A vacuum device and a control method thereof

Abstract

The present invention relates to the technical field of semiconductor coating, and in particular to a vacuum pumping device and a control method thereof. The base in the vacuum pumping device has a ventilation cavity, and the upper surface of the base is provided with a plurality of ventilation holes connected to the ventilation cavity. The base is installed at the bottom of the vacuum chamber, and the upper surface of the base is used to carry a substrate. A mechanical pump is connected to the vacuum chamber and is used to extract vacuum from the vacuum chamber. The first housing has a first accommodating cavity, and the first accommodating cavity is connected to the vacuum chamber. The evaporator is installed in the first accommodating cavity, and the evaporator is used to condense and liquefy the gas in the vacuum chamber that enters the first housing. The second housing has a second accommodating cavity, and the second accommodating cavity is connected to the first accommodating cavity, and the second accommodating cavity is also connected to the ventilation cavity. The condenser is installed in the second accommodating cavity, and the condenser is used to heat the gas in the second housing and then transport it to the ventilation cavity. The present invention is used for coating equipment.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor coating, and in particular to a vacuum pumping device and a control method thereof. Background Art

[0002] Semiconductor materials are the cornerstone of the modern semiconductor industry and the microelectronics industry. From a physical point of view, it refers to a type of material with electrical conductivity between conductors and insulators. Semiconductor substrates often need to be coated before use, and semiconductor coating usually needs to be performed in a vacuum environment. However, coating equipment is generally made of stainless steel. When the coating equipment is placed in a low temperature environment (such as winter in the north), it is easy for the vacuum chamber used as a vacuum environment to become humid. In this way, even after the vacuum chamber is evacuated, when the semiconductor substrate is processed, the remaining moisture may affect the processing of the semiconductor substrate. In addition, the remaining moisture can easily contaminate the vacuum chamber and is not conducive to the long-term storage of the coating equipment. Summary of the invention

[0003] 1. Technical issues to be resolved

[0004] In order to solve the above problems in the prior art, the present invention provides a vacuum pumping device and a control method thereof, which solves the problem of residual moisture in the vacuum chamber affecting the processing of semiconductor substrates and improves the environment in the vacuum chamber.

[0005] (II) Technical solution

[0006] To achieve the above object, the embodiments of the present invention adopt the following technical solutions:

[0007] On the one hand, an embodiment of the present invention provides a vacuum pumping device, which may include a vacuum chamber, a base, a mechanical pump, a first housing, an evaporator, a second housing and a condenser. Among them, the base has a ventilation cavity, and a plurality of vents are provided on the upper surface of the base and are connected to the ventilation cavity. The base is installed at the bottom of the vacuum chamber, and the upper surface of the base is used to carry a substrate. The mechanical pump is connected to the vacuum chamber and is used to extract vacuum from the vacuum chamber. The first housing has a first accommodating cavity, and the first accommodating cavity is connected to the vacuum chamber. The evaporator is installed in the first accommodating cavity, and the evaporator is used to condense and liquefy the gas in the vacuum chamber that enters the first housing. The second housing has a second accommodating cavity, and the second accommodating cavity is connected to the first accommodating cavity, and the second accommodating cavity is also connected to the ventilation cavity. The condenser is installed in the second accommodating cavity, and the condenser is used to heat the gas in the second housing and then transport it to the ventilation cavity.

[0008] Furthermore, a new air inlet is provided on the second housing of the vacuum pumping device. The vacuum pumping device may also include a first fan and a second fan, wherein the first fan is arranged in the first housing, the first housing is provided with a first air inlet and a first air outlet, the first air inlet is connected to the vacuum chamber, and the first air outlet is connected to the second housing; the first fan is installed at the first air inlet, and is used to transport the gas in the vacuum chamber to the first housing. The second fan is arranged in the second housing, the second housing is provided with a second air inlet and a second air outlet, the second air inlet is connected to the first air outlet of the first housing, the second fan covers the second air inlet and the new air inlet, and the second fan is used to transport the gas in the first housing to the second housing, or to transport the gas at the new air inlet to the second housing.

