Manufacturing support system and manufacturing support method

Abstract

The manufacturing support system and the manufacturing support method of the present application, which support manufacturing using a semiconductor manufacturing device, include: a holding unit configured to hold, in an evaluation subject, information for determining a semiconductor manufacturing device used or scheduled to be used by a use subject, and information for determining a manufacturing process performed by the semiconductor manufacturing device; an evaluation unit configured to evaluate, in the evaluation subject, appropriateness of a material provided by a material supply subject that supplies the material used by the semiconductor manufacturing device, based on information for determining the material provided by the material supply subject and the information held by the holding unit; and an evaluation result providing unit configured to provide the material supply subject with an evaluation result obtained by the evaluation unit.

Description

Technical Field

[0001] The present invention relates to a manufacturing support system and manufacturing support method for supporting manufacturing using semiconductor manufacturing apparatus. Background Technology

[0002] In the manufacture of semiconductor devices, various methods have been proposed to shorten preparation time through prior performance evaluation, etc. As one such method, Japanese Patent Application Publication No. 2003-259015 (Patent Document 1) discloses an electronic conference system in which, as a pre-sales activity for the sale of semiconductor manufacturing equipment, process engineers of semiconductor manufacturing equipment suppliers and process engineers of semiconductor equipment manufacturers (customers) can hold meetings regarding semiconductor equipment processes or semiconductor manufacturing equipment performance without having to travel to each other's locations.

[0003] [Existing Technical Documents]

[0004] [Patent Literature]

[0005] Patent Document 1: Japanese Patent Application Publication No. 2003-259015 Summary of the Invention

[0006] [The problem the invention aims to solve]

[0007] The electronic conferencing system disclosed in Japanese Patent Application Publication No. 2003-259015 (Patent Document 1) assumes that the performance of the semiconductor manufacturing equipment is evaluated in advance using samples provided by the semiconductor equipment manufacturer as part of the pre-sales activities for the purpose of selling semiconductor manufacturing equipment.

[0008] However, in the actual manufacturing process of semiconductor devices, since various materials are used, if the process technicians of semiconductor equipment manufacturers do not have knowledge including material selection, they may not be able to manufacture semiconductor devices of the required quality.

[0009] The object of the present invention is to provide a new structure that supports the manufacture of semiconductor devices using such semiconductor manufacturing apparatus.

[0010] [Technical means to solve the problem]

[0011] According to one aspect of the present invention, a manufacturing support system is provided to support manufacturing using a semiconductor manufacturing apparatus. The manufacturing support system includes: a holding unit disposed in an evaluation body, which holds information for determining whether a semiconductor manufacturing apparatus is used or intended to be used by a user, and information for determining the manufacturing process performed by the semiconductor manufacturing apparatus; an evaluation unit disposed in the evaluation body, which evaluates the suitability of the material based on information for determining the material provided by a material supplier supplying materials used in the semiconductor manufacturing apparatus, and the information held by the holding unit; and an evaluation result providing unit, which provides the evaluation result obtained by the evaluation unit to the material supplier.

[0012] According to another aspect of the present invention, a manufacturing support method is provided to support manufacturing using a semiconductor manufacturing apparatus. The manufacturing support method includes: a step of holding information for determining a semiconductor manufacturing apparatus used or intended to be used by a user, and information for determining a manufacturing process performed by the semiconductor manufacturing apparatus, in an evaluation body; a step of evaluating the suitability of the materials based on information provided by a material supply entity for determining materials used in the semiconductor manufacturing apparatus, and the information held by the holding unit; and a step of providing the evaluation results obtained in the evaluation step to the material supply entity.

[0013] [The effects of the invention]

[0014] The present invention provides a novel configuration that supports the manufacture of semiconductor devices using semiconductor manufacturing apparatus. Attached Figure Description

[0015] Figure 1 This is a schematic diagram used to illustrate the overview of the manufacturing support system according to this embodiment.

[0016] Figure 2 This is a sequence diagram showing the order of processes performed by the manufacturing support system according to this embodiment.

[0017] Figure 3 This is a schematic diagram used to illustrate one application example of the manufacturing support system according to this embodiment.

[0018] Figure 4 This is a sequence diagram showing the processing order executed by one of the application examples of the manufacturing support system according to this embodiment.

[0019] Figure 5 This is a schematic diagram illustrating an example of the device structure of the management device constituting the manufacturing support system according to this embodiment.

[0020] Figure 6This is a schematic diagram illustrating an installation example of data retention in the manufacturing support system according to this embodiment.

