Computing system with support bracket for liquid cooling cold plate mechanism

Abstract

A computing system having a support bracket for a liquid-cooled cold plate mechanism is disclosed, wherein the computing system includes a housing, a circuit board, a fixed bracket, a support bracket, and a cold plate. The circuit board includes at least one electronic component. The fixed bracket is secured to the housing. The support bracket is pivotably coupled to the fixed bracket. The cold plate is coupled to the support bracket. The support bracket is pivotable between a first configuration and a second configuration. The cold plate contacts the at least one electronic component in the first configuration. The cold plate is out of contact with the at least one electronic component in the second configuration.

Description

Technical Field

[0001] This invention relates to heat management in several computing systems, and more particularly to a liquid-cooled cold plate mechanism for improving access to several electronic components in several computing systems. Background Technology

[0002] Computing systems typically contain electronic components housed in a chassis. Examples of computing systems include desktop computers, blade servers, and rack servers. Computing systems usually generate heat during typical operation, thus requiring thermal management. Thermal management can be targeted at specific components within the computing system and / or generalized to the air surrounding all components. Localized thermal management focuses on specific hardware components of the computing system that generate heat, such as processors, mechanical disks, and power supplies. Generalized thermal management involves reducing the ambient temperature within the chassis, for example, by expelling hotter air from the chassis to the environment and drawing cooler air from the environment into the chassis.

[0003] The goal of thermal management is to cool the electronic components of a computing system so that these components do not operate outside their respective ratings and / or are not damaged by overheating. Cooling the electronic components allows the computing system to operate at peak efficiency. Heat sinks, fans, and liquid cooling systems using heat exchangers are used in specific electronic components. Components such as processors may be difficult to replace in the field when liquid-cooled. These components are typically in contact with a cold plate. The cold plate should initially be removed to allow physical access to these components. This invention provides several solutions that at least reduce the difficulty of physically accessing several components of a computing system. Summary of the Invention

[0004] The terms "embodiment" and similar terms are intended to broadly refer to the entire subject matter and claims of the invention described below. Examples of similar terms include "implementation," "configuration," "aspect," "example," and "option." The inclusion of these terms should be understood as not limiting the subject matter described herein, or limiting the meaning and scope of the claims below. Several embodiments of the invention covered herein are defined by the claims below and are not part of this summary. This summary is a high-level overview of several aspects of the invention and introduces some concepts further illustrated in the embodiments below. This summary is not intended to be a key identifying feature or essential characteristic of the claimed subject matter. Nor is this summary intended to be used alone to define the scope of the claimed subject matter. The subject matter should be understood by referring to suitable portions of the entire specification, any or all of the drawings, and the claims.

[0005] According to a particular aspect of the present invention, a computing system includes a housing, a circuit board, a mounting bracket, a support bracket, and a cold plate. The circuit board includes at least one electronic component. The mounting bracket is fixed to the housing. The support bracket is pivotally coupled to the mounting bracket. The cold plate is coupled to the support bracket. The support bracket is pivotally movable between a first configuration and a second configuration. The cold plate contacts the at least one electronic component in the first configuration and releases contact with the at least one electronic component in the second configuration.

[0006] In one embodiment, a mounting bracket is fixed to a base plate of the housing, and a support bracket is parallel to the base plate of the housing in a first configuration. In one embodiment, the mounting bracket includes an edge that prevents the support bracket from pivoting when the support bracket is changed from the first configuration to the second configuration. In one embodiment, contact between the cold plate and at least one electronic component prevents excessive rotation of the support bracket.

[0007] In one embodiment, the computing system further includes an inlet pipe and an outlet pipe coupled to a cold plate. The inlet and outlet pipes are longitudinally routed within a support frame. In one embodiment, the support frame includes a pipe cover for maintaining the positioning of the inlet and outlet pipes when the support frame pivots between a first configuration and a second configuration. In one embodiment, the support frame includes a narrow frame portion and a wide frame portion. The width of the narrow frame portion is less than the width of the wide frame portion, and the length of the narrow frame portion is greater than the length of the wide frame portion. In one embodiment, the cold plate is coupled to the support frame at the wide frame portion.

[0008] In one embodiment, the cold plate includes a plurality of flanges, to which the support frame is secured by one or more fasteners. In one embodiment, a pivot of the support frame is spaced apart from the base plate of the housing. In one embodiment, the pivot of the support frame is adjustable to increase or decrease the distance from the base plate of the housing. This increase or decrease contributes to variations in the thickness of the cold plate. In one embodiment, the circuit board is a motherboard, and the at least one electronic component is a processor. In one embodiment, the support frame includes a handle to facilitate pivoting the support frame between a first configuration and a second configuration.

