Transfer of a radio frequency identification inlay from a first substrate to a second substrate

Abstract

Systems and methods for transferring a radio frequency identification (RFID) inlay from a first substrate to a second substrate are provided. The RFID inlay is secured to the first substrate with a first adhesive. The RFID inlay is brought into proximity with the second substrate and secured to the second substrate with a second adhesive. The RFID inlay is then separated from the first substrate. The RFID inlay can be separated from the first substrate by softening the first adhesive, such as by applying heat or applying a softening substance. Alternatively, the RFID inlay can be separated from the first substrate without softening the first adhesive, but by differential release, whereby a release force is applied between the two substrates, wherein the release force is greater than the release strength of the first adhesive but less than the release strength of the second adhesive.

Description

[0001] Cross-referencing of related patent applications

[0002] This application claims the benefit of U.S. Provisional Patent Application No. 62 / 975,398, filed February 12, 2020, which is incorporated herein by reference in its entirety. Technical Field

[0003] This invention relates to radio frequency identification (RFID) devices. More specifically, it relates to systems and methods for transferring an RFID inlay from one substrate to another. Background Technology

[0004] RFID tags and markings (collectively referred to herein as "devices") are widely used to associate objects with identification codes. RFID devices typically include antennas and analog and / or digital electronic equipment, which may include, for example, communication electronics, data storage, and control logic. RFID devices can be used in a variety of applications, such as vehicle security locks, building access control, and inventory and package tracking.

[0005] One challenge associated with RFID devices is attaching functional components (i.e., the RFID chip and associated antenna) or “RFID inlays” to certain materials (such as ultra-soft fabrics, very thin materials, or heterogeneous / unconventional materials) using conventional techniques. Providing methods for attaching RFID inlays to such materials would be advantageous, especially if such methods also allow for reduced manufacturing costs and promote sustainability (i.e., reuse of selected materials used in the manufacturing process). Summary of the Invention

[0006] Several aspects of the subject matter of this invention can be implemented individually or together in the apparatuses and systems described and claimed below. These aspects can be used alone or in combination with other aspects of the subject matter described herein, and the common description of these aspects is not intended to exclude their use alone or in different combinations that may be elucidated in the appended claims.

[0007] This document describes a method for transferring an RFID inlay. In some embodiments, the RFID inlay includes a chip electrically coupled to an antenna. The chip can be electrically coupled to the antenna using techniques known in the art. In some embodiments, the chip is conductively attached to the antenna using a conductive adhesive. In some embodiments, the chip can be attached using a "direct attachment" process or a "strip attachment" process. In some embodiments, the antenna can be formed of materials known in the art. In some embodiments, the antenna is formed of a metal or a metallic material such as aluminum, copper, or nickel. In some embodiments, the metallic material is a metal foil. In other embodiments, the antenna is formed using conductive ink.

[0008] In some embodiments, the method includes attaching an RFID inlay to a first substrate. In some embodiments, the first substrate is a conventional material, such as a polymer (e.g., PET (polyethylene terephthalate)), a cellulose-based material (e.g., paper), textiles, fabrics, knitwear, etc. In some embodiments, the inlay can be attached using techniques known in the art. In some embodiments, an adhesive is used to attach the inlay to the substrate. In some embodiments, the adhesive is applied in any desired pattern or configuration. In some embodiments, the adhesive is applied in a desired shape or pattern for the antenna. In some embodiments, the first adhesive is a conductive adhesive.

[0009] In some embodiments, the RFID inlay is then positioned near the second substrate and secured to it with a second adhesive. In some embodiments, the second substrate is a conventional substrate as described above. In other embodiments, the second substrate is an unconventional material, such as an ultra-soft fabric, a very thin material, or a foreign material. In some embodiments, the RFID inlay is then separated from the first substrate. Attached Figure Description

[0010] Figure 1 This is a schematic cross-sectional view of an exemplary embodiment of an RFID inlay fixed to a first substrate.

