Covered antenna

Abstract

An antenna according to one embodiment of the present application includes a first radiating portion formed in a shape of a cover on a first surface of a printed circuit board, and a second radiating portion extending from one end of the first radiating portion through the printed circuit board to a second surface of the printed circuit board, wherein the second radiating portion includes a radiating pattern on the second surface of the printed circuit board, and the radiating pattern is spaced apart from a ground pattern formed inside the printed circuit board or on the first surface of the printed circuit board by a predetermined distance.

Description

Technical Field

[0001] This invention relates to an antenna, and more specifically, to a cap antenna including a capacitor-assisted pattern. Background Technology

[0002] When configuring a typical antenna, the length should be designed to be 1 / 4 of the wavelength. For example, for a 2.4 GHz frequency, considering the wavelength, the antenna cable length needs to be approximately 32 mm. Furthermore, a certain distance must be maintained from the ground wire (GND). In cases where small communication modules used for near-field communication require small antennas, the antenna should also be configured to a small size for miniaturization.

[0003] Conventional products adjust the length of the traces with PCB patterns, use large-sized chassis-type antennas, or use chip antennas. All of these methods are unsuitable for miniaturization, especially chip antennas, which also have cost disadvantages. Detailed Implementation

[0005] Technical issues

[0006] The technical problem to be solved by the present invention is to specifically provide a cap antenna including a capacitor-assisted pattern.

[0007] The problems of this invention are not limited to those described above, and those skilled in the art will clearly understand other unmentioned problems through the following description.

[0008] Technical solution

[0009] To solve the above-mentioned technical problems, the antenna according to an embodiment of the present invention includes: a first transmitting part formed in the shape of a cover on a first surface of a printed circuit board; and a second transmitting part extending from one end of the first transmitting part through the printed circuit board and extending to a second surface of the printed circuit board, wherein the second transmitting part includes a transmitting pattern located on the second surface of the printed circuit board, and the transmitting pattern is spaced as large a predetermined distance as possible from the first surface of the printed circuit board or a grounding pattern formed inside the printed circuit board.

[0010] In addition, a printed circuit board may include multiple layers, wherein a ground pattern may be formed on one of the multiple layers.

[0011] In addition, the printed circuit board may include multiple layers, wherein a ground line may not be formed between the emitter pattern and the ground pattern.

[0012] In addition, the transmitting pattern can be capacitively coupled with the ground pattern.

[0013] Furthermore, the frequency of the transmitted signal can be varied depending on the distance between the transmitted pattern and the ground pattern.

[0014] Furthermore, the frequency of the transmitted signal can be varied according to the length of the transmitted pattern.

[0015] In addition, the second transmitting unit may include a connecting part that connects to the transmitting unit on another plate on which the antenna is mounted.

[0016] Furthermore, in another board where the antenna is installed, a ground wire may not be formed in the direction of the transmission pattern.

[0017] In addition, the first transmitting unit may include: a power supply unit for receiving signals from the printed circuit board; and a grounding unit for connecting to the ground wire of the printed circuit board.

[0018] In addition, the first transmitter may include one or more support portions soldered onto the printed circuit board and supporting the first transmitter.

[0019] Furthermore, a ground wire may not be formed between the lower part of the support and the second surface of the printed circuit board.

[0020] Beneficial effects

[0021] According to embodiments of the invention, by designing a commonly used shielding portion as an antenna, the area of ​​a separate antenna design can be reduced, making it miniaturized and lowering costs. Furthermore, the antenna can be optimized by patterning signal lines with capacitors to maximize the emission effect and fine-tuning in the resonant point design. Additionally, supplementary modules can be used to insert additional auxiliary patterns into the application board, making it a structure that allows for fine-tuning even in various stacking and dielectric constant environments of various types of application PCBs.

[0022] This enables the realization of ultra-miniature chassis antenna integration modules, which improve efficiency through additional auxiliary patterns for antenna length and performance, and easily adjust and supplement resonant points that vary due to various application environments (i.e., equipment, metal, body, PCB stacking, dielectric constant, etc.).

