An electronic device

Abstract

The present application discloses an electronic device, belonging to the field of terminal technology. The electronic device includes: a circuit board, which is arranged in the electronic device; a circuit board bracket, which is connected to the circuit board; a first metal layer, which is arranged opposite to the circuit board, the first metal layer, the circuit board and the circuit board bracket enclose a first cavity, and a first gap is also arranged on the first metal layer, and the first gap is connected to the first cavity; a radio frequency transmitter, one end of which is located in the first cavity.

Description

Technical Field

[0001] The present application belongs to the field of terminal technology, and specifically relates to an electronic device. Background Art

[0002] Generally, electronic devices can send and receive signals through internal antennas.

[0003] However, as flexible displays, multiple cameras, dual speakers and other components are increasingly used in electronic devices, the space available for setting up antennas inside electronic devices is constantly being compressed.

[0004] Therefore, how to increase the space for antenna layout inside electronic devices is a technical problem that needs to be solved urgently. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide an electronic device that can solve the problem of increasing the space for antenna layout inside the electronic device.

[0006] In a first aspect, an embodiment of the present application provides an electronic device, comprising: a circuit board, disposed in the electronic device; a circuit board bracket, the circuit board bracket being connected to the circuit board; a first metal layer, disposed opposite to the circuit board, the first metal layer, the circuit board and the circuit board bracket enclosing a first cavity, the first metal layer also being provided with a first gap, the first gap being connected to the first cavity; and a radio frequency transmitter, one end of which is located in the first cavity.

[0007] In an embodiment of the present application, the electronic device includes a circuit board disposed in the electronic device, a circuit board bracket connected to the circuit board, a first metal layer disposed opposite to the circuit board (the first metal layer, the circuit board and the circuit board bracket enclose a first cavity), a first slit disposed on the first metal layer and connected to the first cavity, and a radio frequency transmitting element located at one end in the first cavity. Since the circuit board inside the electronic device, the first metal layer disposed opposite to the circuit board and the circuit board bracket on the circuit board can enclose the first cavity, so that the radio frequency transmitting element can be disposed in the first cavity, and the first slit connected to the first cavity is disposed on the first metal layer, the radio frequency transmitting element can be coupled with the first cavity to excite different antenna radiation modes, and then radiate out through the first slit, that is, the first cavity, the radio frequency transmitting element and the first slit form a slot antenna, so that the space for arranging antennas inside the electronic device can be increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is one of the schematic diagrams of the electronic device provided in the embodiment of the present application;

[0009] Figure 2This is the second schematic diagram of the electronic device provided in the embodiment of the present application;

[0010] Figure 3 It is one of the schematic diagrams of the metal assembly provided in the embodiment of the present application;

[0011] Figure 4 This is the second schematic diagram of the metal component provided in the embodiment of the present application;

[0012] Figure 5 is a schematic diagram of a first gap provided in an embodiment of the present application;

[0013] Figure 6 is a schematic diagram of a fourth metal layer provided in an embodiment of the present application;

[0014] Figure 7 It is a schematic diagram of the fifth metal layer provided in an embodiment of the present application.

[0015] Among them, a circuit board 1, a circuit board bracket 2, a first metal layer 3, a first cavity 4, a first gap 5, a radio frequency transmitter 6, a filling material 7, a second metal layer 8, a third metal layer 9, a third surface 10, a metal component 11, a first metal component 12, a first surface 13, a second metal component 14, a second surface 15, a third metal component 16, a second gap 17, a central axis of the first gap 18, a first central axis of the first metal layer 19, a fourth metal layer 20, a first surface 21 of the first metal layer, a fifth metal layer 22, and a first surface 23 of the fourth metal layer 2. DETAILED DESCRIPTION

[0016] Embodiments of the present invention will be described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0017] The term "first" or "second" in the specification and claims of the present application may include one or more of the features explicitly or implicitly. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0018] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0019] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0020] An electronic device provided by an embodiment of the present application is described below with reference to the accompanying drawings.

[0021] In order to solve this technical problem, the embodiment of the present application adopts the following technical solution.

