Infrared temperature measuring device and control method thereof

Abstract

The application discloses an infrared temperature measuring device and a control method thereof, and relates to the technical field of temperature measuring devices.The infrared temperature measuring device comprises a detection assembly, a temperature control assembly and a control assembly.The detection assembly comprises a frame body and a temperature sensor arranged on the frame body, a temperature measuring space is formed between the frame body and a to-be-measured member, the temperature sensor collects the temperature of the to-be-measured member and outputs a temperature detection signal.The temperature control assembly comprises a placing disc and a first temperature adjusting member arranged on the placing disc, and is configured to place the to-be-measured member and adjust the temperature of the to-be-measured member.The control assembly is in control connection with the temperature control assembly and the detection assembly, and outputs a control signal to control the adjusting power of the first temperature adjusting member and the working state of the temperature sensor.The first temperature adjusting member arranged in the placing disc on which the to-be-measured member is placed can accurately simulate the to-be-measured member, i.e., the heat dissipation effect of the heat dissipation module on different heat bodies, so that the heat dissipation effect of the heat dissipation module on the heat bodies under different heat dissipation conditions can be accurately tested in the same test process, and the process is simple and convenient.

Description

Technical Field

[0001] This invention relates to the field of temperature measuring device technology, and more specifically, to an infrared temperature measuring device and its control method. Background Technology

[0002] Currently, in the military-grade heat dissipation module series, if it is necessary to test its heat dissipation effect, the heat dissipation module needs to be assembled into the equipment for testing. The disadvantages of this method are very obvious: it cannot simulate the actual heat dissipation effect of the heat dissipation module in various environments, and the testing process is lengthy and slow. Summary of the Invention

[0003] To address the problem that the testing process for heat dissipation modules in practical applications is lengthy and slow, and cannot simulate the working states of heat dissipation modules under various environments, the first objective of this application is to propose an infrared temperature measurement device. This device can accurately detect the heat dissipation effect of the heat dissipation module based on its heat dissipation characteristics and possible operating conditions, exhibiting strong adaptability and rapid, accurate detection. The second objective of this application is to provide a control method for the infrared temperature measurement device, the specific scheme of which is as follows:

[0004] An infrared temperature measuring device, comprising:

[0005] The detection component includes a frame and a temperature sensor mounted on the frame. A temperature measurement space is formed between the frame and the workpiece under test. The temperature sensor collects the temperature of the workpiece under test and outputs a temperature detection signal.

[0006] A temperature control assembly includes a placement tray and a first temperature regulating element disposed on the placement tray, configured to place the test piece and regulate the temperature of the test piece;

[0007] The control component is configured to be connected to the temperature control component and the detection component, and outputs control signals to control the adjustment power of the first temperature regulator and the working state of the temperature sensor.

[0008] The above technical solution utilizes a first temperature regulating component to simulate a heat-generating element requiring heat dissipation, such as a semiconductor block. By placing the device under test (DUT), i.e., the heat dissipation module, on a placement plate and then detecting temperature changes at various locations on both the heat dissipation module and the DUT, the heat changes of the DUT and the direction of heat dissipation within the heat dissipation module can be obtained in a timely manner throughout the entire test. This is of great significance for acquiring the heat dissipation characteristics of the heat dissipation module. Furthermore, the first temperature regulating component can be used to simulate different heat-generating elements, allowing for the determination of the heat dissipation effect of the heat dissipation module for different heat-generating elements within a short time, significantly improving testing efficiency.

[0009] Furthermore, the frame is configured as multiple frames, and a sealed heat insulation cover is provided between adjacent frames to form a sealed temperature measurement space.

[0010] The above technical solutions can isolate the external environment from the temperature measurement space and improve the accuracy of temperature measurement.

[0011] Furthermore, the temperature control component also includes a second temperature regulating element for adjusting the ambient temperature in the temperature measuring space;

[0012] The second temperature regulator is connected to the control component and receives and responds to the control signal of the control component to adjust the ambient temperature in the temperature measurement space.

[0013] By adjusting the temperature in the temperature measurement space, the performance of the heat dissipation module under different working conditions can be realistically simulated through the above technical solution, making the test results more accurate.