[0021] [Explanation of Symbols]

[0022] 1: Manufacturing Support System

[0023] 10: Assessment Entity

[0024] 12: Evaluation device

[0025] 14, 24, 34: Management devices

[0026] 20: Main User

[0027] 30: Material supply entities

[0028] 50: Semiconductor manufacturing equipment

[0029] 60: Materials

[0030] 102: Processor

[0031] 104: Main Memory

[0032] 106: Input Section

[0033] 108, 118: Display section

[0034] 110: Output Department

[0035] 120: Secondary storage device

[0036] 122: Processing Implementation Module

[0037] 124: Data Group

[0038] 126: Ministry of Communications

[0039] 128: Internal Bus Detailed Implementation

[0040] The embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, the same or equivalent parts in the drawings are labeled with the same symbols, and their descriptions will not be repeated.

[0041] <A. Overview of the Structure and Processing of the Manufacturing Support System>

[0042] First, the structure of the manufacturing support system 1 according to this embodiment and an overview of the processes within the manufacturing support system 1 will be described. The manufacturing support system 1 supports manufacturing using a semiconductor manufacturing apparatus. In the following description, the supply of various materials used in the semiconductor manufacturing apparatus will be mainly described, but the manufacturing support system 1 according to this embodiment is not limited to these scopes.

[0043] Figure 1 This is a schematic diagram used to explain the overview of the manufacturing support system 1 according to this embodiment. (Refer to...) Figure 1 The manufacturing support system 1 mainly relates to one or more user entities 20 using the semiconductor manufacturing apparatus 50, one or more material supply entities 30 supplying materials 60 used in the semiconductor manufacturing apparatus 50, and an evaluation entity 10 that evaluates in advance whether the materials 60 supplied by the material supply entities 30 are suitable.

[0044] exist Figure 1 In this context, information exchanged between the assessment subject 10 and "User Subject X," one of the user subjects 20, is labeled "X," and information exchanged between the assessment subject 10 and "Material Supplier A," one of the material suppliers 30, and between "User Subject X" and "Material Supplier A," is labeled "A." For example, information with the same name, such as "Equipment Information X" and "Equipment Information A," but with different symbols for "X" or "A," can be either identical in content or different in content. The following... Figures 2-4 The same applies to China.

[0045] In this specification, the term "user subject 20" is used to include users who use the semiconductor manufacturing apparatus 50 in any form, such as semiconductor manufacturers, semiconductor equipment manufacturers, packaging plants (companies that only contract the packaging and assembly processes in semiconductor manufacturing), outsourced assembly and testing (OSAT) (companies engaged in semiconductor contract packaging and testing), foundries (companies that specialize in the manufacture of semiconductor chips), etc.

[0046] In this specification, "material supply entity" includes any entity that manufactures and / or sells any material 60 used in the semiconductor manufacturing apparatus 50, and is a different entity from "evaluation entity 10" and "user entity 20".

[0047] For example, as a semiconductor manufacturing apparatus 50, consider a molding apparatus for resin sealing electronic components containing semiconductor chips, and a dicing apparatus for monolithically processing electronic components containing semiconductor chips. This resin sealing apparatus uses resin to seal semiconductor chips mounted on a substrate (lead frame, printed circuit board, ceramic substrate, metal substrate, glass substrate, semiconductor substrate, resin substrate, etc.). A material supply unit 30 supplies the resin or substrate used to seal the semiconductor chips as material 60. The material 60 used in the semiconductor manufacturing apparatus 50 is not limited to this type of resin or substrate, but includes any consumables related to the manufacturing process of the semiconductor manufacturing apparatus 50.

[0048] User 20 uses material 60 supplied by material supplier 30 to manufacture a semiconductor device using semiconductor manufacturing apparatus 50. User 20, considering its own semiconductor manufacturing apparatus 50's manufacturing process, specifies the specifications and quality performance of the material 60 supplied by material supplier 30. Material supplier 30 supplies material 60 that meets the specified specifications and quality performance.

[0049] However, not all users 20 may have sufficient understanding of the manufacturing process. Furthermore, during the initial adjustment phase of the newly introduced semiconductor manufacturing equipment 50, the following operations also occur: the manufacturing process is optimized through repeated trial and error, while the specifications or quality performance of the materials 60 used are determined.

