Light-emitting device

Abstract

The present invention provides a light-emitting device capable of suppressing peeling of a covering member from a resin package. The light-emitting device includes: a resin package having a first lead and a second lead and a resin portion holding the first lead and the second lead; at least one light-emitting element mounted on the resin package; a covering member covering at least a part of the upper surfaces of the first lead, the second lead, and the resin portion, the first lead having a first portion and a first extension portion, the second lead having a second portion and a second extension portion, the resin portion having at least one resin recess between the first lead and the second lead, at least a part of the resin recess being clamped by the first portion and the second portion in a first direction and being clamped by the first extension portion and the second extension portion in a second direction, and at least a part of the resin recess being covered by the covering member.

Description

Technical Field

[0001] The present invention relates to a light-emitting device. Background Art

[0002] A light-emitting device using a light-emitting element such as an LED easily achieves high luminous efficiency, and thus is used in a large number of devices including a backlight and a lighting fixture for a display. Patent Document 1 discloses a light-emitting device including a resin package having a pair of positive and negative leads, a light-emitting element mounted on the resin package, and a covering member covering the pair of positive and negative leads.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2013-125776 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] An object of an embodiment of the present invention is to provide a light-emitting device that suppresses peeling of a covering member from a resin package.

[0008] Means for Solving the Problems

[0009] One embodiment provides a light-emitting device including: a resin package having a first lead, a second lead, and a resin portion holding the first lead and the second lead; at least one light-emitting element mounted on the resin package; and a covering member covering at least a part of an upper surface of the first lead, the second lead, and the resin portion, the first lead having a first portion and a first extension portion extending from the first portion toward the second lead side in a first direction, the second lead having a second portion overlapping the first portion in the first direction and a second extension portion extending from the second portion toward the first lead side in the first direction and overlapping the first extension portion in a second direction orthogonal to the first direction, the resin portion having at least one resin recess recessed downward from an upper surface of the first lead between the first lead and the second lead, at least a part of the resin recess being clamped by the first portion and the second portion in the first direction and being clamped by the first extension portion and the second extension portion in the second direction, and at least a part of the resin recess being covered by the covering member.

[0010] Advantages of the Invention

[0011] According to a light-emitting device of an embodiment of the present invention, peeling of a covering member from a resin package can be suppressed. Brief Description of the Drawings

[0012] Figure 1 is a schematic top view of the light-emitting device of the present embodiment.

[0013] Figure 2A is Figure 1 a schematic cross-sectional view taken along line IIA-IIA shown in the figure.

[0014] Figure 2B is Figure 1 a schematic cross-sectional view taken along line IIB-IIB shown in the figure.

[0015] Figure 3 is a schematic bottom view of the light-emitting device of the present embodiment.

[0016] Figure 4 is a schematic top view showing the resin encapsulation of the present embodiment.

[0017] Figure 5A is a schematic top view showing the first lead and the second lead of the present embodiment.

[0018] Figure 5B is a schematic bottom view showing the first lead and the second lead of the present embodiment. Detailed Embodiment

[0019] Hereinafter, the embodiments will be described with reference to the drawings. Each drawing schematically shows the embodiments, and sometimes the scales, intervals, positional relationships, etc. of the components are exaggerated, or a part of the components is omitted, or, as a cross-sectional view, only an end view of the cut surface is shown. In addition, in each drawing, the same reference numerals are assigned to the same structures.

[0020] In the following description, components having the same function are denoted by the same reference numerals, and the description may be omitted sometimes. In addition, terms indicating a specific direction or position (for example, "upper", "lower" and other terms including these terms) are sometimes used. However, these terms are only used to easily understand the relative directions or positions in the reference drawings. If the relative directions or positional relationships of the terms such as "upper" and "lower" in the reference drawings are the same, in the drawings other than the present disclosure, actual products, etc., the configurations may not be the same as those in the reference drawings. The positional relationship expressed as "upper" in this specification also includes the case of being in contact and the case of being located on the upper side although not in contact.

[0021] <Embodiments>

[0022] Figures 1 to 5B The light-emitting device 100 of the present embodiment will be described. In order to show the internal structure, in Figure 1 the first light-transmissive member 41 and the second light-transmissive member 42 are shown as transparent members. In Figure 5A , Figure 5BIn the figure, the boundaries between the first part 11A and the first extension part 11B of the first lead 11, and between the second part 12A and the second extension part 12B of the second lead 12 are shown by dashed lines. For reference, arrows indicating the X direction, Y direction, and Z direction that are orthogonal to each other are depicted in Figures 1 to 5B In the figure.

