COC Chip Loading System

Abstract

The present invention discloses a COC chip loading system, which includes a blue film loading mechanism. A chip ejector pin module is arranged below the blue film loading mechanism, and a chip transfer module is arranged above the blue film loading mechanism. The chip transfer module includes a Z-direction fixing plate, on which a Z-axis voice coil motor is fixed. An elastic mechanism is also arranged on the Z-direction fixing plate, and the restoring force of the elastic mechanism is greater than or equal to the gravity of the driving shaft of the Z-axis voice coil motor and its connecting object. The chip ejector pin module includes an ejector pin seat, on which an ejector pin is vertically arranged upward. An ejector pin cap is sleeved on the ejector pin in a vertically movable manner, and a first driving device for driving the ejector pin cap to move up and down is also provided. An ejector pin hole and at least one vacuum suction hole are arranged on the upper surface of the ejector pin cap. The present invention has the advantage that no scratches or scuffs will be left on the front and back surfaces of the chip during the demoulding, sucking and transporting of the chip.

Description

Technical Field

[0001] The present invention relates to the field of chip processing, and particularly to a COC chip feeding system that will not leave scratches or abrasions on the front and back sides of the chip during the demolding, sucking, and handling of the chip. Background Art

[0002] At present, with the rapid development of the optical communication industry, laser chip manufacturers are making the integration of chips higher and higher. Generally, in the production and processing of COC chips, a COC eutectic machine is required. During product processing, it is necessary to suck the chip from the blue film through a chip transfer mechanism and transfer it to the COC alignment table for alignment, and then suck and transfer the chip on the COC alignment table to the upper part of the COC eutectic table module through the COC chip welding transfer mechanism. However, the existing equipment will leave scratches or abrasions on the front and back sides of the chip during chip sucking and transfer, resulting in a low qualified rate of finished products. Summary of the Invention

[0003] In order to overcome the deficiencies of the prior art, the purpose of the present invention is to provide a COC chip feeding system that will not leave scratches or abrasions on the front and back sides of the chip during the demolding, sucking, and handling of the chip.

[0004] The purpose of the present invention is achieved by adopting the following technical solutions:

[0005] A COC chip feeding system includes a blue film feeding mechanism. A chip ejector pin module is arranged below the blue film feeding mechanism, and a chip transfer module is arranged above the blue film feeding mechanism. The chip transfer module includes a Z-direction fixing plate, on which a Z-axis voice coil motor is fixed. A nozzle fixing seat is also slidably arranged on the Z-direction fixing plate. The driving shaft of the Z-axis voice coil motor is connected to and drives the nozzle fixing seat to slide up and down along the Z-direction fixing plate. An elastic mechanism is also arranged on the Z-direction fixing plate. One end of the elastic mechanism is fixed on the Z-direction fixing plate and the other end is fixed on the nozzle fixing seat. A nozzle part is fixed on the nozzle fixing seat. The restoring force of the elastic mechanism is greater than or equal to the gravity of the driving shaft of the Z-axis voice coil motor and its connecting objects. The chip ejector pin module includes an ejector pin seat, on which an ejector pin is arranged vertically upward. An ejector pin cap is sleeved on the ejector pin and can move up and down. A first driving device for driving the ejector pin cap to move up and down is also provided. A ejector pin hole and at least one vacuum suction hole are arranged on the upper surface of the ejector pin cap. When the ejector pin cap moves downward, the ejector pin can penetrate through the ejector pin hole on the upper surface of the ejector pin cap. When the ejector pin cap moves upward, the ejector pin can be hidden in the ejector pin cap.

[0006] As a preferred embodiment, the nozzle portion includes a nozzle holder fixed to the nozzle base. A nozzle slideway that can match the up-and-down sliding of the nozzle is provided at the front end of the nozzle holder. The tail end of the nozzle is fixed to a nozzle slider, and the nozzle slider is arranged to slide up and down on the nozzle holder. An elastic mechanism is provided between the nozzle slider and the nozzle holder. In the normal state, the elastic mechanism applies a downward pressure to the nozzle opening.

[0007] As a preferred embodiment, two mini-bearings are provided on each of the upper and lower parts of the nozzle slideway, and the tail of the nozzle slider is slidably arranged in the chute of the nozzle holder through a mini-bearing.

[0008] As a preferred embodiment, the nozzle is a bakelite nozzle.

[0009] As a preferred embodiment, the thimble cap is fixed to the thimble cap seat, a bearing is fixed on the thimble cap seat, the first driving device is a first motor, a cam is fixed on the main shaft of the first motor, the bearing presses against the upper surface of the cam, and the surface of the upper surface of the cam in contact with the bearing unfolds into a ramp shape when the cam rotates. Thus, when the cam rotates, it presses against the bearing to drive the thimble cap to slide vertically up and down.