[0014] Furthermore, the infrared temperature measuring device also includes:

[0015] The airflow simulation component includes an air tube, an airflow nozzle, an airflow direction adjustment component, and an airflow power adjustment component;

[0016] The airflow direction adjustment component and the airflow power adjustment component are configured to be connected to the control component for control, receive and respond to the control signal of the control component, and adjust the airflow direction and airflow intensity in the temperature measurement space.

[0017] The above technical solutions can simulate the heat dissipation effect of the heat dissipation module in an environment with airflow disturbance, which helps to improve the accuracy of test results.

[0018] Furthermore, the first temperature regulating element includes:

[0019] The heating element is configured as a heating power output module and a heating block disposed on a placement plate, wherein the heating block contains a heating wire electrically connected to the heating power output module; and / or

[0020] The refrigeration component is configured as a refrigeration power output module and a cooling block disposed on a placement plate. The cooling block is made of thermally conductive material and has a circulating cooling pipe inside. The refrigeration power output module is configured as a refrigeration unit and a fluid pump connected to the circulating cooling pipe.

[0021] The above technical solution can simulate the heat dissipation effect of the heat dissipation module under different temperature conditions.

[0022] Furthermore, a rotation drive assembly for driving the placement tray to rotate is provided at the bottom of the placement tray;

[0023] The rotation drive component is connected to the control component and receives and responds to the control signal output by the control component to drive the placement disk to rotate.

[0024] The above technical solution not only facilitates the detection of temperature at various locations of the test piece by temperature sensors, but also allows for the acquisition of more temperature detection data using a limited number of temperature sensors.

[0025] Furthermore, the placement tray is detachably provided with a clamp for placing the test piece, the clamp being made of a thermally conductive material; or the first temperature regulating component is connected to a heat-conducting component for contacting the test piece.

[0026] The above technical solution enables the placement plate to fix different types of test devices and heat dissipation modules, making it more widely applicable.

[0027] Furthermore, at least one mounting slider is slidably disposed on the frame, and multiple temperature sensors are configured and respectively disposed on the mounting slider;

[0028] The detection component also includes a sliding drive for driving the mounting slider to move along the frame. The sliding drive is controlled by the control component and receives and responds to the control signal output by the control component.

[0029] The above technical solution allows for real-time adjustment of the temperature sensor's position as needed, making it suitable for testing different types of test pieces.

[0030] Furthermore, the infrared temperature measuring device also integrates:

[0031] The data processing component is configured to be connected to the detection component, receive the temperature detection signal, perform data processing based on a set algorithm, and output the processing result data.

[0032] The above technical solutions enable data acquisition and processing to be completed in one device, resulting in higher integration and greater ease of use.

[0033] Furthermore, the data processing component includes:

[0034] The data receiving unit is configured to be connected to the temperature sensor signal, receive the temperature detection signal, convert it into temperature detection data, and output it.

[0035] The data processing unit is equipped with a set data algorithm module and is connected to the data receiving unit and the data storage unit. It receives the temperature detection data and performs data processing based on the set algorithm module to generate the processing result data.

[0036] The data storage unit is configured to receive and store the temperature detection data and the processing result data;

[0037] The data output unit is configured to be connected to the data processing unit and the data storage unit, and outputs processing result data in response to external data request signals.

[0038] A method for controlling an infrared temperature measuring device, comprising:

[0039] Test procedures are set based on the type and heat dissipation characteristics of the device under test and stored in the control component;

[0040] Configure the mounting fixture according to the type of test piece and fix it together with the test piece on the placement tray;

[0041] The control component receives instruction information and reads and determines the type and heat dissipation characteristics of the device under test, and selects the test procedure;

[0042] Control one or more of the following states according to the selected test procedure: the position of each temperature sensor, the heating power of the heating component, the rotation speed of the placement plate, the frequency of data acquisition, the flow rate of the airflow, and the flow direction of the airflow.

[0043] It acquires and stores temperature detection data collected by temperature sensors and processes it based on a set algorithm to generate processing result data.

[0044] The above technical solutions can simulate the heat dissipation effect of the device under test, i.e., the heat dissipation module, in different environments for different heat-generating elements, which greatly expands the applicability of the temperature measuring device and improves the efficiency of the test.

