Substrate processing apparatus and substrate inversion method

Abstract

The present application relates to a substrate processing apparatus (1) and a substrate conveying method. The substrate processing apparatus (1) includes a support portion (25), a conveying mechanism (23), and a reversing mechanism (26). The conveying mechanism (23) includes a first suction portion (42) and a hand portion driving portion (45). The reversing mechanism (26) includes a second suction portion (72) and a rotation driving portion. When the conveying mechanism (23) conveys a substrate (W) to the support portion (25), the first suction portion (42) is positioned above the substrate (W), the first suction portion (42) causes gas to flow along an upper surface of the substrate (W) to suction the substrate (W) upward, and the hand portion driving portion (45) moves the first suction portion (42) to the support portion (25). When the reversing mechanism (26) receives the substrate (W) from the support portion (25), the second suction portion (72) is positioned above the substrate (W) supported on the support portion (25), and the second suction portion (72) causes gas to flow along an upper surface of the substrate (W) to suction the substrate (W) upward.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a substrate reversal method for processing substrates. Examples of substrates include semiconductor wafers, liquid crystal display substrates, organic EL (Electroluminescence) substrates, FPD (Flat Panel Display) substrates, optical display substrates, magnetic disk substrates, optical disk substrates, magneto-optical disk substrates, photomask substrates, and solar cell substrates. Background Technology

[0002] Patent Document 1 discloses a substrate cleaning apparatus. Hereinafter, the symbols described in Patent Document 1 will be indicated in parentheses. The substrate cleaning apparatus includes a reversing section (18). The reversing section (18) rotates the substrate (W) about a horizontal axis. The reversing section (18) reverses the substrate (W).

[0003] The reversing part (18) includes multiple support pins (72), a pair of chucks (73), and a rotating part (74). The support pins (72) support the substrate (W). The pair of chucks (73) contact the substrate (W). The pair of chucks (73) clamp the end edges of the substrate (W). The rotating part (74) supports the pair of chucks (73). The rotating part (74) causes the pair of chucks (73) to rotate about a horizontal axis of rotation.

[0004] The substrate cleaning apparatus includes a conveying unit (12). The conveying unit (12) conveys the substrate (W) to the reversing unit (18). The conveying unit (12) includes a substrate holding part (51). The substrate holding part (51) contacts the substrate (W). The substrate holding part (51) holds the substrate (W).

[0005] The reversing unit (18) and the conveying unit (12) operate as follows: The substrate holding unit (51) delivers the substrate (W) to the support pin (72). A pair of chucks (73) receive the substrate (W) from the support pin (72). The rotating unit (74) rotates the pair of chucks (73). As a result, the substrate (W) is reversed. The pair of chucks (73) deliver the substrate (W) to the support pin (72). The substrate holding unit (51) receives the substrate (W) from the support pin (72).

[0006] Existing technical documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2003-59885 Summary of the Invention

[0008] The problem the invention aims to solve

[0009] In recent years, substrates have been trending towards ultra-thinness and larger diameters. If the substrate thickness is thinner and the diameter is larger, the substrate's deflection increases significantly. Therefore, existing devices sometimes struggle to properly reverse the substrate. For example, reversing the substrate may cause damage or breakage.

[0010] The present invention was made in view of this situation, and its object is to provide a substrate processing apparatus and a substrate reversing method that can properly reverse a substrate.

[0011] means for solving problems

[0012] To achieve this objective, the present invention is configured as follows: The present invention is a substrate processing apparatus comprising: a support portion that contacts a substrate and supports the substrate in a horizontal position; a conveying mechanism that conveys the substrate to the support portion; and a reversing mechanism that receives the substrate from the support portion, reverses the substrate, and delivers the substrate to the support portion; the conveying mechanism comprises: a first suction portion that attracts the substrate without contacting it; and a conveying drive portion that moves the first suction portion; the reversing mechanism comprises: a second suction portion that attracts the substrate without contacting it; and a rotation drive portion that moves the substrate... The second suction part rotates about a horizontal rotation axis; when the conveying mechanism conveys the substrate to the support part, the first suction part is located above the substrate, and the first suction part causes gas to flow along the upper surface of the substrate to attract the substrate upward, and the conveying drive part moves the first suction part to the support part; when the reversing mechanism receives the substrate from the support part, the second suction part is located above the substrate supported by the support part, and the second suction part causes gas to flow along the upper surface of the substrate to attract the substrate upward.

[0013] The first suction unit attracts the substrate without contacting it. Therefore, the conveying mechanism can properly support the substrate. The conveying mechanism is equipped with a conveying drive unit. Therefore, the conveying mechanism can properly convey the substrate attracted by the first suction unit.

[0014] The second suction part attracts the substrate without contacting it. Therefore, the reversing mechanism can properly support the substrate. The reversing mechanism includes a rotation drive unit. Therefore, the reversing mechanism can properly reverse the substrate attracted by the second suction part.

[0015] The conveying mechanism transports the substrate to the support section, and the reversing mechanism receives the substrate from the support section. Thus, the reversing mechanism indirectly receives the substrate from the conveying mechanism via the support section. The reversing mechanism does not directly receive the substrate from the conveying mechanism. Therefore, the second suction section can properly attract the substrate.

[0016] The support portion holds the substrate in a horizontal position. Therefore, the second suction portion can more effectively attract the substrate.

[0017] When the conveying mechanism transports the substrate to the support section, the first suction section is located above the substrate. Therefore, the conveying mechanism can properly deliver the substrate to the support section.

[0018] When the reversing mechanism receives the substrate from the support portion, the second suction portion is positioned above the substrate supported on the support portion. Therefore, the reversing mechanism can properly receive the substrate from the support portion.

[0019] As described above, this substrate processing apparatus can properly reverse the substrate.

[0020] In the aforementioned substrate processing apparatus, the support portion preferably includes a position adjustment portion for adjusting the position of the substrate in the horizontal direction. The substrate supported on the support portion is positioned appropriately. Therefore, the second suction portion can appropriately attract the substrate supported on the support portion. The reversing mechanism can appropriately receive the substrate from the support portion.

[0021] In the aforementioned substrate processing apparatus, the position adjustment unit preferably includes an inclined surface that faces downward and is inclined inward in the radial direction to the substrate supported by the support unit, and contacts the end edge of the substrate. Therefore, the position adjustment unit can properly guide the substrate to the appropriate position.

[0022] Preferably, in the above-described substrate processing apparatus, when the reversing mechanism reverses the substrate, the second suction part moves from a position above the substrate to a position below the substrate. When the reversing mechanism delivers the substrate to the support part, the second suction part is located below the substrate and does not attract the substrate. From the time the reversing mechanism delivers the substrate to the support part until the support part delivers the substrate to the transport mechanism, the second suction part remains stationary. When the reversing mechanism reverses the substrate, the second suction part attracts the substrate, and the rotation drive unit rotates the second suction part around the rotation axis. Therefore, when the reversing mechanism reverses the substrate, the second suction part moves from a position above the substrate to a position below the substrate. Therefore, the reversing mechanism can properly reverse the substrate. When the reversing mechanism delivers the substrate to the support part, the second suction part is located below the substrate and does not attract the substrate. Therefore, the reversing mechanism can properly deliver the substrate to the support part. From the time the reversing mechanism delivers the substrate to the support part until the support part delivers the substrate to the transport mechanism, the second suction part does not move. Therefore, after the reversing mechanism delivers the substrate to the support section, the support section can quickly deliver the substrate to the conveying mechanism.

[0023] In the aforementioned substrate processing apparatus, preferably, the rotary drive unit moves the second suction unit to a first position where it blows gas downwards and a second position where it blows gas upwards by rotating the second suction unit around the rotation axis. The rotation axis is positioned lower than the second suction unit at the first position, and the second suction unit at the first position is positioned higher than the second suction unit at the second position. The rotary drive unit moves the second suction unit to the first position by rotating it around the rotation axis. When the second suction unit is in the first position, it blows gas downwards. Therefore, when the second suction unit is in the first position, it can appropriately attract the substrate located below it. The rotary drive unit moves the second suction unit to the second position by rotating it around the rotation axis. When the second suction unit is in the second position, it blows gas upwards. Therefore, when the second suction part is in the second position, it can properly attract the substrate located above it. The rotation axis is positioned lower than the second suction part in the first position. Therefore, the second suction part in the first position is positioned higher than the second suction part in the second position. Therefore, when the second suction part is in the first position, it can be easily positioned above the substrate. Therefore, when the second suction part is in the first position, the reversing mechanism can properly receive the substrate from the support. On the other hand, the second suction part in the second position is positioned lower than the second suction part in the first position. Therefore, when the second suction part is in the second position, it can be easily positioned below the substrate. Therefore, when the second suction part is in the second position, the reversing mechanism can properly deliver the substrate to the support.

[0024] Preferably, in the above-described substrate processing apparatus, when the reversing mechanism delivers the substrate to the support portion, the second suction portion is located at the second position and does not attract the substrate. From the time the reversing mechanism delivers the substrate to the support portion until the support portion delivers the substrate to the transport mechanism, the second suction portion remains at the second position. Therefore, the reversing mechanism can properly deliver the substrate to the support portion. From the time the reversing mechanism delivers the substrate to the support portion until the support portion delivers the substrate to the transport mechanism, the second suction portion remains at the second position. Therefore, after the reversing mechanism delivers the substrate to the support portion, the support portion can quickly deliver the substrate to the transport mechanism.

[0025] In the aforementioned substrate processing apparatus, it is preferable that when the second suction portion is located in the second position, the second suction portion, viewed from above, is positioned radially inward of the substrate supported by the support portion. When the second suction portion is in the second position, it can more effectively attract the substrate. On the other hand, the time required for the second suction portion to retract from the second position is relatively long. However, as described above, from the time the reversing mechanism delivers the substrate to the support portion until the support portion delivers the substrate to the transport mechanism, the second suction portion remains in the second position. Therefore, the time delay in the support portion delivering the substrate to the transport mechanism can be appropriately suppressed.

[0026] Preferably, in the above-described substrate processing apparatus, the substrate processing apparatus includes a lifting drive unit that moves the support unit to a first support position and a second support position lower than the first support position. When the second suction unit is in the first position, the second suction unit is positioned at a position higher than the substrate supported by the support unit at the first support position. The height of the substrate attracted by the second suction unit at the second position is lower than the height of the substrate supported by the support unit at the first support position, but higher than the height of the substrate supported by the support unit at the second support position. When the second suction unit is in the first position, the second suction unit is positioned at a position higher than the substrate supported by the support unit at the first support position. Therefore, when the second suction unit is in the first position, the second suction unit can easily be positioned above the substrate supported by the support unit at the first support position. Therefore, when the second suction unit is in the first position, the reversing mechanism can easily receive the substrate from the support unit. The height of the substrate attracted by the second suction part at the second position is lower than the height of the substrate supported by the support part at the first support position, but higher than the height of the substrate supported by the support part at the second support position. Therefore, when the second suction part is in the second position, the support part can properly receive the substrate by the reversing mechanism as the support part moves from the second support position to the first support position. That is, when the second suction part is in the second position, the reversing mechanism can properly deliver the substrate to the support part.

[0027] Preferably, in the aforementioned substrate processing apparatus, when the conveying mechanism delivers the substrate to the support portion, the support portion is located at the first support position; when the reversing mechanism receives the substrate from the support portion, the support portion is located at the first support position; when the reversing mechanism reverses the substrate, the support portion is located at the second support position; and when the reversing mechanism delivers the substrate to the support portion, the support portion moves from the second support position to the first support position. The support portion has only two positions (specifically, the first support position and the second support position). Therefore, the structure of the lifting drive unit can be simplified.

[0028] Preferably, in the aforementioned substrate processing apparatus, the reversing mechanism includes a movement drive unit that moves the second suction part from the first position to a third position where it does not interfere with the conveying mechanism. When the conveying mechanism delivers the substrate to the support unit, the second suction part is located at the third position. This effectively prevents interference between the second suction part and the conveying mechanism when the conveying mechanism delivers the substrate to the support unit.

[0029] In the aforementioned substrate processing apparatus, it is preferable that when the second suction portion is located in the third position, the second suction portion, viewed from above, is positioned further outward in the radial direction from the substrate supported by the support portion. When the second suction portion is located in the third position, interference between the second suction portion and the conveying mechanism can be reliably prevented.

[0030] Preferably, in the above-described substrate processing apparatus, the reversing mechanism includes: a first branch connected to the movement drive unit; and a second branch connected to the movement drive unit; the second suction unit includes: a third suction unit held at the first branch; and a fourth suction unit held at the second branch; the movement drive unit widens or narrows the gap between the first branch and the second branch, and by increasing the gap between the first branch and the second branch, the movement drive unit moves the second suction unit from the first position to the third position. This appropriately suppresses the amount of movement of the second suction unit when it moves from the first position to the third position. Therefore, the movement drive unit can easily move the second suction unit from the first position to the third position.

[0031] In the aforementioned substrate processing apparatus, preferably, when the second attracting portion is located in the first position, the rotation axis is arranged such that, in plan view, it passes between the first branch and the second branch. When the second attracting portion moves from the first position to the third position, the first branch and the second branch are respectively moved away from the rotation axis in plan view. When the second attracting portion moves from the third position to the first position, the first branch and the second branch are respectively moved closer to the rotation axis in plan view. This appropriately suppresses the amount of movement of the second attracting portion when it moves between the first and third positions. Therefore, the movement drive unit can more easily move the second attracting portion between the first and third positions.

[0032] This invention provides a substrate reversal method, which reverses a substrate; it comprises the following steps: a conveying step, wherein a conveying mechanism having a first suction portion conveys the substrate to a supporting portion; a first supporting step, wherein the supporting portion receives the substrate from the conveying mechanism and supports the substrate in a horizontal position; a first obtaining step, wherein a reversing mechanism having a second suction portion removes the substrate from the supporting portion; a reversing step, wherein the reversing mechanism reverses the substrate; and a second supporting step, wherein the supporting portion receives the substrate from the reversing mechanism and supports the substrate in a horizontal position; and in the above... In the conveying step, the first suction part is located above the substrate. The first suction part causes gas to flow on the upper surface of the substrate and attracts the substrate upward. The first suction part moves to the support part. In the first acquisition step, the second suction part is located above the substrate supported by the support part, i.e., the first position. The second suction part causes gas to flow on the upper surface of the substrate and attracts the substrate upward. In the reversing step, while the second suction part is attracting the substrate, the second suction part rotates half a turn around the horizontal rotation axis and moves from the first position to the second position.

[0033] In the conveying step, the conveying mechanism transports the substrate to the support section. The conveying mechanism includes a first suction section. In the conveying step, the first suction section is located above the substrate, and the first suction section causes gas to flow on the upper surface of the substrate, thereby attracting the substrate upward. Therefore, in the conveying step, the conveying mechanism can properly support the substrate.

[0034] During the transport step, while the first suction part is attracting the substrate, the first suction part moves to the support part. Therefore, during the transport step, the transport mechanism can properly transport the substrate attracted by the first suction part to the support part.

[0035] In the first supporting step, the supporting part receives the substrate from the conveying mechanism. The supporting part supports the substrate in a horizontal position. As described above, in the conveying step, the first suction part is located above the substrate. Therefore, in the first supporting step, the supporting part can properly receive the substrate from the conveying mechanism.

[0036] In the first acquisition step, the reversing mechanism removes the substrate from the support portion. The reversing mechanism includes a second suction portion. In the first acquisition step, the second suction portion is located at a first position. The first position is a position above the substrate supported on the support portion. In the first acquisition step, regarding the second suction portion, the second suction portion causes gas to flow on the upper surface of the substrate, thereby attracting the substrate upward. Therefore, in the first acquisition step, the reversing mechanism can properly remove the substrate from the support portion.

[0037] As described above, in the first supporting step, the supporting portion supports the substrate in a horizontal position. Therefore, in the first acquiring step, the second attracting portion can properly attract the substrate.

[0038] As described above, the substrate reversing method includes a first supporting step. Therefore, the conveying mechanism conveys the substrate to the supporting section. The reversing mechanism removes the substrate from the supporting section. Thus, the reversing mechanism indirectly receives the substrate from the conveying mechanism via the supporting section. The reversing mechanism does not directly receive the substrate from the conveying mechanism. Therefore, the second suction section can more appropriately suction the substrate. Therefore, in the first obtaining step, the reversing mechanism can more appropriately remove the substrate from the supporting section.

[0039] In the reversing step, the reversing mechanism reverses the substrate. Specifically, while the substrate is being attracted by the second attracting part, the second attracting part rotates half a turn around a horizontal rotation axis, thereby moving the second attracting part from the first position to the second position. Therefore, in the reversing step, the reversing mechanism can properly reverse the substrate attracted by the second attracting part.

[0040] In the second supporting step, the supporting part receives the substrate from the reversing mechanism. The supporting part supports the substrate in a horizontal position. Here, in the second supporting step, the second attracting part is located in the second position. As described above, the second position is the position after the second attracting part has rotated half a turn around the horizontal rotation axis from the first position. Therefore, when the second attracting part is in the second position, the second attracting part is located below the substrate. Therefore, in the second supporting step, the supporting part can properly receive the substrate from the reversing mechanism.

[0041] As described above, this substrate reversal method enables the substrate to be properly reversed.

[0042] In the above-described substrate reversal method, it is preferable that, in the first supporting step, the position of the substrate in the horizontal direction is adjusted. In the first supporting step, the substrate supported on the supporting portion is positioned appropriately. Therefore, in the first acquiring step, the second attracting portion can appropriately attract the substrate supported on the supporting portion.

[0043] In the aforementioned substrate reversal method, preferably, in the first support step, the support portion remains stationary at the first support position; in the first acquisition step, the support portion remains stationary at the first support position; in the reversal step, the support portion moves from the first support position to a second support position lower than the first support position; and in the second support step, the support portion moves from the second support position to the first support position. The support portion remains stationary in only two positions (specifically, the first support position and the second support position). Therefore, the operation of the support portion can be simplified.

[0044] In the above-described substrate reversal method, preferably, when the second attraction portion is located at the first position, the second attraction portion is disposed at a position higher than the substrate supported by the support portion at the first support position, the height position of the rotation axis is lower than the height position of the second attraction portion located at the first position, the height position of the second attraction portion located at the second position is lower than the height position of the second attraction portion located at the first position, the height position of the substrate attracted by the second attraction portion at the second position is lower than the height position of the substrate supported by the support portion at the first support position, and the height position of the substrate attracted by the second attraction portion at the second position is higher than the height position of the substrate supported by the support portion at the second support position.

[0045] When the second suction part is in the first position, the second suction part is positioned at a higher position than the substrate supported by the support part at the first support position. Therefore, in the first acquisition step, the second suction part can properly attract the substrate supported by the support part at the first support position.

[0046] The height of the rotation axis is lower than the height of the second suction part located in the first position. Therefore, the height of the second suction part in the second position is lower than the height of the second suction part in the first position. That is, when the second suction part moves from the first position to the second position, the height of the second suction part decreases. Here, the height of the substrate attracted by the second suction part in the second position is lower than the height of the substrate supported by the support part in the first support position, but higher than the height of the substrate supported by the support part in the second support position. Therefore, in the second support step, the reversing mechanism can properly deliver the substrate to the support part. In the second support step, by moving the support part from the second support position to the first support position, the support part can properly receive the substrate from the reversing mechanism.

