Partial tinning device and tinning method for pins of inter-board connector

Abstract

The present invention provides a device for local tinning of pins of inter-board connectors and a tinning method thereof, wherein the device comprises: a tin melting device, a jet system, a control system, a transmission system and a clamping system; the control system is used to control the tin melting device, the jet system and the transmission system; the tin melting device is used to contain the solder used for tinning and heat the solder into a fluid; the jet system is used to flow the fluid solder from top to bottom at a preset speed; the transmission system is used to drive the inter-board connector to move; when the transmission system drives the inter-board connection to move to the bottom of the jet system, the part to be tinned on the inter-board connector completes the gold removal and tinning operation under the action of the fluid solder. The present invention solves the problem of low efficiency of the current tin pot tinning method, avoids the problem of deformation of the inter-board connector body during the tin pot tinning process, and can achieve a processing effect equivalent to the tin pot tinning and gold removal.

Description

Technical Field

[0001] The invention relates to the technical field of electronic assembly, in particular to a local tinning device for inter-board connector pins and a tinning method thereof. Background Art

[0002] In aerospace high-reliability electronic products, there is an installation method that uses inter-board connectors to achieve electrical connections between parallel circuit boards, such as Figure 6 As shown, the schematic diagram of the interconnection between board connectors is shown in the figure.

[0003] In order to ensure good contact between the pin and the socket of the long pin-to-board connector in the figure, the pin surface and the inner wall of the socket are all gold-plated. Therefore, during the welding process, in order to avoid "gold brittleness" in the solder joint between the pin and the printed circuit board, and at the same time not to damage the gold-plated layer of the pin and the socket, it is necessary to perform local tinning and gold removal treatment on the part of the long pin connector that passes through the printed circuit board and is wetted by the solder to form a solder joint, so as to ensure the welding and plug-in reliability of the long pin-to-board connector.

[0004] Usually, local tinning of the pre-welding parts of inter-board connectors is done by protecting the plug-in parts and then using a secondary tinning pot. The first tinning is done in a special tin pot for gold removal, and the second tinning is done in an ordinary tin pot. The protective material can effectively isolate the gold-plated layer on the surface of the pin from contact with the molten solder, thereby achieving the purpose of local tinning.

[0005] However, this method has the following disadvantages: 1) Before tinning with a tin pot, a high-temperature resistant insulating sleeve with the same outer diameter as the connector pin needs to be used to protect the connector pins one by one. Currently, only the insulation skin of aerospace-grade wires of specific models from individual manufacturers can meet the protection requirements, and the purchase cost is very high; 2) Long pin protection is time-consuming and labor-intensive, and inefficient. Taking a 266-core three-row inter-board connector as an example, the protection of the pin insulation skin takes 3 hours, which accounts for about half of the entire tinning and gold removal time. In addition, in order to ensure the protective effect of the insulation skin on the long pin, the inner wall of the insulation skin and the long pin need to be in close contact. The friction between the inner wall of the insulation skin and the long pin must be overcome when the sleeve is inserted, which is unbearable for the fingers of operators for a long time; 3) The pins of the long pins are easy to bend and deform during operation, destroying the original equidistant array structure of the long pins, thereby causing problems such as kneeling pins when plugging and unplugging the long pins later; 4) Although the connector body has been protected, the overall heating of the tin pot immersion method will cause the connector body to deform. The longer the connector size, the more serious the deformation, resulting in inconsistent insertion depths in the middle and at both ends of the connector.

[0006] Therefore, how to change the pin protection method and the gold removal and tin plating method to efficiently complete the local gold removal and tin plating of the pre-welding parts of the pins while ensuring that the inter-board connector body is not deformed and the equidistant array structure of the pins is not damaged has become a technical problem that needs to be urgently solved by technical personnel in this field. Summary of the invention

[0007] In view of the above problems, the purpose of the present invention is to propose a device for local tinning of inter-board connector pins, which solves the problem of low efficiency of the current tin pot dipping method by non-contact assembly line tinning and gold removal of the inter-board connector, avoids the problem of damage to the equidistant structure of the long pins during the current wire insulation protection process and deformation of the inter-board connector body during the tin pot dipping process, and finally achieves a processing effect equivalent to that of tin pot tinning and gold removal.