[0010] As a preferred embodiment, the thimble seat is arranged inside the inner ring of a linear bearing, a linear bearing seat is fixed on the outer bushing of the linear bearing, the thimble cap seat is fixed on the linear bearing seat, and the linear bearing seat is slidably arranged on a fixed block through a first slide rail.

[0011] As a preferred embodiment, it includes a thimble base, a guide rail mounting post is fixed on the thimble base, a second slide rail is fixedly arranged on the guide rail mounting post, a fixed block is slidably arranged on the second slide rail, and the thimble seat is fixed on the fixed block through a thimble seat bracket; the guide rail mounting post also fixedly mounts an electric cylinder mounting seat, a linear motor is fixed on the electric cylinder mounting seat, the linear motor drives a linear motor top block to move up and down, and the linear motor top block is fixed and drives the fixed block to slide up and down on the second slide rail.

[0012] As a preferred embodiment, the linear motor top block is fixed to the fixed block through an electric cylinder push plate.

[0013] As a preferred embodiment, an induction sheet is fixed on the linear motor top block, and a photoelectric sensor is arranged on the guide rail mounting post corresponding to the induction sheet for detecting the movement limit on the fixed block.

[0014] As a preferred embodiment, the thimble cap is hermetically arranged, an air pipe joint is communicated with the inner cavity of the thimble cap, and an external air pump generates negative pressure in the inner cavity of the thimble cap through the air pipe joint, so that the blue film is adsorbed on the upper surface of the thimble cap through the vacuum suction holes.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0016] Since the transfer module of the present invention directly drives the nozzle fixing seat and the nozzle part by a Z-axis voice coil motor, the structure is simple and the positioning accuracy is high, thus avoiding the problems of chip damage caused by excessive pressure when the nozzle descends too low and inaccurate chip positioning caused by the nozzle being too high when placing the chip; at the same time, there are thimble holes and at least one vacuum suction hole on the upper surface of the thimble cap of the chip thimble module. During operation, when the nozzle of the chip transfer module descends and presses the chip on the blue film, the vacuum suction hole of the thimble cap sucks the blue film and moves downward, so that the thimble penetrates through the thimble hole on the upper surface of the thimble cap to separate the chip from the blue film and be taken away by the nozzle. This movement method, first, makes the pressure between the thimble and the chip less than 30 g, and second, since the thimble does not move, the surface of its tip is always in a horizontal state, so that the sharp corner edge will not pierce the chip surface due to the inclination of the tip. Therefore, no scratches or scuffs will be left on the front and back of the chip during chip demolding, sucking, and handling. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the COC chip feeding system according to an embodiment of the invention;

[0018] Figure 2 It is a schematic diagram of the overall structure of the chip transfer module according to an embodiment of the invention;

[0019] Figure 3 It is an exploded view of the chip transfer module according to an embodiment of the invention;

[0020] Figure 4 It is an exploded view of the nozzle of the chip transfer module according to an embodiment of the invention;

[0021] Figure 5 It is a schematic diagram of the overall structure of the chip thimble module according to an embodiment of the invention;

[0022] Figure 6 It is an exploded view of the chip thimble module according to an embodiment of the invention;

[0023] Figure 7 For Figure 5 Partial enlarged view A;

[0024] Figure 8 For Figure 5 Partial enlarged view B. DETAILED DESCRIPTION OF THE INVENTION

