A chip packaged semiconductor discrete device aging system

Abstract

The present invention discloses an aging system for chip-packaged semiconductor discrete devices, which relates to the field of semiconductor detection technology. The system comprises a base plate, a center box is provided in the middle of the upper end surface of the base plate, an equipment compartment is provided on one side of the interior of the center box, an inspection door is also provided on the equipment compartment, a control host is provided on the upper end of the equipment compartment, a detection module is provided on the lower end of the control host, a display is provided on the upper end of the center box, and a drawer-type operating table is provided on the position of the center box below the display. The present invention can drive the installation shaft to rotate when in use through the provided driving component, and after the installation shaft rotates, the turning box can be driven to rotate along the installation shaft as the center, and then the turning box can be turned upward. After turning upward, the three surfaces of the carrier plate and the component fixture can be exposed at the same time, so that the electronic components on the component fixture can be easily taken and placed, which effectively solves the problem that the components are difficult to take and place in the traditional aging system.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor detection technology, in particular to an aging system for chip-type packaged semiconductor discrete devices. Background Art

[0002] With the rapid development of electronic technology today, the reliability requirements for electronic equipment are getting higher and higher. Since various electronic components including various diodes, transistors, three-terminal voltage regulators, etc. often fail due to potential manufacturing defects during normal operation, thus affecting the reliability of the entire machine, it is very necessary to perform aging and screening of the electronic components that make up the entire machine.

[0003] In the use of existing burn-in systems, since the component fixture needs to be connected to the circuit, the fixture plate cannot be removed during use. In actual use, it is very difficult to take and place the components, especially the components located deep in the box. At the same time, in the use of the burn-in system, it is necessary to test the performance of the components by heating and monitor the changes in various performance of the components when heated. However, after the test is completed, a large amount of heat will remain in the chassis, and employees are prone to burns from hot air when opening the box door. In response to the above problems, we provide a chip-packaged semiconductor discrete device burn-in system to solve the above-mentioned problems. Summary of the Invention

[0004] The object of the present invention is to provide a chip-packaged semiconductor discrete device burn-in system to solve the problems in the background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A chip-packaged semiconductor discrete device burn-in system comprises a base plate, a center box disposed in the middle of the upper surface of the base plate, an equipment compartment disposed on one side of the center box, and an access door disposed on the equipment compartment, a control host disposed at the upper end of the equipment compartment, a detection module disposed at the lower end of the control host, a display disposed at the upper end of the center box, and a drawer-type operating table disposed below the display within the center box;

[0007] Both sides of the central box are provided with a carrying plate, and the carrying plate is provided with a component fixture for placing electronic components. Both sides of the upper end surface of the central box are provided with a rotating seat, and a mounting shaft is rotatably connected to the rotating seat. Both ends of the mounting shaft are fixedly connected to the mounting seat. A flip box is provided between the two mounting seats on the same side. One side of the interior of the central box is also provided with a heating component for heating the interior of the flip box;

[0008] The upper end of the central box is also provided with a driving assembly for driving the mounting shaft to rotate so as to drive the flip box to open or close;

[0009] A mounting window is provided on a side of the turnover box away from the bottom plate, and a heat dissipation component for dissipating heat inside the turnover box is also provided on the mounting window.

[0010] On the basis of the above technical solutions, the present invention also provides the following optional technical solutions:

[0011] In an optional solution: the heating component includes a heating chamber, which is opened in the central box, and return ports are provided at the upper and lower ends of both sides of the heating chamber. Mounting holes are provided at positions above the supporting plate on both sides of the heating chamber, and heat-conducting fans are provided in the mounting holes. A heater for generating heat is also provided in the middle of the heating chamber.

[0012] In an optional solution: the drive assembly includes a worm gear, which is fixedly connected to the end of the mounting shaft, and two fixed seats are provided in the middle of the upper end of the center box. A worm is rotatably connected between the two fixed seats, and the worm is engaged with the worm gear. The upper end of the center box is also provided with a drive motor for driving the worm to rotate.

[0013] In an optional solution: the heat dissipation component includes a flip blade, and several flip blades are rotatably connected in the installation window. The upper end surface of the flip box is also provided with a rotating component for driving the flip blades to rotate synchronously. A connection box is fixedly connected to the installation window, and several heat dissipation fans are provided on the connection box.

[0014] In an optional solution: the rotating assembly includes gears, which are fixedly connected to the positions where the flip blade connecting shaft passes through the flip box. Sliding seats are also provided on both sides of the upper end surface of the flip box. A rack is slidably connected between the two sliding seats, and the rack is engaged with the gear. The upper end surface of the flip box is also provided with an electric cylinder for driving the rack to move.