[0045] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0046] (1) By setting a first temperature regulating component in the placement tray where the test piece is placed, the heat dissipation effect of the test piece, i.e. the heat dissipation module, on different heat-generating bodies can be accurately simulated. The heat dissipation effect of the heat dissipation module on the heat-generating body under different heat-generating conditions can be accurately tested in the same test process. The process is simple and fast.

[0047] (2) By setting a second temperature regulating component and an airflow simulation component, the heat dissipation effect of the test component under different working conditions can be accurately simulated and tested, making the test results more accurate.

[0048] (3) By setting multiple temperature sensors and a rotating drive to drive the placement disk to rotate, the temperature change data of each position of the test piece can be obtained as much as possible using a limited number of temperature sensors. This allows for accurate determination of the heat flow direction in the heat source and heat dissipation module during the test piece's operation. This not only improves the efficiency of the test but also provides reference data for the improvement of the heat dissipation module in the future. Attached Figure Description

[0049] Figure 1 This is a schematic diagram of the overall temperature measuring device of the present invention;

[0050] Figure 2 This is a schematic diagram of the functional modules of the temperature measuring device of the present invention;

[0051] Figure 3 This is a schematic diagram of the overall closed-loop temperature measuring device.

[0052] Figure 4 This is a schematic diagram of the disk rotation drive assembly placed in the temperature measuring device.

[0053] Reference numerals: 100, Detection component; 101, Frame; 102, Temperature sensor; 103, Temperature measurement space; 104, Test platform; 105, Heat insulation cover; 106, Transparent observation window; 200, Temperature control component; 210, First temperature regulator; 211, Heating element; 212, Heating block; 213, Programmable power supply; 214, Heating wire; 215, Cooling element; 216, Cooling block; 217, Circulating cooling pipe; 218, Fluid pump; 219, Placement tray; 220, Second temperature regulator; 300, Airflow simulation component; 301, Air pipe; 302, Airflow nozzle; 303, Airflow direction regulator; 304, Airflow power regulator; 400, Rotation drive component; 401, Transmission rod; 402, Reduction gear set; 403, Rotation drive motor; 500, Control component; 501, Operating platform. Detailed Implementation

[0054] Currently, heat dissipation modules are required in many applications to cool heat-generating components, such as integrated circuit boards and semiconductor blocks. To obtain the optimal design for the heat dissipation module, it is necessary to install it onto the corresponding heat-generating component and test its cooling performance. However, since there are many types of heat-generating components for heat dissipation modules, and the operating conditions vary, the actual testing process requires frequent removal and installation of the heat dissipation module from the heat-generating component. Furthermore, it is necessary to control the operation of the heat-generating component under different conditions, making the entire testing process lengthy, cumbersome, and inefficient. Therefore, this application proposes a new infrared temperature measurement device.

[0055] The present application will be further described in detail below with reference to the embodiments and accompanying drawings, but the implementation of the present application is not limited thereto.

[0056] like Figure 1 and Figure 2 As shown, an infrared temperature measuring device mainly includes a detection component 100, a temperature control component 200, and a control component 500.

[0057] The detection component 100 is mainly used to acquire the temperature data of the device under test, and in actual use, it can also monitor the temperature changes of the heating element. For example... Figure 1 As shown, the detection assembly 100 includes a frame 101 and a temperature sensor 102 mounted on the frame 101. A temperature measurement space 103 is formed between the frame 101 and the device under test. The temperature sensor 102 collects the temperature of the device under test and outputs a temperature detection signal.

[0058] The aforementioned frame 101 includes several horizontal and vertical frames, which are spliced ​​together to form a three-dimensional temperature measurement space 103. In this embodiment, the temperature measurement space 103 is cuboid in shape, containing four vertical frames and horizontal frames. The four vertical frames are fixedly installed on a test platform 104. Preferably, the frame 101 is an aluminum alloy cable tray with mounting grooves on its surface, which facilitates the installation of each temperature sensor 102. To avoid the thermal effect of the frame 101 itself affecting the temperature test, in a certain embodiment, the surface of the frame 101 is coated or provided with a heat insulation layer.

