Transfer device and position correction method of transfer device

Abstract

The present invention provides a transfer device and a method for correcting the position of the transfer device, which can measure the position of the transfer substrate holding part, the position of the substrate to be transferred holding part, and the position of the component measurement camera based on the laser irradiation position without accumulating measurement errors. Specifically, the transfer device (1) includes a laser irradiation part (2), a transfer substrate holding part (6), a substrate to be transferred holding part (10), a component measurement camera (14), a holding part measurement camera (16), and a control part (18), and transfers the components held on the transfer substrate (C1) to the substrate to be transferred (C2). The transfer substrate holding part (6) has a reference mark (9b) for the transfer substrate, and the substrate to be transferred holding part (10) has a reference mark (13b) for the substrate to be transferred marked on the fluorescent glass. The component measurement camera (14) is configured to be able to photograph the reference mark (9b) for the transfer substrate and the reference mark (13b) for the substrate to be transferred, and the holding part measurement camera (16) is configured to be able to simultaneously photograph the fluorescence emission point (F) when the laser (L) is irradiated on the fluorescent glass and the reference mark (13b) for the substrate to be transferred.

Description

Technical Field

[0001] The present invention relates to a transfer device and a method for correcting the position of the transfer device. Background Art

[0002] In the past, in elements such as LEDs (Light Emitting Diodes) and RFID (Radio Frequency Identification), miniaturization of chip size has been carried out. For example, in recent years, LEDs are being produced as micro-LEDs having a size of about 20 μm. It is technically difficult to mount such micro-LEDs using a mounter that processes individual elements, and a decrease in productivity has become a problem. Therefore, for example, the installation of fine elements such as the micro-LEDs onto a circuit board is performed by laser-based magnifying transfer or the like, instead of installation using the mounter. For example, the invention described in Patent Document 1.

[0003] In the manufacturing method based on laser transfer described in Patent Document 1, strip-shaped laser light is irradiated onto LEDs formed in a lattice pattern on a wafer. The LEDs are transferred onto a transfer substrate together in one or more rows at a time. For the multiple LEDs transferred onto the transfer substrate, they are again transferred onto another transfer substrate together in one or more rows at a time using strip-shaped laser light. In such a manufacturing method based on the laser transfer, it is possible to mount the micro-LEDs on the transfer substrate without individually processing the tiny LEDs. In addition, since multiple LEDs are mounted on the transfer substrate each time using strip-shaped laser light, the productivity can be improved as compared with the case of mounting one by one using the mounter.

[0004] A transfer device that transfers the LEDs using such a manufacturing method based on laser transfer needs to irradiate the LEDs with laser light with an accuracy corresponding to the size of the LEDs to be transferred. For example, when the size of the LEDs is about 10 μm, in order not to irradiate the adjacent LEDs with laser light, the accuracy of the irradiation position of the laser in the transfer device is required to be about 5 μm. In addition, the transfer device must, within a specified accuracy, make the position of the transfer substrate provided with the LEDs as the transfer source, the position of the transfer substrate as the transfer destination of the LEDs, and the position of the element (LED) position measurement camera that measures the position of the LEDs coincide with the irradiation position of the laser.

[0005] The irradiation position of the laser, which is non-visible light, cannot be directly confirmed by a camera or the like. Therefore, for example, the irradiation mark formed after irradiating a chromium-coated film substrate or the like with the laser can be used to measure the irradiation position of the laser. However, the chromium-coated film substrate needs to be replaced regularly. In addition, it is necessary to separately measure the positional relationship between the irradiation position of the laser and the transfer substrate holding part that holds the transfer substrate, and the positional relationship between the irradiation position of the laser and the substrate to be transferred holding part that holds the substrate to be transferred, using the reference points of the transfer substrate holding part and the substrate to be transferred holding part. That is, in the position correction using the chromium-coated film substrate or the like, the measurement of the irradiation position of the laser, the measurement of the position of the transfer substrate holding part relative to the irradiation position of the laser, the measurement of the position of the substrate to be transferred holding part relative to the irradiation position of the laser, and the measurement of the position of the component measurement camera relative to the irradiation position of the laser are respectively performed. Therefore, it is disadvantageous in terms of cumulative measurement error.

[0006] Prior Art Documents

[0007] Patent Documents

[0008] Patent Document 1: Japanese Patent Application Laid-Open No. 2010-161221 Summary of the Invention

[0009] Problems to be Solved by the Invention

[0010] An object of the present invention is to provide a transfer device and a position correction method for the transfer device, which can measure the positions of a transfer substrate holding part, a substrate to be transferred holding part, and a component measurement camera based on the irradiation position of a laser without cumulative measurement error.

[0011] Means for Solving the Problems

[0012] The problems to be solved by the present invention are as described above. Next, the means for solving the problems will be described.

[0013] That is, the transfer device of the first invention includes: a laser irradiation unit that irradiates a laser on an element held on a transfer substrate; a transfer substrate holding unit that holds the transfer substrate and moves the element held on the transfer substrate to the irradiation position of the laser; a substrate to be transferred holding unit that holds the substrate to be transferred so as to face the element held on the transfer substrate with a gap therebetween and moves the substrate to be transferred to the transfer position of the element; an element measurement camera that measures the relative position of the element held on the transfer substrate with respect to the irradiation position of the laser; a holding unit measurement camera that measures at least one of the relative position of the transfer substrate holding unit with respect to the irradiation position of the laser and the relative position of the substrate to be transferred holding unit with respect to the irradiation position of the laser; and a control unit that controls the laser irradiation unit, the transfer substrate holding unit, and the substrate to be transferred holding unit so that the element is separated from the transfer substrate and a force is applied thereto toward the substrate to be transferred for transfer. The transfer device transfers the element held on the transfer substrate to the substrate to be transferred.

[0014] The transfer substrate holding unit has a reference mark for the transfer substrate. The substrate to be transferred holding unit has a reference mark for the substrate to be transferred, and the reference mark for the substrate to be transferred is marked on a fluorescent light-emitting member that emits fluorescence by irradiation with the laser. The element measurement camera is configured to be able to photograph the reference mark for the transfer substrate and the reference mark for the substrate to be transferred. The holding unit measurement camera is configured to be able to simultaneously photograph the fluorescent light-emitting point when the fluorescent light-emitting member marked with the reference mark for the substrate to be transferred is irradiated with the laser and the reference mark for the substrate to be transferred.

[0015] In the transfer device of the second invention, the control unit irradiates a fluorescent light-emitting component marked with the reference mark for the substrate to be transferred with laser light using the laser irradiation unit. The control unit measures, using the holding unit, the fluorescent light-emitting point of the fluorescent light-emitting component marked with the reference mark for the substrate to be transferred and the reference mark for the substrate to be transferred by the camera, and calculates the relative position of the reference mark for the substrate to be transferred with respect to the fluorescent light-emitting point of the fluorescent light-emitting component marked with the reference mark for the substrate to be transferred. Next, the control unit corrects the position of the substrate holding unit for the substrate to be transferred with respect to the irradiation position of the laser, and measures the reference mark for the substrate to be transferred by the component measurement camera, and calculates the relative position of the component measurement camera with respect to the reference mark for the substrate to be transferred. Next, the control unit corrects the position of the component measurement camera with respect to the substrate holding unit for the substrate to be transferred, and measures the reference mark for the transfer substrate by the component measurement camera, and calculates the relative position of the reference mark for the transfer substrate with respect to the component measurement camera. Then, the control unit corrects the position of the transfer substrate holding unit with respect to the component measurement camera.

[0016] In the transfer device of the third invention, the reference mark for the transfer substrate is marked on a fluorescent component that emits fluorescence upon irradiation with the laser. The holding unit is configured such that the measurement camera can simultaneously capture the fluorescence emission point when the fluorescent component marked with the reference mark for the transfer substrate is irradiated with the laser and the reference mark for the transfer substrate. The control unit irradiates the fluorescent component marked with the reference mark for the transfer substrate with the laser using the laser irradiation unit, and simultaneously captures the fluorescence emission point of the fluorescent component marked with the reference mark for the transfer substrate and the reference mark for the transfer substrate using the measurement camera of the holding unit, and calculates the relative position of the reference mark for the transfer substrate with respect to the fluorescence emission point of the fluorescent component marked with the reference mark for the transfer substrate. Then, the control unit corrects the position of the transfer substrate holding unit with respect to the irradiation position of the laser. Next, the control unit irradiates the fluorescent component marked with the reference mark for the transferred substrate with the laser using the laser irradiation unit, and simultaneously captures the fluorescence emission point of the fluorescent component marked with the reference mark for the transferred substrate and the reference mark for the transferred substrate using the measurement camera of the holding unit, and calculates the relative position of the reference mark for the transferred substrate with respect to the fluorescence emission point of the fluorescent component marked with the reference mark for the transferred substrate. The control unit corrects the position of the transferred substrate holding unit with respect to the irradiation position of the laser. Next, the control unit captures the reference mark for the transferred substrate using the component measurement camera and calculates the relative position of the component measurement camera with respect to the reference mark for the transferred substrate, or captures the reference mark for the transfer substrate using the component measurement camera and calculates the relative position of the component measurement camera with respect to the reference mark for the transfer substrate. Then, the control unit corrects the position of the component measurement camera with respect to the transferred substrate holding unit or the transfer substrate holding unit.

