Fuse current test board, system, method and apparatus for bonding materials

Abstract

The application relates to a bonding material fusing current test board, system, method and device, the bonding material fusing current test board is provided with m first bonding points and n second bonding points, the first end of the bonding material is bonded with a first bonding point, the second end of the bonding material is bonded with a second bonding point, the first bonding point connected with the first end is connected with the first output end of a power supply module, the second bonding point connected with the second end is connected with the second output end of the power supply module, and the fusing current of the bonding material is tested according to the power supply voltage output by the power supply module. The bonding material fusing current test board provided by the application can solve the clamping damage and clamping deformation problems of the clamping test method on the bonding material by bonding the bonding material on the fusing current test board in a bonding mode, the test result is accurate and closer to the actual fusing current in the actual use state of the bonding material.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of power electronics, in particular to a bonding material fusing current test board, system, method and device. BACKGROUND

[0002] With the rapid development of the semiconductor industry, electronic products are increasingly developing towards miniaturization, and the reliability requirements for internal integrated circuits and components, chips and connections between chips and external devices are increasingly high, so the requirements for bonding materials are also increasing. Fusing current is an important electrochemical property of bonding materials. Fusing current refers to the maximum current that can be passed through the bonding material when it is fused. Detecting the fusing current of the bonding material is of great significance to its applicability, service reliability and failure evaluation.

[0003] The current bonding material fusing current test method is generally as follows: the two ends of the bonding material sample are clamped by a fixed clamp such as a locking nut, a mechanical clamp, an electromagnetic clamp, a pneumatic clamp, etc., and an adjustable constant current DC power supply is used to supply power to the bonding material sample. The current is gradually increased from low current, and the bonding material sample is fused until the current value at the moment of fusing of the bonding material sample is obtained as the fusing current of the sample.

[0004] However, after using the clamp to clamp the bonding material sample, the bonding material sample will be damaged or plastically deformed, which can easily cause the bonding material sample to fuse at the clamped end, thereby causing poor accuracy of the tested fusing current. SUMMARY

[0005] Therefore, it is necessary to provide a bonding material fusing current test board, system, method and device capable of improving the accuracy of testing the fusing current of the bonding material.

[0006] In a first aspect, the present application provides a bonding material fusing current test board, wherein m first bonding points and n second bonding points are arranged on the fusing current test board, the positions of the first bonding points and the positions of the second bonding points are set according to test requirements, wherein m and n are integers greater than or equal to 1.

[0007] The first end of the bonding material is bonded to one of the first bonding points, and the second end of the bonding material is bonded to one of the second bonding points. The first bonding point connected to the first end is connected to the first output end of a power supply module, and the second bonding point connected to the second end is connected to the second output end of the power supply module. The power supply module is used to output a power supply voltage, and the fusing current of the bonding material is tested according to the power supply voltage output by the power supply module.

[0008] In one of the embodiments, the fuse current test board is provided with i first wire holes, j second wire holes, first connecting pieces corresponding to the i first wire holes one by one, and second connecting pieces corresponding to the j second wire holes one by one, i and j are integers greater than or equal to 1.

[0009] The first connecting pieces pass through the corresponding first wire holes, the first ends of the first connecting pieces passing through the first wire holes are connected with the first fixing pieces, and the second ends of the first connecting pieces passing through the first wire holes are connected with the first output end.

[0010] The second connecting pieces pass through the corresponding second wire holes, the first ends of the second connecting pieces passing through the second wire holes are connected with the second fixing pieces, and the second ends of the second connecting pieces passing through the second wire holes are connected with the second output end.

[0011] In one of the embodiments, the number of the first wire holes is equal to the number of the first bonding points, and the number of the second wire holes is equal to the number of the second bonding points.

[0012] In one of the embodiments, a plurality of first bonding points in the m first bonding points correspond to one first wire hole in the i first wire holes, and a plurality of second bonding points in the n second bonding points correspond to one second wire hole in the j second wire holes.

[0013] In one of the embodiments, the fuse current test board is provided with a first lead wire, a first metal electrode surrounding the first wire hole, a second lead wire, and a second metal electrode surrounding the second wire hole.

