IC Radio Frequency Packaging Structure and Preparation Method of IC Radio Frequency Packaging Structure

Abstract

The present invention provides an IC radio frequency packaging structure and a preparation method thereof, which relate to the technical field of semiconductor packaging. By arranging a chip on a substrate, and forming a wire arc antenna spanning both sides of the chip on the substrate through wire bonding, and then covering the chip and the wire arc antenna with a plastic package body, and the wire arc antenna is electrically connected to the substrate, and the top end of the wire arc antenna is exposed outside the plastic package body to realize signal transmission or reception. Compared with the prior art, the present invention forms an antenna structure with a three-dimensional shape through a wire bonding structure, so as to be able to realize a multi-directional wireless transmission / reception structure, improve the applicable range of the antenna, and at the same time, the antenna spans the chip, which can play a role in waveguide signal aggregation, thereby realizing antenna transmission gain. And the wire bonding structure has low cost and good structural stability, and can effectively realize the functions of heat dissipation and enhanced structural strength, avoiding a series of problems brought by the traditional printing or sputtering methods.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular, to an IC radio frequency packaging structure and a preparation method thereof. Background Art

[0002] With the rapid development of the semiconductor industry, IC radio frequency antenna structures are widely used in the semiconductor industry. Integrated antennas include two major types: Antenna-on-Chip (AoC) and Antenna-in-Package (AiP). With the iteration of high-frequency and low-frequency signals in the communication field for electronic products, there is a need for products with antenna functions to meet the high / low-frequency signal transmission. IC radio frequency antenna products are required to emit in a specified direction and have a strong enough signal.

[0003] The traditional method of printing antennas mainly uses the printing process to print antenna patterns on the surface of IC packaging devices. Usually, in the printing process, there are quality problems such as printed antenna offset, printed antenna short circuit, and printed antenna soldering deficiency, and the cost of using printing materials is relatively high, which is not conducive to cost control. At the same time, in the traditional manufacturing method of IC radio frequency antenna structures, the metal sputtering process is also used for preparation. This method also brings the problem of increased cost, and the yield of metal sputtering products is relatively low. At the same time, the metal sputtering antenna is mainly designed on the surface of IC packaging devices and is a two-dimensional structure, which can only meet the single-group and one-way antenna structure and cannot realize the multi-directional wireless transmission structure. And often, a multi-directional wireless structure requires multiple IC radio frequency antenna packages to be combined together, resulting in an increase in procurement cost and the structural size of the terminal product, which is not conducive to cost control and product miniaturization.

[0004] Furthermore, a solution of separately and additionally setting an antenna on the top surface of the package body has emerged. For example, as disclosed in Patent 202010860407.7 (Packaging Antenna Structure, Its Manufacturing Method, and Electronic Device), the antenna is arranged on the package body of the packaged chip and is located on the side of the package body away from the substrate. This makes the antenna located above the chip instead of being arranged on the substrate like the chip. However, it is also designed on the surface of the IC packaging device and is a two-dimensional structure, which can only meet the single-group and one-way antenna structure and cannot realize the multi-directional wireless transmission structure. Summary of the Invention

[0005] The objectives of the present invention include, for example, providing an IC radio frequency packaging structure and a preparation method thereof, which can realize multiple frequencies and multi-directional wireless structures without multiple assemblies, is conducive to product miniaturization, has a relatively low cost, simple antenna forming, good structural stability, and reliable quality.

[0006] Embodiments of the present invention can be implemented as follows:

[0007] In a first aspect, the present invention provides an IC radio frequency packaging structure, comprising:

[0008] A substrate;

[0009] A chip disposed on the substrate;

[0010] A wire arc antenna disposed on the substrate and spanning both sides of the chip;

[0011] And, a plastic package disposed on the substrate and covering the chip and the wire arc antenna;

[0012] Wherein, the wire arc antenna is formed by wire bonding, is electrically connected to the substrate, and the top end of the wire arc antenna is exposed outside the plastic package for transmitting or receiving signals.

[0013] In an optional embodiment, a plurality of pairs of corresponding antenna pads are disposed on the substrate on both sides of the chip, the wire arc antennas are respectively connected to the plurality of antenna pads, and the projection trajectory of the wire arc antennas on the substrate is in a serpentine distribution.

[0014] In an optional embodiment, the wire arc antenna includes a cross wire arc and a connecting wire arc, the cross wire arc spans both sides of the chip, and both ends of the cross wire arc are respectively connected to two corresponding antenna pads, the connecting wire arc is disposed on one side of the chip, and both ends of the connecting wire arc are respectively connected to two adjacent antenna pads located on one side of the chip, wherein the top ends of the cross wire arc and the connecting wire arc are both exposed outside the plastic package.

[0015] In an optional embodiment, the cross wire arc is in a semi-circular arch shape, and the vertex of the semi-circular arch is exposed outside the plastic package.

[0016] In an optional embodiment, the cross wire arc includes a first arch portion and a second arch portion which are integrally provided, the first arch portion and the second arch portion form an M-shaped structure, one end of the first arch portion is connected to the antenna pad located on one side of the chip, the other end of the first arch portion is located in the middle of the chip and is connected to the second arch portion, and the end of the second arch portion away from the first arch portion is connected to the antenna pad located on the other side of the chip, wherein the top ends of the first arch portion and the second arch portion are both exposed outside the plastic package.