[0023] The light-emitting device 100 includes a resin encapsulation 10, at least one light-emitting element 20, and a covering member 30. The light-emitting device 100 may further include a first light-transmissive member 41, a second light-transmissive member 42, and a protection element 50. The resin encapsulation 10 has a first lead 11, a second lead 12, and a resin part 13. The resin part 13 holds the first lead 11 and the second lead 12. At least one light-emitting element 20 is placed on the resin encapsulation 10. The covering member 30 covers at least a part of the upper surface of the first lead 11, at least a part of the upper surface of the second lead 12, and at least a part of the upper surface of the resin part 13. The first lead 11 has a first part 11A and a first extension part 11B. The first extension part 11B extends from the first part 11A toward the second lead 12 side in a first direction. The second lead 12 has a second part 12A and a second extension part 12B. The second part 12A overlaps the first part 11A in the first direction. The second extension part 12B extends from the second part 12A toward the first lead 11 side in the first direction and overlaps the first extension part 11B in a second direction orthogonal to the first direction. The resin part 13 has at least one resin recess 14 that is recessed downward from the upper surface of the first lead 11 between the first lead 11 and the second lead 12. At least a part of the resin recess 14 is clamped by the first part 11A and the second part 12A in the first direction. At least a part of the resin recess 14 is clamped by the first extension part 11B and the second extension part 12B in the second direction. At least a part of the resin recess 14 is covered by the covering member 30. In Figure 1 the figure, the first direction is the X direction and the second direction is the Y direction. In this specification, sometimes the first direction from the first part 11A side toward the second part 12A side is referred to as the +X direction, and the first direction from the second part 12A side toward the first part 11A side is referred to as the -X direction. Sometimes the second direction from the first extension part 11B side toward the second extension part 12B side is referred to as the +Y direction, and the second direction from the second extension part 12B side toward the first extension part 11B side is referred to as the -Y direction. Additionally, sometimes the first lead 11 and / or the second lead 12 are referred to as leads.

[0024] Since at least a part of the resin recess 14 is covered by the covering member 30, it is easy to increase the area where the resin part 13 and the covering member 30 are in contact. As a result, the adhesion between the resin part 13 and the covering member 30 is improved, and thus, it is possible to prevent the covering member from peeling off from the resin encapsulation.

[0025] At least a part of the resin recess 14 is clamped by the first part 11A and the second part 12A in the first direction and by the first extension part 11B and the second extension part 12B in the second direction. Therefore, breakage of the resin part 13 can be suppressed. Generally, the mechanical strength of a lead is higher than that of resin. Therefore, even when a force is applied from the first direction and / or the second direction, the resin is not easily deformed. Thus, by clamping the lead with at least a part of the resin recess 14 that is not easily deformed, deformation of the resin recess 14 can be suppressed even when a force is applied from the first direction and / or the second direction. Thereby, breakage of the resin part 13 can be suppressed.

[0026] Hereinafter, each element constituting the light-emitting device 100 will be described in detail.

[0027] (Resin package 10)

[0028] The resin package 10 is a component for mounting the light-emitting element 20. The resin package 10 has a first lead 11, a second lead 12, and a resin part 13.

[0029] The first lead 11 has a first part 11A and a first extension part 11B. The first extension part 11B extends from the first part 11A toward the second lead 12 side in the first direction (X direction). The second lead 12 has a second part 12A and a second extension part 12B. The second part 12A overlaps the first part 11A in the first direction (X direction). The second extension part 12B extends from the second part 12A toward the first lead 11 side in the first direction (X direction) and overlaps the first extension part 11B in the second direction (Y direction). In the first direction (X direction), the first part 11A and the second part 12A are arranged and configured. In the second direction (Y direction), the first extension part 11B and the second extension part 12B are arranged and configured. In addition, the resin package 10 may have three or more leads in addition to the two leads of the first lead 11 and the second lead 12.

[0030] Preferably, the maximum length of the first extension part 11B in the second direction (Y direction) is shorter than the maximum length of the first part 11A in the second direction (Y direction). Thereby, it is easy to miniaturize the light-emitting device in the second direction (Y direction). Preferably, the first part 11A does not overlap the second lead 12 in the second direction (Y direction). Thereby, it is easy to miniaturize the light-emitting device in the second direction (Y direction). Preferably, the maximum length of the second extension part 12B in the second direction (Y direction) is shorter than the maximum length of the second part 12A in the second direction (Y direction). Thereby, it is easy to miniaturize the light-emitting device in the second direction (Y direction). Preferably, the second part 12A does not overlap the first lead 11 in the second direction (Y direction). Thereby, it is easy to miniaturize the light-emitting device in the second direction (Y direction).