[0017] The fourth invention is a method for correcting the position of a transfer device that transfers an element held on a transfer substrate to a transferred substrate by irradiating the laser of a laser irradiation unit. In the transfer device, based on the irradiation position of the laser, the position of the transferred substrate holding unit that holds the transferred substrate, the position of the transfer substrate holding unit that holds the transfer substrate, and the position of the component measurement camera that measures the position of the element are corrected.

[0018] The position correction method of the transfer device includes: a laser irradiation process of the substrate to be transferred holding part, irradiating the fluorescent light-emitting member marked with the reference mark for the substrate to be transferred on the substrate to be transferred holding part with laser by the laser irradiation part, so that the fluorescent light-emitting member marked with the reference mark for the substrate to be transferred emits fluorescence; a position calculation process of the substrate to be transferred holding part, using the holding part measurement camera for measuring the position of the transfer substrate holding part and the position of the substrate to be transferred holding part, simultaneously photographing the fluorescent light-emitting point of the fluorescent light-emitting member marked with the reference mark for the substrate to be transferred and the reference mark for the substrate to be transferred, and calculating the relative position of the reference mark for the substrate to be transferred with respect to the fluorescent light-emitting point of the fluorescent light-emitting member marked with the reference mark for the substrate to be transferred; a position correction process of the substrate to be transferred holding part, correcting the position of the substrate to be transferred holding part with respect to the irradiation position of the laser; a position calculation process of the component measurement camera, using the component measurement camera to photograph the reference mark for the substrate to be transferred, and calculating the relative position of the component measurement camera with respect to the reference mark for the substrate to be transferred; a position correction process of the component measurement camera, correcting the position of the component measurement camera with respect to the substrate to be transferred holding part; a position calculation process of the transfer substrate holding part, using the component measurement camera to photograph the reference mark for the transfer substrate on the transfer substrate holding part, and calculating the relative position of the reference mark for the transfer substrate with respect to the component measurement camera; and a position correction process of the transfer substrate holding part, correcting the position of the transfer substrate holding part with respect to the component measurement camera.

[0019] The fifth invention is a position correction method of a transfer device. The transfer device transfers the components held on the transfer substrate to the substrate to be transferred by the irradiation of the laser of the laser irradiation part. In the transfer device, based on the irradiation position of the laser, the position of the substrate to be transferred holding part for holding the substrate to be transferred, the position of the transfer substrate holding part for holding the transfer substrate, and the position of the component measurement camera for measuring the position of the component are corrected.

[0020] The position correction method of the transfer device includes: a laser irradiation process of the transfer substrate holding part, irradiating a laser on the fluorescent light-emitting component marked with the reference mark for the transfer substrate of the transfer substrate holding part by using the laser irradiation part, so that the fluorescent light-emitting component marked with the reference mark for the transfer substrate emits fluorescence; a position calculation process of the transfer substrate holding part, using the holding part measurement camera that measures the position of the transfer substrate holding part and the position of the substrate to be transferred holding part, simultaneously photographing the fluorescent light-emitting point of the fluorescent light-emitting component marked with the reference mark for the transfer substrate and the reference mark for the transfer substrate, and calculating the relative position of the reference mark for the transfer substrate with respect to the fluorescent light-emitting point of the fluorescent light-emitting component marked with the reference mark for the transfer substrate; a position correction process of the transfer substrate holding part, correcting the position of the transfer substrate holding part with respect to the irradiation position of the laser; a laser irradiation process of the substrate to be transferred holding part, irradiating a laser on the fluorescent light-emitting component marked with the reference mark for the substrate to be transferred of the substrate to be transferred holding part by using the laser irradiation part, so that the fluorescent light-emitting component marked with the reference mark for the substrate to be transferred emits fluorescence; a position calculation process of the substrate to be transferred holding part, using the holding part measurement camera to simultaneously photograph the fluorescent light-emitting point of the fluorescent light-emitting component marked with the reference mark for the substrate to be transferred and the reference mark for the substrate to be transferred, and calculating the relative position of the reference mark for the substrate to be transferred with respect to the fluorescent light-emitting point of the fluorescent light-emitting component marked with the reference mark for the substrate to be transferred; a position correction process of the substrate to be transferred holding part, correcting the position of the substrate to be transferred holding part with respect to the irradiation position of the laser; a position calculation process of the component measurement camera, using the component measurement camera to photograph the reference mark for the substrate to be transferred and calculating the relative position of the component measurement camera with respect to the reference mark for the substrate to be transferred, or using the component measurement camera to photograph the reference mark for the transfer substrate and calculating the relative position of the component measurement camera with respect to the reference mark for the transfer substrate; and a position correction process of the component measurement camera, correcting the position of the component measurement camera with respect to the substrate to be transferred holding part or the transfer substrate holding part.

[0021] Effects of the Invention

[0022] As an effect of the present invention, the following effects are achieved.

[0023] In the first invention, the substrate holding portion of the transfer device has a reference mark for the substrate to be transferred marked on a fluorescent member that emits fluorescence upon irradiation with laser light. Further, the holding portion of the transfer device can measure that the camera can simultaneously capture the fluorescent emission point when the fluorescent member marked with the reference mark for the substrate to be transferred is irradiated with laser light and the reference mark for the substrate to be transferred. That is, in the image captured by the measurement camera of the holding portion, the reference mark for the substrate to be transferred and the fluorescent emission point are included in the same image. Therefore, the transfer device can measure the irradiation position of the laser by the fluorescent emission point and can measure the relative position of the substrate holding portion with respect to the laser irradiation position by capturing the fluorescent member marked with the reference mark for the substrate to be transferred only once with the measurement camera of the holding portion. Thus, the transfer device can measure the position of the substrate holding portion, the position of the substrate holding portion, and the position of the element measurement camera with respect to the laser irradiation position without accumulating measurement errors.

[0024] In the second and fourth inventions, the control portion of the transfer device corrects the position of the substrate holding portion with respect to the irradiation position of the laser. Next, the control portion corrects the position of the element measurement camera with respect to the substrate holding portion, and the position of the substrate holding portion has been corrected with respect to the irradiation position of the laser. That is, the control portion corrects the position of the element measurement camera with respect to the irradiation position of the laser. Next, the control portion corrects the position of the substrate holding portion with respect to the element measurement camera, and the position of the element measurement camera has been corrected with respect to the substrate holding portion. That is, the control portion corrects the position of the substrate holding portion with respect to the irradiation position of the laser. Thus, the transfer device can measure the positions of the substrate holding portion, the substrate holding portion, and the element measurement camera with respect to the laser irradiation position without accumulating measurement errors by the position correction method of the transfer device.

[0025] In the third and fifth inventions, the control unit of the transfer device corrects the position of the transfer substrate holding unit relative to the irradiation position of the laser. Then, the control unit corrects the position of the substrate to be transferred holding unit relative to the irradiation position of the laser. Then, the control unit corrects the position of the element measurement camera relative to the substrate to be transferred holding unit or the transfer substrate holding unit. Thus, by the position correction method of the transfer device, the transfer device can measure the positions of the transfer substrate holding unit, the substrate to be transferred holding unit, and the element measurement camera based on the irradiation position of the laser without accumulating measurement errors. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic diagram showing the overall structure of the transfer device of the present invention.

[0027] Figure 2 is a block diagram showing the overall structure of the transfer device of the present invention.

[0028] Figure 3 shows a schematic diagram of the transfer of an element performed by the transfer device of the present invention. Figure 3 (A) shows a state in which alignment of the transfer substrate and the substrate to be transferred is performed, Figure 3 (B) shows a state in which an element of the transfer substrate is transferred to the substrate to be transferred by a laser.

[0029] Figure 4 is a top view and a cross-sectional view showing a substrate aligner of the transfer device of the present invention.

[0030] Figure 5 shows the operation during control of the substrate to be transferred holding unit of the transfer device according to the first embodiment of the present invention. Figure 5 (A) shows a state in which a laser is irradiated onto the substrate to be transferred aligner, Figure 5 (B) shows an image obtained by photographing the aligner.

[0031] Figure 6 shows the operation during control of the element measurement camera of the transfer device according to the first embodiment of the present invention. Figure 6 (A) shows a state in which the substrate to be transferred aligner is photographed by the element camera, Figure 6 (B) shows an image obtained by photographing the aligner.