[0014] The first end of the first lead wire is connected with the first bonding point, and the second end of the first lead wire is connected with the first metal electrode.

[0015] The first end of the second lead wire is connected with the second bonding point, and the second end of the second lead wire is connected with the second metal electrode.

[0016] In one of the embodiments, the fuse current test board is provided with a limiting hole for fixing the fuse current test board on a base.

[0017] In a second aspect, the application further provides a fuse current test system of a bonding material. The fuse current test system comprises a power supply module, a control module, and the fuse current test board as described above, the control module is connected with the power supply module, and the power supply module is connected with the first bonding points and the second bonding points on the fuse current test board.

[0018] In a third aspect, the application further provides a method for testing the fusing current of a bonding material, the method being applied to the fusing current testing system of the second aspect, and the method comprising:

[0019] The control module sends a control signal to the power supply module.

[0020] The power supply module controls the size of the current output to the fusing current testing board according to the control signal, so as to test the fusing current of the bonding material.

[0021] In one of the embodiments, the method further comprises:

[0022] According to the testing requirement, the bonding material is bonded to the fusing current testing board.

[0023] In one of the embodiments, the testing requirement comprises a bonding process and a testing state of the bonding material.

[0024] In a fourth aspect, the application further provides a device for testing the fusing current of a bonding material, the device comprising:

[0025] A sending module is configured to send a control signal from the control module to the power supply module.

[0026] A control module is configured to control the size of the current output to the fusing current testing board according to the control signal, so as to test the fusing current of the bonding material.

[0027] In a fifth aspect, the application further provides a computer device, which comprises a memory and a processor, the memory stores a computer program, and the processor implements the steps of the method of any one of the above embodiments when executing the computer program.

[0028] In a sixth aspect, the application further provides a computer readable storage medium, which stores a computer program, and the computer program implements the steps of the method of any one of the above embodiments when executed by a processor.

[0029] In a seventh aspect, the application further provides a computer program product, which comprises a computer program, and the computer program implements the steps of the method of any one of the above embodiments when executed by a processor.

[0030] The above-mentioned bonding material fusing current test board, system, method and device, the fusing current test board is provided with m first bonding points and n second bonding points, the position of each first bonding point and the position of each second bonding point are set according to test requirements, wherein m and n are integers greater than or equal to 1;The first end of the bonding material is bonded with a first bonding point, and the second end of the bonding material is bonded with a second bonding point, the first bonding point connected with the first end is connected with the first output end of the power supply module, and the second bonding point connected with the second end is connected with the second output end of the power supply module, for testing the fusing current of the bonding material according to the power supply voltage output by the power supply module.The fusing current test board of the bonding material provided in the application can simulate the actual use state of the bonding material by bonding the bonding material on the fusing current test board, solve the clamping damage, clamping deformation and tensile deformation of the bonding material test sample in the test process of the existing test technology, and make the measured fusing current closer to the fusing current in the actual use state. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 A bonding diagram of the bonding material in one embodiment;

[0032] Figure 2 A first structure diagram of the fusing current test board of the bonding material in one embodiment;

[0033] Figure 3 A diagram of the bonding tape in one embodiment;

[0034] Figure 4 A diagram of the bonding wire in one embodiment;

[0035] Figure 5 A second structure diagram of the fusing current test board of the bonding material in one embodiment;

[0036] Figure 6 A third structure diagram of the fusing current test board of the bonding material in one embodiment;

[0037] Figure 7 A fourth structure diagram of the fusing current test board of the bonding material in one embodiment;

[0038] Figure 8 A fifth structure diagram of the fusing current test board of the bonding material in one embodiment;

[0039] Figure 9 A fusing current test system diagram of the bonding material in one embodiment;

[0040] Figure 10 A fusing current test method diagram of the bonding material in one embodiment;

[0041] Figure 11 A structure block diagram of a fuse current test device of a bonding material in an embodiment;

[0042] Figure 12 An internal structure diagram of a computer device in an embodiment.