[0047] Preferably, in the above-described substrate reversal method, the substrate reversal method includes a second acquisition step, in which the conveying mechanism removes the substrate from the support portion, and from the second support step to the second acquisition step, the second suction portion remains stationary at the second position. The second acquisition step can be started quickly after the second support step.

[0048] Preferably, in the above-described substrate reversal method, the substrate reversal method includes a retraction step, which occurs after the second acquisition step, whereby the second attracting part moves from the second position to a third position where it does not interfere with the conveying mechanism, and the second attracting part is located in the third position during the first support step. The second acquisition step is performed before the retraction step. Therefore, the second acquisition step can be performed at an earlier time. During the first support step, the second attracting part is located in the third position. Therefore, interference between the second attracting part and the conveying mechanism during the first support step can be appropriately prevented.

[0049] Preferably, in the above-described substrate reversal method, the retraction step includes: a lowering step, wherein the supporting portion moves from the first supporting position to the second supporting position; a first moving step, wherein after the lowering step, the second attracting portion rotates about the rotation axis and moves from the second position to the first position; a second moving step, wherein after the first moving step, the second attracting portion moves from the first position to the third position; and an raising step, wherein after the first moving step, the supporting portion moves from the second supporting position to the first supporting position. In the retraction step, the second attracting portion can be appropriately moved from the second position to the third position.

[0050] The effects of the invention

[0051] According to the present invention, the substrate can be properly reversed. Attached Figure Description

[0052] Figure 1 This is a top view showing the interior of the substrate processing apparatus according to the embodiment.

[0053] Figure 2 (a) is a side view of the substrate. Figure 2 (b) is a top view of the substrate.

[0054] Figure 3 (a) and Figure 3 (b) are cross-sectional views showing an example of the shape of the substrate W.

[0055] Figure 4 (a) and Figure 4 (b) are side views showing an example of the structure of the substrate W.

[0056] Figure 5 This is a left-side view showing the configuration of the central portion of the substrate processing apparatus in the width direction.

[0057] Figure 6 (a) is a front view of the substrate mounting section. Figure 6 (b) is a top view of the substrate mounting section.

[0058] Figure 7 This is a left-side view showing the configuration of the left side of the substrate processing device.

[0059] Figure 8 This is a diagram of the control area of ​​the substrate processing device.

[0060] Figure 9 This diagram schematically illustrates the sequence of transporting a single substrate.

[0061] Figure 10 It is a bottom view of the hands of the conveying mechanism.

[0062] Figure 11 of (a), Figure 11 (b) and Figure 11 (c) are side views of the hands of the conveying mechanism.

[0063] Figure 12 This is a side view of the inverted cell.

[0064] Figure 13 This is a top view of part of the inverted unit.

[0065] Figure 14 This is a front view of part of the inverted unit.

[0066] Figure 15 This is a front view of part of the inverted unit.

[0067] Figure 16 This is a flowchart illustrating the sequence of actions that cause the substrate to flip.

[0068] Figure 17 of (a), Figure 17 (b) and Figure 17 (c) are top views that schematically represent examples of the conveying step and the first support step.

[0069] Figure 18 (a) to Figure 18 The (h) views are side views that schematically represent examples of the conveying step and the first support step.

[0070] Figure 19 (a) is a front view schematically representing an example of the action of the first acquisition step. Figure 19 (b) is a top view schematically representing an example of the action of the first acquisition step.

[0071] Figure 20 (a) is a front view schematically representing an example of the action of the first acquisition step. Figure 20 (b) is a top view schematically representing an example of the action of the first acquisition step.

[0072] Figure 21 (a) is a front view schematically representing an example of the action of the first acquisition step. Figure 21 (b) is a top view schematically representing an example of the action of the first acquisition step.

[0073] Figure 22 (a) is a front view schematically representing an example of a reversal step. Figure 22 (b) is a top view schematically representing an example of the reversal step.

[0074] Figure 23 (a) is a front view schematically illustrating an example of the reversal step and the second support step. Figure 23 (b) is a top view schematically illustrating an example of the reversal step and the second support step.

[0075] Figure 24 (a) is a front view schematically illustrating an example of the action of the second support step. Figure 24 (b) is a top view schematically representing an example of the action of the second support step.

[0076] Figure 25 (a) is a front view schematically representing an example of the action in the second acquisition step. Figure 25 (b) is a top view schematically representing an example of the action in the second acquisition step.

[0077] Figure 26 (a) is a front view schematically representing an example of the action in the second acquisition step. Figure 26 (b) is a top view schematically representing an example of the action in the second acquisition step.

[0078] Figure 27 (a) is a front view schematically representing an example of the action of moving out. Figure 27 (b) is a top view schematically representing an example of the moving steps.

[0079] Figure 28 (a) to (h) of 28 are side views that schematically represent examples of actions in the second acquisition step and the removal step.

[0080] Figure 29 (a) is a front view schematically representing an example of the descent step. Figure 29 (b) is a top view schematically representing an example of the descent step.

[0081] Figure 30 (a) is a front view schematically representing an example of the action of the first moving step. Figure 30 (b) is a top view schematically representing an example of the action of the first moving step.

[0082] Figure 31 (a) is a front view schematically illustrating an example of the actions of the second moving step and the rising step. Figure 31 (b) is a top view schematically showing an example of the actions of the second moving step and the rising step. Detailed Implementation

[0083] Hereinafter, the substrate processing apparatus of the present invention will be described with reference to the accompanying drawings.

[0084] Figure 1 This is a top view of the substrate processing apparatus according to the embodiment. The substrate processing apparatus 1 processes the substrate W.

[0085] <Substrate W>

[0086] First, the substrate W processed by the substrate processing apparatus 1 will be described. Figure 2 (a) is a side view of the substrate W. Figure 2 (b) is a top view of substrate W. Substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display, a substrate for an organic EL (Electroluminescence) display, a substrate for an FPD (Flat Panel Display), a substrate for an optical display, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a magneto-optical disk, a substrate for a photomask, or a substrate for a solar cell.

[0087] The basic shape of substrate W is described below. Substrate W has a relatively thin flat plate shape. Substrate W may also have a relatively thin thickness. The thickness of substrate W is, for example, 10 μm or more and 200 μm or less. However, the thickness of substrate W is not limited to 10 μm or more and 200 μm or less. The thickness of substrate W may also be less than 10 μm. The thickness of substrate W may also be greater than 200 μm.

[0088] The substrate W has a generally circular shape when viewed from above. The substrate W may also have a relatively large diameter. The diameter of the substrate W is, for example, 300 mm. However, the diameter of the substrate W is not limited to 300 mm. The diameter of the substrate W may be less than 300 mm, or it may be greater than 300 mm.

[0089] The substrate W has a first surface W1 and a second surface W2. When the substrate W is in a horizontal position, one of the first surface W1 and the second surface W2 faces upward, and the other of the first surface W1 and the second surface W2 faces downward. The surface of the substrate W facing upward is called the "top surface WT", and the surface of the substrate W facing downward is called the "back surface WB". For example, when the first surface W1 is located on the top surface WT, the second surface W2 is located on the back surface WB. For example, when the substrate W is flipped, the first surface W1 changes from the top surface WT to the back surface WB, and the second surface W2 changes from the back surface WB to the top surface WT.

[0090] The substrate W has a first region 3 for forming a semiconductor device and a second region 4 for not forming a semiconductor device. The second region 4 is located at the periphery of the substrate W in top view. The first region 3 is located inside the second region 4 in top view. The first region 3 is referred to as the "main portion 3". The second region 4 is referred to as the "peripheral portion 4".

[0091] The detailed shape of substrate W is shown as an example.

[0092] like Figure 3 As shown in (a), the substrate W may also have a recess 5. Figure 3 (a) is a cross-sectional view showing an example of the shape of the substrate W. The recess 5 is formed, for example, by a grinding process (polishing process). The recess 5 is formed, for example, by the main portion 3 being more recessed than the peripheral portion 4. For example, if a semiconductor device is formed on the main portion 3 of the first surface W1 but not on the main portion 3 of the second surface W2, the recess 5 is not formed on the first surface W1, but on the second surface W2.

[0093] Or, such as Figure 3 As shown in (b), the substrate W may also not have the recess 5. Figure 3 (b) is a cross-sectional view showing another example of the shape of the substrate W. The first surface W1 and the second surface W2 can also be flat throughout the main part 3 and the peripheral part 4, respectively.

[0094] The structure of substrate W is illustrated.

[0095] like Figure 4 As shown in (a), the substrate W may also include a substrate body 6 and a protective member 7. Figure 4(a) is a side view showing an example of the structure of the substrate W. A semiconductor device is formed on the substrate body 6. The substrate body 6 is, for example, a silicon wafer. The substrate body 6 may also have the aforementioned recess 5. Alternatively, the substrate body 6 may not have the recess 5. A protective member 7, for example, supports the substrate W and protects the substrate W. The semiconductor device is not formed on the protective member 7. The protective member 7 is, for example, at least one of a plate, film, tape, sheet, and thin film. The material of the protective member 7 is, for example, glass or resin. The resin is, for example, a synthetic resin. The protective member 7 is bonded to the substrate body 6. The protective member 7 is bonded to the substrate body 6, for example, via an adhesive not shown.

[0096] like Figure 4 As shown in (b), the substrate W may also include a substrate body 6 and not a protective member 7. Figure 4 (b) is a side view showing another example of the construction of the substrate W. The substrate W may also be, for example, a substrate body 6 obtained by peeling off a protective member 7 that is bonded to the substrate body 6. For example, the adhesive used to bond the substrate body 6 to the protective member 7 may also be attached to the substrate W.

[0097] The processing performed by the substrate processing apparatus 1 is, for example, a cleaning process of the substrate W. The processing performed by the substrate processing apparatus 1 is, for example, a process of removing adhesive adhering to the substrate W from the substrate W.

[0098] <Overview of the substrate processing apparatus>

[0099] Reference Figure 1 An overview of the substrate processing apparatus 1 will be provided.

[0100] The substrate processing apparatus 1 includes an indexing unit 10 and a processing area 20. The processing area 20 is connected to the indexing unit 10. The indexing unit 10 and the processing area 20 are arranged in a horizontal direction. The indexing unit 10 supplies a substrate W to the processing area 20. The processing area 20 processes the substrate W. The indexing unit 10 retrieves the substrate W from the processing area 20.

[0101] For convenience, in this specification, the horizontal direction in which the indexing unit 10 and the processing area 20 are arranged is referred to as the "front-rear direction X". The direction in the front-rear direction X from the processing area 20 toward the indexing unit 10 is referred to as the "front". The direction opposite to the front is referred to as the "rear". The horizontal direction orthogonal to the front-rear direction X is referred to as the "width direction Y". One direction of the "width direction Y" is appropriately referred to as the "right". The direction opposite to the right is referred to as the "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". When there is no special distinction between "front", "rear", "right" and "left", it is referred to as "side". In each figure, front, rear, right, left, up and down are appropriately indicated for reference.

[0102] The indexing unit 10 includes multiple (e.g., four) carrier placement units 11. The carrier placement units 11 are arranged along the width direction Y. Each carrier placement unit 11 holds one carrier C. The carrier C houses multiple wafer substrates W. When the substrates W are housed in the carrier C, the substrates W are in a horizontal position. The carrier C is, for example, a front-opening unified pod (FOUP).

[0103] The indexing unit 10 includes a transport space 12. The transport space 12 is located behind the carrier mounting unit 11. The transport space 12 extends along the width direction Y.

[0104] The indexing unit 10 includes a conveying mechanism 13. The conveying mechanism 13 is disposed in the conveying space 12. The conveying mechanism 13 is located behind the carrier placement unit 11. The conveying mechanism 13 conveys the substrate W. When the substrate W is supported by the conveying mechanism 13, the substrate W is in a horizontal position. The conveying mechanism 13 can access the carrier C placed in the carrier placement unit 11.

[0105] The processing area 20 includes a transport space 22. The transport space 22 extends in the front-to-back direction X. The front part of the transport space 22 is connected to the transport space 12 of the indexing unit 10. The transport space 22 extends rearward from the transport space 12. The transport space 22 is located at the center of the processing area 20 in the width direction Y.

[0106] Reference Figure 1 , 5 . Figure 5 This is a left-side view showing the configuration of the central portion of the substrate processing apparatus 1 in the width direction Y. The processing area 20 is equipped with a conveying mechanism 23. The conveying mechanism 23 is provided in the conveying space 22. The conveying mechanism 23 conveys the substrate W. When the substrate W is supported by the conveying mechanism 23, the substrate W is in a horizontal position.

[0107] The processing area 20 has multiple (e.g., two) reversing units 24. The reversing units 24 are disposed in the transport space 22. The reversing units 24 are arranged at the front of the transport space 22. The reversing units 24 are arranged in front of the transport mechanism 23. Each reversing unit 24 reverses the substrate W.

[0108] Each inversion unit 24 has a substantially identical structure. Specifically, each inversion unit 24 includes a support portion 25. The support portion 25 supports the substrate W. When the substrate W is supported by the support portion 25, the substrate W is in a horizontal position.

[0109] Each reversing unit 24 includes a reversing mechanism 26. The reversing mechanism 26 removes the substrate W from the support portion 25. The reversing mechanism 26 reverses the substrate W. The reversing mechanism 26 rotates the substrate W about a horizontal axis of rotation A. The reversing mechanism 26 delivers the substrate W to the support portion 25.

[0110] When each reversing unit 24 is distinguished, they are referred to as reversing units 24a and 24b. The support portion 25, reversing mechanism 26, and rotation axis A of reversing unit 24a are appropriately referred to as support portion 25a, reversing mechanism 26a, and rotation axis Aa. The support portion 25, reversing mechanism 26, and rotation axis A of reversing unit 24b are appropriately referred to as support portion 25b, reversing mechanism 26b, and rotation axis Ab.

[0111] Reference Figure 5 The processing area 20 includes multiple (e.g., two) substrate mounting sections 27. The substrate mounting sections 27 are disposed in the transport space 22. The substrate mounting sections 27 are located at the front of the transport space 22. The substrate mounting sections 27 are located in front of the transport mechanism 23. The substrate mounting sections 27 are located below the reversing unit 24. The substrate mounting sections 27 hold one or more substrates W. When a substrate W is placed in the substrate mounting section 27, the substrate W is in a horizontal position.

[0112] When each substrate mounting portion 27 is distinguished, they are referred to as substrate mounting portions 27a and 27b.

[0113] Figure 6 (a) is a front view of the substrate mounting portion 27. Figure 6 (b) is a top view of the substrate mounting section 27. The substrate mounting section 27 includes a wall 31 and a plurality of (e.g., two) shelves 32. The shelves 32 are supported on the wall 31. The plurality of shelves 32 are arranged in a vertical Z-direction. Each shelf 32 supports one substrate W in a horizontal position.

[0114] Each shelf 32 includes a first shelf 33 and a second shelf 34. The first shelf 33 and the second shelf 34 are positioned at the same height. The first shelf 33 and the second shelf 34 are arranged along the width direction Y. The first shelf 33 and the second shelf 34 extend in a horizontal direction (e.g., the front-to-back direction X). The first shelf 33 contacts a first side of the substrate W. The second shelf 34 contacts a second side of the substrate W.

[0115] The support plate 32 then adjusts the position of the substrate W in the horizontal direction. Specifically, the first support plate 33 has a first inclined surface 33a. The second support plate 34 has a second inclined surface 34a. The first inclined surface 33a and the second inclined surface 34a respectively contact the end edge of the substrate W. For example, the first inclined surface 33a and the second inclined surface 34a are inclined downwards and inwards in the radial direction of the substrate W supported on the support plate 32. For example, the distance between the first inclined surface 33a and the second inclined surface 34a in the horizontal direction decreases downwards. The first inclined surface 33a and the second inclined surface 34a guide the substrate W to a predetermined position.

[0116] Reference Figure 1The processing area 20 has multiple processing units 28. Each processing unit 28 is adjacent to the transport space 22. Some of the processing units 28 are located on the right side of the transport space 22. The other processing units 28 are located on the left side of the transport space 22.

[0117] Figure 7 This is a left-side view showing the configuration of the left side of the substrate processing apparatus 1. Figure 7 This indicates the processing unit 28 located on the left side of the transport space 22. Multiple processing units 28 are arranged along the front-to-back direction X and the vertical direction Z. For example, six processing units 28 are arranged in two rows in the front-to-back direction X and in three segments in the vertical direction Z. Although not shown in the figure, the processing units 28 located on the right side of the transport space 22 are arranged in the same manner as those located on the left side of the transport space 22.

[0118] Each processing unit 28 processes the substrate W. The processing performed by each processing unit 28 may be, for example, cleaning or adhesive removal. Each processing unit 28 processes one substrate W at a time. Each processing unit 28 processes the upper surface WT of the substrate W.

[0119] The processing unit 28 includes a substrate holding section 36 and a rotation drive section 37. The substrate holding section 36 holds a substrate W. When the substrate holding section 36 holds the substrate W, the substrate W is in a horizontal position. The rotation drive section 37 is connected to the substrate holding section 36. The rotation drive section 37 rotates the substrate holding section 36. Therefore, the substrate W held in the substrate holding section 36 rotates integrally with the substrate holding section 36. The substrate W held in the substrate holding section 36 rotates about a rotation axis parallel to the vertical direction Z.

[0120] Reference Figure 1 The processing unit 28 includes a nozzle 38. The nozzle 38 sprays processing liquid onto the substrate W. The nozzle 38 sprays processing liquid onto the upper surface WT. The nozzle 38 is configured to be movable to a processing position and a retracted position. Figure 1 The nozzle 38, located at the processing position, is indicated by a solid line in the center. Figure 1 The nozzle 38, located in the retreat position, is indicated by a dashed line. Figure 1 This refers to a substrate W held in a substrate holding section 36. The processing position is the position above the substrate W held in the substrate holding section 36. When the nozzle 38 is in the processing position, the nozzle 38 overlaps with the substrate W held in the substrate holding section 36 when viewed from above. When the nozzle 38 is in the retracted position, the nozzle 38 does not overlap with the substrate W held in the substrate holding section 36 when viewed from above.

[0121] The processing unit 28 includes a protective cover 39. The protective cover 39 is arranged to surround the side of the substrate holding portion 36. The protective cover 39 receives the processing liquid.

[0122] The conveying mechanism 23 can access the reversing unit 24. The conveying mechanism 23 can access the support part 25. The conveying mechanism 23 can access the substrate mounting part 27. The conveying mechanism 23 can access the shelf 32. The conveying mechanism 23 can access the processing unit 28. The conveying mechanism 23 can access the substrate holding part 36.

[0123] The transfer mechanism 13 of the indexer section 10 can access the substrate placement section 27. However, the transfer mechanism 13 does not access the reversing unit 24.

[0124] The substrate processing apparatus 1 includes a control unit 29. The control unit 29 is provided, for example, in the indexer unit 10.