[0009] Furthermore, the upper surface of the base has a substrate bearing surface, and a plurality of ventilation openings are arranged around the substrate bearing surface.

[0010] Furthermore, the vent is arranged at an angle, and the air outlet direction of the vent is arranged towards a direction away from the substrate bearing surface.

[0011] Furthermore, the vacuum pumping device further comprises a first electric valve, a second electric valve, a third electric valve and a fourth electric valve, wherein the first electric valve is installed between the vacuum chamber and the first housing. The second electric valve is installed between the first housing and the second housing. The third electric valve is installed between the second housing and the ventilation chamber. The fourth electric valve is installed between the vacuum chamber and the mechanical pump.

[0012] Furthermore, the vacuum pumping device further comprises a main pipeline, a branch pipeline, a first flow meter, a second flow meter and a fifth electric valve, wherein the main pipeline is connected to the vacuum chamber, and the mechanical pump and the fourth electric valve are installed on the main pipeline. One end of the branch pipeline is connected to the main pipeline between the mechanical pump and the fourth electric valve, and the other end is connected to the atmosphere. The first flow meter is installed on the main pipeline and is located between the branch pipeline and the mechanical pump. The second flow meter is installed on the branch pipeline. The fifth electric valve is installed on the branch pipeline.

[0013] Furthermore, the vacuum pumping device further includes a refrigeration pipeline, a compressor and a throttle valve, wherein the refrigeration pipeline is used to circulate the refrigerant. One end of the compressor is connected to the evaporator through the refrigeration pipeline, and the other end is connected to the condenser through the refrigeration pipeline. One end of the throttle valve is connected to the evaporator through the refrigeration pipeline, and the other end is connected to the condenser through the refrigeration pipeline.

[0014] Furthermore, the vacuum pumping device further includes a humidity sensor, a pressure sensor, a comparator and a controller, wherein the humidity sensor is installed in the vacuum chamber to measure the humidity value in the vacuum chamber. The pressure sensor is installed in the vacuum chamber to measure the pressure value in the vacuum chamber. The comparator is electrically connected to the humidity sensor and the pressure sensor. The controller is electrically connected to the comparator, the first electric valve, the second electric valve, the third electric valve, the fourth electric valve, the fifth electric valve, the first fan, the second fan and the compressor.

[0015] Furthermore, the vacuum extraction device also includes a liquid collecting pan, which is arranged in the first housing and below the evaporator, and the liquid collecting pan is used to collect liquid condensed on the surface of the evaporator.

[0016] On the other hand, an embodiment of the present invention further provides a control method for a vacuum pumping device, including the vacuum pumping device mentioned in the above technical solution, and the control method for the vacuum pumping device includes the following steps:

[0017] S1, the controller controls the fourth electric valve to close, the first electric valve, the second electric valve and the third electric valve to open, and the first fan, the second fan and the compressor to operate; the condenser heats the gas in the second casing and transports it to the ventilation cavity through the second fan, the first fan transports the gas in the vacuum chamber to the first casing, and the evaporator condenses and liquefies the gas in the vacuum chamber for dehumidification; the gas cooled in the first casing is transported to the second casing for circulation;

[0018] S2, when the humidity value monitored by the humidity sensor in the vacuum chamber reaches a preset humidity threshold, all the equipment in step S1 is closed, the user opens the door of the vacuum chamber, places the substrate on the substrate carrying surface, and then closes the door of the vacuum chamber, and controls the equipment in step S1 to start running again, when the humidity value monitored by the humidity sensor reaches the preset humidity threshold again; the controller controls the first electric valve, the second electric valve and the third electric valve to be closed, the first fan, the second fan and the compressor to stop running, the fourth electric valve to open, and the mechanical pump to start pumping air in the vacuum chamber; when the vacuum degree in the vacuum chamber reaches the preset pressure threshold, all the equipment in the vacuum pumping device is closed and stops running, and the coating step is started;

[0019] S3, after the coating step is closed, the controller controls the second fan to run, the third electric valve to open, and the second fan transports the gas at the fresh air outlet to the ventilation chamber. When the pressure value in the vacuum chamber reaches the outdoor ambient atmospheric pressure, the controller controls the second fan to stop running and the third electric valve to close, and the processed substrate is taken out;

[0020] S4, continuing with step S1, when the humidity value in the vacuum chamber reaches a preset humidity threshold, all devices in the vacuum pumping device stop running.