[0011] Figure 2 It is temporarily fixed to both the first and second substrates. Figure 1 A schematic cross-sectional view of an RFID inlay.

[0012] Figure 3 It is fixed to the second substrate after separating from the first substrate. Figure 2 A schematic cross-sectional view of an RFID inlay.

[0013] Figure 4 This is a schematic cross-sectional view of another exemplary embodiment of an RFID inlay fixed to a first substrate.

[0014] Figure 5It is temporarily fixed to both the first and second substrates. Figure 4 A schematic cross-sectional view of an RFID inlay.

[0015] Figure 6 This is a schematic view of an exemplary embodiment of a system for transferring an RFID inlay from a first substrate to a second substrate.

[0016] Figure 7 This is a schematic view of another exemplary embodiment of a system for transferring an RFID inlay from a first substrate to a second substrate. Detailed Implementation

[0017] Detailed embodiments of the invention have been disclosed herein as needed; however, it should be understood that the disclosed embodiments are merely examples of the invention, which can be implemented in various forms. Therefore, the specific details disclosed herein should not be construed as limiting, but merely as a basis for the scope of the invention claims and as a representative basis for teaching those skilled in the art to use the invention differently in virtually any suitable manner.

[0018] Figure 1 An exemplary RFID inlay 10 according to the present invention is shown. Figure 1 The RFID inlay 10 includes an RFID chip 12 (which may be configured in various ways without departing from the scope of the invention), which is electrically coupled to an antenna 14 (which may also be configured in various ways without departing from the scope of the invention). In the illustrated embodiment, the RFID chip 12 is coupled to the antenna 14 via a conductive adhesive 16, but different components may be used for coupling the RFID chip 12 to the antenna 14 without departing from the scope of the invention.

[0019] The RFID insert 10 is secured to a conventional substrate 18 (e.g., formed of paper or polyethylene terephthalate material) by an adhesive 20. The manner in which the RFID insert 10 is assembled and secured to the substrate 18 can vary without departing from the scope of the invention. In one embodiment, the substrate 18 is configured as a mesh of material unwound from a reel. The adhesive 20 is applied to the substrate 18 as it is unwound from the reel, or alternatively, if the adhesive 20 is already present on the substrate 18, the liner is removed to expose the adhesive 20 as the substrate 18 is unwound from the reel. In one embodiment, the adhesive 20 is applied in the desired shape for the antenna 14 of the RFID insert 10, but the adhesive 20 may be applied or configured in other ways without departing from the scope of the invention.

[0020] The substrate 18 with exposed adhesive 20 continues to unwind from the reel, wherein conductive material is applied to at least a portion of the adhesive 20. Without departing from the scope of the invention, the conductive material can be applied according to any suitable method and in any pattern; however, according to one exemplary embodiment, a web of conductive material (e.g., aluminum foil) is provided, wherein the conductive material is unwound from the reel and contacts the adhesive 20. The conductive material (if not set in the final configuration) is formed into the shape of an antenna (e.g., using a die-cutting or laser-cutting process), and then any excess material is removed by any suitable method. In one exemplary embodiment, the adhesive 20 is provided in the desired shape of the antenna 14, in which case the conductive material can be peeled off from the substrate 18, leaving only the portion of the conductive material in contact with the patterned adhesive 20 as the antenna 14. The substrate 18 (where the conductive material is in the shape of the antenna 14) is then wound onto a second reel. By employing this reel-to-reel process, multiple antennas 14 can be sequentially applied to the substrate 18, thereby allowing for the efficient production of multiple RFID inlays 10.

[0021] The substrate 18 (and the plurality of antennas 14) is then unwound from the reel, and chip adhesive 16 is sequentially applied to each antenna 14. An RFID chip 12 is then applied to the chip adhesive 16 (e.g., using a “chip-to-adhesion” or “strip-adhesion” method) to electrically couple the RFID chip 12 to the associated antenna 14. This may include applying pressure and / or heat to cure the chip adhesive 16 and bond the RFID chip 12 to the antenna 14, thereby forming the RFID inlay 10. After formation, each RFID inlay 10 can be tested while the substrate 18 (and the plurality of RFID inlays 10) is wound onto another reel. Again, it should be understood that the prior methods for assembling and securing the RFID inlays 10 to the initial substrate 18 are merely exemplary, and any other suitable methods may be employed without departing from the scope of the invention.