[0015] In an optional solution: the detection module, heater, heat-conducting fan, display, heat-dissipating fan, electric cylinder and drive motor are all electrically connected to the control host.

[0016] In an optional solution: a plurality of heat dissipation holes are provided at the lower end of the inspection door.

[0017] In an optional solution: the inspection door is also provided with a handle for facilitating opening and closing the inspection door, and the inspection door and the central box are fixed by magnetic attraction.

[0018] In an optional solution, a thermal insulation layer is attached to a side of the heating chamber close to the equipment compartment.

[0019] In an optional solution, anti-slip feet are provided at the four corners of the lower end surface of the base plate.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. The present invention can drive the installation shaft to rotate through the provided driving assembly during use. After the installation shaft rotates, the turning box can be driven to rotate along the installation shaft as the center, and then the turning box can be turned upward. After turning upward, the three surfaces of the carrier plate and the component fixture can be exposed at the same time, which makes it easy to pick up and place the electronic components on the component fixture, effectively solving the problem that components are difficult to pick up and place in the traditional refining system.

[0022] 2. The present invention can discharge the heat inside the flip box when in use through the heat dissipation component, thereby preventing the hot air from scalding the staff after the flip box is opened. At the same time, the rotating component can close the installation window when the system is working, preventing the heat from overflowing when the system is working.

[0023] 3. The present invention can blow the heat generated by the heater into the flip box when in use by setting up multiple heat-conducting fans, thereby heating the inside of the flip box. The multiple heat-conducting fans can evenly transport hot air into the flip box, making the temperature inside the flip box more uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the invention.

[0025] Figure 2 It is a structural diagram of the invention when the flip box is opened.

[0026] Figure 3 It is a schematic diagram of the back structure in the invention.

[0027] Figure 4 It is a schematic diagram of the structure of the connection box when it is disassembled in the invention.

[0028] Figure 5 It is a schematic diagram of the internal structure of the equipment warehouse in the invention.

[0029] Figure 6 Schematic diagram of the internal structure of the heating chamber in the invention.

[0030] Figure 7 For the invention Figure 4 A is an enlarged structural diagram of FIG.

[0031] Among them: 1. Base plate; 2. Flip box; 3. Drawer-type operating table; 4. Display; 5. Center box; 6. Mounting seat; 7. Rotating seat; 8. Fixed seat; 9. Worm gear; 10. Mounting shaft; 11. Connection box; 12. Cooling fan; 13. Inspection door; 14. Component fixture; 15. Loading plate; 16. Drive motor; 17. Worm; 18. Flip blade; 19. Mounting window; 20. Detection module; 21. Control host; 22. Equipment compartment; 23. Mounting hole; 24. Heat transfer fan; 25. Return port; 26. Heating chamber; 27. Heater; 28. Gear; 29. ​​Electric cylinder; 30. Rack; 31. Sliding seat. DETAILED DESCRIPTION

[0032] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.

[0033] In one embodiment, Figure 1-Figure 3 and Figure 5 As shown, a chip-packaged semiconductor discrete device aging system includes a base plate 1, and the four corners of the lower end surface of the base plate 1 are provided with anti-slip feet. The anti-slip feet make the device placement more stable and avoid slipping. A center box 5 is provided in the middle of the upper end surface of the base plate 1, and an equipment compartment 22 is provided on one side of the center box 5. The equipment compartment 22 is also provided with an inspection door 13, and a plurality of heat dissipation holes are opened at the lower end of the inspection door 13; the heat dissipation holes can facilitate the heat dissipation of the equipment modules inside the equipment compartment 22. A control host 21 is provided at the end, a detection module 20 is provided at the lower end of the control host 21, a display 4 is provided at the upper end of the central box 5, and a drawer-type operating table 3 is provided at the position below the display 4 of the central box 5; the detection module 20, heater 27, heat conduction fan 24, display 4, heat dissipation fan 12, electric cylinder 29 and drive motor 16 are all electrically connected to the control host 21; the inspection door 13 is also provided with a handle for facilitating the opening and closing of the inspection door 13, and the inspection door 13 and the central box 5 are fixed by magnetic attraction.

[0034] A carrying plate 15 is provided on both sides of the center box 5, and a component fixture 14 for placing electronic components is provided on the carrying plate 15. A rotating seat 7 is provided on both sides of the upper end surface of the center box 5, and a mounting shaft 10 is rotatably connected inside the rotating seat 7. Both ends of the mounting shaft 10 are fixedly connected to a mounting seat 6. A flip box 2 is provided between the two mounting seats 6 on the same side, and a heating component for heating the inside of the flip box 2 is also provided on one side of the interior of the center box 5; the heating component is used to transport hot air to the cavity formed by the flip box 2 and the center box 5 during operation, so that the required temperature is achieved in the cavity.