[0022] Figure 1 A possible structural diagram of an electronic device provided in an embodiment of the present application is shown. Figure 1 As shown, the electronic device includes: a circuit board 1, which is arranged in the electronic device; a circuit board bracket 2, which is connected to the circuit board 1; a first metal layer 3, which is arranged opposite to the circuit board 1, and the first metal layer 3, the circuit board 1 and the circuit board bracket 2 enclose a first cavity 4, and a first gap 5 is also provided on the first metal layer 3, and the first gap 5 is connected to the first cavity 4; a radio frequency transmitter 6, one end of which is located in the first cavity 4.

[0023] Optionally, in the embodiment of the present application, the above-mentioned electronic device can be a mobile phone, a wearable device, a camera, a tablet computer, a laptop computer, a display device, etc., and the embodiment of the present application does not make specific limitations.

[0024] Optionally, in the embodiment of the present application, the circuit board 1 may be a printed circuit board (PCB) mainboard of an electronic device, which is arranged inside the electronic device to support various components and realize electrical connection or electrical insulation between them.

[0025] Optionally, in the embodiment of the present application, the circuit board bracket 2 may be a printed circuit board (PCB) frame of an electronic device, which is connected to the circuit board 1 and is used to cooperate with the circuit board 1 to install various electronic components.

[0026] It can be understood that since grooves are left on both sides of the circuit board bracket 2 to accommodate the installation of electronic components, the shape of the grooves can be semicircular, elliptical, rectangular, etc.

[0027] Optionally, in the embodiment of the present application, a cavity space may be formed between the circuit board 1 and one side of the circuit board bracket 2 .

[0028] Further optionally, in the embodiment of the present application, the cavity space may be specifically a rectangular cavity, the lower surface of the rectangular cavity is a partial surface of the circuit board 1 , and the side surface of the rectangular cavity is the side surface of the groove of the circuit board bracket 2 .

[0029] Optionally, in the embodiment of the present application, the first metal layer 3 may specifically be an electroplated metal layer.

[0030] Further optionally, in the embodiment of the present application, the material of the metal layer can be any one of the following: metal copper, metal iron, metal silver, etc.

[0031] It should be noted that the above-mentioned “first metal layer 3 is arranged opposite to the circuit board 1, and the first metal layer 3, the circuit board 1 and the circuit board bracket 2 enclose a first cavity 4” can be understood as: a cavity space can be formed between the circuit board 1 and one side of the circuit board bracket 2, and the cavity space can accommodate the setting of a component, the first side of the component is in contact with the circuit board 1, and the second side of the component is away from the first side, that is, the second side is arranged opposite to the circuit board 1, so that the first metal layer 3 can be arranged on the second side of the component opposite to the circuit board 1, and then the first metal layer 3, the circuit board 1 and the circuit board bracket 2 can enclose a first cavity 4.

[0032] Optionally, in the embodiment of the present application, the electronic device further includes: a filling material 7 , wherein the filling material 7 is disposed in the first cavity 4 , and the first metal layer 3 is disposed on the filling material 7 .

[0033] Further optionally, in the embodiment of the present application, the above-mentioned filling material 7 can be any one of the following: phenolic paper laminate, epoxy paper laminate, polyester glass felt laminate and epoxy glass cloth laminate, etc.

[0034] Further optionally, in the embodiment of the present application, a filling material 7 is filled in the first cavity 4 enclosed by the first metal layer 3 , the circuit board 1 and the circuit board bracket 2 .

[0035] It can be understood that the specific shape of the filling material 7 is adapted to the shape of the first cavity 4. If the shape of the first cavity 4 is an elliptical cylinder, the shape of the filling material 7 is also an elliptical cylinder; if the shape of the first cavity 4 is a rectangular parallelepiped, the shape of the filling material 7 is also a rectangular parallelepiped. The first surface of the filling material 7 contacts the circuit board 1, and the second surface of the filling material 7 is away from the first surface, that is, the second surface is arranged opposite to the circuit board 1.

[0036] Further optionally, in the embodiment of the present application, the first metal layer 3 can be specifically laid on the second surface of the filling material 7 opposite to the circuit board 1 .

[0037] It can be seen that, since the filling material is disposed between the circuit board and the circuit board bracket, and the first metal layer is disposed on the filling material, the first metal layer, the circuit board and the circuit board bracket can enclose a first cavity.

[0038] Optionally, in the embodiment of the present application, the first gap 5 is provided on the first metal layer 3 , and the first gap 5 is communicated with the first cavity 4 .

