Conductive Structure and Display Device

Abstract

The present application discloses a conductive structure and a display device. The conductive structure includes a first inorganic film layer, a metal conductive layer, a first organic film layer, and a second inorganic film layer. The metal conductive layer is disposed on the first inorganic film layer. The metal conductive layer includes a plurality of spaced-apart conductive lines. The first organic film layer is disposed on one side of the first inorganic film layer and covers the metal conductive layer. The first organic film layer has a first opening. The second inorganic film layer is disposed on the side of the first organic film layer away from the first inorganic film layer. The second inorganic film layer includes a spacer disposed within the first opening, and the spacer is located between adjacent conductive lines. According to the embodiments provided by the present application, the conductive structure and the display device provided by the present application are provided with spacers between adjacent conductive lines, which can avoid or reduce the corrosion of the conductive lines to a certain extent.

Description

Technical Field

[0001] The present application relates to the field of display panels, and particularly to a conductive structure and a display device. Background Art

[0002] In the related art, multiple conductive lines are arranged in a display device for signal transmission, and an organic film layer is arranged to cover the conductive lines to achieve insulation between adjacent conductive lines. After the organic material in the organic film layer absorbs water, the conductivity of the organic film layer increases, enabling the organic film layer to provide an electron migration environment for adjacent conductive lines. When there is a large voltage difference between adjacent conductive lines, an electric field is formed between the adjacent conductive lines. Among the adjacent conductive lines, one releases metal ions, which are transferred to the other conductive line through the organic film layer under the drive of the electric field force, thus presenting the phenomenon of corrosion of the conductive lines and affecting the service life of the display device. Summary of the Invention

[0003] Embodiments of the present application provide a conductive structure and a display device, aiming to set a spacer between adjacent conductive lines to avoid or reduce the corrosion of the conductive lines to a certain extent.

[0004] An embodiment of the first aspect of the present application provides a conductive structure, which includes a first inorganic film layer, a metal conductive layer, a first organic film layer, and a second inorganic film layer. The metal conductive layer is arranged on the first inorganic film layer. The metal conductive layer includes a plurality of spaced conductive lines. The first organic film layer is arranged on one side of the first inorganic film layer and covers the metal conductive layer. The first organic film layer has a first opening. The second inorganic film layer is arranged on the side of the first organic film layer away from the first inorganic film layer. The second inorganic film layer includes a spacer arranged in the first opening, and the spacer is located between adjacent conductive lines.

[0005] According to the embodiment of the first aspect of the present application, the first opening exposes the first inorganic film layer, and the spacer is connected to the first inorganic film layer through the first opening.

[0006] According to any one of the foregoing embodiments of the first aspect of the present application, the spacer includes spaced side walls and a bottom wall connecting the side walls. The side walls are connected to the first organic film layer, and the bottom wall is connected to the first inorganic film layer.

[0007] According to any one of the foregoing embodiments of the first aspect of the present application, the side walls and the bottom wall enclose a cavity.

[0008] According to any one of the foregoing embodiments of the first aspect of the present application, the second inorganic film layer further includes a covering portion, and the orthographic projection of the covering portion on the first inorganic film layer overlaps with the orthographic projection of the first organic film layer on the first inorganic film layer.

[0009] According to any one of the foregoing embodiments of the first aspect of the present application, the covering portion is connected to the side walls.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the first inorganic film layer includes a plurality of grooves arranged at intervals, the conductive circuits are at least partially arranged in the grooves, and the plurality of conductive circuits correspond one-to-one to the plurality of grooves.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, along a direction perpendicular to the first inorganic film layer to the second inorganic film layer, the wall surface defining the groove in the first inorganic film layer is spaced apart from the conductive circuit to form a gap, and the first organic film layer fills the gap.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the spacer on the first inorganic film layer falls between adjacent grooves.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, along a direction perpendicular to the first inorganic film layer to the second inorganic film layer, the spacing distance between adjacent grooves is greater than the width of the spacing portion.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the voltage difference between adjacent conductive circuits is greater than or equal to 5V.