[0008] To achieve the above object, the present invention adopts the following specific technical solutions:

[0009] The present invention provides a device for local tinning of pins of inter-board connectors, comprising: a tin melting device, a jet system, a control system, a transmission system and a clamping system;

[0010] The control system is installed on the tin melting device and is used to control the tin melting device, the jet system and the transmission system;

[0011] The tin melting device is a hollow integrated cubic structure with an opening on the top, which is used to hold the solder used for tinning and heat the solder into a fluid;

[0012] The jet system is installed on the tin melting device and is used to flow the fluid solder from top to bottom at a preset speed;

[0013] The clamping system is installed on the inner side of the transmission system and is used to clamp and fix the inter-board connector;

[0014] The transmission system is located at the top of the side of the tin melting device and is used to drive the clamping system to move;

[0015] When the transmission system drives the inter-board connector to move to the bottom of the jet system, the part to be tinned on the inter-board connector completes the gold removal and tinning operation under the action of the fluid solder.

[0016] Preferably, the jet system comprises: a tin pump, a hollow pipe and a nozzle;

[0017] One end of the tin pump is fixed on the first side surface, and the other end of the tin pump is suspended in the tin melting device and is perpendicular to the first side surface. The tin pump is used to control the outflow speed of the solder; the tin pump and the nozzle are connected to each other through a sealed pipe;

[0018] The nozzle is fixedly connected to one end of the inverted U-shaped hollow pipe, and the nozzle is used to flow out the fluid solder. The other end of the hollow pipe is fixed on the top surface of the second side through a mounting seat and is connected to the tin pump.

[0019] Preferably, the jet system also includes: a pipeline heating and temperature sensing device, which includes a heating device and a temperature sensing device, wherein the temperature sensing device is built into the hollow pipeline, and the heating device achieves heating by winding a heating wire around the outer circumference of the hollow pipeline, and the pipeline heating and temperature sensing device is used to heat the nozzle and monitor the temperature.

[0020] Preferably, the transmission system comprises: a first one-dimensional guide rail, a second one-dimensional guide rail, a transmission bracket, a transmission rack and a motor;

[0021] The first one-dimensional guide rail and the second one-dimensional guide rail are placed parallel to each other on the top surfaces of the first side surface and the second side surface;

[0022] The transmission bracket is installed on the first one-dimensional guide rail and the second one-dimensional guide rail through a slider, and the transmission rack is fixed on the outer side of the transmission bracket; a gear is installed on the output shaft of the motor, and the gear and the transmission rack are meshed for transmission;

[0023] The motor drives the gear to rotate and then drives the transmission bracket to move horizontally.

[0024] Preferably, the clamping system comprises: a clamping fixture;

[0025] The clamping fixture is a C-shaped structure, the back of the clamping fixture is fixed on the inner side of the transmission bracket, and the inter-board connector is located on the clamping fixture.

[0026] Preferably, the clamping system further comprises: a locking screw;

[0027] The upper supporting part of the clamping fixture is provided with a threaded hole, and the locking screw is screwed in along the threaded hole to apply an extrusion force to the inter-board connector, thereby finally fixing the inter-board connector.

[0028] Preferably, the target temperatures of the tin melting device and the pipeline heating temperature sensing device are the same.

[0029] The present invention also provides a method for partially tinning pins of an inter-board connector, comprising the following steps:

[0030] S1, controlling the tin melting device through the control system, when the tin melting device is heated to a target temperature, the solder becomes a fluid, and starting the tin pump to make the fluid solder flow out through the nozzle at a preset flow rate;

[0031] S2. Heat the pipeline heating temperature sensing device to make the solder temperature in the nozzle the same as the solder temperature in the tin melting device, and install the inter-board connector on the clamping system; S3. Drive the inter-board connector to move to the bottom of the nozzle through the transmission system, and the part to be tinned on the inter-board connector completes the gold removal and tinning operation under the action of the fluid solder.

