Tooling for microwave module testing and manufacturing method thereof

Abstract

The invention discloses a test tool for microwave modules, comprising a shell, a microwave board is provided in the middle of the front of the shell, a plurality of grooves for placing microwave module products to be tested are arranged in an array on the upper and lower parts of the microwave board, a power board is provided on the back of the shell, and first and second DB9 connectors, first, second and third SMA connectors are provided on the side; wherein, a plurality of power-dividing resistor 100 ohm components are provided on the microwave board, a plurality of components and a plurality of jack metal guide pillars are provided on the power board, and the jack metal guide pillars are used to connect the insulator of the microwave module product to be tested with the power board to achieve electrical intercommunication; the first DB9 connector and the second DB9 connector are respectively connected to the power board through wires, the first SMA connector and the second SMA connector are connected to the power board, and the third SMA connector is connected to the microwave board. The test tool can quickly realize the one-time screening and acceptance test process of multiple products, greatly improving the test production efficiency and achieving twice the result with half the effort.

Description

Technical Field

[0001] The present invention relates to the technical field of microwave modules, and in particular to a microwave module test tool and a manufacturing method thereof. Background Art

[0002] In recent years, microwave modules have been widely used in radar, electronic countermeasures, radio and television and other fields. After assembly, almost all microwave modules need to be screened and accepted before delivery. Screening and acceptance tests are necessary processes to ensure product reliability.

[0003] However, there is currently no effective tooling to meet production needs for mass-produced product testing, resulting in low test production efficiency and time-consuming and labor-intensive testing.

[0004] Therefore, it is particularly important to design a scientific and reasonable test tooling. Summary of the invention

[0005] The purpose of the present invention is to provide a test tool for microwave modules, which can quickly realize the screening and acceptance test process of multiple products at one time, greatly improving the test production efficiency and achieving twice the result with half the effort.

[0006] Another object of the present invention is to provide a manufacturing method, by which the microwave module test tooling manufactured has excellent quality and long service life, and can meet the requirements of long-term, multiple, and one-time testing of multiple products.

[0007] In order to achieve the above-mentioned object, the present invention provides a test fixture for a microwave module, the test fixture comprises a shell, a microwave board is provided in the middle of the front of the shell, a plurality of grooves for placing microwave module products to be tested are arranged in an array on the upper and lower sides of the microwave board, a power board is provided on the back of the shell, and a first DB9 connector, a second DB9 connector, a first SMA connector, a second SMA connector and a third SMA connector are provided on the side; wherein,

[0008] The microwave board is provided with multiple power-dividing resistors of 100 ohm components, and the power board is provided with multiple components and multiple jack metal guide pillars. The jack metal guide pillars are used to connect the insulator of the microwave module product to be tested with the power board to achieve electrical interconnection;

[0009] The first DB9 connector and the second DB9 connector are respectively connected to the power board through wires, the first SMA connector and the second SMA connector are connected to the power board, and the third SMA connector is connected to the microwave board.

[0010] Preferably, the shape of the groove is consistent with the shape of the microwave module product to be tested.

[0011] Preferably, the multiple components on the power board include multiple integrated blocks U, capacitors C and resistors R.

[0012] The present invention also provides a method for manufacturing the above-mentioned tooling for microwave module testing, the method comprising:

[0013] Step 1: Make and process circuit boards and structural parts;

[0014] Step 2: Solder components;

[0015] Step 3: Bonding the circuit board;

[0016] Step 4: Install the circuit board and connector;

[0017] Step 5: Solder the wires.

[0018] Preferably, in step 1, a shell is made according to the drawings, and the material is LY12; a power board is made according to the drawings, and the material is FR-4; a microwave board is made according to the drawings, and the material is FR-4, and the back of the microwave board is metallized and grounded.

[0019] Preferably, step 2 comprises:

[0020] Step 2.1, print OM338 solder paste on the power board through the silk screen, then mount the components U1-U6, C1-C24, R1-R6 on the corresponding pads, and then place them on a hot plate at a temperature of 250° C. for sintering; use an electric soldering iron to melt the Sn96.5Ag3Cu0.5 solder wire to solder the inner hole of the metal guide column of the jack downward on the power board (2), and obtain the test tooling power board assembly;

[0021] Step 2.2: Use the silk screen to print OM338 solder paste on the microwave board, mount components R7 to R13 on the corresponding pads, and then place it on a hot plate at a temperature of 250°C for sintering to obtain a test fixture microwave board assembly.