[0032] Figure 7 shows the operation during control of the transfer substrate holding unit of the transfer device according to the first embodiment of the present invention. Figure 7 (A) shows a state in which the transfer substrate aligner is photographed by the element camera, Figure 7The image obtained by photographing the alignment mark is shown in (B).

[0033] Figure 8 It is a diagram showing a flowchart of the overall steps of position correction control of the transfer device showing the first embodiment of the present invention.

[0034] Figure 9 It is a diagram showing a flowchart of the steps of the transferred substrate holding unit control of the transfer device showing the first embodiment of the present invention.

[0035] Figure 10 It is a diagram showing a flowchart of the steps of the element measurement camera control of the transfer device showing the first embodiment of the present invention.

[0036] Figure 11 It is a diagram showing a flowchart of the steps of the transferred substrate holding unit control of the transfer device showing the first embodiment of the present invention.

[0037] Figure 12 The operation during the transferred substrate holding unit control of the transfer device showing the second embodiment of the present invention is shown. Figure 12 The state of irradiating the laser to the transfer substrate alignment mark is shown in (A). Figure 12 The image obtained by photographing the alignment mark is shown in (B).

[0038] Figure 13 It is a diagram showing a flowchart of the overall steps of position correction control of the transfer device showing the second embodiment of the present invention.

[0039] Figure 14 It is a diagram showing a flowchart of the steps of the transferred substrate holding unit control of the transfer device showing the second embodiment of the present invention. Detailed Description of the Invention

[0040] First, the transfer device 1 according to the first embodiment of the present invention will be described using Figure 1 and Figure 2 . The transfer device 1 is a device that separates and transfers micro-elements of 100 μm or less formed on the transfer substrate C1 to the substrate to be transferred C2 by laser. In the present embodiment, the transfer device 1 transfers a micro LED (hereinafter simply referred to as "LED") as an element. In the present embodiment, the irradiation direction of the laser is defined as the Z-axis. In addition, two directions orthogonal to the irradiation direction of the laser, i.e., the Z-axis direction, and orthogonal to each other are defined as the X-axis and the Y-axis. The laser is irradiated onto the transfer substrate C1.

[0041] The transfer substrate C1 provided with the LEDs to be transferred is composed of a sapphire wafer, a gallium arsenide wafer, etc. On the surface of the transfer substrate C1, LEDs formed by growing a gallium nitride thin film are formed. After the LEDs are diced, a plurality (hundreds to tens of thousands) of LEDs are arranged on the transfer substrate C1. The size of the LEDs is, for example, 50 μm × 50 μm or less, and they are arranged at intervals including the dicing width. The transfer substrate C2 of the transferred LEDs is composed of a conductive carrier material.

[0042] In the LEDs on the transfer substrate C1, by irradiating excimer laser, the portion in the range from the uppermost part to a depth of 10 nm of the gallium nitride intermediate layer is decomposed. As a result, the LEDs are peeled off from the transfer substrate C1 (laser lift-off). The LEDs are transferred to the transfer substrate C2 by the force exerted by N (nitrogen) generated when the gallium nitride is decomposed.

[0043] As Figure 1 and Figure 2 shown, the transfer device 1 includes a laser irradiation unit 2, a transfer substrate holding unit 6, a transfer substrate holding unit 10, a component measurement camera 14, a holding unit measurement camera 16, and a control unit 18. In order to transfer the LEDs to be transferred to the transfer position on the transfer substrate C2 by irradiating the laser L, the transfer device 1 controls the position of the component measurement camera 14, the position of the transfer substrate mounting table 8 of the transfer substrate holding unit 6, and the position of the transfer substrate mounting table 12 of the transfer substrate holding unit 10 based on the irradiation position of the laser L, that is, the laser irradiation position Pr.

[0044] The laser irradiation unit 2 is a device that irradiates short-wavelength laser L. The laser irradiation unit 2 includes a laser oscillation device 3, a Galvano scanner 4, and a telecentric lens 5. The laser irradiation unit 2 is fixed to a frame (not shown) of the transfer device 1. That is, the laser oscillation device 3, the Galvano scanner 4, and the telecentric lens 5 of the laser irradiation unit 2 are configured not to be able to move relative to the transfer substrate holding unit 6 and the substrate to be transferred holding unit 10. The laser oscillation device 3 is an excimer laser that oscillates short-wavelength (ArF: 193 nm, KrF: 248 nm, XeCl: 308 nm, XeF: 351 nm) laser L. The Galvano scanner 4 is a mirror device that reflects the laser L using a plurality of Galvano mirrors 4a and irradiates the laser L in an arbitrary direction. The Galvano scanner 4 independently controls the angles of the plurality of Galvano mirrors 4a using a Galvano motor 4b. Thus, the Galvano scanner 4 can irradiate the laser L oscillated by the laser oscillation device 3 to any position on the transfer substrate C1. The telecentric lens 5 is composed of a plurality of lenses. The telecentric lens 5 is designed such that the scanning speed becomes constant at the peripheral part and the central part of the lens by changing the curvature of two lens surfaces. The laser irradiation unit 2 configured in this way can irradiate the laser L to any LED held on the transfer substrate C1.

[0045] The transfer substrate holding unit 6 is a movable stage that holds the transfer substrate C1 provided with LEDs. The transfer substrate holding unit 6 includes a transfer substrate driving device 7, a transfer substrate stage 8, and a transfer substrate aligner 9. The transfer substrate holding unit 6 is disposed below the laser irradiation unit 2.

[0046] The transfer substrate stage 8 of the transfer substrate holding unit 6 is formed in a ring shape. That is, the transfer substrate stage 8 has a through hole through which the laser L passes when the LEDs on the held transfer substrate C1 are transferred to the substrate to be transferred C2. The transfer substrate stage 8 is configured to be able to move in the X direction, the Y direction, and the direction of rotation about the Z axis (i.e., θ rotation) using a transfer substrate driving device 7 composed of a plurality of servo motors and the like. Thus, the transfer substrate holding unit 6 is configured to be able to irradiate the laser L to any position on the held transfer substrate C1.

[0047] The transfer substrate aligner 9 is used to correct the position of the transfer substrate stage 8. The transfer substrate aligner 9 is provided on the transfer substrate stage 8. The transfer substrate holding unit 6 configured in this way can hold the transfer substrate C1 and move the LEDs on the transfer substrate C1 to the laser irradiation position Pr.

[0048] The substrate to be transferred holding unit 10 is a movable stage that holds the substrate C2 to be transferred with the LED to be transferred. The substrate to be transferred holding unit 10 includes a substrate to be transferred driving device 11, a substrate to be transferred stage 12, and a fiducial for substrate to be transferred 13. The substrate to be transferred holding unit 10 is arranged below the transfer substrate holding unit 6.

[0049] The substrate to be transferred stage 12 of the substrate to be transferred holding unit 10 is configured to be movable in the X direction, Y direction, Z-axis direction, and the direction of rotation about the Z-axis, i.e., the θ rotation direction, by the substrate to be transferred driving device 11 composed of a plurality of servo motors or the like. Thus, the substrate to be transferred holding unit 10 is configured to be able to transfer the LED peeled from the transfer substrate C1 to any position of the substrate C2 to be held.

[0050] The fiducial for substrate to be transferred 13 is used to correct the position of the substrate to be transferred stage 12. The fiducial for substrate to be transferred 13 is provided on the substrate to be transferred stage 12. The substrate to be transferred holding unit 10 configured in this way holds the substrate C2 to be opposed to the LED held on the transfer substrate C1 with a gap, and moves the substrate C2 to the transfer position of the LED.

[0051] The component measurement camera 14 captures an image for measuring the position of the LED as a component. The component measurement camera 14 is composed of a CCD camera or the like. The component measurement camera 14 is arranged at a position below the laser irradiation unit 2 and above the transfer substrate stage 8 of the transfer substrate holding unit 6. The component measurement camera 14 is configured to be movable in the X direction, Y direction, and Z-axis direction by the component measurement camera driving device 15. That is, the component measurement camera 14 is configured to be movable independently of the transfer substrate stage 8 and the substrate to be transferred stage 12. Thus, the component measurement camera 14 is configured to be able to capture any position of the transfer substrate C1 held on the transfer substrate holding unit 6 from above in the X-axis direction of the transfer substrate holding unit 6. In addition, the component measurement camera 14 is configured to be able to capture the fiducial for transfer substrate 9 of the transfer substrate holding unit 6 and the fiducial for substrate to be transferred 13 of the substrate to be transferred holding unit 10.