[0017] In an alternative embodiment, an arc-shaped groove is further formed on the plastic package body. The arc-shaped groove corresponds to the middle part of the chip, and two ends of the arc-shaped groove respectively extend to the tops of the first arched part and the second arched part. The connection part between the first arched part and the second arched part is accommodated in the arc-shaped groove and exposed outside the plastic package body.

[0018] In an alternative embodiment, the IC radio frequency packaging structure further includes a circuit board disposed on the plastic package body. A connection pad is disposed on one side surface of the circuit board. The connection pad is connected to the cross-wiring arc through a solder ball. A planar antenna is disposed on the other side surface of the circuit board. The planar antenna is electrically connected to the connection pad.

[0019] In an alternative embodiment, a conduction opening is further formed on the circuit board. The conduction opening corresponds to the chip, so that the middle part of the cross-wiring arc corresponds to the conduction opening.

[0020] In an alternative embodiment, a Luneburg lens is embedded in the conduction opening. The Luneburg lens is disposed corresponding to the exposed part of the cross-wiring arc.

[0021] In an alternative embodiment, the Luneburg lens is spherical.

[0022] In an alternative embodiment, the connection wire arc is horizontally arched, and the connection wire arc extends towards the side wall of the plastic package body and is partially exposed outside the plastic package body.

[0023] In an alternative embodiment, a ground wire arc is further formed on the substrate. The ground wire arc is electrically connected to the substrate and is partially exposed outside the plastic package body.

[0024] In a second aspect, the present invention provides a method for manufacturing an IC radio frequency packaging structure for manufacturing the IC radio frequency packaging structure according to any one of the foregoing embodiments, including the following steps:

[0025] Provide a substrate

[0026] Attach a chip on the substrate;

[0027] Form a wire arc antenna on the substrate. The wire arc antenna straddles both sides of the chip;

[0028] Form a plastic package body on the substrate. The plastic package body covers the chip and the wire arc antenna;

[0029] Wherein, the wire arc antenna is formed by wire bonding and is electrically connected to the substrate, and the top end of the wire arc antenna is exposed outside the plastic package body for transmitting or receiving signals.

[0030] The beneficial effects of the embodiments of the present invention include, for example:

[0031] An embodiment of the present invention provides an IC radio frequency packaging structure and a preparation method thereof. A chip is arranged on a substrate, and wire arc antennas spanning both sides of the chip are formed on the substrate by wire bonding. Then, a plastic package body is used to coat the chip and the wire arc antennas. The wire arc antennas are electrically connected to the substrate, and the tops of the wire arc antennas are exposed outside the plastic package body to realize signal transmission or reception. Compared with the prior art, the IC radio frequency packaging structure provided by the present invention forms an antenna structure with a three-dimensional shape through a wire bonding structure, so as to realize a multi-directional wireless transmission / reception structure, improve the applicable range of the antenna. At the same time, the antenna spans the chip, which can play a role in waveguide signal aggregation, thereby realizing antenna transmission gain and enabling directional propagation of the antenna. Moreover, the wire bonding structure has low cost and good structural stability, can effectively realize heat dissipation and enhance the structural strength, realizes radio frequency functions by using the wire bonding structure, and avoids a series of problems brought by traditional printing or sputtering methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0033] Figure 1 Schematic diagram of the IC radio frequency packaging structure provided by the first embodiment of the present invention from the first perspective;

[0034] Figure 2 Schematic diagram of the IC radio frequency packaging structure provided by the first embodiment of the present invention from the second perspective;

[0035] Figure 3 Schematic diagram of the IC radio frequency packaging structure provided by the second embodiment of the present invention;

[0036] Figure 4 Schematic diagram of the IC radio frequency packaging structure provided by the third embodiment of the present invention;

[0037] Figure 5 Schematic diagram of the IC radio frequency packaging structure provided by the fourth embodiment of the present invention;

[0038] Figure 6 Schematic diagram of the IC radio frequency packaging structure provided by the fifth embodiment of the present invention;

[0039] Figure 7 Schematic diagram of the IC radio frequency packaging structure provided by the sixth embodiment of the present invention;

[0040] Figure 8 Schematic diagram of the IC radio frequency packaging structure provided by the seventh embodiment of the present invention from the first perspective;

[0041] Figure 9 Schematic diagram of the IC radio frequency packaging structure provided by the seventh embodiment of the present invention from the second perspective.

[0042] Icons: 100 - IC radio frequency packaging structure; 110 - substrate; 111 - antenna pad; 120 - chip; 130 - wire arc antenna; 131 - jumper wire arc; 132 - connecting wire arc; 133 - first arched portion; 135 - second arched portion; 137 - ground wire arc; 140 - plastic package; 141 - arc groove; 150 - circuit board; 151 - connection pad; 153 - conduction opening; 160 - planar antenna; 170 - Luneburg lens. Detailed implementation manners

[0043] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some but not all of the embodiments of the present invention. Generally, the components of the embodiments of the present invention described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0044] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts fall within the scope of protection of the present invention.

[0045] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0046] In the description of the present invention, it should be noted that if terms such as "upper", "lower", "inner", "outer", etc. are used to indicate the orientation or positional relationship, it is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the present invention is usually placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention.