[0039] In one example, the first slit 5 can be arranged on the first central axis of the first metal layer 3, and there is an angle between the first central axis of the first slit 5 and the first central axis of the first metal layer 3. The first central axis of the first slit 5 and the first central axis of the first metal layer 3 both refer to the longer central axis of the geometric plane of the first slit 5 and the first metal layer 3.

[0040] In another example, the first slit 5 may also be disposed on one side of the first central axis of the first metal layer 3 , and the first central axis of the first slit 5 is parallel to the first central axis of the first metal layer 3 .

[0041] Optionally, in an embodiment of the present application, one end of the above-mentioned RF transmitter 6 is located in the first cavity 4, and the other end of the RF transmitter 6 can be connected to the RF transmitter inside the electronic device. The RF transmitter 6 is used to transmit the electromagnetic waves emitted by the RF transmitter to the first cavity 4, and excite a specific transverse electric mode (TE) in the first cavity 4 through coupling feeding.

[0042] Further optionally, in the embodiment of the present application, the radio frequency transmitting element 6 may specifically be a microstrip feed line with a characteristic impedance of 50 ohms.

[0043] Optionally, in the embodiment of the present application, the shape of the first gap 5 can be a rectangle.

[0044] Further optionally, in an embodiment of the present application, the length of the first slot 5 can be specifically 1 / 2 of the operating wavelength, and the width of the first slot 5 can be adjusted according to actual impedance matching requirements, wherein the operating wavelength is the resonant wavelength under a specific TE mode in the first cavity 4.

[0045] Optionally, in the embodiment of the present application, Figure 2 As shown, the circuit board bracket further includes: a second metal layer 8 disposed on a surface of the circuit board 1 adjacent to the circuit board bracket 2 , and the second metal layer 8 is disposed opposite to the first metal layer 3 .

[0046] Optionally, in the embodiment of the present application, the second metal layer 8 may specifically be an electroplated metal layer.

[0047] Further optionally, in the embodiment of the present application, the material of the above-mentioned metal layer can be any one of the following: metal copper, metal iron, metal silver, etc.

[0048] Further optionally, in the embodiment of the present application, the second metal layer 8 can be laid on a first plane of the circuit board 1 adjacent to the circuit board bracket 2 , and the first plane is a projection plane of the first cavity 4 in a direction perpendicular to the circuit board 1 .

[0049] Thus, it can be known that since the second metal layer can be laid on the plane of the circuit board adjacent to the circuit board bracket and the second metal layer is arranged opposite to the first metal layer, the second metal layer can enclose the first cavity with the first metal layer and the circuit board bracket.

[0050] Optionally, in the embodiment of the present application, combined with Figure 2 As shown, the circuit board bracket 2 further includes: a third metal layer 9 disposed on a third surface 10 of the circuit board bracket 2 .

[0051] Optionally, in the embodiment of the present application, the third metal layer 9 may specifically be an electroplated metal layer.

[0052] Further optionally, in the embodiment of the present application, the material of the above-mentioned metal layer can be any one of the following: metal copper, metal iron, metal silver, etc.

[0053] Optionally, in the embodiment of the present application, the third surface 10 may be a side surface of the circuit board bracket 2 adjacent to the circuit board 1 .

[0054] It can be seen that, since the third metal layer can be laid on a side surface of the circuit board bracket adjacent to the circuit board, the third metal layer can enclose the first cavity together with the first metal layer and the second metal layer.

[0055] Optionally, in the embodiment of the present application, Figure 3As shown, the electronic device further includes: at least one metal component 11, one end of each metal component 11 is connected to the first metal layer 3, and the other end is connected to the second metal layer 8;

[0056] In the embodiment of the present application, the first metal layer 3 , the circuit board 1 , the circuit board bracket 2 and at least one metal component 11 enclose a first cavity 4 .

[0057] Optionally, in an embodiment of the present application, the above-mentioned metal component 11 can be a group of metal columns arranged along the plane where the side of the circuit board bracket 2 is located, and a small gap can be maintained between each metal column in the group of metal columns, and the length of each metal column in the group of metal columns is equal.

[0058] Further optionally, in an embodiment of the present application, one end of each metal column in each metal component 11 is connected to the first metal layer 3, and the other end of each metal column is connected to the second metal layer 8, so that the metal component 11 and the first metal layer 3 and the second metal layer 8 can be conductively connected.

[0059] Further optionally, in the embodiment of the present application, the material of the above-mentioned metal column can be any one of the following: metal copper, metal iron, metal silver, etc.