[0021] (III) Beneficial effects

[0022] The beneficial effects of the present invention are as follows: the vacuum pumping device provided by the embodiment of the present invention can heat the gas in the second housing through the condenser in the second accommodating chamber, so that the hot gas can enter the vacuum chamber, and the hot gas can dry the vacuum chamber, and then take away the moisture in the vacuum chamber to the first housing. The evaporator in the first accommodating chamber can condense and liquefy the gas coming out of the vacuum chamber for dehumidification, and the dehumidified gas enters the second housing for circulation.

[0023] In addition, the upper surface of the base is provided with a plurality of vents connected to the ventilation cavity, so that the heated gas in the second housing first enters the ventilation cavity of the base, and then the heated gas can enter the vacuum chamber through the vents for dehumidification. After dehumidification, the vacuum chamber can be evacuated by a mechanical pump, so that the vacuum chamber is in a vacuum state, and then the next coating step is carried out. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of a vacuum pumping device of the present invention;

[0025] Figure 2 For the present invention Figure 1 Schematic diagram of the top view of the middle base;

[0026] Figure 3 For the present invention Figure 2 AA direction cross-sectional diagram;

[0027] Figure 4 It is a schematic diagram of another vacuum pumping device of the present invention;

[0028] Figure 5 It is a schematic diagram of another vacuum pumping device of the present invention;

[0029] Figure 6 For the present invention Figure 5 The enlarged schematic diagram of point B in FIG.

[0030] Figure 7 It is a schematic diagram of the connection of the evaporator, condenser, compressor and throttle valve of the present invention;

[0031] Figure 8 It is a schematic diagram of electrical connection of the present invention. DETAILED DESCRIPTION

[0032] In order to better explain the present invention and facilitate understanding, the present invention is described in detail below through specific implementation modes in conjunction with the accompanying drawings.

[0033] The coating equipment for semiconductor substrates needs to evacuate the vacuum chamber 1 in the coating equipment before coating. However, if the coating equipment is left for a long time, a certain amount of moisture may accumulate in the vacuum chamber 1, thereby affecting the coating process of the semiconductor substrate.

[0034] Based on this, Figure 1 As shown, the embodiment of the present invention provides a vacuum pump 100, which may include a vacuum chamber 1, a base 2, a mechanical pump 3, a first housing 4, an evaporator 5, a second housing 6 and a condenser 7. The base 2 has a ventilation cavity 21, and a plurality of ventilation holes 22 are provided on the upper surface of the base 2 (see FIG. Figure 2 ) is connected to the ventilation chamber 21, the base 2 is installed at the bottom of the vacuum chamber 1, and the upper surface of the base 2 is used to carry the substrate. The mechanical pump 3 is connected to the vacuum chamber 1, and is used to evacuate the vacuum chamber 1. The first housing 4 has a first accommodating chamber 41, and the first accommodating chamber 41 is connected to the vacuum chamber 1. The evaporator 5 is installed in the first accommodating chamber 41, and the evaporator 5 is used to condense and liquefy the gas entering the first housing 4 from the vacuum chamber 1. The second housing 6 has a second accommodating chamber 61, and the second accommodating chamber 61 is connected to the first accommodating chamber 41, and the second accommodating chamber 61 is also connected to the ventilation chamber 21. The condenser 7 is installed in the second accommodating chamber 61, and the condenser 7 is used to heat the gas in the second housing 6 and then transport it to the ventilation chamber 21.

[0035] An embodiment of the present invention provides a vacuum pumping device 100, such as Figure 1 As shown, the gas in the second housing 6 can be heated by the condenser 7 in the second accommodating chamber 61, so that the hot gas can enter the vacuum chamber 1, and the hot gas can dry the vacuum chamber 1, and then take away the moisture in the vacuum chamber 1 to the first housing 4. The evaporator 5 in the first accommodating chamber 41 can condense and liquefy the gas coming out of the vacuum chamber 1 for dehumidification, and the dehumidified gas enters the second housing 6 for circulation.