[0059] In this embodiment of the application, in order to achieve non-contact temperature measurement, the temperature sensor 102 is an infrared temperature sensor 102, which detects and outputs temperature detection signals.

[0060] To reduce the influence of the external environment on the temperature in the temperature measurement space 103, in the embodiments of this application, such as Figure 3 As shown, a sealed heat insulation cover 105 is arranged between multiple frame members 101 to form a sealed temperature measurement space 103. The heat insulation cover 105 is made of heat insulation material to isolate the heat exchange between the inside and outside environment of the cover. In order to facilitate the observation of the situation inside the heat insulation cover 105 during the test, a transparent observation window 106 is provided on the heat insulation cover 105.

[0061] For the aforementioned enclosed temperature measurement space 103, the temperature control assembly 200 also includes a second temperature regulating element 220 for adjusting the ambient temperature within the temperature measurement space 103. For example... Figure 2 As shown, the second temperature regulator 220 is connected to the control component 500 and receives and responds to the control signal from the control component 500 to adjust the ambient temperature in the temperature measuring space 103. In this embodiment, the second temperature regulator 220 is configured as an external miniaturized air conditioning device, which is used to regulate the temperature in the sealed temperature measuring space 103.

[0062] In practical applications, heat-generating elements, such as motor circuit boards, often operate in a certain airflow environment. If the heat dissipation performance of the corresponding heat dissipation module is tested only in a static airflow environment, it will obviously differ from the actual situation. Therefore, in order to more accurately simulate the working environment of the heat-generating element and improve the accuracy of the test, the infrared temperature measurement device also includes an airflow simulation component 300.

[0063] like Figure 2 As shown, the airflow simulation component 300 includes an air pipe 301, an airflow nozzle 302, an airflow direction adjuster 303, and an airflow power adjuster 304. The air pipe 301 is a flexible plastic tube, fixedly mounted on the frame 101 or test platform 104 using detachable fasteners to facilitate easy adjustment of the outlet position. The outlet end of the air pipe 301 is equipped with an airflow nozzle 302, and the airflow direction adjuster 303 can be configured as a guide vane located at the airflow nozzle 302. The airflow power adjuster 304 is configured as a fan. Both the fan and the guide vane are connected to the control component 500 and operate under the control signal of the control component 500, adjusting the airflow direction and intensity in the temperature measurement space 103.

[0064] In a specific embodiment, the airflow simulation component 300 can be reused with the aforementioned air conditioning device. That is, while adjusting the airflow direction and magnitude in the temperature measurement space 103, the temperature of the airflow can be changed. This can simulate the heat dissipation effect of the heat dissipation module in airflow disturbance environments at different temperatures, which helps to improve the accuracy of the test results.

[0065] like Figure 1 and Figure 2 As shown, the temperature control component 200 is mainly used to control the temperature of the heating element and the temperature of the test environment. The temperature control component 200 mainly includes a placement tray 219 and a first temperature regulating element 210 disposed on the placement tray 219, configured to place the test piece and regulate its temperature.

[0066] The aforementioned placement tray 219 is positioned on the test platform 104. The first temperature regulating component 210 is used to simulate the heat source corresponding to the device under test (DUT), providing heat sources at different temperatures. In practical applications, the first temperature regulating component 210 can be configured as a heating component 211 and / or a cooling component 215. It is understood that the heating component 211 simulates the heat source to be dissipated, while the cooling component 215 simulates the heat transfer data on the DUT at low temperatures, for example, whether the heat dissipation module will transfer heat from the environment to the heat source when the ambient temperature is higher than that of the heat source.

[0067] In detail, the heating element 211 is configured as a heating power output module and a heating block 212 disposed on the placement tray 219. The heating block 212 is detachably disposed on the placement tray 219. The heating block 212 contains a heating wire 214 electrically connected to the heating power output module. The heating block 212 is made of a thermally conductive material, such as thermally conductive aluminum alloy, or it can be made directly from the material used in the actual application. If it is necessary to test the heat dissipation effect of the heat dissipation module on the PCB circuit board, the surface of the heating block 212 can be configured with the same material as the PCB circuit board.