[0022] Preferably, in step 3, the conductive glue H20E is printed on the back of the test fixture microwave board assembly by a silk screen, and then the test fixture microwave board assembly is installed on the shell and pressed with tweezers to make the test fixture microwave board assembly fit tightly and flat with the shell, and then placed in an oven at a temperature of 150°C to cure the conductive glue for half an hour.

[0023] Preferably, in step 4, the test fixture power board assembly, the first DB9 connector, the second DB9 connector, the first SMA connector, the second SMA connector, and the third SMA connector are fixed to the housing by screws.

[0024] Preferably, in step 5, use an electric soldering iron to melt the solder wire, and solder the inner cores a to i of the first DB9 connector to the pads VCC1 to VCC8 and GND on the power board with wires, and the connection method is: a-VCC1, b-VCC2, c-VCC3, d-VCC4, e-GND, f-VCC5, g-VCC6, h-VCC7 and i-VCC8; use an electric soldering iron to melt the solder wire, and solder the inner cores a to i of the second DB9 connector to the pads A of the power board. LM1~ALM8 and GND are soldered together with wires, and the connection method is: a-ALM1, b-ALM2, c-ALM3, d-ALM4, e-GND, f-ALM5, g-ALM6, h-ALM7 and i-ALM8; use an electric soldering iron to melt the solder wire and solder the first SMA connector, the second SMA connector and the power board together; use an electric soldering iron to melt the solder wire and solder the third SMA connector and the microwave board together.

[0025] According to the above technical solution, the present invention provides grooves for placing products in an array on the test tooling, which plays a role in fixing the products. At the same time, heat can be quickly transferred to the base for easy heat dissipation. In addition, the tooling is quick and convenient to use, and the product can be quickly and conveniently installed on the test tooling.

[0026] Other features and advantages of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention but do not constitute a limitation of the present invention. In the accompanying drawings:

[0028] Figure 1 It is a front structural schematic diagram of a microwave module test tool provided by the present invention;

[0029] Figure 2 It is a schematic diagram of the back structure of the microwave module test tooling provided by the present invention;

[0030] Figure 3 It is a side structural schematic diagram of a microwave module test tool provided by the present invention;

[0031] Figure 4 This is a usage status diagram of the microwave module test tooling provided by the present invention.

[0032] Description of Reference Numerals

[0033] 1- Shell 2- Power board

[0034] 3- Microwave board 4- First DB9 connector

[0035] 5- Second DB9 connector 6- First SMA connector

[0036] 7- Second SMA connector 8- Third SMA connector

[0037] 9- Microwave module product to be tested 10- Groove

[0038] 11-Jack Metal Guide Pillar DETAILED DESCRIPTION

[0039] The specific implementation of the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the present invention, and is not used to limit the present invention.

[0040] In the present invention, unless otherwise stated, directional words such as "upper, lower, front, back" contained in the terms merely represent the orientation of the terms in normal usage, or are common names understood by those skilled in the art, and should not be regarded as limitations on the terms.

[0041] See also Figures 1 to 4 The present invention provides a test tool for a microwave module, the test tool comprises a shell 1, a microwave board 3 is provided in the middle of the front of the shell 1, a plurality of grooves 10 for placing a microwave module product 9 to be tested are arranged in an array above and below the microwave board 3, a power board 2 is provided on the back of the shell 1, and a first DB9 connector 4, a second DB9 connector 5, a first SMA connector 6, a second SMA connector 7 and a third SMA connector 8 are provided on the side; wherein,

[0042] The microwave board 3 is provided with a plurality of power-dividing resistor components of 100 ohms, and the power board 2 is provided with a plurality of components and a plurality of jack metal guide pillars 11, and the jack metal guide pillars 11 are used to connect the insulator of the microwave module product 9 to be tested with the power board 2 to achieve electrical intercommunication;

[0043] The first DB9 connector 4 and the second DB9 connector 5 are respectively connected to the power board 2 through wires, the first SMA connector 6 and the second SMA connector 7 are connected to the power board 2 , and the third SMA connector 8 is connected to the microwave board 3 .