[0036] In addition, if Figure 2 and Figure 3As shown, the upper surface of the base 2 is provided with a plurality of vents 22 connected to the ventilation cavity 21, so that the heated gas in the second housing 6 first enters the ventilation cavity 21 of the base 2, and then the heated gas can enter the vacuum chamber 1 through the vents 22 for dehumidification. After dehumidification, the vacuum chamber 1 can be evacuated by the mechanical pump 3, so that the vacuum chamber 1 is in a vacuum state, and then the next coating step is carried out. The coating equipment of the present application can adopt vacuum evaporation, sputtering coating, ion plating and other equipment, which can be used for vacuum semiconductor coating. The working principles of these coating equipment are different, but they all make the semiconductor material coating material deposited on the substrate, and serve as the material of the substrate. The coating step mentioned in this application is the prior art in the coating equipment.

[0037] The above-mentioned base 2 structure is described below by way of example. For example, in some embodiments of the present application, Figure 2 and Figure 3 As shown, the upper surface of the base 2 may have a substrate bearing surface 23, and a plurality of vents 22 are arranged around the substrate bearing surface 23. The vents 22 are arranged obliquely, and the air outlet direction of the vents 22 is arranged in a direction away from the substrate bearing surface 23.

[0038] In this way, if Figure 2 and Figure 3 As shown, when the gas in the first housing 4 enters the ventilation cavity 21 of the base 2, it can be discharged into the vacuum chamber 1 along the substrate carrying surface 23 (refer to Figure 1 ), in this case, the gas coming out of the ventilation cavity 21 can be dispersed more quickly in the vacuum chamber 1. In some embodiments of the present application, the vent 22 can be set to an ellipse, a polygon or a straight line, and the present application does not limit the shape of the vent 22. The outlet area of ​​multiple vents 22 added together can be smaller than the opening area at the connection point between the vacuum chamber 1 and the second housing 6. In this way, the flow radius of the gas changes from large to small, which can make the gas flow faster in the vacuum chamber 1, thereby accelerating the dehumidification efficiency. In addition, when the substrate is placed in the substrate bearing surface 23, the gas coming out of the vent 22 will not affect the substrate and can avoid the substrate. The dehumidification step can also be performed when the substrate is placed. Because the air outlet direction of the vent 22 is set in a direction away from the substrate bearing surface 23. In this way, the gas entering the vacuum chamber 1 through the vent 22 can flow obliquely along the side wall of the vacuum chamber 1, thereby avoiding the substrate as much as possible and not affecting the substrate.

[0039] In order to enable the gas to flow in the vacuum device 100, in some embodiments of the present application, Figure 4As shown, a fresh air inlet 62 is provided on the second housing 6, and a wind valve may be installed at the fresh air inlet 62, or a cover plate that can mechanically open and close the fresh air inlet 62 may be installed, and this application does not limit this. The vacuum pumping device 100 may also include a first fan 42 and a second fan 63, wherein the first fan 42 is arranged in the first housing 4, and the first housing 4 is provided with a first air inlet and a first air outlet, the first air inlet is connected to the vacuum chamber 1, and the first air outlet is connected to the second housing 6. The first fan 42 is installed at the first air inlet, and is used to transport the gas in the vacuum chamber 1 to the first housing 4. The second fan 63 is arranged in the second housing 6. The second housing 6 is provided with a second air inlet and a second air outlet. The second air inlet is connected to the first air outlet of the first housing 4. The second fan 63 covers the second air inlet and the fresh air outlet 62. The second fan 63 is used to transport the gas in the first housing 4 to the second housing 6, or to transport the gas at the fresh air outlet 62 to the second housing 6.

[0040] In this case, if Figure 4 As shown, the power generated by the first fan 42 and the second fan 63 can make the gas flow in the vacuum chamber 1, the first housing 4, the second housing 6, and then take away the gas in the vacuum chamber 1 and dehumidify. Of course, in some embodiments of the present application, when the power of the first fan 42 or the second fan 63 is sufficient, one of the fans can also be used to provide kinetic energy. The present application does not limit the number and power of the fans.