[0047] In addition, if terms such as "first", "second", etc. are used only for distinguishing descriptions, they cannot be understood as indicating or implying relative importance.

[0048] As disclosed in the background art, in the prior art, printing or sputtering is usually used to form an antenna pattern on the surface of a product.

[0049] When preparing the antenna of an IC product by using the prior art method for manufacturing an IC radio frequency antenna structure, for its electrical connection structure, the solder joints of the antenna circuit on the substrate usually need to be designed inside the IC package structure. The pads are exposed by means of laser grooving, and then the grooves are filled with conductive adhesive. Due to the use of the laser grooving process, it is very difficult to control the laser grooving depth / energy, which easily causes damage to the solder joints of the antenna circuit on the substrate, bringing risks of poor contact of the antenna circuit and damage to the product performance in the IC radio frequency antenna structure.

[0050] In addition, for the antenna itself structure, when using a printed antenna, the printed antenna mainly uses the printing process to print an antenna pattern on the surface of the IC package device. Usually in the printing process, there are problems such as printed antenna offset / printed antenna short circuit / printed antenna false soldering, etc., and the cost of the printing material is relatively high. Using the printing process in the traditional IC radio frequency antenna structure manufacturing method will bring problems of increased cost and low yield of printed products.

[0051] Moreover, this antenna structure is usually sputtered on the surface of the product, and can only meet a single-group and unidirectional antenna, and cannot achieve multi-directional wireless transmission. And often a multi-directional wireless structure needs to use multiple IC radio frequency antenna packages combined together, bringing an increase in procurement cost and an increase in the structural size of the terminal product, which is not conducive to cost control and product miniaturization.

[0052] In addition, the prior art IC radio frequency antenna structure cannot achieve its antenna directional transmission and the antenna signal transmission is weak.

[0053] To solve the above problems, the present invention provides an IC radio frequency package structure and a preparation method of the IC radio frequency package structure. It should be noted that, without conflict, the features in the embodiments of the present invention can be combined with each other.

[0054] First Embodiment

[0055] Referring to Figure 1 and Figure 2 , this embodiment provides an IC radio frequency package structure 100. An antenna structure with a three-dimensional shape is formed through a wire bonding structure, so as to be able to achieve a multi-directional wireless transmission / reception structure, improve the applicable range of the antenna. At the same time, the antenna spans across the chip 120, which can play a role in waveguide signal aggregation, thereby realizing antenna transmission gain and being able to achieve the directional propagation of the antenna. And the wire bonding structure has low cost and good structural stability, and can effectively achieve the functions of heat dissipation and enhanced structural strength. The radio frequency function is realized by using the wire bonding structure, avoiding a series of problems brought by the traditional printing or sputtering method.

[0056] The IC radio frequency packaging structure 100 provided in this embodiment includes a substrate 110, a chip 120, a wire arc antenna 130, and a plastic package 140. The chip 120 is disposed on the substrate 110. The wire arc antenna 130 is disposed on the substrate 110 and straddles both sides of the chip 120. The plastic package 140 is disposed on the substrate 110 and covers the chip 120 and the wire arc antenna 130. Among them, the wire arc antenna 130 is formed by wire bonding and is electrically connected to the substrate 110, and the top end of the wire arc antenna 130 is exposed outside the plastic package 140 for transmitting or receiving signals.

[0057] In this embodiment, the chip 120 is disposed on the front surface of the substrate 110, which can be a radio frequency device. At the same time, a plurality of solder ball pads are provided on the back surface of the substrate 110, and solder balls are provided on the solder ball pads, thereby realizing external electrical connection. By disposing the chip 120 on the substrate 110 and forming a wire arc antenna 130 that straddles both sides of the chip 120 by wire bonding on the substrate 110, the radio frequency function is realized. Then, the chip 120 and the wire arc antenna 130 are covered by the plastic package 140, and the wire arc antenna 130 is electrically connected to the substrate 110, and the top end of the wire arc antenna 130 is exposed outside the plastic package 140 to realize signal transmission or reception. In this embodiment, a three-dimensional antenna structure is formed by the wire bonding structure, so that a multi-directional wireless transmission / reception structure can be realized, the applicable range of the antenna is improved, and at the same time, the wire arc antenna 130 straddles the chip 120, which can play a role in waveguide signal aggregation, thereby realizing antenna transmission gain and realizing directional propagation of the antenna. Moreover, the wire bonding structure has low cost and good structural stability, can effectively realize heat dissipation and enhance the structural strength, realizes the radio frequency function by using the wire bonding structure, and avoids a series of problems brought by the traditional printing or sputtering method.

[0058] It should be noted that in this embodiment, the wire arc antenna 130 formed by wire bonding straddles both sides of the chip 120, which means that the bottom feet of the wire arc antenna 130 are connected to the substrate 110, and the rest are located above the chip 120 and can be spaced apart from the chip 120. Moreover, in this embodiment, the top end of the wire arc antenna 130 is exposed outside the plastic package 140, which means that a part of the wire arc antenna 130 is covered in the plastic package 140 and the top is extended out of the plastic package 140 to ensure its function of transmitting or receiving signals.