[0025] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0026] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0028] A COC chip loading system, combined with Figures 1 to 8As shown, it includes a blue film loading mechanism 200. Below the blue film loading mechanism 200, there is a chip ejector pin module 300, and above the blue film loading mechanism 200, there is a chip transfer module 100. It includes a Y-axis linear motor module 31. On the Y-axis linear motor module 31, there is a voice coil motor mounting plate 32 fixed. At the front end of the voice coil motor mounting plate 32, there is a Z-direction fixing plate 29 fixed. On the Z-direction fixing plate 29, there is a Z-axis voice coil motor 33 fixed. On the Z-direction fixing plate 29, there is also a nozzle fixing seat 35 slidably arranged. The driving shaft of the Z-axis voice coil motor 33 is connected to and drives the nozzle fixing seat 35 to slide up and down along the Z-direction fixing plate 29. On the Z-direction fixing plate 29, there is also an elastic mechanism 34 arranged. One end of the elastic mechanism 34 is fixed on the Z-direction fixing plate 29 and the other end is fixed on the nozzle fixing seat 35. On the nozzle fixing seat 35, there is a nozzle part 27 fixed. The restoring force of the elastic mechanism 34 is greater than or equal to the gravity of the driving shaft of the Z-axis voice coil motor 33 and its connecting objects. In this embodiment, the elastic mechanism 34 is a tension spring. The chip ejector pin module 300 includes an ejector pin seat 7. Vertically upward on the ejector pin seat 7, there is an ejector pin 6. An ejector pin cap 15 is sleeved on the ejector pin 6 and can move up and down. On the ejector pin base 21, there is also a first driving device for driving the ejector pin cap 15 to move up and down. On the upper surface of the ejector pin cap 15, there are an ejector pin hole 15A and at least one vacuum suction hole 15B. When the ejector pin cap 15 moves downward, the ejector pin 6 can protrude from the ejector pin hole 15A on the upper surface of the ejector pin cap 15. When the ejector pin cap 15 moves upward, the ejector pin 6 can be hidden inside the ejector pin cap 15.

[0029] Since the chip transport module 100 of the present system uses the Z-axis voice coil motor 33 to directly drive the nozzle fixing seat 35 and the nozzle part 27, the structure is simple and the positioning accuracy is high, thereby avoiding the problem that the nozzle is lowered too low and the pressure is too high, causing damage to the chip, and the nozzle is lowered too high, causing inaccurate chip positioning; an elastic mechanism 34 is also provided on the Z-axis fixed plate 29, and the restoring force of the elastic mechanism 34 is greater than or equal to the gravity of the driving shaft of the Z-axis voice coil motor 33 and its connection, so that when the Z-axis voice coil motor 33 fails or loses power, the restoring force of the elastic mechanism 34 can make the nozzle part 27 rise, avoiding the nozzle from pressing on the chip due to gravity and damaging the chip; at the same time, the chip The upper surface of the ejector cap 15 of the ejector module 300 is provided with an ejector hole 15A and at least one vacuum suction hole 15B. When working, when the suction nozzle 111 of the chip transport module 100 descends to press the chip on the blue film, the vacuum suction hole 15B of the ejector cap 15 sucks the blue film and moves downward, so that the ejector 15A passes through the ejector hole 15A on the upper surface of the ejector cap, so that the chip is separated from the blue film and taken away by the suction nozzle 111. This movement mode, firstly, makes the pressure between the ejector and the chip less than 30g, and secondly, because the ejector does not move, the surface of its needle tip is always in a horizontal state, so that the sharp corners will not pierce the chip surface due to the tilt of the needle tip. Therefore, when the chip is removed from the film and sucked and transported, no scratches or scratches will be left on the front and back of the chip.

[0030] In an embodiment of a COC chip loading system, please refer to Figure 3 and Figure 4 The nozzle part 27 includes a nozzle frame 103 fixed on the nozzle base 28, and a nozzle slide 109 that can match the up and down sliding of the nozzle 111 is arranged at the front end of the nozzle frame 103. The tail end of the nozzle 111 is fixed on a nozzle slider 106, and the nozzle slider 106 is arranged on the nozzle frame 103 for sliding up and down. An elastic mechanism is arranged between the nozzle slider 106 and the nozzle frame 103. Under normal conditions, the elastic mechanism causes a downward pressure on the mouth of the nozzle 111. The elastic mechanism in this embodiment is a tension spring (not shown in the figure). In this embodiment, a spring puller 108 is fixed on one side of the nozzle holder 103. One end of the tension spring is fixed in the strip groove 107 of the nozzle slider 106, and the other end is fixed on the hook of the spring puller 108. The nozzle 111 is not fixed on the nozzle holder 103. Therefore, when the nozzle 111 presses down to absorb the chip, it will be subject to the reaction force and move upward along the Z axis. The slight downward pulling force of the tension spring will ensure that the nozzle 111 is in close contact with the chip but will not damage the chip surface. Generally, this pressure is less than 50g. In order to ensure that the chip is not damaged, a pressure of 20-30g is more appropriate; when the force of the nozzle mouth pressing on the chip is greater than this force, the nozzle holder 103 drives the nozzle to move upward.

[0031] In an embodiment of a COC chip loading system, please refer to Figure 3 andFigure 4 On the upper and lower sides of the nozzle slideway 109, two mini-bearings 110 are provided respectively. The tail of the nozzle slider 106 is slidably arranged in the chute of the nozzle holder 103 through a mini-bearing 101. For the convenience of processing, the chute is arranged on the limiting block 102 fixed to the nozzle holder 103. The nozzle holder 103 is also provided with a nozzle positioning push piece 104 corresponding to the nozzle slideway 109. There is an oblong hole on the nozzle positioning push piece 104, and it is adjusted and fixed on the nozzle holder 103 through a screw 105 to adjust the depth of its extension into the nozzle slideway 109, so that it can be applied to nozzles with different diameters.