[0125] Figure 8 This is a diagram of the control area of ​​the substrate processing apparatus 1. The control unit 29 controls the conveying mechanisms 13 and 23, the reversing unit 24, and the processing unit 28. The control unit 29 is communicatively connected to the conveying mechanisms 13 and 23, the reversing unit 24, and the processing unit 28.

[0126] The control unit 29 is implemented through a central processing unit (CPU) that performs various processes, random-access memory (RAM) that serves as the working area for the processing, and storage media such as a fixed disk. Various types of information are pre-stored in the storage media. The information stored in the storage media includes, for example, information related to the operating conditions of the conveying mechanisms 13 and 23, the reversing unit 24, and the processing unit 28. The information stored in the storage media also includes, for example, information used to identify each substrate W.

[0127] Reference Figure 9 An example of the operation of the substrate processing apparatus 1 will be explained. Figure 9 This schematically illustrates the sequence of transporting one substrate W. Figure 9 The elements of the substrate processing apparatus 1 through which the substrate passes are schematically shown.

[0128] In this example of operation, each element of the substrate processing apparatus 1 operates under the control of the control unit 29. Within the carrier C on the carrier placement unit 11, the first surface W1 is located on the back surface WB. To briefly describe this example of operation, the substrate processing apparatus 1 processes the first surface W1. This example of operation will be explained below.

[0129] The carrier C containing the substrate W is placed on the carrier placement section 11 (step S1). The transfer mechanism 13 removes the substrate W from the carrier C on the carrier placement section 11 (step S2). The transfer mechanism 13 transfers the substrate W to the substrate placement section 27a (step S3). The transfer mechanism 13 places the substrate W on the shelf 32 of the substrate placement section 27a. The shelf 32 of the substrate placement section 27a adjusts the position of the substrate W in the horizontal direction. The transfer mechanism 23 receives the substrate W from the substrate placement section 27a (step S4). The transfer mechanism 23 removes the substrate W from the shelf 32 of the substrate placement section 27a. The transfer mechanism 23 transfers the substrate W to the reversing unit 24a. The transfer mechanism 23 transfers the substrate W to the support section 25a (step S5). The transfer mechanism 23 delivers the substrate W to the support section 25a. The support section 25a supports the substrate W. The reversing mechanism 26a receives the substrate W from the support portion 25a (step S6). From the time the carrier C is placed on the carrier placement portion 11 until the reversing mechanism 26a receives the substrate W from the support portion 25a, the first surface W1 is located on the back surface WB.

[0130] The reversing mechanism 26a reverses the substrate W around the rotation axis Aa. The first surface W1 changes from the back surface WB to the top surface WT.

[0131] The reversing mechanism 26a delivers the substrate W to the support portion 25a (step S7). The support portion 25a supports the substrate W. The conveying mechanism 23 receives the substrate W from the support portion 25a (step S8). The conveying mechanism 23 removes the substrate W from the reversing unit 24a. The conveying mechanism 23 conveys the substrate W to the processing unit 28 (step S9). The conveying mechanism 23 places the substrate W on the substrate holding portion 36. The processing unit 28 processes the substrate W. Specifically, the processing unit 28 rotates the substrate W held in the substrate holding portion 36 while supplying processing liquid to the upper surface WT of the substrate W held in the substrate holding portion 36. The conveying mechanism 23 removes the substrate W from the substrate holding portion 36 (step S10). The conveying mechanism 23 removes the substrate W from the processing unit 28. The conveying mechanism 23 conveys the substrate W to the reversing unit 24b. The conveying mechanism 23 conveys the substrate W to the support portion 25b (step S11). The conveying mechanism 23 delivers the substrate W to the support part 25b. The support part 25b supports the substrate W. The reversing mechanism 26b receives the substrate W from the support part 25b (step S12). From the time the reversing mechanism 26a delivers the substrate W to the support part 25a until the reversing mechanism 26b receives the substrate W from the support part 25b, the first surface W1 of the substrate W is located on the upper surface WT.

[0132] The reversing mechanism 26b reverses the substrate W around the rotation axis Ab. The first surface W1 of the substrate W changes from the top surface WT to the back surface WB.

[0133] The reversing mechanism 26b delivers the substrate W to the support section 25b (step S13). The support section 25b supports the substrate W. The conveying mechanism 23 receives the substrate W from the support section 25b (step S14). The conveying mechanism 23 removes the substrate W from the reversing unit 24b. The conveying mechanism 23 delivers the substrate W to the substrate placement section 27b (step S15). The conveying mechanism 23 places the substrate W on the shelf 32 of the substrate placement section 27b. The shelf 32 of the substrate placement section 27b adjusts the position of the substrate W in the horizontal direction. The conveying mechanism 13 receives the substrate W from the substrate placement section 27b (step S16). The conveying mechanism 13 removes the substrate W from the shelf 32 of the substrate placement section 27b. The conveying mechanism 13 moves the substrate W into the carrier C on the carrier placement section 11 (step S17). From the moment the reversing mechanism 26b delivers the substrate W to the support part 25b until the conveying mechanism 13 moves the substrate W into the carrier C, the first side W1 of the substrate W is located on the back side WB.

[0134] The structure of the substrate processing apparatus 1 will be described in more detail.

[0135] <Indexer Section 10>

[0136] The structure of the conveying mechanism 13 will be explained.

[0137] Reference Figure 1 The conveying mechanism 13 has a hand 14. The hand 14 has a roughly U-shaped form when viewed from above. The hand 14 supports a substrate W in a horizontal position.

[0138] Figure 5 This indicates that the hand 14 supports the substrate W. The hand 14 is located below the substrate W. The hand 14 is in contact with the substrate W. The hand 14 does not attract the substrate W.

[0139] The conveying mechanism 13 includes a hand drive unit 15. The hand drive unit 15 is connected to a hand 14. The hand drive unit 15 moves the hand 14. The hand drive unit 15 moves the hand 14 to the carrier C on the carrier placement unit 11. The hand drive unit 15 moves the hand 14 to the substrate placement unit 27.

[0140] The structure of the hand drive unit 15 is illustrated. The hand drive unit 15 includes a track 15a, a horizontal moving part 15b, a vertical moving part 15c, a rotating part 15d, and a forward / backward moving part 15e. The track 15a is fixedly provided. The track 15a is disposed at the bottom of the transport space 12. The track 15a extends along the width direction Y. The horizontal moving part 15b is supported on the track 15a. The horizontal moving part 15b moves relative to the track 15a in the width direction Y. The vertical moving part 15c is supported on the horizontal moving part 15b. The vertical moving part 15c moves relative to the horizontal moving part 15b in the vertical direction Z. The rotating part 15d is supported on the vertical moving part 15c. The rotating part 15d rotates relative to the vertical moving part 15c. The rotating part 15d rotates about a rotation axis passing through the rotating part 15d and parallel to the vertical direction Z. The forward / backward moving part 15e moves relative to the rotating part 15d in the horizontal direction. The retractable movement unit 15e moves back and forth in a horizontal direction determined by the direction of the rotating unit 15d. The retractable movement unit 15e supports the hand 14. The hand 14 is fixed to the retractable movement unit 15e.

[0141] Because the hand drive unit 15 has the above-described structure, the hand 14 can move parallel to the vertical direction Z. The hand 14 can move parallel to the horizontal direction in any direction. The hand 14 can rotate in the horizontal plane.

[0142] Reference Figure 8 The control unit 29 controls the hand drive unit 15 of the conveying mechanism 13. The control unit 29 and the hand drive unit 15 are communicatively connected.

[0143] <Processing Area 20>

[0144] The construction of the conveying mechanism 23 and the reversing unit 24 will be explained.

[0145] <<Transportation Agency 23>>

[0146] Reference Figure 1 , 5 The conveying mechanism 23 has a hand 41. The hand 41 holds a substrate W in a horizontal position.

[0147] The hand 41 has a first suction part 42. The first suction part 42 attracts the substrate W. The hand 41 is called a Bernoulli chuck or Bernoulli gripper.

[0148] Figure 5 This indicates the substrate W attracted by the first attracting part 42. The first attracting part 42 is located above the substrate W. The first attracting part 42 attracts the substrate W upwards.

[0149] More specifically, when the first suction part 42 attracts the substrate W, it blows gas towards the substrate W from above. The first suction part 42 causes the gas to flow along the upper surface WT. As the gas flows along the upper surface WT, the air pressure on the upper surface WT becomes lower than the air pressure on the back surface WB. That is, as the gas flows along the upper surface WT, a negative pressure is formed near the upper surface WT. According to Bernoulli's principle, an upward force is exerted on the substrate W. Therefore, the substrate W is attracted upward. The substrate W is attracted toward the first suction part 42. However, the first suction part 42 does not contact the substrate W attracted by the first suction part 42. The first suction part 42 is separated from the upper surface WT by a small gap. Thus, the first suction part 42 attracts the substrate W without contacting it.

[0150] Reference Figure 1 , 5 The conveying mechanism 23 includes a hand drive unit 45. The hand drive unit 45 is connected to the hand 41. The hand drive unit 45 moves the hand 41. That is, the hand drive unit 45 moves the first suction unit 42. The hand drive unit 45 moves the hand 41 to the reversing unit 24, the substrate placement unit 27, and the processing unit 28.

[0151] The structure of the hand drive unit 45 is illustrated. The hand drive unit 45 includes a support column 45a, a vertical moving part 45b, a rotating part 45c, and a forward / backward moving part 45d. The support column 45a is fixedly provided. The support column 45a extends in the vertical direction Z. The vertical moving part 45b is supported on the support column 45a. The vertical moving part 45b moves relative to the support column 45a in the vertical direction Z. The rotating part 45c is supported on the vertical moving part 45b. The rotating part 45c rotates relative to the vertical moving part 45b. The rotating part 45c rotates about a rotation axis that passes through the rotating part 45c and is parallel to the vertical direction Z. The forward / backward moving part 45d moves relative to the rotating part 45c in the horizontal direction. The forward / backward moving part 45d moves back and forth in a horizontal direction determined by the direction of the rotating part 45c. The forward / backward moving part 45d supports the hand 41.

[0152] Because the hand drive unit 45 has the above-described structure, the hand 41 can move parallel to the vertical direction Z. The hand 41 can move parallel to the horizontal direction in any direction. The hand 41 can rotate in the horizontal plane.

[0153] The hand drive unit 45 is an example of a conveying drive unit in this invention. The conveying mechanism 23 is an example of a conveying mechanism in this invention.

[0154] Figure 10 This is a bottom view of the hand (41). Figure 11 of (a), Figure 11 (b) Figure 11 (c) are side views of the hand 41. The structure of the hand 41 will be explained.

[0155] The hand part 41 has a connecting part 46. The connecting part 46 is fixed to the forward and backward moving part 45d.

[0156] The hand part 41 has an attraction and holding part 47. The attraction and holding part 47 is fixed to the connecting part 46. The attraction and holding part 47 extends horizontally from the connecting part 46. The attraction and holding part 47 holds the first attraction part 42.

[0157] The attraction and retention section 47 has, for example, two branches 47A and 47B. The branches 47A and 47B are arranged at approximately the same height.

[0158] The first suction section 42 has a plurality of (e.g., 6) suction pads 43. For example, 3 suction pads 43 are installed in branch section 47A. The other 3 suction pads 43 are installed in branch section 47B.

[0159] Each attraction pad 43 is distributed and dispersed throughout the substrate W attracted by the first attraction part 42 when viewed from above. Figure 10 The substrate W attracted by the first attraction part 42 is indicated by a dashed line. Figure 11 (a) shows the substrate W attracted by the first attraction part 42 in solid line.

[0160] Each suction pad 43 blows gas. The suction pad 43 is cylindrical in shape with a central axis parallel to the vertical direction Z. The suction pad 43 has a lower portion that opens downwards. Gas is blown downwards from the lower portion of the suction pad 43. When the suction pad 43 blows gas, it may also form a swirling flow. The suction pad 43 may also release the swirling flow to its lower portion. Here, the swirling flow is, for example, an airflow circulating inside the suction pad 43 around its central axis.

[0161] The conveying mechanism 23 includes a gas supply passage 48. The gas supply passage 48 is connected to the first suction unit 42. The gas supply passage 48 is also connected to each suction pad 43. The gas supply passage 48 supplies gas to the first suction unit 42. The first suction unit 42 blows out the gas supplied from the gas supply passage 48. The gas supplied to the first suction unit 42 is, for example, nitrogen or air. The gas supplied to the first suction unit 42 is, for example, high-pressure gas or compressed gas.

[0162] The conveying mechanism 23 includes a suction adjustment unit 49. The suction adjustment unit 49 is provided on the gas supply passage 48. The suction adjustment unit 49 opens and closes the gas supply passage 48. When the suction adjustment unit 49 opens the gas supply passage 48, the gas supply passage 48 supplies gas to the first suction unit 42. When the suction adjustment unit 49 closes the gas supply passage 48, the gas supply passage 48 does not supply gas to the first suction unit 42. Furthermore, the suction adjustment unit 49 can also change the flow rate of the gas supplied by the gas supply passage 48 to the first suction unit 42. For example, the suction adjustment unit 49 can also adjust the cross-sectional area of ​​the flow path of the gas supply passage 48. The suction adjustment unit 49 may include, for example, one or more valves. The suction adjustment unit 49 may include, for example, at least one of an on / off valve and a flow regulating valve.

[0163] The hand portion 41 includes a contact portion 51. The contact portion 51 is fixed to the suction holding portion 47. Viewed from above, the contact portion 51 is positioned overlapping the substrate W attracted by the first suction portion 42. The contact portion 51 is positioned below the first suction portion 42. When the first suction portion 42 attracts the substrate W, the contact portion 51 contacts the upper surface WT of the substrate W. By contacting the upper surface WT, the contact portion 51 suppresses horizontal movement of the substrate W relative to the first suction portion 42. That is, when the first suction portion 42 attracts the substrate W, the contact portion 51 holds the substrate W in an appropriate position relative to the first suction portion 42.

[0164] The hand portion 41 includes wall portions 52 and 53. Wall portions 52 and 53 are fixed to the attraction and holding portion 47. Viewed from above, wall portions 52 and 53 are disposed radially outside the substrate W attracted by the first attraction portion 42. Wall portions 52 and 53 are positioned at approximately the same height as the substrate W attracted by the first attraction portion 42. Wall portions 52 and 53 extend in the vertical direction Z. Wall portions 52 and 53 extend downward from the attraction and holding portion 47. When the substrate W is in an appropriate position relative to the first attraction portion 42, wall portions 52 and 53 do not contact the substrate W. When the substrate W moves excessively in the horizontal direction relative to the first attraction portion 42, wall portions 52 and 53 contact the edge of the substrate W. Therefore, wall portions 52 and 53 limit excessive horizontal displacement of the substrate W relative to the first attraction portion 42.

[0165] The hand part 41 has a receiving part 54. The receiving part 54 is positioned at a lower position than the substrate W attracted by the first attracting part 42.

[0166] The receiving part 54 is positioned to prevent it from falling off. Figure 11 (a) and (b) of 11 indicate the receiving part 54 located in the anti-detachment position.

[0167] When the receiving portion 54 is in the anti-drop position, it overlaps with the substrate W attracted by the first attraction portion 42 when viewed from above. For example, when the receiving portion 54 is in the anti-drop position, it overlaps with the periphery of the substrate W attracted by the first attraction portion 42 when viewed from above. When the receiving portion 54 is in the anti-drop position, it can receive the substrate W. When the receiving portion 54 is in the anti-drop position, it prevents the substrate W from falling off the hand portion 41.

[0168] Figure 11 (b) indicates the substrate W received by the receiving part 54. When the receiving part 54 receives the substrate W, the substrate W is in a horizontal position.

[0169] When the receiving portion 54 receives the substrate W, the receiving portion 54 contacts at least one of the back surface WB of the substrate W and the end edge of the substrate W. When the receiving portion 54 receives the substrate W, the receiving portion 54 allows the substrate W to move upward relative to the receiving portion 54.

[0170] The receiving part 54 can be moved to a retracted position. Figure 11 (c) indicates the receiving part 54 located in the retreat position.

[0171] When the receiving portion 54 is in the retracted position, the substrate W can move in the vertical direction Z through the receiving portion 54. Therefore, the substrate W can be easily moved between a position above and below the receiving portion 54 below the first attracting portion 42. Figure 11 (c) indicates the substrate W located below the first attracting part 42 and above the receiving part 54, indicated by a solid line. Figure 11 (c) is indicated by a dashed line, showing the substrate W located below the first attracting portion 42 and below the receiving portion 54. Therefore, when the receiving portion 54 is in the retracted position, the first attracting portion 42 can be easily brought close to the substrate W, and the first attracting portion 42 can be easily moved away from the substrate W.

[0172] The configuration of the receiving portion 54 will be described. The receiving portion 54 includes a first receiving portion 55 and a second receiving portion 56. The first receiving portion 55 and the second receiving portion 56 are respectively disposed at a position lower than the substrate W attracted by the first attracting portion 42. The first receiving portion 55 and the second receiving portion 56 are disposed at approximately the same height. The first receiving portion 55 and the second receiving portion 56 are disposed at a distance from each other in the horizontal direction. The first receiving portion 55 and the second receiving portion 56 can approach each other in the horizontal direction and can also move away from each other in the horizontal direction. When the receiving portion 54 moves from the retracted position to the anti-drop position, the first receiving portion 55 and the second receiving portion 56 approach each other, and the distance between the first receiving portion 55 and the second receiving portion 56 in the horizontal direction decreases. When the second receiving part 56 moves from the anti-detachment position to the retraction position, the first receiving part 55 and the second receiving part 56 move away from each other, and the distance between the first receiving part 55 and the second receiving part 56 in the horizontal direction increases.

[0173] In this embodiment, the first receiving portion 55 is fixed to the attraction holding portion 47. Specifically, the first receiving portion 55 is fixed to the lower part of the wall portion 52. The first receiving portion 55 extends from the wall portion 52 toward the inner side of the substrate W attracted by the first attraction portion 42 in the radial direction. The second receiving portion 56 is movable in the horizontal direction relative to the attraction holding portion 47. Figure 10 The second receiving part 56 is indicated by a solid line when the receiving part 54 is in the retreat position. Figure 10 The second receiving part 56 is indicated by a dashed line when the receiving part 54 is in the anti-detachment position.

[0174] The hand part 41 includes a support rod 57 and a receiving part drive part 58. The support rod 57 supports a second receiving part 56. The second receiving part 56 is fixed to the support rod 57. The second receiving part 56 extends from the support rod 57 in the radial direction inward toward the substrate W attracted by the first attraction part 42. The receiving part drive part 58 is connected to the support rod 57. The receiving part drive part 58 is supported by the connecting part 46 or the attraction holding part 47. The receiving part drive part 58 moves the support rod 57 relative to the attraction holding part 47. The receiving part drive part 58 moves the support rod 57 in the horizontal direction. The second receiving part 56 moves integrally with the support rod 57. When the support rod 57 moves relative to the attraction holding part 47, the second receiving part 56 moves relative to the first receiving part 55. Thus, the receiving part drive part 58 moves the second receiving part 56 relative to the first receiving part 55. The receiving part drive unit 58 moves the receiving part 54 to the anti-drop position and the retraction position. The receiving part drive unit 58 is, for example, at least one of a cylinder and an electric motor.