[0041] Since part of the gas passing through the surface of the evaporator 5 will be condensed and liquefied, in some embodiments of the present application, the vacuum pumping device 100 may also include: Figure 4 The liquid collecting pan 43 shown is arranged in the first housing 4 and below the evaporator 5 . The liquid collecting pan 43 is used to collect the liquid condensed on the surface of the evaporator 5 .

[0042] In this case, if Figure 4 As shown, the liquid condensed by the evaporator 5 can flow into the liquid collecting pan 43, thereby preventing the liquid from affecting the operation of the device in the first housing 4, and in other embodiments of the present application, the liquid collecting pan 43 can be configured to be pulled out. When the liquid in the liquid collecting pan 43 reaches a certain amount, the liquid collecting pan 43 can be taken out for recycling, and then the liquid collecting pan 43 can be placed back in the first housing 4 for reuse.

[0043] To realize intelligent control of the vacuum device, in some embodiments of the present application, Figure 5As shown, the vacuum pump 100 may further include a first electric valve 101, a second electric valve 102, a third electric valve 103 and a fourth electric valve 104, wherein the first electric valve 101 is installed between the vacuum chamber 1 and the first housing 4. The second electric valve 102 is installed between the first housing 4 and the second housing 6. The third electric valve 103 is installed between the second housing 6 and the ventilation chamber 21. The fourth electric valve 104 is installed between the vacuum chamber 1 and the mechanical pump 3 ( Figure 5 Not shown, can be combined with Figure 4 It can be known) between.

[0044] In this case, the first electric valve 101 , the second electric valve 102 , the third electric valve 103 and the fourth electric valve 104 can be electrically controlled to switch, thereby realizing the switching between the dehumidification and vacuuming steps.

[0045] Since the power of the mechanical pump 3 is constant when evacuating, in order to prevent the mechanical pump 3 from affecting the substrate when evacuating, in some embodiments of the present application, the vacuum pump 100 may also include: Figure 6 The main line 8, the branch line 81, the first flowmeter 82, the second flowmeter 83 and the fifth electric valve 105 shown in the figure, wherein the main line 8 is connected to the vacuum chamber 1, and the mechanical pump 3 and the fourth electric valve 104 are installed on the main line 8. One end of the branch line 81 is connected to the main line 8 between the mechanical pump 3 and the fourth electric valve 104, and the other end is connected to the atmosphere. The first flowmeter 82 is installed on the main line 8 and is located between the branch line 81 and the mechanical pump 3. The second flowmeter 83 is installed on the branch line 81. The fifth electric valve 105 is installed on the branch line 81.

[0046] In this way, combined with Figure 5 and Figure 6 As shown, in the initial stage of vacuuming, the fourth electric valve 104 is opened, and the fifth electric valve 105 is opened. Since the mechanical pump 3 is arranged on the main pipeline 8 behind the branch pipeline 81, the gas in the vacuum chamber 1 will be drawn away by the mechanical pump 3 itself along the main pipeline 8, and a part of the atmospheric gas will be drawn into the mechanical pump 3 by the branch pipeline 81 and discharged. In this case, the branch pipeline 81 can release a certain suction force of the mechanical pump 3, so that the suction force on the vacuum chamber 1 is small in the initial state. This prevents the gas in the vacuum chamber 1 from flowing out in large quantities at the beginning, so that the airflow affects the position of the substrate. As the vacuuming proceeds, the gas in the vacuum chamber 1 becomes thin, and the fifth electric valve 105 can be gradually closed. Finally, the mechanical pump 3 reaches the maximum suction force on the vacuum chamber 1, so that the vacuum chamber 1 reaches a vacuum state. When the pressure value in the vacuum chamber 1 reaches the required preset pressure threshold, the fourth electric valve 104 can be closed.

[0047] In addition, the flow values ​​measured by the first flow meter 82 and the second flow meter 83 can be used as a reference to control the opening and closing degree of the fifth electric valve 105. For example, the gas flow entering the mechanical pump 3 is Q1 (unit L / h), the gas flow of the branch pipeline 81 is Q2 (unit L / h), and the gas flow through the fourth electric valve 104 is Q3 (unit L / h), then Q1 = Q2 + Q3. Q1 is constant, and the gas flow Q3 (i.e., the gas flow out of the vacuum chamber 1) through the fourth electric valve 104 can be indirectly controlled according to the gas flow Q2 of the branch pipeline 81.