[0068] In this embodiment of the application, the heating power output module can be selected as a programmable power supply 213. The output power of the programmable power supply 213 can be adjusted by the control signal output by the control component 500, thereby changing the heat generation effect of the heating element 211.

[0069] In detail, the cooling component 215 is configured as a cooling power output module and a cooling block 216 disposed on the placement tray 219. The cooling block 216 is made of thermally conductive material and has an internal circulating cooling pipe 217. The cooling power output module is configured as a refrigerator and a fluid pump 218 connected to the circulating cooling pipe 217. The cooling block 216 can be made of aluminum alloy and has multiple fluid channels inside. The circulating cooling pipe 217 is made of rubber hose, with one end connected to the cooling block 216 and the other end connected to the refrigerator and the fluid pump 218. In practical applications, the fluid pump 218 can be a peristaltic pump. The fluid pump 218 and the refrigerator are both connected to the control component 500 and receive and respond to the control signals output by the control component 500 to adjust the temperature of the cooling block 216.

[0070] During the temperature measurement process, since the temperature of each position of the test piece is not the same, more temperature sensors 102 need to be set in order to obtain temperature data of each position. In order to use a limited number of temperature sensors 102 to collect temperature data of more positions, in one embodiment, the bottom of the placement plate 219 is provided with a rotation drive component 400 for driving the placement plate 219 to rotate.

[0071] The aforementioned rotation drive assembly 400 is disposed below the test platform 104, as follows: Figure 4As shown, the system specifically includes a transmission rod 401, a reduction gear set 402, and a rotation drive motor 403. The transmission rod 401 is coaxially mounted on the bottom of the rotating disk and rotatably connected to the test platform 104 via bearings. A gear is mounted on the end of the transmission rod 401 away from the placement disk 219, and this gear is connected to the rotation drive motor 403 via the reduction gear set 402. In a specific embodiment, a chain drive can also be used between the transmission rod 401 and the rotation drive motor 403. The rotation drive motor 403 is a servo motor and is controlled by the control component 500, receiving and responding to the control signals output by the control component 500 to drive the placement disk 219 to rotate. Based on the above technical solution, it is not only beneficial for the temperature sensor 102 to detect the temperature at various locations of the test piece, but also allows for the acquisition of more temperature detection data using a limited number of temperature sensors 102.

[0072] In another embodiment, at least one mounting slider is slidably disposed on the frame 101, and multiple temperature sensors 102 are configured and respectively disposed on the mounting slider. The detection assembly 100 also includes a sliding drive for driving the mounting slider to move along the frame 101. The sliding drive is controlled and connected to the control assembly 500, and receives and responds to the control signal output by the control assembly 500. In this embodiment, the sliding drive includes a lead screw drive assembly disposed on the frame 101. The mounting slider is disposed on the lead screw, and the end of the lead screw is driven by a servo motor. The servo motor is controlled and connected to the control assembly 500, thereby allowing precise adjustment and change of the position of each temperature sensor 102. Based on the above technical solution, the position of the temperature sensor 102 can be adjusted in real time as needed, which is suitable for testing different types of test pieces.

[0073] To ensure the device under test (DUT) can be stably placed on the placement tray 219, a detachable clamp for placing the DUT is provided on the placement tray 219. The clamp is adapted to the shape and size of the DUT. The clamp is made of a thermally conductive material, or a heat-conducting element is connected to the first temperature regulating component 210 for contact with the DUT, so that the heat or cold output from the first temperature regulating component 210 can be accurately transferred to the DUT. This also allows the placement tray 219 to hold different types of DUTs and heat dissipation modules, thus broadening its applicability.

[0074] In this embodiment, the control component 500 is configured as a microcontroller or FPGA control module, which is located below the test platform 104 and electrically connected to each functional component via data cables. Additionally, for ease of control, an operation platform 501 for manipulating each functional component is provided on the side of the test platform 104.

[0075] In order to make the entire infrared temperature measuring device more compact, in this embodiment of the application, the infrared temperature measuring device also integrates a data processing component, which is configured to be connected to the detection component 100 for data connection, receive temperature detection signals and perform data processing based on a set algorithm, and output the processing result data.