[0015] An embodiment of the second aspect of the present application further provides a display device, comprising a display panel and a conductive structure provided by any embodiment of the first aspect, wherein the conductive structure is electrically connected to the display panel.

[0016] In the conductive structure and display device provided in the embodiments of the present application, a first opening is opened on the first organic film layer, and the second inorganic film layer includes a spacer portion arranged in the first opening, the spacer portion separates adjacent conductive circuits, and the spacer portion prepared by the inorganic material can separate the first organic film layer. Even if the conductivity of the first organic film layer is improved after absorbing water, the first organic film layer separated by the spacer portion cannot provide an electron transmission path for the adjacent conductive circuit. In the case of an electric field between adjacent conductive circuits, the adjacent conductive circuits cannot exchange electrons and ions through the first organic film layer, thereby avoiding or reducing corrosion of the conductive circuits to a certain extent and improving the service life of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0018] Figure 1 It is a schematic cross-sectional structure diagram of a conductive structure provided by an embodiment of the first aspect of the present application;

[0019] Figure 2It is a schematic cross-sectional structure diagram of another conductive structure provided by an embodiment of the first aspect of the present application;

[0020] Figure 3 It is a schematic cross-sectional structure diagram of another conductive structure provided by an embodiment of the first aspect of the present application;

[0021] Figure 4 It is a schematic cross-sectional structure diagram of another conductive structure provided by an embodiment of the first aspect of the present application;

[0022] Figure 5 It is a schematic cross-sectional structure diagram of another conductive structure provided by an embodiment of the first aspect of the present application.

[0023] Explanation of reference numerals:

[0024] 10. Conductive structure;

[0025] 1. First inorganic film layer; 11. Groove; 111. Wall surface; 112. Gap;

[0026] 2. First organic film layer; 21. First opening;

[0027] 3. Second inorganic film layer; 31. Spacing part; 311. Side wall; 312. Bottom wall; 32. Covering part.

[0028] 4. Conductive line. Detailed implementation manners

[0029] The features and exemplary embodiments of each aspect of the present application will be described in detail below. For the purpose of making the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is only for providing a better understanding of the present application by showing examples of the present application.

[0030] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variants thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0031] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "above" or "over" another layer or another region, it may mean directly above the other layer or another region, or there may be other layers or regions between it and the other layer or another region. And if the component is flipped, this layer or region will be "below" or "under" the other layer or another region.

[0032] In existing display devices, multiple conductive lines are provided in the display device for signal transmission, and an organic film layer is provided to cover the conductive lines to achieve insulation between adjacent conductive lines. After the organic material in the organic film layer absorbs water, the conductivity of the organic film layer increases, enabling the organic film layer to provide an electron migration environment for adjacent conductive lines. When there is a large voltage difference between adjacent conductive lines, an electric field is formed between the adjacent conductive lines. Among the adjacent conductive lines, one releases metal ions, and under the drive of the electric field force, the metal ions are transferred through the organic film layer to the other conductive line, thus presenting the phenomenon of conductive line corrosion and affecting the service life of the display device.

[0033] To solve the above problems, embodiments of the present application provide a conductive structure and a display device. The following will describe the embodiments of the conductive structure and the display device with reference to the accompanying drawings.

[0034] Please refer to Figure 1In a first aspect of the present application, an embodiment provides a conductive structure 10, which includes a first inorganic film layer 1, a metal conductive layer (not shown in the figure), a first organic film layer 2, and a second inorganic film layer 3. The metal conductive layer is disposed on the first inorganic film layer 1, and the metal conductive layer includes a plurality of conductive lines 4 disposed at intervals. The first organic film layer 2 is disposed on one side of the first inorganic film layer 1 and covers the metal conductive layer. The first organic film layer 2 has a first opening 21. The second inorganic film layer 3 is disposed on a side of the first organic film layer 2 away from the first inorganic film layer 1. The second inorganic film layer 3 includes a spacer 31 disposed in the first opening 21, and the spacer 31 is located between adjacent conductive lines 4.