[0175] The support rod 57 is positioned at approximately the same height as the walls 52 and 53. That is, the support rod 57 is positioned at approximately the same height as the substrate W attracted by the first attraction part 42. The support rod 57 extends in the vertical direction Z. The support rod 57 has the same function as the walls 52 and 53. The support rod 57 restricts excessive horizontal displacement of the substrate W relative to the first attraction part 42.

[0176] <<Reversal Unit 24>>

[0177] Figure 12 This is a side view of the reversing unit 24. The reversing unit 24 includes a frame 61. The frame 61 has a generally box-shaped shape. The frame 61 has a substrate transfer port 62. The substrate transfer port 62 is formed on the rear wall of the frame 61. The substrate W can pass through the substrate transfer port 62. The substrate W can move between the outside and the inside of the frame 61 through the substrate transfer port 62. The hand 41 of the transfer mechanism 23 can also pass through the substrate transfer port 62. It should be noted that the frame 61 does not have a substrate transfer port formed on the front wall of the frame 61. Therefore, the transfer mechanism 13 cannot access the reversing unit 24.

[0178] The support portion 25 of the reversing unit 24 is disposed inside the frame 61. When the support portion 25 supports the substrate W, the support portion 25 contacts the substrate W.

[0179] The support portion 25 supports the substrate W from below. When the support portion 25 supports the substrate W, the support portion 25 is located below the substrate W. The support portion 25 is in contact with at least one of the back surface WB of the substrate W and the end edge of the substrate W. When the support portion 25 supports the substrate W, the support portion 25 allows the substrate W to move upward relative to the support portion 25. The support portion 25 does not attract the substrate W.

[0180] Reference Figure 12 , 13 14. Figure 13 This is a top view of part of the inverted unit 24. Figure 14 This is a front view of a portion of the reversing unit 24. The support portion 25 has a plurality of (e.g., 6) support pins 63. Each support pin 63 is sufficiently smaller than the substrate W in plan view. Each support pin 63 is positioned at the same height. In plan view, each support pin 63 is arranged on the end edge of the substrate W supported by the support portion 25. Each support pin 63 is in contact with the substrate W.

[0181] More specifically, each support pin 63 has a shaft portion 64 and a position adjustment portion 65. The shaft portion 64 has an elongated rod shape. The shaft portion 64 extends in the vertical direction Z. The position adjustment portion 65 is connected to the upper end of the shaft portion 64. The position adjustment portion 65 protrudes upward from the shaft portion 64. The position adjustment portion 65 contacts the substrate W.

[0182] Reference Figure 14The position adjustment unit 65 then adjusts the position of the substrate W in the horizontal direction. Specifically, the position adjustment unit 65 has an inclined surface 65a. The inclined surface 65a contacts the end edge of the substrate W. The inclined surface 65a is inclined downwards and inwards in the radial direction of the substrate W supported on the support unit 25. In other words, the inclined surface 65a is inclined upwards and outwards in the radial direction of the substrate W supported on the support unit 25. The inclined surface 65a guides the substrate W to a predetermined position.

[0183] Figure 14 The center J of the substrate W, supported by the support portion 25, is shown. Furthermore, Figure 14 The central axis K is shown. The central axis K is an imaginary line passing through center J and parallel to the vertical direction Z. The radial direction corresponds to a direction orthogonal to the central axis K. The inner side of the radial direction is the direction closer to the central axis K in the radial direction. In other words, the inner side of the radial direction is the direction closer to center J in the radial direction of the substrate W. The outer side of the radial direction is the direction away from the central axis K in the radial direction. In other words, the outer side of the radial direction is the direction away from center J in the radial direction of the substrate W.

[0184] Reference Figure 12 The reversing unit 24 includes a lifting base 66 and a lifting drive unit 67. The lifting base 66 is positioned below the support portion 25. The lifting base 66 supports the support portion 25. The lifting base 66 is connected to the lower part of the support portion 25. The lifting drive unit 67 is connected to the lifting base 66. The lifting drive unit 67 is supported on the frame 61. The lifting drive unit 67 moves the lifting base 66 relative to the frame 61. The lifting drive unit 67 moves the lifting base 66 in the vertical direction Z. When the lifting base 66 moves, the support portion 25 moves integrally with the lifting base 66. Therefore, the support portion 25 moves relative to the frame 61. The support portion 25 moves in the vertical direction Z. The lifting drive unit 67 may include a cylinder, for example.

[0185] The lifting drive unit 67 moves the support unit 25 to the first support position PH and the second support position PL. Figure 12 , 14 The solid line represents the support portion 25 located at the first support position PH. Figure 12 , 14 The support portion 25 located at the second support position PL is indicated by a dashed line. The second support position PL is lower than the first support position PH. Specifically, the support portion 25 located at the second support position PL is positioned lower than the support portion 25 located at the first support position PH.

[0186] Reference Figure 13The second support position PL, viewed from above, is at the same position as the first support position PH. Specifically, the support portion 25 located at the second support position PL is positioned at the same location as the support portion 25 located at the first support position PH, viewed from above. It should be noted that... Figure 13 The illustration of the lifting base 66 is omitted.

[0187] The lifting drive unit 67 keeps the support part 25 stationary at the first support position PH and the second support position PL. The lifting drive unit 67 does not keep the support part 25 stationary at any position other than the first support position PH and the second support position PL. The lifting drive unit 67 does not move the support part 25 to a position higher than the first support position PH. The lifting drive unit 67 does not move the support part 25 to a position lower than the second support position PL.

[0188] Reference Figure 12 The reversing unit 24 includes a substrate detection unit 69. The substrate detection unit 69 is supported on the frame 61. The substrate detection unit 69 detects the substrate W. For example, the substrate detection unit 69 detects whether the substrate W is supported on the support portion 25. For example, the substrate detection unit 69 detects the position of the substrate W.

[0189] The reversing mechanism 26 of the reversing unit 24 has a hand 71. The hand 71 holds a substrate W. The hand 71 is located inside the frame 61.

[0190] The hand 71 has a second suction part 72. The second suction part 72 has a structure that is substantially the same as that of the first suction part 42. The second suction part 72 attracts the substrate W. The hand 71 is called a Bernoulli chuck or Bernoulli gripper.

[0191] The second attracting portion 72 attracts either the first surface W1 or the second surface W2 of the substrate W. For example, when the second attracting portion 72 attracts the first surface W1 of the substrate W, the second attracting portion 72 is positioned facing the first surface W1 and blows gas towards the first surface W1. The second attracting portion 72 causes the gas to flow along the first surface W1. As the gas flows along the first surface W1, the air pressure on the first surface W1 becomes lower than the air pressure on the second surface W2. That is, as the gas flows along the first surface W1, a negative pressure is formed near the first surface W1. According to Bernoulli's principle, a force is applied to the substrate W towards the second attracting portion 72. Therefore, the substrate W is attracted towards the second attracting portion 72. However, the second attracting portion 72 does not contact the substrate W attracted by the second attracting portion 72. The second attracting portion 72 and the substrate W are separated by a small gap. Thus, the second attracting portion 72 attracts the substrate W without contacting it.

[0192] The hand part 71 has an attraction and retention part 74. The attraction and retention part 74 retains the second attraction part 72.

[0193] Reference Figure 13The suction and holding section 74 includes a first branch 74A and a second branch 74B. The first branch 74A and the second branch 74B are arranged at a distance from each other.

[0194] The second suction section 72 includes a third suction section 72A and a fourth suction section 72B. The third suction section 72A is held in the first branch section 74A. The fourth suction section 72B is held in the second branch section 74B.

[0195] The third suction section 72A includes a plurality of (e.g., three) suction pads 73A. Suction pads 73A are mounted on the first branch section 74A. The fourth suction section 72B includes a plurality of (e.g., three) suction pads 73B. Suction pads 73B are mounted on the second branch section 74B. Suction pads 73A and 73B have a construction substantially the same as that of suction pad 43. When not distinguishing between suction pads 73A and 73B, they are appropriately referred to as suction pads 73.

[0196] The reversing mechanism 26 includes a gas supply path 75. The gas supply path 75 functions similarly to the gas supply path 48. The gas supply path 75 is connected to the second suction unit 72. The gas supply path 75 is also connected to the third suction unit 72A and the fourth suction unit 72B. The gas supply path 75 is connected to each suction pad 73. The gas supply path 75 supplies gas to the second suction unit 72. The second suction unit 72 blows out the gas supplied from the gas supply path 75. The gas supplied to the second suction unit 72 is, for example, nitrogen or air. The gas supplied to the second suction unit 72 is, for example, high-pressure gas or compressed gas.

[0197] The reversing mechanism 26 includes a suction adjustment section 76. The suction adjustment section 76 has a function similar to that of the suction adjustment section 49. The suction adjustment section 76 is provided on the gas supply passage 75. The suction adjustment section 76 opens and closes the gas supply passage 75. When the suction adjustment section 76 opens the gas supply passage 75, the gas supply passage 75 supplies gas to the second suction section 72. When the suction adjustment section 76 closes the gas supply passage 75, the gas supply passage 75 does not supply gas to the second suction section 72. Furthermore, the suction adjustment section 76 can also change the flow rate of the gas supplied by the gas supply passage 75 to the second suction section 72. For example, the suction adjustment section 76 can also adjust the cross-sectional area of ​​the flow path of the gas supply passage 75. The suction adjustment section 76 may include, for example, one or more valves. The suction adjustment section 76 may include, for example, at least one of an on / off valve and a flow regulating valve.

[0198] Reference Figure 12The hand portion 71 has a contact portion 77. The contact portion 77 has a similar function to the contact portion 51. The contact portion 77 is fixed to the suction holding portion 74. When the second suction portion 72 attracts the substrate W, the contact portion 77 contacts the substrate W. By contacting the substrate W with the contact portion 77, the contact portion 77 prevents the substrate W from shifting relative to the second suction portion 72. When the second suction portion 72 attracts the substrate W, the contact portion 77 holds the substrate W in an appropriate position relative to the second suction portion 72.

[0199] The hand portion 41 has a wall portion 78. The wall portion 78 has a similar function to the walls 52 and 53. The wall portion 78 is fixed to the attraction holding portion 74. The wall portion 78 restricts the substrate W from excessive offset relative to the second attraction portion 72.

[0200] The reversing mechanism 26 includes a hand drive unit 81. The hand drive unit 81 is connected to the hand 71. The hand drive unit 81 moves the hand 71.

[0201] Specifically, the hand drive unit 81 rotates the hand 71 about the rotation axis A. The hand drive unit 81 widens or narrows the gap between the first branch 74A and the second branch 74B. Therefore, the hand drive unit 81 rotates the second suction unit 72 about the rotation axis A. The hand drive unit 81 widens or narrows the gap between the third suction unit 72A and the fourth suction unit 72B.

[0202] The structure of the hand drive unit 81 is illustrated. The hand drive unit 81 includes a rotation drive unit 82, a rotation base 83, and a movement drive unit 84. The rotation drive unit 82 is supported on the frame 61. The rotation drive unit 82 is disposed on the front wall of the frame 61. The rotation drive unit 82 has a portion disposed on the outside of the frame 61 and a portion disposed on the inside of the frame 61. The rotation base 83 is connected to the rotation drive unit 82. The movement drive unit 84 is supported on the rotation base 83. The movement drive unit 84 is connected to the hand 71. The movement drive unit 84 is connected to the first branch 74A and the second branch 74B. The rotation base 83 and the movement drive unit 84 are disposed inside the frame 61.

[0203] The rotation drive unit 82 rotates the rotating base 83 relative to the frame 61. The rotation drive unit 82 rotates the rotating base 83 about the rotation axis A. When the rotating base 83 rotates, the movement drive unit 84 and the hand part 71 rotate integrally with the rotating base 83. Thus, the rotation drive unit 82 rotates the second suction part 72. The second suction part 72 rotates relative to the frame 61 via the rotation drive unit 82. The second suction part 72 rotates about the rotation axis A.

[0204] The movement drive unit 84 moves the first branch 74A relative to the rotating base 83. The movement drive unit 84 also moves the second branch 74B relative to the rotating base 83. Therefore, the movement drive unit 84 widens or narrows the gap between the first branch 74A and the second branch 74B.

[0205] The rotary drive unit 82, for example, includes a rotary actuator. The motion drive unit 84, for example, includes a cylinder. For example, the motion drive unit 84 may also include a first cylinder corresponding to the first branch 74A and a second cylinder corresponding to the second branch 74B. Alternatively, the motion drive unit 84 may also include a common cylinder corresponding to both the first branch 74A and the second branch 74B. Furthermore, the motion drive unit 84 may also include at least one of a first linkage mechanism and a second linkage mechanism. The first linkage mechanism connects the cylinder to the first branch 74A. The second linkage mechanism connects the cylinder to the second branch 74B.

[0206] The hand drive unit 81 moves the second suction unit 72 to the first position P1, the second position P2, and the third position P3. Figure 12 The second attraction part 72, located at position P1, is indicated by a solid line. Figure 12 The second attraction part 72, located at position P2, is indicated by a dashed line. Figure 13 The second attraction part 72, located at position P1, is indicated by a solid line. Figure 13 The second attraction part 72, located at position 3 P3, is indicated by a dashed line. Figure 14 The second attraction part 72, located at position P1, is indicated by a solid line. Figure 14 The second attraction part 72, located at position 2 P2 and position 3 P3, is indicated by a dashed line.

[0207] Reference Figure 12 The rotation drive unit 82 moves the second attraction part 72 to the first position P1 and the second position P2. Specifically, the rotation drive unit 82 rotates the second attraction part 72 about the rotation axis A, and the second attraction part 72 moves between the first position P1 and the second position P2. More specifically, the rotation drive unit 82 rotates the second attraction part 72 half a turn. The rotation drive unit 82 rotates the second attraction part 72 180 degrees. When the second attraction part 72 moves between the first position P1 and the second position P2, the movement drive unit 84 does not change the interval between the first branch 74A and the second branch 74B.

[0208] Here, the position of the rotation axis A relative to the frame 61 is fixed. The rotation axis A is horizontal. For example, the rotation axis A is parallel to the front-back direction X.

[0209] Reference Figure 13The movement drive unit 84 moves the second suction unit 72 to a first position P1 and a third position P3. Specifically, by changing the interval between the first branch 74A and the second branch 74B, the second suction unit 72 moves between the first position P1 and the third position P3. Specifically, by increasing the interval between the first branch 74A and the second branch 74B, the second suction unit 72 moves from the first position P1 to the third position P3. By decreasing the interval between the first branch 74A and the second branch 74B, the second suction unit 72 moves from the third position P3 to the first position P1. The interval between the first branch 74A and the second branch 74B when the second suction unit 72 is in the third position P3 is larger than the interval between the first branch 74A and the second branch 74B when the second suction unit 72 is in the first position P1. When the second attraction part 72 moves between the first position P1 and the third position P3, the rotation drive part 82 does not cause the second attraction part 72 to rotate around the rotation axis A.

[0210] It should be noted that when the second suction part 72 rotates around the rotation axis A, the interval between the first branch 74A and the second branch 74B remains fixed. The interval between the first branch 74A and the second branch 74B when the second suction part 72 rotates around the rotation axis A is equal to the interval between the first branch 74A and the second branch 74B when the second suction part 72 is in the first position P1. The interval between the first branch 74A and the second branch 74B when the second suction part 72 rotates around the rotation axis A is smaller than the interval between the first branch 74A and the second branch 74B when the second suction part 72 is in the third position P3.

[0211] The relationship between the rotation axis A and the first position P1, the second position P2, and the third position P3 is explained.

[0212] Reference Figure 12 The rotation axis A is lower than the first position P1. The rotation axis A is higher than the second position P2. The second position P2 is lower than the first position P1. Specifically, the rotation axis A is positioned lower than the second attraction part 72 located at the first position P1. The rotation axis A is positioned higher than the second attraction part 72 located at the second position P2. The second attraction part 72 located at the second position P2 is positioned lower than the second attraction part 72 located at the first position P1.

[0213] Reference Figure 14Position P3 is higher than the rotation axis A. The height of position P3 is approximately the same as that of position P1. Position P3 is higher than position P2. Specifically, the second suction part 72 located at position P3 is positioned higher than the rotation axis A. The second suction part 72 located at position P3 is positioned at approximately the same height as the second suction part 72 located at position P1. The second suction part 72 located at position P3 is positioned higher than the second suction part 72 located at position P2.

[0214] When the second suction part 72 is in the first position P1, it can blow gas downwards. When the second suction part 72 is in the first position P1, the third suction part 72A and the fourth suction part 72B are positioned at the same height. When the second suction part 72 is in the first position P1, the contact part 77 is positioned below the second suction part 72 (see reference). Figure 12 ).

[0215] When the second suction part 72 is in the second position P2, it can blow gas upwards. When the second suction part 72 is in the second position P2, the third suction part 72A and the fourth suction part 72B are positioned at the same height. When the second suction part 72 is in the second position P2, the contact part 77 is positioned above the second suction part 72 (see reference). Figure 12 ).

[0216] When the second suction part 72 is in the third position P3, the second suction part 72 can blow gas downwards. However, in this embodiment, when the second suction part 72 is in the third position P3, the second suction part 72 does not blow gas. When the second suction part 72 is in the third position P3, the third suction part 72A and the fourth suction part 72B are arranged at the same height.

[0217] Reference Figure 13 When the second suction part 72 is in the first position P1, the rotation axis A is positioned between the third suction part 72A and the fourth suction part 72B in a top view. When the second suction part 72 is in the first position P1, the third suction part 72A and the fourth suction part 72B are positioned in a position that is linearly symmetrical with respect to the rotation axis A in a top view.

[0218] Although the illustration is omitted, position P2 overlaps with position P1 in top view. Position P2 is positioned below position P1. Specifically, the second suction part 72 located in position P2 is positioned in the same location as the second suction part 72 located in position P1 in top view. The second suction part 72 located in position P2 is positioned below the second suction part 72 located in position P1. Therefore, when the second suction part 72 is in position P2, the rotation axis A is positioned between the third suction part 72A and the fourth suction part 72B in top view. When the second suction part 72 is in position P2, the third suction part 72A and the fourth suction part 72B are positioned in a position that is linearly symmetrical with respect to the rotation axis A in top view.

[0219] When the second attracting portion 72 is in the first position P1, it overlaps with the substrate W supported by the support portion 25 in a top view. When the second attracting portion 72 is in the first position P1, it is positioned radially inward of the substrate W supported by the support portion 25, relative to the support portion 25. When the second attracting portion 72 is in the first position P1, it is distributed throughout the entire substrate W attracted by it in a top view. When the second attracting portion 72 is in the first position P1, it may be positioned, for example, at the center of the substrate W supported by the support portion 25 in a top view. Similarly, when the second attracting portion 72 is in the second position P2, it overlaps with the substrate W supported by the support portion 25 in a top view. When the second attracting portion 72 is in the second position P2, in plan view, the second attracting portion 72 is disposed further in the radial direction inward than the supporting portion 25 on the substrate W supported by the supporting portion 25. When the second attracting portion 72 is in the second position P2, in plan view, the second attracting portion 72 is distributed throughout the entire substrate W attracted by the second attracting portion 72. When the second attracting portion 72 is in the second position P2, for example, in plan view, the second attracting portion 72 is disposed at the center of the substrate W supported by the supporting portion 25.