[0031] As Figure 4 , Figure 5A, Figure 5B As shown, the first extension portion 11B may also have a first convex portion 11B1 and a first extension main body portion 11B2. The first convex portion 11B1 extends from the first extension main body portion 11B2 toward the second lead 12 along the second direction (Y direction). One first convex portion 11B1 may extend from the first extension main body portion 11B2, or multiple first convex portions 11B1 may extend as shown in Figure 4 , Figure 5A , Figure 5B As shown. By having the first convex portion 11B1 on the first extension portion 11B, it is easy to increase the area where the first lead 11 is in contact with the resin portion 13. Thereby, the adhesion between the first lead 11 and the resin portion 13 is improved.

[0032] As Figure 4 , Figure 5A , Figure 5B shown, the second extension portion 12B may also have a second convex portion 12B1 and a second extension main body portion 12B2. The second convex portion 12B1 is opposed to the first convex portion 11B1 in the second direction (Y direction). The second convex portion 12B1 extends from the second extension main body portion 12B2 toward the first lead 11 along the second direction (Y direction). One second convex portion 12B1 may extend from the second extension main body portion 12B2, or multiple second convex portions 12B1 may extend as shown in Figure 4 , Figure 5A , Figure 5B As shown. By having the second convex portion 12B1 on the second extension portion 12B, it is easy to increase the area where the second lead 12 is in contact with the resin portion 13.

[0033] As Figure 5A shown, it is preferable that a first groove 15A (represented by grid shading) is provided on the upper surface of the first lead 11 and / or the second lead 12. The first groove 15A is recessed downward from the upper surface of the first lead 11 and / or the second lead 12. The first groove 15A can be formed by etching, stamping, or the like. Regarding the first groove 15A, the resin portion 13 is disposed within the first groove 15A. Thereby, the adhesion between the resin portion 13 and the first lead 11 and / or the second lead 12 is improved.

[0034] As Figure 5BAs shown, preferably, a second groove 15B (represented by grid shading) is provided on the lower surface of the first lead 11 and / or the second lead 12. The second groove 15B is recessed upward from the lower surface of the first lead 11 and / or the second lead 12. The second groove 15B can be formed by etching, stamping, or the like. The second groove 15B is arranged along the outer edge of the first lead 11 and / or the second lead 12. A resin portion 13 is arranged in the second groove 15B. Thereby, the adhesion between the resin portion 13 and the first lead 11 and / or the second lead 12 is improved. Preferably, the second groove 15B is provided on the lower surfaces of the first convex portion 11B1 and the second convex portion 12B1. Thereby, when the resin portion 13 is formed by injection molding or the like, the non-filled resin portion 13 can be suppressed.

[0035] As Figure 2A shown, the first lead 11 and / or the second lead 12 may also be provided with a third groove 15C opened on the lower surface and the side surface of the resin package. The third groove 15C functions as a hemming portion. For example, when the light-emitting device is soldered to the mounting substrate, by the light-emitting device having the third groove 15C, it is easy to confirm the molten state of the solder.

[0036] As Figure 3 shown, preferably, the first lead 11 and the second lead 12 are exposed from the resin portion 13 on the lower surface of the light-emitting device. Thereby, the heat from the light-emitting device is easily transferred from the first lead 11 and the second lead 12 to the mounting substrate on which the light-emitting device is mounted. Thereby, the heat dissipation of the light-emitting device 100 can be improved.

[0037] The first lead 11 and the second lead 12 are components for electrically connecting to the light-emitting element 20 and supplying power to the light-emitting element. The first lead 11 and the second lead 12 can be formed into a prescribed shape, for example, by processing such as rolling, blanking, extrusion, etching based on wet or dry etching, or a combination thereof, using metals such as copper, aluminum, gold, silver, iron, nickel, or their alloys, phosphor bronze, iron-containing copper, etc. They can be a single layer or a laminated structure. It is particularly preferable to use inexpensive and highly heat-dissipating copper. For example, for the purpose of improving the reflectivity, the first lead 11 and the second lead 12 may be locally or entirely plated with metals such as silver, aluminum, copper, and gold in a single layer or a laminated structure. Further, when a silver-containing metal layer is formed on the outermost surface of the first lead 11 and the second lead 12, it is preferable to provide a protective layer such as silicon oxide on the surface of the silver-containing metal layer. Thereby, the silver-containing metal layer can be prevented from discoloring due to sulfur components in the atmosphere, etc. Examples of the film-forming method of the protective layer include known methods such as vacuum processes such as sputtering.

