Optical device

Abstract

The present invention provides an optical device, in which, in a first individual area among multiple first individual areas that is arranged in a central area, the center position of a pinhole is arranged at the center position of a sensing area, in a first individual area among multiple first areas that is arranged in a peripheral area different from the central area, the pinhole does not overlap with the sensing area, and in the first individual area arranged in the peripheral area, the distance between the center area of ​​the sensing area in the first individual area far from the central area and the pinhole when viewed from above is greater than the distance between the center area of ​​the sensing area in the first individual area close to the central area and the pinhole when viewed from above.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is based upon and claims the benefit of priority of Japanese patent application No. 2021-085272 filed on May 20, 2021, the entire contents of which are incorporated herein. Technical Field

[0003] Embodiments of the present invention relate to optical devices. Background Art

[0004] Conventionally, electronic devices including a light-receiving element and a light-emitting element have been developed. Summary of the invention

[0005] An object of the present embodiment is to provide an optical element and an electronic device capable of detecting a change in the direction of a line of sight.

[0006] An optical device according to one embodiment comprises a first substrate and a second substrate arranged overlapping with the first substrate, wherein the first substrate has an active area including a plurality of light-emitting areas for emitting near-infrared light and a plurality of sensing areas for detecting the near-infrared light, and the second substrate has a light-shielding area and a plurality of pinholes arranged in the light-shielding area, the optical device comprises a plurality of first individual areas and a plurality of second individual areas, the plurality of first individual areas respectively having one of the plurality of sensing areas, one of the light-shielding areas and one of the plurality of pinholes, the plurality of second individual areas respectively having one of the plurality of light-emitting areas, and the plurality of first individual areas each having a light-shielding area corresponding to the plurality of first individual areas. The 2 individual areas are alternately arranged, and in the first individual area among the multiple first individual areas that is arranged in the central area, the center position of the pinhole is arranged at the center position of the sensing area, and in the first individual area among the multiple first areas that is arranged in a peripheral area different from the central area, the pinhole does not overlap with the sensing area, and in the first individual area arranged in the peripheral area, the distance between the center area of ​​the sensing area in the first individual area far from the central area and the pinhole in a plan view is greater than the distance between the center area of ​​the sensing area in the first individual area close to the central area and the pinhole in a plan view. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1A It is a diagram for explaining an optical element according to an embodiment.

[0008] Figure 1B It is a diagram for explaining an optical element according to an embodiment.

[0009] Figure 1C It is a diagram for explaining an optical element according to an embodiment.

[0010] Figure 2 is a plan view of an optical element.

[0011] Figure 3A is a cross-sectional view of an optical element.

[0012] Figure 3B is a cross-sectional view of an optical element.

[0013] Figure 4A It is a diagram showing the positional relationship of optical elements.

[0014] Figure 4B It is a diagram showing the positional relationship of optical elements.

[0015] Figure 5A It is a figure which shows the application example of an optical element.

[0016] Figure 5B It is a figure which shows the application example of an optical element.

[0017] Figure 6 yes Figure 5A A perspective view of an electronic device.

[0018] Figure 7 It is a cross-sectional view showing another configuration example of the electronic device in the embodiment. DETAILED DESCRIPTION

[0019] Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the present disclosure is only an example, and appropriate changes that maintain the main purpose of the invention that are easily conceived by those skilled in the art are of course included in the scope of the present invention. In addition, in order to make the description clearer, the width, thickness, shape, etc. of each part in the drawings are sometimes schematically shown compared to the actual form, but this is only an example and is not limited to the interpretation of the present invention. In addition, in this specification and the drawings, the same elements as those described in the drawings that have already appeared are marked with the same figure numbers, and detailed descriptions are sometimes appropriately omitted.

[0020] Hereinafter, an optical element according to one embodiment will be described in detail with reference to the drawings.

[0021] In the present embodiment, the first direction X, the second direction Y, and the third direction Z are orthogonal to each other, but may intersect at an angle other than 90 degrees. The direction of the tip of the arrow pointing to the third direction Z is defined as up or above, and the direction on the opposite side to the direction of the tip of the arrow pointing to the third direction Z is defined as down or below.

[0022] In addition, when "the second member above the first member" and "the second member below the first member" are described, the second member may be in contact with the first member, or may be located at a position separated from the first member. In the latter case, a third member may be provided between the first member and the second member. On the other hand, when "the second member above the first member" and "the second member below the first member" are described, the second member is in contact with the first member.