[0032] Preferably, a pre-processing step is also included:

[0033] S0, setting the target temperature of the tin melting device and the nozzle through the control system, and setting the speed of the tin pump and the motor respectively.

[0034] Preferably, soldering flux is applied to the to-be-tinned portion of the inter-board connector before the gold removal and tinning operation is performed.

[0035] Compared with the prior art, the present invention has the following advantages:

[0036] (1) The solder temperature actually reaching the connector pin position of the present invention is precisely controllable;

[0037] (2) In the present invention, there is no need to preheat the connector, and the tinning and gold removal operation can be directly performed, which is faster and more convenient;

[0038] (3) The present invention adopts a top-down solder flow method. Under the dual force of the initial velocity of the solder fluid provided by the rotation of the tin pump and the gravity of the fluid solder itself, it can achieve comprehensive tin plating and gold removal of multi-row long-pin connector pins, thereby avoiding the disadvantage of the bottom-up solder spraying method in the prior art that the upper pins far away from the nozzle cannot contact the fluid solder due to the shielding effect of the bottom pins and cannot be fully tinned and gold removed.

[0039] (4) Through the non-contact assembly line tinning and gold removal method for the inter-board connector, the problem of low efficiency of the current tin pot dipping method is solved, and the problem of damage to the equidistant structure of the long pins caused by the current wire insulation skin protection long pins and deformation of the inter-board connector body during the tin pot dipping process is avoided, and finally a processing effect equivalent to tin pot tinning and gold removal is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 The present invention is a schematic structural diagram of a device for partially tinning pins of an inter-board connector provided according to an embodiment of the present invention.

[0041] Figure 2 It is a structural schematic diagram of a jet system of a local tinning device for inter-board connector pins provided according to an embodiment of the present invention.

[0042] Figure 3 The present invention is a schematic structural diagram of a transmission system of a device for partially tinning pins of an inter-board connector provided according to an embodiment of the present invention.

[0043] Figure 4 It is a structural schematic diagram of a clamping system of a local tinning device for inter-board connector pins provided according to an embodiment of the present invention.

[0044] Figure 5 The present invention is a flowchart of a method for local tinning of inter-board connector pins provided in accordance with an embodiment of the present invention.

[0045] Figure 6 It is a schematic diagram of the interconnection between board connectors.

[0046] The figure marks include: tin melting device 1, jet system 2, tin pump 21, nozzle 22, mounting base 221, pipeline heating temperature sensing device 23, control system 3, transmission system 4, first one-dimensional guide rail 411, second one-dimensional guide rail 412, transmission bracket 42, transmission rack 43, motor 44, clamping system 5, clamping fixture 51, locking screw 52 and inter-board connector 6. DETAILED DESCRIPTION

[0047] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, the same modules are represented by the same reference numerals. In the case of the same reference numerals, their names and functions are also the same. Therefore, the detailed description thereof will not be repeated.

[0048] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and do not constitute a limitation of the present invention.

[0049] Figure 1 A device for local tinning of pins of an inter-board connector provided according to an embodiment of the present invention is shown.

[0050] like Figure 1 As shown, the local tinning device for inter-board connector pins provided by an embodiment of the present invention includes: a tin melting device 1, a jet system 2, a control system 3, a transmission system 4 and a clamping system 5.

[0051] The tin melting device 1 provided by the present invention is a hollow integrated cubic structure with an opening on the top. The tin melting device 1 is a device with adjustable temperature and accurate temperature control, and is used to hold solder used for tinning.

[0052] The control system is installed on the tin melting device and is used to control the tin melting device, the jet system and the transmission system.

[0053] The control system 3 is located inside the second side of the tin melting device 1. The control system 3 is used to control the temperature of the tin melting device 1 and the nozzle 22. The control system 3 is used to adjust the rotation speed of the tin pump 21 to further regulate the outflow speed of the fluid solder; the control system 3 is also used to control the moving speed and moving direction of the transmission system 4.