[0050] When optimizing the manufacturing process, an evaluation device is needed to evaluate the semiconductor device or its semi-finished product manufactured by the semiconductor manufacturing apparatus 50. However, not all users 20 have an evaluation device, especially as the manufactured semiconductor devices become more miniaturized, requiring a higher performance evaluation device. Furthermore, there may be users 20 that, even if they have an evaluation device, cannot properly provide feedback on the evaluation results output from the evaluation device regarding the manufacturing process.

[0051] The manufacturing support system 1 according to this embodiment provides a solution to the problems described above related to the semiconductor manufacturing apparatus 50 used by the user 20. Specifically, the evaluation unit 10 is responsible for part or all of the evaluation work performed by the user 20, and also for the pre-evaluation of the specifications or quality performance of the material 60 supplied by the material supply unit 30. Through the existence of this evaluation unit 10 and the services it provides, even a user 20 that lacks sufficient insight into the manufacturing process itself, or is unable to adequately evaluate the quality of the manufacturing process, can easily use the semiconductor manufacturing apparatus 50 to manufacture a semiconductor device.

[0052] Furthermore, for the material supplier 30, the reliability of supplying materials that are compatible with the semiconductor manufacturing equipment 50 used by the user 20 at the supply destination can be improved, thus enabling a more stable supply system.

[0053] The assessment subject 10 substantially includes the semiconductor manufacturing apparatus 50, which is substantially the same as the semiconductor manufacturing apparatus 50 used by the user subject 20, and the assessment device 12. The assessment subject 10 is generally suitable to be the manufacturer of the semiconductor manufacturing apparatus 50 or its affiliates. However, it is not limited to the manufacturer of the semiconductor manufacturing apparatus 50 or its affiliates; any group or individual may also be the assessment subject 10.

[0054] In order to manage the information exchanged among the three entities, management devices 14, 24 and 34 may be configured in the assessment entity 10, the user entity 20 and the material supply entity 30 respectively.

[0055] The evaluation entity 10 exchanges equipment information, evaluation information, process information, and certification information with the user entity 20. The evaluation entity 10 also exchanges equipment information, evaluation information, process information, and material information with the material supplier entity 30. Finally, the user entity 20 exchanges equipment information, evaluation information, process information, and certification information with the material supplier entity 30. The information exchanged between these three entities will be explained here.

[0056] The device information includes information used to determine whether the semiconductor manufacturing apparatus 50 is used or intended to be used by the user subject 20. The device information may further include information about replaceable components, etc., used in the semiconductor manufacturing apparatus 50 for determining the target.

[0057] The evaluation information includes the evaluation results when the semiconductor manufacturing apparatus 50 of the object uses the material 60 of the object under the manufacturing conditions of the object.

[0058] Process information includes information used to determine the manufacturing process performed by the semiconductor manufacturing apparatus 50 of the object. Typically, process information includes information defining the manufacturing conditions applicable to the semiconductor manufacturing apparatus 50 of the object.

[0059] Material information includes information related to the material 60 of the object.

[0060] The identification information includes the required specifications of the manufacturing process of the semiconductor manufacturing apparatus 50 containing the object. The identification information depends on the user entity 20.

[0061] Figure 2 This is a sequence diagram showing the processing order performed by the manufacturing support system 1 according to this embodiment. (Refer to...) Figure 1 and Figure 2 An example of the processing sequence executed by Manufacturing Support System 1 will be explained. Figure 2 In the example shown, it is assumed that the evaluation subject 10 is the manufacturer of the semiconductor manufacturing apparatus 50, and it is assumed that a scheme is adopted to introduce a new semiconductor manufacturing apparatus 50 using subject 20. In this scheme, the material supply subject 30 develops the material 60 used in the newly introduced semiconductor manufacturing apparatus 50.

[0062] In the development scheme of material 60, the material supplier 30 develops material 60 according to the manufacturing conditions proposed by the user 20, etc. (step S2). The material supplier 30 provides the evaluation subject 10 with a part of the developed material 60 (material sample) and material information (step S4). Furthermore, if the evaluation subject 10 can analyze the material sample, it is not necessary to provide material information.

[0063] The evaluation entity 10 holds in advance device information (information for determining the semiconductor manufacturing apparatus 50 used or intended to be used by the user entity 20) and process information (information for determining the manufacturing process performed by the semiconductor manufacturing apparatus 50).

[0064] The evaluation entity 10 uses material samples provided by the material supplier 30 for evaluation (step S6). More specifically, the evaluation entity 10 evaluates the suitability of material 60 based on information used to determine the material 60 provided by the material supplier 30 and information held by the evaluation entity 10 (equipment information and process information). Then, the evaluation entity 10 provides the evaluation results obtained through the evaluation, along with the equipment information and process information, to the material supplier 30 (step S8).