[0009] According to a particular aspect of the invention, a method for mounting a cold plate in a computing system is provided. The method includes attaching the cold plate to a support frame of the computing system. The method further includes pivotally coupling the support frame of the computing system to a mounting bracket fixed to a housing of the computing system, such that the support frame is pivotable between a first configuration and a second configuration. When the support frame is in the first configuration, the cold plate contacts at least one electronic component located on a circuit board of the computing system; when the support frame is in the second configuration, the cold plate is de-contacted with the at least one electronic component of the computing system. The method also includes wiring an inlet pipe and an outlet pipe to the cold plate. The inlet pipe and the outlet pipe are wired along the length of the support frame.

[0010] In one embodiment, the support frame coupling the cold plate to the computing system includes: (a) positioning the support frame at a distance from a base plate of the computing system housing; and (b) securing the support frame to a mounting frame using at least one fastener. In one embodiment, the distance from the base plate of the housing is adjusted by changing the position of the at least one fastener. In one embodiment, adjusting the distance from the base plate of the housing changes a pivot of the support frame. In one embodiment, the support frame includes a handle to facilitate pivoting the support frame between a first configuration and a second configuration. In one embodiment, the mounting frame includes an edge that prevents the support frame from pivoting when the support frame is changed from the first configuration to the second configuration. In one embodiment, the inlet and outlet pipes are bendable when the support frame is in the first configuration and when the support frame is in the second configuration, and remain wired along the length of the support frame.

[0011] The foregoing summary is not intended to represent all embodiments or every aspect of the invention. Rather, it provides examples of some novel aspects and features set forth herein. The foregoing summary will become more apparent from the following detailed description of representative embodiments and modes for carrying out the invention, in conjunction with the appended drawings and claims. Further aspects of the invention will become more apparent to those skilled in the art from the detailed description of several embodiments with reference to the accompanying drawings. A brief description of the drawings is provided below. To provide a better understanding of the foregoing and other aspects of the invention, specific embodiments are described below in conjunction with the accompanying drawings: Attached Figure Description

[0012] The invention, its advantages, and the accompanying drawings will be better understood from the following description of representative embodiments and with reference to the accompanying drawings. These drawings illustrate only representative embodiments and are therefore not intended to limit the scope of the various embodiments or the claims.

[0013] Figure 1 A perspective view of a computing system having a support frame in a first configuration, for a specific aspect of the invention;

[0014] Figure 2 For a specific aspect of the invention, a support frame is provided in the second configuration. Figure 1 A perspective view of the computing system;

[0015] Figure 3 For specific aspects of the present invention Figure 2 A side view of the computing system;

[0016] Figure 4 For specific aspects of the present invention Figure 1 A perspective view of some components of the computing system;

[0017] Figure 5 For removal from the support frame Figure 1 A perspective view of the cold plate of the computing system;

[0018] Figure 6 This is a specific embodiment of the present invention. Figure 1 A cross-sectional view of the computing system;

[0019] Figure 7A For the pivot at the first height Figure 1 A magnified view of a portion of the computing system;

[0020] Figure 7B For the pivot at the second height Figure 1 A magnified view of a portion of the computing system.

[0021] Symbol Explanation

[0022] 100: Computing System

[0023] 101: Circuit Board

[0024] 102: Memory slot

[0025] 103: Base Plate

[0026] 104: Adapter Card Holder

[0027] 106a, 106b: Channels

[0028] 108a, 108b: Fixture

[0029] 110a, 110b: Support frame

[0030] 112: Chassis

[0031] 114: Power Supply

[0032] 116: Fan

[0033] 118, 118a, 118b: Pipe fittings

[0034] 118a, 118b

[0035] 202a, 202b: Cold-rolled steel plate

[0036] 204a, 204b: Pipe covers

[0037] 206a, 206b: Processors

[0038] 208a, 208b: Pivot points

[0039] 302a, 302b: Handles

[0040] 304b: Edge

[0041] 306: Distance

[0042] 400, 500: Partial

[0043] 402a, 402b: Pipes

[0044] 404: Pallet

[0045] 502a, 502b: Narrow frame section

[0046] 504a, 504b: Wide frame section

[0047] 508: Fasteners

[0048] 510: Flange

[0049] 701: First Height

[0050] 702: Second Altitude Detailed Implementation

[0051] Liquid cooling typically involves placing a cold plate in contact with electronic components to facilitate heat transfer from the components to the cold plate and from the cold plate to the liquid cooling medium. The cold plate sometimes covers the entire electronic component, thus hindering easy access to it. Furthermore, the cold plate generally requires channels to facilitate the flow of the liquid cooling medium through it. Therefore, if a faulty electronic component located beneath the cold plate needs to be replaced, it can be difficult to remove the faulty component to replace it with a new one. This is because the cold plate and other fittings connected to it must be removed to access the faulty component. Therefore, several embodiments of the present invention provide a cold plate attached to a rotatable support frame. The rotatable support frame, when rotated at a first end, raises the cold plate from a first position to a second position. In the first position, the cold plate is in direct contact with the electronic component. In the second position, the cold plate is moved away from the electronic component, allowing support personnel to access the electronic component.