[0043] Explanation of reference signs:

[0044] 100, fuse current test board; 101, first bonding point; 102, second bonding point;

[0045] 103, bonding material; 200, power supply module; 104, first wiring hole;

[0046] 105, second wiring hole; 201, first output end; 202, second output end;

[0047] 106, first lead wire; 107, first metal electrode; 108, second lead wire;

[0048] 109, second metal electrode; 110, limiting hole; 300, base;

[0049] 400, control module. DETAILED DESCRIPTION

[0050] In order to make the purpose, technical scheme and advantages of the present application clearer, further detailed description will be given in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0051] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0052] In the present application, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0053] In the present application, unless specifically defined otherwise, the terms "mounting", "connected", "connecting", "fixed", and "fixedly" are to be construed as broad terms, for example, they can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be direct connection, or indirect connection through intermediate medium; can be internal communication of two elements, or interaction relationship between two elements, unless specifically defined otherwise. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0054] In the present application, unless specifically defined otherwise, the first feature is "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0055] It should be noted that when an element is referred to as "fixed to" or "provided on" another element, it can be directly on the other element or there can be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there can be a middle element. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are for illustrative purposes only and are not the only implementation.

[0056] The bonding wire / bonding ribbon is a kind of metal wire for realizing circuit connection inside the chip and between the chip and external devices, mainly applied in the fields of semiconductor discrete devices, integrated circuits and components. The maximum current that can be passed by the fuse current guide line when the fuse is blown, and the fuse characteristics of the bonding wire / bonding ribbon are closely related to its use safety, reliability and service life. Under the condition that the wire material is certain, its fuse current performance is determined by the cross-sectional area and length. In the case of a certain cross-sectional area, the longer the wire length, the greater the resistance, and the smaller the fuse current; in the case of a certain wire length, the larger the cross-sectional area, the smaller the resistance, and the larger the fuse current. Therefore, detecting the fuse current of the bonding wire / bonding ribbon is of great significance to its applicability, service reliability and failure evaluation.

[0057] The common test method for the melting current of the bonding material in the prior art is a clamping type test method and a contact type test method. The specific test operation of the clamping type test method is as follows: a bonding material test sample with a certain length is selected, a fixed clamp such as a locking nut, a mechanical clamp, an electromagnetic clamp, a pneumatic clamp, etc. is used to clamp both ends of the sample, an adjustable constant current DC power supply is connected, the current is gradually increased from a low current, and the sample is melted until the melting current value at the moment of melting is obtained. The specific test operation of the contact type test method is as follows: a bonding material test sample with a certain length is selected, a fixed clamp is used to clamp both ends of the bonding material test sample, the sample is straightened, the output end of an adjustable constant current DC power supply is placed in the middle of the bonding material test sample through two electrical contacts and contacts the bonding material test sample, the current is gradually increased from a low current, and the sample is melted until the melting current value at the moment of melting is obtained. The part tested is the bonding material sample between the two electrical contacts.

[0058] In the clamping type test method, a locking nut, a mechanical clamp, an electromagnetic clamp, a pneumatic clamp, etc. are used to clamp both ends of the bonding material test sample. When the clamp is clamped, a certain degree of clamping deformation will be generated on the bonding material test sample. The clamping deformation leads to a decrease in the cross-sectional area of the bonding material test sample, which causes the bonding material test sample to be melted at the clamped end during the test. Therefore, the test result is invalid, and reducing the clamping force of the clamp will cause poor contact. Especially for bonding materials with soft materials such as bonding wires and bonding ribbons. In the contact type test method, the electrical contacts and the bonding material test sample are in point contact, and the contact area is small. In order to ensure that the electrical contacts and the bonding material test sample are in close contact, the clamp at both ends of the bonding material test sample needs to tension the bonding material test sample. At this time, there will be tension in the bonding material test sample, which causes the bonding material test sample to be plastically deformed along the stretching direction and the cross-sectional area to be small, resulting in a decrease in the melting current value of the bonding material test sample and low test accuracy. Therefore, the above test methods have low test accuracy for soft bonding material samples such as bonding wires and bonding ribbons. The test results of the prior art are affected by factors such as the clamping force of the clamp and the tensioning force of the clamp, and the test results are not accurate.