[0060] Further optionally, in the embodiment of the present application, the shape of the above-mentioned metal column can be any one of the following: cylinder, rectangular parallelepiped, elliptical cylinder, etc.

[0061] It should be noted that the above-mentioned “the first metal layer 3, the circuit board 1, the circuit board bracket 2 and the at least one metal component 11 enclose the first cavity 4” can be understood as: the at least one metal component 11 can become the other surface of the first cavity 4 except the three surfaces of the first metal layer 3, the circuit board 1 and the circuit board bracket 2, and the at least one metal component 11 can enclose a closed metal cavity with the first metal layer 3, the second metal layer 8 on the circuit board 1 and the third metal layer 9 on the circuit board bracket 2.

[0062] It can be seen that since the electronic device also includes at least one metal component connected to the first metal layer at one end and to the second metal layer at the other end, the at least one metal component and the first metal layer, the circuit board and the circuit board bracket can enclose a closed metal cavity, thereby reducing the coupling between electromagnetic waves and other antennas in the electronic device, improving the isolation of the antenna inside the electronic device, and saving the antenna cost.

[0063] Optionally, in the embodiment of the present application, combined with Figure 3 ,like Figure 4As shown, the at least one metal component 11 includes: a first metal component 12, connected to the first surface 13 of the circuit board bracket 2; a second metal component 14, connected to the second surface 15 of the circuit board bracket 2, and the second surface 15 is arranged opposite to the first surface 13; a third metal component 16, opposite to the third surface 10 of the circuit board bracket 2, and the third surface 10 is adjacent to the first surface 13 and the second surface 15.

[0064] Optionally, in an embodiment of the present application, the first metal component 12 and the second metal component 14 can specifically be a group of metal columns arranged along the plane where the side surface of the circuit board bracket 2 is located, and a small gap can be maintained between each metal column in the group of metal columns, and the length of each metal column in the group of metal columns is equal.

[0065] Optionally, in the embodiment of the present application, the third metal component 16 may be a group of metal pillars disposed on the side opposite to the third surface 10 of the circuit board bracket 2 .

[0066] Optionally, in the embodiment of the present application, the first surface 13 , the second surface 15 and the third surface 10 may specifically be three different side surfaces of the circuit board bracket 2 .

[0067] The second surface 15 and the first surface 13 are two side surfaces arranged opposite to each other, and the third surface 10 is adjacent to the first surface 13 and the second surface 15 .

[0068] It can be understood that the filling material 7 in the first cavity 4 of the electronic device can wrap and fix the first metal component 12 and connect it to the first surface 13 of the circuit board bracket 2; wrap and fix the second metal component 14 and connect it to the second surface 15 of the circuit board bracket 2; wrap and fix the third metal component 16 and make it opposite to the third surface 10 of the circuit board bracket 2.

[0069] It can be seen that since the first metal component is connected to the first surface of the circuit board bracket, the second metal component is connected to the second surface of the circuit board bracket, and the third surface of the circuit board bracket of the third metal component is opposite, the first metal component, the second metal component and the third metal component can be together with the first metal layer, the second metal layer and the first metal layer to enclose a closed metal cavity, and since the electromagnetic wave energy is confined in the metal cavity and radiated into the space through the first gap, the coupling with other antennas in the electronic device can be reduced, thereby improving the isolation of the antenna inside the electronic device.

[0070] The electronic device provided in the embodiment of the present application includes a circuit board arranged in the electronic device, a circuit board bracket connected to the circuit board, a first metal layer arranged opposite to the circuit board (the first metal layer, the circuit board and the circuit board bracket enclose a first cavity), a first slit arranged on the first metal layer and connected to the first cavity, and a radio frequency transmitting element located at one end in the first cavity. Since the circuit board inside the electronic device, the first metal layer arranged opposite to the circuit board and the circuit board bracket on the circuit board can enclose the first cavity, so that the radio frequency transmitting element can be arranged in the first cavity, and the first slit connected to the first cavity is arranged on the first metal layer, the radio frequency transmitting element can be coupled with the first cavity to excite different antenna radiation modes, and then radiate out through the first slit, that is, the first cavity, the radio frequency transmitting element and the first slit form a slot antenna, so that the space for arranging antennas inside the electronic device can be increased.

