A marker point identification method, device, equipment and storage medium

Abstract

The application discloses a kind of mark point identification method, device, equipment and storage medium.The mark point identification method includes: the shape and size of the figure in the signal line layer of printed circuit board design drawing are acquired, and the figure that shape and size meet preset condition is regarded as first figure;The relative position relationship of first figure and the solder mask layer of printed circuit board design drawing is acquired, and according to the relative position relationship, the first figure exposed relative to the solder mask layer is regarded as second figure;The arrangement mode of second figure is acquired, and the second figure that arrangement mode does not conform to matrix distribution is determined as third figure;Determine the third figure that does not intersect with all figures in third figure as fourth figure;The distance of fourth figure and the patch chip figure of printed circuit board design drawing is acquired, and the fourth figure within the distance in the preset distance range is determined as mark point.The technical scheme of the embodiment of the application improves the mark point identification efficiency and accuracy.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board technology, and in particular to a method, apparatus, device, and storage medium for identifying marker points. Background Technology

[0002] With the development of automation technology, the soldering of components on printed circuit boards (PCBs) is becoming increasingly automated.

[0003] To facilitate the soldering of surface mount chips, marking points, or optical points, need to be designed on the printed circuit board to indicate the position, pins, or orientation of the surface mount chips, thereby enabling automatic placement machines to accurately position the surface mount chips on the PCB.

[0004] However, existing marker identification relies on human visual recognition, which is not accurate and is prone to omission, resulting in low efficiency and accuracy of marker identification. Summary of the Invention

[0005] This invention provides a marker identification method, apparatus, device, and storage medium to solve the problem of low efficiency and accuracy in marker identification.

[0006] According to one aspect of the present invention, a marker recognition method is provided, the marker recognition method comprising:

[0007] Obtain the shape and size of the graphic in the signal line layer of the printed circuit board design, and use the graphic whose shape and size meet the preset conditions as the first graphic;

[0008] Obtain the relative positional relationship between the first pattern and the solder mask layer of the printed circuit board design; based on the relative positional relationship, use the first pattern exposed relative to the solder mask layer as the second pattern.

[0009] Obtain the arrangement of the second graphic, and determine the second graphic whose arrangement does not conform to the matrix distribution as the third graphic;

[0010] The third figure that does not intersect with any of the other figures is identified as the fourth figure.

[0011] The distance between the fourth graphic and the surface mount chip graphic of the printed circuit board design is obtained, and the fourth graphic whose distance is within a preset distance range is determined as a marker point.

[0012] Optionally, the signal line layer includes at least a top layer and a bottom layer; obtaining the shape and size of the pattern in the signal line layer of the printed circuit board design, and using the pattern whose shape and size meet preset conditions as the first pattern, includes:

[0013] Obtain the shapes of the top and bottom layers of the signal line layer, and use the shapes that conform to a preset shape as the initial shape; wherein, the preset shape includes a circle and / or a rectangle;

[0014] Obtain the size of the initial graphic, and use the initial graphic whose size is within a preset size range as the first graphic.

[0015] Optionally, obtaining the size of the initial graphic and using the initial graphic whose size is within a preset size range as the first graphic includes:

[0016] Obtain the diameter of the initial shape, and use the initial shape whose diameter is within a preset diameter range as the first shape;

[0017] And / or, obtain the first length of the first side and the second length of the second side of the initial shape, and take the initial shape with the first length within a first preset length range and the second length within a second preset length range as the first shape; wherein, the first side is perpendicular to the second side.

[0018] Optionally, determining the third figure that does not intersect with any of the other figures as the fourth figure includes:

[0019] The third graphic that does not intersect with any other graphic in its layer is identified as the first isolated graphic.

[0020] The first isolated graphic that does not intersect with any graphic in the ribbon layer of the printed circuit board design is identified as the second isolated graphic.

[0021] The second isolated pattern that does not intersect with any pattern in the via layer of the printed circuit board design is identified as the fourth pattern; wherein the via layer includes at least one of via layer, blind via layer and buried via layer.

