A high-temperature resistant electronic device, a method for making an electronic device high-temperature resistant, and a terminal device

Abstract

An embodiment of the present invention provides a high-temperature resistant electronic device, a method for making an electronic device high-temperature resistant, and a terminal device. The high-temperature resistant electronic device is applied to a vehicle-mounted device. The high-temperature resistant electronic device includes a first system, a second system, and a power switch unit. The second system is respectively connected to the vehicle-mounted system and the first system of the vehicle-mounted device. The power supply end of the first system is connected to the vehicle-mounted system through the power switch unit, and the power switch unit is connected to the second system. After being powered by the vehicle-mounted system, the second system is configured to detect the ambient temperature, and when the ambient temperature meets the conditions, control the switch of the power switch unit to close so that the vehicle-mounted system powers the first system, thereby enabling the first system to operate. The structure of the high-temperature resistant electronic device in this application is not only simpler, but also can increase the selection range of electronic components in the electronic device, thereby reducing its production cost.

Description

Technical Field

[0001] The present invention relates to automotive technology, and particularly to a high-temperature resistant electronic device, a method for making an electronic device high-temperature resistant, and a terminal device. Background Art

[0002] Currently, automotive electronic devices need to be installed under the sunroof. Since the glass is directly exposed to the sun, the temperature of the outer surface of the glass can reach 150 - 200 °C, and the highest temperature of the inner surface of the glass can reach 105 °C. Therefore, the electronic devices under the sunroof glass need to meet the condition of normal operation at 105 °C, while the operating temperatures of the electronic components used in current market products must reach or exceed 105 °C.

[0003] Most automotive electronic components on the market can only reach the high-temperature resistant operating condition of 85 °C. If they want to reach the high-temperature operating condition of 105 °C, the structure of the electronic device is relatively complex, and the selection range of automotive electronic components is very small, so that the production cost of the electronic device is 3 - 5 times higher than that of current automotive electronic components that reach the high-temperature operating condition of 85 °C. Summary of the Invention

[0004] In view of this, embodiments of the present application provide a high-temperature resistant electronic device, a method for making an electronic device high-temperature resistant, and a terminal device to solve the problems of small selection range of electronic components and high production cost in the prior art.

[0005] In a first aspect, embodiments of the present application provide a high-temperature resistant electronic device applied to a vehicle-mounted device. The high-temperature resistant electronic device includes a first system, a second system, and a power switch unit. The first system includes electronic components that operate at a preset temperature threshold, and the second system includes electronic components that operate at a temperature higher than the temperature threshold;

[0006] The second system is respectively connected to the vehicle-mounted system of the vehicle-mounted device and the first system. The power supply end of the first system is connected to the vehicle-mounted system through the power switch unit, and the power switch unit is connected to the second system;

[0007] The second system is configured to detect the ambient temperature after being powered by the vehicle-mounted system, and when the ambient temperature meets the condition, control the switch of the power switch unit to close so that the vehicle-mounted system supplies power to the first system, and then the first system operates.

[0008] In some embodiments, the device further includes: a vehicle-mounted interface hub;

[0009] The second system is further configured to perform data interaction with the vehicle system through the vehicle interface hub, and control the vehicle system to communicate with the first system after power-on through the vehicle interface hub to achieve data interaction.

[0010] In some embodiments, when the ambient temperature does not meet the condition, the second system is further configured to maintain a normal working state and control the vehicle system to stop supplying power to the first system.

[0011] In some embodiments, after the first system is started, the second system is further configured to monitor the working state of the first system, and when an abnormal state occurs in the first system, control the power switch unit to disconnect to cut off the power supply of the first system.

[0012] In some embodiments, the second system includes a temperature sensor and a microcontroller;

[0013] The temperature sensor is connected to the microcontroller, and the temperature sensor is configured to detect the ambient temperature and send the ambient temperature to the microcontroller;

[0014] The microcontroller is respectively connected to the first system and the vehicle system through the vehicle interface hub.

[0015] In some embodiments, the first system includes a central processing unit, a first communication interface, a second communication interface, a memory, and a functional module;

[0016] The central processing unit is respectively connected to the first communication interface, the second communication interface, the memory, and the functional module;

[0017] The first communication interface is connected to the vehicle interface hub, and the first communication interface is used for data interaction between the first system and the vehicle system;

[0018] The second communication interface is connected to the second system, and the second communication interface is used for data interaction between the first system and the second system.

