A semiconductor package structure and a semiconductor package manufacturing process

Abstract

The present invention relates to a semiconductor packaging structure and a semiconductor packaging manufacturing process in the field of semiconductor packaging technology, including a semiconductor component, a bottom plate, and an integrated circuit board. The surface of the bottom plate is provided with heat dissipation grooves, and a refrigerating sheet for heat dissipation is installed on the surface of the bottom plate. An accommodation cavity is provided inside the protective housing, and the accommodation cavity is used for pouring epoxy resin. Its manufacturing process includes the following steps: S1: Circuit testing; S2: Glue pouring and encapsulation; S3: Secondary encapsulation. The cold end face of the refrigerating sheet generates low-temperature gas to dissipate heat from the semiconductor component, the bottom plate, and the integrated circuit board, increasing the service life of the semiconductor component and the integrated circuit board and reducing the expenditure on maintenance costs. In addition, pouring epoxy resin has a waterproof effect. By coating the semiconductor component and the integrated circuit board with epoxy resin, it plays a role in isolating moisture, preventing the semiconductor component and the integrated circuit board from being affected by moisture and thus affecting their use performance.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a semiconductor packaging structure and a semiconductor packaging manufacturing process. Background Art

[0002] A semiconductor refers to a material whose electrical conductivity at room temperature is between that of a conductor and an insulator. Semiconductors have a wide range of applications in radios, televisions, and temperature measurement. For example, diodes are devices made of semiconductors. A semiconductor refers to a material whose conductivity can be controlled and whose range can be from an insulator to a conductor. From the perspective of both technology and economic development, the importance of semiconductors is extremely great.

[0003] In most electronic products today, such as the core units in computers, mobile phones, or digital recorders, they are extremely closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc.

[0004] The existing Chinese patent with the reference publication number CN105990326B discloses a semiconductor package, a semiconductor package structure, and a method for manufacturing a semiconductor package to improve the stability of the semiconductor package. The semiconductor package structure includes: a semiconductor package. The semiconductor package includes: a semiconductor bare chip, a redistribution layer structure, and a conductive pillar structure. Among them, the redistribution layer structure is coupled to the semiconductor bare chip, and the conductive pillar structure is disposed on the surface of the redistribution layer structure away from the bare chip and is coupled to the redistribution layer structure.

[0005] The existing Chinese patent with the reference publication number CN108511423A discloses a semiconductor package and a manufacturing method thereof. In some embodiments, the semiconductor package includes a substrate, at least one chip, a sealing ring, and an inductor. The at least one chip is mounted on the substrate and includes a plurality of component structures that operate using sound waves. The component structures are arranged on one side of the at least one chip facing the substrate. The sealing ring is disposed between the at least one chip and the substrate and surrounds the component structures. The inductor is disposed in the substrate.

[0006] An existing Chinese patent with reference publication number CN114823942A discloses a semiconductor packaging structure and packaging method, relating to the field of semiconductor packaging technology. The semiconductor packaging structure includes a substrate, a bracket, a semiconductor element, a light-transmitting component, and a connecting portion. The substrate includes a bottom plate and sidewalls surrounding the bottom plate, the sidewalls and the bottom plate defining a housing space, and the top and bottom surfaces of the bottom plate are both provided with a conductive layer. The bracket is located within the housing space and mounted on the conductive layer on the top surface of the bottom plate, and the bracket is made of a conductive material. The semiconductor element is mounted on the bracket. The light-transmitting component is disposed over the substrate and includes a light-transmitting member and a metal connecting member surrounding the light-transmitting member, the bottom surface of the metal connecting member abutting the top surface of the sidewalls. The connecting portion is connected to the sidewalls and the metal connecting member, respectively, and is located on a radial extension of the light-transmitting member to seal the housing space. High-energy beam welding eliminates the need to expose the substrate to a high-temperature environment, avoids the formation of ventilation channels, and ensures the sealing of the housing space.