[0022] Optionally, after determining that the fourth graphic whose distance is within a preset distance range is a marker point, the method further includes:

[0023] The position coordinates of the marked point are determined and sent to the pick-and-place machine so that the pick-and-place machine can solder the chip according to the position coordinates.

[0024] Optionally, after determining that the fourth graphic whose distance is within a preset distance range is a marker point, the method further includes:

[0025] Draw lines around the marked point to select it; wherein the lines include straight lines or curves.

[0026] Optionally, before obtaining the shape and size of the graphic in the signal line layer of the printed circuit board design, and using the graphic whose shape and size satisfy a preset condition as the first graphic, the method further includes:

[0027] Search all layers of the printed circuit board design and filter out the signal line layer.

[0028] According to another aspect of the present invention, a marker recognition device is provided, the marker recognition device comprising:

[0029] The first pattern determination module is used to obtain the shape and size of the pattern in the signal line layer of the printed circuit board design, and to take the pattern whose shape and size meet the preset conditions as the first pattern;

[0030] The second pattern determination module is used to obtain the relative positional relationship between the first pattern and the solder mask layer of the printed circuit board design, and to take the first pattern exposed relative to the solder mask layer as the second pattern.

[0031] The third graphic determination module is used to obtain the arrangement of the second graphic and determine the second graphic whose arrangement does not conform to the matrix distribution as the third graphic;

[0032] The fourth graphic determination module is used to determine the fourth graphic as the graphic in the third graphic that does not intersect with any other graphic.

[0033] The marker point determination module is used to obtain the distance between the fourth graphic and the surface mount chip graphic of the printed circuit board design, and determine the fourth graphic whose distance is within a preset distance range as a marker point.

[0034] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0035] At least one processor; and

[0036] A memory communicatively connected to the at least one processor; wherein,

[0037] The memory stores a computer program that can be executed by the at least one processor, which enables the at least one processor to perform the marker recognition method according to any embodiment of the present invention.

[0038] According to another aspect of the present invention, a computer-readable storage medium is provided, the computer-readable storage medium storing computer instructions for causing a processor to execute and implement the marker point recognition method according to any embodiment of the present invention.

[0039] The technical solution of this invention uses a first graphic whose shape and size meet preset conditions, a second graphic exposed relative to the solder mask layer, a third graphic that does not conform to the matrix distribution, a fourth graphic that does not intersect with any other graphic, and a fourth graphic whose distance from the surface mount chip graphic on the printed circuit board design is within a preset distance range as a marker point. This means that marker point identification can be achieved through several rounds of screening, thereby improving the speed of marker point identification. The identified marker points meet preset conditions in shape and size, are not covered by the solder mask layer, do not conform to the matrix distribution, do not intersect with any other graphic, and are within a preset distance range from the surface mount chip graphic. Therefore, the identified marker points satisfy all the characteristics of a marker point, and can be accurately identified, thus improving the efficiency and accuracy of marker point identification.

[0040] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a flowchart of a marker point recognition method provided in an embodiment of the present invention;

[0043] Figure 2 This is a flowchart of another marker point recognition method provided in an embodiment of the present invention;

[0044] Figure 3 This is a flowchart of another marker point recognition method provided in an embodiment of the present invention;

[0045] Figure 4 This is a schematic diagram of a marker recognition result provided by an embodiment of the present invention;

[0046] Figure 5 This is a schematic diagram of the structure of a marker point recognition device provided in an embodiment of the present invention;

[0047] Figure 6 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention. Detailed Implementation

[0048] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0049] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0050] Figure 1 This is a flowchart of a marker point recognition method provided in an embodiment of the present invention, such as... Figure 1 As shown, the marker recognition method includes:

[0051] S101. Obtain the shape and size of the graphic in the signal line layer of the printed circuit board design, and use the graphic whose shape and size meet the preset conditions as the first graphic.