[0032] In an embodiment of a COC chip loading system, in order to prevent the metal nozzle from scratching the chip surface, the nozzle 111 is selected as a bakelite nozzle with a lower hardness.

[0033] In an embodiment of a COC chip loading system, please refer to Figure 2 and Figure 3 A pressure sensing piece 36 is also arranged below the nozzle part 27.

[0034] In an embodiment of a COC chip loading system, please refer to Figure 2 and Figure 3 An inductor 30 is fixed on the Z-direction fixing plate 29, and an induction piece 28 matching the inductor 30 is fixed on the nozzle fixing seat 35.

[0035] In an embodiment of a COC chip loading system, please refer to Figure 7 and Figure 8 On the upper surface of the thimble cap 15, a plurality of vacuum suction holes 15B are arranged around the thimble hole 15A. Thus, the chip can be horizontally separated from the blue film.

[0036] In an embodiment of a COC chip loading system, please refer to Figures 5 to 8 The thimble cap 15 is fixed on the thimble cap seat 8. A bearing 26 is fixed on the thimble cap seat 8 through a roller frame 13. The first driving device is a first motor 23. A cam 22 is fixed on the main shaft of the first motor 23. The bearing 26 abuts against the upper surface of the cam 22. When the cam 22 rotates, the surface in contact with the bearing 26 on its upper surface unfolds into a ramp shape. Thus, when the cam 22 rotates, it presses against the bearing 26 to drive the thimble cap 15 to slide vertically up and down. This structure of driving the thimble cap 15 to slide vertically up and down by pressing against the bearing 26 when the cam 22 rotates enables the thimble cap 15 to move downward slowly and evenly, thus avoiding the displacement of other surrounding chips.

[0037] In an embodiment of a COC chip loading system, please refer to Figure 5 and Figure 6, the thimble base 7 is arranged inside the inner ring of the linear bearing 9. A linear bearing seat 10 is fixed on the outer bushing of the linear bearing 9. The thimble cap seat 8 is fixed on the linear bearing seat 10. The linear bearing seat 10 is slidably arranged on a fixed block 19 through a first slide rail 20.

[0038] In an embodiment of a COC chip loading system, please refer to Figure 5 and Figure 6 , a thimble base 21. A guide rail mounting post 17 is fixed on the thimble base 21. A second slide rail 18 is fixedly arranged on the guide rail mounting post 17. A fixed block 19 is slidably arranged on the second slide rail 18. The thimble base 7 is fixed on the fixed block 19 through a thimble base bracket 11. The guide rail mounting post 17 is also fixedly provided with an electric cylinder mounting seat 3. A linear motor 4 is fixed on the electric cylinder mounting seat 3. The linear motor 4 drives a linear motor top block 2 to move up and down. The linear motor top block 2 is fixed and drives the fixed block 19 to slide up and down on the second slide rail 18. The overall up and down movement adjustment of the thimble part is realized.

[0039] In an embodiment of a COC chip loading system, please refer to Figure 5 and Figure 6 , the linear motor top block 2 is fixed on the fixed block 19 through an electric cylinder push plate 16.

[0040] In an embodiment of a COC chip loading system, please refer to Figure 5 and Figure 6 , an induction sheet 1 is fixed on the linear motor top block 2. A photoelectric sensor 14 is arranged on the guide rail mounting post 17 corresponding to the induction sheet 1 for detecting the movement limit of the fixed block 19. Thus, the position deviation during the overall up and down movement of the thimble part is avoided.

[0041] In an embodiment of a COC chip loading system, please refer to Figure 5 and Figure 6 , it further includes a module base 25. An XY-axis slide table 24 is arranged on the module base 25. The thimble base 21 is arranged on the XY-axis slide table 24.

[0042] In an embodiment of a COC chip loading system, please refer to Figure 5 and Figure 6 , the thimble cap 15 is hermetically arranged. The inner cavity of the thimble cap is communicated with an air pipe joint 12. An external air pump generates negative pressure in the inner cavity of the thimble cap 15 through the air pipe joint 12, so that the blue film is adsorbed on the upper surface of the thimble cap 15 through the vacuum suction holes 15B.

[0043] In an embodiment of a COC chip loading system, please refer to Figure 1 and Figure 2 , the thimble 6 is fixed on the thimble base 7 through a thimble nut 5.