[0052] The holding unit measurement camera 16 captures an image for measuring the positions of the transfer substrate holding unit 6 and the substrate to be transferred holding unit 10. The holding unit measurement camera 16 is composed of a CCD camera or the like. The holding unit measurement camera 16 is arranged at a position below the substrate to be transferred stage 12 of the substrate to be transferred holding unit 10. The holding unit measurement camera 16 is configured to be able to use the holding unit measurement camera driving device 17 (refer to Figure 2)It moves in the X direction and the Y direction. That is, the holding unit measurement camera 16 is configured to be able to move independently of the transfer substrate mounting table 8 and the substrate to be transferred mounting table 12. Thereby, the holding unit measurement camera 16 is configured to be able to photograph the transfer substrate fiducial 9 of the transfer substrate holding unit 6 and the substrate to be transferred fiducial 13 of the substrate to be transferred holding unit 10.

[0053] The control unit 18 is a control unit 18 that controls the laser irradiation unit 2, the transfer substrate holding unit 6, the substrate to be transferred holding unit 10, the component measurement camera 14, and the holding unit measurement camera 16. Substantially, the control unit 18 may be a structure in which a CPU, ROM, RAM, HDD, etc. are connected by a bus, or may be a structure constituted by a single-chip LSI or the like.

[0054] The control unit 18 is connected to the laser oscillation device 3 and the galvanometer motor 4b of the laser irradiation unit 2. The control unit 18 can control the irradiation timing and output of the laser oscillation device 3 through the laser oscillation device 3. In addition, the control unit 18 can control the position of the irradiation laser L through the galvanometer scanner 4.

[0055] The control unit 18 is connected to the transfer substrate driving device 7 of the transfer substrate holding unit 6. The control unit 18 can control the position of the transfer substrate mounting table 8 through the transfer substrate driving device 7.

[0056] The control unit 18 is connected to the substrate to be transferred driving device 11 of the substrate to be transferred holding unit 10. The control unit 18 can control the position of the substrate to be transferred mounting table 12 through the substrate to be transferred driving device 11.

[0057] The control unit 18 is connected to the component measurement camera 14 and the component measurement camera driving device 15. The control unit 18 can control the position of the component measurement camera 14 through the component measurement camera driving device 15. In addition, the control unit 18 can control the photographing timing, photographing conditions, etc. of the component measurement camera 14. In addition, the control unit 18 can measure the distance between specific objects in the image captured by the component measurement camera 14.

[0058] The control unit 18 is connected to the holding unit measurement camera 16 and the holding unit measurement camera driving device 17. The control unit 18 can control the position of the holding unit measurement camera 16 through the holding unit measurement camera driving device 17. In addition, the control unit 18 can control the photographing timing, photographing conditions, etc. of the holding unit measurement camera 16. In addition, the control unit 18 can measure the distance between specific objects in the image captured by the holding unit measurement camera 16.

[0059] As Figure 3As shown, the transfer device 1 holds the transfer substrate C1 on the transfer substrate stage 8 of the transfer substrate holding unit 6, and holds the substrate to be transferred C2 on the substrate to be transferred stage 12 of the substrate to be transferred holding unit 10. The transfer device 1 moves the transfer substrate C1 using the transfer substrate holding unit 6 so that the LEDs to be transferred in the transfer substrate C1 are arranged at the laser irradiation position Pr. At this time, the transfer device 1 measures the position of the LED to be transferred relative to the laser irradiation position Pr using the component measurement camera 14.

[0060] Next, the transfer device 1 moves the LED transfer position of the substrate to be transferred C2 to a position that overlaps the laser irradiation position Pr of the transfer substrate C1 when observed in the Z-axis direction. The transfer device 1 irradiates the LED to be transferred with the laser L using the laser irradiation unit 2. The LED of the transfer substrate C1 irradiated with the laser L is peeled off from the transfer substrate C1 by laser lift-off. The peeled-off LED is transferred to the substrate to be transferred C2.

[0061] Hereinafter, Figures 4 to 12 the position calibration of the transfer substrate holding unit 6, the substrate to be transferred holding unit 10, and the component measurement camera 14 performed by the control unit 18 of the transfer device 1 (refer to Figure 2 ) will be described. The transfer device 1 uses the laser L, the transfer substrate fiducial 9 of the transfer substrate holding unit 6, the substrate to be transferred fiducial 13 of the substrate to be transferred holding unit 10, the component measurement camera 14, and the holding unit measurement camera 16 to perform position calibration of the transfer substrate holding unit 6, the substrate to be transferred holding unit 10, and the component measurement camera 14.

[0062] As Figure 4 shown, the transfer substrate fiducial 9 of the transfer substrate holding unit 6 is a fiducial for measuring the position of the transfer substrate holding unit 6. The transfer substrate fiducial 9 has a glass substrate 9a.

[0063] The glass substrate 9a is fixed to the transfer substrate stage 8 via a holding member or the like. That is, the glass substrate 9a moves together with the transfer substrate holding unit 6. On the glass substrate 9a, a crosshair, that is, a transfer substrate fiducial mark 9b (scale line), which is a reference when measuring the position of the transfer substrate holding unit 6, is engraved. In addition, since the transfer substrate fiducial 9 formed of the glass substrate 9a has high transmittance, the transfer substrate fiducial mark 9b can be visually confirmed from the back side.

[0064] The substrate to be transferred fiducial 13 of the substrate to be transferred holding unit 10 is a fiducial for measuring the position of the substrate to be transferred holding unit 10. The substrate to be transferred fiducial 13 has a fluorescent glass substrate 13a as a fluorescent light-emitting member.

[0065] The fluorescent glass substrate 13a is formed of a fluorescent glass that absorbs and accumulates the energy of ultraviolet rays and releases the energy of the ultraviolet rays as light in the visible or near-visible part. The fluorescent glass substrate 13a contains specific elements such as transition metal ions, rare earth ions, semiconductor fine particles, and metal fine particles added to the glass as fluorescent active elements. When the laser L is irradiated from the laser irradiation unit 2, the irradiated portion of the fluorescent glass substrate 13a emits fluorescence. That is, the fluorescent glass substrate 13a can show the laser irradiation position Pr through the fluorescent emission point F (refer to Figure 5 ).

[0066] The fluorescent glass substrate 13a is fixed to the transfer substrate mounting table 12. That is, the fluorescent glass substrate 13a moves together with the transfer substrate holding unit 10. On the fluorescent glass substrate 13a, a crosshair serving as a reference when measuring the position of the transfer substrate holding unit 10, that is, a reference mark 13b (scale line) for the transfer substrate, is engraved. Thus, when the fluorescent glass substrate 13a is irradiated with the laser L, the reference mark 13b for the transfer substrate and the fluorescent emission point F as the laser irradiation position Pr can be simultaneously displayed. That is, the holding unit can measure the reference mark 13b for the transfer substrate and the fluorescent emission point F of the transfer substrate reference device 13 photographed by the camera 16 within one camera field of view V. In addition, since the transfer substrate reference device 13 formed of the fluorescent glass substrate 13a has high transparency, the reference mark 13b for the transfer substrate and the fluorescent emission point F can be visually confirmed from the back surface of the surface irradiated with the laser L (refer to Figure 5 ).

[0067] Next, a position correction method of the transfer device 1 for correcting the positions of the transfer substrate holding unit 6, the transfer substrate holding unit 10, and the component measurement camera 14 of the first embodiment of the present invention will be described.

[0068] As Figure 5 shown, in the laser irradiation process of the transfer substrate holding unit 10, the control unit 18 of the transfer device 1 uses the transfer substrate driving device 11 of the transfer substrate holding unit 10 (refer to Figure 2 ) to move the reference mark 13b (the intersection of the crosshairs) of the transfer substrate reference device 13 fixed to the transfer substrate mounting table 12 to the laser irradiation position Pr. The control unit 18 irradiates the fluorescent glass substrate 13a of the transfer substrate reference device 13 with the laser L using the laser irradiation unit 2. As a result, the irradiated portion of the fluorescent glass substrate 13a marked with the reference mark 13b for the transfer substrate emits fluorescence.

[0069] In the process of calculating the position of the substrate to be transferred holding part, the control unit 18 uses the holding part measurement camera 16 to simultaneously capture the fluorescence emission point F of the fluorescent glass substrate 13a of the reference for the substrate to be transferred 13 and the reference mark 13b for the substrate to be transferred within the same camera field of view V. The control unit 18 calculates the relative position, i.e., the relative coordinates A(a, b), of the reference mark 13b for the substrate to be transferred with respect to the fluorescence emission point F of the fluorescent glass substrate 13a.

[0070] In the process of correcting the position of the substrate to be transferred holding part, when the reference mark 13b for the substrate to be transferred is included within the range of the radius R centered on the fluorescence emission point F of the fluorescent glass substrate 13a, the control unit 18 determines that the reference mark 13b for the substrate to be transferred of the substrate to be transferred holding part 10 coincides with the laser irradiation position Pr which is the fluorescence emission point F. On the other hand, when the reference mark 13b for the substrate to be transferred is not included within the range of the radius R centered on the fluorescence emission point F of the fluorescent glass substrate 13a ( Figure 5 in the state of (B)), the control unit 18 determines that there is a deviation between the reference mark 13b for the substrate to be transferred of the substrate to be transferred holding part 10 and the laser irradiation position Pr of the laser irradiation unit 2.