[0059] In this embodiment, a plurality of pairwise corresponding antenna pads 111 are provided on the substrates 110 on both sides of the chip 120. The wire arc antennas 130 are respectively connected to the plurality of antenna pads 111, and the projection trajectory of the wire arc antennas 130 on the substrate 110 is serpentine. Specifically, the antenna pads 111 are electrically connected to the wiring layer inside the substrate 110. The serpentine distribution of the wire arc antennas 130 means that the projection of the wire arc antennas 130 is a continuous S shape, so as to ensure that each two opposite antenna pads 111 can be connected to the spanning part of the wire arc antennas 130, and ensure that the wire arc antennas 130 straddle above the chip 120.

[0060] It should be noted that in this embodiment, the wire arc antennas 130 are all metal wire bonding structures, and the metal wires can connect the antenna pads 111, are embedded in the plastic package 140, and the metal wires straddle the chip 120, which can improve the heat dissipation capacity of the chip 120, so as to conduct the heat inside the chip 120 to the external area.

[0061] In this embodiment, the wire arc antennas 130 include cross wire arcs 131 and connecting wire arcs 132. The cross wire arcs 131 straddle both sides of the chip 120, and both ends of the cross wire arcs 131 are respectively connected to two corresponding antenna pads 111. The connecting wire arcs 132 are arranged on one side of the chip 120, and both ends of the connecting wire arcs 132 are respectively connected to two adjacent antenna pads 111 on one side of the chip 120. The tops of the cross wire arcs 131 and the connecting wire arcs 132 are both exposed outside the plastic package 140. Specifically, the projection of the cross wire arcs 131 on the substrate 110 is a horizontal straight line segment, and the projection of the connecting wire arcs 132 on the substrate 110 is a vertical straight line segment. The projections of the plurality of cross wire arcs 131 and the plurality of connecting wire arcs 132 present a serpentine distribution, so as to cover the entire chip 120 inside.

[0062] It should be noted that the connecting wire arcs 132 connect two adjacent antenna pads 111 on the same side, and one end of each connecting wire arc 132 is jointly connected to the same antenna pad 111 with one end of the cross wire arc 131, so as to realize the electrical connection between the connecting wire arcs 132 and the cross wire arcs 131, so that the plurality of connecting wire arcs 132 and the plurality of cross wire arcs 131 jointly form a three-dimensional cage structure to better realize the antenna function.

[0063] In this embodiment, the jumper arc 131 includes a first arched portion 133 and a second arched portion 135 which are integrally provided. The first arched portion 133 and the second arched portion 135 form an M-shaped structure. One end of the first arched portion 133 is connected to the antenna pad 111 on one side of the chip 120. The other end of the first arched portion 133 is located in the middle of the chip 120 and is connected to the second arched portion 135. The end of the second arched portion 135 far from the first arched portion 133 is connected to the antenna pad 111 on the other side of the chip 120. The tops of the first arched portion 133 and the second arched portion 135 are both exposed outside the plastic package 140.

[0064] It should be noted that in this embodiment, a semi-circular arc-shaped trough structure is formed at the connection between the first arched portion 133 and the second arched portion 135. This arc-shaped trough structure is also located above the chip 120 and is spaced apart from the chip 120. The first arched portion 133 and the second arched portion 135 can be used as the signal output / input ends of the antenna. By setting the arc-shaped trough structure, it can play a focusing role when transmitting or receiving signals, concentrating the waveguide signal at the center point of this arc-shaped trough structure, thereby achieving the antenna transmission gain effect and enabling the directional propagation of the antenna signal.

[0065] It should be noted that the connection arc 132 in this embodiment can be a single-arch structure, that is, the connection arc 132 is semi-circular and connects two adjacent antenna pads 111, or it can be a double-arch structure, that is, the shape of the connection arc 132 is the same as that of the jumper arc 131, which can further improve the performance of the antenna.

[0066] In this embodiment, the jumper arc 131 and the connection arc 132 can be formed by wire bonding together. The materials of the jumper arc 131 and the connection arc 132 only need to meet the requirements for transmitting or receiving, have low resistivity, stable signals, and small dielectric losses. For example, they can be copper wires, gold wires, or other alloy materials.

[0067] In this embodiment, an arc-shaped groove 141 is also formed on the plastic package 140. The arc-shaped groove 141 corresponds to the middle of the chip 120, and both ends of the arc-shaped groove 141 extend to the tops of the first arched portion 133 and the second arched portion 135 respectively. The connection part between the first arched portion 133 and the second arched portion 135 is accommodated in the arc-shaped groove 141 and is exposed outside the plastic package 140. By setting the arc-shaped groove 141, the arc-shaped trough structure between the first arched portion 133 and the second arched portion 135 can be exposed, thereby reducing signal loss and improving the propagation rate.

[0068] In this embodiment, a ground wire arc 137 is further provided on the substrate 110. The ground wire arc 137 is electrically connected to the substrate 110 and is partially exposed in the encapsulant 140. By providing the ground wire arc 137 and electrically connecting the ground wire arc 137 to the ground line on the substrate 110, grounding is achieved, thereby effectively eliminating the static electricity brought by the periphery of the encapsulant 140, achieving good static electricity control, and avoiding the static electricity from affecting the normal operation of the device.

[0069] It should be noted that the ground wire arc 137 is also formed by a wire bonding structure here, and its wire bonding shape is not specifically limited and can be the same as that of the connection wire arc 132.