[0019] In some embodiments, the condition is that the ambient temperature is less than the temperature threshold;

[0020] The value range of the temperature threshold is 80°C - 110°C.

[0021] In a second aspect, an embodiment of the present application further provides a method for an electronic device to withstand high temperatures, which is applied to the second system, and the method includes:

[0022] After being powered by the vehicle system, detect the ambient temperature;

[0023] Determine whether the ambient temperature meets the condition;

[0024] If the ambient temperature meets the condition, control the power switch unit to supply power to the first system by the vehicle-mounted system, so as to make the first system operate.

[0025] In a third aspect, an embodiment of the present application further provides a terminal device, including a memory and a processor. The memory stores a computer program, and when the computer program runs on the processor, it executes the above-mentioned high-temperature resistant method for an electronic device.

[0026] In a fourth aspect, an embodiment of the present application further provides a readable storage medium, which stores a computer program, and when the computer program runs on a processor, it executes the above-mentioned high-temperature resistant method for an electronic device.

[0027] The embodiments of the present application have the following beneficial effects:

[0028] The embodiments of the present application provide a high-temperature resistant electronic device, a high-temperature resistant method for an electronic device, and a terminal device. The high-temperature resistant electronic device is applied to a vehicle-mounted device. The high-temperature resistant electronic device includes a first system, a second system, and a power switch unit. The first system includes electronic devices that work under a preset temperature threshold. The second system includes electronic devices that work above the temperature threshold. The second system is respectively connected to the vehicle-mounted system and the first system of the vehicle-mounted device. The power supply end of the first system is connected to the vehicle-mounted system through the power switch unit. The second system is connected to the power switch unit. The second system is used to detect the ambient temperature after being powered by the vehicle-mounted system, and when the ambient temperature meets the condition, control the power switch unit to supply power to the first system by the vehicle-mounted system, so as to make the first system operate. The structure of the high-temperature resistant electronic device proposed in the embodiments of the present application is not only simpler, but also can increase the selection range of electronic devices in the electronic device, thereby reducing its production cost. Description of the Drawings

[0029] In order to more clearly illustrate the technical solutions of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the protection scope of the present invention. In each drawing, similar components are numbered similarly.

[0030] Figure 1 Shows a first structural schematic diagram of the high-temperature resistant electronic device according to an embodiment of the present application;

[0031] Figure 2 Shows a second structural schematic diagram of the high-temperature resistant electronic device according to an embodiment of the present application;

[0032] Figure 3Shows a third structural schematic diagram of the high-temperature resistant electronic device according to an embodiment of the present application;

[0033] Figure 4 Shows a flowchart of a method for making an electronic device high-temperature resistant according to an embodiment of the present application.

[0034] Main element symbol description:

[0035] 100 - High-temperature resistant electronic device; 110 - Vehicle-mounted system; 120 - First system; 130 - Second system; 140 - Vehicle-mounted interface hub; 150 - Power switch unit; 131 - Temperature sensor; 132 - Microcontroller; 121 - Central processing unit; 122 - First communication interface; 123 - Second communication interface; 124 - Memory; 125 - Functional module; 111 - Data interface; 112 - Power supply. Detailed implementation manners

[0036] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0037] Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0038] Hereinafter, the terms "including", "having" and their cognates that can be used in various embodiments of the present invention are only intended to indicate specific features, numbers, steps, operations, elements, components or combinations of the foregoing items, and should not be construed as first excluding the existence of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing items or increasing the possibility of one or more features, numbers, steps, operations, elements, components or combinations of the foregoing items.

[0039] In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0040] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which various embodiments of the present invention pertain. The terms (such as those defined in a general use dictionary) will be interpreted to have the same meaning as their contextual meaning in the relevant technical field and will not be interpreted to have an idealized or overly formal meaning unless clearly defined in various embodiments of the present invention.

[0041] Embodiment 1

[0042] As Figure 1 shown, it is a schematic structural diagram of a high-temperature resistant electronic device 100 according to an embodiment of the present application. The high-temperature resistant electronic device 100 is applied to a vehicle-mounted device and includes a first system 120, a second system 130, and a power switch unit 150.

[0043] The second system 130 is respectively connected to the vehicle-mounted system 110 of the vehicle-mounted device and the first system 120. The power supply terminal of the first system 120 is connected to the vehicle-mounted system 110 through the above-mentioned power switch unit 150, wherein the control terminal of the power switch unit 150 is connected to the second system 130. Among them, the first system includes electronic devices that operate at a preset temperature threshold, and the second system includes electronic devices that operate at a temperature higher than the temperature threshold.