[0052] Several embodiments are described with reference to the accompanying drawings, wherein similar reference numerals are used throughout the drawings to denote similar or identical elements. These drawings are not to scale and are provided merely to illustrate several aspects and features of the invention. Various specific details, relationships, and methods are set forth to provide a comprehensive understanding of specific aspects and features of the invention; however, it will be apparent to those skilled in the art that these aspects and features may be implemented without one or more specific details, but through other relationships or methods. For illustrative purposes, well-known structures or operations are not shown in detail in some instances. Because some actions may occur in different orders and / or simultaneously with other actions or events, the several embodiments disclosed herein are not necessarily limited to the order of the described actions or events. Furthermore, not all described actions or events must be used to implement specific aspects and features of the invention.

[0053] For the purposes of this detailed description, unless otherwise excluded and where appropriate, the singular form includes the plural form, and vice versa. The word "including" means "including without limitation." Furthermore, similar words such as "about," "almost," "substantially," "approximately," and the like may be used herein to mean "at," "near," "nearly at," "within 3-5% of," "within acceptable manufacturing tolerances of," or any logical combination thereof. Similarly, the terms "vertical" or "horizontal" mean additionally included in "3-5%" in the vertical or horizontal direction, respectively. Additionally, directional terms such as "top," "bottom," "left," "right," "above," and "below" are intended to relate to the equivalent directions illustrated in the accompanying drawings, as understood from the context of the referenced object or element, such as from the general position of the object or element; or in other ways as described herein.

[0054] Reference Figure 1 A computing system 100 according to a specific aspect of the present invention is proposed. The computing system 100 includes a housing 112. The housing 112 houses the components of the computing system 100. The components may include, for example, a circuit board 101 (e.g., a motherboard) having a memory slot 102, one or more riser card holders 104, one or more fans 116, a power supply 114, and one or more channels 106a, 106b. These channels 106a, 106b are used to deliver liquid for liquid cooling of the computing system 100. One or more pipe adaptors 118 (e.g., pipe adaptors 118a and 118b) are provided for connecting a liquid source (not shown) to the channels 106a, 106b. The computing system 100 includes one or more mounting brackets 108a, 108b. The mounting brackets 108a, 108b are fixed to the base plate 103 of the housing 112. One or more support brackets 110a, 110b are attached to the mounting brackets 108a, 108b. Support brackets 110a, 110b are shown in a first configuration, wherein support brackets 110a, 110b cover a processor (not shown) mounted on a circuit board 101 of the computing system 100.

[0055] Reference Figure 2The computing system 100 is illustrated as having support frames 110a and 110b in a second configuration. In the second configuration, the support frames 110a and 110b are raised to expose the processors 206a and 206b. The undersides of the support frames 110a and 110b respectively include pipe covers 204a and 204b and cold plates 202a and 202b. In one embodiment, the pipe covers 204a and 204b are removable from the support frames 110a and 110b. To allow the support frames 110a and 110b to be removed from... Figure 1 The first configuration was changed to Figure 2 In the second configuration, support frames 110a and 110b are pivotally connected to pivot points 208a and 208b on fixed frames 108a and 108b. Pivot points 208a and 208b define pivots for rotating support frames 110a and 110b.

[0056] Figure 3 A side view of the computing system 100 without the housing 112 is shown. The pivot point 208b may include screws, bolts, or other mechanical coupling devices that provide free rotation of the support frame 110b. The pivot point 208b is located at a distance 306 from the base plate 103 of the housing 112. The distance 306 takes into account the thickness of the cold plate 202b, such that when the support frame 110b is in the first configuration ( Figure 1 The cold plate 202b is parallel to the base plate 103 of the housing 112 and contacts the processor 206b. Figure 1 The support frame 110b may have a handle 302b (similarly, the support frame 110a may have a handle 302a, such as...). Figure 4 and Figure 5 (As shown), to facilitate pivoting of the support frame 110b when it is mounted in the first or second configuration. In some embodiments, the support frame 110b rests against the edge 304b of the retainer 108b in the second configuration. The edge 304b acts as a stop to prevent over-rotating of the support frame 110b in the second configuration. Similarly, in some embodiments, when in the first configuration, the support frame 110b avoids contact between the cold plate 202b and the processor 206b (as shown), to facilitate pivoting of the support frame 110b when it is mounted in the first or second configuration. Figure 2 Excessive rotation during rotation.