[0071] When the reference mark 13b for the substrate to be transferred is not included within the range of the radius R centered on the fluorescence emission point F of the fluorescent glass substrate 13a, based on the calculated relative position of the reference mark 13b for the substrate to be transferred with respect to the fluorescence emission point F, the control unit 18 uses the substrate to be transferred driving device 11 (refer to Figure 2 ) to correct the position of the substrate to be transferred mounting table 12 so that the reference mark 13b for the substrate to be transferred coincides with the laser irradiation position Pr.

[0072] As Figure 6 shown, in the process of calculating the position of the component measurement camera, the control unit 18 uses the driving device 15 for the component measurement camera of the component measurement camera 14 (refer to Figure 2 ) to move the reference point (e.g., the center point of the camera field of view V. Hereinafter, only denoted as "component measurement camera reference point 14a") of the camera field of view V of the component measurement camera 14 to the position of the reference mark 13b of the reference for the substrate to be transferred 13.

[0073] The control unit 18 uses the component measurement camera 14 to capture the reference mark 13b for the substrate to be transferred and calculates the relative position, i.e., the relative coordinates B(c, d), of the component measurement camera reference point 14a with respect to the reference mark 13b for the substrate to be transferred.

[0074] In the component measurement camera position correction process, when the component measurement camera reference point 14a of the component measurement camera 14 is included within the range of a radius R centered on the transferred substrate reference mark 13b of the transferred substrate holding unit 10, the control unit 18 determines that the component measurement camera reference point 14a coincides with the transferred substrate reference mark 13b ( Figure 6 the state of (B)). On the other hand, when the component measurement camera reference point 14a is not included within the range of a radius R centered on the transferred substrate reference mark 13b, the control unit 18 determines that there is a deviation between the component measurement camera reference point 14a and the transferred substrate reference mark 13b.

[0075] When the component measurement camera reference point 14a is not included within the range of a radius R centered on the transferred substrate reference mark 13b, the control unit 18, based on the calculated relative position of the component measurement camera reference point 14a with respect to the transferred substrate reference mark 13b, uses the driving device 15 for the component measurement camera (refer to Figure 2 ) to correct the position of the component measurement camera 14 so that the component measurement camera reference point 14a coincides with the transferred substrate reference mark 13b.

[0076] As Figure 7 shown, in the transferred substrate holding unit position calculation process, the control unit 18 uses the transferred substrate driving device 7 of the transferred substrate holding unit 6 (refer to Figure 2 ) to move the transferred substrate reference mark 9b of the transferred substrate fiducial 9 fixed to the transferred substrate mounting table 8 to the position of the component measurement camera reference point 14a of the component measurement camera 14.

[0077] The control unit 18 uses the component measurement camera 14 to photograph the transferred substrate reference mark 9b and calculates the relative position, i.e., the relative coordinates C(e, f), of the transferred substrate reference mark 9b with respect to the component measurement camera reference point 14a.

[0078] In the transferred substrate holding unit position correction process, when the transferred substrate reference mark 9b of the transferred substrate holding unit 6 is included within the range of a radius R centered on the component measurement camera reference point 14a of the component measurement camera 14, the control unit 18 determines that the transferred substrate reference mark 9b coincides with the component measurement camera reference point 14a. On the other hand, when the transferred substrate reference mark 9b is not included within the range of a radius R centered on the component measurement camera reference point 14a ( Figure 7 the state of (B)), the control unit 18 determines that there is a deviation between the transferred substrate reference mark 9b and the component measurement camera reference point 14a.

[0079] When the reference mark 9b for the transfer substrate is not included within the range of the radius R centered on the reference point 14a of the component measurement camera, the control unit 18 corrects the position of the transfer substrate holding unit 6 using the transfer substrate driving device 7 based on the calculated relative position of the reference mark 9b for the transfer substrate with respect to the reference point 14a of the component measurement camera, so that the reference mark 9b for the transfer substrate coincides with the reference point 14a of the component measurement camera.

[0080] Next, the position correction control of the transfer device 1 according to the first embodiment of the present invention will be specifically described.

[0081] As Figure 8 shown, in step S100, the control unit 18 of the transfer device 1 starts the control A for the transfer substrate holding unit, and transfers the step to step S110 (refer to Figure 9 ). After the control A for the transfer substrate holding unit ends, the control unit 18 transfers the step to S200 (refer to Figure 8 ).

[0082] In step S200, the control unit 18 starts the component measurement camera control B, and transfers the step to step S210 (refer to Figure 10 ). After the component measurement camera control B ends, the control unit 18 transfers the step to S300 (refer to Figure 8 ).

[0083] In step S300, the control unit 18 starts the transfer substrate holding unit control C, and transfers the step to step S310 (refer to Figure 11 ). After the transfer substrate holding unit control C ends, the control unit 18 ends the position correction control of the transfer device 1 (refer to Figure 8 ).

[0084] As Figure 9 shown, the control unit 18 starts the control A for the transfer substrate holding unit, and transfers the step to step S110.

[0085] In step S110, which is the laser irradiation process of the transfer substrate holding unit 10, the control unit 18 moves the reference mark 13b for the transfer substrate of the transfer substrate fiducial 13 fixed to the transfer substrate mounting table 12 to the laser irradiation position Pr. The control unit 18 transfers the step to S120.

[0086] In step S120, which is the laser irradiation process of the transfer substrate holding unit 10, the control unit 18 irradiates the fluorescent glass substrate 13a of the transfer substrate fiducial 13 with the laser L using the laser irradiation unit 2. The control unit 18 transfers the step to S130.

[0087] In step S130, which is the process of calculating the position of the substrate transfer holding unit, the control unit 18 uses the holding unit measurement camera 16 to simultaneously photograph the fluorescence emission point F of the reference for the substrate to be transferred 13 and the reference mark 13b for the substrate to be transferred within the same camera field of view V. The control unit 18 advances the step to S140.

[0088] In step S140, which is the process of calculating the position of the substrate transfer holding unit, the control unit 18 calculates the relative position of the reference mark 13b for the substrate to be transferred with respect to the fluorescence emission point F of the fluorescent glass substrate 13a. The control unit 18 advances the step to S150.

[0089] In step S150, which is the process of correcting the position of the substrate transfer holding unit, the control unit 18 determines whether the reference mark 13b for the substrate to be transferred is included within a range of a radius R centered on the fluorescence emission point F of the fluorescent glass substrate 13a.

[0090] As a result, when it is determined that the reference mark 13b for the substrate to be transferred is included within the range of the radius R centered on the fluorescence emission point F of the fluorescent glass substrate 13a, the control unit 18 determines that the reference mark 13b for the substrate to be transferred coincides with the laser irradiation position Pr. The control unit 18 ends the substrate transfer holding unit control A and advances the step to step S200 (see Figure 8 ).

[0091] On the other hand, when it is determined that the reference mark 13b for the substrate to be transferred is not included within the range of the radius R centered on the fluorescence emission point F of the fluorescent glass substrate 13a, the control unit 18 determines that there is a deviation between the reference mark 13b for the substrate to be transferred and the laser irradiation position Pr. The control unit 18 advances the step to step S160.

[0092] In step S160, which is the process of correcting the position of the substrate transfer holding unit, the control unit 18 corrects the position of the substrate transfer stage 12 based on the calculated relative position of the substrate transfer holding unit 10 with respect to the fluorescence emission point F. The control unit 18 ends the substrate transfer holding unit control A and advances the step to step S200 (see Figure 8 ).

[0093] As Figure 10 shown, the control unit 18 starts the component measurement camera control B and advances the step to step S210.

[0094] In step S210, which is the process of calculating the position of the component measurement camera, the control unit 18 moves the component measurement camera reference point 14a of the component measurement camera 14 to the position of the reference mark 13b of the reference for the substrate to be transferred 13. The control unit 18 advances the step to S220.

[0095] In step S220 which is the step of calculating the position of the component measurement camera, the control unit 18 uses the component measurement camera 14 to photograph the reference mark 13b for the substrate to be transferred. The control unit 18 transfers the step to S230.

[0096] In step S230 which is the step of calculating the position of the component measurement camera, the control unit 18 calculates the relative position of the reference point 14a of the component measurement camera with respect to the reference mark 13b for the substrate to be transferred. The control unit 18 transfers the step to S240.

[0097] In step S240 which is the step of correcting the position of the component measurement camera, the control unit 18 determines whether the reference point 14a of the component measurement camera is included within the range of a radius R centered on the reference mark 13b for the substrate to be transferred.