[0023] In addition, it is assumed that there is an observation position for observing the optical element on the front end side of the arrow in the third direction Z, and observation from the observation position toward the XY plane defined by the first direction X and the second direction Y is referred to as a top view. Observation of a cross section of the optical element in the XZ plane defined by the first direction X and the third direction Z, or in the YZ plane defined by the second direction Y and the third direction Z is referred to as a cross-sectional view.

[0024] [Example]

[0025] Figure 1A to Figure 1C It is a diagram for explaining an optical element according to an embodiment. Figure 1A 2 is an exploded perspective view of the optical element OPT. The optical element OPT includes a sensor element portion SE and an optical path adjustment portion HE.

[0026] The sensor element unit SE includes a base material BA1 and a plurality of individual regions PA. The plurality of individual regions PA are provided in the active region AA in the base material BA1. The sensor element unit SE is also referred to as a first substrate SUB1.

[0027] The optical path adjustment unit HE includes a base material BA2 and a light shielding layer BM having a plurality of pinholes PH. The optical path adjustment unit HE is also referred to as a second substrate SUB2.

[0028] like Figure 1B As shown, the individual area PA includes individual areas PA1 and PA2. The individual area PA1 includes a sensing area SA. A light shielding layer BM and a pinhole PH of an optical path adjustment part HE are provided overlapping with the individual area PA1 of the sensor element part SE. The individual area PA2 includes a light emitting area EA. The individual areas PA1 and PA2 are also referred to as a first individual area and a second individual area, respectively.

[0029] Figure 2 is a plan view of an optical element. Figure 2 In the plurality of individual regions PA1, the plurality of individual regions PA2 are alternately arranged. In the individual region PA1 disposed in the central region CA of the active region AA, the center position of the pinhole PH is arranged at the center position of the sensing region SA. Figure 2In FIG. 1 , 16 and 12 individual areas PA1 and PA2 are arranged respectively, but the number of individual areas PA1 and PA2 is not limited thereto.

[0030] In addition, the individual areas PA1 and PA2 may not be arranged alternately. For example, one individual area PA2 may be arranged for two individual areas PA1. The number of individual areas PA1 to individual areas PA2 can be appropriately determined according to the sensitivity of the sensing area SA.

[0031] In the individual area PA1 provided in the peripheral area FA away from the central area CA, the pinhole PH does not overlap with the sensing area SA. The distance (referred to as offset) between the center position of the sensing area SA and the center position of the pinhole PH becomes longer toward the periphery.

[0032] That is, the offset amount is 0 (zero) in the central area CA, but becomes larger toward the periphery in the peripheral area FA.

[0033] That is, if the distance of the individual area PA1 from the center point CP of the active area AA becomes longer, the distance between the center position of the sensing area SA and the center position of the pinhole PH becomes longer. However, in the individual areas PA1 having the same distance from the center point CP of the active area AA, it is preferable to make the distance between the center position of the pinhole PH and the center point CP of the active area AA equal.

[0034] In other words, in the individual area PA1 configured in the peripheral area FA, the distance between the center area of ​​the sensing area SA in the individual area PA1 far from the central area CA and the pinhole PH when viewed from above is larger than the distance between the center area of ​​the sensing area SA in the individual area PA1 close to the central area CA and the pinhole PH when viewed from above.

[0035] Figure 3A as well as Figure 3B is a cross-sectional view of an optical element. Figure 3A It is along Figure 2 A cross-sectional view of the optical element OPT along line A1-A2. Figure 3B yes Figure 3A A partial enlarged view of .

[0036] The optical element OPT shown in Fig. 3 has a first substrate SUB1 and a second substrate SUB2. The first substrate SUB1 has a base material BA1, an anode AD, a light emitting layer EML, a sensor layer SRL, a cathode CD, an insulating layer PAS, and an insulating layer FIL. The second substrate SUB2 has a base material BA2, a light shielding layer BM, and a pinhole PH as described above.

[0037] The substrates BA1 and BA2 are transparent substrates. Examples of the material of the substrates BA1 and BA2 include resin materials made of resin materials such as glass, acrylic, and polyimide.

[0038] An anode AD is provided on the substrate BA1. The anode AD is formed of a laminate of a transparent conductive layer and a metal layer. As a material for the transparent conductive layer, for example, a light-transmitting metal oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO) can be used. As a material for the metal layer, for example, silver or a silver alloy can be used.

[0039] A portion of the anode AD is overlapped on the substrate BA1, and a plurality of banks BK (also referred to as ribs) are provided. The banks BK are convex portions formed by an organic insulating layer. As the organic insulating layer of the banks BK, a resin material such as acrylic resin or polyimide resin is used. The area between adjacent banks BK corresponds to the individual area PA.