[0007] However, the above solution does not have the functions of waterproofing and heat dissipation. When the semiconductor is in a working environment higher than the constant temperature environment and is powered on for operation, the semiconductor may overheat due to the lack of heat dissipation function, thereby damaging the semiconductor, affecting the performance of the semiconductor, and reducing work efficiency. On the other hand, when it needs to be installed in a specific working environment, such as an environment that requires waterproofing, the semiconductor structure needs to be further installed or improved due to the lack of waterproofing effect, which increases the installation process and installation costs. For this reason, the inventors have proposed a semiconductor packaging structure and a semiconductor packaging manufacturing process to solve the above-mentioned technical problems. Summary of the Invention

[0008] In order to overcome the above-mentioned shortcomings, the present invention aims to provide a technical solution that can solve the above-mentioned problems.

[0009] A semiconductor packaging structure includes a semiconductor element, a base plate and an integrated circuit board, wherein the semiconductor element and the integrated circuit board are respectively mounted on surfaces at both ends of the base plate, a heat dissipation groove is provided on the surface of the base plate, a cooling fin for heat dissipation is mounted on the surface of the base plate, the cooling fin includes a cold end surface and a hot end surface, the interior of the heat dissipation groove is a heat dissipation cavity, the hot end surface of the cooling fin extends into the interior of the heat dissipation cavity, the inner surface of the heat dissipation cavity is connected to a fireproof layer, the fireproof layer is composed of a glass magnesium fireproof board, an insulation groove is provided between the fireproof layer and the heat dissipation groove, the interior of the insulation groove is filled with insulation cotton, a plurality of exhaust ports are provided on the surface of the heat dissipation groove, the exhaust ports sequentially penetrate the heat dissipation groove, the insulation cotton and the fireproof layer, and extend into the interior of the heat dissipation cavity, an exhaust pipe for discharging heat is connected to the inner surface of the exhaust port, and one end of the exhaust pipe extends toward the outside of the insulation groove;

[0010] A protective shell is placed on the outside of the base plate, and one end of the protective shell is connected to a top cover. The surface of the top cover is provided with a clamping component for increasing the stability of the connection. A accommodating cavity is provided inside the protective shell, and the semiconductor components, base plate and integrated circuit board are all located inside the accommodating cavity. A number of metal conductors are provided on the surface of the base plate, and a protective component is provided on the outer side of the metal conductor. The inside of the accommodating cavity is used to irrigate epoxy resin. When the hot end face of the refrigeration plate is energized to generate heat, the heat generated by the hot end face is stored in the heat dissipation cavity inside the heat dissipation groove, and the heat is discharged to the outside of the protective shell through the exhaust port and the exhaust pipe in turn. When epoxy resin is irrigated inside the accommodating cavity, the junction of the exhaust port and the exhaust pipe is sealed by the epoxy resin to prevent the heat inside the heat dissipation cavity from flowing out from the junction of the exhaust port and the exhaust pipe. Low-temperature gas is generated by the cold end face of the refrigeration plate to dissipate heat for the semiconductor components, base plate and integrated circuit board, thereby avoiding overheating of the semiconductor components and integrated circuit board due to the heat generated by power. The exhaust port runs through the surface of the protective shell.

[0011] Furthermore, the exhaust port and the exhaust pipe are interference fit, the cooling fin is a semiconductor cooling fin, the surface of the heat dissipation groove is equipped with a mounting groove for matching the hot end surface of the cooling fin, the mounting groove extends to the interior of the heat dissipation cavity, and the middle part of the heat dissipation groove is provided with an air avoidance groove for avoiding the circuit welding point, and the air avoidance groove is located between two adjacent mounting grooves.

[0012] Furthermore, the protective component includes a protective sleeve and a protective bullet. The interior of the protective sleeve is a connecting groove for connecting a metal conductor. The connecting groove runs through both ends of the protective sleeve. The protective bullet is located inside the connecting groove. The inner surface of the connecting groove is provided with a wire hole for connecting an external power cord. The wire hole runs through the surface of the protective sleeve. One end of the protective sleeve is fitted with one end of the top cover to prevent the epoxy resin from flowing into the interior of the connecting groove when the epoxy resin is irrigated inside the accommodating cavity. The contact area between the connecting groove and the metal conductor is increased by the protective bullet, which increases the friction force and thus increases the connection stability.