[0044] When the vehicle starts, the second system 130 will obtain the working voltage from the vehicle-mounted system 110 and then power on. After powering on, the second system 130 will communicate with the vehicle-mounted system 110, receive and process relevant data of the vehicle-mounted system 110, detect the ambient temperature, and when the ambient temperature meets the conditions, control the vehicle-mounted system 110 to supply power to the first system 120 through the power switch unit 150, that is, close the switch in the power switch unit 150, so that the first system 120 can operate normally and thus enter the working state. In other words, at this time, the first system 120 will communicate with the vehicle-mounted system 110 and the second system 130 and complete relevant functions. When the ambient temperature does not meet the above conditions, the second system 130 maintains the normal working state and controls the vehicle-mounted system 110 to stop supplying power to the first system 120. At this time, the first system 120 does not work.

[0045] Among them, the condition that the above ambient temperature needs to meet is that the ambient temperature is less than the preset temperature threshold. For example, the value range of the temperature threshold is 80°C - 110°C.

[0046] During the operation of the first system 120, the second system 130 can monitor the working state of the first system 120. When the first system 120 has an abnormality or a fault, the second system 130 can immediately take effective measures to troubleshoot and recover from the fault, or can control the switch of the power switch unit 150 to be turned off to cut off the power supply of the first system 120, thereby shutting down the functions of the first system 120 and transferring the core functions of the first system 120 to the second system 130 for operation. Among them, the core functions include functions such as communication, error reporting, data reporting, and diagnosis.

[0047] It can be understood that the high-temperature resistant electronic device 100 of the vehicle can be installed under the sunroof glass of the vehicle. Since the sunroof glass will be directly exposed to the sun, the inner surface temperature of the glass can reach 105 °C. Therefore, in this embodiment, the devices in the second system 130 can use devices that can operate normally at 105 °C, or can use devices with a working operating temperature exceeding 105 °C according to actual needs. When the ambient temperature meets the conditions, the second system 130 controls the first system 120 to start. Therefore, devices that can work normally under a preset temperature threshold can be used in the first system 120. By using electronic devices that reach different temperature operating conditions in the high-temperature resistant electronic device 100, not only can the complexity of the automotive electronic devices installed under the sunroof glass be reduced, but also the selectable range of electronic devices can be expanded, thereby reducing the production cost of the high-temperature resistant electronic device 100.

[0048] Exemplarily, when the preset temperature threshold is 85 °C, the first system 120 can use electronic devices that operate normally at 85 °C. When the vehicle starts, the second system 130 starts. In other words, at this time, the second system 130 will communicate with the in-vehicle system 110 and process relevant data, and detect the ambient temperature. If the ambient temperature is detected to be 80 °C at this time, that is, when the ambient temperature meets the conditions, the second system 130 will control the switch of the power switch unit 150 to be closed to start the first system 120. If the second system 130 detects that the ambient temperature is 100 °C, that is, when the ambient temperature does not meet the conditions, the second system 130 controls the switch of the power switch unit 150 to be turned off to stop the first system 120 from working.

[0049] As Figure 2 shown, the above-mentioned high-temperature resistant electronic device 100 further includes an in-vehicle interface hub 140. The second system 130 is further used to control the in-vehicle system 110 to perform data interaction with the powered-on first system 120 through the in-vehicle interface hub (HUB) 140, and control the in-vehicle system 110 to establish a communication connection with the first system 120 through the in-vehicle interface hub 140 to achieve data interaction.

[0050] It can be understood that after the first system 120 enters the working state, data interaction occurs between the first system 120 and the second system 130, data interaction occurs between the second system 130 and the vehicle-mounted system 110, and the data interaction between the first system 120 and the vehicle-mounted system 110 is controlled to coordinate the work between the first system 120 and the second system 130, so as to complete the various functions of the first system 120 and the second system 130. The state of the first system 120 can also be monitored for troubleshooting and recovery, and even the core functions of the first system 120 can be realized, etc.

[0051] In one implementation, as Figure 2 shown, the second system 130 includes a temperature sensor 131 and a microcontroller 132. The temperature sensor 131 is connected to the microcontroller 132. The temperature sensor 131 is used to detect the ambient temperature and send the ambient temperature to the microcontroller 132; the microcontroller 132 is respectively connected to the first system 120 and the vehicle-mounted system 110 through the vehicle-mounted interface hub 140. Among them, the microcontroller 132 can be an MCU (Micro Control Unit).