[0048] In order to enable the surface of the evaporator 5 to cool and the surface of the condenser 7 to heat, in some embodiments of the present application, the vacuum device 100 may further include: Figure 7 The refrigeration pipeline 9, the compressor 10 and the throttle valve 11 are shown, wherein the refrigeration pipeline 9 is used to circulate the refrigerant. One end of the compressor 10 is connected to the evaporator 5 through the refrigeration pipeline 9, and the other end is connected to the condenser 7 through the refrigeration pipeline 9. One end of the throttle valve 11 is connected to the evaporator 5 through the refrigeration pipeline 9, and the other end is connected to the condenser 7 through the refrigeration pipeline 9.

[0049] In this case, the compressor 10 compresses the refrigerant in the refrigeration pipeline 9 from low-temperature and low-pressure gas to high-temperature and high-pressure gas, and then condenses it into medium-temperature and high-pressure refrigerant liquid through the condenser 7, and becomes low-temperature and low-pressure refrigerant liquid after throttling through the throttle valve 11. The low-temperature and low-pressure liquid refrigerant is sent to the evaporator 5, absorbs heat and evaporates in the evaporator 5 to become low-temperature and low-pressure refrigerant vapor, and is sent to the compressor 10 again, thereby completing the refrigeration cycle.

[0050] To further realize intelligent control, in some embodiments of the present application, the vacuum device 100 may also include: Figure 8 The humidity sensor 106, the pressure sensor 107, the comparator 108 and the controller 109 shown, wherein the humidity sensor 106 is installed in the vacuum chamber 1, and is used to measure the humidity value in the vacuum chamber 1. The pressure sensor 107 is installed in the vacuum chamber 1, and is used to measure the pressure value in the vacuum chamber 1. The comparator 108, the humidity sensor 106 and the pressure sensor 107 are all electrically connected. The controller 109 is electrically connected to the comparator 108, the first electric valve 101, the second electric valve 102, the third electric valve 103, the fourth electric valve 104, the fifth electric valve 105, the first fan 42, the second fan 63 and the compressor 10.

[0051] In this way, if Figure 8As shown, the humidity sensor 106 and the pressure sensor 107 can be used as detection elements to measure the real-time parameter value in the vacuum chamber 1. The comparator 108 compares the data measured by the humidity sensor 106 and the pressure sensor 107 according to the preset threshold value, and performs corresponding control when the measured parameters of the humidity sensor 106 and the pressure sensor 107 reach the preset threshold value. The controller 109 can send control instructions to the first electric valve 101, the second electric valve 102, the third electric valve 103, the fourth electric valve 104, the fifth electric valve 105, the first fan 42, the second fan 63 and the compressor 10, so as to make the entire vacuum device 100 more intelligent.

[0052] To further illustrate the technical solution of the present application, in some embodiments of the present application, the present invention also provides a control method of a vacuum pumping device 100, comprising the vacuum pumping device 100 mentioned in the above technical solution, combined with the above mentioned Figures 1 to 8 The control method of the vacuum pumping device 100 comprises the following steps:

[0053] S1, the controller 109 controls the fourth electric valve 104 to close, the first electric valve 101, the second electric valve 102 and the third electric valve 103 are all opened, and the first fan 42, the second fan 63 and the compressor 10 are running. The condenser 7 heats the gas in the second housing 6 and transports it to the ventilation cavity 21 through the second fan 63, the first fan 42 transports the gas in the vacuum chamber 1 to the first housing 4, and the evaporator 5 condenses and liquefies the gas out of the vacuum chamber 1 and collects it. The gas cooled in the first housing 4 is transported to the second housing 6 for circulation.