[0038] The resin portion 13 is a component for holding the first lead 11 and the second lead 12. As Figure 4As shown, the resin part 13 has at least one resin recess 14 (represented by grid shading). The resin part 13 may also have a plurality of resin recesses 14. The resin recess 14 is located between the first lead 11 and the second lead 12. The resin recess 14 is recessed downward from the upper surface 111 of the first lead 11. The resin recess 14 is recessed downward from the upper surface 121 of the second lead 12. By providing the resin recess 14 in the resin part 13, the surface area of the resin part 13 can be increased. Thereby, the area where the covering member 30 and the resin part 13 are in contact can be increased, and thus, peeling of the covering member 30 from the resin package 10 can be suppressed.

[0039] At least a part of the resin recess 14 is clamped by the first part 11A and the second part 12A in the first direction (X direction), and is clamped by the first extension part 11B and the second extension part 12B in the second direction (Y direction). Thereby, when an external force is applied in the first direction and / or the second direction, deformation of at least a part of the resin recess 14 can be suppressed. Thereby, breakage of the resin part 13 can be suppressed.

[0040] Preferably, the whole of at least one resin recess 14 is clamped by the first extension part 11B and the second extension part 12B in the second direction. Thereby, breakage of the resin part 13 can be further suppressed. In the case of having a plurality of resin recesses 14, preferably, the whole of the plurality of resin recesses 14 is clamped by the first extension part 11B and the second extension part 12B in the second direction. Thereby, breakage of the resin part 13 can be further suppressed.

[0041] Preferably, the whole of at least one resin recess 14 is clamped by the first part 11A and the second part 12A in the first direction. Thereby, breakage of the resin part 13 can be further suppressed. In the case of having a plurality of resin recesses 14, preferably, the whole of the plurality of resin recesses 14 is clamped by the first part 11A and the second part 12A in the first direction. Thereby, breakage of the resin part 13 can be further suppressed.

[0042] The size of the resin recess 14 in a top view is not particularly limited. Preferably, the maximum length of the resin recess 14 in the first direction (X direction) is longer than the maximum length of the resin recess 14 in the second direction (Y direction). Thus, compared with the case where the maximum length of the resin recess 14 in the first direction (X direction) is shorter than the maximum length of the resin recess 14 in the second direction (Y direction), it is easier to increase the surface area of the resin recess 14. Thus, it is easy to improve the adhesion between the resin part 13 and the covering member 30, and therefore, peeling of the covering member 30 from the resin package 10 can be suppressed. In this specification, the maximum length of the resin recess 14 in the first direction (X direction) is the length from the portion of the resin recess 14 closest to the +X direction to the portion of the resin recess 14 closest to the -X direction. In the case where there are a plurality of resin recesses 14, the maximum length of the resin recess 14 in the first direction (X direction) is set as the length from the portion of the resin recess 14 closest to the +X direction among the plurality of resin recesses 14 to the portion of the resin recess 14 closest to the -X direction among the plurality of resin recesses 14. Similarly, the maximum length of the resin recess 14 in the second direction (Y direction) is the length from the portion of the resin recess 14 closest to the +Y direction to the portion of the resin recess 14 closest to the -Y direction. In the case where there are a plurality of resin recesses 14, the maximum length of the resin recess 14 in the second direction (Y direction) is set as the length from the portion of the resin recess 14 closest to the +Y direction among the plurality of resin recesses 14 to the portion of the resin recess 14 closest to the -Y direction among the plurality of resin recesses 14.

[0043] In a top view, the resin recess 14 may be in contact with and / or separated from the first lead 11 and / or the second lead 12. In a top view, it is preferable that the resin recess 14 is in contact with the first lead 11 and the second lead 12. Thus, it is easy to increase the surface area of the resin recess 14. The surface of the resin recess 14 preferably has a convex portion. Thus, it is easy to increase the surface area of the resin recess 14.

[0044] Preferably, at least a part of the resin recess is clamped between the first convex portion 11B1 and the second convex portion 12B1 in the second direction (Y direction). By having the first convex portion 11B1, it is easy to increase the volume of the first lead 11. By increasing the volume of the first lead 11, deformation of the first lead 11 due to an external force is suppressed. Similarly, by having the second convex portion 12B1, it is easy to increase the volume of the second lead 12. By increasing the volume of the second lead 12, deformation of the second lead 12 due to an external force is suppressed. By clamping at least a part of the resin recess between the first lead 11 and the second lead 12 that are not easily deformed, deformation of the resin recess 14 can be suppressed. Thus, breakage of the resin part 13 can be suppressed.

[0045] In the case where there are a plurality of resin recesses 14, it is preferable to arrange the plurality of resin recesses 14 on a straight line extending in the first direction (X direction). Thereby, it is easy to miniaturize the light-emitting device in the second direction (Y direction). In this specification, arranging the plurality of resin recesses 14 on a straight line extending in the first direction (X direction) means that an imaginary straight line extending parallel to the first direction (X direction) overlaps with the plurality of resin recesses 14. It is preferable to arrange all of the plurality of resin recesses 14 on a straight line extending in the first direction (X direction).

