Metallized film and metallized thin film capacitors

Abstract

This invention discloses a metallized film and a metallized film capacitor. The metallized film includes an organic thin film layer, a high sheet resistance layer, and multiple thickened ribs. The width of the organic thin film layer is greater than the width of the high sheet resistance layer, creating an unplated area through the width difference between the organic thin film layer and the high sheet resistance layer. The high sheet resistance layer is deposited on one side of the organic thin film layer, and the multiple thickened ribs are spaced apart on the other side of the high sheet resistance layer opposite to the organic thin film layer. This effectively increases the interlayer air gap of the metallized film capacitor, prevents incomplete self-healing and short circuits due to small interlayer air gaps during self-healing, and ensures the safety of the metallized film capacitor.

Description

Technical Field

[0001] This invention relates to the field of capacitor manufacturing technology, and in particular to a metallized film and a metallized thin-film capacitor comprising such a metallized film. Background Technology

[0002] Metallized films are widely used in the film capacitor industry, providing the dielectric layer and electrodes for film capacitors. Roll-wound film capacitors are mostly made by winding metallized films. Due to the miniaturization trend of metallized film capacitors, there is a need to continuously improve the voltage withstand capability per unit thickness of the metallized film.

[0003] In related technologies, increasing the sheet resistance layer is often used to improve the withstand voltage per unit thickness of the metallized film. However, when the metallized film produced in this way is wound into a metallized film capacitor, if the interlayer pressure is too high, the small interlayer air gap will cause problems such as difficulty in arcing during self-healing and difficulty in forming the insulating ring required for self-healing. Summary of the Invention

[0004] The present invention aims to at least partially solve one of the technical problems in the aforementioned technologies. Therefore, one objective of the present invention is to provide a metallization film that can effectively increase the interlayer air gap in metallized film capacitors, preventing incomplete self-healing and short circuits due to small interlayer air gaps during self-healing; and ensuring the safety of the metallized film capacitor in use.

[0005] The second objective of this invention is to provide a metallized thin-film capacitor.

[0006] To achieve the above objectives, a first aspect of the present invention provides a metallized film comprising: an organic thin film layer, a high sheet resistance layer, and multiple thickened ribs; wherein the high sheet resistance layer is deposited on one side of the organic thin film layer, and the multiple thickened ribs are spaced apart on the other side of the high sheet resistance layer opposite to the organic thin film layer; the width of the organic thin film layer is greater than the width of the high sheet resistance layer, so that an uncoated area is formed by the width difference between the organic thin film layer and the high sheet resistance layer.

[0007] The present invention includes: an organic thin film layer, a high sheet resistance layer, and multiple thickened ribs; wherein, the high sheet resistance layer is deposited on one side of the organic thin film layer, and the width of the organic thin film layer is greater than the width of the high sheet resistance layer, so as to create an unplated area through the width difference between the organic thin film layer and the high sheet resistance layer, thereby forming an edge in the unplated area; multiple thickened ribs are distributed at intervals on the other side of the high sheet resistance layer relative to the organic thin film layer, that is, multiple thickened ribs are provided on the other side of the high sheet resistance layer relative to the organic thin film layer, so as to increase the interlayer air gap between the metallized films after the metallized film is wound; thereby effectively increasing the interlayer air gap of the metallized film capacitor made of the metallized film, preventing incomplete self-healing and short circuits due to small interlayer air gaps during self-healing; and ensuring the safety of the metallized film capacitor in use.

[0008] In addition, the metallization film proposed in the above embodiments of the present invention may also have the following additional technical features:

[0009] Optionally, the extension direction of the thickened rib is parallel to the winding direction of the metallized film.

[0010] Optionally, the extension direction of the thickened rib is perpendicular to the winding direction of the metallized film.

[0011] Optionally, it further includes a thickening layer disposed on the surface of the high sheet resistance layer and located on the same side as the thickening rib.

[0012] Optionally, the thickened layer is integrated with the multiple thickened ribs.

[0013] Optionally, the extension length of the thickened rib is less than or equal to half the width of the metallized film.