[0059] In addition, the conventional clamping type test method and the contact type test method are usually used to test the melting current of the bonding material sample in a straightened state after clamping both ends of the bonding material sample. However, the bonding material is actually used in a state of a certain arc, as shown in FIG. 1, Figure 1 as shown in FIG. 2, Figure 1 which is a bonding diagram of the bonding material, wherein, Figure 1The middle curved part (No. 1) is a bonding wire, which presents a certain arc. It is found that the fuse current of the sample is different in the straight state and the state of a certain bending arc (the height of the pull arc formed by the bonding process). Specifically, when the fuse current test is performed, the current through the bonding material causes the temperature of the bonding material to rise, the resistance to increase, and then the Joule heat to be generated in the bonding material. Due to the existence of the Joule heat, the bonding material is finally fused. Before the bonding material is fused, the Joule heat generated by the current is partially transferred to the surrounding environment in the form of heat convection and heat radiation, which delays the fusion of the bonding material. The heat transfer of the test sample is different in the straight state and the curved state, so that the fuse current of the sample in the two states (straight, curved) is different. Therefore, the conventional test result cannot represent the actual fuse current of the bonding material in actual packaging use. That is, the conventional test can only test the fuse current of the bonding material in the straight state, but cannot test the fuse current of the bonding material in the actual packaging bonding state. Therefore, the present application provides a fuse current test board, system, method and device of a bonding material, which can improve the accuracy of testing the fuse current of the bonding material.

[0060] Reference Figure 2 , Figure 2 is a first structural schematic diagram of a fuse current test board of a bonding material provided by the embodiments of the present application. The fuse current test board 100 is provided with m first bonding points 101 and n second bonding points 102. The positions of the first bonding points 101 and the positions of the second bonding points 102 are set according to test requirements, wherein m and n are integers greater than or equal to 1. A first end of the bonding material 103 is bonded to a first bonding point 101, and a second end of the bonding material 103 is bonded to a second bonding point 102. The first bonding point 101 connected to the first end is connected to a first output end of a power supply module 200, and the second bonding point 102 connected to the second end is connected to a second output end of the power supply module 200, for testing the fuse current of the bonding material 103 according to the power supply voltage output by the power supply module 200.

[0061] Optionally, the fuse current test board can be a chip.

[0062] Optionally, as shown in Figure 3 and Figure 4 , the bonding material 103 between the m first bonding points 101 and the n second bonding points 102 can be a bonding wire / bonding ribbon, etc. Figure 3 is a schematic diagram of a bonding ribbon, Figure 4 is a schematic diagram of a bonding wire, which can be the same bonding material or different bonding materials.

[0063] Optionally, the power supply module 200 can be an oscilloscope for supplying power to the fuse current test board 100, or an inductive AC stabilizer, etc.

[0064] In the embodiment, the first end of the bonding material 103 can be bonded to a first bonding point 101 by using a ball bonding process or a wedge bonding process. After the first end is bonded, the second end of the bonding material 103 is bonded to a second bonding point 102. The first bonding point 101 and the second bonding point 102 are respectively connected to two ends of the power supply module 200 to form a loop.

[0065] In the embodiment, when the length of the bonding material 103 is fixed, the distance between the first bonding point 101 and the second bonding point 102 can be controlled according to actual requirements, so as to control the arc height of the bonding material 103. Alternatively, the distances between the plurality of first bonding points 101 and the plurality of second bonding points 102 can be the same or different. When the distances between the plurality of first bonding points 101 and the plurality of second bonding points 102 are different, the bonding material 103 has different arc heights between the first bonding point 101 and the second bonding point 102, which can be used to simulate or study the optimal bonding arc height of the bonding material 103.

[0066] In the embodiment, in addition to the above-mentioned method of making different bonding point distances on the fuse current test board to make the bonding material 103 form different arc heights required by the test, the bonding material can also be bonded by different bonding processes, and the influence of different bonding processes on the fuse current of the bonding material can be measured.