[0046] As the resin material of the resin portion 13, known materials such as thermosetting resins and thermoplastic resins can be used. In the case of a thermoplastic resin, for example, polyphthalamide resin, polybutylene terephthalate (PBT), unsaturated polyester, etc. can be used. In the case of a thermosetting resin, for example, epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, etc. can be used. In particular, as the resin material, thermosetting resins such as epoxy resin and silicone resin, which have excellent heat resistance and light resistance, are preferably used.

[0047] It is preferable that the resin portion 13 contains a light-reflective substance in the resin material. As the light-reflective substance, a component that hardly absorbs light from the light-emitting element and has a large refractive index difference with respect to the resin material is preferably used. Examples of such a light-reflective substance include titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, aluminum nitride, etc. For example, the light-reflective substance can be contained in an amount of 10 wt% or more and 90 wt% or less with respect to the resin material.

[0048] (Light-emitting element 20)

[0049] The light-emitting element 20 is a semiconductor element that emits light by applying a voltage, and a known semiconductor element composed of a nitride semiconductor or the like can be applied. As the light-emitting element 20, for example, an LED chip can be cited. The light-emitting element 20 includes a semiconductor laminate and element electrodes. The semiconductor laminate includes an n-type semiconductor layer, a p-type semiconductor layer, and a light-emitting layer sandwiched between these layers. The light-emitting layer may have a structure such as a double heterojunction or a single quantum well (SQW), or may have a structure such as a multi-quantum well (MQW) having a single active layer group. The semiconductor laminate is configured to be able to emit visible light or ultraviolet light. Such a semiconductor laminate including a light-emitting layer can include, for example, In x Al y Ga 1-x-y N (0 ≦ x, 0 ≦ y, x + y ≦ 1).

[0050] The semiconductor laminate may have a structure including one or more light-emitting layers between an n-type semiconductor layer and a p-type semiconductor layer, or may have a structure in which the structure including an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer in sequence is repeated multiple times. When the semiconductor laminate includes a plurality of light-emitting layers, the light-emitting layers may include light-emitting layers having different peak emission wavelengths, or may include light-emitting layers having the same peak emission wavelength. In addition, the same peak emission wavelength also includes a case where there is unevenness within ±10 nm. The combination of the peak emission wavelengths between the plurality of light-emitting layers can be appropriately selected. For example, when the semiconductor laminate includes two light-emitting layers, the light-emitting layers can be selected by combinations such as blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, or green light and red light. Each light-emitting layer may include a plurality of active layers having different peak emission wavelengths, or may include a plurality of active layers having the same peak emission wavelength.

[0051] One light-emitting element 20 may be mounted in one light-emitting device, or a plurality of light-emitting elements may be mounted. As Figure 1 shown, two light-emitting elements may also be mounted on the light-emitting device 100. In this specification, the two light-emitting elements are sometimes referred to as a first light-emitting element 20A and a second light-emitting element 20B. In the first direction (X direction), it is preferable that the first light-emitting element 20A and the second light-emitting element 20B are arranged and configured. Thereby, it is easy to miniaturize the light-emitting device in the second direction (Y direction).

[0052] When a plurality of light-emitting elements are mounted, in order to increase the luminous intensity, light-emitting elements having the same peak emission wavelength may be combined. In addition, for example, by combining a plurality of light-emitting elements having different peak emission wavelengths in a manner corresponding to red, green, and blue, the color reproducibility can also be improved. When the light-emitting device includes a plurality of light-emitting elements, all of them may be connected in series, all of them may be connected in parallel, or a combination of series and parallel connections may be used.

[0053] The light-emitting element 20 includes an electrode surface 201A having a pair of positive and negative element electrodes 21. It may be a face-up mounting in which the electrode surface having a pair of positive and negative element electrodes is set as the upper side for mounting, or as Figure 2BFlip chip mounting is shown in which the electrode surface 201A having a pair of positive and negative element electrodes 21 and the first lead 11 are opposed and placed. In this specification, the surface of the light-emitting element 20 that faces the placement surface of the resin package 10 on which the light-emitting element 20 is placed is sometimes referred to as the lower surface of the light-emitting element. In the case of face-up mounting, the surface on the opposite side of the electrode surface having a pair of positive and negative element electrodes is the lower surface of the light-emitting element. In the case of flip chip mounting, the electrode surface having a pair of positive and negative element electrodes is the lower surface of the light-emitting element. In addition, the surface on the opposite side of the lower surface of the light-emitting element is sometimes referred to as the upper surface of the light-emitting element, and the surface between the upper surface and the lower surface of the light-emitting element is referred to as the side surface of the light-emitting element.