[0035] like Figure 6As shown, the heating assembly includes a heating chamber 26, which is opened in the central box 5. Return ports 25 are provided at the upper and lower ends of both sides of the heating chamber 26. Mounting holes 23 are provided at positions above the supporting plate 15 on both sides of the heating chamber 26. Heat-conducting fans 24 are provided in the mounting holes 23. A heater 27 for generating heat is also provided in the middle of the heating chamber 26. A thermal insulation layer is attached to one side of the heating chamber 26 close to the equipment compartment 22. At the same time, a temperature control system for controlling the internal temperature of the flip box 2 and the heater 27 is also provided inside the heating chamber 26.

[0036] By setting up multiple heat-conducting fans 24, the heat generated by the heater 27 can be blown into the flip box 2 during use, thereby heating the inside of the flip box 2. In addition, the multiple heat-conducting fans 24 can evenly transport hot air into the flip box 2, making the temperature inside the flip box 2 more uniform.

[0037] like Figure 3 As shown, the upper end of the center box 5 is also provided with a driving component for driving the installation shaft 10 to rotate so as to drive the flip box 2 to open or close; the driving component includes a worm gear 9, and the worm gear 9 is fixedly connected to the end of the installation shaft 10 respectively. Two fixed seats 8 are also provided in the middle of the upper end of the center box 5, and a worm 17 is rotatably connected between the two fixed seats 8. The worm 17 is engaged with the worm gear 9. The upper end of the center box 5 is also provided with a driving motor 16 for driving the worm 17 to rotate.

[0038] During use, the worm 17 is driven to rotate by the driving motor 16, and the rotation of the worm 17 drives the worm wheel 9 to rotate. The rotation of the worm wheel 9 can drive the flip box 2 to rotate around the installation axis 10, and then the flip box 2 can be flipped up, making it more convenient to take and place electronic components in the component fixture 14.

[0039] like Figure 4 and Figure 7 As shown, an installation window 19 is provided on the side of the flip box 2 away from the base plate 1, and a heat dissipation component for dissipating heat inside the flip box 2 is also provided on the installation window 19; the heat dissipation component includes a flip blade 18, and several flip blades 18 are rotatably connected in the installation window 19. The upper end surface of the flip box 2 is also provided with a rotating component for driving the flip blades 18 to rotate synchronously, and a connecting box 11 is fixedly connected to the installation window 19, and a plurality of heat dissipation fans 12 are provided on the connecting box 11.

[0040] The heat dissipation component provided can discharge the heat inside the flip box 2 during use, thereby preventing the hot air from scalding the staff after the flip box 2 is opened. At the same time, the rotating component provided can close the installation window 19 when the system is working, thereby preventing the hot air from overflowing when the system is working.

[0041] like Figure 7 As shown, the rotating assembly includes a gear 28, which is fixedly connected to the position where the connecting shaft of the flip blade 18 passes through the flip box 2. Sliding seats 31 are also provided on both sides of the upper end surface of the flip box 2. A rack 30 is slidably connected between the two sliding seats 31, and the rack 30 is engaged with the gear 28. The upper end surface of the flip box 2 is also provided with an electric cylinder 29 for driving the rack 30 to move.

[0042] During operation, the electric cylinder 29 drives the rack 30 to move, and the movement of the rack 30 drives the gear 28 to rotate synchronously. The synchronous rotation of the gear 28 drives the flip blade 18 to flip, so that the inside of the flip box 2 is connected with the outside world, and at the same time cooperates with the heat dissipation fan 12 to discharge the hot air inside the bottom plate 1.

[0043] To sum up, when in use, the electronic components to be tested are placed on the component fixture 14 and the contacts are connected. After placement is completed, the worm 17 is driven by the driving motor 16 to rotate, and the rotation of the worm 17 drives the worm wheel 9 to rotate. The rotation of the worm wheel 9 can drive the flip box 2 to rotate around the installation axis 10, thereby realizing the closing of the flip box 2. After the flip box 2 is closed, the device can be operated by the control host 21 and the display 4. During testing, the heat generated by the heater 27 can be blown into the flip box 2 through the multiple heat-conducting fans 24 provided, so as to realize the heating inside the flip box 2. Heat, and the multiple heat-conducting fans 24 set up can evenly transport hot air into the flip box 2, and then use the detection module 20 to execute the detection program to detect the various functions of the components under high temperature. After the detection is completed, the electric cylinder 29 drives the rack 30 to move, and the movement of the rack 30 drives the gear 28 to rotate synchronously. The synchronous rotation of the gear 28 drives the flip blade 18 to flip, so that the inside of the flip box 2 is connected with the outside world, and at the same time cooperates with the heat dissipation fan 12 to realize the discharge of hot air inside the bottom plate 1 to avoid hot air scalding the staff. After the heat dissipation is completed, the flip box 2 is opened again by the driving component to take out the components.