[0040] Although not shown, a driving element of the individual area PA, such as a thin film transistor, may be provided between the base material BA1 and the bank BK.

[0041] In the individual area PA1, a sensor layer SRL is provided in the area between the adjacent banks BK so as to overlap with the anode AD. The sensor layer SRL is, for example, near-infrared light, more specifically, for sensing light having a wavelength of about 800 nm. In this embodiment, an organic photodiode material is used as the material of the sensor layer SRL. The sensor layer SRL is sometimes referred to as an OPD layer. Specifically, the sensor layer SRL is a photoelectric conversion layer capable of performing photoelectric conversion on near-infrared light.

[0042] In the individual area PA2, a light-emitting layer EML is provided in the area between the adjacent banks BK so as to overlap with the anode AD. The light-emitting layer EML emits, for example, near-infrared light, more specifically, light having a wavelength of about 800 nm. In this embodiment, an organic electroluminescence (Organic Electro Luminescence) light-emitting material is used as the material of the light-emitting layer EML. The light-emitting layer EML is sometimes also referred to as an organic EL layer or an OLED layer.

[0043] A cathode CD is provided on the sensor layer SRL and the light emitting layer EML. The material of the cathode CD is, for example, a conductive layer including an alkali metal or an alkaline earth metal. As the alkali metal or the alkaline earth metal, for example, magnesium (Mg), lithium (Li), etc. can be used. In this embodiment, an alloy of magnesium and silver, that is, an MgAg film, is used as the cathode CD. The cathode CD is provided across a plurality of individual areas PA.

[0044] An insulating layer PAS is provided on the cathode CD. As the material of the insulating layer PAS, inorganic materials such as silicon oxide, silicon nitride, and silicon oxynitride can be used. The insulating layer PAS prevents the intrusion of moisture and the like from the outside, and can prevent the light emitting layer EML and the sensor layer SRL from being degraded.

[0045] An insulating layer FIL is provided to cover the insulating layer PAS. As a material of the insulating layer FIL, for example, a resin material such as acrylic resin or polyimide resin is used. The insulating layer FIL can planarize the undulation of the first substrate SUB1 caused by the bank BK.

[0046] In addition, here, the electrode provided in the lower layer is set as the anode AD, and the electrode provided in the upper layer is set as the cathode CD, but depending on the stacking structure of the sensor layer SRL and the light-emitting layer EML, the opposite situation may also occur. Specifically, the electrode provided in the lower layer may be formed as the cathode CD, and the electrode provided in the upper layer may be formed as the anode AD.

[0047] The light shielding layer BM of the second substrate SUB2 is formed by using, for example, a resin material mixed with a black pigment. In the present embodiment, the region in the individual region PA1 where the light shielding layer BM is provided is also referred to as a light shielding region.

[0048] The pinhole PH is a through hole provided in the light shielding layer BM. One pinhole PH is provided for each individual area PA1.

[0049] In the individual area PA2, the light ELT emitted from the light emitting layer EML is emitted to the upper surface of the optical element OPT.

[0050] On the other hand, in the individual area PA1, the light ILT is incident on the sensor layer SRL via the pinhole PH provided in the light shielding layer BM. In the sensor layer SRL, the incident near-infrared light ILT is converted into an electrical signal by photoelectric conversion. By outputting the electrical signal, the incident near-infrared light ILT can be sensed. In addition, the sensor layer SRL is sometimes referred to as a light receiving layer or a photoelectric conversion layer.

[0051] As described above, the light ILT is incident on the pinhole PH arranged in the central area CA from the direction opposite to the third direction Z, that is, vertically from above.

[0052] The center of the pinhole PH arranged in the peripheral area FA is offset from the center of the sensing area SA. Therefore, the light ILT enters the pinhole PH arranged in the peripheral area FA at an angle having an inclination with respect to the third direction, that is, from an oblique direction.

[0053] Figure 4A as well as Figure 4B It is a diagram showing the positional relationship of optical elements. Figure 4AIt is a diagram showing the positional relationship among the optical element OPT, the eyeball EYE, the light ILT, and the light ELT. Figure 4B A diagram showing the principle of a pinhole camera.

[0054] like Figure 4A As shown, near-infrared light ELT is emitted from the light emitting layer EML of the optical element OPT toward the eyeball EYE. The light ELT is reflected on the surface of the eyeball EYE, and light ILT including position information of the black eyeball EBL, for example, travels toward the sensor layer SRL.

