OLED display panel and display device

Abstract

The application provides an OLED display panel and a display device, and relates to the technical field of display. The non-display area of the OLED display panel comprises a substrate, a first metal layer, an insulating layer, a second metal layer, a glass powder encapsulating layer and an encapsulating cover plate. The distance between the outer circumferential side of the insulating layer and the inner circumferential side of the glass powder encapsulating layer is greater than the distance between the outer circumferential side of the second metal layer and the inner circumferential side of the glass powder encapsulating layer. The outer circumferential side of the first metal layer protrudes from the outer circumferential side of the glass powder encapsulating layer. During electrostatic testing, the first metal layer attracts a large amount of static electricity, so that the second metal layer attracts less static electricity, thereby reducing the electric stress between the glass powder encapsulating layer and the insulating layer, and preventing the glass powder encapsulating layer and the insulating layer from being easily peeled off. Meanwhile, the second metal layer attracts less static electricity, so that the second metal layer is prevented from being thermally damaged, and the second metal layer and the adjacent insulating layer are prevented from being peeled off, thereby improving the encapsulating effect of the OLED display panel.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to an OLED display panel and a display device. BACKGROUND

[0002] An organic light-emitting diode (OLED) display panel generally includes an encapsulation layer, which is used to isolate water and oxygen and other pollutants, so as to prevent water and oxygen and other pollutants from invading into the OLED device layer, thereby improving the service life of the OLED display panel. In the related art, the OLED display panel includes an OLED device layer and a glass powder encapsulation layer encapsulating the OLED device layer. However, when the OLED display panel is subjected to electrostatic testing, the glass powder encapsulation layer is prone to failure, which affects the service life of the OLED display panel. SUMMARY

[0003] In view of the above problems, the embodiments of the present application provide an OLED display panel and a display device to solve the technical problem that the glass powder encapsulation layer of the OLED display panel is prone to failure during electrostatic testing.

[0004] To achieve the above object, the embodiments of the present application provide the following technical solutions:

[0005] The first aspect of the embodiments of the present application provides an OLED display panel, which has a display area and a non-display area surrounding the display area. The OLED display panel located in the non-display area includes a substrate, a first metal layer disposed on the substrate, an insulating layer disposed on the first metal layer, a second metal layer disposed on the insulating layer, a glass powder encapsulation layer disposed on the second metal layer and the insulating layer, and an encapsulation cover plate disposed on the glass powder encapsulation layer. In the non-display area, the outer peripheral side of the glass powder encapsulation layer protrudes from the outer peripheral side of the second metal layer, and the outer peripheral side of the first metal layer protrudes from the outer peripheral side of the glass powder encapsulation layer.

[0006] The OLED display panel provided by the embodiment of the present application, when electrostatic testing, the electrostatic gun hits the outer periphery of the glass powder packaging layer, the outer periphery side of the glass powder packaging layer protrudes from the outer periphery side of the second metal layer, so as to increase the distance between the outer periphery side of the second metal layer and the outer periphery side of the glass powder packaging layer, so that the second metal layer is not easy to attract static electricity; the first metal layer located outside the outer periphery of the glass powder packaging layer attracts a large amount of static electricity, so that the static electricity attracted by the second metal layer is reduced, thereby reducing the electric stress between the glass powder packaging layer and the insulating layer, so that the glass powder packaging layer and the insulating layer are not easy to peel off; meanwhile, the static electricity attracted by the second metal layer is reduced, so as to avoid thermal damage of the second metal layer, and further avoid the peeling of the second metal layer and the adjacent insulating layer, thereby improving the packaging effect of the OLED display panel.

[0007] In a possible implementation, in the non-display area, the distance between the inner periphery side of the first metal layer and the inner periphery side of the glass powder packaging layer is greater than the distance between the outer periphery side of the second metal layer and the inner periphery side of the glass powder packaging layer.