[0057] In some embodiments, the weight of the cold plate 202b is greater than the weight of the support frame 110b, causing the weight distribution along the support frame 110b to be significantly biased towards the position of the cold plate 202b. The mounting bracket 108b may include a damping mechanism at pivot point 208b to control the pivoting speed of the support frame 110b when pivoting between the first and second configurations. Examples of damping mechanisms include torsion springs, gears, etc. In one example, if the handle 302b slips from the supporter's hand while pivoting the support frame 110b from the second configuration to the first configuration, the damping mechanism may then limit the cold plate 202b's orientation towards the processor 206b. Figure 2 The maximum speed at which the cold plate 202b falls. In other words, the damping mechanism will offset some of the weight of the cold plate 202b, causing it to fall onto the processor 206b. Figure 2 The impact system on the surface is reduced.

[0058] In one example, if handle 302b slips from the supporter's hand while pivoting support 110b from the second configuration to the first configuration, a damping mechanism can then limit the pivoting movement of support 110b. In one embodiment, the damping mechanism introduces multiple stable intermediate configurations between the first and second configurations. The damping mechanism may include gears that maintain at least one of the multiple stable intermediate configurations, such that a force from the supporter is required to move support 110b toward (or away from) the first or second configuration. In this embodiment, handle 302b slipping out of the supporter's hand will not cause support 110b to fall onto processor 206b. Instead, the damping mechanism maintains the position of support 110b. In one embodiment, the damping mechanism defines the first and second configurations and uses a hard stop to prevent over-rotation in either the first or second configuration.

[0059] Figure 4 This is a perspective view of a portion 400 of the computing system 100 without the housing 112. In some embodiments, portion 400 is illustrated with mounting brackets 108a, 108b attached to a tray 404. The tray 404 can then be attached to the housing 112. Figure 1 The base plate 103. Figure 4 In the middle, support frames 110a and 110b ( Figure 1 The tubes 402a and 402b are transparent, making the liquid-carrying tubes visible. Tubes 402a and 402b are longitudinally routed and pass through support frames 110a and 110b. Figure 1 ) to cold plate 202a, 202b ( Figure 3 In one embodiment, pipe 402b is an inlet pipe that provides cooled liquid to cold plates 202a and 202b. Figure 3Pipe 402a is the outlet pipe, and the outlet pipe connects to cold plates 202a and 202b. Figure 3 (Issuing hot liquid.) Pipe covers 204a, 204b ( Figure 2 It can be configured to maintain the longitudinal shape of the tubes 402a and 402b along the support frames 110a and 110b when the support frames 110a and 110b are in the first configuration. That is, when the support frames 110a and 110b pivot between the first and second configurations, the tube covers 204a and 204b ( Figure 2 Move pipes 402a and 402b together with support frames 110a and 110b.

[0060] Figure 5 This is a perspective view of a portion 500 of a computing system 100 without the housing 112 or circuit board 101. Support frames 110a and 110b are shown having narrow frames 502a and 502b and wide frames 504a and 504b, respectively. The width of each narrow frame 502a and 502b is used to accommodate tubes 402a and 402b. Figure 4 ), and preferably not as good as pipes 402a and 402b ( Figure 4 The space required for wiring within the support frames 110a and 110b is too wide. Limiting the width of the narrow frames 502a and 502b in this way better utilizes the space within the housing 112. The wide frames 504a and 504b provide a wider surface area to substantially match the footprint of the cold plates 202a and 202b. The cold plates 202a and 202b can interface with the wide frames 504a and 504b, such that the cold plates 202a and 202b are positioned within... Figure 1 The first configuration and Figure 2 In the second configuration, the support frame 110b moves together. The wider surface area of ​​the wide frame portions 504a and 504b facilitates easier coupling of the cold plates 202a and 202b with the wide frame portions 504a and 504b. In some embodiments, the wider surface area can provide multiple coupling locations throughout the wide frame portions 504a and 504b. Although the wide frame portions 504a and 504b are drawn as rectangles, they can take other shapes (e.g., elliptical, circular, square, etc.) to substantially conform to the shape of the area occupied by the cold plates 202a and 202b.