[0022] With the RFID inlay 10 fixed to the substrate 18, the second substrate 22 is fixed to the RFID inlay using the second adhesive 24, such as Figure 2 As shown. As described above, the first substrate 18 is formed of a conventional substrate material. Although the second substrate 22 can also be formed of a conventional substrate material, it can instead be formed of an unconventional material (e.g., an ultra-soft fabric or a very thin material or a heterogeneous material), which is not well-suited for conventional methods of applying RFID inlays to the substrate (e.g., the method described above for applying RFID inlay 10 to the first substrate 18).

[0023] When the RFID inlay 10 is fixed to the second substrate 22, the first substrate 18 separates from the RFID inlay 10, thus fixing the RFID inlay 10 only to the second substrate 22. Figure 3 As shown. Subsequently, an additional or third substrate (e.g., a liner) may be applied to the RFID inlay 10, wherein the RFID inlay 10 is positioned between the second substrate 22 and the third substrate. The first substrate 18 may be separated from the RFID inlay 10 using any of a variety of different methods and systems, wherein exemplary methods and systems will be described in more detail herein.

[0024] It should be understood that Figure 1 and Figure 2 The components described are merely exemplary, and any other RFID inlay / first substrate configuration may be employed without departing from the scope of the invention. For example, in an alternative embodiment, an additional layer 26 (e.g., a thermally conductive adhesive layer) is provided between the first substrate 18 and the first adhesive 20. Figure 4 ). Figure 4 The components can be manufactured according to any suitable method (including methods of the type described above). If the method described above is used, an additional step of applying the additional layer 26 to the first substrate 18 is provided before applying the first adhesive 20, wherein the first adhesive 20 is applied to the additional layer 26 instead of directly to the first substrate 18. Subsequently, the second substrate 22 can be attached to the RFID inlay 10 according to any suitable method (including methods described above), thereby producing Figure 5 The components. Finally, the RFID inlay 10 is separated from the first substrate 18 using the method and / or system according to the invention, thereby producing Figure 3 Components.

[0025] Figure 6 and Figure 7 Exemplary systems 28 and 30 are shown for transferring RFID inlay 10 from a first substrate 18 to a second substrate 22. It should be understood that the shown systems 28 and 30 and the associated transfer methods are merely exemplary, and systems and methods configured in different ways may be employed without departing from the scope of the invention.

[0026] exist Figure 6 In system 28, a first base 18 is disposed on reel 32, and a plurality of RFID inlays 10 are fixed thereto (e.g., such as...). Figure 1 or Figure 4 (As shown). In Figure 6In this embodiment, a second substrate 22 is also disposed on a reel 34. Substrates 18 and 22 are both unwound from their respective reels 32 and 34 by any suitable mechanism (e.g., a roller 36 in the illustrated embodiment). If the second substrate 22 is provided with an adhesive layer 24 and a liner 38, the liner 38 can be unwound from the second substrate 22 onto the reel 40 to expose the adhesive 24. Alternatively, if the second substrate 22 does not include adhesive, an adhesive applicator 42 can be provided to apply the adhesive 24 (e.g., in the form of a spray) to the second substrate 22 as it is unwound from the reel 34.

[0027] Regardless of how the adhesive 24 is applied to the second substrate 22, the RFID inlay 10 remains in proximity to the second substrate 22, with the adhesive 24 on the second substrate 22 facing the RFID inlay 10 on the first substrate 18. When the RFID inlay 10 is in proximity to the second substrate 22 (as in... Figure 6 At the location marked in the middle (at position 44), the RFID inlay 10 is fixed to the second substrate 22 using adhesive 24 on the second substrate 22. This produces, for example... Figure 2 or Figure 4 The configuration shown has the RFID chip 12 in contact with the adhesive 24 on the second substrate 22, while the antenna 14 is in contact with the adhesive 20 on the first substrate 18.