[0052] Specifically, the printed circuit board design includes at least one signal line layer, which includes chip patterns, chip pin patterns, marker point patterns, and connection line patterns. By acquiring the shape and size of each pattern, patterns whose shape and size meet preset conditions can be selected and used as the first pattern. By selecting patterns whose shape and size meet the preset conditions, larger patterns, such as larger chip patterns, can be excluded; longer connection line patterns can also be excluded; this facilitates narrowing the selection range and determining the marker points.

[0053] The shape and size meet preset conditions. For example, the shape of the graphic meets a preset shape, and the size of the image meets a preset size. The preset shape and preset size can be determined based on the shape and size of the marker points. For example, when the marker points in the printed circuit board design include circular marker points, rectangular marker points, and elliptical marker points, the preset shape can be circular, rectangular, or elliptical. In some other embodiments, the preset shape can also be an annular. For example, when the preset shape is circular, the preset size is, for example, a preset diameter; when the preset shape is rectangular, the preset size is, for example, a preset length and a preset width; when the preset shape is elliptical, the preset size is, for example, a preset major axis length and a preset minor axis length. The specific preset size can be determined based on the size range of the marker points.

[0054] S102. Obtain the relative positional relationship between the first pattern and the solder mask layer of the printed circuit board design. Based on the relative positional relationship, the first pattern exposed relative to the solder mask layer is taken as the second pattern.

[0055] Specifically, the solder mask layer covers the surface of some patterns that do not require soldering, while the marker points are exposed relative to the solder mask layer, meaning the marker points are completely exposed relative to the solder mask layer. The relative positional relationship between the first pattern and the solder mask layer includes, for example, the first pattern being completely covered by the solder mask layer, the first pattern being partially covered by the solder mask layer, and the first pattern being exposed relative to the solder mask layer. By selecting the first pattern that is exposed relative to the solder mask layer and using it as the second pattern, the selection range can be further narrowed.

[0056] S103. Obtain the arrangement of the second graphic and determine the second graphic whose arrangement does not conform to the matrix distribution as the third graphic.

[0057] Specifically, each chip typically corresponds to one marker point, and these marker points are isolated from each other, as are the patterns of the marker points and chip pins. By obtaining the arrangement of the second patterns, we can filter out second patterns that conform to the matrix distribution, and we can also filter out second patterns that do not conform to the matrix distribution. The second patterns that conform to the matrix distribution are recorded as chip pin patterns, and the second patterns that do not conform to the matrix distribution are used as third patterns, thereby further narrowing down the filtering range and making it easier to filter out the marker points.

[0058] S104. Determine the third figure that does not intersect with any other figure as the fourth figure.

[0059] Specifically, markers are used to identify the location of surface-mount chips, the first pin of a surface-mount chip, or the orientation of a surface-mount chip. These markers do not intersect with any other shapes in the design drawing; that is, they do not intersect with the chip's shape, the chip's pin shape, vias, or the routing tape. Therefore, using the third shape (which does not intersect with any other shape) as the fourth shape further narrows down the selection range, making it easier to identify the markers.

[0060] S105. Obtain the distance between the fourth graphic and the surface mount chip graphic of the printed circuit board design, and determine the fourth graphic within the preset distance range as the marker point.

[0061] Specifically, the distance between each fourth graphic and the surface mount chip graphic is obtained. For example, the distance between the center of the fourth graphic and the center of the surface mount chip can be obtained. Fourth graphics within a preset distance range are designated as marker points, thereby identifying marker points in the printed circuit board design, facilitating subsequent soldering of the surface mount chip. The preset distance range is, for example, greater than 0.6 mm, but can also be other distance ranges, determined according to actual conditions; this embodiment does not impose limitations. After identifying all marker points, the number of marker points and the size of each marker point can also be determined.

[0062] The technical solution of this embodiment uses a first graphic whose shape and size meet preset conditions as the first graphic, a first graphic exposed relative to the solder mask layer as the second graphic, a second graphic that does not conform to the matrix distribution as the third graphic, a third graphic that does not intersect with any other graphic as the fourth graphic, and a fourth graphic whose distance from the surface mount chip graphic of the printed circuit board design is within a preset distance range as the marker point. That is, by several screenings, the marker point can be identified, thereby improving the speed of marker point identification. The identified marker points meet the preset conditions in shape and size, are not covered by the solder mask layer, do not conform to the matrix distribution, do not intersect with any other graphic, and are within a preset distance range from the surface mount chip graphic. Therefore, the identified marker points satisfy all the characteristics of a marker point, and can be accurately identified, thereby improving the efficiency and accuracy of marker point identification.