[0070] This embodiment also provides a preparation method for the IC radio frequency packaging structure 100 for preparing the aforementioned IC radio frequency packaging structure 100. The method includes the following steps:

[0071] S1: Provide a substrate 110.

[0072] Specifically, take a substrate 110 with a wiring layer and fabricate antenna pads 111 on the front surface of the substrate 110 according to the antenna trajectory.

[0073] S2: Attach a chip 120 to the substrate 110.

[0074] Specifically, then invert and attach the chip 120 on the antenna pads 111 of the substrate 110 again, where the chip 120 can be a radio frequency device on the antenna pads 111 of the substrate 110.

[0075] S3: Form a wire arc antenna 130 on the substrate 110.

[0076] Among them, the wire arc antenna 130 straddles both sides of the chip 120. After the chip 120 is attached, wire bonding is performed on the antenna pads 111 to form an antenna trajectory line, and then an antenna pattern layer is formed. Part of the antenna pattern layer is horizontally disposed above the chip 120.

[0077] Specifically, the wire bonding operations of the jumper wire arc 131 and the connection wire arc 132 can be completed simultaneously, so that the jumper wire arc 131 can straddle the chip 120, and the connection wire arc 132 can electrically connect multiple jumper wire arcs 131 into one body. Among them, by controlling the wire bonding structure, an M-shaped jumper wire arc 131 can be formed.

[0078] S4: Form an encapsulant 140 on the substrate 110.

[0079] Among them, the plastic package 140 wraps the chip 120 and the wire arc antenna 130, and the top end of the wire arc antenna 130 is exposed outside the plastic package 140 for transmitting or receiving signals. After the plastic package 140 is completed, an arc-shaped groove 141 can be formed by grooving above the chip 120, and the arc-shaped groove 141 can expose the connection part between the first arched part 133 and the second arched part 135 in the jumper wire arc 131.

[0080] Specifically, after wire bonding is completed, the bottom area of the antenna can be covered by using the method of liquid printing the plastic package 140 (or using the die plastic package method, and its die needs to be made with a groove for protecting the wire bonding top arc to avoid being encapsulated by the plastic package 140 during plastic packaging), leaving the top end of the wire arc antenna 130 exposed. The top end of the wire arc antenna 130 serves as the antenna transmitting end (antenna track transmitting end). Then, by using the etching or laser grooving method, the plastic package 140 on the upper surface of the connection part between the first arched part 133 and the second arched part 135 is removed, exposing the semi-circular arc-shaped trough structure, and the connection part between the first arched part 133 and the second arched part 135 is exposed, thereby achieving the gain effect of the antenna.

[0081] In summary, the IC radio frequency packaging structure 100 and its manufacturing method provided in this embodiment, by setting the chip 120 on the substrate 110, and forming a wire arc antenna 130 spanning both sides of the chip 120 by wire bonding on the substrate 110, and then covering the chip 120 and the wire arc antenna 130 with the plastic package 140, and the wire arc antenna 130 is electrically connected to the substrate 110, and the top end of the wire arc antenna 130 is exposed outside the plastic package 140 to achieve signal transmission or reception. Compared with the prior art, the IC radio frequency packaging structure 100 provided in this embodiment forms a three-dimensional antenna structure through the wire bonding structure, thereby enabling a multi-directional wireless transmission / reception structure, expanding the applicable range of the antenna. At the same time, the antenna spans the chip 120, which can play a role in waveguide signal aggregation, thereby achieving antenna transmission gain and enabling directional propagation of the antenna. And the wire bonding structure has low cost and good structural stability, can effectively achieve heat dissipation and enhance the structural strength, realizes the radio frequency function by using the wire bonding structure, and avoids a series of problems brought by the traditional printing or sputtering method.

[0082] Second Embodiment

[0083] Refer to Figure 3 , this embodiment provides an IC radio frequency packaging structure 100, whose basic structure, principle, and the resulting technical effects are the same as those of the first embodiment. For a brief description, for the parts not mentioned in this embodiment, reference can be made to the corresponding content in the first embodiment.

[0084] In this embodiment, the jumper arc 131 includes a first arched portion 133 and a second arched portion 135 which are integrally provided. The first arched portion 133 and the second arched portion 135 form an M-shaped structure. One end of the first arched portion 133 is connected to the antenna pad 111 on one side of the chip 120. The other end of the first arched portion 133 is located in the middle of the chip 120 and is connected to the second arched portion 135. The end of the second arched portion 135 far from the first arched portion 133 is connected to the antenna pad 111 on the other side of the chip 120. The tops of the first arched portion 133 and the second arched portion 135 are both exposed outside the plastic package 140. Specifically, the connection area between the first arched portion 133 and the second arched portion 135 is partially located inside the plastic package 140.

[0085] In this embodiment, the plastic package 140 covers the connection part of the first arched portion 133 and the second arched portion 135. Compared with the first embodiment, this embodiment avoids the structure of grooving on the plastic package 140, thus avoiding the risk of damage to the wire arc caused by laser grooving.

[0086] In this embodiment, the connecting wire arc 132 has a semi-circular arched structure, that is, the shape of the connecting wire arc 132 is different from that of the jumper arc 131. The connecting wire arc 132 adopts a simple arched structure, which can reduce the wire bonding difficulty.