[0076] In further detail, the aforementioned data processing components include: a data receiving unit, a data processing unit, a data storage unit, and a data output unit. The data receiving unit is configured to connect to the temperature sensor 102, receive the temperature detection signal, convert it into temperature detection data, and output it. The data processing unit is equipped with a predefined data algorithm module, connected to the data receiving unit and the data storage unit, receives the temperature detection data, processes the data based on the predefined algorithm module, and generates processed result data. The data storage unit is configured to receive and store the temperature detection data and the processed result data. The data output unit is configured to connect to the data processing unit and the data storage unit, and outputs the processed result data in response to external data request signals. Since each of these functional units can be implemented using existing technologies, such as a microcontroller control module, their specific working principles and configurations will not be elaborated upon here. Based on the above technical solution, data acquisition and processing can be completed in a single device, resulting in higher integration and greater ease of use.

[0077] The beneficial effects of the technical solution in this application are as follows:

[0078] The first temperature regulator 210 simulates a heat-generating element requiring heat dissipation, such as a semiconductor block. By placing the device under test (DUT), i.e., the heat dissipation module, on the placement plate 219 and then detecting the temperature changes at various locations on both the heat dissipation module and the DUT, the heat changes of the DUT and the direction of heat dissipation within the heat dissipation module can be obtained in a timely manner throughout the test. This is of great significance for acquiring the heat dissipation characteristics of the heat dissipation module. Simultaneously, the second temperature regulator 220 and an airflow simulation assembly can be used to simulate different operating conditions. This allows for the rapid acquisition of the heat dissipation effect of the heat dissipation module under different usage conditions, greatly improving the efficiency and accuracy of the test.

[0079] Regarding the aforementioned infrared temperature measuring device control device, this application also proposes an infrared temperature measuring device control method, comprising the following main steps:

[0080] S1, Set the test procedure based on the type and heat dissipation characteristics of the device under test and store it in the control component 500;

[0081] S2, Configure the mounting fixture according to the type of the test piece and fix it together with the test piece on the placement tray 219;

[0082] S3, the control component 500 receives instruction information and reads and determines the type and heat dissipation characteristics of the device under test, and selects the test procedure;

[0083] S4, according to the selected test procedure, control one or more of the following states: the position of each temperature sensor 102, the heating power of the heating component, the rotation speed of the placement plate 219, the frequency of data acquisition, the flow rate of the airflow, and the flow direction of the airflow.

[0084] S5: Acquire and store the temperature detection data collected by the temperature sensor 102 and process it based on the set algorithm to generate the processing result data.

[0085] It should be noted that the above steps do not necessarily have to be performed in numerical order; the numerical order here is only for illustrative purposes.

[0086] In step S1 above, the heat dissipation characteristics of the device under test, i.e., the heat dissipation module, refer to the heat dissipation effect that various types of heat dissipation modules can achieve for specific or different heat-generating objects, such as the surface temperature of the heat dissipation module and the direction of heat conduction. Therefore, different devices under test will correspond to different test procedures. These procedures can be converted into test specifications, similar to a computer program stored in the control component 500, for example, in a RAM memory chip connected to the microcontroller control module.

[0087] In step S3 above, the user only needs to input the information of the test piece into the control component 500 through the operating table 501, and the control component 500 will automatically match and retrieve the corresponding test procedure to start the test.

[0088] In step S4, depending on the type of test piece, parameters such as the temperature of the test environment and the temperature of the heating element will be controlled to more accurately simulate the real working environment.

[0089] Compared with existing technical solutions, the above method can simulate the heat dissipation effect of the test component, i.e., the heat dissipation module, under different working conditions, for different heat-generating elements, which greatly expands the applicability of the temperature measuring device and improves the efficiency of the test.