[0220] When the second suction part 72 is in the third position P3, the rotation axis A is positioned between the third suction part 72A and the fourth suction part 72B in a top view. When the second suction part 72 is in the third position P3, the third suction part 72A and the fourth suction part 72B are positioned in a position that is linearly symmetrical with respect to the rotation axis A in a top view.

[0221] When the second suction part 72 moves from the first position P1 to the third position P3, the first branch 74A and the second branch 74B move away from the rotation axis A when viewed from above. When the second suction part 72 moves from the third position P3 to the first position P1, the first branch 74A and the second branch 74B move closer to the rotation axis A when viewed from above.

[0222] When the second suction part 72 moves between the first position P1 and the third position P3, the first branch 74A and the second branch 74B move parallel to each other along a horizontal direction orthogonal to the rotation axis A. The horizontal direction orthogonal to the rotation axis A is, for example, the width direction Y.

[0223] When the second suction part 72 is in the third position P3, it does not overlap with the substrate W supported on the support part 25 when viewed from above. When the second suction part 72 is in the third position P3, it does not overlap with the support part 25 when viewed from above. When the second suction part 72 is in the third position P3, it is positioned radially outward from the substrate W supported on the support part 25 when viewed from above. When the second suction part 72 is in the third position P3, it does not interfere with the conveying mechanism 23.

[0224] When the second suction part 72 is in the third position P3, the suction holding part 74 does not overlap with the substrate W supported on the support part 25 when viewed from above. When the second suction part 72 is in the third position P3, the suction holding part 74 also does not overlap with the support part 25 when viewed from above. When the second suction part 72 is in the third position P3, the suction holding part 74 is also positioned radially outward from the substrate W supported on the support part 25 when viewed from above. When the second suction part 72 is in the third position P3, the suction holding part 74 does not interfere with the conveying mechanism 23.

[0225] The relationship between the rotation axis A and the first position P1, the second position P2, the first support position PH, and the second support position PL is explained.

[0226] Position 1 P1 is higher than position 1 PH. Position 1 P1 is higher than position 2 PL. Position 2 P2 is positioned at approximately the same height as position 1 PH. Position 2 P2 overlaps with position 1 PH in a side view. Position 2 P2 is higher than position 2 PL. Rotation axis A overlaps with position 1 PH in a side view. Rotation axis A is higher than position 2 PL. Specifically, the second suction part 72 located at position 1 P1 is positioned higher than the support part 25 located at position 1 PH. The second suction part 72 located at position 1 P1 is positioned higher than the support part 25 located at position 2 PL. The second suction part 72 located at position 2 P2 is positioned at approximately the same height as the support part 25 located at position 1 PH. The second suction part 72 located at position 2 P2 overlaps with the support part 25 located at position 1 PH in a side view. The second suction part 72, located at the second position P2, is positioned higher than the support part 25 located at the second support position PL. The rotation axis A, viewed from the side, overlaps with the support part 25 located at the first support position PH. The rotation axis A is positioned higher than the support part 25 located at the second support position PL.

[0227] Figure 15 This is a front view of a portion of the inverted unit 24. Figure 15 The substrate WP1 is shown being attracted by the second attraction part 72 at the first position P1. Figure 15 The substrate WP2 is shown being attracted by the second attraction part 72 at the second position P2. Figure 15 The substrate WPH is shown supported by the support portion 25 at the first support position PH. Figure 15 The substrate WPL is shown supported by the support portion 25 at the second support position PL. It should be noted that in this embodiment, the support portion 25 does not support the substrate W at the second support position PL.

[0228] When the second suction part 72 is in the first position P1, the second suction part 72 is located above the substrate WP1. The second suction part 72 attracts the substrate WP1 upwards. The substrate WP1 is in a horizontal position. The second suction part 72 does not contact the substrate WP1. The contact part 77 contacts the substrate WP1 (specifically, the upper surface WT). The contact part 77 is located above the substrate WP1.

[0229] When the second suction part 72 is in the second position P2, it is located below the substrate WP2. The second suction part 72 attracts the substrate WP2 downwards. The substrate WP2 is in a horizontal position. The second suction part 72 does not contact the substrate WP2. The contact part 77 contacts the substrate WP2 (specifically, the back surface WB). The contact part 77 is located below the substrate WP2.

[0230] When the second suction part 72, located at the second position P2, stops attracting the substrate WP2, the hand part 71 (contact part 77) supports the substrate W at the same position as the substrate WP2. When the second suction part 72 is not attracting the substrate W at the second position P2, the second suction part 72 allows the substrate W supported by the hand part 71 to move upward relative to the hand part 71.

[0231] The height of substrate WP1 is higher than that of substrate WP2. The height of substrate WPH is higher than that of substrate WPL.

[0232] The height of substrate WP1 is higher than the height of substrate WPH. The height of substrate WPH is higher than the height of substrate WP2. The height of substrate WP2 is higher than the height of substrate WPL.

[0233] The first position P1 is higher than the substrate WPH. Specifically, when the second attraction part 72 is in the first position P1, the second attraction part 72 is positioned higher than the substrate WPH.

[0234] More specifically, when the second suction portion 72 is in the first position P1, the second suction portion 72 is positioned slightly above the substrate WPH. The second suction portion 72 in the first position P1 is positioned near the upper surface WT of the substrate WPH. Therefore, when the second suction portion 72 is in the first position P1, the second suction portion 72 can easily cause the substrate W to float from the position of the substrate WPH to the position of the substrate WP1.

[0235] The second position P2 is lower than the substrate WPH. The second position P2 is higher than the substrate WPL. Specifically, the second attraction portion 72 located at the second position P2 is disposed at a position lower than the substrate WPH. The second attraction portion 72 located at the second position P2 is disposed at a position higher than the substrate WPL.

[0236] The first support position PH is lower than the substrate WP1. The first support position PH overlaps with the substrate WP2 in a side view. The second support position PL is lower than the substrate WP2. Specifically, the support portion 25 located at the first support position PH is positioned lower than the substrate WP1. The support portion 25 located at the first support position PH overlaps with the substrate WP2 in a side view. The support portion 25 located at the second support position PL is positioned lower than the substrate WP2.

[0237] Although the illustrations are omitted, substrate WP1 is positioned in the same location as substrate WP2 in top view. Substrate WPH is positioned in the same location as substrate WPL in top view. Substrates WP1 and WP2 are positioned in the same location as substrates WPH and WPL in top view. Therefore, substrate WP1 is positioned above substrate WPH. Substrate WPH is positioned above substrate WP2. Substrate WP2 is positioned above substrate WPL.

[0238] Reference Figure 8 The control unit 29 controls the hand drive unit 45, the suction adjustment unit 49, and the receiving drive unit 58 of the conveying mechanism 23. The control unit 29 controls the lifting drive unit 67 of the reversing unit 24. The control unit 29 acquires the detection results of the substrate detection unit 69 of the reversing unit 24. The control unit 29 controls the suction adjustment unit 76 and the hand drive unit 81 of the reversing mechanism 26. The control unit 29 controls the rotation drive unit 82 and the movement drive unit 84 of the hand drive unit 81. The control unit 29 is communicatively connected to the aforementioned elements.

[0239] <Example of operation of substrate processing apparatus 1>

[0240] The following is a detailed explanation of the operation of the conveying mechanism 23 and the reversing unit 24. Specifically, for Figure 9 The actions of steps S4-S8 and S10-S14 shown will be explained in more detail.

[0241] Figure 16 This is a flowchart illustrating the sequence of operations for reversing the substrate W. In the following operational examples, each element of the substrate processing apparatus 1 operates according to the control of the control unit 29.

[0242] <<Step S21: Transfer Step>>

[0243] The conveying mechanism 23 conveys the substrate W to the support part 25.

[0244] Figure 17 of (a), Figure 17 (b) Figure 17 (c) is a top view that schematically represents an example of the conveying step. Figure 17 of (a), Figure 17 (b) Figure 17 The hand drive unit 45 and the lifting base 66 are omitted in (c).

[0245] Reference Figure 17 (a) Hand 41 supports substrate W. First suction part 42 attracts substrate W. Support part 25 does not support substrate W. Hand 71 also does not support substrate W. Second suction part 72 does not attract substrate W. Second suction part 72 is located at position P3.

[0246] Reference Figure 17 (b) The hand drive unit 45 moves the hand 41 (first suction unit 42) to the support unit 25. Therefore, the hand 41 enters the interior of the frame 61 from the outside of the frame 61 through the substrate transfer port 62. While the first suction unit 42 is attracting the substrate W, the first suction unit 42 moves to the support unit 25.

[0247] The first suction part 42 and the substrate W reach a position above the support part 25. During the transfer step, the second suction part 72 remains stationary at the third position P3. Therefore, the second suction part 72 does not interfere with the transfer mechanism 23. The suction holding part 74 also does not interfere with the transfer mechanism 23. That is, the hand part 71 does not interfere with the transfer mechanism 23.

[0248] <<Step S22: First Support Step>>

[0249] Reference Figure 17 (b) The conveying mechanism 23 delivers the substrate W to the support part 25. The support part 25 receives the substrate W from the conveying mechanism 23. The support part 25 supports the substrate W in a horizontal position.

[0250] Reference Figure 17 (c) The first suction part 42 leaves the position above the support part 25 without attracting the substrate W. Specifically, the hand part 41 moves from the inside of the frame 61 to the outside of the frame 61. The support part 25 supports the substrate W. The second suction part 72 is located at the third position P3. The second suction part 72 does not attract the substrate W.

[0251] During the first support step, the second suction unit 72 also remains stationary at the third position P3. Therefore, during the first support step, the second suction unit 72 does not interfere with the conveying mechanism 23. During the first support step, the suction holding unit 74 also does not interfere with the conveying mechanism 23.

[0252] Reference Figure 18 (a)~ Figure 18 (h) will now be explained again regarding the above-mentioned transport steps and the first support step. Figure 18 (a)~ Figure 18 The (h) views are side views that schematically represent examples of the conveying step and the first support step.

[0253] Reference Figure 18 (a) The hand part 41 is located further back than the support part 25. The first suction part 42 is located above the substrate W. The first suction part 42 causes gas to flow on the upper surface WT of the substrate W, thereby attracting the substrate W upward. The substrate W is in a horizontal position. The receiving part 54 is located in the anti-drop position. The support part 25 is located in the first support position PH.

[0254] Reference Figure 18 (b) The hand drive unit 45 moves the hand 41 forward. While the first suction unit 42 is attracting the substrate W, the first suction unit 42 moves to the support unit 25. The first suction unit 42 and the substrate W attracted by the first suction unit 42 are located above the support unit 25. The receiving unit 54 is located above the support unit 25.

[0255] Reference Figure 18 (c) The suction adjustment unit 49 stops supplying gas to the first suction unit 42. The first suction unit 42 stops blowing gas. The first suction unit 42 stops suctioning the substrate W. The substrate W falls downward. The substrate W moves downward relative to the first suction unit 42. The receiving unit 54 receives the substrate W. The receiving unit 54 supports the substrate W in a horizontal position. The substrate W supported by the receiving unit 54 is located above the support unit 25.

[0256] Reference Figure 18 (d). The hand drive unit 45 moves the hand 41 slightly downward. The receiving part 54 descends in a state supporting the substrate W. The receiving part 54 delivers the substrate W to the support part 25. The support part 25 receives the substrate W from the receiving part 54 at the first support position PH. The receiving part 54 moves to a position lower than the substrate W supported by the support part 25. The receiving part 54 leaves the substrate W.

[0257] Although not shown in the figure, the position adjustment unit 65 adjusts the position of the substrate W in the horizontal direction. Specifically, the inclined surface 65a contacts the edge of the substrate W, guiding the substrate W to a predetermined position. Furthermore, the support unit 25 supports the substrate W in a horizontal position.

[0258] Reference Figure 18 (e) The receiving part drive 58 moves the receiving part 54 from the anti-detachment position to the retracted position. The second receiving part 56 moves away from the first receiving part 55. The second receiving part 56 moves rearward. As a result, the second receiving part 56 is located further rearward than the substrate W supported by the support part 25. The second receiving part 56 does not overlap with the substrate W supported by the support part 25 when viewed from above.

[0259] Reference Figure 18 (f) The hand drive unit 45 moves the hand 41 slightly forward. The first receiving part 55 and the second receiving part 56 move forward. As a result, the first receiving part 55 is located further forward than the substrate W supported by the support part 25. Neither the first receiving part 55 nor the second receiving part 56 overlaps with the substrate W supported by the support part 25 when viewed from above.

[0260] Reference Figure 18 (g) The hand drive unit 45 moves the hand 41 upward. The receiving part 54 moves from a position lower than the substrate W supported by the support part 25 to a position higher than the substrate W supported by the support part 25. At this time, the first receiving part 55 passes in front of the substrate W supported by the support part 25. The second receiving part 56 passes in rear of the substrate W supported by the support part 25. The substrate W passes between the first receiving part 55 and the second receiving part 56, moving away from the first attracting part 42.

[0261] Reference Figure 18(h). The hand drive unit 45 moves the hand 41 backward. When the first suction unit 42 is not attracting the substrate W, the first suction unit 42 moves away from the position above the support unit 25.

[0262] As described above, in the first supporting step, the supporting part 25 is stationary at the first supporting position PH. In the conveying step, the supporting part 25 is also stationary at the first supporting position PH.

[0263] <<Step S23: First substrate inspection step>>

[0264] The substrate detection unit 69 detects the substrate W. The substrate detection unit 69 outputs its detection result to the control unit 29. Based on the detection result of the substrate detection unit 69, the control unit 29 determines whether the substrate W exists at a predetermined position. If the control unit 29 determines that the substrate W exists at the predetermined position, it proceeds to step S24. If the control unit 29 does not determine that the substrate W exists at the predetermined position, it does not proceed to step S24. In this case, error handling is performed. Error handling may, for example, return to step S21. Error handling may, for example, notify the user that an error has occurred.

[0265] <<Step S24: First Acquisition Step>>

[0266] The support part 25 delivers the substrate W to the reversing mechanism 26. The reversing mechanism 26 removes the substrate W from the support part 25.

[0267] Figure 19 of (a), Figure 19 (b) Figure 20 of (a), Figure 20 (b) Figure 21 of (a), Figure 21 (b) are diagrams that schematically represent examples of actions in the first acquisition step. Figure 19 of (a), Figure 20 of (a), Figure 21 (a) is a front view of a portion of the inverted unit 24. Figure 19 (b) Figure 20 (b) Figure 21 (b) is a top view of a portion of the reversing unit 24. Illustrations of the hand drive unit 81, etc., are omitted in the figures.

[0268] Reference Figure 19 of (a), Figure 19 (b) The second attracting part 72 is located at the third position P3. The second attracting part 72 does not attract the substrate W. The supporting part 25 is located at the first supporting position PH. The supporting part 25 supports the substrate W. The substrate W is in a horizontal position.

[0269] Reference Figure 20 of (a), Figure 20 (b) The moving drive unit 84 moves the second attracting part 72 from the third position P3 to the first position P1. When the second attracting part 72 is in the first position P1, the second attracting part 72 is located above the substrate W supported by the support part 25.

[0270] Reference Figure 21 of (a), Figure 21 (b) The second suction section 72 begins to attract the substrate W. Specifically, the suction adjustment section 76 supplies gas to the second suction section 72. The second suction section 72 blows gas downwards. The second suction section 72 blows gas upwards onto the upper surface WT. The second suction section 72 causes the gas to flow on the upper surface WT, thereby attracting the substrate W upwards. The substrate W floats upwards from the support section 25. The substrate W leaves the support section 25. The support section 25 delivers the substrate W to the reversing mechanism 26 at the first support position PH. The reversing mechanism 26 receives the substrate W from the support section 25. The reversing mechanism 26 supports the substrate W. The substrate W is in a horizontal position.

[0271] In the first acquisition step, the support 25 is stationary at the first support position PH.

[0272] <<Step S25: Reverse the step>>

[0273] The reversing mechanism 26 reverses the substrate W.

[0274] Figure 22 of (a), Figure 22 (b) Figure 23 of (a), Figure 23 (b) are diagrams that schematically represent examples of actions in the reversal step. Figure 22 of (a), Figure 23 (a) is a front view of a portion of the inverted unit 24. Figure 22 (b) Figure 23 (b) is a top view of a portion of the inverted unit 24.

[0275] Reference Figure 22 of (a), Figure 22 (b) The second suction part 72 is located above the substrate W. The second suction part 72 attracts the substrate W. The substrate W is in a horizontal position. The lifting drive part 67 moves the support part 25 from the first support position PH to the second support position PL.

[0276] Reference Figure 23 of (a), Figure 23(b) The support portion 25 is located at the second support position PL. The rotation drive portion 82 causes the second attraction portion 72 to rotate about the rotation axis A. While the second attraction portion 72 is attracting the substrate W, the second attraction portion 72 rotates half a turn. While the second attraction portion 72 is attracting the substrate W, the second attraction portion 72 rotates 180 degrees. While the second attraction portion 72 is attracting the substrate W, the second attraction portion 72 moves from the first position P1 to the second position P2. The substrate W attracted by the second attraction portion 72 also rotates about the rotation axis A. The substrate W reverses direction.

[0277] When the substrate W is flipped, the second suction part 72 moves from a position above the substrate W to a position below the substrate W. When the substrate W is flipped, the surface of the substrate W attracted by the second suction part 72 changes from the upper surface WT to the back surface WB.

[0278] When the second suction part 72 is in the second position P2, the second suction part 72 is located below the substrate W. The substrate W is in a horizontal position.

[0279] <<Step S26: Second Support Step>>

[0280] The reversing mechanism 26 delivers the substrate W to the support part 25. The support part 25 receives the substrate W from the reversing mechanism 26. The support part 25 supports the substrate W in a horizontal position.

[0281] Reference Figure 23 of (a), Figure 23 (b) The second suction section 72 is always located at the second position P2. The second suction section 72 stops attracting the substrate W. Specifically, the suction adjustment section 76 stops supplying gas to the second suction section 72. The second suction section 72 stops blowing gas. The substrate W is simply placed on the hand section 71 (contact section 77). The substrate W is in a horizontal position. The second suction section 72 allows the substrate W to move upward.

[0282] Figure 24 of (a), Figure 24 (b) is a diagram that schematically illustrates an example of the action of the second support step. Figure 24 (a) is a front view of a portion of the inverted unit 24. Figure 24 (b) is a top view of a portion of the inverted unit 24.

[0283] The second suction part 72 is located at the second position P2. The second suction part 72 is located below the substrate W. The second suction part 72 does not attract the substrate W. The lifting drive part 67 moves the support part 25 from the second support position PL to the first support position PH. The support part 25 contacts the substrate W on the hand part 71. Then, the support part 25 lifts the substrate W upward. The substrate W moves upward relative to the reversing mechanism 26. The substrate W leaves the reversing mechanism 26. The reversing mechanism 26 hands the substrate W to the support part 25.