[0087] Third Embodiment

[0088] See Figure 4 , this embodiment provides an IC radio frequency packaging structure 100, whose basic structure, principle, and the resulting technical effects are the same as those of the first embodiment. For a brief description, for the parts not mentioned in this embodiment, reference can be made to the corresponding content in the first embodiment.

[0089] In this embodiment, the wire arc antenna 130 includes a jumper arc 131 and a connecting wire arc 132. The jumper arc 131 spans across both sides of the chip 120, and the two ends of the jumper arc 131 are respectively connected to two corresponding antenna pads 111. The connecting wire arc 132 is arranged on one side of the chip 120, and the two ends of the connecting wire arc 132 are respectively connected to two adjacent antenna pads 111 on one side of the chip 120. The tops of the jumper arc 131 and the connecting wire arc 132 are both exposed outside the plastic package 140. Specifically, the jumper arc 131 is in a semi-circular arched shape, and the vertex of the semi-circular arched shape is exposed outside the plastic package 140. At the same time, the structure of the connecting wire arc 132 is the same as that of the jumper arc 131, also in a semi-circular arched shape, and the top of the connecting wire arc 132 is exposed outside the plastic package 140.

[0090] By adopting the jumper arc 131 and the connecting wire arc 132 with a semi-circular arched structure, the wire bonding difficulty can be reduced, thus facilitating preparation.

[0091] Fourth Embodiment

[0092] See Figure 5 , this embodiment provides an IC radio frequency packaging structure 100, whose basic structure, principle, and technical effects are the same as those of the first embodiment, the second embodiment, or the third embodiment. For a brief description, for the parts not mentioned in this embodiment, reference can be made to the corresponding content in the first embodiment, the second embodiment, or the third embodiment.

[0093] In this embodiment, the IC radio frequency packaging structure 100 further includes a circuit board 150 disposed on the plastic package 140. A connection pad 151 is disposed on one side surface of the circuit board 150. The connection pad 151 is connected to the jumper arc 131 through solder balls. A planar antenna 160 is disposed on the other side surface of the circuit board 150. The planar antenna 160 is electrically connected to the connection pad 151. Specifically, the circuit board 150 has a wiring layer, which can realize an antenna stacked packaging structure.

[0094] It should be noted that other features of the IC radio frequency packaging structure 100 in this embodiment can refer to the relevant content in the first embodiment. That is to say, in this embodiment, the jumper arc 131 includes a first arched portion 133 and a second arched portion 135, and the jumper arc 131 is in an M shape. An arc-shaped groove 141 exposing the connection portion of the first arched portion 133 and the second arched portion 135 is further formed on the plastic package 140.

[0095] It should be noted that the preparation method of the planar antenna 160 in this embodiment is the same as that of a conventional printed antenna, and wire bonding is used to form a wire arc antenna 130 on the antenna pad 111 of the substrate 110 as the antenna feedback end (feeder end). At the same time, the circuit board 150 can mount an access point, such as a connection pad 151, on the bottom side surface of the circuit board 150, and then connect them through soldering, so as to realize the stacked structure of the planar antenna 160 and the wire arc antenna 130. The antenna gain function is realized, and at the same time, the product realizes the two-way antenna radio frequency function, where the wire arc antenna 130 is used as the transmitting antenna, and the planar antenna 160 can be used as the receiving antenna. Of course, both the wire arc antenna 130 and the planar antenna 160 can also be used as transmitting / receiving antennas. When they are used as transmitting / receiving antennas, the signal of the transmitting antenna can be adjusted by using the planar antenna 160 through the signal received by the wire arc antenna 130 as the receiving antenna. For example, when the signal received by the receiving antenna is weak, it adjusts and strengthens the signal of the transmitting antenna to achieve the gain effect.

[0096] In this embodiment, the circuit board 150 is arranged parallel to the substrate 110, and the spacing height between the circuit board 150 and the encapsulant 140 is greater than the height of the portion of the wire arc antenna 130 exposed from the encapsulant 140, thereby avoiding direct contact between the circuit board 150 and the wire arc antenna 130. Here, the circuit board 150 and the substrate 110 are electrically connected together through the connection wire arc 132, thereby realizing the electrical connection function of the entire device.

[0097] In this embodiment, a ground wire arc 137 is further provided on the substrate 110. The ground wire arc 137 is electrically connected to the substrate 110 and is partially exposed from the encapsulant 140. By providing the ground wire arc 137 and electrically connecting the ground wire arc 137 to the ground line on the substrate 110, grounding is achieved, thereby effectively eliminating the static electricity brought by the periphery of the encapsulant 140 and the circuit board 150, thereby achieving good static electricity control and avoiding the static electricity from affecting the normal operation of the device.

[0098] It should be noted that other features of the IC radio frequency structure here can also refer to the relevant content in the third embodiment. That is to say, the jumper wire arc 131 can also be in a semi-circular arc structure.

[0099] Fifth Embodiment

[0100] See Figure 6 , this embodiment provides an IC radio frequency packaging structure 100, whose basic structure, principle, and the resulting technical effects are the same as those of the fourth embodiment. For a brief description, for the parts not mentioned in this embodiment, reference can be made to the corresponding content in the fourth embodiment.