[0044] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A chip-packaged semiconductor discrete device aging system, comprising a base plate (1), a center box (5) provided in the middle of the upper end surface of the base plate (1), an equipment compartment (22) provided on one side of the interior of the center box (5), an inspection door (13) provided on the equipment compartment (22), a control host (21) provided at the upper end of the equipment compartment (22), a detection module (20) provided at the lower end of the control host (21), a display (4) provided at the upper end of the center box (5), and a drawer-type operating table (3) provided on the position of the center box (5) below the display (4); Its characteristics are: Both sides of the central box (5) are provided with a supporting plate (15), and a component fixture (14) for placing electronic components is provided on the supporting plate (15). Both sides of the upper end surface of the central box (5) are provided with a rotating seat (7), and a mounting shaft (10) is rotatably connected inside the rotating seat (7). Both ends of the mounting shaft (10) are fixedly connected to the mounting seat (6). A turning box (2) is provided between the two mounting seats (6) on the same side. A heating component for heating the inside of the turning box (2) is also provided on one side of the interior of the central box (5); The upper end of the central box (5) is also provided with a driving assembly for driving the mounting shaft (10) to rotate so as to drive the flip box (2) to open or close; A mounting window (19) is provided on a side of the flip box (2) away from the bottom plate (1), and a heat dissipation component for dissipating heat inside the flip box (2) is also provided on the mounting window (19); The heating assembly comprises a heating chamber (26), the heating chamber (26) being opened in the central box (5), the upper end and the lower end of both sides of the heating chamber (26) being provided with a return port (25), the positions on both sides of the heating chamber (26) being located above the bearing plate (15) being provided with mounting holes (23), the mounting holes (23) being provided with a heat-conducting blower (24), and the middle position of the heating chamber (26) being provided with a heater (27) for generating heat; The driving assembly includes a worm wheel (9), which is fixedly connected to the end of the mounting shaft (10). Two fixed seats (8) are also provided in the middle of the upper end of the center box (5). A worm (17) is rotatably connected between the two fixed seats (8). The worm (17) is engaged with the worm wheel (9). A driving motor (16) for driving the worm (17) to rotate is also provided at the upper end of the center box (5).

2. The chip packaged semiconductor discrete device burn-in system according to claim 1, characterized in that: The heat dissipation component includes a flip blade (18), and a plurality of flip blades (18) are rotatably connected in the installation window (19). The upper end surface of the flip box (2) is also provided with a rotating component for driving the flip blades (18) to rotate synchronously. The installation window (19) is fixedly connected with a connection box (11), and the connection box (11) is provided with a plurality of heat dissipation fans (12).

3. The chip-packaged semiconductor discrete device burn-in system according to claim 2, characterized in that: The rotating assembly includes a gear (28), and the gear (28) is fixedly connected to the position where the connecting shaft of the flip blade (18) passes through the flip box (2). Sliding seats (31) are also provided on both sides of the upper end surface of the flip box (2). A rack (30) is slidably connected between the two sliding seats (31), and the rack (30) is meshed with the gear (28). The upper end surface of the flip box (2) is also provided with an electric cylinder (29) for driving the rack (30) to move.

4. The chip-packaged semiconductor discrete device burn-in system according to claim 3, characterized in that: The detection module (20), heater (27), heat-conducting fan (24), display (4), heat-dissipating fan (12), electric cylinder (29) and driving motor (16) are all electrically connected to the control host (21).

5. The chip-packaged semiconductor discrete device burn-in system according to claim 1, characterized in that: The lower end of the inspection door (13) is provided with a plurality of heat dissipation holes.

6. The chip-packaged semiconductor discrete device burn-in system according to claim 1, characterized in that: The inspection door (13) is also provided with a handle for facilitating opening and closing the inspection door (13), and the inspection door (13) and the central box (5) are fixed by magnetic attraction.

7. The chip-packaged semiconductor discrete device burn-in system according to claim 1, characterized in that: A thermal insulation layer is attached to a side of the heating chamber (26) close to the equipment compartment (22).

8. The chip-packaged semiconductor discrete device burn-in system according to claim 1, characterized in that: The four corners of the lower end surface of the base plate (1) are all provided with anti-slip feet.

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