[0098] As a result, in the case where it is determined that the reference point 14a of the component measurement camera is included within the range of a radius R centered on the reference mark 13b for the substrate to be transferred, the control unit 18 determines that the reference point 14a of the component measurement camera coincides with the reference mark 13b for the substrate to be transferred. The control unit 18 ends the component measurement camera control B and transfers the step to step S300 (refer to Figure 8 ).

[0099] On the other hand, in the case where it is determined that the reference point 14a of the component measurement camera is not included within the range of a radius R centered on the reference mark 13b for the substrate to be transferred, the control unit 18 determines that there is a deviation between the reference point 14a of the component measurement camera and the reference mark 13b for the substrate to be transferred. The control unit 18 transfers the step to step S250.

[0100] In step S250 which is the step of correcting the position of the component measurement camera, the control unit 18 corrects the position of the component measurement camera 14 based on the calculated relative position of the reference point 14a of the component measurement camera with respect to the reference mark 13b for the substrate to be transferred. The control unit 18 ends the component measurement camera control B and transfers the step to step S300 (refer to Figure 8 ).

[0101] As Figure 11 shown, the control unit 18 starts the transfer substrate holding unit control C and transfers the step to step S310.

[0102] In step S310 which is the step of calculating the position of the transfer substrate holding unit, the control unit 18 moves the transfer substrate reference mark 9b of the transfer substrate reference 9 to the position of the reference point 14a of the component measurement camera 14. The control unit 18 transfers the step to S320.

[0103] In step S320, which is the transfer substrate holding unit position calculation process, the control unit 18 uses the component measurement camera 14 to photograph the transfer substrate reference mark 9b. The control unit 18 advances the step to S330.

[0104] In step S330, which is the transfer substrate holding unit position calculation process, the control unit 18 calculates the relative position of the transfer substrate reference mark 9b with respect to the component measurement camera reference point 14a. The control unit 18 advances the step to S340.

[0105] In step S340, which is the transfer substrate holding unit position correction process, the control unit 18 determines whether the transfer substrate reference mark 9b is included within a range of a radius R centered on the component measurement camera reference point 14a.

[0106] As a result, when it is determined that the transfer substrate reference mark 9b is included within the range of the radius R centered on the component measurement camera reference point 14a, the control unit 18 determines that the transfer substrate reference mark 9b coincides with the component measurement camera reference point 14a. The control unit 18 ends the transfer substrate holding unit control C and ends the position correction control of the transfer device 1 (see Figure 8 ).

[0107] On the other hand, when it is determined that the transfer substrate reference mark 9b is not included within the range of the radius R centered on the component measurement camera reference point 14a, it is determined that there is a deviation between the transfer substrate reference mark 9b and the component measurement camera reference point 14a. The control unit 18 advances the step to step S350.

[0108] In step S350, which is the transfer substrate holding unit position calculation process, the control unit 18 corrects the position of the transfer substrate mounting table 8 based on the calculated relative position of the transfer substrate reference mark 9b with respect to the component measurement camera reference point 14a. The control unit 18 ends the transfer substrate holding unit control C and ends the position correction control of the transfer device 1 (see Figure 8 ).

[0109] The substrate holding unit 10 of the transfer device 1 configured in such a manner has a reference mark 13b for the substrate to be transferred marked on the fluorescent glass substrate 13a that emits fluorescence upon irradiation with the laser L. Further, the holding unit measurement camera 16 of the transfer device 1 can simultaneously capture the fluorescence emission point F when the laser L is irradiated onto the fluorescent glass substrate 13a marked with the reference mark 13b for the substrate to be transferred and the reference mark 13b for the substrate to be transferred. That is, in the image captured by the holding unit measurement camera 16, the reference mark 13b for the substrate to be transferred and the fluorescence emission point F are included in the same image. Therefore, the transfer device 1 can measure the relative position of the substrate holding unit 10 with respect to the laser irradiation position Pr by the fluorescence emission point F by capturing the fluorescent glass substrate 13a marked with the reference mark 13b for the substrate to be transferred only once using the holding unit measurement camera 16.

[0110] The control unit 18 of the transfer device 1 corrects the position of the substrate holding unit 10 with respect to the laser irradiation position Pr in the laser irradiation process, the substrate holding unit position calculation process, and the substrate holding unit position correction process of the substrate holding unit 10. Next, the control unit 18 corrects the position of the component measurement camera 14 with respect to the substrate holding unit 10 in the component measurement camera position calculation process and the component measurement camera position correction process, and the position of the substrate holding unit 10 has been corrected with respect to the laser irradiation position Pr. That is, the control unit 18 corrects the position of the component measurement camera 14 with respect to the laser irradiation position Pr. Next, the control unit 18 corrects the position of the transfer substrate holding unit 6 with respect to the component measurement camera 14 in the transfer substrate holding unit position calculation process and the transfer substrate holding unit position correction process, and the position of the component measurement camera 14 has been corrected with respect to the substrate holding unit 10. That is, the control unit 18 corrects the position of the transfer substrate holding unit 6 with respect to the laser irradiation position Pr. Thus, the transfer device 1 can correct the positions of the transfer substrate holding unit 6, the substrate holding unit 10, and the component measurement camera 14 with respect to the laser irradiation position Pr without accumulating measurement errors by the position correction method of the transfer device 1.

[0111] Next, use Figures 4 to 6 and Figures 12 to 14 , the transfer device 1A according to the second embodiment of the present invention will be specifically described. In addition, the transfer device 1A in the following embodiment is used as a device applied in place of the transfer device 1 shown in Figures 1 to 11 . The same parts are denoted by the names, figure numbers, and reference numerals used in the description of the transfer device 1. In the following embodiments, specific descriptions of the same points as those in the already described embodiments are omitted, and the description will be centered on the different parts.

[0112] The transfer device 1A uses the laser L, the transfer substrate aligner 9 of the transfer substrate holding unit 6, the transfer substrate aligner 13 of the substrate to be transferred holding unit 10, the component measurement camera 14, and the holding unit measurement camera 16 to perform position correction of the transfer substrate holding unit 6, the substrate to be transferred holding unit 10, and the component measurement camera 14.

[0113] As Figure 4 shown, the transfer substrate aligner 9 of the transfer substrate holding unit 6 is an aligner for measuring the position of the transfer substrate holding unit 6. The transfer substrate aligner 9 has a fluorescent glass substrate 9c.

[0114] The fluorescent glass substrate 9c is fixed to the transfer substrate holding unit 6. That is, the fluorescent glass substrate 9c moves together with the transfer substrate holding unit 6. On the fluorescent glass substrate 9c, a crosshair as a reference when measuring the position of the transfer substrate holding unit 6, that is, a transfer substrate reference mark 9b (scale line), is engraved. Thus, when the fluorescent glass substrate 9c is irradiated with the laser L, the transfer substrate reference mark 9b and the fluorescent emission point F as the laser irradiation position Pr can be simultaneously displayed. That is, the transfer substrate reference mark 9b and the fluorescent emission point F of the transfer substrate aligner 9 can be photographed within one camera field of view V by using the holding unit measurement camera 16. In addition, since the transfer substrate aligner 9 formed of the fluorescent glass substrate 9c has high transmittance, the transfer substrate reference mark 9b and the fluorescent emission point F can be visually confirmed from the back surface of the surface irradiated with the laser L.

[0115] Next, use Figure 12 , to describe the position correction method of the control unit 18 (refer to Figure 2 ) of the transfer device 1A for correcting the positions of the transfer substrate holding unit 6, the substrate to be transferred holding unit 10, and the component measurement camera 14 of the transfer device 1A according to the second embodiment of the present invention.

[0116] As Figure 12 shown, in the laser irradiation process of the transfer substrate holding unit 6, the control unit 18 of the transfer device 1A uses the transfer substrate driving device 7 of the transfer substrate holding unit 6 to move the transfer substrate reference mark 9b of the transfer substrate aligner 9 to the laser irradiation position Pr. The control unit 18 irradiates the fluorescent glass substrate 9c of the transfer substrate aligner 9 with the laser L by using the laser irradiation unit 2. Thus, the portion of the fluorescent glass substrate 9c marked with the transfer substrate reference mark 9b that is irradiated with the laser L emits fluorescence.

[0117] In the transfer substrate holding unit position calculation process, the control unit 18 uses the holding unit measurement camera 16 to simultaneously capture the fluorescence emission point F of the fluorescent glass substrate 9c in the transfer substrate reference 9 and the transfer substrate reference mark 9b within the same camera field of view V. The control unit 18 calculates the relative position, i.e., the relative coordinates D(g, h), of the transfer substrate reference mark 9b with respect to the fluorescence emission point F of the fluorescent glass substrate 9c.