[0101] In this embodiment, a conduction opening 153 is further provided on the circuit board 150. The conduction opening 153 corresponds to the chip 120, so that the middle part of the jumper wire arc 131 corresponds to the conduction opening 153. Specifically, by providing the conduction opening 153, the direct exposure of the wire arc antenna 130 can be realized, thereby enhancing its ability to transmit or receive antenna signals.

[0102] In this embodiment, the width of the conduction opening 153 is smaller than the width of the chip 120 and is directly opposite to the chip 120. Of course, in other preferred embodiments of the present invention, the width of the conduction opening 153 can also be equivalent to the width of the exposed part of the wire arc antenna 130 relative to the encapsulant 140. The width of the conduction opening 153 is not specifically limited herein.

[0103] Sixth Embodiment

[0104] See Figure 7 , this embodiment provides an IC radio frequency packaging structure 100, whose basic structure, principle, and the resulting technical effects are the same as those of the fifth embodiment. For a brief description, for the parts not mentioned in this embodiment, reference can be made to the corresponding content in the fifth embodiment.

[0105] Furthermore, a Luneburg lens 170 is embedded in the conduction opening 153, and the Luneburg lens 170 is correspondingly arranged with the exposed part of the jumper arc 131. Specifically, the size of the Luneburg lens 170 is equivalent to that of the conduction opening 153, so as to ensure that the Luneburg lens 170 can be exactly embedded in the conduction opening 153. By setting the Luneburg lens 170, the antenna signal gain effect can be further realized and the antenna signal can be propagated in a specified direction.

[0106] A Luneburg lens is a dielectric sphere made of several layers of materials with different dielectric constants.

[0107] It should be noted that in this embodiment, the principle of the Luneburg lens 170 is utilized to realize the antenna signal gain effect and make the antenna signal propagate in a specified direction. The dielectric material of the Luneburg lens 170 can be determined according to needs, and the dielectric constants of the dielectric layers increase in sequence and show a gradient change. In this way, the Luneburg lens 170 can make the electromagnetic waves incident from any direction converge to a certain point on the spherical surface. Correspondingly, as long as a feed source is placed on the spherical surface, a good gain effect can be produced, the signal can be radiated in a specified direction, and the signal coming from a specified direction can also be received.

[0108] In this embodiment, the Luneburg lens 170 is a spherical lens. By setting the Luneburg lens 170, the gain of the bottom first arched part 133 and the second arched part 135 is enhanced, and the antenna signal is propagated in a specified direction, so as to realize the gain of the transmitting / receiving function of the wire arc antenna 130. It should be emphasized here that the receiving function of the wire arc antenna 130 can be realized. The planar antenna 160 is designed on the circuit board 150, and the planar antenna 160 can be a transmitting / receiving antenna, which is stacked on the wire arc antenna 130, so as to realize the dual-band antenna function of the product. The wire arc antenna 130 can be a high-frequency antenna, and the planar antenna 160 can be a low-frequency antenna, so as to realize the simultaneous operation of different band frequencies.

[0109] It is worth noting that in this embodiment, a ground wire arc 137 is also arranged on the substrate 110. The ground wire arc 137 is electrically connected to the substrate 110 and is partially exposed to the plastic package 140. By setting the ground wire arc 137 and electrically connecting the ground wire arc 137 to the ground circuit on the substrate 110, grounding is realized, and thus the static electricity brought by the plastic package 140, the circuit board 150 and the Luneburg lens 170 is effectively eliminated, so as to realize good static electricity control and avoid the static electricity from affecting the normal operation of the device.

[0110] It should be noted that due to its material and structural characteristics, the surface of the Luneburg lens 170 is prone to static electricity. The ground wire arc 137 is arranged at a relatively inner position, so it is closer to the Luneburg lens 170, which can effectively eliminate the static electricity on the surface of the Luneburg lens 170 and achieve good static electricity control.

[0111] The Seventh Embodiment

[0112] Refer to Figure 8 and Figure 9 , this embodiment provides an IC radio frequency packaging structure 100, whose basic structure, principle, and technical effects are the same as those of the first embodiment, the second embodiment, or the third embodiment. For the sake of brief description, for the parts not mentioned in this embodiment, reference can be made to the corresponding content in the first embodiment, the second embodiment, or the third embodiment.

[0113] In this embodiment, the IC radio frequency packaging structure 100 includes a substrate 110, a chip 120, a wire arc antenna 130, and a plastic package 140. The chip 120 is arranged on the substrate 110, the wire arc antenna 130 is arranged on the substrate 110 and spans both sides of the chip 120, and the plastic package 140 is arranged on the substrate 110 and covers the chip 120 and the wire arc antenna 130 outside; among them, the wire arc antenna 130 is formed by wire bonding and is electrically connected to the substrate 110, and the top end of the wire arc antenna 130 is exposed outside the plastic package 140 for transmitting or receiving signals.

[0114] In this embodiment, the wire arc antenna 130 includes a jumper wire arc 131 and a connecting wire arc 132. The jumper wire arc 131 spans both sides of the chip 120, and both ends of the jumper wire arc 131 are respectively connected to two corresponding antenna pads 111. The connecting wire arc 132 is arranged on one side of the chip 120, and both ends of the connecting wire arc 132 are respectively connected to two adjacent antenna wire arcs on one side of the chip 120. Among them, the top ends of the jumper wire arc 131 and the connecting wire arc 132 are both exposed outside the plastic package 140.