[0035] Among them, the material of the first inorganic film layer 1 and the second inorganic film layer 3 is an insulating material, which can be one of silicon oxide, silicon nitride or silicon oxynitride. Silicon oxide, silicon nitride and silicon oxynitride have good waterproof performance and can play a good water and oxygen barrier effect. The spacer 31 is also made of the above-mentioned inorganic material. The material of the first organic film layer 2 is an organic insulating material to achieve the insulation of adjacent conductive circuits 4. Optionally, the material of the first organic film layer 2 is an organic silicon compound, diphenylene, styrene, etc. Compared with the inorganic material in the inorganic film layer, the organic material of the first organic film layer 2 has a poor ability to block water and oxygen. The organic material can form a conductive dielectric layer after absorbing water. The multiple conductive circuits 4 include at least signal lines of different voltages, high potential signal lines such as VGH, output signal lines of Scan circuits, switch signal lines of crack detection circuits, etc.; low potential signal lines such as VGL, Vrefn, output signal lines of EM circuits, etc. The spacer 31 can only cover the inner wall surface of the first opening 21 and not completely fill the first opening 21, or it can completely fill the first opening 21.

[0036] The conductive structure 10 of this embodiment is formed by opening a first opening 21 on the first organic film layer 2, and the second inorganic film layer 3 includes a spacer 31 arranged in the first opening 21, and the spacer 31 separates adjacent conductive lines. The spacer 31 made of inorganic material can separate the first organic film layer 2. Even if the conductivity of the first organic film layer 2 is improved after absorbing water, the first organic film layer 2 separated by the spacer 31 cannot provide an electron transmission path for the adjacent conductive lines. In the case of an electric field between adjacent conductive lines 4, electron and ion exchange cannot be carried out between the adjacent conductive lines 4, which can avoid or reduce the corrosion of the conductive lines 4 to a certain extent, and improve the service life of the display device using the conductive structure 10.

[0037] In some embodiments, the first opening 21 exposes the first inorganic film layer 1, and the spacer 31 is connected to the first inorganic film layer 1 through the first opening 21. That is, the first opening 21 is a through hole, the first opening 21 penetrates the first inorganic film layer 1, and the first inorganic film layer 1 and the second inorganic film layer 3 are directly connected. At this time, the first inorganic film layer 1 and the second inorganic film layer 3 cooperate to form a closed area spaced between adjacent conductive lines 4, blocking the first organic film layer 2 from forming an electron transmission path, and having a better effect of blocking water and oxygen. When preparing the conductive structure 10, the first inorganic film layer 1 can be provided, a metal conductive layer is formed on the first inorganic film layer 1, and then a first organic film layer 2 covering the metal conductive layer is formed. The first opening 21 is formed in the area of the first organic film layer 2 between adjacent metal conductive layers by etching. The first opening 21 penetrates the first organic film layer 2 and extends to the first inorganic film layer 1. Finally, a spacer 31 connected to the first inorganic film layer 1 is formed at the first opening 21.

[0038] Please refer to Figure 2 , in some embodiments, the spacer 31 completely fills the first opening 21, and the surface of the spacer 31 away from the first inorganic film layer 1 is a plane.

[0039] Please refer to Figure 3 , in some embodiments, the spacer 31 includes side walls 311 arranged at intervals and a bottom wall 312 connecting the side walls 311. The side walls 311 are connected to the first organic film layer 2, and the bottom wall 312 is connected to the first inorganic film layer 1.

[0040] The thickness of the side walls 311 in the direction perpendicular to the direction from the first inorganic film layer 1 to the second inorganic film layer 3 and the thickness of the bottom wall 312 in the direction from the first inorganic film layer 1 to the second inorganic film layer 3 can be the same, and they are formed together by deposition and other methods to form a film layer extending along the first organic film layer 2.