[0008] In a possible implementation, in the non-display area, the orthographic projection of the second metal layer on the substrate and the orthographic projection of the first metal layer on the substrate partially overlap.

[0009] In a possible implementation, the first metal layer located in the non-display area is connected with a ground trace.

[0010] In a possible implementation, in the non-display area, the first metal layer and the second metal layer are both electrically connected with the VSS trace.

[0011] In a possible implementation, in the non-display area, a plurality of first openings are formed on the first metal layer, and the first openings penetrate the first metal layer in a direction perpendicular to the substrate; in the non-display area, a plurality of second openings are formed on the second metal layer, and the second openings penetrate the second metal layer in a direction perpendicular to the substrate.

[0012] In a possible implementation, the insulating layer includes a first insulating layer and a second insulating layer, the first insulating layer is attached to the first metal layer, the second insulating layer is attached to the second metal layer, and a third metal layer located in the display area is arranged between the first insulating layer and the second insulating layer.

[0013] In a possible implementation, the first insulating layer has a first extension located in the first opening.

[0014] In a possible implementation, the glass powder packaging layer has a second extension located in the second opening.

[0015] In a possible implementation, the OLED display panel is a rectangular panel, the non-display area includes a first area, a second area and a third area, the first area, the second area and the third area are arranged to form a rectangular frame with an opening, and the first metal layer in the non-display area is distributed in the first area, the second area and the third area.

[0016] A second aspect of the embodiments of the present application provides a display device, including the OLED display panel of any one of the above.

[0017] The display device provided by the embodiments of the present application has the beneficial effects of the above OLED display panel, and thus the display device also has the beneficial effects of the above OLED display panel, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0019] Figure 1 A top view of the OLED display panel provided by the embodiments of the present application;

[0020] Figure 2 A partial sectional view of a possible implementation in the direction of A-A in the above figure; Figure 1

[0021] A partial sectional view of another possible implementation in the direction of A-A in the above figure; Figure 3

[0022] A structure schematic diagram of the glass powder encapsulation layer and the first metal layer in the non-display area on the substrate in the OLED display panel provided by the embodiments of the present application; Figure 4 Figure 1 A partial sectional view of another possible implementation in the direction of A-A in the above figure;

[0023] Legend of reference signs:

[0024] 100, display area;

[0025] 200, non-display area; 201, first area; 202, second area; 203, third area; 204, fourth area;

[0026] 10, substrate; 110, first projection; 120, second projection; 130, overlapping projection;

[0027] 20, first metal layer;

[0028] ​30, insulating layer; 310, first insulating layer; 320, second insulating layer;

[0029] 40, second metal layer;

[0030] 50, glass powder packaging layer;

[0031] 60, packaging cover plate. DETAILED DESCRIPTION

[0032] As described in the background, the OLED display panel in the related art has a problem of failure of the glass powder packaging layer in the electrostatic test. The inventors have found that the cause of the problem is that the glass powder packaging layer is packaged on the insulating layer and the metal layer, the distance between the outer circumferential side of the insulating layer and the display area is greater than the distance between the outer circumferential side of the metal layer and the display area, and in the electrostatic test, the electrostatic gun hits the outer circumferential side of the glass powder packaging layer. Since the metal layer itself has strong conductivity, the metal layer attracts a large amount of static electricity, and the static electricity moves from the insulating layer combined with the glass powder packaging layer to the metal layer. When the electrostatic current of the metal layer exceeds the bearing capacity of the metal layer, the metal layer is prone to overheat and burn out, causing the metal layer and the adjacent insulating layer to peel off. In addition, when a large amount of static electricity flows through the insulating layer combined with the glass powder packaging layer, an electric stress is generated between the glass powder packaging layer and the insulating layer. When the electric stress is too large, the glass powder packaging layer and the insulating layer are prone to peel off, thereby causing the glass powder packaging layer to fail to package the OLED display panel.