[0044] Through the above technical solution, grooves 10 for placing products are provided in an array on the test tooling to fix the products. At the same time, heat can be quickly transferred to the base to facilitate heat dissipation. In addition, the tooling is quick and convenient to use, and the product can be quickly and conveniently installed on the test tooling.

[0045] In this embodiment, in order to make the microwave module product 9 to be tested perfectly match with the groove 10, facilitate the placement and testing of the microwave module product 9 to be tested, and avoid slight displacement during the placement and testing process from affecting the accuracy of the test results, preferably, the shape of the groove 10 is consistent with the shape of the microwave module product 9 to be tested.

[0046] The multiple components on the power board 2 include multiple integrated blocks U, capacitors C and resistors R.

[0047] In addition, the present invention also provides a method for manufacturing the above-mentioned tooling for microwave module testing, the method comprising:

[0048] Step 1: Make and process circuit boards and structural parts;

[0049] Step 2: Solder components;

[0050] Step 3: Bonding the circuit board;

[0051] Step 4: Install the circuit board and connector;

[0052] Step 5: Solder the wires.

[0053] Specifically, in step 1, a shell 1 is manufactured according to the drawings, and the base material is LY12; a power board 2 is manufactured according to the drawings, and the material is FR-4; a microwave board 3 is manufactured according to the drawings, and the material is FR-4, and the back of the microwave board 3 is metallized and grounded.

[0054] Step 2 includes:

[0055] Step 2.1, print OM338 solder paste on the power board 2 through a silk screen, then mount components U1-U6, C1-C24, R1-R6 on corresponding pads, and then place them on a hot plate at a temperature of 250° C. for sintering; use an electric soldering iron to melt the Sn96.5Ag3Cu0.5 solder wire to solder the inner hole opening end of the jack metal guide column 11 downward on the power board (2), and obtain a test fixture power board assembly;

[0056] Step 2.2: Use the silk screen to print OM338 solder paste on the microwave board 3, then mount the components R7 to R13 on the corresponding pads, and then place them on a hot plate at a temperature of 250°C for sintering to obtain a test fixture microwave board assembly.

[0057] In step 3, the conductive glue H20E is printed on the back of the test fixture microwave board assembly through a silk screen, and then the test fixture microwave board assembly is installed on the shell 1 and pressed with tweezers to make the test fixture microwave board assembly fit tightly and flat with the shell 1, and then placed in an oven at a temperature of 150°C to cure the conductive glue for half an hour.

[0058] In step 4, the test fixture power board assembly, the first DB9 connector 4, the second DB9 connector 5, the first SMA connector 6, the second SMA connector 7, and the third SMA connector 8 are fixed to the housing 1 by screws.

[0059] In step 5, use a soldering iron to melt the solder wire and solder the inner cores a to i of the first DB9 connector 4 to the pads VCC1 to VCC8 and GND of the power board 2 with wires. The connection method is: a-VCC1, b-VCC2, c-VCC3, d-VCC4, e-GND, f-VCC5, g-VCC6, h-VCC7 and i-VCC8; use a soldering iron to melt the solder wire and solder the inner cores a to i of the second DB9 connector 5 to the pads ALM1 to ALM8 and GND of the power board 2. D are welded together with wires, and the connection method is: a-ALM1, b-ALM2, c-ALM3, d-ALM4, e–GND, f-ALM5, g-ALM6, h-ALM7 and i-ALM8; use an electric soldering iron to melt the solder wire and solder the first SMA connector 6, the second SMA connector 7 and the overlapping part of the power board 2 with solder; use an electric soldering iron to melt the solder wire and solder the third SMA connector 8 and the overlapping part of the microwave board 3 with solder. At this point, the production of the microwave module test tooling is completed.

[0060] The test fixture made by this method can quickly realize the one-time screening and acceptance test process of multiple products, replacing the previous single product test, greatly improving the test production efficiency. The test fixture has grooves for placing products in an array, which plays a role in fixing the products and can quickly conduct heat to the base for heat dissipation. In addition, the fixture is easy to use, and the product can be quickly and easily installed on the test fixture.

[0061] On the whole, the tooling design is scientific, reasonable and practical, and the manufacturing method is simple. Testing using the test tooling manufactured using this method can greatly save test time and provide a strong guarantee for product batch testing.