[0013] Furthermore, a plurality of mating holes are provided on the surface of the protective shell, the diameter of the mating hole is consistent with the diameter of the wire threading hole, the number of the mating holes is consistent with the number of the wire threading holes, one end of the mating hole extends to the interior of the accommodating cavity, and the mating hole is used to connect the external power cord. The external power cord can pass through the mating hole and the wire threading hole in turn, so that the external power cord is electrically connected to the metal conductor.

[0014] Furthermore, the metal conductor is in contact with the surface of the bottom plate through a limit block, two adjacent metal conductors are equidistantly arranged, one end of the metal conductor extends beyond the surface of the top cover, and the metal conductor can be connected to the external power line by laser spot welding.

[0015] Further, the clamping assembly includes a plurality of clamping blocks and a plurality of clamping plates. The clamping plates are symmetrically installed at both ends of the clamping blocks. One end of the clamping block abuts against the surface of the top cover. When the accommodating cavity is filled with epoxy resin, the contact area between the top cover and the epoxy resin is increased through the clamping blocks and the clamping plates, thereby preventing the top cover from falling off the surface of the epoxy resin and enhancing the connection stability.

[0016] Further, one end of the integrated circuit board is electrically connected with a contact terminal.

[0017] A manufacturing process for a semiconductor package structure, which is used to manufacture a semiconductor package structure. The process includes the following steps:

[0018] S1: Circuit testing; welding the semiconductor element to one end of the bottom plate, and installing the integrated circuit board on the end of the bottom plate away from the semiconductor element through welding to obtain a semiconductor assembly, and performing integrated circuit testing on the semiconductor assembly through an integrated circuit testing device;

[0019] S2: Glue filling and encapsulation; installing the semiconductor assembly in the accommodating cavity inside the protective shell, and filling it with epoxy resin. When the epoxy resin is flush with the surface of the protective shell, installing the top cover on the surface of the protective shell to obtain an encapsulated assembly;

[0020] S3: Secondary encapsulation; using a protective shell with an inner size of the accommodating cavity larger than the outer side size of the encapsulated assembly, installing the encapsulated assembly inside the accommodating cavity, and filling it with epoxy resin to make the epoxy resin flush with the surface of the top cover.

[0021] Further, in S1, the integrated circuit testing device is divided into a physical testing device and an electrical testing device. The physical testing device is an ellipsometer or a scanning electron microscope, the electrical detection device is a probe station or a tester, and the welding is laser spot welding.

[0022] Further, in S2, the protective shell and the top cover are abutted through ultrasonic welding, and the protective shell and the top cover are sealed by ultrasonic welding to play a further waterproof role.

[0023] Compared with the prior art, the beneficial effects of the present invention are: generating low-temperature gas through the cold end surface of the thermoelectric cooler to dissipate heat from the semiconductor element, the bottom plate and the integrated circuit board, avoiding overheating of the semiconductor element and the integrated circuit board due to the heat generated by energization, enhancing the service life of the semiconductor element and the integrated circuit board, and reducing the expenditure on maintenance costs;

[0024] In addition, the method of using epoxy resin for irrigation enables the semiconductor components and integrated circuit boards inside the accommodation cavity to achieve a waterproof effect. By coating the semiconductor components and integrated circuit boards with epoxy resin, it plays a role in isolating moisture, preventing the semiconductor components and integrated circuit boards from being affected by moisture and thus influencing their performance. Brief Description of the Drawings

[0025] Figure 1 is a perspective view of a semiconductor packaging structure of the present invention;

[0026] Figure 2 is a perspective view of a semiconductor packaging structure of the present invention from another angle;

[0027] Figure 3 is a schematic exploded view of a semiconductor packaging structure of the present invention;

[0028] Figure 4 is a front view of a semiconductor packaging structure of the present invention;

[0029] Figure 5 is a rear view of a semiconductor packaging structure of the present invention;