[0052] It can be understood that when the vehicle starts, the microcontroller 132 starts. The microcontroller 132 will communicate with the vehicle-mounted system 110 through the vehicle-mounted interface hub 140 to achieve data interaction, and process the relevant data of the vehicle-mounted system 110 in real time. It will also control the data interaction between the first system 120 and the vehicle-mounted system 110 through the vehicle-mounted interface hub 140. The microcontroller 132 can also control the temperature sensor 131 to detect the ambient temperature, receive the ambient temperature sent by the temperature sensor 131, and control the on-off of the power switch unit 150 according to the ambient temperature, so as to control the power-on logic of the first system 120, and thus control the working state of the first system 120.

[0053] In one implementation, as Figure 3 shown, the first system 120 includes a central processor 121, a first communication interface 122, a second communication interface 123, a memory 124, and a function module 125. The central processor 121 is respectively connected to the first communication interface 122, the second communication interface 123, the memory 124, and the function module 125; the first communication interface 122 is connected to the vehicle-mounted interface hub 140, and the first communication interface 122 is used for data interaction between the first system 120 and the vehicle-mounted system 110; the second communication interface 123 is connected to the second system 130, and the second communication interface 123 is used for data interaction between the first system 120 and the second system 130. Among them, the central processor 121 is a CPU (central processing unit).

[0054] It can be understood that after the first system 120 is powered on, the second system 130 controls the communication between the first system 120 and the vehicle system 110 through the vehicle interface hub 140 via the first communication interface 122, and realizes the communication between the first system 120 and the second system 130 through the second communication interface 123.

[0055] In one embodiment, as Figure 3 shown, the vehicle system 110 includes a data interface 111 and a power supply 112. The power supply 112 is used to supply electrical energy to the first system 120 and / or the second system 130. The data interface 111 is respectively connected to the first system 120 and the second system 130 through the vehicle interface hub 140. The data interface 111 is used to realize the communication between the first system 120 and / or the second system 130.

[0056] It can be understood that after the vehicle starts, the second system 130 starts to work. When it is detected that the ambient temperature does not meet the preset conditions, the first system 120 does not enter the working state, and the power supply 112 only supplies electrical energy to the second system 130. At this time, the data interface 111 can realize the communication with the second system 130. When the detected ambient temperature meets the preset conditions, the second system 130 controls the first system 120 to start working, and the power supply 112 can supply electrical energy to the first system 120 and the second system 130. At this time, the data interface 111 can realize the communication with the first system 120 and the second system 130 respectively.

[0057] In this embodiment, by combining high-temperature-resistant electronic devices with electronic devices that can operate normally when reaching the temperature threshold, not only can the structure of the high-temperature-resistant electronic device 100 be made simpler, but also the range of selectable electronic devices can be expanded, thereby reducing the production cost of the high-temperature-resistant electronic device 100. And in this embodiment, the second system 130 detects the ambient temperature and controls the power-on logic of the first system 120 according to the ambient temperature. The second system 130 can monitor the current, temperature of the first system 120, and diagnose the internal state of the first system 120 in real time through communication, so as to ensure the normal operation of the first system 120 at high temperatures. In addition, when an abnormality or fault is found during the operation of the first system 120, the second system 130 can immediately take effective measures to eliminate and recover from the fault, and can also turn off the function of the first system 120 according to the actual situation and transfer the core function to the second system 130 to run, avoiding the influence of the fault of the first system 120 on the equipment operation.

[0058] Embodiment 2

[0059] As Figure 4 shown, a method for making an electronic device resistant to high temperatures is provided, which is applied to the second system 130. The method for making an electronic device resistant to high temperatures includes the following steps:

[0060] Step S100: After being powered by the vehicle-mounted system, detect the ambient temperature.

[0061] Step S200: Determine whether the ambient temperature meets the conditions.

[0062] Step S300: If the ambient temperature meets the conditions, control the power switch unit to enable the vehicle-mounted system to supply power to the first system, and then enable the first system to operate.

[0063] It can be understood that the method steps of this embodiment correspond to the corresponding functions of the high-temperature resistant electronic device 100 in the above embodiment. Among them, the optional items of the above high-temperature resistant electronic device 100 are also applicable to the method of this embodiment, and will not be described repeatedly here.

[0064] An embodiment of the present application also provides a terminal device, including a memory and a processor. The memory stores a computer program, and when the computer program runs on the processor, it executes the above-mentioned high-temperature resistant method for electronic devices.