[0067] The fuse current test board for the bonding material provided in the embodiment is provided with m first bonding points and n second bonding points. The positions of the first bonding points and the positions of the second bonding points are set according to test requirements, wherein m and n are integers greater than or equal to 1. The first end of the bonding material is bonded to a first bonding point, and the second end of the bonding material is bonded to a second bonding point. The first bonding point connected to the first end is connected to the first output end of the power supply module, and the second bonding point connected to the second end is connected to the second output end of the power supply module, which is used to test the fuse current of the bonding material according to the power supply voltage output by the power supply module. The fuse current test board for the bonding material provided in the application can simulate the actual use state of the bonding material by bonding the bonding material on the fuse current test board by using the bonding method, so that the bonding material presents a certain arc height. The problems of clamping damage, clamping deformation and tensile deformation of the bonding material test sample in the test process of the existing test technology are solved, so that the measured fuse current is closer to the fuse current in the actual use state.

[0068] Figure 5 FIG. 2 is a second structural schematic view of the fuse current test board for the bonding material provided in an embodiment, Figure 5As shown, the fuse current test board 100 is provided with i first wire holes 104, j second wire holes 105, a first connecting piece corresponding to each of the i first wire holes 104, and a second connecting piece corresponding to each of the j second wire holes 105, i and j are integers greater than or equal to 1; the first connecting piece passes through the corresponding first wire hole 104, the first end of the first connecting piece passing through the first wire hole 104 is connected with the first fixing piece, and the second end of the first connecting piece passing through the first wire hole 104 is connected with the first output end 201; the second connecting piece passes through the corresponding second wire hole 105, the first end of the second connecting piece passing through the second wire hole 105 is connected with the second fixing piece, and the second end of the second connecting piece passing through the second wire hole 105 is connected with the second output end 202.

[0069] Optionally, the fuse current test board 100 can be provided with 1 first wire hole 104, 1 second wire hole 105, 1 first wire hole 104 and multiple second wire holes 105, or multiple first wire holes 104 and multiple second wire holes 105 at the same time.

[0070] Optionally, the first connecting piece and the second connecting piece can be a screw or a wire column.

[0071] Optionally, the first fixing piece and the second fixing piece can be a nut.

[0072] Optionally, the first output end 201 and the second output end 202 are respectively two ends of the power supply module 200.

[0073] In this embodiment, for the first wire hole 104, it is assumed that the first connecting piece is a screw and the first fixing piece is a nut. The screw passes through the corresponding first wire hole 104, the lower end of the screw (i.e. the first end of the first connecting piece) is connected with the nut, and the head of the screw (i.e. the second end of the first connecting piece) is connected with the first output end 201, so as to lock the wire output by the first output end 201 of the power supply module with the first wire hole 104 of the fuse current test board 100 by using the screw and the nut.

[0074] In one embodiment, the number of first wire holes of the fuse current test board of the bonding material, the number of first bonding points, and the number of second wire holes are equal to the number of second bonding points, which can satisfy the following two relationships.

[0075] The first relationship is as shown in the following formula: Figure 6 As shown, the number of first wire holes 104 is equal to the number of first bonding points 101, and the number of second wire holes 105 is equal to the number of second bonding points 102.

[0076] In the embodiment, the number of the first wire holes 104 is equal to the number of the first bonding points 101, the number of the second wire holes 105 is equal to the number of the second bonding points 102, the first wire holes 104 correspond to the first bonding points 101 one by one, and the second wire holes 105 correspond to the second bonding points 102 one by one, so that a plurality of power supply modules can be used to simultaneously test a plurality of bonding material test samples, and the test of a bonding material test sample does not affect other bonding material test samples.

[0077] The second relationship is as follows: Figure 5 The bonding material fusing current test board includes a plurality of the first bonding points 101 corresponding to one of the first wire holes 104 and a plurality of the second bonding points 102 corresponding to one of the second wire holes 105.

[0078] In the embodiment, the bonding material fusing current test board 100 includes i first wire holes 104, one of the i first wire holes 104 is selected as a first target wire hole, the first target wire hole corresponds to the m first bonding points 101, the remaining first wire holes 104 can also correspond to the m first bonding points 101 respectively, or the remaining first wire holes 104 can also correspond to one first bonding point 101, and there can be various combinations, which are not limited in the embodiment. Similarly, one of the j second wire holes 105 can be selected as a second target wire hole, and the second target wire hole corresponds to the n second bonding points 102, so that one power supply module can be used to simultaneously test a plurality of bonding material test samples, and the test efficiency of the bonding material test samples is improved.