[0063] Figure 2 This is a flowchart of another marker recognition method provided by an embodiment of the present invention, such as... Figure 2 As shown, the marker recognition method includes:

[0064] S201. Search all layers of the printed circuit board design and filter out the signal line layers.

[0065] Specifically, a printed circuit board design may include at least one signal line layer, via layer, router layer, solder mask layer, and silkscreen layer. By searching all layers of the printed circuit board design, the signal line layer can be filtered out, making it easier to select marker points from the signal line layer.

[0066] S202. Obtain the shapes of the top and bottom layers of the signal line layer, and use the shapes that conform to the preset shapes as the initial shapes; wherein, the preset shapes include circles and / or rectangles.

[0067] Specifically, the signal line layer includes at least a top layer and a bottom layer. In some other embodiments, the signal line layer may also include an intermediate layer located between the top and bottom layers, but the marker points are not set in the intermediate layer. Therefore, filtering is performed from the top and bottom layers of the signal line layer. By acquiring the shape of each graphic and comparing it with a preset shape, graphics that conform to the preset shape can be selected. These graphics that conform to the preset shape are used as initial graphics, and then filtering is performed from all the initial graphics to narrow down the filtering range and facilitate the selection of marker points. The preset shape may include, for example, a circle, a rectangle, a circle and a rectangle, or a ring.

[0068] S203. Obtain the size of the initial graphic and use the initial graphic whose size is within the preset size range as the first graphic.

[0069] Specifically, by obtaining the dimensions of the initial graphic, the obtained dimensions are compared with a preset size range. If the dimensions are within the preset size range, the corresponding initial graphic is used as the first graphic. This filters out graphics that are too large or too small, i.e., excluding larger chip graphics and larger connecting line graphics, thus narrowing the filtering range and facilitating the selection of marker points. The preset size range can be determined based on the dimensions of the marker points. For example, the preset size range could be a preset diameter range, a preset length range, a preset width range, or other types of size ranges, such as 18mil to 100mil, or other numerical ranges. The specific range can be determined based on actual conditions, such as empirical size values ​​of the marker points; this embodiment does not impose any limitations.

[0070] S204. Obtain the relative positional relationship between the first pattern and the solder mask layer of the printed circuit board design. Based on the relative positional relationship, use the first pattern exposed relative to the solder mask layer as the second pattern.

[0071] S205. Obtain the arrangement of the second graphic and determine the second graphic whose arrangement does not conform to the matrix distribution as the third graphic.

[0072] S206. Determine the third figure that does not intersect with any other figure as the fourth figure.

[0073] S207. Obtain the distance between the fourth graphic and the surface mount chip graphic of the printed circuit board design, and determine the fourth graphic within the preset distance range as the marker point.

[0074] Based on the above technical solution, optionally, S203, obtaining the size of the initial graphic and using the initial graphic whose size is within a preset size range as the first graphic, includes:

[0075] Step a: Obtain the diameter of the initial shape, and use the initial shape whose diameter is within the preset diameter range as the first shape.

[0076] Specifically, when the marking points in the printed circuit board design include circular marking points, the diameter of the initial shape is compared with a preset diameter range. The initial shape with a diameter within the preset diameter range is selected as the first shape, thus filtering out the first shape whose size and shape match the size and shape of the marking point.

[0077] Step b: Obtain the first length of the first side and the second length of the second side of the initial shape, and take the initial shape with the first length within the first preset length range and the second length within the second preset length range as the first shape; wherein, the first side is perpendicular to the second side.