[0030] Figure 6 is a bottom view of a semiconductor packaging structure of the present invention;

[0031] Figure 7 is a perspective view of a heat dissipation groove in a semiconductor packaging structure of the present invention;

[0032] Figure 8 is an internal structure diagram of a heat dissipation groove in a semiconductor packaging structure of the present invention;

[0033] Figure 9 is an internal structure diagram of a protection component in a semiconductor packaging structure of the present invention;

[0034] Figure 10 is a schematic flow chart of the manufacturing process of a semiconductor packaging structure of the present invention;

[0035] In the figures: 1 - semiconductor component, 2 - bottom plate, 3 - integrated circuit board, 4 - heat dissipation groove, 5 - Peltier element, 6 - cold end face, 7 - hot end face, 8 - heat dissipation cavity, 9 - fireproof layer, 10 - heat insulation groove, 11 - exhaust port, 12 - exhaust duct, 13 - protective housing, 14 - top cover, 15 - accommodation cavity, 16 - metal conductor, 17 - mounting groove, 18 - clearance groove, 19 - protective sleeve, 20 - protective spring block, 21 - connecting groove, 22 - wire passing hole, 23 - limiting block, 24 - clamping block, 25 - clamping plate, 26 - mating hole, 27 - contact terminal, 28 - heat insulation cotton. Detailed Description of the Invention

[0036] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0037] For this embodiment, please refer to Figures 1-10 , a semiconductor packaging structure implemented specifically includes a semiconductor element 1, a bottom plate 2, and an integrated circuit board 3. The semiconductor element 1 and the integrated circuit board 3 are respectively installed on the surfaces at both ends of the bottom plate 2. The surface of the bottom plate 2 is provided with heat dissipation grooves 4. A refrigerating sheet 5 for heat dissipation is installed on the surface of the bottom plate 2. The refrigerating sheet 5 includes a cold end face 6 and a hot end face 7. The inside of the heat dissipation groove 4 is a heat dissipation cavity 8. The hot end face 7 of the refrigerating sheet 5 extends into the inside of the heat dissipation cavity 8. A fireproof layer 9 is connected to the inner surface of the heat dissipation cavity 8. The fireproof layer 9 is composed of a magnesium oxychloride fireproof board. An insulating groove 10 is provided between the fireproof layer 9 and the heat dissipation groove 4. The inside of the insulating groove 10 is filled with insulating cotton 28. A plurality of exhaust ports 11 are provided on the surface of the heat dissipation groove 4. The exhaust ports 11 sequentially penetrate through the heat dissipation groove 4, the insulating cotton 28, and the fireproof layer 9, and extend into the inside of the heat dissipation cavity 8. An exhaust pipe 12 for discharging heat is connected to the inner surface of the exhaust port 11. One end of the exhaust pipe 12 extends towards the outside of the insulating groove 10;

[0038] A protective housing 13 is arranged outside the bottom plate 2. One end of the protective housing 13 is connected to a top cover 14. The surface of the top cover 14 is provided with a clamping assembly for increasing the connection stability. An accommodation cavity 15 is provided inside the protective housing 13. The semiconductor element 1, the bottom plate 2, and the integrated circuit board 3 are all located inside the accommodation cavity 15. A plurality of metal conductors 16 are provided on the surface of the bottom plate 2. A protective assembly is provided on the outer side surface of the metal conductors 16. Epoxy resin is used for irrigation inside the accommodation cavity 15. When heat is generated when the hot end face 7 of the refrigerating sheet 5 is energized, the heat generated by the hot end face 7 is stored in the heat dissipation cavity 8 inside the heat dissipation groove 4. The heat is discharged outside the protective housing 13 sequentially through the exhaust port 11 and the exhaust pipe 12. When epoxy resin is irrigated inside the accommodation cavity 15, the junction of the exhaust port 11 and the exhaust pipe 12 is sealed by the epoxy resin, which prevents the heat inside the heat dissipation cavity 8 from flowing out from the junction of the exhaust port 11 and the exhaust pipe 12. The cold end face 6 of the refrigerating sheet 5 generates low-temperature gas to dissipate heat from the semiconductor element 1, the bottom plate 2, and the integrated circuit board 3, avoiding the phenomenon that the semiconductor element 1 and the integrated circuit board 3 overheat due to the heat generated by energization. The exhaust port 11 penetrates through the surface of the protective housing 13.