[0079] Figure 7 FIG. 4 is a fourth structural schematic view of the bonding material fusing current test board provided in an embodiment. The fusing current test board 100 is provided with a first lead wire 106, a first metal electrode 107 surrounding the first wire hole 104, a second lead wire 108, and a second metal electrode 109 surrounding the second wire hole 105. The first end of the first lead wire 106 is connected to the first bonding point 101, and the second end of the first lead wire 106 is connected to the first metal electrode 107. The first end of the second lead wire 108 is connected to the second bonding point 102, and the second end of the second lead wire 108 is connected to the second metal electrode 109.

[0080] Optionally, the first metal electrode 107 and the second metal electrode 109 can be copper-clad surfaces or gold-plated surfaces, as long as they can meet the conductivity requirements.

[0081] Figure 8Fig. 5 is a fifth structural schematic diagram of a bonding material fusing current test board provided in an embodiment, as shown in the figure, a limiting hole 110 is arranged on the bonding material fusing current test board 100, and the limiting hole 110 is used for fixing the bonding material fusing current test board 100 on a base 300. Figure 8

[0082] Optionally, the base can be a PC board, a flexible circuit board or the like, and the material of the base is not limited.

[0083] In the embodiment, the base 300 is a bottom plate of the bonding material fusing current test board 100, the base 300 has four fixed limiting studs for fixing the bonding material fusing current test board 100, the bonding material fusing current test board 100 has four limiting holes 110 corresponding to the limiting studs of the base, and the bonding material fusing current test board 100 can be fixed on the base 300 through the limiting holes 110 arranged on the bonding material fusing current test board 100 according to test requirements.

[0084] Figure 9 Fig. 1 is a bonding material fusing current test system provided in an embodiment, as shown in the figure, the bonding material fusing current test system includes a power supply module 200, a control module 400 and a bonding material fusing current test board 100 provided in any one of the above embodiments. Figure 7

[0085] In the embodiment, the control module 400 is connected with the power supply module 200, the first output end 201 of the power supply module can be connected with the first metal electrode 107 in a clamping or contacting manner, the second output end 202 of the power supply module can be connected with the second metal electrode 109 in a clamping or contacting manner, so that the power supply module 200 is connected with the first bonding point 101 and the second bonding point 102 on the bonding material fusing current test board 100. The power supply module 200 is connected with the bonding material fusing current test board 100 in a clamping or contacting manner, and does not contact the bonding material test sample itself, so that other connection manners can be selected when the power supply module 200 is connected with the bonding material fusing current test board 100, and the connection manner is not limited.

[0086] Optionally, the control module 400 can be a control module of a central processing unit (CPU), a field-programmable gate array (FPGA), a digital signal processing (DSP), a single-chip microcomputer or the like. ​​

[0087] In one embodiment, as shown in Figure 10 , Figure 10 is a flowchart of a method for testing the fusing current of a bonding material provided by an embodiment of the present application, comprising the following steps:

[0088] S1001, the control module sends a control signal to the power supply module.

[0089] S1002, the power supply module controls the size of the current output to the fusing current test board according to the control signal to test the fusing current of the bonding material.

[0090] In this embodiment, the power supply module controls the size of the current output to the fusing current test board according to the control signal until the bonding material fuses, and records the output current value at the moment of fusing, which is the test result of the fusing current of the bonding material.

[0091] In this embodiment, the control module sends a control signal to the power supply module, and the power supply module controls the size of the current output to the fusing current test board according to the control signal to test the fusing current of the bonding material. By changing the control signal, the size of the current output by the power supply module is changed, thereby realizing the test of the fusing current of the bonding material. Since the bonding material is connected in a bonding manner in actual use, the actual use state of the bonding material can be simulated, and the problems of clamping damage, clamping deformation, and tensile deformation of the bonding material test sample in the test process of the existing test technology are solved, so that the measured fusing current is closer to the fusing current in the actual use state. Moreover, the test steps of the method are simple, easy to operate, and high in test efficiency, and have great application prospect and promotional significance.

[0092] In one embodiment, the bonding material is bonded to the fusing current test board according to the test requirements.

[0093] The test requirements include the bonding process and the test state of the bonding material.