[0055] Here, use Figure 4B Explain the principle of pinhole camera. Figure 4B The pinhole camera CAM shown has a light shielding portion BMC, a pinhole PHC provided in the light shielding portion BMC, and a screen SCN. When external light OLT enters the pinhole camera CAM, only the light reaching the pinhole PHC can pass through the pinhole PH. Thus, an image IMG of the object OBJ can be obtained on the screen SCN.

[0056] In the optical element OPT of this embodiment, it is assumed that the light ILT travels along the same optical path as the external light OLT incident on the pinhole PHC of the pinhole camera CAM. Only the light ILT using this optical path passes through the pinhole PH of the optical element OPT.

[0057] The light ILT that has passed through the pinhole PH is incident on the sensor layer SRL. The light ILT is photoelectrically converted by the sensor layer SRL, and position information of the black eye ball EBL and the like are output as electrical information.

[0058] The distance between the optical element OPT and the eyeball EYE is fixed to a predetermined distance, and the pinholes PH provided in the individual areas PA are arranged on the optical path based on the predetermined distance and the position of the sensor layer ERL.

[0059] For example, when the position of the black pupil EBL changes, the sensor layer SRL detects the change in the position of the boundary EBD between the black pupil EBL and the white pupil EWT using the light ILT. This makes it possible to detect changes such as whether the line of sight is directed upward or downward.

[0060] Figure 5A as well as Figure 5B It is a diagram showing an application example of the optical element OPT. Figure 5A This is a diagram showing an electronic device for VR (Virtual Reality). Figure 5B It is a diagram showing a glasses-type electronic device.

[0061] Figure 5AThe electronic device ERP shown has an optical element OPT and a display device DSP. Although not shown for easy viewing of the attached figure, the optical element OPT is provided corresponding to the right eye and the left eye of the observer OBS, respectively. The display device DSP may be a display device that displays two different images corresponding to the right eye and the left eye of the observer OBS. Alternatively, it may be two display devices that display images corresponding to the right eye and the left eye of the observer OBS, respectively. The display device DSP and the optical element OPT are connected by wiring not shown in the figure, and transmit and receive input signals or output signals to each other.

[0062] The electronic device ERP includes a head mounted display (HMD) or glasses-type device mounted on the head of the observer OBS, etc. The electronic device ERP is used to provide, for example, virtual reality (VR) or augmented reality (AR) to the observer OBS.

[0063] As described above, the optical element OPT included in the electronic device ERP can detect the position change of the eyeball EYE, that is, the change of the line of sight of the observer OBS. The image displayed on the display device DSP is changed along with the movement of the line of sight of the observer OBS, thereby making the observer OBS feel virtual reality.

[0064] In the area AA1 of the optical element OPT, near infrared light is emitted, but visible light is transmitted. The observer OBS can observe the image displayed on the display device DSP through the area AA1. Thus, the electronic device ERP can provide the observer OBS with virtual reality (VR), for example.

[0065] Furthermore, when the display device DSP is a transparent display, that is, as long as the outside scenery can be observed through the display device DSP, augmented reality (AR) can be realized. As such a transparent display, a transparent display using liquid crystal or a transparent display using organic EL can be used.

[0066] exist Figure 5A Although not shown in the figure, the display device DSP includes a plurality of pixels. The pixel includes a switch element for controlling a liquid crystal layer or an organic EL light emitting layer. The resolution of the pixel only needs to be about 10 to 100 times the density of the individual area PA1 of the optical element OPT.

[0067] Figure 5B The eyeglass-type electronic device GLS shown in the figure has an optical element OPT and a lens LNS. Although not shown in the figure for the sake of convenience, it can be combined with Figure 5ASimilarly, an optical element OPT and a lens LNS are provided corresponding to the right eye and the left eye of the observer OBS, respectively.

[0068] As described above, visible light is transmitted through the area AA1 of the optical element OPT, and the observer OBS can observe the outside scenery through the area AA1. Thus, the glasses-type electronic device GLS can provide, for example, augmented reality (AR) to the observer OBS.

[0069] Figure 6 yes Figure 5A A three-dimensional diagram of an electronic device. The electronic device ERP has a frame CAS and a clip FST. An optical element OPT and a display device DSP are built into the frame CAS. Although not shown in the figure for the convenience of observing the accompanying drawings, a control unit connected to the optical element OPT and the display device DSP, or for sending and receiving signals to the optical element OPT and the display device DSP, may be provided in the frame CAS.

[0070] In this embodiment, the near infrared light ELT emitted from the light emitting layer EML is reflected by the eyeball EYE of the observer OBS. The reflected light ILT enters the sensor layer SRL through the pinhole PH. The position information of the eyeball EYE contained in the incident light is photoelectrically converted by the sensor layer SRL and output as an electrical signal.