[0065] In the development scheme of material 60, steps S2 to S8 are repeatedly performed (※1). The evaluation subject 10 can evaluate the suitability of different materials 60 in the manner described above. Specifically, as an example, the composition ratio of material 60 can be used in the suitability evaluation process.

[0066] After obtaining evaluation results for one or more materials, a candidate material to be supplied to user 20 is determined between the evaluation entity 10 and the material supplier 30 as needed (step S10). Then, the evaluation entity 10 provides user 20 with equipment information, evaluation information, and process information for the materials determined to be candidate materials (step S12). Similarly, the material supplier 30 provides user 20 with equipment information, evaluation information, and process information for the materials determined to be candidate materials (step S14).

[0067] Furthermore, the equipment information, evaluation information, and process information provided by the evaluation entity 10 in step S12 are essentially consistent with the equipment information, evaluation information, and process information provided by the material supply entity 30 in step S14. The purpose is to prevent errors in information provision by confirming the consistency of the information provided by each entity. From the perspective of simplifying the process, either step S12 or step S14 can be omitted.

[0068] User 20 performs final performance verification by referring to the provided device information, evaluation information, and process information (step S16). After understanding the content of the performance verification, User 20 sends verification information to Evaluation 10 (step S18) and Material Supply 30 (step S20).

[0069] Through the above processing, the pre-assessment of the manufacturing process is completed. Then, the user 20 orders a semiconductor manufacturing apparatus containing the certification information from the assessment 10 (in this example, the manufacturer of the semiconductor manufacturing apparatus 50) (step S22), and orders materials containing the certification information from the material supply 30 (step S24).

[0070] Evaluation Entity 10 (the manufacturer of the semiconductor manufacturing apparatus 50) manufactures the semiconductor manufacturing apparatus 50 according to the order of User Entity 20 (step S26) and delivers the manufactured semiconductor manufacturing apparatus 50 to User Entity 20 (step S28). Furthermore, Material Supply Entity 30 manufactures Material 60 according to the order of User Entity 20 (step S30) and delivers the manufactured Material 60 to User Entity 20 (step S32).

[0071] according to Figure 2 The processing sequence shown completes the pre-assessment of the manufacturing process.

[0072] Furthermore, Figure 2 This indicates the processing sequence for the prior evaluation of the manufacturing process. However, after the semiconductor manufacturing apparatus 50 is delivered, if the user 20 wishes to reconsider the manufacturing process, the processing steps S2 to S20 can be performed again.

[0073] <B. Assessment and Treatment>

[0074] Next, an example of the assessment process for assessment subject 10 will be explained.

[0075] Typically, the evaluation subject 10 is the manufacturer of the semiconductor manufacturing apparatus 50 or its affiliate, and has a semiconductor manufacturing apparatus 50 that is substantially the same as the semiconductor manufacturing apparatus 50 used by the user subject 20. Alternatively, a semiconductor manufacturing apparatus 50 that is substantially the same as the semiconductor manufacturing apparatus 50 used by the user subject 20 may be prepared.

[0076] The evaluation entity 10 uses material samples provided by the material supplier 30 to reproduce the manufacturing process intended to be implemented or currently implemented by the user entity 20 in a semiconductor manufacturing apparatus 50 that is substantially the same as that used or intended to be used by the user entity 20. The evaluation apparatus 12 evaluates the product (semiconductor device) or its semi-finished product manufactured using the reproduced manufacturing process. Alternatively, it may evaluate the impact of the reproduced manufacturing process on the semiconductor manufacturing apparatus 50, etc.

[0077] As described above, the evaluation entity 10 retains device information (information for determining the semiconductor manufacturing apparatus 50 used or intended to be used by the user entity 20) and process information (information for determining the manufacturing process performed by the semiconductor manufacturing apparatus 50). Based on the information for determining the material 60 provided by the material supplier 30 and the information retained by the evaluation entity 10 (device information and process information), the evaluation entity 10 evaluates the suitability of the material 60. Then, the evaluation entity 10 provides the evaluation results to the material supplier 30.

[0078] The evaluation of a semiconductor device or its semi-finished product manufactured using the reproduced manufacturing process can also be performed through shape observation. Examples of evaluation items include: (1) external dimensions and warpage, (2) cross-sectional images, (3) thermal warpage variation, (4) internal observation results, and (5) hardness measurement results. Corresponding to these evaluation items, the evaluation device 12 used to evaluate the quality of a semiconductor device or its semi-finished product may include any one of the following: a shape measuring device, a microscope for obtaining cross-sectional images, a probe for internal observation, and a hardness tester for measuring hardness.