[0094] Specifically, the bonding process includes using a spherical bonding process or a wedge-shaped bonding process, etc.; and the test state is to simulate the actual on-load use requirements during the test, i.e., to control the bonding material to present a certain arc height.

[0095] It should be understood that although the steps in the flowcharts involved in the embodiments described above are shown in sequence according to the arrows, the steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, the execution of the steps is not strictly limited in sequence, and the steps can be executed in other orders. Moreover, at least some of the steps in the flowcharts involved in the embodiments described above can include multiple steps or multiple stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution order of the steps or stages is not necessarily sequential, but can be alternately or alternately executed with at least part of other steps or steps or stages in other steps.

[0096] Based on the same inventive concept, the embodiments of the present application also provide a bonding material fusing current test device for implementing the bonding material fusing current test method described above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme described in the above method, so the specific limitations in one or more bonding material fusing current test device embodiments provided below can refer to the limitations of the bonding material fusing current test method described above, and will not be repeated here.

[0097] In one embodiment, as shown in Figure 11 A bonding material fusing current test device is provided, comprising: a sending module 11 and a control module 12, wherein:

[0098] The sending module 11 is configured to send a control signal to the power supply module;

[0099] The control module 12 is configured to control the size of the current output to the fusing current test board according to the control signal to test the fusing current of the bonding material.

[0100] In one embodiment, the device further comprises:

[0101] A bonding module is configured to bond the bonding material to the fusing current test board according to the test requirement.

[0102] In one embodiment, the test requirement includes a bonding process and a test state of the bonding material.

[0103] The modules in the bonding material fusing current test device described above can be all or partially implemented by software, hardware, and combinations thereof. The modules described above can be embedded in or independent of the processor in the computer device in hardware form, or can be stored in the memory in the computer device in software form, so as to be called and executed by the processor to perform the operations corresponding to the above modules.

[0104] In one embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 12 As shown, the computer device includes a processor, memory, and a network interface connected via a system bus. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The database stores circuit experiment data. The network interface communicates with external terminals via a network connection. When executed by the processor, the computer program implements a method for testing the fusible current of bonded materials.

[0105] Those skilled in the art will understand that Figure 12 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0106] In one embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0107] The control module sends control signals to the power supply module;

[0108] The power supply module controls the current output to the fusing current test board according to the control signal, so as to test the fusing current of the bonding material.

[0109] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0110] According to the testing requirements, the bonding material is bonded to the fusible current test board.

[0111] In one embodiment, testing requirements include the testing status of the bonding process and the bonding materials.

[0112] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program performing the following steps when executed by a processor:

[0113] The control module sends control signals to the power supply module;

[0114] The power supply module controls the current output to the fusing current test board according to the control signal, so as to test the fusing current of the bonding material.

[0115] In one embodiment, the computer program, which is executed by the processor, further implements the following steps:

[0116] According to the test requirement, the bonding material is bonded to the fuse current test plate.

[0117] In one embodiment, the test requirement includes a test state of the bonding process and the bonding material.

[0118] In one embodiment, a computer program product is provided, comprising a computer program which, when executed by the processor, implements the following steps:

[0119] The control module sends a control signal to the power supply module;

[0120] The power supply module controls the size of the current output to the fuse current test plate according to the control signal to test the fuse current of the bonding material.

[0121] In one embodiment, the computer program, which is executed by the processor, further implements the following steps:

[0122] According to the test requirement, the bonding material is bonded to the fuse current test plate.

[0123] In one embodiment, the test requirement includes a test state of the bonding process and the bonding material.

[0124] It should be noted that the user information (including but not limited to user equipment information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) involved in the present application are all information and data authorized by the user or authorized by all parties.

[0125] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer readable storage medium, and when the computer program is executed, the processes of the above-mentioned embodiments of the methods can be included. Any reference to memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (Read-Only Memory, ROM), magnetic tape, floppy disk, flash memory, optical storage, high-density embedded non-volatile memory, resistive memory (ReRAM), magnetoresistive random access memory (Magnetoresistive Random Access Memory, MRAM), ferroelectric memory (Ferroelectric Random Access Memory, FRAM), phase change memory (Phase Change Memory, PCM), graphene memory, etc. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory, etc. As an illustration but not limitation, RAM can be in various forms, such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), etc. The database involved in the embodiments provided in the present application can include at least one of a relational database and a non-relational database. The non-relational database can include a distributed database based on a block chain, etc., without being limited thereto. The processor involved in the embodiments provided in the present application can be a general-purpose processor, a central processing unit, a graphics processing unit, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., without being limited thereto.