[0090] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions falling within the scope of the present invention's concept are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. An infrared temperature measuring device, characterized in that The application relates to an infrared temperature measuring device. The device comprises a detection assembly (100) and a temperature control assembly (200). The detection assembly (100) comprises a frame body (101) and a temperature sensor (102) arranged on the frame body (101). The temperature sensor (102) is arranged in a temperature measuring space (103) formed between the frame body (101) and a to-be-measured object. The temperature sensor (102) collects the temperature of the to-be-measured object and outputs a temperature detection signal. The temperature control assembly (200) comprises a placing disc (219) and a first temperature adjusting element (210) arranged on the placing disc (219). The first temperature adjusting element (210) is configured to place the to-be-measured object and adjust the temperature of the to-be-measured object. A control assembly (500) is configured to be in control connection with the temperature control assembly (200) and the detection assembly (100). The control assembly (500) outputs a control signal to control the adjusting power of the first temperature adjusting element (210) and the working state of the temperature sensor (102). The frame body (101) is arranged in multiple and adjacent frame bodies (101). Airtight heat insulation covers (105) are arranged between the adjacent frame bodies (101) to form an airtight temperature measuring space (103). The temperature control assembly (200) further comprises a second temperature adjusting element (220) for adjusting the ambient temperature in the temperature measuring space (103). The second temperature adjusting element (220) is in control connection with the control assembly (500) and adjusts the ambient temperature in the temperature measuring space (103) in response to the control signal of the control assembly (500). The second temperature adjusting element (220) is configured as an external small-sized air conditioner. The infrared temperature measuring device further comprises an air flow simulation assembly (300). The air flow simulation assembly (300) comprises an air pipe (301), an air flow nozzle (302), an air flow direction adjusting element (303) and an air flow power adjusting element (304). The air flow direction adjusting element (303) and the air flow power adjusting element (304) are in control connection with the control assembly (500) and adjust the air flow direction and the air flow intensity in the temperature measuring space (103) in response to the control signal of the control assembly (500). The first temperature adjusting element (210) comprises a heating element (211) and / or a refrigeration element (215). The heating element (211) comprises a heating power output module and a heating block (212) arranged on the placing disc (219). The heating block (212) is internally provided with an electric heating wire (214) in electrical connection with the heating power output module. The refrigeration element (215) comprises a refrigeration power output module and a cooling block (216) arranged on the placing disc (219). The cooling block (216) is made of a heat-conducting material and is internally provided with a circulating cooling pipe (217). The refrigeration power output module is configured as a refrigeration machine and a fluid pump (218) in communication with the circulating cooling pipe (217). The bottom of the placing disc (219) is provided with a rotating driving assembly (400) for driving the rotating of the placing disc (219); the rotating driving assembly (400) is in control connection with the control assembly (500), receives and responds to the control signal output by the control assembly (500) to drive the rotating of the placing disc (219); at least one mounting sliding block is slidably arranged on the frame body (101), and the temperature sensor (102) is configured as a plurality of temperature sensors and is arranged on the mounting sliding block respectively; the detection assembly (100) further comprises a sliding driving member for driving the mounting sliding block to move along the frame body (101), and the sliding driving member is in control connection with the control assembly (500) and receives and responds to the control signal output by the control assembly (500) to move. A clamp for placing the to-be-tested member is detachably arranged on the placing disc (219), and the clamp is made of a heat-conducting material; or a heat-conducting member for contacting the to-be-tested member is connected to the first temperature adjusting member (210).

2. The infrared temperature measurement device of claim 1, wherein The infrared temperature measuring device further integrates: A data processing assembly configured to be in data connection with the detection assembly (100), receive the temperature detection signal and perform data processing based on a set algorithm, and output processed result data.

3. An infrared temperature measuring device control method based on the infrared temperature measuring device according to any one of claims 1 to 2, characterized by, The infrared temperature measuring device further integrates: A data processing assembly configured to be in data connection with the detection assembly (100), receive the temperature detection signal and perform data processing based on a set algorithm, and output processed result data. The infrared temperature measuring device further integrates: A data processing assembly configured to be in data connection with the detection assembly (100), receive the temperature detection signal and perform data processing based on a set algorithm, and output processed result data. The infrared temperature measuring device further integrates: A data processing assembly configured to be in data connection with the detection assembly (100), receive the temperature detection signal and perform data processing based on a set algorithm, and output processed result data. The infrared temperature measuring device further integrates: A data processing assembly configured to be in data connection with the detection assembly (100), receive the temperature detection signal and perform data processing based on a set algorithm, and output processed result data.

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