[0079] More specifically, (1) the evaluation of external dimensions and warpage, and (3) the evaluation of thermal warpage variation, use a shape measuring device such as a heat-induced warpage measuring device (TSM) or a scanning acoustic tomography (SAT) device as the evaluation device 12. (2) the evaluation of cross-sectional observation images uses an optical microscope or a scanning electron microscope (SEM) as the evaluation device 12. (4) the evaluation of internal observation results uses an ultrasonic tomography device or an X-ray fluoroscopy device as the evaluation device 12. (5) the evaluation of hardness measurement results uses a hardness tester as the evaluation device 12.

[0080] The impact of the reproduced manufacturing process on the semiconductor manufacturing apparatus 50 can also be assessed by observing the molds and fixtures used in the semiconductor manufacturing apparatus 50. Evaluation items may include: (1) the presence or absence of dirt on the mold surface, (2) the wear condition of the cutting blades, and (3) the amount of cutting blade wear. Corresponding to these evaluation items, the structure used to evaluate the wear of substantially the same semiconductor manufacturing apparatus 50 may include either an observation device or a detection device.

[0081] More specifically, (1) the presence or absence of dirt on the mold surface can be assessed by human visual inspection or by using an observation device or the like as an assessment device 12. (2) the wear condition of the cutting blade is assessed using an ultrasonic detection device or an X-ray fluoroscopy device or the like as an assessment device 12. (3) the amount of cutting blade wear is assessed using a shape measuring device.

[0082] Not limited to the aforementioned items, one or more evaluation devices 12 may be used for any evaluation item.

[0083] As described above, the evaluation unit, which is the evaluation subject 10, may include: a semiconductor manufacturing apparatus 50 that is substantially the same as the semiconductor manufacturing apparatus 50 used or intended to be used by the user subject 20; and an evaluation device 12 that evaluates the quality of the semiconductor device or the semi-finished product of the semiconductor device manufactured by the substantially the same semiconductor manufacturing apparatus 50, and / or the loss of the substantially the same semiconductor manufacturing apparatus 50.

[0084] Typically, the evaluation is performed by reproducing the manufacturing process using a semiconductor manufacturing apparatus 50, but some or all of the evaluation can also be achieved through simulation. In the case of evaluation via simulation, a model of the semiconductor manufacturing apparatus 50 is prepared, and a model corresponding to the material information supplied by the material supplier 30 is generated, thereby enabling simulation related to the manufacturing process of the object. Furthermore, in the case of evaluation via simulation, it is not necessary for the material supplier 30 to provide material samples to the evaluation subject 10.

[0085] As described above, the evaluation unit, which is the evaluation subject 10, may include a simulation device that utilizes a model of the semiconductor manufacturing apparatus 50 used or intended to be used by the user subject 20. By using simulation, evaluation can be performed even if the semiconductor manufacturing apparatus 50 does not exist in reality.

[0086] <C. Details of the Information>

[0087] Next, details of the information exchanged in the manufacturing support system 1 according to this embodiment will be explained.

[0088] (c1: Device Information)

[0089] The device information includes information about the semiconductor manufacturing apparatus 50 used to identify the object and the replaceable components used. More specifically, if the semiconductor manufacturing apparatus 50 is a molding apparatus, the device information includes (1) device type (model) and (2) mold type (model), etc.

[0090] Furthermore, if the semiconductor manufacturing apparatus 50 is a single-cutting apparatus, the apparatus information includes (1) apparatus type (model), (2) model of the kit (unit component for a variety), (3) model of the blade, etc.

[0091] (c2: Assessment Information)

[0092] The evaluation information includes evaluation results when the semiconductor manufacturing apparatus 50 of the object uses the material 60 of the object under the manufacturing conditions of the object. More specifically, the evaluation information includes evaluation results of the quality of the semiconductor device manufactured using the material 60 of the object and through the semiconductor manufacturing apparatus 50 of the object, and evaluation results of the degree of wear and tear of the semiconductor manufacturing apparatus 50, etc.