[0039] The exhaust port 11 and the exhaust pipe 12 are in interference fit. The refrigerating sheet 5 is a semiconductor refrigerating sheet. An installation groove 17 for mating installation with the hot end face 7 of the refrigerating sheet 5 is installed on the surface of the heat dissipation groove 4. The installation groove 17 extends into the inside of the heat dissipation cavity 8. An avoidance groove 18 for avoiding circuit welding points is provided in the middle of the heat dissipation groove 4. The avoidance groove 18 is located between two adjacent installation grooves 17.

[0040] The protection component includes a protective sleeve 19 and a protective elastic block 20. The inside of the protective sleeve 19 is a connection groove 21 for connecting the metal conductor 16. The connection groove 21 runs through both ends of the protective sleeve 19. The protective elastic block 20 is located inside the connection groove 21. The inner surface of the connection groove 21 is provided with a wire passing hole 22 for connecting the external power supply line. The wire passing hole 22 runs through the surface of the protective sleeve 19. One end of the protective sleeve 19 is in contact with one end of the top cover 14, preventing the epoxy resin from flowing into the connection groove 21 when the epoxy resin is irrigated inside the accommodation cavity 15. By means of the protective elastic block 20, the contact area between the connection groove 21 and the metal conductor 16 is increased, achieving the effect of increasing the friction force, thereby playing a role in increasing the connection stability; several matching holes 26 are provided on the surface of the protective housing 13. The diameter of the matching hole 26 is the same as that of the wire passing hole 22, and the number of the matching holes 26 is the same as that of the wire passing holes 22. One end of the matching hole 26 extends into the accommodation cavity 15. The matching hole 26 is used to connect the external power supply line. The external power supply line can pass through the matching hole 26 and the wire passing hole 22 in sequence, so that the external power supply line is electrically connected to the metal conductor 16.

[0041] The metal conductor 16 abuts against the surface of the bottom plate 2 through a limiting block 23. Adjacent two metal conductors 16 are arranged at equal distances. One end of the metal conductor 16 extends beyond the surface of the top cover 14. The metal conductor 16 can be connected to the external power supply line by laser spot welding.

[0042] The clamping component includes several clamping blocks 24 and several clamping plates 25. The clamping plates 25 are symmetrically installed at both ends of the clamping block 24. One end of the clamping block 24 abuts against the surface of the top cover 14. When the epoxy resin is irrigated inside the accommodation cavity 15, the contact area between the top cover 14 and the epoxy resin is increased through the clamping block 24 and the clamping plate 25, thereby preventing the top cover 14 from falling off the surface of the epoxy resin and achieving the effect of increasing the connection stability; one end of the integrated circuit board 3 is electrically connected with a contact terminal 27. The contact terminal 27 is used to connect with the external data wiring.

[0043] A manufacturing process for a semiconductor packaging structure, which is used to manufacture a semiconductor packaging structure. The process includes the following steps:

[0044] S1: Circuit testing; welding the semiconductor element 1 to one end of the bottom plate 2, and installing the integrated circuit board 3 on the end of the bottom plate 2 away from the semiconductor element 1 through welding to obtain a semiconductor component. Conduct integrated circuit testing on the semiconductor component through an integrated circuit testing device. The integrated circuit testing device is divided into a physical testing device and an electrical testing device. The physical testing device is an ellipsometer or a scanning electron microscope, and the electrical detection device is a probe station or a tester. The welding is laser spot welding;

[0045] S2: Glue encapsulation; Install the semiconductor component inside the accommodation cavity 15 of the protective housing 13, and irrigate with epoxy resin. When the epoxy resin is flush with the surface of the protective housing 13, install the top cover 14 on the surface of the protective housing 13 to obtain the encapsulated component. The protective housing 13 and the top cover 14 are abutted by ultrasonic welding, and the protective housing 13 and the top cover 14 are sealed by ultrasonic welding to further play a role in waterproofing;

[0046] S3: Secondary encapsulation; Use a protective housing 13 with an inner size of the accommodation cavity 15 larger than the outer side dimension of the encapsulated component. Install the encapsulated component inside the accommodation cavity 15 and irrigate with epoxy resin to make the epoxy resin flush with the surface of the top cover 14.