[0054] (Coating member 30)

[0055] The coating member 30 is a member that covers at least a part of the upper surfaces of the first lead 11, the second lead 12, and the resin portion 13. Thereby, the upper surfaces of the first lead 11, the second lead 12, and the resin portion 13 can be protected from external forces and the like. The coating member 30 covers at least a part of the resin recess 14. The upper surface of the light-emitting element may be covered by the coating member 30 or may be exposed from the coating member 30 as shown in FIG. 2. When the electrode surface 201A of the light-emitting element 20 and the first lead 11 are opposed, it is preferable that the coating member 30 covers the electrode surface 201A. Thereby, the coating member 30 is clamped by the electrode surface 201A and the first lead 11. Thereby, peeling of the coating member 30 from the resin package 10 can be suppressed.

[0056] The coating member 30 may have functions such as wavelength conversion and / or light reflection according to the particles added to the coating member 30. Specifically, the coating member 30 may also contain a phosphor and / or a light-reflective substance in the resin material. The same resin material as that of the resin portion 13 can be used for the resin material of the coating member 30. As the resin material of the coating member 30, a dimethyl silicone resin with particularly excellent light resistance is preferably used. By the coating member 30 containing a phosphor, color adjustment of the light-emitting device becomes easy. As the phosphor, the following can be used: yttrium-aluminum-garnet-based phosphors (for example, Y3(Al, Ga)5O 12 :Ce), lutetium-aluminum-garnet-based phosphors (for example, Lu3(Al, Ga)5O 12 :Ce), terbium-aluminum-garnet-based phosphors (for example, Tb3(Al, Ga)5O 12 :Ce), β-sialon-based phosphors (for example, (Si, Al)3(O, N)4:Eu), α-sialon-based phosphors (for example, Mz(Si, Al) 12 (O, N) 16: Eu (where 0 < z ≤ 2, and M is a lanthanum element other than Li, Mg, Ca, Y, La, and Ce)), nitride-based phosphors such as CASN-based phosphors (e.g., CaAlSiN3:Eu) or SCASN-based phosphors (e.g., (Sr, Ca)AlSiN3:Eu), fluoride-based phosphors such as KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2(Si, Al)F6:Mn) or MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), phosphors having a perovskite structure (e.g., CsPb(F, Cl, Br, I)3), or quantum dot phosphors (e.g., CdSe, InP, AgInS2 or AgInSe2), etc. As the phosphor contained in the coating member 30, one kind of phosphor can be used, or a plurality of kinds of phosphors can be used.

[0057] As the KSAF-based phosphor, it may also have a composition represented by the following formula (I).

[0058] M2[Si p Al q Mn r F s (I)

[0059] In formula (I), M represents an alkali metal and may at least contain K. Mn may also be a tetravalent Mn ion. p, q, r, and s may satisfy 0.9 ≤ p + q + r ≤ 1.1, 0 < q ≤ 0.1, 0 < r ≤ 0.2, 5.9 ≤ s ≤ 6.1. It may also be preferably 0.95 ≤ p + q + r ≤ 1.05 or 0.97 ≤ p + q + r ≤ 1.03, 0 < q ≤ 0.03, 0.002 ≤ q ≤ 0.02 or 0.003 ≤ q ≤ 0.015, 0.005 ≤ r ≤ 0.15, 0.01 ≤ r ≤ 0.12 or 0.015 ≤ r ≤ 0.1, 5.92 ≤ s ≤ 6.05 or 5.95 ≤ s ≤ 6.025. For example, examples include those represented by K2[Si 0.946 Al 0.005 Mn 0.049 F 5.995 , K2[Si 0.942 Al 0.008 Mn 0.050 F 5.992 , K2[Si 0.939 Al 0.014 Mn 0.047 F 5.986 . According to this KSAF-based phosphor, red light emission with high luminance and a narrow half-value width of the emission peak wavelength can be obtained.

[0060] The coating member 30 may also contain a light-reflective substance. By the coating member 30 containing a light-reflective substance, the light from the light-emitting element 20 is reflected by the coating member 30. Therefore, it is possible to suppress the light from the light-emitting element 20 from being absorbed by the resin encapsulation 10. Thereby, the light extraction efficiency of the light-emitting device can be improved. The same light-reflective substance as that of the resin portion 13 can be used for the light-reflective substance of the coating member 30.