[0028] With the RFID inlay 10 secured to the second substrate 22, the RFID inlay 10 then separates from the first substrate 18. This may include softening the adhesive 20 on the first substrate 18 before separating the RFID inlay 10 from the first substrate 18, or conversely, separating the RFID inlay 10 from the first substrate 18 without first softening the adhesive 20 on the first substrate 18. The adhesive 20 on the first substrate 18 can be softened by any of a variety of possible methods, depending on the nature of the adhesive 20. In one embodiment, heat is applied to soften the adhesive 20 on the first substrate 18 (e.g., ...). Figure 6 (Indicated at 46). In another embodiment, a softening substance or agent (e.g., a solvent) is applied to soften the adhesive 20 on the first substrate 18. Once the adhesive 20 on the first substrate 18 is softened, the two substrates 18, 22 are moved apart (e.g., by orienting the first substrate 18 away from the second substrate 22, as shown in the diagram). Figure 6 (As shown). Moving substrates 18 and 22 away from each other results in the application of a release force that overcomes the release strength of the softening adhesive 20 on the first substrate 18 (thus separating the RFID inlay 10 from the first substrate 18) without separating the RFID inlay 10 from the second substrate 22. This produces, for example... Figure 3The configuration shown is such that the RFID inlay 10 is fixed only to the second substrate 22.

[0029] If the adhesive 20 on the first substrate 18 is not softened before separating the RFID insert 10 from the first substrate 18, care must be taken in selecting appropriate adhesives 20 and 24. Specifically, if the adhesive 20 on the first substrate 18 is not softened beforehand, the release strength of the adhesive should be less than the release strength of the adhesive 24 on the second substrate 22. With this configuration, moving the substrates 18 and 22 away from each other (or by moving one of the substrates 18 and 22 away from the other) will apply a release force between the substrates 18 and 22. When the release strength of the adhesive 20 on the first substrate 18 is less than the release strength of the adhesive 24 on the second substrate 22, the bond between the RFID insert 10 and the adhesive 20 on the first substrate 18 will be overcome, thereby separating the RFID insert 10 from the first substrate 18 without separating the RFID insert 10 from the second substrate 22. This produces, for example... Figure 3 The configuration shown has the RFID inlay 10 fixed only to the second substrate 22. This method for separating the RFID inlay 10 from the first substrate 18 can be termed "differential release" because it relies on the difference in release strength between adhesive 20 and adhesive 24.

[0030] After the RFID inlay 10 has been separated from the first substrate 18, the first substrate 18 can be wound onto a second reel 48 for reuse (e.g., for receiving additional RFID inlays and then transferring the additional RFID inlays to different substrates, as described herein). Reusing rather than discarding the first substrate 18 promotes sustainability and also reduces the cost of RFID devices incorporating the RFID inlay 10 (by reducing material costs).

[0031] With the RFID inlay 10 simply attached to the second substrate 22, the component can undergo further processing. This may include any additional processing without departing from the scope of the invention. Figure 6 In one embodiment, a third substrate 50 (which may be a lining or backing of a material mesh) is attached to an RFID insert 10 (e.g., using an adhesive), wherein the RFID insert 10 is positioned between the second substrate 22 and the third substrate 50. Figure 6 It is also shown (at position 52) that a second substrate 22 is cut between adjacent RFID inlays 10 (e.g., by die cutting or laser cutting) to define individual RFID tags or markers. While the third substrate 50 remains intact, the individual RFID tags or markers can be tested (e.g., as shown in the image). Figure 6(As shown at position 54), the third substrate 50 is then wound onto the finished reel 56, where each RFID tag or marker is ready to be removed from the third substrate 50 and attached to or incorporated into an item or commodity. Alternatively, if the third substrate 50 is also cut between adjacent RFID inlays 10 to define different RFID tags or markers, different RFID tags or markers can be collected for subsequent attachment to or incorporation into an item or commodity. Again, it should be understood that the above description and Figure 6 The separation and post-processing steps shown are merely exemplary, and other and / or additional processing steps may be employed without departing from the scope of the invention.