[0023] The effects of the present invention are not limited to those illustrated above, and include many other effects in this specification. Attached Figure Description

[0024] Figure 1 This is a view showing an antenna according to an embodiment of the present invention.

[0025] Figure 2 This is a view showing an antenna mounted on another board according to an embodiment of the present invention.

[0026] Figures 3 to 9 This is a view used to illustrate an antenna according to an embodiment of the present invention. Detailed Implementation

[0027] Preferred embodiments of the invention will be described in detail below with reference to the accompanying drawings.

[0028] However, the technical concept of the present invention is not limited to the certain embodiments to be described, but can be implemented in various forms, and within the scope of the technical concept of the present invention, one or more of the constituent elements can be selectively combined or substituted among the embodiments.

[0029] Furthermore, unless explicitly defined and described, the terms (including technical and scientific terms) used in the embodiments of the present invention are to be understood in a general sense that can be understood by those skilled in the art, and common terms (such as terms defined in dictionaries) can be interpreted in the context of the relevant art.

[0030] Furthermore, the terminology used in this specification is for describing embodiments and is not intended to limit the invention.

[0031] In this specification, unless otherwise stated in the wording, the singular form may include the plural form, and when described as “at least one (or more than one) of A, B and C”, it may include one or more of all combinations that can be combined with A, B and C.

[0032] Furthermore, when describing components of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended only to distinguish components from other components, and they do not limit the nature, order, or sequence of the components.

[0033] Furthermore, when a component is described as being “connected,” “coupled,” or “interconnected” to another component, the component is not only directly connected, coupled, or interconnected to the other component, but may also include cases where it is “connected,” “coupled,” or “interconnected” to another component through another component between other components.

[0034] Furthermore, when described as being formed or arranged "above" or "below" each component, "above" or "below" means not only that the two components are in direct contact, but also that one or more other components are formed or arranged between the two components. Additionally, when expressed as "above" or "below," it can include not only an upward direction based on a component but also a downward direction based on a component.

[0035] Figure 1 This is a view showing an antenna according to an embodiment of the present invention.

[0036] The antenna according to an embodiment of the present invention includes a first transmitting part 110 and a second transmitting part 120.

[0037] The first transmitter 110 is formed in the form of a cover on the first surface 131 of the printed circuit board 130.

[0038] More specifically, the first transmitting part 110 is formed to cover the upper part of the printed circuit board 130 and transmit signals to the outside. Here, the printed circuit board 130 can be a system in a self-contained package (SIP) communication module, and can be a near-field wireless communication module, such as Bluetooth, Bluetooth Low Energy (BLE), and Wi-Fi. Furthermore, various communication modules can naturally be used. As a module for performing near-field wireless communication, it can be a small communication module. The first transmitting part 110 serves as a shield to protect the printed circuit board 130 while simultaneously transmitting signals. For this purpose, the first transmitting part 110 can be formed of metal. By being formed of metal, the printed circuit board 130 can be protected while simultaneously transmitting signals.

[0039] The first transmitting part 110 is spaced a predetermined distance from the first surface 131 of the printed circuit board 130 to form a cover shape covering the first surface of the printed circuit board 130. The first transmitting part 110 may include a power supply part 111 for receiving signals from the printed circuit board 130 for transmitting signals, and a grounding part 112 connected to the ground wire of the printed circuit board 130. When current is applied through the power supply part 111, a signal is input, and current applied to the grounding part is drawn out, but... Figure 2 As shown, the signal is transmitted through the first transmitting part 110, which is formed in a meander shape or a similar shape.

[0040] The first transmitter 110 may include one or more supports 113, 114, and 115 soldered to a printed circuit board 130 to support the first transmitter 110 and maintain the shape of the cover. Support 113 of the supports 113, 114, and 115 is connected to the second transmitter 120 (described later), while the other supports 114 and 115 are connected to the printed circuit board 130 by soldering and may be configured to be insulated from ground or other components.