[0078] Specifically, when the markers in the printed circuit board design include rectangular markers, the first length of the first side of the initial graphic is compared with the first preset length range, and the second length of the second side of the initial graphic is compared with the second preset length range. The initial graphic with the first length within the first preset length range and the second length within the second preset length range is selected as the first graphic. Thus, the first graphic whose size and shape match the size and shape of the marker is selected.

[0079] It should be noted that the order of steps a and b can be interchanged. Step S203 may include step a, step b, or both steps a and b.

[0080] Figure 3 This is a flowchart of another marker recognition method provided by an embodiment of the present invention, such as... Figure 3 As shown, the marker recognition method includes:

[0081] S301. Search all layers of the printed circuit board design and filter out the signal line layers.

[0082] S302. Obtain the shapes of the top and bottom layers of the signal line layer, and use the shapes that conform to the preset shapes as the initial shapes; wherein, the preset shapes include circles and / or rectangles.

[0083] S303. Obtain the size of the initial graphic and use the initial graphic whose size is within the preset size range as the first graphic.

[0084] S304. Obtain the relative positional relationship between the first pattern and the solder mask layer of the printed circuit board design. Based on the relative positional relationship, use the first pattern exposed relative to the solder mask layer as the second pattern.

[0085] S305. Obtain the arrangement of the second graphic and determine the second graphic whose arrangement does not conform to the matrix distribution as the third graphic.

[0086] S306. Determine the third graphic in the third graphic that does not intersect with any graphic in its layer as the first isolated graphic.

[0087] Specifically, if the marker point does not intersect with any of the graphics, the third graphics that do not intersect with any of the graphics in their layer are first isolated graphics. For example, you can determine whether the third graphics intersect with the graphics in their layer by checking if there are connecting lines. If the third graphics do not have connecting lines, then the third graphics do not intersect with the graphics in their layer; thus, the filtering range can be narrowed.

[0088] S307. Determine the first isolated graphic that does not intersect with any graphic in the ribbon layer of the printed circuit board design as the second isolated graphic.

[0089] Specifically, the routing layer includes routing patterns. The routing patterns provide shape and size references for the milling process of the printed circuit board, facilitating the creation of the printed circuit board shape according to user requirements. From the first isolated patterns, a second isolated pattern is selected that does not intersect with any patterns in the routing layer of the printed circuit board design. This further narrows the selection range, making it easier to identify marker points.

[0090] S308. Determine the second isolated pattern that does not intersect with any pattern in the via layer of the printed circuit board design as the fourth pattern; wherein the via layer includes at least one of via layer, blind via layer and buried via layer.

[0091] Specifically, the via layer includes the pattern of vias. The via layer includes at least one of via layer, blind via layer and buried via layer. The second isolated pattern that does not intersect with any pattern in the via layer is the fourth pattern. That is, the fourth pattern is a pattern that does not intersect with any pattern, thereby further narrowing the screening range and making it easier to screen out the marker points so as to realize the identification of the marker points.

[0092] S309. Obtain the distance between the fourth graphic and the surface mount chip graphic of the printed circuit board design, and determine the fourth graphic within the preset distance range as the marker point.

[0093] S310. Draw lines around the marker to select the marker; the lines may be straight lines or curves.

[0094] Specifically, after determining the marker point, draw a straight line or curve around the marker point to select it. The color of the line can be different from the color of the marker point, so that the marker point can be visually represented and all marker points can be viewed. Figure 4 This is a schematic diagram of a marker recognition result provided by an embodiment of the present invention, as shown below. Figure 4 As shown, by employing the marker point recognition method of this embodiment, marker point A was identified and selected by bounding box, facilitating a clear and intuitive representation of marker point A. It should be noted that, in order to clearly represent marker point A, Figure 4 The text only includes a portion of the printed circuit board design diagram for explanation.

[0095] S311. Determine the position coordinates of the marker point and send the position coordinates to the pick-and-place machine so that the pick-and-place machine can solder the chip according to the position coordinates.