[0047] The design key point of the present invention is that the cold end surface 6 of the thermoelectric cooler 5 generates low-temperature gas to dissipate heat from the semiconductor element 1, the bottom plate 2, and the integrated circuit board 3, avoiding overheating of the semiconductor element 1 and the integrated circuit board 3 due to the heat generated by energization, achieving the effect of increasing the service life of the semiconductor element 1 and the integrated circuit board 3, and reducing the expenditure on maintenance costs;

[0048] In addition, the irrigation method with epoxy resin enables the semiconductor element 1 and the integrated circuit board 3 inside the accommodation cavity 15 to achieve a waterproof effect. By coating the semiconductor element 1 and the integrated circuit board 3 with epoxy resin, it plays a role in isolating moisture, avoiding the influence of moisture on the performance of the semiconductor element 1 and the integrated circuit board 3.

[0049] The encapsulation process of the present invention is as follows: The semiconductor element 1 and the integrated circuit board 3 are respectively installed on the surfaces at both ends of the bottom plate 2 by laser spot welding. The thermoelectric coolers 5 are respectively installed on the surfaces at both ends of the bottom plate 2. When the cold end surface 6 of the thermoelectric cooler 5 generates low-temperature gas, the low-temperature gas dissipates heat from the semiconductor element 1, the bottom plate 2, and the integrated circuit board 3, avoiding overheating of the semiconductor element 1 and the integrated circuit board 3 due to the heat generated by energization. When the hot end surface 7 of the thermoelectric cooler 5 is energized to generate heat, the heat generated by the hot end surface 7 is stored in the heat dissipation cavity 8 inside the heat dissipation groove 4, and the heat is discharged outside the protective housing 13 through the exhaust port 11 and the exhaust pipe 12 in sequence.

[0050] Then, an ellipsometer and a tester are used to perform integrated circuit tests on the semiconductor element 1 and the integrated circuit board 3. After passing the tests, the semiconductor element 1, the bottom plate 2, and the integrated circuit board 3 are installed inside the accommodation cavity 15, and waterproof treatment is carried out by irrigating with epoxy resin. By coating the semiconductor element 1 and the integrated circuit board 3 with epoxy resin, it plays a role in isolating moisture, avoiding the influence of moisture on the performance of the semiconductor element 1 and the integrated circuit board 3.

[0051] The above content is a further detailed description of the present invention in combination with specific preferred embodiments. It cannot be determined that the specific implementation of the present invention is only limited to these descriptions. For those of ordinary skill in the technical field to which the present invention pertains, without departing from the concept of the present invention, several simple deductions or substitutions can still be made, which should all be regarded as the protection scope of the present invention.

Claims

1. A semiconductor package structure comprising a semiconductor element, a base plate, and an integrated circuit board, characterized in that: The semiconductor component and the integrated circuit board are respectively installed on the surfaces at both ends of the bottom plate. The surface of the bottom plate is provided with heat dissipation grooves, and a refrigerating sheet for heat dissipation is installed on the surface of the bottom plate. The refrigerating sheet includes a cold end face and a hot end face. The inside of the heat dissipation groove is a heat dissipation cavity, and the hot end face of the refrigerating sheet extends into the inside of the heat dissipation cavity. A fireproof layer is connected to the inner surface of the heat dissipation cavity. The fireproof layer is composed of a magnesium oxychloride fireproof board. An insulating groove is provided between the fireproof layer and the heat dissipation groove, and the inside of the insulating groove is filled with heat insulating cotton. A number of exhaust ports are provided on the surface of the heat dissipation groove. The exhaust ports sequentially penetrate through the heat dissipation groove, the heat insulating cotton and the fireproof layer, and extend into the inside of the heat dissipation cavity. An exhaust pipe for discharging heat is connected to the inner surface of the exhaust port, and one end of the exhaust pipe extends towards the outside of the insulating groove; A protective housing is arranged outside the bottom plate. One end of the protective housing is connected with a top cover. A clamping component for increasing the connection stability is arranged on the surface of the top cover. An accommodating cavity is arranged inside the protective housing. The semiconductor component, the bottom plate and the integrated circuit board are all located inside the accommodating cavity. A number of metal conductors are arranged on the surface of the bottom plate. A protective component is arranged on the outer side surface of the metal conductor. Epoxy resin is used for irrigation inside the accommodating cavity.