[0041] The first transmitting section 110 is formed as a cover of the printed circuit board 130, thereby simultaneously performing the functions of a cover for the printed circuit board and transmitting signals. Since it does not require a structure for transmitting a single signal individually, miniaturization is advantageous. Furthermore, when forming the transmitting section, spatial constraints exist, meaning other components cannot be arranged within predetermined intervals to prevent them from interfering with transmission. By implementing the transmitting section as a cover of the printed circuit board 130, spatial constraints can be reduced, thereby increasing design freedom.

[0042] The second transmitter 120 extends from one end 113 of the first transmitter 110 through the printed circuit board 130 to the second surface 132 of the printed circuit board 130.

[0043] More specifically, the second transmitter 120 extends from the first transmitter 110 and is formed by passing through the printed circuit board 130 and extending to the second surface 132 of the printed circuit board 130. The second transmitter 120 may be formed by extending from one of the support portions 113, 114, and 115 of the first transmitter 110.

[0044] The second transmitting unit 120 may include a through portion 122 penetrating through the printed circuit board 130 and a transmitting pattern 121 formed on the second surface of the printed circuit board 130. The second transmitting unit 120 is electrically connected to the first transmitting unit 110, and the current applied to the first transmitting unit 110 also flows to the second transmitting unit 120, thereby transmitting a signal. The first transmitting unit 110 is formed on the first surface 131 of the printed circuit board 130, and the second transmitting unit 120 is formed on the second surface 132 of the printed circuit board 130, thereby realizing bidirectional transmission between the first transmitting unit 110 and the second transmitting unit 120. Bidirectional transmission can improve transmission efficiency and transmission directionality, thus improving transmission efficiency even in environments with limited transmission space.

[0045] The first transmitting part 110 is formed as a cover of the printed circuit board 130, and the length of the transmitting part 110, which can be implemented as the first transmitting part, is limited by the size of the printed circuit board 130. For example... Figure 2 As shown, even when the pattern is formed in a curved shape, the total length of the emitting portion is limited by area constraints. The second emitting portion 120 connects to the first emitting portion 110 and extends through the printed circuit board 130, thereby extending the total length of the emitting portion and resolving the length constraint. The second emitting portion 120 is implemented with the length of the through portion 122 penetrating the printed circuit board 130 (i.e., the thickness of the printed circuit board 130) and the length of the emitting pattern 121 formed on the second surface 132 of the printed circuit board 130, thus ensuring that the length of the entire emitting portion is the same as the length of the second emitting portion 120. The frequency of the emitted signal can vary depending on the length of the emitting pattern 121. The frequency of the emitted signal is affected by the total length of the emitting portion. Due to space constraints, the length of the first emitting portion 110 is difficult to adjust, while the length of the emitting pattern 121 is easily adjustable; therefore, the length of the emitting pattern 121 can be adjusted according to the design and the frequency of the signal to be emitted.

[0046] Furthermore, the transmitting pattern 121 is formed on the second surface 132 of the printed circuit board 130, and can be formed at a predetermined distance from the first surface 131 of the printed circuit board 130 or from the ground pattern 133 formed inside the printed circuit board 130. Since the transmitting pattern 121 is formed at a predetermined distance from the ground pattern 133, the transmitting pattern 121 and the ground pattern 133 can form capacitive coupling. The frequency of the transmitted signal varies with the resonant point of the transmitting section, and the resonant point of the transmitting section is affected by the inductive and capacitive components formed in the transmitting section. The transmitting pattern 121 and the ground pattern 133 form capacitive coupling, thereby adjusting the resonant point. Since the capacitance is affected by the distance and area of ​​the two patterns, the frequency of the transmitted signal can vary according to the distance between the transmitting pattern 121 and the ground pattern 133.