[0014] To achieve the above objectives, a second aspect of the present invention provides a metallized thin-film capacitor comprising two metallized films as described above, wherein the two metallized films are staggered.

[0015] The metallized film capacitor according to an embodiment of the present invention is made by staggered winding of two metallized films, which can effectively increase the amount of interlayer air gap and prevent short circuits caused by incomplete self-healing due to small interlayer air gap during self-healing; thus ensuring the safety of the metallized film capacitor in use. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the metallization film according to an embodiment of the present invention;

[0017] Figure 2 This is a schematic diagram of the structure of a metallization film according to another embodiment of the present invention;

[0018] Figure 3This is a schematic diagram of the structure of a metallized film according to another embodiment of the present invention. Detailed Implementation

[0019] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0020] In related technologies, a high sheet resistance layer is added to improve the withstand voltage per unit thickness of the metallized film. When the metallized film produced in this way is wound into a metallized thin-film capacitor, if the interlayer pressure is too high, the small interlayer air gap will cause problems such as difficulty in arc initiation during self-healing, and difficulty in forming the insulating ring required for self-healing. The present invention includes: an organic thin film layer, a high sheet resistance layer, and multiple thickened ribs; wherein, the high sheet resistance layer is deposited on one side of the organic thin film layer, and the multiple thickened ribs are spaced apart on the other side of the high sheet resistance layer opposite to the organic thin film layer. The width of the organic thin film layer is greater than that of the high sheet resistance layer, so that an unplated area is set by the width difference between the organic thin film layer and the high sheet resistance layer, thereby forming an edge in the unplated area; that is, multiple thickened ribs are provided on the other side of the high sheet resistance layer opposite to the organic thin film layer, so that the interlayer air gap between the metallized films is increased after the metallized film is wound; thereby effectively increasing the interlayer air gap of the metallized film capacitor made of the metallized film, preventing short circuits due to incomplete self-healing caused by small interlayer air gaps during self-healing; and ensuring the safety of the metallized film capacitor in use.

[0021] To better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the invention to those skilled in the art.

[0022] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0023] Figure 1 This is a schematic diagram of the structure of the metallization film according to an embodiment of the present invention; as shown. Figure 2 As shown, the metallized film includes: an organic thin film layer 10, a high sheet resistance layer 20, and multiple thickened ribs 30.

[0024] The high sheet resistance layer 20 is deposited on one side of the organic thin film layer 10, and multiple thickened ribs 30 are distributed at intervals on the other side of the high sheet resistance layer 20 relative to the organic thin film layer 10.

[0025] The high sheet resistance layer 20 can be made of various materials; for example, the high sheet resistance layer 20 can be made of aluminum, zinc, or zinc-aluminum.

[0026] If the width of the organic thin film layer 10 is greater than the width of the high sheet resistance layer 20, then there is a width difference between the organic thin film layer 10 and the high sheet resistance layer 20. Thus, the range within this width difference is the uncoated region 40, so that an edge is formed through the uncoated region 40.

[0027] There are several ways to set the thickened rib 30.

[0028] As an example, such as Figure 2 As shown, the extension direction of the thickened rib 30 is parallel to the winding direction of the metallized film, that is, the extension direction of the thickened rib 30 is perpendicular to the current direction.

[0029] As another example, such as Figure 1 As shown, the extension direction of the thickened rib 30 is perpendicular to the winding direction of the metallized film. That is to say, the extension direction of the thickened rib 30 is consistent with the current direction. This is beneficial to increase the cross-sectional area in the current direction, reduce the heat loss of the final metallized film capacitor during operation, and facilitate heat conduction.

[0030] It should be noted that the above-mentioned arrangement of the extension direction of the thickened rib 30 is only a preferred arrangement, and this application is not limited thereto. It can be understood that setting the thickened rib 30 at a certain angle to the winding direction of the metallized film can also increase the air gap, prevent short circuits due to incomplete self-healing caused by small interlayer air gaps during self-healing, and improve safety.