[0093] As an example of the evaluation results of the quality of a semiconductor device, shape observation results can be listed. Shape observation results include: (1) the external dimensions and warpage of the semiconductor device, (2) cross-sectional observation images of the semiconductor device (observed using an optical microscope or a scanning electron microscope (SEM), (3) thermal warpage of the semiconductor device, (4) internal observation results of the semiconductor device obtained by ultrasonic waves (e.g., presence or absence of defects or voids), (5) internal observation results of the semiconductor device obtained by X-rays (e.g., presence or absence of defects or voids), and (6) hardness measurement results of the semiconductor device.

[0094] Furthermore, as an example of the assessment results of the wear level of the semiconductor manufacturing apparatus 50, the observation results of molds and fixtures can be cited. The observation results of molds and fixtures include: (1) the presence or absence of dirt on the surface of the mold (visual inspection), (2) the wear condition of the cutting blades (observation using an optical microscope or a scanning electron microscope), and (3) the amount of cutting blade wear.

[0095] (c3: Process Information)

[0096] The process information includes information defining the manufacturing conditions of the semiconductor manufacturing apparatus 50 to which the semiconductor is applied. More specifically, if the semiconductor manufacturing apparatus 50 is a molding apparatus, the process information includes: (1) mold temperature, (2) resin weight and deviation, (3) preheating time, (4) molding pressure, and (5) molding profile (resin injection pressure and mold position changes over time, etc.).

[0097] Furthermore, if the semiconductor manufacturing apparatus 50 is a single-cutting apparatus, the process information related to the cutting process includes: (1) rotational speed, (2) cutting speed, (3) number of cuts, (4) cutting resistance, and (5) cooling water volume.

[0098] (c4: Material Information)

[0099] The material information includes information related to the material 60 of the object. More specifically, if the material 60 is a resin material, the material information includes: (1) helical flow as an indicator of fluidity, (2) gel time, (3) glass transition temperature, (4) coefficient of linear expansion, (5) filler content, (6) filler particle size distribution, (7) moisture content, (8) density, etc.

[0100] Furthermore, if material 60 is a substrate material, the material information includes: (1) the thickness and deviation measurement results of the wiring plating, and (2) the thickness and deviation measurement results of the wiring resist.

[0101] (c5: Certification Information)

[0102] The identification information includes the required specifications of the manufacturing process of the semiconductor manufacturing apparatus 50 containing the object. More specifically, the identification information includes: (1) the determination result of whether the guarantee value of the semiconductor manufacturing apparatus is met, (2) the process capability index (cpk), (3) the blade life prediction, etc.

[0103] Furthermore, the item mentioned is just one example, and any item may be included in each piece of information depending on the manufacturing process or the type of material 60.

[0104] <D. Application Examples>

[0105] The description primarily illustrates examples applicable to prior performance evaluation, but is not limited to these, and various applications are possible. For example, it can also be used to ensure the quality of the material 60 manufactured by the material supplier 30. In this case, the material supplier 30 can associate the evaluation results provided by the evaluation entity 10 with the corresponding material 60 and supply it to the user entity 20.

[0106] Figure 3 This is a schematic diagram used to illustrate one application example of the manufacturing support system 1 according to this embodiment. Figure 4 This is a sequence diagram showing the processing order performed by one of the application examples of the manufacturing support system 1 according to this embodiment.

[0107] Reference Figure 3 For example, if the main body 20 uses the semiconductor manufacturing apparatus 50 to manufacture a semiconductor device, the evaluation body 10 evaluates the quality of the material 60 supplied by the material supply body 30 in advance.

[0108] Reference Figure 3 and Figure 4In the scheme for supplying material 60, the material supplier 30 manufactures material 60 according to manufacturing conditions proposed in advance by the user 20, etc. (step S52). The material supplier 30 provides the evaluation subject 10 with a portion of the manufactured material 60 (material sample) and material information (step S54).

[0109] The evaluation entity 10 performs an evaluation using material samples provided by the material supplier 30 (step S56). Then, the evaluation entity 10 provides the material supplier 30 with the evaluation results obtained through the evaluation (step S58).

[0110] Material supply entity 30 supplies the evaluation results provided by evaluation entity 10 to user entity 20 along with the manufactured material 60 (step S60). After user entity 20 confirms the evaluation results attached to the material 60 delivered by material supply entity 30, it uses it in semiconductor manufacturing apparatus 50.

[0111] Furthermore, in steps S56 and S58, the evaluation results may be provided to the material supplier 30 only when the evaluation results obtained by the evaluation subject 10 are appropriate.

[0112] By adopting such Figure 3 and Figure 4 The configuration shown can more reliably ensure that the material 60 supplied from the material supply unit 30 to the user unit 20 is suitable for the semiconductor manufacturing apparatus 50.