[0041] Since it is relatively simple to set a thicker first organic film layer 2 compared to the second inorganic film layer 3, the thickness of the first organic film layer 2 is much greater than the thickness of the second inorganic film layer 3. Optionally, the thickness of the first organic film layer is 2 - 2.5 μm, and the thickness of the second inorganic film layer 3 is 0.3 - 0.5 μm. Therefore, when preparing the spacer 31 by deposition, the thickness of the side walls 311 and the bottom wall 312 is approximately the same, and within a certain time, the deposited side walls 311 and bottom wall 312 cannot completely fill the first opening 21. Therefore, in some embodiments, the side walls 311 and the bottom wall 312 enclose a cavity. In the case where other functional layers need to be prepared on the conductive structure 10, a second organic film layer can be provided on the side of the second inorganic film layer 3 away from the first inorganic film layer 1, and the second organic film layer fills the cavity, thereby planarizing the second inorganic film layer 3.

[0042] In some embodiments, the second inorganic film layer 3 further includes a covering portion 32, and the covering portion 32 overlaps the orthographic projection of the first inorganic film layer 1 with the orthographic projection of the first organic film layer 2 on the first inorganic film layer 1. The covering portion 32 of the second inorganic film layer 3 covers the first organic film layer 2, which can block water vapor from entering the first organic film layer 2 on the one hand, and the second inorganic film layer 3 serves as other functional layers, for example, the second inorganic film layer 3 can serve as a buffer layer to protect other film layers from damage caused by external forces. Optionally, the covering portion 32 is connected to the side wall 311. The covering portion 32 and the side wall 311 can be prepared together, and the second inorganic film layer 3 completely covers the first inorganic film layer 1 and the first organic film layer 2, which can effectively block water vapor from entering the first organic film layer 2, and the protection effect is also better.

[0043] Please refer to Figure 4 In some embodiments, the first inorganic film layer 1 includes a plurality of grooves 11 arranged at intervals, the conductive circuit 4 is at least partially arranged in the groove 11, and the plurality of conductive circuits 4 correspond to the plurality of grooves 11 one by one. Optionally, the grooves 11 are formed by etching. The grooves 11 are provided on the first inorganic film layer 1, and the conductive circuits 4 are placed in the grooves 11. On the one hand, it is convenient to position and fix the conductive circuits 4. On the other hand, the inorganic material spaced between the grooves 11 can provide a certain insulation protection for the conductive circuits 4. The first inorganic film layer 1 can also prevent some water vapor from entering and damaging the conductive circuits 4.

[0044] Please refer to Figure 5 In some embodiments, along the direction perpendicular to the first inorganic film layer 1 to the second inorganic film layer 3, the wall surface 111 defining the groove 11 in the first inorganic film layer 1 is spaced from the conductive circuit 4 to form a gap 112, and the first organic film layer 2 fills the gap 112. Along the direction perpendicular to the first inorganic film layer 1 to the second inorganic film layer 3, the width of the conductive circuit 4 is smaller than the width of the groove 11, so that a gap 112 can be formed between the wall surface 111 of the groove 11 and the conductive circuit 4, and the first organic film layer 2 fills the gap 112, so that the conductive circuit 4 is tightly wrapped, which plays a certain role in insulating and protecting the conductive circuit 4 and makes the structure of the conductive structure 10 more stable.

[0045] In some embodiments, the orthographic projection of the spacer 31 on the first inorganic film layer 1 falls between adjacent grooves 11. The spacer 31 and the first inorganic film layer 1 between adjacent grooves 11 are provided between adjacent conductive circuits 4, and both parts can separate the first organic film layer 2, preventing the first organic film layer 2 from forming an electron transmission path for adjacent conductive circuits 4, thereby avoiding or reducing corrosion of the conductive circuits 4.

[0046] In some embodiments, along a direction perpendicular to the first inorganic film layer 1 to the second inorganic film layer 3, the spacing distance d2 between adjacent grooves 11 is greater than the width d1 of the spacer portion 31. That is, along a direction perpendicular to the first inorganic film layer 1 to the second inorganic film layer 3, the width d2 of the first inorganic film layer 1 between adjacent conductive lines 4 is greater than the width d1 of the spacer portion 31. Obviously, the more inorganic material there is between adjacent conductive lines 4, the better the water vapor barrier effect.