[0044] The above are only embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, shall be similarly included in the patent protection scope of the present invention.

Claims

1. A COC chip loading system, characterized in that, It includes a blue film loading mechanism, a chip ejector pin module is arranged below the blue film loading mechanism, and a chip transfer module is arranged above the blue film loading mechanism; the chip transfer module includes a Z-direction fixing plate, a Z-axis voice coil motor is fixed on the Z-direction fixing plate, and a nozzle fixing seat is also slidably arranged on the Z-direction fixing plate. The driving shaft of the Z-axis voice coil motor is connected to and drives the nozzle fixing seat to slide up and down along the Z-direction fixing plate. An elastic mechanism is also arranged on the Z-direction fixing plate. One end of the elastic mechanism is fixed on the Z-direction fixing plate and the other end is fixed on the nozzle fixing seat. A nozzle part is fixed on the nozzle fixing seat. The restoring force of the elastic mechanism is greater than or equal to the gravity of the driving shaft of the Z-axis voice coil motor and its connecting objects; the chip ejector pin module includes an ejector pin seat, an ejector pin is arranged vertically upward on the ejector pin seat, an ejector pin cap is sleeved on the ejector pin and can move up and down, and a first driving device for driving the ejector pin cap to move up and down is arranged on the ejector pin seat. The upper surface of the ejector pin cap is provided with an ejector pin hole and at least one vacuum suction hole; when the ejector pin cap moves downward, the ejector pin penetrates out of the ejector pin hole on the upper surface of the ejector pin cap, and when the ejector pin cap moves upward, the ejector pin is hidden in the ejector pin cap.

2. The COC chip loading system according to claim 1, characterized in that, The nozzle part includes a nozzle holder fixed on a nozzle base. A nozzle slideway that can match the up and down sliding of the nozzle is arranged at the front end of the nozzle holder. The tail end of the nozzle is fixed on a nozzle slider. The nozzle slider is slidably arranged up and down on the nozzle holder. An elastic mechanism is arranged between the nozzle slider and the nozzle holder. In the normal state, the elastic mechanism makes the nozzle mouth part have a downward pressure.

3. The COC chip loading system according to claim 2, characterized in that, Two mini bearings are arranged above and below the nozzle slideway respectively. The tail of the nozzle slider is slidably arranged in the chute of the nozzle holder through a mini bearing.

4. The COC chip loading system according to claim 2, characterized in that, The nozzle is a bakelite nozzle.

5. The COC chip loading system according to claim 1, characterized in that, The ejector pin cap is fixed on an ejector pin cap seat. A bearing is fixed on the ejector pin cap seat. The first driving device is a first motor. A cam is fixed on the main shaft of the first motor. The bearing presses against the upper surface of the cam. When the cam rotates, the surface in contact with the bearing on the upper surface is unfolded into a slope shape. Thus, when the cam rotates, it presses against the bearing to drive the ejector pin cap to slide vertically up and down.

6. The COC chip loading system according to claim 5, characterized in that, The ejector pin seat is arranged inside the inner ring of a linear bearing. A linear bearing seat is fixed on the outer bushing of the linear bearing. The ejector pin cap seat is fixed on the linear bearing seat. The linear bearing seat is slidably arranged on a fixed block through a first slide rail.

7. The COC chip loading system according to claim 6, characterized in that, It includes an ejector pin base. A guide rail mounting post is fixed on the ejector pin base. A second slide rail is fixedly arranged on the guide rail mounting post. A fixed block is slidably arranged on the second slide rail. The ejector pin seat is fixed on the fixed block through an ejector pin seat bracket; a linear motor mounting seat is also fixed on the guide rail mounting post. A linear motor is fixed on the linear motor mounting seat. The linear motor drives a linear motor top block to move up and down. The linear motor top block is fixed and drives the fixed block to slide up and down on the second slide rail.

8. The COC chip loading system according to claim 7, characterized in that, The linear motor top block is fixed on the fixed block through an electric cylinder push plate.

9. The COC chip loading system according to claim 7, characterized in that, An induction piece is fixed on the linear motor top block. A photoelectric sensor is arranged on the guide rail mounting post corresponding to the induction piece for detecting the movement limit of the fixed block.

10. The COC chip loading system according to claim 1, characterized in that, The thimble cap is hermetically sealed. A tracheal joint is connected to the inner cavity of the thimble cap. An external air pump generates negative pressure in the inner cavity of the thimble cap through the tracheal joint, so that the blue film is adsorbed on the upper surface of the thimble cap through the vacuum suction holes.

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