[0061] When the coating member contains a light-reflective substance, it is preferably as Figure 2A shown that at least a part of the first element first side surface 201C of the first light-emitting element 20A facing the side surface of the second light-emitting element 20B is covered by the coating member 30. Thereby, it is possible to suppress the light from the first light-emitting element 20A from being absorbed by the second light-emitting element 20B. The first element first side surface 201C is a part of the side surface of the first light-emitting element 20A. In addition, it is preferably that at least a part of the second element first side surface 202C of the second light-emitting element 20B facing the first element first side surface 201C of the first light-emitting element 20A is covered by the coating member 30. Thereby, it is possible to suppress the light from the second light-emitting element 20B from being absorbed by the first light-emitting element 20A.

[0062] As Figure 2A shown, in a cross-sectional view, the height of the coating member 30 covering the first element second side surface 201D located on the opposite side of the first element first side surface 201C is preferably lower than the height of the coating member 30 covering the first element first side surface 201C. Thereby, it is possible to suppress the light from the first light-emitting element 20A from being blocked by the coating member 30. Therefore, the light extraction efficiency of the light-emitting device is improved. Similarly, in a cross-sectional view, the height of the coating member 30 covering the second element second side surface 202D located on the opposite side of the second element first side surface 202C is preferably lower than the height of the coating member 30 covering the second element first side surface 202C.

[0063] (First light-transmissive member 41)

[0064] The light-emitting device 100 may also include a first light-transmissive member 41 that covers the light-emitting element 20. The first light-transmissive member 41 has light transmissivity. In addition, having light transmissivity in this specification means that the transmittance with respect to the peak wavelength of the light-emitting element is 40% or more. When the light-emitting device includes a plurality of light-emitting elements, it is sufficient that the transmittance with respect to the peak wavelength of at least one light-emitting element is 40% or more. As shown in FIG. 2, the first light-transmissive member 41 covers the upper surface of the light-emitting element 20. Thereby, the light-emitting element 20 can be protected from external forces and the like. The first light-transmissive member 41 is in contact with the covering member 30. Preferably, the surface where the first light-transmissive member 41 and the covering member 30 are in contact has irregularities. Thereby, the adhesion between the first light-transmissive member 41 and the covering member 30 is improved. As a method of forming irregularities on the surface of the covering member 30, for example, grinding, sandblasting, etc. can be cited. The first light-transmissive member 41 may also contain a phosphor and / or a light-reflective substance in the resin material. The same resin material as the resin portion 13 can be used for the resin material of the first light-transmissive member 41. Preferably, the first light-transmissive member 41 contains dimethyl silicone resin with particularly excellent light resistance. The phosphor contained in the first light-transmissive member 41 can be the same phosphor as that of the covering member 30. The light-reflective substance contained in the first light-transmissive member 41 can be the same light-reflective substance as that of the resin portion 13. By the light-reflective substance contained in the first light-transmissive member 41, the light from the light-emitting element 20 is easily diffused.

[0065] (Second light-transmissive member 42)

[0066] The light-emitting device 100 may also include a second light-transmissive member 42 that is connected to the first light-transmissive member 41 and covers the light-emitting element 20. The second light-transmissive member 42 has light-transmitting properties. As shown in FIG. 2, the second light-transmissive member 42 covers the upper surface of the light-emitting element 20 via the first light-transmissive member 41. Thereby, the light-emitting element 20 can be protected from external forces and the like. Preferably, the surfaces where the first light-transmissive member 41 and the second light-transmissive member 42 are in contact have irregularities. Thereby, the adhesion between the first light-transmissive member 41 and the second light-transmissive member 42 is improved. As a method of forming irregularities on the surface of the first light-transmissive member 41, for example, grinding, sandblasting, etc. can be cited. The second light-transmissive member 42 may also contain a phosphor and / or a light-reflective substance in the resin material. The same resin material as that of the resin portion 13 can be used for the resin material of the second light-transmissive member 42. The second light-transmissive member 42 may also contain phenyl silicone resin, which is less permeable to moisture than dimethyl silicone resin. Thereby, it is possible to suppress the deterioration of the light-emitting element and the like due to moisture. When the first light-transmissive member contains a phosphor, it is preferable that the second light-transmissive member does not contain a phosphor. Thereby, the second light-transmissive member 42 that does not contain a phosphor also functions as a protective layer. Therefore, it is possible to suppress the deterioration of the phosphor of the first light-transmissive member due to moisture and the like. As a phosphor that is susceptible to moisture, for example, KSF-based phosphors and KSAF-based phosphors can be cited. In this specification, "not containing a phosphor" means not excluding unavoidably mixed phosphors, and includes a case where the content rate of wavelength-converting particles is 0.05 wt% or less.