[0118] In the transfer substrate holding unit position correction process, when the transfer substrate reference mark 9b is included within the range of the radius R centered on the fluorescence emission point F of the fluorescent glass substrate 9c, the control unit 18 determines that the transfer substrate reference mark 9b coincides with the laser irradiation position Pr. On the other hand, when the transfer substrate reference mark 9b is not included within the range of the radius R centered on the fluorescence emission point F of the fluorescent glass substrate 9c ( Figure 12 in the state of (B)), the control unit 18 determines that a deviation has occurred between the transfer substrate reference mark 9b and the laser irradiation position Pr.

[0119] When the transfer substrate reference mark 9b is not included within the range of the radius R centered on the fluorescence emission point F of the fluorescent glass substrate 9c, based on the calculated relative position of the transfer substrate reference mark 9b with respect to the fluorescence emission point F, the control unit 18 uses the transfer substrate driving device 7 to correct the position of the transfer substrate mounting table 8 so that the transfer substrate reference mark 9b coincides with the laser irradiation position Pr.

[0120] As Figure 5 shown, the control unit 18 corrects the position of the transfer substrate holding unit 10 with reference to the laser irradiation position Pr by performing the laser irradiation process, the transfer substrate holding unit position calculation process, and the transfer substrate holding unit position correction process of the transfer substrate holding unit 10.

[0121] As Figure 6 shown, the control unit 18 corrects the position of the component measurement camera 14 with reference to the position of the transfer substrate reference mark 13b by performing the component measurement camera position calculation process and the component measurement camera position correction process.

[0122] In addition, in the second embodiment, it is also possible to use the transfer substrate reference mark 9b of the transfer substrate reference 9 to perform the correction of the position of the component measurement camera 14.

[0123] In the process of calculating the position of the component measurement camera, the control unit 18 uses the driving device 15 for the component measurement camera of the component measurement camera 14 to move the reference point 14a of the component measurement camera of the component measurement camera 14 to the position of the reference mark 9b for the transfer substrate of the transfer substrate reference 9. The control unit 18 uses the component measurement camera 14 to photograph the reference mark 9b for the transfer substrate and calculates the relative position of the reference point 14a of the component measurement camera with respect to the reference mark 9b for the transfer substrate.

[0124] In the process of correcting the position of the component measurement camera, when the reference point 14a of the component measurement camera is included within the range of a radius R centered on the reference mark 9b for the transfer substrate, the control unit 18 determines that the reference point 14a of the component measurement camera coincides with the reference mark 9b for the transfer substrate. On the other hand, when the reference point 14a of the component measurement camera is not included within the range of a radius R centered on the reference mark 9b for the transfer substrate, the control unit 18 determines that a deviation has occurred between the reference point 14a of the component measurement camera and the reference mark 9b for the transfer substrate. The control unit 18 corrects the position of the component measurement camera 14 based on the calculated relative position of the reference point 14a of the component measurement camera with respect to the reference mark 9b for the transfer substrate.

[0125] Next, use Figure 13 and Figure 14 to specifically describe the position correction control of the transfer device 1A according to the second embodiment of the present invention.

[0126] As Figure 13 shown, in step S400, the control unit 18 of the transfer device 1A starts the transfer substrate holding unit control D, causing the step to transfer to step S410 (refer to Figure 14 ). After the transfer substrate holding unit control D ends, the control unit 18 causes the step to transfer to S100 (refer to Figure 13 ).

[0127] In step S100, the control unit 18 of the transfer device 1A starts the transfer substrate holding unit control A, causing the step to transfer to step S110. After the transfer substrate holding unit control A ends, the control unit 18 causes the step to transfer to S200.

[0128] In step S200, the control unit 18 starts the component measurement camera control B, causing the step to transfer to step S210. After the component measurement camera control B ends, the control unit 18 ends the position correction control of the transfer device 1A.

[0129] As Figure 14 shown, the control unit 18 starts the transfer substrate holding unit control D, causing the step to transfer to step S410.

[0130] In step S410 of the laser irradiation process for the transfer substrate holding unit 6, the control unit 18 moves the transfer substrate reference mark 9b of the transfer substrate aligner 9 to the laser irradiation position Pr. The control unit 18 transfers the step to S420.

[0131] In step S420 of the laser irradiation process for the transfer substrate holding unit 6, the control unit 18 irradiates the fluorescent glass substrate 9c of the transfer substrate aligner 9 with the laser L using the laser irradiation unit 2. The control unit 18 transfers the step to S430.

[0132] In step S430 of the transfer substrate holding unit position calculation process, the control unit 18 uses the holding unit measurement camera 16 to simultaneously capture the fluorescent emission point F of the transfer substrate aligner 9 and the transfer substrate reference mark 9b within the same camera field of view V. The control unit 18 transfers the step to S440.

[0133] In step S440 of the transfer substrate holding unit position calculation process, the control unit 18 calculates the relative position of the transfer substrate reference mark 9b with respect to the fluorescent emission point F of the fluorescent glass substrate 9c. The control unit 18 transfers the step to S450.

[0134] In step S450 of the transfer substrate holding unit position correction process, the control unit 18 determines whether the transfer substrate reference mark 9b is included within a range of radius R centered on the fluorescent emission point F of the fluorescent glass substrate 9c.

[0135] As a result, when it is determined that the transfer substrate reference mark 9b is included within the range of radius R centered on the fluorescent emission point F of the fluorescent glass substrate 9c, the control unit 18 determines that the transfer substrate reference mark 9b coincides with the laser irradiation position Pr. The control unit 18 ends the transfer substrate holding unit control D and transfers the step to step S100 (refer to Figure 13 ).

[0136] On the other hand, when it is determined that the transfer substrate reference mark 9b is not included within the range of radius R centered on the fluorescent emission point F of the fluorescent glass substrate 9c, the control unit 18 determines that there is a deviation between the transfer substrate reference mark 9b and the laser irradiation position Pr. The control unit 18 transfers the step to step S460.

[0137] In step S460 of the transfer substrate holding unit position correction process, the control unit 18 corrects the position of the transfer substrate mounting table 8 based on the calculated relative position of the transfer substrate holding unit 6 with respect to the fluorescent emission point F. The control unit 18 ends the transfer substrate holding unit control D and transfers the step to step S100 (refer to Figure 13 ).

[0138] The control unit 18 of the transfer device 1A configured in this way corrects the position of the transfer substrate holding unit 6 relative to the laser irradiation position Pr. Next, the control unit 18 corrects the position of the substrate to be transferred holding unit 10 relative to the laser irradiation position Pr. Next, the control unit 18 corrects the position of the component measurement camera 14 relative to the substrate to be transferred holding unit 10 or the transfer substrate holding unit 6. Thus, the transfer device 1A can measure the positions of the transfer substrate holding unit 6, the substrate to be transferred holding unit 10, and the component measurement camera 14 based on the laser irradiation position Pr without accumulating measurement errors by the position correction method of the transfer device 1A.

[0139] In addition, in the first embodiment, the transfer substrate reference mark 9b of the transfer substrate holding unit 6 is provided on the transfer substrate reference device 9, but it is not limited thereto. In the first embodiment, the transfer substrate reference mark 9b of the transfer substrate holding unit 6 may also be provided on the transfer substrate mounting table 8.

[0140] In the above embodiment, the fluorescent light-emitting member is made of fluorescent glass, but it is not limited thereto. The fluorescent light-emitting member may be a member coated or mixed with a substance that emits fluorescence by laser. For example, the fluorescent light-emitting member may also be a paper member or a resin member coated with a substance that emits fluorescence.

[0141] In the above embodiment, the laser irradiation unit 2 is configured to oscillate excimer laser. However, the laser irradiation unit 2 is not limited to the configuration that oscillates excimer laser. For example, the laser irradiation unit may also be configured to oscillate YAG laser, semiconductor laser, etc.

[0142] The above embodiments merely show representative modes, and various modifications can be made and implemented without departing from the gist of an embodiment. In addition, of course, it can be implemented in various ways, and the scope of the present invention is shown by the description in the claims, and also includes meanings equivalent to the content described in the claims and all changes within the scope.