[0054] S2, when the humidity value monitored by the humidity sensor 106 in the vacuum chamber 1 reaches the preset humidity threshold, stop step S1, the user opens the door of the vacuum chamber 1, places the substrate on the substrate bearing surface 23, and then closes the door of the vacuum chamber 1, and runs step S1 again, when the humidity value monitored by the humidity sensor 106 reaches the preset humidity threshold again. (When the vacuum chamber 1 is opened after dehumidification, it is also possible to generate moisture again, especially in rainy days, and dehumidification in step S1 again can ensure the dryness in the vacuum chamber 1 before the coating step). The controller 109 controls the first electric valve 101, the second electric valve 102 and the third electric valve 103 to be closed, the first fan 42, the second fan 63 and the compressor 10 to stop running, the fourth electric valve 104 to open, and the mechanical pump 3 is controlled to start to evacuate the vacuum chamber 1. At this time, the opening and closing degree of the fifth electric valve 105 can be changed from large to small to control the suction force. When the vacuum degree monitored by the pressure sensor 107 in the vacuum chamber 1 reaches a preset pressure threshold, all equipment in the vacuum pumping device 100 stops running, all valves, fans, etc. are closed, and the subsequent coating step starts.

[0055] S3, after the coating step is completed, the controller 109 controls the second fan 63 to run, the third electric valve 103 is opened, and the second fan 63 transports the gas at the fresh air inlet 62 to the ventilation chamber 21. When the pressure value in the vacuum chamber 1 reaches the atmospheric pressure of the outdoor environment, the controller 109 controls the second fan 63 to stop running and the third electric valve 103 to close. The user can open the door in the vacuum chamber 1 to take out the substrate after coating, and then close the door in the vacuum chamber 1 (because the door of the vacuum chamber 1 cannot be opened manually after evacuating the vacuum chamber 1 and coating, therefore, it is necessary to add gas to achieve a close to the external environment so that the user can open it more easily).

[0056] S4, after the vacuum chamber 1 door is opened, air will flow into the vacuum chamber 1 door, which may cause moisture to be generated in the vacuum chamber 1. Therefore, the operation can continue according to step S1. When the humidity value in the vacuum chamber 1 reaches the preset humidity threshold, the fan and the electric valve in step S1 are turned off. Finally, all programs of the coating equipment can be stopped and placed.

[0057] It should be understood that the above description of the specific embodiments of the present invention is only for illustrating the technical route and features of the present invention, and its purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, but the present invention is not limited to the above specific implementation methods. Any changes or modifications made within the scope of the claims of the present invention should be included in the protection scope of the present invention.

Claims

1. A vacuum pumping device, characterized in that: include: Vacuum chamber; A base having a ventilation cavity, a plurality of ventilation holes are provided on the upper surface of the base and are connected to the ventilation cavity, and the base is installed at the bottom of the vacuum chamber; A mechanical pump connected to the vacuum chamber and used to evacuate the vacuum chamber; A first housing having a first accommodating cavity, wherein the first accommodating cavity is connected to the vacuum chamber; An evaporator is installed in the first accommodating chamber, and the evaporator is used to transfer the liquid in the vacuum chamber to the The gas entering the first casing is condensed and liquefied; A second housing has a second accommodating cavity, the second accommodating cavity is connected to the first accommodating cavity, and the second accommodating cavity is also connected to the ventilation cavity; a condenser installed in the second accommodating cavity, the condenser being used to heat the gas in the second housing and then transport it to the ventilation cavity; The substrate carrying surface is located on the upper surface of the base, and a plurality of ventilation openings are arranged around the substrate carrying surface. The outlet areas of the plurality of ventilation openings added together are smaller than the opening area at the connection point between the vacuum chamber and the second housing. The ventilation openings are arranged at an angle, and the air outlet direction of the ventilation openings is arranged in a direction away from the substrate carrying surface.

2. A vacuum pumping device according to claim 1, characterized in that: The second housing is provided with a fresh air outlet; The vacuum pumping device also includes: a first fan, disposed in the first housing, the first housing being provided with a first air inlet and a first air outlet, the first air inlet being connected to the vacuum chamber, and the first air outlet being connected to the second housing; the first fan being installed at the first air inlet, and being used for conveying the gas in the vacuum chamber to the first housing; The second fan is arranged in the second casing. The second casing is provided with a second air inlet and a second air outlet. The second air inlet is connected to the first air outlet of the first casing. The second fan covers the second air inlet and the fresh air outlet. The second fan is used to transport the gas in the first casing to the second casing, or to transport the gas at the fresh air outlet to the second casing.

