a side of the plurality of metasurface structures facing away from the substrate and comprising at least one set of films, each set of films comprising at least one film layer stacked one on another in a thickness direction of the substrate, each film layer comprising a material having a corresponding refractive index to enhance light transmission and / or reflection; as well as A protective material layer is located between the fourth film layer and the first film layer.

7. The metasurface optical device according to any one of claims 1 to 5, further comprising a fifth film layer, the fifth film layer being located on the second surface of the substrate and comprising at least one group of films distributed at different positions on the second surface, each group of films comprising at least one film stacked on each other in the thickness direction of the substrate, each film comprising a material having a corresponding refractive index to enhance the transmission and / or reflection of light.

8. The metasurface optical device according to any one of claims 1 to 5, wherein: Each of the plurality of metasurface structures includes a plurality of distributed feedback films stacked on one another in a thickness direction of the substrate.

9. A method for manufacturing a metasurface optical device, comprising: A first film layer is formed on a first surface of a substrate, wherein the first film layer includes at least one group of films distributed at different positions on the first surface, each group of films includes at least one film stacked one on another in a thickness direction of the substrate, and each film includes a material having a corresponding refractive index to enhance light transmission and / or reflection, wherein the at least one group of films in the first film layer includes a first group of films and a second group of films, the first group of films being made of a material different from that of the second group of films, and wherein forming the first film layer on the first surface of the substrate includes: forming a first film material layer, a sacrificial material layer, a mask material layer and a photoresist material layer stacked on the first surface of the substrate in sequence; patterning the photoresist material layer and the mask material layer by photolithography and etching to expose a portion of the sacrificial material layer; etching the exposed portion of the sacrificial material layer and a corresponding portion of the first film material layer to form the first group of films and expose a portion of the substrate, wherein the corresponding portion of the first film material layer is below the exposed portion of the sacrificial material layer; and forming the second set of films on the exposed portion of the substrate; and A supersurface structure array is formed on a side of the first film layer facing away from the substrate, wherein the supersurface structure array includes a plurality of supersurface structures extending in a direction facing away from the substrate.

10. The method of claim 9, wherein: Forming a metasurface structure array on a side of the first film layer facing away from the substrate includes: forming a supersurface material layer, a mask material layer, and a photolithography material layer stacked on one another in sequence on a side of the first film layer facing away from the substrate; patterning the photoresist material layer and the mask material layer by photolithography and etching to expose a portion of the metasurface material layer; and The exposed portion of the metasurface material layer is etched to form the metasurface structure array.

11. The method according to claim 10, wherein: The exposed portion of the metasurface material layer is etched to expose a portion of the first film layer, and the method further comprises: A second film material layer is deposited on the exposed portion of the first film layer and the end of the multiple super-surface structures facing away from the substrate, wherein the second film material layer deposited on the exposed portion of the first film layer forms a second film layer, and the second film material layer deposited on the end of the multiple super-surface structures facing away from the substrate forms a third film layer, wherein the second film layer and the third film layer each include at least one group of films, each group of films includes at least one film stacked on each other in the thickness direction of the substrate, and each film includes a material with a corresponding refractive index to enhance the transmission and / or reflection of light.

12. The method according to claim 11, wherein forming a metasurface structure array on a side of the first film layer facing away from the substrate comprises: A second film material layer, a sacrificial material layer, a mask material layer, and a photoresist material layer are sequentially formed on a side of the first film layer facing away from the substrate, wherein the second film layer includes at least one group of films, each group of films includes at least one film layer stacked one on another in a thickness direction of the substrate, and each film layer includes a material having a corresponding refractive index to enhance light transmission and / or reflection; patterning the photoresist material layer and the mask material layer by photolithography and etching to expose a portion of the sacrificial material layer; etching the exposed portion of the sacrificial material layer and a corresponding portion of the second film material layer to form a second film layer and expose a portion of the first film layer, wherein the corresponding portion of the second film material layer is below the exposed portion of the sacrificial material layer; and The plurality of supersurface structures are formed on the exposed portion of the first film layer, wherein the plurality of supersurface structures extend beyond the second film layer in a direction away from the substrate.

13. The method of claim 12, further comprising: A third film layer is formed at one end of the multiple metasurface structures facing away from the substrate, wherein the third film layer includes at least one group of films, each group of films includes at least one layer of films stacked one on another in the thickness direction of the substrate, and each layer of the film includes a material with a corresponding refractive index to enhance the transmission and / or reflection of light.

14. The method according to any one of claims 9 to 13, further comprising: depositing a protective material layer so that each of the plurality of metasurface structures is surrounded by the protective material layer; planarizing the protective material layer; as well as A fourth film layer is formed on the side of the protective material layer facing away from the substrate, wherein the fourth film layer includes at least one group of films, each group of films includes at least one layer of films stacked on each other in the thickness direction of the substrate, and each layer of the film includes a material with a corresponding refractive index to enhance the transmission and / or reflection of light.

15. The method according to any one of claims 9 to 13, wherein Each of the plurality of metasurface structures includes a plurality of distributed feedback films stacked on one another in a thickness direction of the substrate.

16. The method according to any one of claims 9 to 13, further comprising: A fifth film layer is formed on the second surface of the substrate, the second surface being opposite to the first surface in the thickness direction of the substrate, wherein the fifth film layer includes at least one group of films distributed at different positions on the second surface, each group of films including at least one layer of films stacked on each other in the thickness direction of the substrate, each layer of the film including a material having a corresponding refractive index to enhance the transmission and / or reflection of light.

17. An optical system comprising the optical device according to any one of claims 1 to 8.

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