[0071] The pinhole PH overlaps with the sensing area SA in the central area CA, but does not overlap with the sensing area SA in the peripheral area FA. The deviation of the center position of the pinhole PH from the center position of the sensing area SA increases toward the periphery.

[0072] This makes it possible to detect a change in the direction of the line of sight of the observer OBS, and to change the displayed image in accordance with the change in the line of sight.

[0073] <Configuration Example 1>

[0074] Figure 7 2 is a cross-sectional view showing another configuration example of the electronic device in the embodiment. Figure 7 The illustrated configuration example is different from the configuration example illustrated in FIG. 3 in that pinholes are formed in a plurality of stacked light shielding layers.

[0075] Figure 7The optical path adjustment part HE (second substrate SUB2) of the optical element OPT shown has light shielding layers BM1, BM2, and BM3 stacked in sequence above the base material BA2. The light shielding layers BM1, BM2, and BM3 are also collectively referred to as light shielding layers BM. The light shielding layers BM1, BM2, and BM3 can be formed using the above-mentioned materials. In addition, in this configuration example, an example of stacking three light shielding layers is described, but the number of light shielding layers is not limited to this, and two or more layers can be stacked.

[0076] Pinholes PH1, PH2, and PH3 are provided in the light shielding layers BM1, BM2, and BM3, respectively. Pinholes PH1, PH2, and PH3 are also collectively referred to as pinholes PH. A portion of pinhole PH1 overlaps with pinhole PH2, and the other portion does not overlap. A portion of pinhole PH2 overlaps with pinhole PH3, and the other portion does not overlap. Pinholes PH1, PH2, and PH3 overlap and stagger on the XY plane, and as a whole constitute a pinhole PH extending obliquely with respect to a direction (thickness direction) parallel to the third direction Z.

[0077] The obliquely extending pinhole PH can make the light ILT incident obliquely with respect to the direction parallel to the third direction Z. When the light ILT is incident obliquely, the amount of light reaching the sensor layer SRL increases, and the sensitivity further increases.

[0078] In this configuration example as well, the same effects as those of the above-described embodiment are achieved.

[0079] The above describes the embodiments of the present invention, but the embodiments are presented as examples and are not intended to limit the scope of the invention. The new embodiments can be implemented using various other forms, and various omissions, substitutions, and changes can be made without departing from the scope of the invention. The embodiments or their modifications are included in the scope or spirit of the invention, and are included in the invention described in the claims and the scope equivalent thereto.

Claims

1. An optical device comprising: 1st substrate; a second substrate arranged overlapping with the first substrate; a plurality of light emitting regions on the first substrate for emitting near-infrared light and a plurality of sensing regions for detecting the near-infrared light; A light shielding region on the second substrate and a plurality of pinholes provided in the light shielding region; a plurality of first individual regions, each of which has one of the plurality of sensing regions, the light shielding region, and one of the plurality of pinholes; as well as a plurality of second individual regions, each of which has one of the plurality of light-emitting regions, The plurality of first individual regions are arranged alternately with the plurality of second individual regions. In the first individual area arranged in the central area among the plurality of first individual areas, the center position of the pinhole is arranged at the center position of the sensing area, In the first individual area among the plurality of first areas, which is arranged in a peripheral area different from the central area, the pinhole does not overlap with the sensing area. In the first individual area arranged in the peripheral area, the distance between the center area of ​​the sensing area in the first individual area far from the central area and the pinhole when viewed from above is greater than the distance between the center area of ​​the sensing area in the first individual area close to the central area and the pinhole when viewed from above.

2. The optical device according to claim 1, wherein: The light shielding region includes a plurality of light shielding layers, a first pinhole provided in one of the plurality of light shielding layers, and a second pinhole provided in another of the plurality of light shielding layers. One of the plurality of pinholes includes the first pinhole and the second pinhole, The first pinhole and the second pinhole are arranged to be staggered with each other in a plan view. A line connecting the center of the first pinhole and the center of the second pinhole extends obliquely with respect to the thickness direction of the second substrate.

3. The optical device according to claim 1, wherein: It also has a display panel. The first substrate, the second substrate, and the display panel are arranged to overlap each other.

4. The optical device according to claim 3, wherein: The first substrate is located between the second substrate and the display panel.

5. The optical device according to claim 1, wherein: The first substrate, the second substrate, and the lens are arranged to overlap each other.

6. The optical device according to claim 5, wherein: The first substrate is located between the second substrate and the lens.

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