[0047] In some embodiments, the voltage difference between adjacent conductive lines 4 is greater than or equal to 5V. When the voltage difference between two adjacent conductive lines 4 is greater than or equal to 5V, an electric field can be formed between adjacent conductive lines 4, thereby causing electron migration. By arranging the spacer portion 31 between conductive lines 4 with a voltage difference greater than or equal to 5V, water vapor transmission can be blocked and the electron transmission path can be blocked.

[0048] In a second aspect, an embodiment of the present application further provides a display device, including a display panel and the conductive structure 10 provided in any of the embodiments of the first aspect above, and the conductive structure 10 is electrically connected to the display panel. The display device may further include a display device layer, in which a plurality of light-emitting units are provided, and the conductive lines 4 in the conductive structure 10 provide electrical signals for each light-emitting unit.

[0049] In the display device provided in the embodiment of the present application, for the related structure having the aforementioned conductive structure 10, reference may be made to the conductive structure 10 provided in the above embodiments, and it has all the beneficial effects of the aforementioned conductive structure 10, which will not be elaborated here.

[0050] In accordance with the embodiments of the present application as described above, these embodiments do not describe all the details in detail, nor do they limit the invention to only the specific embodiments. Obviously, based on the above description, many modifications and variations can be made. These embodiments are selected and specifically described in this specification to better explain the principle and practical application of the present application, so that those skilled in the art can make good use of the present application and its modifications based on the present application. The present application is only limited by the claims and their full scope and equivalents.

Claims

1. A conductive structure, characterized in that, the conductive structure includes: a first inorganic film layer; a metal conductive layer disposed on the first inorganic film layer, the metal conductive layer including a plurality of spaced conductive lines; a first organic film layer disposed on one side of the first inorganic film layer and covering the metal conductive layer, the first organic film layer having a first opening, the first inorganic film layer including a plurality of spaced grooves, and at least a part of the conductive lines being disposed in the grooves; a second inorganic film layer disposed on a side of the first organic film layer away from the first inorganic film layer, the second inorganic film layer including a spacer portion disposed in the first opening, the spacer portion being located between adjacent conductive lines; wherein the first inorganic film layer and the second inorganic film layer include an insulating material, and along a direction perpendicular to the first inorganic film layer to the second inorganic film layer, a wall surface defining the groove in the first inorganic film layer is spaced from the conductive line to form a gap, and the first organic film layer fills the gap.

2. The conductive structure according to claim 1, characterized in that, the first opening exposes the first inorganic film layer, and the spacer portion is connected to the first inorganic film layer through the first opening.

3. The conductive structure according to claim 2, characterized in that, the spacer portion includes spaced side walls and a bottom wall connecting the side walls, the side walls are connected to the first organic film layer, and the bottom wall is connected to the first inorganic film layer.

4. The conductive structure according to claim 3, characterized in that, the side walls and the bottom wall enclose to form a cavity.

5. The conductive structure according to claim 3, characterized in that, the second inorganic film layer further includes a covering portion, and a projection of the covering portion on the first inorganic film layer overlaps with a projection of the first organic film layer on the first inorganic film layer.

6. The conductive structure according to claim 5, characterized in that, the covering portion is connected to the side walls.

7. The conductive structure according to claim 2, characterized in that, the first inorganic film layer includes a plurality of spaced grooves, at least a part of the conductive lines are disposed in the grooves, and the plurality of conductive lines correspond to the plurality of grooves one by one.

8. The conductive structure according to claim 7, characterized in that, along a direction perpendicular to the first inorganic film layer to the second inorganic film layer, a spacing distance between adjacent grooves is greater than a width of the spacer portion.

9. The conductive structure according to claim 1, characterized in that, a voltage difference between adjacent conductive lines is greater than or equal to 5V.

10. A display device, characterized in that, it includes: a display panel; the conductive structure according to any one of claims 1 - 9, the conductive structure being electrically connected to the display panel.

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