[0096] Specifically, after identifying the marker point, the position coordinates of the marker point are determined and sent to the pick-and-place machine, for example, to the pick-and-place machine's controller. The pick-and-place machine can then determine the position of the chip and the position of the chip's first pin based on the marker point's position coordinates, thereby accurately soldering the chip and avoiding misalignment when soldering the pins of the chip signal, ensuring that the printed circuit board can work normally.

[0097] Figure 5 This is a schematic diagram of the structure of a marker point recognition device provided in an embodiment of the present invention. Figure 5As shown, the marker point identification device includes: a first pattern determination module 401, a second pattern determination module 402, a third pattern determination module 403, a fourth pattern determination module 404, and a marker point determination module 405. The first pattern determination module 401 is used to obtain the shape and size of the pattern in the signal line layer of the printed circuit board design, and to identify the pattern whose shape and size meet the preset conditions as the first pattern. The second pattern determination module 402 is used to obtain the relative positional relationship between the first pattern and the solder mask layer of the printed circuit board design, and to identify the first pattern exposed relative to the solder mask layer as the second pattern. The third pattern determination module 403 is used to obtain the arrangement of the second pattern, and to identify the second pattern whose arrangement does not conform to the matrix distribution as the third pattern. The fourth pattern determination module 404 is used to identify the third pattern that does not intersect with any other pattern as the fourth pattern. The marker point determination module 405 is used to obtain the distance between the fourth pattern and the surface mount chip pattern of the printed circuit board design, and to identify the fourth pattern whose distance is within the preset distance range as a marker point.

[0098] Optionally, the first pattern determination module 401 is specifically used to obtain the shape of the pattern in the top and bottom layers of the signal line layer, and to take the pattern whose shape conforms to the preset shape as the initial pattern; wherein, the preset shape includes a circle and / or a rectangle; to obtain the size of the initial pattern, and to take the initial pattern whose size is within the preset size range as the first pattern.

[0099] Optionally, the fourth graphic determination module 404 is specifically used to determine the third graphic that does not intersect with all graphics in its layer as the first isolated graphic; to determine the first isolated graphic that does not intersect with all graphics in the ribbon layer of the printed circuit board design as the second isolated graphic; and to determine the second isolated graphic that does not intersect with all graphics in the via layer of the printed circuit board design as the fourth graphic; wherein the via layer includes at least one of via layer, blind via layer, and buried via layer.

[0100] Optionally, the marker recognition device also includes a position coordinate sending module, which is used to determine the position coordinates of the marker and send the position coordinates to the pick-and-place machine so that the pick-and-place machine can solder the chip according to the position coordinates.

[0101] Optionally, the marker recognition device further includes a selection module, which is used to draw lines around the marker to select the marker; wherein the lines include straight lines or curves.

[0102] The marker recognition device provided in the embodiments of the present invention can execute the marker recognition method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the method.

[0103] Figure 6This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention, such as... Figure 6 As shown, Figure 6 A schematic diagram of an electronic device 10 that can be used to implement embodiments of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0104] like Figure 6 As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12 or a random access memory (RAM) 13, communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the ROM 12 or loaded from storage unit 18 into the RAM 13. The RAM 13 may also store various programs and data required for the operation of the electronic device 10. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0105] Multiple components in electronic device 10 are connected to I / O interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of displays, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication unit 19, such as network card, modem, wireless transceiver, etc. Communication unit 19 allows electronic device 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0106] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as marker point recognition methods.

[0107] In some embodiments, the marker point recognition method may be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program may be loaded and / or mounted on electronic device 10 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the marker point recognition method described above may be performed. Alternatively, in other embodiments, processor 11 may be configured to perform the marker point recognition method by any other suitable means (e.g., by means of firmware).

[0108] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0109] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0110] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0111] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0112] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or computing systems that include middleware components (e.g., application servers), or computing systems that include frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0113] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0114] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and no limitation is imposed herein.