3. A vacuum pumping device according to claim 2, characterized in that: The vacuum pumping device also includes: A first electric valve is installed between the vacuum chamber and the first housing; A second electric valve is installed between the first housing and the second housing; a third electric valve, installed between the second housing and the ventilation chamber; The fourth electric valve is installed between the vacuum chamber and the mechanical pump.

4. A vacuum pumping device according to claim 3, characterized in that: The vacuum pumping device also includes: A main pipe is connected to the vacuum chamber, and the mechanical pump and the fourth electric valve are installed on the main pipe; A branch pipeline, one end of which is connected to the main pipeline between the mechanical pump and the fourth electric valve, and the other end of which is connected to the atmosphere; A first flow meter is installed on the main pipeline and located between the branch pipeline and the mechanical pump; A second flow meter is installed on the branch pipeline; The fifth electric valve is installed on the branch pipeline.

5. A vacuum pumping device according to claim 4, characterized in that: The vacuum pumping device also includes: Refrigeration pipeline, used to circulate refrigerant; A compressor, one end of which is connected to the evaporator through the refrigeration pipeline, and the other end of which is connected to the condenser through the refrigeration pipeline; A throttle valve has one end connected to the evaporator through the refrigeration pipeline, and the other end connected to the condenser through the refrigeration pipeline.

6. A vacuum pumping device according to claim 5, characterized in that: The vacuum pumping device also includes: A humidity sensor is installed in the vacuum chamber and is used to measure the humidity value in the vacuum chamber; A pressure sensor, installed in the vacuum chamber, for measuring the pressure value in the vacuum chamber; a comparator, electrically connected to both the humidity sensor and the pressure sensor; The controller is electrically connected to the comparator, the first electric valve, the second electric valve, the third electric valve, the fourth electric valve, the fifth electric valve, the first fan, the second fan and the compressor.

7. A vacuum pumping device according to claim 1, characterized in that: The vacuum pumping device also includes: The liquid collecting pan is arranged in the first housing and is located below the evaporator. The liquid collecting pan is used to collect the liquid condensed on the surface of the evaporator.

8. A method for controlling a vacuum pumping device, comprising the vacuum pumping device according to claim 6, characterized in that: The control method of the vacuum pumping device comprises the following steps: S1, the controller controls the fourth electric valve to close, the first electric valve, the second electric valve and the third electric valve to open, the first fan, the second fan and the compressor to operate; the condenser heats the gas in the second housing and transports it to the ventilation cavity through the second fan, the first fan transports the gas in the vacuum chamber to the first housing, the evaporator condenses and liquefies the gas in the vacuum chamber for dehumidification; the gas cooled in the first housing is transported to the second housing for circulation; S2, when the humidity value monitored by the humidity sensor in the vacuum chamber reaches a preset humidity threshold, all the equipment in step S1 is closed, the user opens the door of the vacuum chamber, places the substrate on the substrate carrying surface, and then closes the door of the vacuum chamber, and controls the equipment in step S1 to start running again, when the humidity value monitored by the humidity sensor reaches the preset humidity threshold again; the controller controls the first electric valve, the second electric valve and the third electric valve to be closed, the first fan, the second fan and the compressor to stop running, the fourth electric valve to open, and the mechanical pump to start pumping air into the vacuum chamber; when the vacuum degree in the vacuum chamber reaches the preset pressure threshold, all the equipment in the vacuum pumping device is closed and stops running, and the coating step is started; S3, after the coating step is finished, the controller controls the second fan to run, the third electric valve to open, and the second fan to transport the gas at the fresh air inlet to the ventilation chamber. When the pressure value in the vacuum chamber reaches the outdoor ambient pressure, the controller controls the second fan to stop running and the third electric valve to close, and the processed substrate is taken out; S4, continuing with step S1, when the humidity value in the vacuum chamber reaches a preset humidity threshold, all devices in the vacuum pumping device stop running.

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