[0071] Of course, in order to improve the radiation efficiency of the slot antenna of the electronic device, it can also be achieved by forming a slot array antenna, which is specifically explained below.

[0072] Optionally, in the embodiment of the present application, Figure 5 As shown, the first slit 5 includes: at least two second slits 17, and the at least two second slits 17 are parallel to each other.

[0073] In the embodiment of the present application, in at least two second slits 17 , the distance between each two adjacent second slits 17 is the same.

[0074] It can be understood that the first slot 5 includes at least two second slots 17 which are parallel to each other and have an equal spacing. The at least two second slots 17 are arranged on the first metal layer 3 to form a group of slot array antennas. The RF transmitting element 6 inside the first cavity 4 transmits the electromagnetic waves emitted by the RF transmitter to the first cavity 4, excites the specific TE mode in the first cavity 4 through coupling feeding, and radiates the electromagnetic waves of the TE mode excited in the first cavity 4 through the slot array antenna. The TE mode can be determined according to the volume of the first cavity 4.

[0075] It can be seen that, since the first slot includes at least two second slots that are parallel to each other and have an equal spacing, the at least two second slots form a group of slot array antennas, thereby improving the radiation efficiency of the antenna.

[0076] Optionally, in the embodiment of the present application, combined with Figure 5 As shown, there is an angle between the central axis 18 of the first gap 5 and the first central axis 19 of the first metal layer 3 .

[0077] Optionally, in the embodiment of the present application, the first slit 5 may be disposed on the first central axis 19 of the first metal layer 3 , and an angle is formed between the central axis 18 of the first slit 5 and the first central axis 19 of the first metal layer 3 .

[0078] Further optionally, in the embodiment of the present application, the above-mentioned angle can be any one of the following: 30°, 45°, 60°, etc.

[0079] Optionally, in the embodiment of the present application, the central axis 18 of the first slit 5 and the first central axis 19 of the first metal layer 3 are both longer central axes of the geometric planes of the first slit 5 and the first metal layer 3 .

[0080] It can be seen that, since there is an angle between the central axis of the first slot and the first central axis of the first metal layer, the efficiency of the first slot in radiating electromagnetic waves can be improved.

[0081] Optionally, in the embodiment of the present application, Figure 6 As shown, the electronic device further includes: a fourth metal layer 20 , and the fourth metal layer 20 is arranged opposite to the first surface 21 of the first metal layer 3 .

[0082] In the embodiment of the present application, the first surface 21 of the first metal layer 3 is away from the circuit board 1 .

[0083] Optionally, in the embodiment of the present application, the shape of the fourth metal layer 20 may be any one of the following: square, rectangle, ellipse, etc.

[0084] Optionally, in the embodiment of the present application, the fourth metal layer 20 may specifically be an electroplated metal layer.

[0085] Further optionally, in the embodiment of the present application, the material of the above-mentioned metal layer can be any one of the following: metal copper, metal iron, metal silver, etc.

[0086] Further optionally, in the embodiment of the present application, the fourth metal layer 20 can be laid on a second plane arranged opposite to the first surface 20 of the first metal layer 3, and the second plane can be a surface of a plastic bracket installed on the circuit board bracket 2.

[0087] Optionally, in the embodiment of the present application, combined with Figure 3 and Figure 6 As shown, the fourth metal layer 20 is parallel to the first metal layer 3 .

[0088] It can be understood that the fourth metal layer 20 is arranged away from the circuit board 1 and parallel to the first surface 21 of the first metal layer 3, so that the electromagnetic waves radiated from the first gap 5 couple energy to the fourth metal layer 20, and the fourth metal layer 20 acts as an antenna to finally radiate the electromagnetic waves.

[0089] It can be seen that, since the fourth metal layer is arranged opposite to the first surface of the first metal layer, the electromagnetic wave radiated from the first gap couples energy to the fourth metal layer and radiates out, thereby further improving the radiation efficiency of the antenna.

[0090] Of course, if the area of ​​a metal layer is small and the efficiency of the antenna in radiating electromagnetic waves needs to be further improved, the number and area of ​​the metal layers may be increased, which is explained in detail below.

[0091] Optionally, in the embodiment of the present application, Figure 7 As shown, the electronic device further includes: a fifth metal layer 22 , and the fifth metal layer 22 is arranged opposite to the first surface 23 of the fourth metal layer 20 .