[0065] An embodiment of the present application also provides a computer-readable storage medium, which stores a computer program. When the computer program is executed on a processor, it implements the above-mentioned high-temperature resistant method for electronic devices.

[0066] In several embodiments provided by the present application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely illustrative. For example, the flowcharts and structure diagrams in the drawings show the possible architectures, functions, and operations of devices, methods, and computer program products according to multiple embodiments of the present invention. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code, and the module, program segment, or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in an alternative implementation, the functions marked in the blocks may occur in a different order from that marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the structure diagram and / or flowchart, as well as the combination of blocks in the structure diagram and / or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.

[0067] In addition, in each embodiment of the present invention, each functional module or unit may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.

[0068] When the above-described functions are implemented in the form of software function modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art or a part of this technical solution can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a smart phone, a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in various embodiments of the present invention. The foregoing storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memories (ROMs), random access memories (RAMs), magnetic disks, or optical discs that can store program codes.

[0069] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered by the protection scope of the present invention.

Claims

1. A high-temperature resistant electronic device, characterized in that, Applied to in-vehicle devices, the high-temperature resistant electronic device includes a first system, a second system, and a power switch unit. The first system includes electronic components that operate at a preset temperature threshold, and the second system includes electronic components that operate at a temperature higher than the temperature threshold; The second system is respectively connected to the in-vehicle system of the in-vehicle device and the first system. The power supply terminal of the first system is connected to the in-vehicle system through the power switch unit, and the power switch unit is connected to the second system; After being powered by the in-vehicle system, the second system is configured to detect the ambient temperature, and when the ambient temperature meets the condition, control the switch of the power switch unit to close so that the in-vehicle system powers the first system, thereby enabling the first system to operate; It further includes: an in-vehicle interface hub; The second system is further configured to perform data interaction with the in-vehicle system through the in-vehicle interface hub, and control the in-vehicle system to establish a communication connection with the powered-on first system through the in-vehicle interface hub to achieve data interaction.

2. The high-temperature resistant electronic device according to claim 1, characterized in that, When the ambient temperature does not meet the condition, the second system is further configured to maintain a normal operating state and control the in-vehicle system to stop powering the first system.

3. The high-temperature resistant electronic device according to claim 1, characterized in that, After the first system is started, the second system is further configured to monitor the operating state of the first system, and when the first system exhibits an abnormal state, control the switch of the power switch unit to open to cut off the power supply to the first system.

4. The high-temperature resistant electronic device according to claim 1, characterized in that, The second system includes a temperature sensor and a microcontroller; The temperature sensor is connected to the microcontroller. The temperature sensor is configured to detect the ambient temperature and send the ambient temperature to the microcontroller; The microcontroller is respectively connected to the first system and the in-vehicle system through the in-vehicle interface hub.

5. The high-temperature resistant electronic device according to claim 1, characterized in that, The first system includes a central processing unit, a first communication interface, a second communication interface, a memory, and a functional module; The central processing unit is respectively connected to the first communication interface, the second communication interface, the memory, and the functional module; The first communication interface is connected to the in-vehicle interface hub. The first communication interface is used for data interaction between the first system and the in-vehicle system; The second communication interface is connected to the second system. The second communication interface is used for data interaction between the first system and the second system.

6. The high-temperature resistant electronic device according to claim 1, characterized in that, The condition is that the ambient temperature is less than the temperature threshold; The value range of the temperature threshold is 80°C - 110°C.

7. A method for making an electronic device high-temperature resistant, characterized in that, Applied to the second system in the high-temperature resistant electronic device according to any one of claims 1 - 6, The method includes: After being powered by the in-vehicle system, detect the ambient temperature; Judge whether the ambient temperature meets the condition; If the ambient temperature meets the condition, control the power switch unit so that the in-vehicle system powers the first system, thereby enabling the first system to operate; Perform data interaction with the in-vehicle system through the in-vehicle interface hub, and control the in-vehicle system to establish a communication connection with the powered-on first system through the in-vehicle interface hub to achieve data interaction.

8. A terminal device, characterized in that, It includes a memory and a processor. The memory stores a computer program which, when running on the processor, executes the method for the electronic device to withstand high temperatures as claimed in claim 7.

9. A readable storage medium, characterized in that, It stores a computer program which, when running on the processor, executes the method for the electronic device to withstand high temperatures as claimed in claim 7.

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