[0062] The preferred embodiments of the present invention are described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, a variety of simple modifications can be made to the technical solution of the present invention, and these simple modifications all belong to the protection scope of the present invention.

[0063] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations.

[0064] In addition, various embodiments of the present invention may be arbitrarily combined, and as long as they do not violate the concept of the present invention, they should also be regarded as the contents disclosed by the present invention.

Claims

1. A method for making a microwave module test tool, characterized in that: The microwave module test tool comprises a housing (1), a microwave board (3) is provided in the middle of the front of the housing (1), a plurality of grooves (10) for placing microwave module products (9) to be tested are arranged in an array above and below the microwave board (3), a power board (2) is provided on the back of the housing (1), and a first DB9 connector (4), a second DB9 connector (5), a first SMA connector (6), a second SMA connector (7) and a third SMA connector (8) are provided on the side; wherein: The microwave board (3) is provided with a plurality of power dividing resistors, the power board (2) is provided with a plurality of components and a plurality of jack metal guide pillars (11), and the jack metal guide pillars (11) are used to connect the insulator of the microwave module product (9) to be tested with the power board (2) to achieve electrical interconnection; The first DB9 connector (4) and the second DB9 connector (5) are respectively connected to the power board (2) through wires, the first SMA connector (6) and the second SMA connector (7) are connected to the power board (2), and the third SMA connector (8) is connected to the microwave board (3); The shape of the groove (10) is consistent with the shape of the microwave module product (9) to be tested; The multiple components on the power board (2) include multiple integrated blocks U, capacitors C and resistors R; The method comprises: Step 1: Make and process circuit boards and structural parts; Step 2: Solder components; Step 3: Bonding the circuit board; Step 4: Install the circuit board and connector; Step 5: welding the wires; wherein: In step 1, a housing (1) is manufactured according to the drawings, and the material is LY12; a power board (2) is manufactured according to the drawings, and the material is FR-4; a microwave board (3) is manufactured according to the drawings, and the material is FR-4, and the back of the microwave board (3) is metallized and grounded; Step 2 includes: Step 2.1, using a silk screen to print OM338 solder paste on the power board (2), and then mounting components U1-U6, C1-C24, R1-R6 on corresponding pads, and then sintering on a hot plate at a temperature of 250° C.; using an electric soldering iron to melt the Sn96.5Ag3Cu0.5 solder wire, solder the inner hole opening end of the jack metal guide column (11) downward on the power board (2), and obtain a test fixture power board assembly; Step 2.2, OM338 solder paste is leak-printed on the microwave board (3) through a silk screen, and components R7 to R13 are mounted on corresponding pads, and then placed on a hot plate at a temperature of 250° C. for sintering to obtain a test fixture microwave board assembly; In step 3, conductive adhesive H20E is printed on the back of the test fixture microwave board assembly by means of a silk screen, and then the test fixture microwave board assembly is mounted on the housing (1), and pressed with tweezers to make the test fixture microwave board assembly and the housing (1) fit tightly and flat, and then placed in an oven at a temperature of 150° C. to cure the conductive adhesive for half an hour; In step 4, the test fixture power board assembly, the first DB9 connector (4), the second DB9 connector (5), the first SMA connector (6), the second SMA connector (7), and the third SMA connector (8) are fixed to the housing (1) by screws; In step 5, use a soldering iron to melt the solder wire and solder the inner cores a to i of the first DB9 connector (4) to the pads VCC1 to VCC8 and GND of the power board (2) with wires, and the connection method is: a-VCC1, b-VCC2, c-VCC3, d-VCC4, e-GND, f-VCC5, g-VCC6, h-VCC7 and i-VCC8; use a soldering iron to melt the solder wire and solder the inner cores a to i of the second DB9 connector (5) to the pad ALM1 of the power board (2). ~ALM8 and GND are welded together with wires, and the connection method is: a-ALM1, b-ALM2, c-ALM3, d-ALM4, e-GND, f-ALM5, g-ALM6, h-ALM7 and i-ALM8; use an electric soldering iron to melt the solder wire and solder the overlapping parts of the first SMA connector (6), the second SMA connector (7) and the power board (2); use an electric soldering iron to melt the solder wire and solder the overlapping parts of the third SMA connector (8) and the microwave board (3).

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