[0047] The ground pattern 133 can be formed on or inside the first surface 131 of the printed circuit board 130. Here, the ground pattern 133 can be a pattern connected to a ground line, which is formed to correspond to the emission pattern 121. Naturally, the ground pattern 133 can be formed in a shape corresponding to the emission pattern 121, or it can be formed in the form of a wide plate, and it can be formed in various other forms.

[0048] When the ground pattern 133 is formed on the first surface 131 of the printed circuit board 130, the printed circuit board 130 can be formed to have a predetermined thickness, and since the emission pattern 121 is formed on the second surface 132 of the printed circuit board 130, the emission pattern 121 and the ground pattern 133 can be formed to be separated by a distance equal to the thickness of the printed circuit board 130. That is, the frequency of the emitted signal can vary according to the thickness of the printed circuit board 130.

[0049] The ground pattern 133 can be formed inside the printed circuit board 130, rather than on the first surface 131 of the printed circuit board 130. In this case, the printed circuit board 130 includes multiple layers, and the ground pattern can be formed on one of the multiple layers. The printed circuit board 130 can be formed by stacking multiple printed circuit boards including multiple layers instead of a single printed circuit board, and the ground pattern 133 can be formed on one of the multiple layers. When the ground pattern 133 is formed on the uppermost layer of the printed circuit board 130, since the uppermost layer of the printed circuit board 130 corresponds to the first surface of the printed circuit board 130 and is printed thereon, it can be said that the ground pattern 133 is formed on the first surface 131 of the circuit board 130.

[0050] When the printed circuit board 130 is formed from multiple layers, a ground line may not be formed between the emitter pattern 121 and the ground pattern 133. The emitter pattern 121 and the ground pattern 133 are spaced apart and capacitively coupled. Since the capacitive coupling between the emitter pattern 121 and the ground pattern 133 is affected when a ground line is formed between them, a ground line may not be formed in the corresponding area of ​​the layer between the emitter pattern 121 and the ground pattern 133 to improve the design accuracy of the resonant point and the emission efficiency. The corresponding space can be left empty if other components such as signal lines other than ground lines are not formed. For example, as... Figure 1 As shown, the printed circuit board 130 is formed as four layers. The emission pattern 121 is formed on the second surface 132 of the printed circuit board 130, and when the ground pattern 133 is formed on the first surface 131 (i.e. the fourth layer) of the printed circuit board 130, the ground line may not be formed in the corresponding areas of the second and third layers.

[0051] As described above, the first transmitting section 110 and the second transmitting section 120 extending from the first transmitting section 110 can be represented as an equivalent circuit, such as... Figure 3 As shown. The entire transmitting section is connected to the power supply section 111 and the ground section 112. When only the first transmitting section is formed, there is a physically achievable length limitation in the total length L1 of the first transmitting section 110. For example, if the length of L1 required for signal transmission is 32 mm, even if it (the area covered by the printed circuit board 130) is designed as a curved shape within a 6x4 mm module space, only half the length (approximately 18 mm) can be achieved, making it difficult to achieve the desired frequency of the transmitted signal. However, the length of L1 can be extended by connecting the second transmitting section 120 to achieve the desired frequency of the transmitted signal, and the length of the transmitting section can also be extended by including the transmitting pattern 121, which is capacitively coupled to the ground pattern 133, so that the resonant point can be designed along with the capacitive component, and an improvement in transmission efficiency performance can be expected.

[0052] As described above, one or more support portions 113, 114, and 115 are formed in the first transmitting portion 110. When a ground line is formed at the lower portion of the support portions 114 and 115 that is not connected to the second transmitting portion 120, capacitive coupling can be achieved through the support portions 114 and 115 and the ground line at their lower portions. The resonant point can be adjusted by using the capacitive coupling formed by the support portions 114 and 115, or conversely, resonant point control using capacitive coupling can be achieved in the transmitting pattern 121, and the effect of capacitive coupling can be minimized in the support portions 114 and 115. For this purpose, a ground line may not be formed between the lower portion of the support portions 114 and 115 and the second surface 132 of the printed circuit board 130. By not forming a ground line between the lower portion of the support portions 114 and 115 and the second surface 132 of the printed circuit board 130, the capacitive coupling generated by the support portions 114 and 115 can be fixed, and the resonant point can be adjusted easily using the transmitting pattern 121.