[0054] The jet system 2 is installed on the tin melting device 1 and is used to flow the fluid solder from top to bottom at a preset speed.

[0055] The clamping system is installed on the inner side of the transmission system and is used to clamp and fix the inter-board connector.

[0056] The transmission system is located at the top of the side of the tin melting device and is used to drive the clamping system to move.

[0057] When the transmission system drives the inter-board connection to move to the bottom of the jet system, the part to be tinned on the inter-board connector completes the gold removal and tinning operation under the action of the fluid solder.

[0058] Figure 2 A jet system provided according to an embodiment of the present invention is shown.

[0059] like Figure 2 As shown, the jet system 2 is located on the top surface of the first side surface of the tin melting device 1, and is used to flow the molten solder at a preset speed. The jet system 2 includes: a tin pump 21, a nozzle 22, and a pipeline heating temperature sensing device 23. One end of the tin pump 21 is fixed on the first side surface, and the other end of the tin pump 21 is suspended inside the tin melting device 1 and is perpendicular to the first side surface. The tin pump 21 is used to control the outflow speed of the solder.

[0060] The nozzle 22 is located at one end of the hollow pipe structure, and the nozzle 22 is used to discharge the fluid tin solder. The hollow pipe structure is a detachable inverted U-shaped structure with an adjustable inner diameter. The tin pump 21 and the nozzle 22 are interconnected through a sealed pipe; the other end of the hollow pipe is connected to the sealed pipe and fixed on the mounting seat 221, and the hollow pipe is fixed on the top surface of the second side surface through the mounting seat 221; the pipe heating temperature sensing device 23 includes a heating device and a temperature sensing device, wherein the temperature sensing device is built into the hollow pipe. The temperature sensing device can be a temperature measuring instrument such as a thermocouple. The thermocouple is directly built into the pipe. When the fluid solder flows through the thermocouple, the solder temperature can be monitored. The heating device realizes the heating function by winding a heating wire around the outer circumference of the hollow pipe. The pipe heating temperature sensing device 23 is used to heat the temperature of the nozzle 22 and monitor the temperature of the nozzle 22 to achieve precise temperature control of the nozzle 22; one end where the nozzle 22 is located is suspended, and the position of the nozzle is higher than the height of the cube structure;

[0061] Generally, the temperature of the tin melting device 1 and the nozzle 22 is the same, which is 260°C.

[0062] Figure 3 A transmission system according to an embodiment of the present invention is shown.

[0063] like Figure 3As shown, the transmission system 4 is located on the top surface of the first side surface and the second side surface of the tin melting device 1, and is used to change the horizontal position of the inter-board connector 6. The transmission system 4 includes: a first one-dimensional guide rail 411, a second one-dimensional guide rail 412, a transmission bracket 42, a transmission rack 43 and a motor 44. The first one-dimensional guide rail 411 and the second one-dimensional guide rail 412 are of the same size and length, and are placed parallel to each other on the top surface of the first side surface and the second side surface of the tin melting device 1; the first one-dimensional guide rail 411 and the second one-dimensional guide rail 412 are provided to ensure the stability of the guide rails during use. The transmission bracket 42 is installed on the first one-dimensional guide rail 411 and the second one-dimensional guide rail 412 through a slider, and the unconnected part of the transmission bracket 42 between the first one-dimensional guide rail 411 and the second one-dimensional guide rail 412 is suspended; the transmission rack 43 is fixed on the outer side of the transmission bracket 42 and is arranged parallel to the first one-dimensional guide rail 411; the motor 44 is located on the top surface of the first side surface of the tin melting device 1, and a gear is installed on the motor 44, which is meshed with the transmission rack 43. The motor 44 drives the gear to rotate and then drives the transmission bracket 42 to move horizontally.

[0064] Figure 4 A clamping system provided according to an embodiment of the present invention is shown.