[0092] In the embodiment of the present application, the first surface 23 of the fourth metal layer 20 is away from the first metal layer 3 .

[0093] Optionally, in the embodiment of the present application, the shape of the fifth metal layer 22 can be any one of the following: square, rectangle, ellipse, etc.

[0094] Optionally, in the embodiment of the present application, the fifth metal layer 22 may specifically be an electroplated metal layer.

[0095] Further optionally, in the embodiment of the present application, the material of the above-mentioned metal layer can be any one of the following: metal copper, metal iron, metal silver, etc.

[0096] Further optionally, in the embodiment of the present application, the fifth metal layer 22 may be laid on a third plane arranged opposite to the first surface 23 of the fourth metal layer 20 , and the third plane may be an inner surface of a battery cover of the electronic device.

[0097] Optionally, in the embodiment of the present application, combined with Figure 7 As shown, the fifth metal layer 22 is parallel to the fourth metal layer 20 .

[0098] The area of ​​the fifth metal layer 22 is greater than the area of ​​the fourth metal layer 20 .

[0099] It can be understood that the fifth metal layer 22 is arranged away from the circuit board 1 and parallel to the fourth metal layer 20, so that the electromagnetic wave radiated from the first gap 5 couples energy to the fourth metal layer 20, excites current on the fourth metal layer 20, and then the current excited on the fourth metal layer 20 can be coupled to the fifth metal layer 22 with a larger area. The fifth metal layer 22 acts as an antenna and finally radiates the electromagnetic wave.

[0100] It can be seen that since the fifth metal layer is arranged relative to the first surface of the fourth metal layer, the electromagnetic wave radiated from the first gap couples energy to the fourth metal layer and indirectly couples to the fifth metal layer, and then radiates out, thereby further improving the radiation efficiency of the antenna.

[0101] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0102] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An electronic device, characterized in that: include: A circuit board is arranged in the electronic device; A circuit board bracket, wherein the circuit board bracket is connected to the circuit board; a first metal layer, arranged opposite to the circuit board, wherein the first metal layer, the circuit board and the circuit board bracket enclose a first cavity, a first slit is further arranged on the first metal layer, the first slit is connected to the first cavity, and an angle is formed between a central axis of the first slit and a first central axis of the first metal layer; A radio frequency transmitting component, one end of which is located in the first cavity.

2. The electronic device according to claim 1, characterized in that: The circuit board bracket also includes: The second metal layer is arranged on a surface of the circuit board adjacent to the circuit board bracket, and the second metal layer is arranged opposite to the first metal layer.

3. The electronic device according to claim 2, characterized in that: The electronic device further comprises: at least one metal component, one end of each metal component is connected to the first metal layer, and the other end of each metal component is connected to the second metal layer; The first metal layer, the circuit board, the circuit board bracket and the at least one metal component enclose the first cavity.

4. The electronic device according to claim 3, characterized in that: At least one of the metal components comprises: A first metal component connected to the first surface of the circuit board bracket; A second metal component connected to a second surface of the circuit board bracket, wherein the second surface is arranged opposite to the first surface; The third metal component is opposite to a third surface of the circuit board support, and the third surface is adjacent to the first surface and the second surface.

5. The electronic device according to claim 4, characterized in that: The circuit board bracket also includes: The third metal layer is disposed on the third surface of the circuit board bracket.

6. The electronic device according to claim 1, characterized in that: The electronic device further comprises: A filling material is disposed in the first cavity, and the first metal layer is disposed on the filling material.

7. The electronic device according to claim 1, characterized in that: The first gap comprises: At least two second slits, wherein at least two of the second slits are parallel to each other; Among the at least two second slits, the distance between each two adjacent second slits is the same.

8. The electronic device according to claim 1, characterized in that: The electronic device further comprises: a fourth metal layer, the fourth metal layer being arranged opposite to the first surface of the first metal layer; Wherein, the first surface of the first metal layer is away from the circuit board.

9. The electronic device according to claim 8, characterized in that: The fourth metal layer is parallel to the first metal layer.

10. The electronic device according to claim 8, characterized in that: The electronic device further comprises: a fifth metal layer, the fifth metal layer being arranged opposite to the first surface of the fourth metal layer; Wherein, the first surface of the fourth metal layer is away from the first metal layer.

11. The electronic device according to claim 10, characterized in that: The fifth metal layer is parallel to the fourth metal layer.

Images