[0126] Any combination of the technical features of the above embodiments can be made. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combination of the technical features does not exist contradictory, it should be considered as the scope of the present application.

[0127] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent of the present application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A fused current test board for bonding material, characterized by, The fuse current test board is provided with m first bonding points and n second bonding points, the positions of each first bonding point and each second bonding point are set according to test requirements, wherein m and n are integers greater than or equal to 1; A first end of the bonding material is bonded to a first bonding point, and a second end of the bonding material is bonded to a second bonding point, the first bonding point connected to the first end is connected to a first output end of a power supply module, and the second bonding point connected to the second end is connected to a second output end of the power supply module; The power supply module is used for controlling the current output from the fuse current test board according to a control signal sent by a control module, so as to take the current value output from the power supply module when the bonding material is fused as the fuse current of the bonding material.

2. The fusing current test board of claim 1, wherein, The fuse current test board is provided with i first wiring holes, j second wiring holes, a first connecting piece corresponding to each of the i first wiring holes, and a second connecting piece corresponding to each of the j second wiring holes, i and j are integers greater than or equal to 1; The first connecting piece passes through the corresponding first wiring hole, a first end of the first connecting piece passing through the first wiring hole is connected to a first fixing piece, and a second end of the first connecting piece passing through the first wiring hole is connected to the first output end; The second connecting piece passes through the corresponding second wiring hole, a first end of the second connecting piece passing through the second wiring hole is connected to a second fixing piece, and a second end of the second connecting piece passing through the second wiring hole is connected to the second output end.

3. The fused current test board of claim 2, wherein, The number of the first wiring holes is equal to the number of the first bonding points, and the number of the second wiring holes is equal to the number of the second bonding points.

4. The fused current test board of claim 2, wherein, A plurality of first bonding points in the m first bonding points correspond to one first wiring hole in the i first wiring holes, and a plurality of second bonding points in the n second bonding points correspond to one second wiring hole in the j second wiring holes.

5. The fusing current test panel of any of claims 2-4, wherein, The fuse current test board is provided with a first lead wire, a first metal electrode arranged around the first wiring hole, a second lead wire, and a second metal electrode arranged around the second wiring hole; A first end of the first lead wire is connected to the first bonding point, and a second end of the first lead wire is connected to the first metal electrode; A first end of the second lead wire is connected to the second bonding point, and a second end of the second lead wire is connected to the second metal electrode.

6. The current fuse test strip of claim 5, wherein, The fuse current test board is provided with a limiting hole for fixing the fuse current test board on a base.

7. A fused current test system for a bonding material, characterized by, The fuse current test system comprises a power supply module, a control module, and the fuse current test board according to any one of claims 1-6, the control module is connected to the power supply module, and the power supply module is connected to the first bonding point and the second bonding point on the fuse current test board.

8. A method of testing the fusing current of a bonding material, characterized by, The method is applied to the fuse current test system according to claim 7; the method comprises: The control module sends a control signal to the power supply module; The power supply module controls the current output from the fuse current test board according to the control signal, so as to test the fuse current of the bonding material.

9. The method of claim 8, wherein, The method further comprises: bonding the bonding material to the fuse current test board according to test requirements.

10. The method of claim 9, wherein, The test requirements include a bonding process and a test state of the bonding material. 11.A computer device, comprising a memory and a processor, wherein the memory stores a computer program, and the computer device is configured to perform the method according to any one of claims 1-10 when the computer program is executed by the processor. The processor, when executing the computer program, realizes the steps of the method of any one of claims 8 to 10.

12. A computer readable storage medium having stored thereon a computer program, characterized in that, The computer program, when executed by the processor, realizes the steps of the method of any one of claims 8 to 10.

13. A computer program product comprising a computer program, characterized in that, The computer program, when executed by the processor, realizes the steps of the method of any one of claims 8 to 10.

Images