[0113] Furthermore, Figure 3 and Figure 4 The quality assessment shown can be performed, for example, during the manufacturing of 60 batches of each material.

[0114] <E. Management Device>

[0115] Next, the management devices 14, 24, and 34, respectively configured in the evaluation entity 10, the user entity 20, and the material supply entity 30, will be described. In the manufacturing support system 1, the information required by the management devices 14, 24, and 34 is essentially exchanged.

[0116] Figure 5 This is a schematic diagram illustrating an example of the device structure of the management device 14 constituting the manufacturing support system 1 according to this embodiment. Furthermore, management devices 24 and 34 are also related to... Figure 5 The devices shown have the same structure.

[0117] Reference Figure 5The management device 14 is implemented using a computer and includes, as its main components, a processor 102, a main memory 104, an input unit 106, a display unit 108, an output unit 110, a secondary storage device 120, and a communication unit 126. These components are connected to an internal bus 128.

[0118] The processor 102 is the computing unit that performs the processing required to execute the functions provided by the management device 14. It achieves the required functions by executing programs or program modules stored in the secondary storage device 120. The processor 102 may also be multi-core and / or multi-processor, and the required number of cores or processors can be set according to the required load processing capacity.

[0119] Main memory 104 provides the working memory required by processor 102 to execute programs. Main memory 104 is a non-volatile memory that holds the program code or working data of the executed program once.

[0120] The input unit 106 is a component that receives operations from operators, etc., and is implemented, for example, using a keyboard, mouse, touch screen, etc. The display unit 118 is a component that displays information such as processing results to operators, etc., and is implemented, for example, using a monitor, etc. The output unit 110 is a component that outputs information from the management device 14 in a tangible form, and is implemented, for example, using a printer, etc.

[0121] The secondary storage device 120 is an example of a storage unit. In addition to the operating system (not shown), it also stores a data set 124, which includes a processing implementation module 122 for providing the functions required in the manufacturing support system 1 according to this embodiment, and various data. Typically, the data set 124 of the management device 14 of the evaluation subject 10 includes identification information, device information, and process information.

[0122] The communication unit 126 is a component used to communicate with the user entity 20 and / or the material supply entity 30, for example, using a wired local area network (LAN) communication interface, a wireless LAN communication interface, a public network communication interface, etc. Multiple or more communication units 126 can be installed depending on the number of user entities 20 and / or material supply entities 30 that are the communication targets and the communication method.

[0123] The description shows a structural example of a direct exchange of necessary information between the evaluation subject 10 (management device 14), the user subject 20 (management device 24), and the material supply subject 30 (management device 34), but is not limited to this structure; information may also be managed by a specific subject.

[0124] Figure 6 This is a schematic diagram illustrating an installation example of data retention in the manufacturing support system 1 according to this embodiment. Figure 6 (A) represents an example of the installation of data required for the management of assessment subject 10. Figure 6 (B) represents the installation example of the data required for the management of the material supply entity 30.

[0125] Reference Figure 6 In (A), the assessment entity 10 manages assessment information related to material samples provided by the material supplier 30, and provides the material supplier 30 with specific information such as a Uniform Resource Locator (URL) for accessing the managed assessment information in lieu of the assessment information. Furthermore, the material supplier 30 provides the user entity 20 with the specific information provided by the assessment entity 10.

[0126] Material supplier 30 and user 20 can access the assessment entities managed by assessment entity 10 based on specific information. Furthermore, various restrictions such as access codes (passwords) can be set in the access to assessment information managed by assessment entity 10.

[0127] By adopting this structure, the computing resources in the material supply unit 30 (management device 34) can be reduced, and the processing of the manufacturing support system 1 can be simplified.

[0128] Reference Figure 6 (B) The assessment entity 10 sends assessment information related to the material samples provided by the material supplier 30 to the material supplier 30. The material supplier 30 manages the assessment information received from the assessment entity 10. The material supplier 30 provides the user entity 20 with specific information such as URLs for accessing the assessment information it manages.

[0129] User 20 can access the assessment information managed by material supplier 30 based on specific information. Furthermore, various restrictions, such as access codes (passwords), can be set for accessing the assessment information managed by material supplier 30.

[0130] By adopting this structure, the computing resources used in the main body 20 (management device 24) can be reduced, and the processing of the manufacturing support system 1 can be simplified.