[0284] Although not shown in the figure, the position adjustment unit 65 adjusts the position of the substrate W in the horizontal direction. Specifically, the inclined surface 65a contacts the edge of the substrate W, guiding the substrate W to a predetermined position.

[0285] The support portion 25 supports the substrate W at the first support position PH. The substrate W is in a horizontal position.

[0286] During the second support step, the second attraction part 72 remains stationary at the second position P2. That is, during the second support step, the second attraction part 72 is always located below the substrate W. When the support part 25 is located at the first support position PH, the support part 25 surrounds the side of the second attraction part 72.

[0287] <<Step S27: Second Substrate Inspection Step>>

[0288] The substrate detection unit 69 detects the substrate W. The substrate detection unit 69 outputs its detection result to the control unit 29. Based on the detection result of the substrate detection unit 69, the control unit 29 determines whether the substrate W exists at a predetermined position. If the control unit 29 determines that the substrate W exists at the predetermined position, it proceeds to step S28. If the control unit 29 does not determine that the substrate W exists at the predetermined position, it does not proceed to step S28. In this case, error handling is performed. Error handling may include notifying the user that an error has occurred.

[0289] <<Step S28: Second Acquisition Step>>

[0290] The support section 25 delivers the substrate W to the conveying mechanism 23. The conveying mechanism 23 removes the substrate W from the support section 25.

[0291] Figure 25 of (a), Figure 25 (b) Figure 26 of (a), Figure 26 (b) is a diagram that schematically represents an example of the action in the second acquisition step. Figure 25 of (a), Figure 26 (a) is a front view of a portion of the reversing unit 24 and the conveying mechanism 23. Figure 25 (b) Figure 26 (b) is a top view of part of the reversing unit 24 and the conveying mechanism 23.

[0292] Reference Figure 25 of (a), Figure 25(b) The support portion 25 supports the substrate W at the first support position PH. The second suction portion 72 is always located at the second position P2. When the first suction portion 42 is not attracting the substrate W, the first suction portion 42 moves to a position above the support portion 25. The first suction portion 42 is located above the substrate W supported by the support portion 25.

[0293] Reference Figure 26 of (a), Figure 26 (b) The first suction part 42 begins to attract the substrate W. The first suction part 42 attracts the substrate W supported on the support part 25 upward. The substrate W floats upward from the support part 25. The substrate W leaves the support part 25. The support part 25 delivers the substrate W to the conveying mechanism 23 at the first support position PH. The conveying mechanism 23 supports the substrate W. The substrate W is in a horizontal position.

[0294] In the second acquisition step, the support 25 remains stationary at the first support position PH. In the second acquisition step, the second attraction 72 remains stationary at the second position P2.

[0295] From the second supporting step to the second acquiring step, the second attracting part 72 remains stationary at the second position P2. From the time the substrate W is handed over from the reversing mechanism 26 to the time the substrate W is handed over from the support part 25 to the transport mechanism 23, the second attracting part 72 does not move. From the time the substrate W is handed over from the reversing mechanism 26 to the support part 25 to the time the support part 25 hands over to the transport mechanism 23, the support part 25 surrounds the side of the second attracting part 72.

[0296] <<Step S29: Moving out>>

[0297] When the first attracting part 42 attracts the substrate W, the first attracting part 42 moves away from the position above the support part 25.

[0298] Reference Figure 26 of (a), Figure 26 (b) Figure 27 of (a), Figure 27 (b) Figure 27 of (a), Figure 27 (b) is a diagram that schematically illustrates an example of the action of moving out. Figure 27 (a) is a front view of a portion of the inverted unit 24. Figure 27 (b) is a top view of a portion of the reversing unit 24. For example, the conveying mechanism 23 removes the substrate W from the reversing unit 24. Specifically, the first suction part 42 and the substrate W move from the inside of the frame 61 to the outside of the frame 61. Then, the conveying mechanism 23 conveys the substrate W to the processing unit 28 or the substrate placement part 27.

[0299] Reference Figure 28(a)~ Figure 28 (h) will now reiterate the second acquisition and removal steps described above. Figure 28 (a)~ Figure 28 (h) is a side view that schematically represents an example of the actions of the second acquisition step and the removal step.

[0300] Reference Figure 28 (a) The hand part 41 is located further back than the support part 25. The first suction part 42 does not attract the substrate W. The receiving part 54 is in the retracted position. The support part 25 is in the first support position PH. The support part 25 supports the substrate W. The substrate W is in a horizontal position. The second suction part 72 is in the second position P2. The second suction part 72 does not attract the substrate W.

[0301] Reference Figure 28 (b) The first suction part 42 moves to the support part 25. The first suction part 42 is located above the support part 25. The first suction part 42 is located above the substrate W supported on the support part 25. The receiving part 54 is located above the support part 25. The receiving part 54 does not overlap with the substrate W supported on the support part 25 when viewed from above. The first receiving part 55 is located further forward than the substrate W supported on the support part 25. The second receiving part 56 is located further rearward than the substrate W supported on the support part 25.

[0302] Reference Figure 28 (c) Hand 41 moves slightly downward. Receiving portion 54 moves from a position higher than the substrate W supported by support portion 25 to a position lower than the substrate W supported by support portion 25. Receiving portion 54 descends to a position lower than the upper end of support portion 25. The substrate W supported by support portion 25 passes between the first receiving portion 55 and the second receiving portion 56. The first attracting portion 42 approaches the upper surface WT of the substrate W supported by support portion 25.

[0303] Reference Figure 28 (d). Hand 41 moves slightly rearward. First receiving part 55 and second receiving part 56 move rearward. As a result, first receiving part 55 is located below the substrate W supported by support part 25. First receiving part 55 overlaps with substrate W supported by support part 25 when viewed from above.

[0304] Reference Figure 28 (e) The receiving portion 54 moves to the anti-detachment position. Specifically, the second receiving portion 56 moves closer to the first receiving portion 55. The second receiving portion 56 moves forward. As a result, the second receiving portion 56 is located below the substrate W supported by the support portion 25 when viewed from above. Both the first receiving portion 55 and the second receiving portion 56 overlap with the substrate W supported by the support portion 25 when viewed from above.

[0305] Reference Figure 28(f) The first suction part 42 is located above the substrate W supported by the support part 25. The first suction part 42 begins to attract the substrate W. Specifically, the first suction part 42 blows gas onto the upper surface WT. The first suction part 42 causes the gas to flow on the upper surface WT, thereby attracting the substrate W upward. The substrate W floats upward from the support part 25. The substrate W leaves the support part 25. The support part 25 delivers the substrate W to the conveying mechanism 23 at the first support position PH. The conveying mechanism 23 receives the substrate W from the support part 25. The conveying mechanism 23 supports the substrate W. The substrate W is in a horizontal position.

[0306] Reference Figure 28 (g). With the first attracting part 42 attracting the substrate W, the hand part 41 moves upward. The receiving part 54 moves from a position below the upper end of the support part 25 to a position above the upper end of the support part 25.

[0307] Reference Figure 28 (h). Hand 41 moves backward. While the first suction part 42 is attracting the substrate W, the first suction part 42 moves away from the position above the support part 25.

[0308] As described above, in the second acquisition step, the support portion 25 remains stationary at the first support position PH. In the second acquisition step, the second suction portion 72 remains stationary at the second position P2. In the removal step, the support portion 25 also remains stationary at the first support position PH. In the removal step, the second suction portion 72 also remains stationary at the second position P2.

[0309] <<Step S30: Retreat Step>>

[0310] The retraction step is performed after the second acquisition step. That is, the retraction step is performed after the support 25 delivers the substrate W to the transport mechanism 23. In the retraction step, the second suction part 72 moves from the second position P2 to the third position P3. Specifically, the second suction part 72 moves from the second position P2 to the first position P1. Then, the second suction part 72 moves from the first position P1 to the third position P3. The retraction step includes a descending step, a first moving step, a second moving step, and a rising step. The first moving step is performed after the descending step. The second moving step and the rising step are performed after the first moving step.

[0311] <<Step S31: Descent Step>>

[0312] Reference Figure 29 of (a), Figure 29 (b) Figure 29 (a) is a front view schematically representing an example of the descent step. Figure 29(b) is a top view schematically illustrating an example of the descent step. The second suction part 72 is located at the second position P2. The second suction part 72 does not attract the substrate W. The support part 25 does not support the substrate W. The support part 25 moves from the first support position PH to the second support position PL.

[0313] <<Step S32: First moving step>>

[0314] Reference Figure 30 of (a), Figure 30 (b) Figure 30 (a) is a side view schematically representing an example of the action of the first moving step. Figure 30 (b) is a top view schematically illustrating an example of the first moving step. The support 25 is located at the second support position PL. The second suction part 72 rotates about the rotation axis A. The second suction part 72 moves from the second position P2 to the first position P1.

[0315] <<Step S33: Second movement step>>

[0316] Reference Figure 31 of (a), Figure 31 (b) Figure 31 (a) is a front view schematically showing an example of the actions of the second moving step and the rising step. Figure 31 (b) is a top view schematically illustrating an example of the second moving step and the rising step. The second suction unit 72 moves from the first position P1 to the third position P3.

[0317] <<Step S34: Ascent Step>>

[0318] Reference Figure 31 of (a), Figure 31 (b) The support 25 moves from the second support position PL to the first support position PH.

[0319] Here, the period for the upward step may overlap with the period for the second movement step. For example, the upward step may be performed simultaneously with the second movement step. Alternatively, the period for the upward step may not overlap with the period for the second movement step. For example, the upward step may be performed after the second movement step. For example, the second movement step may be performed after the upward step.

[0320] After the retreat step, return to step S21 to perform the transfer step.

[0321] <Effects of the Implementation Method>

[0322] The substrate processing apparatus 1 includes a transport mechanism 23 for transporting a substrate W. The transport mechanism 23 includes a first suction portion 42. The first suction portion 42 attracts the substrate W without contacting it. Therefore, the transport mechanism 23 can properly support the substrate W. For example, even with a substrate W that is easily bent, the transport mechanism 23 can properly support the substrate W. For example, even when the rigidity of the substrate W itself is relatively low, the transport mechanism 23 can properly support the substrate W.

[0323] The conveying mechanism 23 includes a hand drive unit 45. The hand drive unit 45 moves the first suction unit 42. Therefore, the conveying mechanism 23 can properly convey the substrate W attracted by the first suction unit 42.

[0324] The substrate processing apparatus 1 includes a reversing mechanism 26. The reversing mechanism 26 includes a second suction portion 72. The second suction portion 72 attracts the substrate W without contacting it. Therefore, the reversing mechanism 26 can properly support the substrate W. For example, even if the substrate W is easily bent, the reversing mechanism 26 can properly support it. For example, even if the rigidity of the substrate W itself is relatively low, the reversing mechanism 26 can properly support it.

[0325] The reversing mechanism 26 includes a rotation drive unit 82. The rotation drive unit 82 causes the second attraction unit 72 to rotate about the rotation axis A. Therefore, the reversing mechanism 26 can properly reverse the substrate W attracted by the second attraction unit 72.

[0326] The substrate processing apparatus 1 includes a support portion 25. The support portion 25 contacts and supports the substrate W. A conveying mechanism 23 conveys the substrate W to the support portion 25. A reversing mechanism 26 receives the substrate W from the support portion 25. Thus, when the substrate W is conveyed from the conveying mechanism 23 to the reversing mechanism 26, the conveying mechanism 23 does not directly transfer the substrate W to the reversing mechanism 26. When the substrate W is conveyed from the conveying mechanism 23 to the reversing mechanism 26, the conveying mechanism 23 indirectly transfers the substrate W to the reversing mechanism 26 via the support portion 25. Therefore, the second suction portion 72 can properly attract the substrate W supported on the support portion 25. Therefore, the reversing mechanism 26 can properly receive the substrate W from the support portion 25.

[0327] The support portion 25 supports the substrate W in a horizontal position. Therefore, the second suction portion 72 can more properly attract the substrate W supported on the support portion 25. Therefore, the reversing mechanism 26 can more properly receive the substrate W from the support portion 25.

[0328] When the conveying mechanism 23 conveys the substrate W to the support portion 25, the first suction portion 42 is located above the substrate W. Therefore, the conveying mechanism 23 can properly deliver the substrate W to the support portion 25.

[0329] When the reversing mechanism 26 receives the substrate W from the support portion 25, the second suction portion 72 is located above the substrate W supported on the support portion 25, and the second suction portion 72 causes gas to flow along the upper surface WT of the substrate W to attract the substrate W upward. Therefore, the reversing mechanism 26 can properly receive the substrate W from the support portion 25.

[0330] As described above, the substrate processing apparatus 1 can properly reverse the substrate W.

[0331] The support portion 25 includes a position adjustment portion 65. The position adjustment portion 65 adjusts the position of the substrate W in the horizontal direction. Therefore, when the support portion 25 supports the substrate W, the substrate W is in the correct position. Therefore, the second suction portion 72 can properly attract the substrate W supported on the support portion 25. The reversing mechanism 26 can properly receive the substrate W from the support portion 25.

[0332] Since the support portion 25 has a position adjustment portion 65, the first suction portion 42 can also properly attract the substrate W supported on the support portion 25. Therefore, the conveying mechanism 23 can properly receive the substrate W from the support portion 25.

[0333] As described above, the first attracting portion 42 and the second attracting portion 72 attract the substrate W without contacting it. Therefore, it is particularly important for the first attracting portion 42 and the second attracting portion 72 to have the substrate W in the correct position when they attract it.

[0334] The position adjustment unit 65 has an inclined surface 65a. The inclined surface 65a contacts the end edge of the substrate W. The inclined surface 65a is inclined downward and inward in the radial direction of the substrate W supported by the support unit 25. Therefore, the position adjustment unit 65 can properly guide the substrate W to a predetermined position.

[0335] When the reversing mechanism 26 reverses the substrate W, the second suction part 72 moves from a position above the substrate W to a position below the substrate W. Therefore, the reversing mechanism 26 can properly reverse the substrate W.

[0336] When the reversing mechanism 26 delivers the substrate W to the support portion 25, the second suction portion 72 is located below the substrate W and does not attract the substrate W. Therefore, when the reversing mechanism 26 delivers the substrate W to the support portion 25, the reversing mechanism 26 allows the substrate W to move upward relative to the reversing mechanism 26. Thus, the reversing mechanism 26 can properly deliver the substrate W to the support portion 25.

[0337] From the moment the substrate W is handed over from the reversing mechanism 26 to the support portion 25 until the support portion 25 hands over the substrate W to the transport mechanism 23, the second suction portion 72 remains stationary. That is, from the moment the substrate W is handed over from the reversing mechanism 26 to the support portion 25 until the support portion 25 hands over the substrate W to the transport mechanism 23, the second suction portion 72 does not move. Therefore, after the reversing mechanism 26 hands over the substrate W to the support portion 25, the support portion 25 can quickly hand over the substrate W to the transport mechanism 23. In other words, the time from when the reversing mechanism 26 hands over the substrate W to the support portion 25 until the support portion 25 hands over the substrate W to the transport mechanism 23 can be easily shortened. Therefore, the processing capacity of the substrate processing apparatus 1 can be appropriately increased. For example, the number of substrates W that the substrate processing apparatus 1 can process per unit time can be appropriately increased.

[0338] The rotary drive unit 82 moves the second suction unit 72 to the first position P1 by rotating the second suction unit 72 about the rotation axis A. When the second suction unit 72 is in the first position P1, the second suction unit 72 blows gas downward. Therefore, when the second suction unit 72 is in the first position P1, the second suction unit 72 can properly attract the substrate W located below the second suction unit 72 upward.

[0339] The rotary drive unit 82 moves the second suction unit 72 to a second position P2 by rotating the second suction unit 72 about the rotation axis A. When the second suction unit 72 is in the second position P2, the second suction unit 72 blows gas upward. Therefore, when the second suction unit 72 is in the second position P2, the second suction unit 72 can properly attract the substrate W located above the second suction unit 72 downward.

[0340] The rotation axis A is positioned lower than the second attraction portion 72 located at the first position P1. Therefore, the second attraction portion 72 located at the first position P1 is positioned higher than the second attraction portion 72 located at the second position P2. Therefore, when the second attraction portion 72 is located at the first position P1, it can be easily positioned above the substrate W. Therefore, when the second attraction portion 72 is located at the first position P1, the reversing mechanism 26 can properly receive the substrate W from the support portion 25.

[0341] On the other hand, the second suction part 72 located at the second position P2 is positioned lower than the second suction part 72 located at the first position P1. Therefore, when the second suction part 72 is located at the second position P2, it can be easily positioned below the substrate W. Therefore, when the second suction part 72 is located at the second position P2, the reversing mechanism 26 can properly deliver the substrate W to the support part 25.

[0342] By moving the second suction part 72 from the first position P1 to the second position P2, the reversing mechanism 26 reverses the substrate W and lowers the height of the substrate W. Therefore, when the second suction part 72 is in the second position P2, the reversing mechanism 26 can more easily deliver the substrate W to the support part 25.

[0343] When the reversing mechanism 26 delivers the substrate W to the support portion 25, the second suction portion 72 is located at the second position P2, and the second suction portion 72 does not attract the substrate W. Therefore, when the reversing mechanism 26 delivers the substrate W to the support portion 25, the reversing mechanism 26 allows the substrate W to move upward relative to the reversing mechanism 26. Therefore, the reversing mechanism 26 can properly deliver the substrate W to the support portion 25.

[0344] From the time the reversing mechanism 26 delivers the substrate W to the support section 25 until the support section 25 delivers the substrate W to the transport mechanism 23, the second suction section 72 remains in the second position P2. Therefore, after the reversing mechanism 26 delivers the substrate W to the support section 25, the support section 25 can quickly deliver the substrate W to the transport mechanism 23. Thus, the processing capacity of the substrate processing apparatus 1 can be appropriately increased.

[0345] When the second attraction part 72 is in the first position P1, the second attraction part 72 is positioned, in plan view, further in the radial direction than the support part 25, towards the inner side of the substrate W supported by the support part 25. Therefore, the second attraction part 72 can apply an upward force to the center of the substrate W. Thus, the second attraction part 72 can attract the substrate W more effectively.

[0346] When the second attracting part 72 is in the second position P2, it is positioned, in plan view, further in the radial direction than the supporting part 25, towards the inner side of the substrate W supported by the supporting part 25. Therefore, the second attracting part 72 allows a downward force to act on the center of the substrate W. Thus, the second attracting part 72 can more effectively attract the substrate W.

[0347] In the substrate processing apparatus 1 equipped with the second suction part 72, the time required for the second suction part 72 to retract is particularly long. This is because, when the second suction part 72 is at the second position P2, it is positioned, in plan view, further in the radial direction than the support part 25, towards the substrate W supported by the support part 25. Therefore, for example, the movement distance from the second position P2 to the third position P3 is relatively long. For example, the movement time of the second suction part 72 from the second position P2 to the third position P3 is relatively long. Here, assuming that the second suction part 72 retracts from the second position P2 before the support part 25 hands over the substrate W to the transport mechanism 23, the time when the support part 25 hands over the substrate W to the transport mechanism 23 will be significantly delayed. As described above, in this embodiment, from the time the substrate W is handed over from the reversing mechanism 26 to the support portion 25 until the support portion 25 hands over the substrate W to the transport mechanism 23, the second suction portion 72 is always located at the second position P2. Therefore, the time delay in the support portion 25 handing over the substrate W to the transport mechanism 23 can be appropriately suppressed. This effect is particularly significant for the substrate processing apparatus 1 equipped with the second suction portion 72.