[0115] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A marker point recognition method, characterized in that, include: Obtain the shape and size of the graphic in the signal line layer of the printed circuit board design, and use the graphic whose shape and size meet the preset conditions as the first graphic; Obtain the relative positional relationship between the first pattern and the solder mask layer of the printed circuit board design; based on the relative positional relationship, use the first pattern exposed relative to the solder mask layer as the second pattern. Obtain the arrangement of the second graphic, and determine the second graphic whose arrangement does not conform to the matrix distribution as the third graphic; The third figure that does not intersect with any of the other figures is identified as the fourth figure. Obtain the distance between the fourth graphic and the surface mount chip graphic of the printed circuit board design, and determine the fourth graphic whose distance is within a preset distance range as a marker point; The signal line layer includes at least a top layer and a bottom layer; Obtain the shape and size of the graphics in the signal line layer of the printed circuit board design, and select the graphics whose shape and size meet preset conditions as the first graphics, including: Obtain the shapes of the top and bottom layers of the signal line layer, and use the shapes that conform to a preset shape as the initial shape; wherein, the preset shape includes a circle and / or a rectangle; Obtain the size of the initial graphic, and use the initial graphic whose size is within a preset size range as the first graphic.

2. The method according to claim 1, characterized in that, Obtaining the size of the initial graphic, and using the initial graphic whose size is within a preset size range as the first graphic, includes: Obtain the diameter of the initial shape, and use the initial shape whose diameter is within a preset diameter range as the first shape; And / or, obtain the first length of the first side and the second length of the second side of the initial shape, and take the initial shape with the first length within a first preset length range and the second length within a second preset length range as the first shape; wherein, the first side is perpendicular to the second side.

3. The method according to claim 1, characterized in that, The third figure that does not intersect with any other figure is identified as the fourth figure, including: The third graphic that does not intersect with any other graphic in its layer is identified as the first isolated graphic. The first isolated graphic that does not intersect with any graphic in the ribbon layer of the printed circuit board design is identified as the second isolated graphic. The second isolated pattern that does not intersect with any pattern in the via layer of the printed circuit board design is identified as the fourth pattern; wherein the via layer includes at least one of via layer, blind via layer and buried via layer.

4. The method according to claim 1, characterized in that, After determining that the fourth graphic whose distance is within the preset distance range is a marker point, the method further includes: The position coordinates of the marked point are determined and sent to the pick-and-place machine so that the pick-and-place machine can solder the chip according to the position coordinates.

5. The method according to claim 1, characterized in that, After determining that the fourth graphic whose distance is within the preset distance range is a marker point, the method further includes: Draw lines around the marked point to select it; wherein the lines include straight lines or curves.

6. The method according to claim 1, characterized in that, Before obtaining the shape and size of the graphic in the signal line layer of the printed circuit board design, and selecting the graphic whose shape and size meet preset conditions as the first graphic, the process further includes: Search all layers of the printed circuit board design and filter out the signal line layer.

7. A marker point recognition device, characterized in that, include: The first pattern determination module is used to obtain the shape and size of the pattern in the signal line layer of the printed circuit board design, and to take the pattern whose shape and size meet the preset conditions as the first pattern; The second pattern determination module is used to obtain the relative positional relationship between the first pattern and the solder mask layer of the printed circuit board design, and to take the first pattern exposed relative to the solder mask layer as the second pattern. The third graphic determination module is used to obtain the arrangement of the second graphic and determine the second graphic whose arrangement does not conform to the matrix distribution as the third graphic; The fourth graphic determination module is used to determine the fourth graphic as the graphic in the third graphic that does not intersect with any other graphic. The marker point determination module is used to obtain the distance between the fourth graphic and the surface mount chip graphic of the printed circuit board design, and determine the fourth graphic whose distance is within a preset distance range as a marker point; The first pattern determination module is further configured to: obtain the shapes of the patterns in the top and bottom layers of the signal line layer, and use the patterns whose shapes conform to a preset shape as the initial pattern; wherein the preset shape includes a circle and / or a rectangle; and obtain the size of the initial pattern, and use the initial pattern whose size is within a preset size range as the first pattern.

8. An electronic device, characterized in that, The electronic device includes: At least one processor; and A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the marker recognition method according to any one of claims 1-6.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that cause a processor to execute the marker recognition method according to any one of claims 1-6.

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