[0031] In some embodiments, such as Figure 3 As shown, the metallized film proposed in this embodiment of the invention further includes a thickened layer 50, which is disposed on the surface of the high sheet resistance layer 20 and located on the same side as the thickened rib 30. It can be understood that the thickened layer 50 can be an independent layer. Preferably, the thickened layer 50 can be integrally formed with the thickened rib 30; that is, the thickened layer 50 and the thickened rib 30 are in the same layer structure; thus, the integrated formation simplifies the metallized film processing and improves production efficiency. It can be understood that by providing the thickened layer 50 at the edge of the metallized film, the loss of the metallized film can be effectively reduced.

[0032] In some embodiments, the extension length of the thickened rib 30 is less than or equal to half the width of the metallized film. Thus, the metallized film produced in this way can increase the interlayer air gap by using the thickened rib 30; when the metallized film capacitor is formed by staggered winding of two metallized films, since the two layers are staggered, the thickened rib 30 of the current layer is opposite to the high sheet resistance layer 20 of the next layer; thus, although the sheet resistance of the thickened rib 30 is low, it does not significantly affect its self-healing ability.

[0033] In summary, the embodiments of the present invention include: an organic thin film layer, a high sheet resistance layer, and multiple thickened ribs; wherein, the high sheet resistance layer is deposited on one side of the organic thin film layer, and the multiple thickened ribs are spaced apart on the other side of the high sheet resistance layer opposite to the organic thin film layer. The width of the organic thin film layer is greater than the width of the high sheet resistance layer, so that an unplated area is set by the width difference between the organic thin film layer and the high sheet resistance layer, thereby forming an edge in the unplated area; that is, multiple thickened ribs are provided on the other side of the high sheet resistance layer opposite to the organic thin film layer, so that the interlayer air gap between the metallized films is increased after the metallized film is wound; thereby effectively increasing the interlayer air gap of the metallized film capacitor made of the metallized film, preventing short circuits due to incomplete self-healing caused by small interlayer air gaps during self-healing; and ensuring the safety of the metallized film capacitor in use.

[0034] To achieve the above embodiments, such as Figure 3 As shown, an embodiment of the present invention proposes a metallized thin-film capacitor, comprising two metallized films as described above, wherein the two metallized films are staggered.

[0035] In summary, the metallized film capacitor according to the embodiments of the present invention is made by staggered winding of two metallized films, which can effectively increase the amount of interlayer air gap, prevent short circuits caused by incomplete self-healing due to small interlayer air gap during self-healing, and ensure the safety of the metallized film capacitor in use.

[0036] It should be noted that any reference signs placed between parentheses in the claims should not be construed as limiting the claims. The word "comprising" does not exclude the presence of components or steps not listed in the claims. The word "a" or "an" preceding a component does not exclude the presence of a plurality of such components. The invention can be implemented by means of hardware comprising several different components and by means of a suitably programmed computer. In a unit claim enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

[0037] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0038] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

[0039] In the description of this invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0040] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0041] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0042] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0043] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A metallized film, characterized in that, include: Organic thin film layer, high square resistance layer and multiple thickened ribs; The high-resistivity layer is deposited on one side of the organic thin film layer, and the multiple thickened ribs are spaced apart on the other side of the high-resistivity layer opposite to the organic thin film layer; the extension length of the thickened ribs is less than or equal to half the width of the metallized film; the extension direction of the thickened ribs is perpendicular to the winding direction of the metallized film. The width of the organic thin film layer is greater than the width of the high sheet resistance layer, so that the uncoated area is set by the width difference between the organic thin film layer and the high sheet resistance layer.

2. The metallized film as described in claim 1, characterized in that, Also includes: A thickened layer is disposed on the surface of the high square resistance layer and is located on the same side as the thickened rib.

3. The metallized film as described in claim 2, characterized in that, The thickened layer is integrated with the multiple thickened reinforcing bars.

4. A metallized thin-film capacitor, characterized in that, It comprises two metallization films as described in any one of claims 1 to 3, wherein the two metallization films are staggered.

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