[0067] (Protection element 50)

[0068] The light-emitting device 100 may also include a protection element 50 placed on the resin package 10. The protection element 50 is an element for protecting the light-emitting element 20 from the effects of static electricity and high-voltage surges. Specifically, as the protection element 50, a Zener diode can be cited. The protection element 50 and the light-emitting element 20 are electrically connected in parallel. In order to suppress the protection element 50 from absorbing the light from the light-emitting element 20, it is preferable that the protection element 50 is covered with a covering member.

[0069] As described above, the embodiments of the present invention have been described with reference to specific examples. However, the present invention is not limited to these specific examples. All modes that can be appropriately designed and implemented by those skilled in the art based on the above-described embodiments of the present invention belong to the scope of the present invention as long as they include the gist of the present invention. In addition, within the scope of the idea of the present invention, those skilled in the art can conceive of various modification examples and correction examples, and these modification examples and correction examples also belong to the scope of the present invention.

[0070] Industrial applicability

[0071] The light-emitting device according to an embodiment of the present invention can be used in various light-emitting devices such as a backlight light source for liquid crystals, a lighting light source, a vehicle-mounted light source, and a display light source.

[0072] Explanation of Reference Numerals

[0073] 10 Resin Encapsulation

[0074] 11 First Lead

[0075] 12 Second Lead

[0076] 13 Resin Part

[0077] 14 Resin Recess

[0078] 20 Light-Emitting Element

[0079] 30 Coating Member

[0080] 41 First Light-Transmissive Member

[0081] 42 Second Light-Transmissive Member

[0082] 50 Protection Element

[0083] 100 Light-Emitting Device

Claims

1. A light-emitting device, comprising: a resin encapsulation having a first lead, a second lead, and a resin portion holding the first lead and the second lead; at least one light-emitting element mounted on the resin encapsulation; a covering member covering at least a part of the upper surfaces of the first lead, the second lead, and the resin portion, the first lead having a first portion and a first extension portion extending from the first portion toward the second lead side in a first direction, the second lead having a second portion overlapping the first portion in the first direction and a second extension portion extending from the second portion toward the first lead side in the first direction and overlapping the first extension portion in a second direction orthogonal to the first direction, the resin portion having at least one resin recess recessed downward from the upper surface of the first lead between the first lead and the second lead, at least a part of the resin recess being clamped between the first portion and the second portion in the first direction and between the first extension portion and the second extension portion in the second direction, at least a part of the resin recess being covered by the covering member, the surface of the resin recess having a convex portion.

2. The light-emitting device according to claim 1, wherein the whole of the resin recess is clamped between the first extension portion and the second extension portion in the second direction.

3. The light-emitting device according to claim 1 or 2, wherein the maximum length of the resin recess in the first direction is longer than the maximum length of the resin recess in the second direction.

4. The light-emitting device according to claim 1 or 2, wherein the first extension portion has a first convex portion extending in the second direction, the second extension portion has a second convex portion opposed to the first convex portion, at least a part of the resin recess being clamped between the first convex portion and the second convex portion.

5. The light-emitting device according to claim 1 or 2, wherein the resin recess has a plurality of them.

6. The light-emitting device according to claim 5, wherein the plurality of resin recesses are arranged on a straight line extending in the first direction.

7. The light-emitting device according to claim 1 or 2, wherein the at least one light-emitting element includes an electrode surface having a pair of positive and negative element electrodes, the first lead faces the electrode surface, the covering member covers the electrode surface.

8. The light-emitting device according to claim 1 or 2, wherein the covering member contains a light-reflective substance.

9. The light-emitting device according to claim 8, wherein the at least one light-emitting element includes a first light-emitting element and a second light-emitting element, at least a part of a first element first side face of the first light-emitting element opposed to a side face of the second light-emitting element is covered by the covering member.

10. The light-emitting device according to claim 9, wherein in a sectional view, the height of the covering member covering a first element second side face located on the opposite side of the first element first side face is lower than the height of the covering member covering the first element first side face.

11. The light-emitting device according to claim 1 or 2, wherein a first light-transmissive member that is in contact with the coating member and covers the light-emitting element is provided.

12. The light-emitting device according to claim 11, wherein the first light-transmissive member contains dimethyl silicone resin.

13. The light-emitting device according to claim 11, wherein a second light-transmissive member that is in contact with the first light-transmissive member and covers the light-emitting element is provided.

14. The light-emitting device according to claim 13, wherein the surface where the first light-transmissive member and the second light-transmissive member are in contact has irregularities.

15. The light-emitting device according to claim 13, wherein the second light-transmissive member contains phenyl silicone resin.

16. The light-emitting device according to claim 14, wherein the first light-transmissive member contains a phosphor, and the second light-transmissive member does not contain a phosphor.

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