[0348] It should be noted that, in this embodiment, from the time the substrate W is handed over from the reversing mechanism 26 to the time the substrate W is handed over from the support part 25 to the time the support part 25 hands over the substrate W to the conveying mechanism 23, the support part 25 is disposed to the side of the second suction part 72. Therefore, from the time the substrate W is handed over from the reversing mechanism 26 to the support part 25 to the time the support part 25 hands over the substrate W to the conveying mechanism 23, the second suction part 72 is prohibited from retracting from the second position P2. This is because the second suction part 72 would interfere with the support part 25. Furthermore, from the time the substrate W is handed over from the reversing mechanism 26 to the support part 25 to the time the support part 25 hands over the substrate W to the conveying mechanism 23, the second suction part 72 is disposed below the substrate W supported by the support part 25. Therefore, from the time the substrate W is handed over from the reversing mechanism 26 to the support part 25 to the time the support part 25 hands over the substrate W to the conveying mechanism 23, the support part 25 is prohibited from descending from the first support position P1. The reason is that the substrate W supported by the support part 25 will interfere with the second attraction part 72.

[0349] The substrate processing apparatus 1 includes a lifting drive unit 67. The lifting drive unit 67 moves the support unit 25 to a first support position PH and a second support position PL. The second support position PL is lower than the first support position PH. Therefore, the support unit 25 can be appropriately raised and lowered.

[0350] When the second suction part 72 is in the first position P1, the second suction part 72 is positioned above the substrate WPH. Therefore, when the second suction part 72 is in the first position P1, the second suction part 72 can be easily positioned above the substrate WPH. Therefore, when the second suction part 72 is in the first position P1, the reversing mechanism 26 can easily receive the substrate W from the support part 25.

[0351] The height of substrate WP2 is lower than the height of substrate WPH, but higher than the height of substrate WPL. Therefore, when the second suction part 72 is in the second position P2, the support part 25 moves from the second support position PL to the first support position PH, and the support part 25 can properly receive substrate W from the reversing mechanism 26. That is, when the second suction part 72 is in the second position P2, the reversing mechanism 26 can properly deliver substrate W to the support part 25.

[0352] When the conveying mechanism 23 delivers the substrate W to the support portion 25, the support portion 25 is located at the first support position PH. When the reversing mechanism 26 receives the substrate W from the support portion 25, the support portion 25 is located at the first support position PH. When the reversing mechanism 26 reverses the substrate W, the support portion 25 is located at the second support position PL. When the reversing mechanism 26 delivers the substrate W to the support portion 25, the support portion 25 moves from the second support position PL to the first support position PH. Thus, the support portion 25 has only two positions (specifically, the first support position PH and the second support position PL). In other words, the lifting drive unit 67 may not move the support portion 25 to more than three positions. Specifically, the lifting drive unit 67 may not move the support portion 25 to positions other than the first support position PH and the second support position PL. For example, the lifting drive unit 67 may not move the support portion 25 to a position higher than the first support position PH. For example, the lifting drive unit 67 may not move the support portion 25 to a position lower than the second support position PL. Therefore, the structure of the lifting drive unit 67 can be simplified. For example, the lifting drive unit 67 can be implemented without using an electric motor. Furthermore, the operation of the support unit 25 can be simplified.

[0353] Furthermore, when the conveying mechanism 23 receives the substrate W from the support portion 25, the support portion 25 is located at the first support position PH. Therefore, the structure of the lifting drive portion 67 can be further simplified. The operation of the support portion 25 can also be further simplified.

[0354] The reversing mechanism 26 includes a movement drive unit 84. The movement drive unit 84 moves the second suction part 72 from a first position P1 to a third position P3. Here, the third position P3 is the position where the second suction part 72 does not interfere with the conveying mechanism 23. When the conveying mechanism 23 delivers the substrate W to the support part 25, the second suction part 72 is located at the third position P3. Therefore, interference between the second suction part 72 and the conveying mechanism 23 can be properly prevented when the conveying mechanism 23 delivers the substrate W to the support part 25.

[0355] When the second suction part 72 is in the third position P3, it is positioned, in plan view, further outward in the radial direction from the substrate W supported by the support part 25 than the support part 25. Therefore, interference between the second suction part 72 and the conveying mechanism 23 when the second suction part 72 is in the third position P3 can be reliably prevented. Furthermore, interference between the second suction part 72 and the support part 25 when the second suction part 72 is in the third position P3 can be reliably prevented.

[0356] The reversing mechanism 26 includes a first branch 74A and a second branch 74B. The first branch 74A is connected to the movement drive unit 84. The second branch 74B is also connected to the movement drive unit 84. The second suction unit 72 includes a third suction unit 72A and a fourth suction unit 72B. The third suction unit 72A is held at the first branch 74A. The fourth suction unit 72B is held at the second branch 74B. The movement drive unit 84 widens or narrows the gap between the first branch 74A and the second branch 74B. By widening the gap between the first branch 74A and the second branch 74B, the movement drive unit 84 moves the second suction unit 72 from a first position P1 to a third position P3. In this way, the movement drive unit 84 changes the relative positions of the third suction unit 72A and the fourth suction unit 72B. Therefore, the third suction unit 72A and the fourth suction unit 72B can be retracted efficiently. That is, the amount of movement of the second suction part 72 when it moves from the first position P1 to the third position P3 can be appropriately suppressed. Therefore, the movement drive unit 84 can easily move the second suction part 72 from the first position P1 to the third position P3. Furthermore, the range of motion of the second suction part 72 when it moves from the first position P1 to the third position P3 can be effectively reduced. Therefore, the enlargement of the reversing mechanism 26 can be appropriately suppressed.

[0357] When the second suction part 72 is in the first position P1, the rotation axis A is arranged such that, in plan view, it passes between the first branch 74A and the second branch 74B. When the second suction part 72 is in the third position P3, the rotation axis A is also arranged such that, in plan view, it passes between the first branch 74A and the second branch 74B. When the second suction part 72 moves from the first position P1 to the third position P3, the first branch 74A and the second branch 74B move away from the rotation axis A in plan view. When the second suction part 72 moves from the third position P3 to the first position P1, the first branch 74A and the second branch 74B move closer to the rotation axis A in plan view. Thus, the movement drive unit 84 causes the third suction part 72A and the fourth suction part 72B to move individually. Specifically, the movement drive unit 84 causes the third suction part 72A and the fourth suction part 72B to move in opposite directions. For example, when the second suction part 72 moves from the first position P1 to the third position P3, the movement drive unit 84 moves the third suction part 72A to the right and the fourth suction part 72B to the left. Similarly, when the second suction part 72 moves from the third position P3 to the first position P1, the movement drive unit 84 moves the third suction part 72A to the left and the fourth suction part 72B to the right. Therefore, the amount of movement of the second suction part 72 when moving between the first position P1 and the third position P3 can be appropriately suppressed. Therefore, the movement drive unit 84 can more easily move the second suction part 72 between the first position P1 and the third position P3. Furthermore, the range of motion of the second suction part 72 when moving from the first position P1 to the third position P3 can be reduced more effectively. Therefore, the enlargement of the reversing mechanism 26 can be appropriately suppressed.

[0358] The distance between the first branch 74A and the second branch 74B when the second suction part 72 rotates around the rotation axis A is smaller than the distance between the first branch 74A and the second branch 74B when the second suction part 72 is in the third position P3. Therefore, the range of motion of the second suction part 72 and the suction holding part 74 when the second suction part 72 rotates around the rotation axis A can be effectively reduced. Therefore, the enlargement of the reversing mechanism 26 can be appropriately suppressed.

[0359] The substrate reversing method includes a conveying step (step S21). In the conveying step, the conveying mechanism 23 conveys the substrate to the support portion 25. In the conveying step, the first suction portion 42 is located above the substrate W. In the conveying step, the first suction portion 42 causes gas to flow on the upper surface WT of the substrate W, thereby attracting the substrate W upwards. Therefore, in the conveying step, the conveying mechanism 23 can properly support the substrate W.

[0360] During the transport step, while the first suction part 42 is attracting the substrate W, the first suction part 42 moves to the support part 25. Therefore, during the transport step, the transport mechanism 23 can properly transport the substrate W to the support part 25.

[0361] The substrate reversal method includes a first support step (step S22). The first support step is performed after the transfer step. In the first support step, the support portion 25 receives the substrate W from the transfer mechanism 23. As described above, in the transfer step, the first suction portion 42 is located above the substrate W. Therefore, in the first support step, the support portion 25 can properly receive the substrate from the transfer mechanism 23.

[0362] The substrate reversal method includes a first acquisition step (step S24). The first acquisition step is performed after the first support step. In the first acquisition step, the reversal mechanism 26 removes the substrate W from the support portion 25. In the first acquisition step, the second suction portion 72 is located at a first position P1. That is, the second suction portion 72 is located above the substrate W supported on the support portion 25. In the first acquisition step, the second suction portion 72 causes gas to flow on the upper surface WT of the substrate W, thereby attracting the substrate W upwards. Therefore, in the first acquisition step, the reversal mechanism 26 can properly remove the substrate W from the support portion 25.

[0363] In the first supporting step, the supporting portion 25 supports the substrate W in a horizontal position. Therefore, in the first acquiring step, the second attracting portion 72 can properly attract the substrate W supported on the supporting portion 25. Therefore, in the first acquiring step, the reversing mechanism 26 can properly remove the substrate W from the supporting portion 25.

[0364] As described above, the substrate reversal method includes a first support step. Therefore, the conveying mechanism 23 delivers the substrate W to the support portion 25, and the reversal mechanism 26 removes the substrate W from the support portion 25. Thus, the reversal mechanism 26 indirectly receives the substrate W from the conveying mechanism 23 via the support portion 25. The reversal mechanism 26 does not directly receive the substrate W from the conveying mechanism 23. Therefore, the second suction portion 72 can more appropriately attract the substrate W supported on the support portion 25. Therefore, in the first acquisition step, the reversal mechanism 26 can more appropriately remove the substrate W from the support portion 25.

[0365] The substrate reversing method includes a reversing step (step S25). The reversing step is performed after the first acquisition step. In the reversing step, the reversing mechanism 26 reverses the substrate W. During the reversing step, with the substrate W attracted by the second attraction part 72, the second attraction part 72 rotates half a turn around the rotation axis A. During the reversing step, with the substrate W attracted by the second attraction part 72, the second attraction part 72 moves from the first position P1 to the second position P2. Therefore, during the reversing step, the substrate W attracted by the second attraction part 72 can be properly reversed.

[0366] The substrate reversal method includes a second support step (step S26). The second support step is performed after the reversal step. In the second support step, the support portion 25 receives the substrate W from the reversal mechanism 26. The support portion 25 supports the substrate W in a horizontal position. Here, in the second support step, the second suction portion 72 is located at a second position P2. That is, in the second support step, the second suction portion 72 is located below the substrate W. Therefore, in the second support step, the support portion 25 can properly receive the substrate W from the reversal mechanism 26.

[0367] As described above, the substrate reversal method enables the substrate W to be properly reversed.

[0368] In the first supporting step, the position of the substrate W in the horizontal direction is adjusted. Therefore, in the first supporting step, the substrate W supported on the support portion 25 is in the proper position. Therefore, in the first acquiring step, the second attracting portion 72 can properly attract the substrate W supported on the support portion 25.

[0369] The substrate reversal method includes a first substrate inspection step. The first substrate inspection step inspects the substrate W supported on the support portion 25. The first substrate inspection step is performed after the first support step. Therefore, the first substrate inspection step can check whether the first support step has been properly completed. Furthermore, the first substrate inspection step is performed before the first acquisition step. Therefore, the first substrate inspection step can determine whether the first acquisition step can be properly performed before the first acquisition step. As a result, the first substrate inspection step can appropriately decide whether to start the first acquisition step.

[0370] In the first support step, the support part 25 remains stationary at the first support position PH. In the first acquisition step, the support part 25 remains stationary at the first support position PH. In the reversal step, the support part 25 moves from the first support position PH to the second support position PL. In the second support step, the support part 25 moves from the second support position PL to the first support position PH. Thus, the support part 25 remains stationary in only two positions (specifically, the first support position PH and the second support position PL). In other words, the support part 25 may not remain stationary in more than three positions. Specifically, the support part 25 may not remain stationary in any position other than the first support position PH and the second support position PL. Therefore, the operation of the support part 25 can be simplified.

[0371] When the second suction portion 72 is located at the first position P1, the second suction portion 72 is positioned above the substrate WPH. Therefore, during the first acquisition step, the second suction portion 72 can properly attract the substrate WPH.

[0372] The height of substrate WP1 is higher than the height of substrate WPH. Therefore, in the first acquisition step, the reversing mechanism 26 can properly remove substrate W from the support 25. In the first acquisition step, the support 25 can properly deliver substrate W to the reversing mechanism 26 at the first support position PH.

[0373] The height of the rotation axis A is lower than the height of the second attraction part 72 located at the first position P1. Therefore, the height of the second attraction part 72 located at the second position P2 is lower than the height of the second attraction part 72 located at the first position P1. That is, when the second attraction part 72 moves from the first position P1 to the second position P2, the second attraction part 72 descends. Here, the height of the substrate WP2 is lower than the height of the substrate WPH and higher than the height of the substrate WPL. Therefore, in the second support step, the reversing mechanism 26 can properly deliver the substrate W to the support part 25. In the second support step, by moving the support part 25 from the second support position PL to the first support position PH, the support part 25 can properly receive the substrate W from the reversing mechanism 26.

[0374] The substrate reversal method includes a second acquisition step. This second acquisition step is performed after the second support step. In this second acquisition step, the conveying mechanism 23 removes the substrate W from the support portion 25. From the second support step to the second acquisition step, the second suction portion 72 remains stationary at the second position P2. Therefore, the second acquisition step can be started quickly after the second support step. As a result, the processing capacity of the substrate processing apparatus 1 can be appropriately increased.

[0375] In the second acquisition step, the first suction part 42 is located above the substrate W supported by the support part 25. The first suction part 42 causes gas to flow on the upper surface WT of the substrate W, thereby attracting the substrate upward. Therefore, in the second acquisition step, the conveying mechanism 23 can properly remove the substrate W from the support part 25.

[0376] As described above, in the second supporting step, the supporting portion 25 supports the substrate W in a horizontal position. Therefore, in the second acquiring step, the first attracting portion 42 can properly attract the substrate W supported on the supporting portion 25.

[0377] As described above, the substrate reversal method includes a second support step. Therefore, the reversal mechanism 26 delivers the substrate W to the support portion 25, and the conveying mechanism 23 removes the substrate W from the support portion 25. Thus, the conveying mechanism 23 indirectly receives the substrate W from the reversal mechanism 26 via the support portion 25. The conveying mechanism 23 does not directly receive the substrate W from the reversal mechanism 26. Therefore, the first suction portion 42 can more appropriately attract the substrate W supported on the support portion 25.

[0378] In the second supporting step, the position of the substrate in the horizontal direction is adjusted. Therefore, in the second supporting step, the substrate W supported on the support portion 25 is in the proper position. Therefore, in the second acquiring step, the first attracting portion 42 can properly attract the substrate W supported on the support portion 25.

[0379] The substrate reversal method includes a second substrate inspection step. This second substrate inspection step inspects the substrate W supported on the support portion 25. The second substrate inspection step is performed after the second support step. Therefore, the second substrate inspection step can check whether the second support step has been properly completed. Furthermore, the second substrate inspection step is performed before the second acquisition step. Therefore, the second substrate inspection step can determine whether the second acquisition step can be properly performed before the second acquisition step. As a result, the second substrate inspection step can appropriately decide whether to start the second acquisition step.

[0380] The reversal step includes a backoff step. This backoff step occurs after the second acquisition step. Therefore, the execution time of the second acquisition step can be easily advanced. The execution of the second acquisition step is not delayed due to the backoff step.

[0381] During the retraction step, the second suction unit 72 moves from the second position P2 to the third position P3. The third position P3 is a position where it does not interfere with the conveying mechanism 23. During the first support step, the second suction unit 72 is located in the third position. Therefore, interference between the second suction unit 72 and the conveying mechanism 23 can be properly prevented during the first support step.

[0382] The retraction step includes a descent step, a first movement step, a second movement step, and a rise step. In the descent step, the support portion 25 moves from the first support position PH to the second support position PL. The first movement step is performed after the retraction step. In the first movement step, the second suction portion 72 rotates about the rotation axis A, and moves from the second position P2 to the first position P1. The second movement step is performed after the first movement step. In the second movement step, the second suction portion 72 moves from the first position P1 to the third position P3. The rise step is performed after the first movement step. In the rise step, the support portion 25 moves from the second support position PL to the first support position PH. Therefore, in the retraction step, the second suction portion 72 can appropriately move from the second position P2 to the third position P3.

[0383] This invention is not limited to the embodiments described below, and can be implemented in various ways as follows.

[0384] In the above embodiment, the first branch 74A and the second branch 74B move parallel to each other in a horizontal direction orthogonal to the rotation axis A. However, this is not a limitation. For example, the first branch 74A and the second branch 74B may also rotate. Specifically, the first branch 74A may also rotate in a horizontal plane with its base end portion as the center. Similarly, the second branch 74B may also rotate in a horizontal plane with its base end portion as the center. Here, the base end portion of the first branch 74A is, for example, the portion of the first branch 74A connected to the hand drive unit 81. The base end portion of the second branch 74B is, for example, the portion of the second branch 74B connected to the hand drive unit 81.

[0385] In the above embodiment, the third position P3 is configured at the same height as the first position P1. However, it is not limited to this. The third position P3 may also be configured at a position higher than the first position P1.

[0386] In the above embodiment, the suction holding part 74 is connected to the motion drive part 84, but not to the rotating base 83. However, it is not limited to this. The suction holding part 74 may also be connected to both the motion drive part 84 and the rotating base 83. For example, the suction holding part 74 may also be slidably supported on the rotating base 83 relative to the rotating base 83. For example, the suction holding part 74 may also be oscillatingly supported on the rotating base 83 relative to the rotating base 83.

[0387] In the above embodiment, the position adjustment portion 65 contacts the end edge of the substrate W. However, it is not limited to this. For example, the shaft portion 64 may also contact the back surface WB of the substrate W. For example, the position adjustment portion 65 may also contact at least one of the end edge of the substrate W and the back surface WB of the substrate W. For example, the position adjustment portion 65 may also contact both the end edge of the substrate W and the back surface WB of the substrate W.

[0388] In the above embodiment, the support portion 25 includes a support pin 63. However, it is not limited to this. For example, the support portion 25 may also include a shelf. Here, the shelf of the support portion 25 extends in the horizontal direction (e.g., the front-to-back direction X) and contacts the substrate W. For example, the shelf of the support portion 25 may also have the same shape as the shelf 32 of the substrate mounting portion 27.