[0115] In this embodiment, the connecting wire arc 132 is in a horizontally arched shape, and the connecting wire arc 132 extends towards the side wall of the plastic package 140 and partially exposes the plastic package 140. Specifically, the connecting wire arc 132 partially extends out of the side wall of the plastic package 140, which can realize the antenna function from the side wall, further improving the transmitting / receiving direction and range of the antenna, thereby improving the applicability of the product.

[0116] In this embodiment, the connecting wire arc 132 being in a horizontally arched shape means that the connecting wire arc 132 arches partially towards the side wall of the plastic package 140, and the rest of the connection structure is the same as that of the first embodiment. During actual preparation, the connecting wire arc 132 can be extended to near the scribe lane, and after cutting, the connecting wire arc 132 on the side wall needs to be exposed by etching to form a side wall antenna.

[0117] It should be noted that the connecting wire arc 132 forms a sidewall antenna here, and the sidewall antenna can extend to the four sidewalls of the plastic package 140 respectively, so that both the jumper wire arc 131 and the connecting wire arc 132 form antenna structures, improving the applicability of the product.

[0118] As described above, it is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. An IC radio frequency packaging structure, characterized in that, it includes: a substrate; a chip disposed on the substrate; a wire arc antenna disposed on the substrate and spanning both sides of the chip; and, a plastic package disposed on the substrate and covering the chip and the wire arc antenna; wherein, the wire arc antenna is formed by wire bonding, is electrically connected to the substrate, and the top end of the wire arc antenna is exposed outside the plastic package for transmitting or receiving signals; a plurality of pairwise corresponding antenna pads are disposed on the substrate on both sides of the chip, the wire arc antenna is respectively connected to the plurality of antenna pads, and the projection trajectory of the wire arc antenna on the substrate is in a serpentine distribution.

2. The IC radio frequency packaging structure according to claim 1, characterized in that, the wire arc antenna includes a jumper wire arc and a connecting wire arc, the jumper wire arc spans both sides of the chip, and both ends of the jumper wire arc are respectively connected to two corresponding antenna pads, the connecting wire arc is disposed on one side of the chip, and both ends of the connecting wire arc are respectively connected to two adjacent antenna pads located on one side of the chip, wherein the top ends of the jumper wire arc and the connecting wire arc are both exposed outside the plastic package.

3. The IC radio frequency packaging structure according to claim 2, characterized in that, the jumper wire arc is in a semi-circular arch shape, and the vertex of the semi-circular arch is exposed outside the plastic package.

4. The IC radio frequency packaging structure according to claim 2, characterized in that, the jumper wire arc includes a first arch portion and a second arch portion which are integrally provided, the first arch portion and the second arch portion form an M-shaped structure, one end of the first arch portion is connected to the antenna pad located on one side of the chip, the other end of the first arch portion is located in the middle of the chip and is connected to the second arch portion, and the end of the second arch portion away from the first arch portion is connected to the antenna pad located on the other side of the chip, wherein the top ends of the first arch portion and the second arch portion are both exposed outside the plastic package.

5. The IC radio frequency packaging structure according to claim 4, characterized in that, an arc-shaped groove is further formed on the plastic package, the arc-shaped groove corresponds to the middle of the chip, and both ends of the arc-shaped groove respectively extend to the top ends of the first arch portion and the second arch portion, and the connection part of the first arch portion and the second arch portion is accommodated in the arc-shaped groove and is exposed outside the plastic package.

6. The IC radio frequency packaging structure according to any one of claims 2-4, characterized in that, the IC radio frequency packaging structure further includes a circuit board disposed on the plastic package, a connection pad is disposed on one side surface of the circuit board, the connection pad is connected to the jumper wire arc through a solder ball, a planar antenna is disposed on the other side surface of the circuit board, and the planar antenna is electrically connected to the connection pad.

7. The IC radio frequency packaging structure according to claim 6, characterized in that, a conduction opening is further formed on the circuit board, the conduction opening corresponds to the chip, so that the middle of the jumper wire arc corresponds to the conduction opening.

8. The IC radio frequency packaging structure according to claim 7, wherein, a Luneburg lens is embedded in the conduction opening, and the Luneburg lens is correspondingly arranged with the exposed part of the jumper arc.

9. The IC radio frequency packaging structure according to claim 8, wherein, the Luneburg lens is spherical.

10. The IC radio frequency packaging structure according to any one of claims 2-4, wherein, the connection line arc is in a horizontally arranged arched shape, and the connection line arc extends towards the side wall of the plastic package body and partially exposes the plastic package body.

11. The IC radio frequency packaging structure according to claim 1, wherein, a ground wire arc is further arranged on the substrate, the ground wire arc is electrically connected to the substrate and is partially exposed to the plastic package body.

12. A preparation method of an IC radio frequency packaging structure for preparing the IC radio frequency packaging structure according to any one of claims 1-11, wherein, it includes the following steps: providing a substrate attaching a chip on the substrate; forming a wire arc antenna on the substrate, and the wire arc antenna straddles both sides of the chip; forming a plastic package body on the substrate, and the plastic package body covers the chip and the wire arc antenna; wherein, the wire arc antenna is formed by wire bonding, is electrically connected to the substrate, and the top end of the wire arc antenna is exposed outside the plastic package body for transmitting or receiving signals.

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