[0143] Description of reference numerals

[0144] 1 Transfer device

[0145] 2 Laser irradiation unit

[0146] 6 Transfer substrate holding unit

[0147] 10 Substrate to be transferred holding unit

[0148] 14 Component measurement camera

[0149] 16 Holding unit measurement camera

[0150] 18 Control unit

[0151] Reference mark for 9b transfer substrate

[0152] Reference mark for 13b substrate to be transferred

[0153] F Fluorescent emission point

Claims

1. A transfer device, comprising: A laser irradiation unit that irradiates a laser onto an element held on a transfer substrate; A transfer substrate holding unit that holds the transfer substrate and moves the element held on the transfer substrate to the irradiation position of the laser; A substrate to be transferred holding unit that holds the substrate to be transferred so as to face the element held on the transfer substrate with a gap therebetween, and moves the substrate to be transferred to the transfer position of the element; An element measurement camera that measures the relative position of the element held on the transfer substrate with respect to the irradiation position of the laser; A holding unit measurement camera that measures at least one of the relative position of the transfer substrate holding unit with respect to the irradiation position of the laser and the relative position of the substrate to be transferred holding unit with respect to the irradiation position of the laser; And A control unit that controls the laser irradiation unit, the transfer substrate holding unit, and the substrate to be transferred holding unit so as to separate the element from the transfer substrate and apply a force thereto toward the substrate to be transferred for transfer, The transfer device transfers the element held on the transfer substrate to the substrate to be transferred, Wherein, The transfer substrate holding unit has a reference mark for the transfer substrate, The substrate to be transferred holding unit has a reference mark for the substrate to be transferred, and the reference mark for the substrate to be transferred is marked on a fluorescence-emitting member that emits fluorescence upon irradiation with the laser, The element measurement camera is configured to be able to photograph the reference mark for the transfer substrate and the reference mark for the substrate to be transferred, The holding unit measurement camera is configured to be able to simultaneously photograph the fluorescence-emitting point when the fluorescence-emitting member marked with the reference mark for the substrate to be transferred is irradiated with the laser and the reference mark for the substrate to be transferred.

2. The transfer device according to claim 1, wherein, The control unit irradiates the fluorescence-emitting member marked with the reference mark for the substrate to be transferred with the laser using the laser irradiation unit, simultaneously photographs the fluorescence-emitting point of the fluorescence-emitting member marked with the reference mark for the substrate to be transferred and the reference mark for the substrate to be transferred using the holding unit measurement camera, calculates the relative position of the reference mark for the substrate to be transferred with respect to the fluorescence-emitting point of the fluorescence-emitting member marked with the reference mark for the substrate to be transferred, and corrects the position of the substrate to be transferred holding unit with respect to the irradiation position of the laser, The control unit photographs the reference mark for the substrate to be transferred using the element measurement camera, calculates the relative position of the element measurement camera with respect to the reference mark for the substrate to be transferred, and corrects the position of the element measurement camera with respect to the substrate to be transferred holding unit, The control unit photographs the reference mark for the transfer substrate using the element measurement camera, calculates the relative position of the reference mark for the transfer substrate with respect to the element measurement camera, and corrects the position of the transfer substrate holding unit with respect to the element measurement camera.

3. The transfer device according to claim 1, wherein, The reference mark for the transfer substrate is marked on a fluorescent light-emitting component that emits fluorescence upon irradiation with the laser. The holding unit is configured such that the measurement camera can simultaneously capture the fluorescent light-emitting point when the laser is irradiated onto the fluorescent light-emitting component marked with the reference mark for the transfer substrate and the reference mark for the transfer substrate. The control unit irradiates the laser onto the fluorescent light-emitting component marked with the reference mark for the transfer substrate using the laser irradiation unit, and uses the holding unit to measure that the camera simultaneously captures the fluorescent light-emitting point of the fluorescent light-emitting component marked with the reference mark for the transfer substrate and the reference mark for the transfer substrate, calculates the relative position of the reference mark for the transfer substrate with respect to the fluorescent light-emitting point of the fluorescent light-emitting component marked with the reference mark for the transfer substrate, and corrects the position of the transfer substrate holding unit with respect to the irradiation position of the laser. The control unit irradiates the laser onto the fluorescent light-emitting component marked with the reference mark for the substrate to be transferred using the laser irradiation unit, and uses the holding unit to measure that the camera simultaneously captures the fluorescent light-emitting point of the fluorescent light-emitting component marked with the reference mark for the substrate to be transferred and the reference mark for the substrate to be transferred, calculates the relative position of the reference mark for the substrate to be transferred with respect to the fluorescent light-emitting point of the fluorescent light-emitting component marked with the reference mark for the substrate to be transferred, and corrects the position of the substrate-to-be-transferred holding unit with respect to the irradiation position of the laser. The control unit uses the component measurement camera to capture the reference mark for the substrate to be transferred and calculates the relative position of the component measurement camera with respect to the reference mark for the substrate to be transferred, or uses the component measurement camera to capture the reference mark for the transfer substrate and calculates the relative position of the component measurement camera with respect to the reference mark for the transfer substrate, and corrects the position of the component measurement camera with respect to the substrate-to-be-transferred holding unit or the transfer substrate holding unit.

4. A method for correcting the position of a transfer device The transfer device transfers the components held on the transfer substrate to the substrate to be transferred by irradiating the laser of the laser irradiation unit. In the transfer device, based on the irradiation position of the laser, the position of the substrate-to-be-transferred holding unit that holds the substrate to be transferred, the position of the transfer substrate holding unit that holds the transfer substrate, and the position of the component measurement camera that measures the position of the component are corrected. Wherein, The method for correcting the position of the transfer device includes: A laser irradiation process for the substrate-to-be-transferred holding unit, which irradiates the laser onto a fluorescent light-emitting component marked with the reference mark for the substrate to be transferred of the substrate-to-be-transferred holding unit to cause the fluorescent light-emitting component marked with the reference mark for the substrate to be transferred to emit fluorescence. The position calculation process of the transfer substrate holding part uses a holding part measurement camera that measures the positions of the transfer substrate holding part and the substrate to be transferred holding part, and simultaneously captures the fluorescence emission points of the fluorescence-emitting component marked with the reference mark for the substrate to be transferred and the reference mark for the substrate to be transferred, and calculates the relative position of the reference mark for the substrate to be transferred with respect to the fluorescence emission points of the fluorescence-emitting component marked with the reference mark for the substrate to be transferred; The position correction process of the substrate to be transferred holding part corrects the position of the substrate to be transferred holding part with respect to the irradiation position of the laser; The position calculation process of the component measurement camera uses the component measurement camera to capture the reference mark for the substrate to be transferred, and calculates the relative position of the component measurement camera with respect to the reference mark for the substrate to be transferred; The position correction process of the component measurement camera corrects the position of the component measurement camera with respect to the substrate to be transferred holding part; The position calculation process of the transfer substrate holding part uses the component measurement camera to capture the reference mark for the substrate to be transferred of the transfer substrate holding part, and calculates the relative position of the reference mark for the substrate to be transferred with respect to the component measurement camera; and The position correction process of the transfer substrate holding part corrects the position of the transfer substrate holding part with respect to the component measurement camera.

5. A position correction method for a transfer device The transfer device transfers components held on a transfer substrate to a substrate to be transferred by the irradiation of laser from a laser irradiation unit. In the transfer device, based on the irradiation position of the laser, the position of the substrate to be transferred holding part that holds the substrate to be transferred, the position of the transfer substrate holding part that holds the transfer substrate, and the position of the component measurement camera that measures the position of the component are corrected, wherein, the position correction method of the transfer device includes: The laser irradiation process of the transfer substrate holding part uses the laser irradiation unit to irradiate laser on the fluorescence-emitting component marked with the reference mark for the transfer substrate of the transfer substrate holding part, so that the fluorescence-emitting component marked with the reference mark for the transfer substrate emits fluorescence; The position calculation process of the transfer substrate holding part uses a holding part measurement camera that measures the positions of the transfer substrate holding part and the substrate to be transferred holding part, and simultaneously captures the fluorescence emission points of the fluorescence-emitting component marked with the reference mark for the transfer substrate and the reference mark for the transfer substrate, and calculates the relative position of the reference mark for the transfer substrate with respect to the fluorescence emission points of the fluorescence-emitting component marked with the reference mark for the transfer substrate; The position correction process of the transfer substrate holding part corrects the position of the transfer substrate holding part with respect to the irradiation position of the laser; The laser irradiation process of the substrate to be transferred holding part uses the laser irradiation unit to irradiate laser on the fluorescence-emitting component marked with the reference mark for the substrate to be transferred of the substrate to be transferred holding part, so that the fluorescence-emitting component marked with the reference mark for the substrate to be transferred emits fluorescence; The step of calculating the position of the substrate to be transferred holding part uses the camera of the holding part to simultaneously capture the fluorescence emission points of the fluorescence-emitting component marked with the reference mark for the substrate to be transferred and the reference mark for the substrate to be transferred, and calculates the relative position of the reference mark for the substrate to be transferred with respect to the fluorescence emission points of the fluorescence-emitting component marked with the reference mark for the substrate to be transferred; The step of correcting the position of the substrate to be transferred holding part corrects the position of the substrate to be transferred holding part with respect to the irradiation position of the laser; The step of calculating the position of the component measurement camera uses the component measurement camera to capture the reference mark for the substrate to be transferred and calculates the relative position of the component measurement camera with respect to the reference mark for the substrate to be transferred, or uses the component measurement camera to capture the reference mark for the transfer substrate and calculates the relative position of the component measurement camera with respect to the reference mark for the transfer substrate; and The step of correcting the position of the component measurement camera corrects the position of the component measurement camera with respect to the substrate to be transferred holding part or the transfer substrate holding part.

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