[0032] Figure 7 Another exemplary system 30 (which can be described as having an “ultra-tight pitch” configuration) is shown that can be used to transfer the RFID inlay 10 from the first substrate 18 to the second substrate 22. Similar to... Figure 6 System 28, Figure 7 A system 30 is shown in which a first substrate 18 and a second substrate 22 are respectively disposed on reels 58 and 60. Substrates 18 and 22 are unwound from their respective reels 58 and 60 by any suitable mechanism (e.g., roller 62 in the illustrated embodiment). In the illustrated embodiment, the second substrate 22 is provided with an adhesive layer 24 and a liner 64, wherein the liner 64 is unwound from the second substrate 22 to expose the adhesive 24. Figure 7 System 30 is different Figure 6 The system 28, because the liner 64 is not immediately wound onto the second reel, but is oriented along a path away from the second substrate 22 (where the first substrate 18 is oriented along a path between the diverging paths of the second substrate 18 and the liner 64), is then brought back to the vicinity of the second substrate 22 for attachment to the RFID inlay 10, as will be described in more detail herein.

[0033] The RFID inlay 10 is positioned near the second substrate 22, wherein the adhesive 24 on the second substrate 22 faces the RFID inlay 10 on the first substrate 18. When the RFID inlay 10 is positioned near the second substrate 22 (e.g., in...), Figure 7 (At position marked in the middle, at 66), the RFID inlay 10 is fixed to the second substrate 22 using adhesive 24 on the second substrate 22. Figure 7 The illustration shows the use of a tamping rod 68 to move the first substrate 18 toward the second substrate 22, but other methods may be used without departing from the scope of the invention. Attaching the RFID inlay 10 to the second substrate 22 produces, for example... Figure 2 or Figure 4The configuration shown has the RFID chip 12 in contact with the adhesive 24 on the second substrate 22, while the antenna 14 is in contact with the adhesive 20 on the first substrate 18.

[0034] With the RFID inlay 10 secured to the second substrate 22, the RFID inlay 10 then separates from the first substrate 18. This may include softening the adhesive 20 on the first substrate 18 before separating the RFID inlay 10 from the first substrate 18, or conversely, separating the RFID inlay 10 from the first substrate 18 without first softening the adhesive 20 on the first substrate 18, as described above. Figure 6 The system 28 is described in more detail. Regardless of the specific method used to separate the RFID inlay 10 from the first substrate 18, the result is, for example... Figure 3 The configuration shown has the RFID inlay 10 attached only to the second substrate 22. After the RFID inlay 10 has been separated from the first substrate 18, the first substrate 18 can be wound onto the second reel 70 for reuse, thus promoting sustainability and reducing manufacturing costs.

[0035] With the RFID inlay 10 simply fixed to the second substrate 22, the component can undergo further processing. Figure 7 In one embodiment, the liner 64, which is initially separated from the second substrate 22, is redirected back to the vicinity of the second substrate 22 and secured to the RFID inlay (e.g., using an adhesive that can be applied to the liner 64 during the time the liner 64 is separated from the second substrate 22 and then brought back to the vicinity of the second substrate 22), wherein the RFID inlay 10 is positioned between the second substrate 22 and the liner 64. Figure 7 It is also shown (at position 72) that a second substrate 22 is cut between adjacent RFID inlays 10 (e.g., by die cutting or laser cutting) to define individual RFID tags or markers. While the liner 64 remains intact, the individual RFID tags or markers can be tested (e.g., as shown in the image). Figure 7 (As shown at position 74), the liner 64 is then wound onto the finished reel 76, where each RFID tag or marker is ready to be removed from the liner 64 and attached to or incorporated into an item or merchandise. Alternatively, if the liner 64 is also cut between adjacent RFID inlays 10 to define different RFID tags or markers, different RFID tags or markers can be collected for subsequent attachment to or incorporation into an item or merchandise. It should be understood that the above description and Figure 7 The separation and post-processing steps shown are merely exemplary, and other and / or additional processing steps may be employed without departing from the scope of the invention.