[0053] When the printed circuit board 130 is formed of multiple layers, for example, when it is formed of four layers, each layer can be as follows: Figures 4 to 7 As shown in the diagram. Figure 4 As shown, the components required for the communication module can be formed on the first surface 131, that is, on the fourth layer of the printed circuit board 130 where the first transmitting part 110 is formed. Furthermore, a feed terminal 411 connected to the first transmitting part 110 and the feed part 111, and a ground terminal 412 connected to the ground part 112 are formed; regions 414 and 415 are formed where support parts 114 and 115 are soldered; and a region 413 connecting the first transmitting part 110 and the second transmitting part 120 can be formed. In the third and second layers, as... Figure 5 and Figure 6 As shown, through-holes can be formed in the layer. (As illustrated...) Figure 7 As shown, components required for the communication module are formed on the second surface 132 of the first layer (i.e., on the printed circuit board 130); and the through portion 713 of the second transmitting section 120 and the transmitting pattern 721 can be formed therein. The transmitting pattern 121 can be capacitively coupled to the ground pattern 510 formed in the third layer, such as... Figure 5 As shown, and a ground wire may not be formed on the second layer between the first and third layers, such as... Figure 6 As shown.

[0054] The antenna formed as described above can be installed Figure 2The second transmitter 120 is mounted on the application board 200 and functions as a communication module. In this case, the second transmitter 120 may include a connecting portion that connects to transmitters 201 and 202 on another board 200 on which an antenna is mounted. The second transmitter 120 does not terminate the total length of the transmitter in its transmission pattern 121, and may form a connecting portion that connects to transmitters 201 and 202 formed on the respective board 200, allowing the total length of the transmitter to extend within the other board 200 on which the antenna is mounted. When the antenna is mounted on the application board 200, the antenna's transmission characteristics may be affected by the characteristics of the application board 200. Therefore, the connecting portion can be provided to fine-tune the transmission characteristics according to the characteristics of the application board.

[0055] The transmitters 201 and 202 of the application board can be connected to the second transmitter 120, such as... Figure 8 As shown. The emitting portion of the application board may include a through portion 201 and an emitting pattern 202 that penetrates the application board. The emitting pattern 202 of the application board may be capacitively coupled to the ground pattern 133, and the emitting characteristics may be adjusted according to the shape of the emitting pattern 202 of the application board.

[0056] The shape of the printed circuit board for the antenna connected to the transmitting part of the application (board) can be as follows: Figure 9 The implementation is shown. The first transmitting part 110 is connected to the second transmitting part 120 that penetrates the first surface 131 of the printed circuit board 130, as shown. Figure 9 As shown in (a), the emission pattern 121 of the second emission section 120 is formed on the second surface of the printed circuit board 130, as follows. Figure 9 As shown in (b), the emitting section of the application board is connected to the emitting pattern of the second emitting section 120, as shown. Figure 9 As shown in (c), the emitting portion of the application board extends through the application board, and the emitting pattern can be formed on another surface, such as... Figure 9 As shown in (d), the emission characteristics can be easily adjusted.

[0057] When the antenna is mounted on the application board, the transmission of the second transmitting unit 120 may be affected by the configuration of the application board, since the application board is located in the transmission direction of the second transmitting unit 120. Therefore, in order to improve the transmission efficiency of the second transmitting unit 120, a ground wire may not be formed in the transmission direction of the transmission pattern on the other board on which the antenna is mounted.

[0058] This allows for the implementation of additional auxiliary patterns on the application board, enabling fine-tuning of the emission characteristics of various types of printed circuit boards constituting the application board, even in environments with varying stacking and dielectric constants. Therefore, the resonant point, which varies with the application environment (i.e., devices, metals, human body, PCB stacking, dielectric constant, etc.), can be easily tuned and adjusted.