[0131] The description shows a structural example in which management devices 14, 24 and 34 are configured in the evaluation subject 10, the user subject 20 and the material supply subject 30, respectively. However, it is not limited to this. The required processing and functions can also be achieved by using part of a system that connects multiple computers via a network, such as a so-called cloud computer.

[0132] The manufacturing support system 1 according to this embodiment can be implemented in any computing environment, and can use any known technology at the time of actual installation, or adopt any installation method according to the laws of the country or region where it is actually installed. The technical scope of the present invention is not limited to a specific installation method, and can include any installation method.

[0133] <F. Advantages>

[0134] Prior assessment of the suitability of semiconductor manufacturing equipment and materials used in the target manufacturing process requires sufficient insight and significant time. A comprehensive evaluation, encompassing both the semiconductor manufacturing equipment and materials, can be achieved through a collaborative, resource-intensive process involving both the assessment entity (typically the manufacturer of the semiconductor manufacturing equipment) and the material supplier.

[0135] By providing a manufacturing support system capable of conducting such comprehensive assessments, material suppliers can reliably and appropriately provide materials that are compatible with the manufacturing processes desired by the users, who are the customers. Furthermore, even if users lack sufficient insight, they can utilize the assessment entity's insights to achieve the target manufacturing process earlier and more accurately. Moreover, the assessment entity can leverage its own insights to support various material suppliers and users.

[0136] The embodiments disclosed herein should be considered illustrative in all respects and not restrictive. The scope of the invention is shown by the claims rather than by the description of the embodiments, and is intended to include all modifications within the same meaning and scope as the claims.

Claims

1. A manufacturing support system that supports manufacturing using a semiconductor manufacturing apparatus, comprising: a holding unit configured to an evaluation subject, which holds information for specifying a semiconductor manufacturing apparatus used or scheduled to be used by a user subject, and information for specifying a manufacturing process performed by the semiconductor manufacturing apparatus; an evaluation unit configured to the evaluation subject, which evaluates appropriateness of a material based on information for specifying the material provided by a material supply subject that supplies the material used by the semiconductor manufacturing apparatus, and the information held by the holding unit; and an evaluation result providing unit that provides the evaluation subject with an evaluation result obtained by the evaluation unit, the evaluation unit including: a substantially identical semiconductor manufacturing apparatus that is substantially identical to the semiconductor manufacturing apparatus used or scheduled to be used by the user subject; and an evaluation device that evaluates at least one of quality of a semiconductor device or a semi-product of the semiconductor device manufactured by the substantially identical semiconductor manufacturing apparatus, and a loss of the substantially identical semiconductor manufacturing apparatus.

2. The manufacturing support system according to claim 1, wherein the evaluation device includes any one of a shape measuring device, a microscope that obtains a cross-sectional observation image, a probe device to perform internal observation, a hardness tester to measure hardness, as a structure to evaluate the quality of the semiconductor device or the semi-product of the semiconductor device.

3. The manufacturing support system according to claim 1, wherein the evaluation device includes any one of an observation device and a probe device, as a structure to evaluate the loss of the substantially identical semiconductor manufacturing apparatus.

4. The manufacturing support system according to any one of claims 1 to 3, wherein the evaluation device includes a simulation device that uses a model of the semiconductor manufacturing apparatus used or scheduled to be used by the user subject.

5. The manufacturing support system according to any one of claims 1 to 3, wherein the material supply subject associates the evaluation result provided by the evaluation subject with a corresponding material, and supplies it to the user subject.

6. The manufacturing support system according to any one of claims 1 to 3, wherein the evaluation unit performs an evaluation appropriateness process on a plurality of different materials, respectively.

7. A manufacturing support method that supports manufacturing using a semiconductor manufacturing apparatus, comprising: a step of holding, by a holding unit configured to an evaluation subject, information for specifying a semiconductor manufacturing apparatus used or scheduled to be used by a user subject, and information for specifying a manufacturing process performed by the semiconductor manufacturing apparatus, a step of evaluating, in the evaluation subject, appropriateness of a material based on information for specifying the material provided by a material supply subject that supplies the material used by the semiconductor manufacturing apparatus, and the information held by the holding unit; and a step of providing the material supply subject with an evaluation result obtained by the evaluation. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ In the step of the evaluation, a step of evaluating at least one of a quality of a semiconductor device or a semi-product of the semiconductor device manufactured by a substantially same semiconductor manufacturing apparatus as the semiconductor manufacturing apparatus used or scheduled to be used by the use subject, and a deterioration of the substantially same semiconductor manufacturing apparatus is included.

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