[0036] It should be understood that the above embodiments illustrate some applications of the principles of the subject matter of this invention. Those skilled in the art can make numerous modifications without departing from the spirit and scope of the claimed subject matter, including those combinations of features individually disclosed or claimed herein. For these reasons, the scope of this invention is not limited to the above description, but rather as set forth in the following claims, and it should be understood that the claims can be directed to its features, including combinations of features individually disclosed or claimed herein.

Claims

1. A method for transferring an RFID inlay, the method comprising: The radio frequency identification inlay is fixed to the first substrate using a first adhesive; Provide a second base with a second adhesive and a lining; Remove the liner from the second substrate to expose the second adhesive; Position the RFID inlay near the second substrate; The radio frequency identification inlay is fixed to the second substrate using the second adhesive; Separate the RFID inlay from the first substrate; as well as After the RFID inlay is separated from the first substrate, a third substrate is fixed to the RFID inlay, wherein the RFID inlay is positioned between the second substrate and the third substrate.

2. The method according to claim 1, wherein, Separating the RFID inlay from the first substrate includes: softening the first adhesive.

3. The method according to claim 2, wherein, Heat is applied to soften the first adhesive.

4. The method according to claim 2, wherein, Apply a softening agent to soften the first adhesive.

5. The method according to claim 1, wherein, The RFID inlay is separated from the first substrate without softening the first adhesive.

6. The method according to claim 5, wherein, The second adhesive has a greater release strength than the first adhesive, and The RFID inlay is separated from the first substrate by applying a release force between the first substrate and the second substrate to separate the RFID inlay from the first substrate without separating the RFID inlay from the second substrate.

7. The method according to any one of claims 1 to 6, wherein, The step of placing the RFID inlay near the second substrate includes: actuating a rod to move one of the first substrate and the second substrate toward the other of the first substrate and the second substrate.

8. The method according to any one of claims 1 to 6, wherein, The first substrate includes a material mesh, and The RFID inlay is positioned near the second substrate by unwinding the first substrate from the first reel.

9. The method according to any one of claims 1 to 6, further comprising: After separating the RFID inlay from the first substrate, the first substrate is wound onto a second reel for reuse.

10. The method according to any one of claims 1 to 6, wherein, The second substrate includes a material mesh, and The RFID inlay is positioned near the second substrate by unwinding the second substrate from the reel.

11. The method according to claim 10, wherein, Multiple radio frequency identification inlays are applied to the first substrate, and As the first substrate and the second substrate are unwound from their respective reels, the consecutive RFID inlays sequentially separate from the first substrate.

12. The method of claim 11, further comprising: After separating the RFID inlay from the first substrate, the second substrate is wound onto the finished reel.

13. The method of claim 11, further comprising: After each RFID inlay is separated from the first substrate, the second substrate is cut to separate the consecutive RFID inlays.

14. The method of claim 10, wherein, Separating the RFID inlay from the first substrate includes orienting the first adhesive and the second adhesive in different directions.

15. The method according to claim 10, wherein, The second and third substrates are both unwound from the same reel, and After the RFID inlay is separated from the first substrate, the third substrate is fixed to the RFID inlay, wherein the RFID inlay is positioned between the second substrate and the third substrate.

16. The method according to claim 15, wherein, The path through which the first substrate is oriented is located between the path through which the second substrate is oriented and the path through which the third substrate is oriented.

17. The method according to claim 15, wherein, The third substrate includes a liner, and The second substrate and the third substrate are unwound from the same reel to expose the second adhesive.

18. The method of claim 10, further comprising: After the second substrate is unwound from the reel, the second adhesive is applied to the second substrate.

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