[0065] like Figure 4 As shown, the clamping system 5 is a C-shaped structure, located on the inner side of the transmission bracket 42, and is used to fix the inter-board connector 6. The clamping system 5 includes: a clamping fixture 51 and a locking screw 52. The clamping fixture 51 is a C-shaped structure, and the back of the clamping fixture 51 is fixed on the inner side of the transmission bracket 42. The inter-board connector 6 is located between the upper support part and the lower support part of the clamping fixture 51. The upper support part of the clamping fixture 51 is provided with a plurality of threaded holes. The locking screw 52 is screwed in and out along the direction of the threaded hole. By screwing in the locking screw 52, ​​an extrusion force is applied to the inter-board connector, and finally the inter-board connector 6 is fixed.

[0066] An appropriate amount of flux should be applied to the inter-board connector pins to be tinned.

[0067] The local tinning device for inter-board connector pins provided by the present invention is used in actual use:

[0068] First, the target temperature of the tin melting device and the nozzle (usually 260°C) is set through the control system.

[0069] Then the speed of the tin pump is adjusted through the control system: the tin melting device and the pipeline heating temperature sensing device are started for heating; when the tin melting device and the nozzle have all reached the target temperature, the solder inside the tin melting device has all become liquid, at this time the tin pump is started, and the speed of the tin pump is adjusted through the control system until the molten solder flowing out of the nozzle flows out at a preset flow rate, then the tin pump is turned off to complete the adjustment of the tin pump speed.

[0070] Secondly, the rotation speed of the motor is adjusted through the control system to achieve the adjustment of the movement speed of the transmission bracket along the first one-dimensional guide rail: first, the transmission bracket is reset to one end of the first one-dimensional guide rail, and then the inter-board connector is placed in the clamping fixture and fixed to the clamping fixture by locking screws. The fixed inter-board connector body should be parallel to the first one-dimensional guide rail in the length direction, and the inter-board connector pin to be tinned can be located directly below the nozzle after the transmission bracket starts to move.

[0071] Finally, the control system starts the tin melting device and the pipeline heating temperature sensing device in sequence for heating, starts the tin pump and the motor to work, and the inter-board connector moves along the first one-dimensional guide rail driven by the transmission bracket, and the part of the inter-board connector pin to be tinned completes the gold removal and tin-plating operation under the action of the flowing solder.

[0072] Figure 5 A method for local tinning of inter-board connector pins provided according to an embodiment of the present invention is shown.

[0073] like Figure 5 As shown, the method for local tinning of the pins of the board-to-board connector includes the following steps:

[0074] S1. Control the tin melting device and the pipeline heating temperature sensing device to heat through the control system, and install the inter-board connector on the clamping system;

[0075] S2, when the tin melting device and the nozzle are heated to the target temperature, the solder becomes fluid, and the tin pump is started to make the fluid solder flow out through the nozzle at a preset flow rate;

[0076] (Due to the heat dissipation of the pipeline, the actual temperature of the solder in the pipeline is lower than the solder temperature in the tin melting device)

[0077] S3. The inter-board connector is driven to move to the position directly below the nozzle through the transmission system, and the part to be tinned on the inter-board connector is de-goldened and tinned under the action of the fluid solder.

[0078] The method for local tinning of inter-board connector pins provided by the present invention further comprises a pretreatment step:

[0079] S0, setting the target temperature of the tin melting device and the nozzle through the control system, and setting the speed of the tin pump and the motor respectively.

[0080] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

[0081] The above specific implementations of the present invention do not constitute a limitation on the protection scope of the present invention. Any other corresponding changes and modifications made based on the technical concept of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A device for local tinning of pins of a board-to-board connector, characterized in that: include: Tin melting device, jet system, control system, transmission system and clamping system; The control system is installed on the tin melting device and is used to control the tin melting device, the jet system and the transmission system; The tin melting device is a hollow integrated cubic structure with an opening on the top, which is used to hold the solder used for tinning and heat the solder into a fluid; The jet system is installed on the tin melting device and is used to flow the fluid solder from top to bottom at a preset speed; The clamping system is installed on the inner side of the transmission system and is used to clamp and fix the inter-board connector; The transmission system is located at the top of the side of the tin melting device and is used to drive the clamping system to move; When the transmission system drives the inter-board connector to move to the position directly below the jet system, the portion to be tinned on the inter-board connector completes the gold removal and tinning operation under the action of the fluid solder.