[0389] In the above embodiment, the substrate processing apparatus 1 includes two inversion units 24. However, it is not limited to this. The substrate processing apparatus 1 may also include one inversion unit 24. The substrate processing apparatus 1 may also include three or more inversion units 24.

[0390] At Figure 9In the illustrated example, the number of processing units 28 on which each substrate W is transported is one. However, this is not a limitation. The number of processing units 28 on which each substrate W is transported may be two or more. For example, in step S9, substrate W may be transported to two or more processing units 28. For example, substrate W may be transported to two or more processing units 28 after being removed from the reversing unit 24a and before being moved into the reversing unit 24b. For example, substrate W may be transported to two or more processing units 28 after step S14 and before step S15. For example, substrate W may be transported to one or more processing units 28 after being removed from the reversing unit 24b and before being moved into the substrate placement section 27b.

[0391] In the above embodiments, the substrate holding portion 36 of the processing unit 28 may, for example, be a Bernoulli chuck or a Bernoulli clamp. For example, the substrate holding portion 36 may also hold the substrate W by attracting it. For example, the substrate holding portion 36 may also have an attraction portion (not shown). Here, the attraction portion of the substrate holding portion 36 may also have a structure similar to the first attraction portion 42 or the second attraction portion 72 described above. The attraction portion of the substrate holding portion 36 may also be disposed below the substrate W supported on the substrate holding portion 36. The attraction portion of the substrate holding portion 36 may also allow gas to flow along the back surface WB of the substrate W supported on the substrate holding portion 36 to attract the substrate W downwards.

[0392] Alternatively, the substrate holding portion 36 may also be a mechanical chuck or a mechanical clamp. For example, the substrate holding portion 36 may also have an edge contact portion (not shown). Here, the edge contact portion of the substrate holding portion 36 may also contact the edge of the substrate W. The edge contact portion of the substrate holding portion 36 is preferably configured to hold the substrate W in such a way that the substrate W does not slide relative to the edge contact portion when the substrate holding portion 36 and the substrate W rotate.

[0393] Regarding the above-described embodiments and various modified embodiments, each component can be replaced with the components of other modified embodiments or combined with the components of other modified embodiments, etc., and appropriate changes can be made.

[0394] Explanation of reference numerals in the attached figures:

[0395] 1: Substrate processing device

[0396] 23: Moving and transporting organizations

[0397] 24, 24a, 24b: Inversion unit

[0398] 25, 25a, 25b: Support section

[0399] 26, 26a, 26b: Reversing mechanism

[0400] 29: Control Department

[0401] 41: Hands

[0402] 42: First attraction section

[0403] 45: Hand drive unit (transfer drive unit)

[0404] 54: Contracting Department

[0405] 65: Position Adjustment Section

[0406] 65a: Inclined surface

[0407] 67: Lifting drive unit

[0408] 69: Substrate Inspection Department

[0409] 71: Hands

[0410] 72: Part 2 of Attraction

[0411] 72A: Third attraction part

[0412] 72B: Fourth attraction part

[0413] 74: Attraction and Retention Section

[0414] 74A: Branch 1

[0415] 74B: Branch 2

[0416] 81: Hand drive unit

[0417] 82: Rotary drive unit

[0418] 83: Rotating base

[0419] 84: Mobile Drive Department

[0420] A, Aa, Ab: Rotation axes

[0421] J: Center of the substrate

[0422] K: Central axis

[0423] P1: Position 1

[0424] P2: Position 2

[0425] P3: Position 3

[0426] PH: First support position

[0427] PL: Second support position

[0428] W: substrate

[0429] W1: Page 1

[0430] W2: Side 2

[0431] WT: Top surface

[0432] WB: Back

[0433] WP1: The substrate attracted by the second suction part at position 1.

[0434] WP2: The substrate attracted by the second suction part at the second position.

[0435] WPH: The substrate supported by the support at the first support position.

[0436] WPL: The substrate supported by the support at the second support position.

[0437] X: Forward / backward direction

[0438] Y: Width direction

[0439] Z: Vertical direction

Claims

1. A substrate processing apparatus, wherein, have: The support portion contacts the substrate and supports the substrate in a horizontal position. The conveying mechanism transports the substrate to the support portion; and The reversing mechanism receives the substrate from the support portion, reverses the substrate, and delivers the substrate to the support portion. The conveying mechanism has the following features: The first suction section attracts the substrate without contacting it; and The conveying drive unit moves the first suction unit; The reversing mechanism has the following features: The second suction part attracts the substrate without contacting it; and The rotation drive unit causes the second attraction unit to rotate about a horizontal rotation axis; When the conveying mechanism conveys the substrate to the support portion, the first suction portion is located above the substrate. The first suction portion causes gas to flow along the upper surface of the substrate, thereby attracting the substrate upwards. Furthermore, the conveying drive portion moves the first suction portion to the support portion. When the reversing mechanism receives the substrate from the support portion, the second suction portion is positioned above the substrate supported on the support portion, and the second suction portion causes gas to flow along the upper surface of the substrate to attract the substrate upwards. The rotary drive unit rotates the second suction unit around the rotation axis, thereby moving the second suction unit to a first position where the second suction unit blows gas downwards and a second position where the second suction unit blows gas upwards. When the reversing mechanism delivers the substrate to the support portion, the second suction portion is located at the second position and does not attract the substrate. From the moment the substrate is handed over to the support portion by the reversing mechanism until the support portion hands over the substrate to the conveying mechanism, the second suction portion is always located in the second position.

2. A substrate processing apparatus, wherein, have: The support portion contacts the substrate and supports the substrate in a horizontal position. The conveying mechanism transports the substrate to the support portion; and The reversing mechanism receives the substrate from the support portion, reverses the substrate, and delivers the substrate to the support portion. The conveying mechanism has the following features: The first suction section attracts the substrate without contacting it; and The conveying drive unit moves the first suction unit; The reversing mechanism has the following features: The second suction part attracts the substrate without contacting it; and The rotation drive unit causes the second attraction unit to rotate about a horizontal rotation axis; When the conveying mechanism conveys the substrate to the support portion, the first suction portion is located above the substrate. The first suction portion causes gas to flow along the upper surface of the substrate, thereby attracting the substrate upwards. Furthermore, the conveying drive portion moves the first suction portion to the support portion. When the reversing mechanism receives the substrate from the support portion, the second suction portion is positioned above the substrate supported on the support portion, and the second suction portion causes gas to flow along the upper surface of the substrate to attract the substrate upwards. The rotary drive unit rotates the second suction unit around the rotation axis, thereby moving the second suction unit to a first position where the second suction unit blows gas downwards and a second position where the second suction unit blows gas upwards. When the second attraction part is located in the second position, the second attraction part is arranged in a top view on the inner side of the substrate supported by the support part in the radial direction.

3. A substrate processing apparatus, wherein, have: The support portion contacts the substrate and supports the substrate in a horizontal position. The conveying mechanism transports the substrate to the support portion; and The reversing mechanism receives the substrate from the support portion, reverses the substrate, and delivers the substrate to the support portion. The conveying mechanism has the following features: The first suction section attracts the substrate without contacting it; and The conveying drive unit moves the first suction unit; The reversing mechanism has the following features: The second suction part attracts the substrate without contacting it; and The rotation drive unit causes the second attraction unit to rotate about a horizontal rotation axis; When the conveying mechanism conveys the substrate to the support portion, the first suction portion is located above the substrate. The first suction portion causes gas to flow along the upper surface of the substrate, thereby attracting the substrate upwards. Furthermore, the conveying drive portion moves the first suction portion to the support portion. When the reversing mechanism receives the substrate from the support portion, the second suction portion is positioned above the substrate supported on the support portion, and the second suction portion causes gas to flow along the upper surface of the substrate to attract the substrate upwards. The rotary drive unit rotates the second suction unit around the rotation axis, thereby moving the second suction unit to a first position where the second suction unit blows gas downwards and a second position where the second suction unit blows gas upwards. The substrate processing apparatus includes a lifting drive unit. The lifting drive unit moves the support unit to a first support position and a second support position lower than the first support position. When the second attracting part is located in the first position, the second attracting part is positioned at a higher position than the substrate supported by the supporting part at the first supporting position. The height of the substrate attracted by the second attraction part at the second position is lower than the height of the substrate supported by the support part at the first support position, but higher than the height of the substrate supported by the support part at the second support position.

4. The substrate processing apparatus as claimed in claim 3, wherein, When the conveying mechanism delivers the substrate to the support portion, the support portion is located at the first support position. When the reversing mechanism receives the substrate from the support portion, the support portion is located in the first support position. When the reversing mechanism reverses the substrate, the support portion is located in the second support position. When the reversing mechanism delivers the substrate to the support portion, the support portion moves from the second support position to the first support position.

5. A substrate processing apparatus, wherein, have: The support portion contacts the substrate and supports the substrate in a horizontal position. The conveying mechanism transports the substrate to the support portion; and The reversing mechanism receives the substrate from the support portion, reverses the substrate, and delivers the substrate to the support portion. The conveying mechanism has the following features: The first suction section attracts the substrate without contacting it; and The conveying drive unit moves the first suction unit; The reversing mechanism has the following features: The second suction part attracts the substrate without contacting it; and The rotation drive unit causes the second attraction unit to rotate about a horizontal rotation axis; When the conveying mechanism conveys the substrate to the support portion, the first suction portion is located above the substrate. The first suction portion causes gas to flow along the upper surface of the substrate, thereby attracting the substrate upwards. Furthermore, the conveying drive portion moves the first suction portion to the support portion. When the reversing mechanism receives the substrate from the support portion, the second suction portion is positioned above the substrate supported on the support portion, and the second suction portion causes gas to flow along the upper surface of the substrate to attract the substrate upwards. The rotary drive unit rotates the second suction unit around the rotation axis, thereby moving the second suction unit to a first position where the second suction unit blows gas downwards and a second position where the second suction unit blows gas upwards. The reversing mechanism includes a movement drive unit. The moving drive unit moves the second suction unit from the first position to a third position where it does not interfere with the conveying mechanism. When the conveying mechanism delivers the substrate to the support portion, the second suction portion is located at the third position.

6. The substrate processing apparatus as claimed in claim 5, wherein, When the second attraction part is located in the third position, the second attraction part is arranged in a top view on the outer side of the substrate supported by the support part in the radial direction.

7. The substrate processing apparatus as claimed in claim 5, wherein, The reversing mechanism has the following features: The first branch is connected to the mobile drive unit; and The second branch is connected to the mobile drive unit; The second suction part includes: The third attraction portion is held at the first branch portion; and The fourth attraction part is held at the second branch; The moving drive unit widens or narrows the gap between the first branch and the second branch. The moving drive unit increases the distance between the first branch and the second branch, thereby moving the second attraction unit from the first position to the third position.

8. The substrate processing apparatus as claimed in claim 7, wherein, When the second suction portion is in the first position, the rotation axis is configured to pass between the first branch and the second branch in a top view. When the second suction part moves from the first position to the third position, the first branch and the second branch respectively move away from the axis of rotation when viewed from above. When the second suction part moves from the third position to the first position, the first branch and the second branch respectively approach the axis of rotation when viewed from above.

9. A substrate processing apparatus, wherein, have: The support portion contacts the substrate and supports the substrate in a horizontal position. The conveying mechanism transports the substrate to the support portion; and The reversing mechanism receives the substrate from the support portion, reverses the substrate, and delivers the substrate to the support portion. The conveying mechanism has the following features: The first suction section attracts the substrate without contacting it; and The conveying drive unit moves the first suction unit; The reversing mechanism has the following features: The second suction part attracts the substrate without contacting it; and The rotation drive unit causes the second attraction unit to rotate about a horizontal rotation axis; When the conveying mechanism conveys the substrate to the support portion, the first suction portion is located above the substrate. The first suction portion causes gas to flow along the upper surface of the substrate, thereby attracting the substrate upwards. Furthermore, the conveying drive portion moves the first suction portion to the support portion. When the reversing mechanism receives the substrate from the support portion, the second suction portion is positioned above the substrate supported on the support portion, and the second suction portion causes gas to flow along the upper surface of the substrate to attract the substrate upwards. When the reversing mechanism reverses the substrate, the second suction part moves from a position above the substrate to a position below the substrate. When the reversing mechanism delivers the substrate to the support portion, the second suction portion is located below the substrate and does not attract the substrate. The second suction part remains stationary from the time the reversing mechanism delivers the substrate to the support part until the support part delivers the substrate to the conveying mechanism.

10. A substrate processing apparatus, wherein, have: The support portion contacts the substrate and supports the substrate in a horizontal position. The conveying mechanism transports the substrate to the support portion; and The reversing mechanism receives the substrate from the support portion, reverses the substrate, and delivers the substrate to the support portion. The conveying mechanism has the following features: The first suction section attracts the substrate without contacting it; and The conveying drive unit moves the first suction unit; The reversing mechanism has the following features: The second suction part attracts the substrate without contacting it; and The rotation drive unit causes the second attraction unit to rotate about a horizontal rotation axis; When the conveying mechanism conveys the substrate to the support portion, the first suction portion is located above the substrate. The first suction portion causes gas to flow along the upper surface of the substrate, thereby attracting the substrate upwards. Furthermore, the conveying drive portion moves the first suction portion to the support portion. When the reversing mechanism receives the substrate from the support portion, the second suction portion is positioned above the substrate supported on the support portion, and the second suction portion causes gas to flow along the upper surface of the substrate to attract the substrate upwards. The rotary drive unit rotates the second suction unit around the rotation axis, thereby moving the second suction unit to a first position where the second suction unit blows gas downwards and a second position where the second suction unit blows gas upwards. The rotation axis is positioned lower than the second attraction portion located at the first position. The second suction part located at the first position is configured at a higher position than the second suction part located at the second position.

11. A substrate processing apparatus, wherein, have: The support portion contacts the substrate and supports the substrate in a horizontal position. The conveying mechanism transports the substrate to the support portion; and The reversing mechanism receives the substrate from the support portion, reverses the substrate, and delivers the substrate to the support portion. The conveying mechanism has the following features: The first suction part attracts the substrate without contacting it. The receiving portion is positioned lower than the substrate attracted by the first attracting portion, and is movable to a position where it overlaps with the periphery of the substrate attracted by the first attracting portion when viewed from above; and The conveying drive unit moves the first suction unit; The reversing mechanism has the following features: The second suction part attracts the substrate without contacting it; and The rotation drive unit causes the second attraction unit to rotate about a horizontal rotation axis; When the conveying mechanism conveys the substrate to the support portion, the first suction portion is located above the substrate. The first suction portion causes gas to flow along the upper surface of the substrate, thereby attracting the substrate upwards. Furthermore, the conveying drive portion moves the first suction portion to the support portion. When the reversing mechanism receives the substrate from the support portion, the second suction portion is positioned above the substrate supported on the support portion, and the second suction portion causes gas to flow along the upper surface of the substrate to attract the substrate upwards. The support portion includes a position adjustment portion for adjusting the position of the substrate in the horizontal direction. The position adjustment part has an inclined surface. The inclined surface faces downward and is inclined inward in the radial direction of the substrate supported by the support portion, and contacts the end edge of the substrate. When the conveying mechanism conveys the substrate to the support part, the receiving part lowers in a supporting state to deliver the substrate to the support part, and the inclined surface of the position adjustment part contacts the end edge of the substrate to adjust the position of the substrate.

12. A substrate reversal method, wherein, have: In the transfer step, the transfer mechanism equipped with the first suction unit transfers the substrate to the support unit; In the first supporting step, the supporting part receives the substrate from the conveying mechanism and supports the substrate in a horizontal position. In the first acquisition step, the reversing mechanism, which has a second attraction part, removes the substrate from the support part; The reversal step involves the reversal mechanism reversing the substrate; and In the second supporting step, the supporting part receives the substrate from the reversing mechanism and supports the substrate in a horizontal position. In the conveying step, the first suction part is located above the substrate. The first suction part causes gas to flow on the upper surface of the substrate, thereby attracting the substrate upwards. Furthermore, the first suction part moves to the support part. In the first acquisition step, the second suction part is located above the substrate supported by the support part, i.e., the first position, and the second suction part causes gas to flow on the upper surface of the substrate, thereby attracting the substrate upward. In the reversal step, while the second attracting part is attracting the substrate, the second attracting part rotates half a turn around the horizontal rotation axis and moves from the first position to the second position. In the first supporting step, the supporting part is stationary at the first supporting position. In the first acquisition step, the support portion remains stationary at the first support position. In the reversal step, the support portion moves from the first support position to a second support position lower than the first support position. In the second support step, the support part moves from the second support position to the first support position.

13. The substrate inversion method as described in claim 12, wherein, In the first support step, the position of the substrate in the horizontal direction is adjusted.

14. The substrate inversion method as described in claim 12, wherein, When the second attracting part is located in the first position, the second attracting part is positioned at a higher position than the substrate supported by the supporting part at the first supporting position. The height of the substrate attracted by the second suction part at the second position is lower than the height of the substrate supported by the support part at the first support position. The height of the substrate attracted by the second attraction part at the second position is higher than the height of the substrate supported by the support part at the second support position.

15. The substrate inversion method as described in claim 14, wherein, The height of the rotation axis is lower than the height of the second attraction part located at the first position. The height of the second attraction part located at the second position is lower than the height of the second attraction part located at the first position.

16. A substrate reversal method, wherein, have: In the transfer step, the transfer mechanism equipped with the first suction unit transfers the substrate to the support unit; In the first supporting step, the supporting part receives the substrate from the conveying mechanism and supports the substrate in a horizontal position. In the first acquisition step, the reversing mechanism, which has a second attraction part, removes the substrate from the support part; In the reversal step, the reversal mechanism reverses the substrate; In the second supporting step, the supporting part receives the substrate from the reversing mechanism and supports the substrate in a horizontal position. and In the second acquisition step, the conveying mechanism removes the substrate from the support portion. In the conveying step, the first suction part is located above the substrate. The first suction part causes gas to flow on the upper surface of the substrate, thereby attracting the substrate upwards. Furthermore, the first suction part moves to the support part. In the first acquisition step, the second suction part is located above the substrate supported by the support part, i.e., the first position, and the second suction part causes gas to flow on the upper surface of the substrate, thereby attracting the substrate upward. In the reversal step, while the second attracting part is attracting the substrate, the second attracting part rotates half a turn around the horizontal rotation axis and moves from the first position to the second position. From the second supporting step to the second acquiring step, the second attracting part remains stationary at the second position.

17. The substrate inversion method as described in claim 16, wherein, In the first support step, the position of the substrate in the horizontal direction is adjusted.

18. The substrate inversion method as described in claim 16, wherein, The substrate reversal method includes: In the retraction step, after the second acquisition step, the second suction unit moves from the second position to a third position where it does not interfere with the conveying mechanism. In the first supporting step, the second attracting part is located at the third position.

19. The substrate inversion method as described in claim 18, wherein, The retreat step includes: In the descent step, the support portion moves from the first support position to a second support position that is lower than the first support position; In the first moving step, after the descending step, the second suction part rotates about the rotation axis, and the second suction part moves from the second position to the first position; In the second moving step, after the first moving step, the second suction part moves from the first position to the third position; and In the rising step, after the first moving step, the support part moves from the second support position to the first support position.

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