[0061] In one embodiment, the cold plates 202a and 202b include flanges 510 for engagement with support frames 110a and 110b. The flanges 510 are insertable into pre-drilled openings in the support frames 110a and 110b and then secured thereto. For example, Figure 6An example is illustrated where flange 510 partially passes through support frame 110b. Fastener 508 (e.g., screw) is used to secure flange 510 to support frame 110b. Cold plate 202b is coupled to support frame 110b in such a manner, but is not limited to other methods of securing cold plate 202b to support frame 110b.

[0062] In some implementations, the pivot of rotation is adjustable to account for manufacturing tolerances. Figure 7A A partial enlarged view of the calculation system 100 at a first height 701 is shown, illustrating the pivot for the rotation of the support frame 110b. Figure 7B A partially enlarged view of the computing system 100 at a second height 702, illustrating the pivot for rotation of support frame 110b. The first height 701 is smaller than the second height 702. The tolerance provided by the ability to move pivot point 208b allows for flexibility in the thickness of the cold plate, enabling its use with support frame 110b. This tolerance also provides flexibility in the height of the components cooled by the cold plate. For example, an older processor with height H1 is replaced by a newer processor with height H2, which differs from height H1. This tolerance allows pivot point 208b to be adjusted to ensure that the cold plate 202b ( Figure 6 When encountering a newer processor, it is parallel to the newer processor.

[0063] While the disclosed embodiments have been illustrated and described with reference to one or more applications, equivalent modifications and adjustments will be made by those skilled in the art upon reading and understanding this specification and the accompanying drawings, or equivalent modifications and adjustments will be known to those skilled in the art. Furthermore, when a particular feature of the invention may be disclosed only in one of several applications, this feature may be combined with one or more other features of other applications to meet the needs and advantages of any given or particular application.

[0064] Having described several embodiments of the invention above, it should be understood that they are presented by way of example only and are not intended to be limiting. Various modifications to the disclosed embodiments may be made based on this disclosure without departing from the spirit or scope of the invention. Therefore, the breadth and scope of the invention should not be limited to any of the embodiments described above. The scope of the invention should instead be defined by the following claims and their equivalents. In summary, although the invention has been disclosed in conjunction with the above embodiments, it is not intended to limit the invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of protection of the invention should be determined by the appended claims.

Claims

1. A computing system, comprising: chassis; A circuit board, disposed within the housing, includes at least one electronic component; The mounting bracket is fixed to the casing. A support frame, pivotally coupled to the fixed frame, the support frame being pivotable about a pivot between a first configuration and a second configuration; as well as A cold plate is coupled to the lower side of the support frame. In the first configuration, the support frame is parallel to the bottom plate of the housing, and the cold plate contacts the at least one electronic component for heat exchange. In the second configuration, the support frame is angled relative to the base plate of the housing, thereby releasing the cold plate from contact with the at least one electronic component and exposing the at least one electronic component for access. The pivot of the support frame is separated from the bottom plate of the housing by a certain distance; The height of the pivot of the support frame is adjustable to increase or decrease the distance between it and the base plate of the housing, and the increase or decrease contributes to the variation of the cold plate thickness.

2. The computing system of claim 1, wherein the mounting bracket is fixed to the base plate of the housing.

3. The computing system of claim 1, wherein the mounting bracket includes an edge that prevents the mounting bracket from pivoting when the support bracket pivots from the first configuration to the second configuration.

4. The computing system of claim 1, wherein contact between the cold plate and at least one electronic component prevents the support frame from rotating further toward the circuit board when in the first configuration.

5. The computing system of claim 1, further comprising: The inlet pipe is coupled to the cold plate; as well as An outlet pipe is coupled to the cold plate, and the inlet pipe and the outlet pipe are longitudinally routed in the support frame.

6. The computing system of claim 5, wherein the support frame includes a tube cover for maintaining the positioning of the inlet tube and the outlet tube when the support frame pivots between the first configuration and the second configuration.

7. The computing system of claim 1, wherein the support frame includes a narrow frame portion and a wide frame portion, the width of the narrow frame portion being less than the width of the wide frame portion, and the length of the narrow frame portion being greater than the length of the wide frame portion.

8. The computing system of claim 7, wherein the cold plate is coupled to the support frame at the wide frame portion of the support frame.

9. The computing system of claim 1, wherein the cold plate includes a plurality of flanges, and the support frame is secured to the flanges via fasteners received by the flanges.

10. The computing system of claim 1, wherein the circuit board is a motherboard and the at least one electronic component is a processor.

11. The computing system of claim 1, wherein the support frame includes a handle to facilitate pivoting the support frame between the first configuration and the second configuration.

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