2. The device for partial tinning of pins of board-to-board connector according to claim 1, characterized in that: The jet system comprises: a tin pump, a hollow pipe and a nozzle; One end of the tin pump is fixed on the first side surface of the tin melting device, and the other end of the tin pump is suspended inside the tin melting device and is perpendicular to the first side surface. The tin pump is used to control the outflow speed of the solder; the tin pump and the nozzle are connected to each other through a sealed pipe; The nozzle is fixedly connected to one end of the inverted U-shaped hollow pipe, and the nozzle is used to flow out the fluid solder. The other end of the hollow pipe is fixed to the top surface of the second side of the tin melting device through a mounting seat and is connected to the tin pump.

3. The device for partial tinning of pins of board-to-board connector according to claim 2, characterized in that: The jet system also includes: a pipeline heating temperature sensing device, which includes a heating device and a temperature sensing device, wherein the temperature sensing device is built into the hollow pipeline, and the heating device achieves heating by winding a heating wire around the outer circumference of the hollow pipeline. The pipeline heating temperature sensing device is used to heat the nozzle and monitor the temperature.

4. The device for partial tinning of pins of board-to-board connector according to claim 3, characterized in that: The transmission system comprises: a first one-dimensional guide rail, a second one-dimensional guide rail, a transmission bracket, a transmission rack and a motor; The first one-dimensional guide rail and the second one-dimensional guide rail are placed parallel to each other on the top surfaces of the first side surface and the second side surface; The transmission bracket is installed on the first one-dimensional guide rail and the second one-dimensional guide rail through a slider, and the transmission rack is fixed on the outside of the transmission bracket; a gear is installed on the output shaft of the motor, and the gear and the transmission rack are meshed for transmission; The motor drives the gear to rotate and then drives the transmission bracket to move horizontally.

5. The device for partial tinning of pins of board-to-board connector according to claim 4, characterized in that: The clamping system comprises: a clamping fixture; The clamping fixture is a C-shaped structure, the back side of the clamping fixture is fixed to the inner side of the transmission bracket, and the inter-board connector is located on the clamping fixture.

6. The device for partial tinning of pins of board-to-board connector according to claim 5, characterized in that: The clamping system further comprises: a locking screw; The upper supporting portion of the clamping fixture is provided with a threaded hole, and the locking screw is screwed in along the direction of the threaded hole to apply a squeezing force to the inter-board connector, thereby finally fixing the inter-board connector.

7. The device for partial tinning of pins of board-to-board connector according to claim 6, characterized in that: The target temperatures of the tin melting device and the pipeline heating temperature sensing device are the same.

8. A method for local tinning of inter-board connector pins using the device for local tinning of inter-board connector pins according to claim 7, characterized in that: The following steps are involved: S1, controlling the tin melting device through the control system, when the tin melting device is heated to a target temperature, the solder becomes a fluid, and starting the tin pump to make the fluid solder flow out through the nozzle at a preset flow rate; S2, heating the pipeline heating temperature sensing device to make the solder temperature in the nozzle the same as the solder temperature in the tin melting device, and installing the inter-board connector on the clamping system; S3. The transmission system drives the inter-board connector to move to the position directly below the nozzle, and the part to be tinned on the inter-board connector completes the gold removal and tinning operation under the action of the fluid solder.

9. The method for partial tinning of inter-board connector pins according to claim 8, characterized in that: Also includes preprocessing steps: S0. Setting the target temperatures of the tin melting device and the nozzle through the control system, and setting the rotation speeds of the tin pump and the motor respectively.

10. The method for partial tinning of inter-board connector pins according to claim 9, characterized in that: Before the gold removal and tin plating operation is performed, soldering flux is applied to the part of the inter-board connector to be tinned.

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