[0059] As described above, the present invention has been described by way of specific examples, such as specific configuration elements and limited embodiments and drawings. However, these are merely to help to give a general understanding of the present invention. The present invention is not limited to the above embodiments. Those skilled in the art to which this invention pertains can make various modifications and variations to the position measuring unit based on such description.

[0060] Therefore, the spirit of this invention should not be limited to the described embodiments, not only to the claims described below, but also to any equivalents or modifications thereof that fall within the scope of this invention.

Claims

1. An antenna, comprising: The first transmitter is formed in the shape of a cover on the first surface of the printed circuit board; as well as The second transmitter extends from one end of the first transmitter through the printed circuit board and onto the second surface of the printed circuit board. The second emitting part includes an emitting pattern located on the second surface of the printed circuit board. The emission pattern is separated from the first surface of the printed circuit board or the grounding pattern formed inside the printed circuit board by a predetermined distance. The second transmitting unit includes a connecting portion that connects to a third transmitting unit on another plate on which the antenna is mounted, and The total length of the transmitter formed by the first transmitter, the second transmitter, and the third transmitter is set according to the lengths of the first transmitter, the second transmitter, and the third transmitter.

2. The antenna according to claim 1, in, The printed circuit board includes multiple layers, and The grounding pattern is formed on one of the multiple layers.

3. The antenna according to claim 1, in, The printed circuit board includes multiple layers, and No ground wire is formed between the emission pattern and the grounding pattern.

4. The antenna according to claim 1, in, The transmitting pattern is capacitively coupled to the grounding pattern.

5. The antenna according to claim 1, in, The frequency of the transmitted signal varies depending on the distance between the transmitted pattern and the grounded pattern.

6. The antenna according to claim 1, in, The frequency of the transmitted signal varies depending on the length of the transmitted pattern.

7. The antenna according to claim 1, in, In another plate on which the antenna is mounted, no ground wire is formed in the direction of the transmission pattern.

8. The antenna according to claim 1, in, The first transmitting unit includes: The power supply unit receives signals from the printed circuit board; and The grounding part is connected to the ground wire of the printed circuit board.

9. The antenna according to claim 1, in, The first transmitting unit includes: One or more support portions are soldered onto the printed circuit board and support the first transmitter.

10. The antenna according to claim 9, in, No ground wire is formed between the lower part of the support and the second surface of the printed circuit board.

11. The antenna according to claim 1, in, The other board includes an application board.

12. The antenna according to claim 1, in, The first emitting part is formed in a curved shape.

13. A communication module, comprising: Printed circuit boards; The first transmitter is formed in the shape of a cover on the first surface of the printed circuit board; as well as The second transmitter extends from one end of the first transmitter through the printed circuit board and onto the second surface of the printed circuit board. The second emitting part includes an emitting pattern located on the second surface of the printed circuit board. The emission pattern is separated from the first surface of the printed circuit board or the grounding pattern formed inside the printed circuit board by a predetermined distance. The second transmitting unit includes a connecting part that connects to a third transmitting unit on another plate on which an antenna is mounted, and The total length of the transmitter formed by the first transmitter, the second transmitter, and the third transmitter is set according to the lengths of the first transmitter, the second transmitter, and the third transmitter.

14. The communication module according to claim 13, in, The printed circuit board includes multiple layers, and The grounding pattern is formed on one of the multiple layers.

15. The communication module according to claim 13, in, The printed circuit board includes multiple layers, and No ground wire is formed between the emission pattern and the grounding pattern.

16. The communication module according to claim 13, in, The transmitting pattern is capacitively coupled to the grounding pattern.

17. The communication module according to claim 13, in, The frequency of the transmitted signal varies depending on the distance between the transmitted pattern and the grounded pattern.

18. The communication module according to claim 13, in, The frequency of the transmitted signal varies depending on the length of the transmitted pattern.

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