2. The semiconductor package structure according to claim 1, wherein: The exhaust port and the exhaust pipe are in interference fit. The refrigerating sheet is a semiconductor refrigerating sheet. An installation groove for mating with the hot end face of the refrigerating sheet is installed on the surface of the heat dissipation groove. The installation groove extends into the inside of the heat dissipation cavity. An avoidance groove for avoiding circuit welding points is arranged in the middle of the heat dissipation groove.

3. A semiconductor package structure according to any one of claims 1-2, characterized in that: The protective component includes a protective sleeve and a protective elastic block. The inside of the protective sleeve is a connection groove for connecting the metal conductor. The protective elastic block is located inside the connection groove. A wire passing hole for connecting an external power supply wire is arranged on the inner surface of the connection groove. The wire passing hole penetrates through the surface of the protective sleeve.

4. A semiconductor package structure according to claim 3, wherein: A number of matching holes are arranged on the surface of the protective housing. The diameter of the matching holes is the same as that of the wire passing holes. The number of the matching holes is the same as that of the wire passing holes. One end of the matching holes extends into the inside of the accommodating cavity.

5. A semiconductor package structure according to any one of claims 1-2, characterized in that: The metal conductor abuts against the surface of the bottom plate through a limiting block. Adjacent two metal conductors are arranged at equal intervals. One end of the metal conductor extends beyond the surface of the top cover.

6. A semiconductor package structure according to any one of claims 1-2, characterized in that: The clamping component includes a number of clamping blocks and a number of clamping plates. The clamping plates are symmetrically installed at both ends of the clamping blocks. One end of the clamping blocks abuts against the surface of the top cover.

7. A semiconductor package structure according to any one of claims 1-2, characterized in that: One end of the integrated circuit board is electrically connected with a contact terminal.

8. A manufacturing process of a semiconductor package structure, characterized in that: This manufacturing process is used to manufacture a semiconductor packaging structure according to any one of claims 1-7. This process includes the following steps: S1: Circuit testing; welding the semiconductor component to one end of the bottom plate, and installing the integrated circuit board on the end of the bottom plate far from the semiconductor component through welding to obtain a semiconductor assembly, and performing integrated circuit testing on the semiconductor assembly through an integrated circuit testing device; S2: Glue filling and encapsulation; installing the semiconductor assembly in the accommodating cavity inside the protective housing, irrigating with epoxy resin, and when the epoxy resin is flush with the surface of the protective housing, installing the top cover on the surface of the protective housing to obtain an encapsulated assembly; S3: Secondary packaging: Use a protective shell with an internal size of the accommodating cavity larger than the external size of the packaged component, install the packaged component inside the accommodating cavity, and irrigate it with epoxy resin to make the epoxy resin flush with the surface of the top cover.

9. The process for manufacturing a semiconductor package structure according to claim 8, wherein: In S1, the integrated circuit testing equipment is divided into physical testing equipment and electrical testing equipment. The physical testing equipment is an ellipsometer or a scanning electron microscope, the electrical testing equipment is a probe station or a tester, and the welding is laser spot welding.

10. The manufacturing process of a semiconductor packaging structure according to claim 8, characterized in that: In the above-mentioned S2, the protective shell and the top cover are abutted by ultrasonic welding.

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