[0033] To solve the above technical problems, the embodiments of the present application provide an OLED display panel and a display device. By making the outer circumferential side of the first metal layer in the non-display area protrude from the outer circumferential side of the glass powder packaging layer, in the electrostatic test, the electrostatic gun hits the outer circumferential side of the glass powder packaging layer. The first metal layer located outside the outer circumferential side of the glass powder packaging layer attracts a large amount of static electricity, so that the second metal layer attracts less static electricity, thereby reducing the electric stress between the glass powder packaging layer and the insulating layer, and making the glass powder packaging layer and the insulating layer less prone to peel off. At the same time, the second metal layer attracts less static electricity, which can avoid thermal damage of the second metal layer, thereby avoiding the second metal layer and the adjacent insulating layer from peeling off, and improving the packaging effect of the OLED display panel.

[0034] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present application more apparent and easy to understand, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0035] The OLED display panel provided by the embodiment of the present application will be described in detail below with reference to the accompanying drawings.

[0036] The embodiment of the present application provides an OLED display panel, referring to Figure 1 , Figure 1 The top view of the OLED display panel provided by the embodiment of the present application has a display area 100 and a non-display area 200, and the non-display area 200 surrounds the display area 100.

[0037] Referring to Figure 2 , Figure 2 For Figure 1 A partial sectional view of one possible implementation of the A-A direction, the OLED display panel located in the non-display area 200 includes a substrate 10, a first metal layer 20 disposed on the substrate 10, an insulating layer 30 disposed on the first metal layer 20, a second metal layer 40 disposed on the insulating layer 30, a glass powder packaging layer 50 disposed on the second metal layer 40 and the insulating layer 30, and a packaging cover plate 60 disposed on the glass powder packaging layer 50. For example, the first metal layer 20 can be used to form a gate, and the second metal layer 40 can be used to form a source and a drain. The insulating layer 30 can be formed of silicon oxide, silicon nitride or other insulating inorganic materials, and the insulating layer 30 is used to isolate the first metal layer 20 and the second metal layer 40 formed on the insulating layer 30.

[0038] Referring to Figure 2 The glass powder packaging layer 50 is disposed on the second metal layer 40 and the insulating layer 30, and the outer peripheral side of the glass powder packaging layer 50 protrudes from the outer peripheral side of the second metal layer 40, that is, the distance (L1) between the outer peripheral side of the glass powder packaging layer 50 and the inner peripheral side of the glass powder packaging layer 50 is greater than the distance (L2) between the outer peripheral side of the second metal layer 40 and the inner peripheral side of the glass powder packaging layer 50, so as to increase the distance between the outer peripheral side of the second metal layer 40 and the outer peripheral side of the glass powder packaging layer 50. During the electrostatic test, the electrostatic gun hits the outer periphery of the glass powder packaging layer 50, and the distance between the outer peripheral side of the second metal layer 40 and the outer peripheral side of the glass powder packaging layer 50 is large, so that the second metal layer 40 is not easy to attract static electricity, the second metal layer 40 is not easy to appear thermal damage, and the peeling of the second metal layer 40 and the insulating layer 30 is avoided, thereby improving the packaging effect of the OLED display panel.

[0039] It should be noted that the "outer periphery" of the film layer described in the embodiments of the present application refers to the end of the film layer away from the display area in the direction parallel to the substrate substrate 10; the "inner periphery" of the film layer refers to the end of the film layer close to the display area 100 in the direction parallel to the substrate substrate 10; the "outer periphery side" of the film layer refers to the end face of the end of the film layer away from the display area 100 in the direction parallel to the substrate substrate 10; the "inner periphery side" of the film layer refers to the end face of the end of the film layer close to the display area 100 in the direction parallel to the substrate substrate 10.

[0040] In the non-display area 200, the outer periphery side of the first metal layer 20 protrudes from the outer periphery side of the glass powder packaging layer 50, that is, the distance (L3) between the outer periphery side of the first metal layer 20 and the inner periphery side of the glass powder packaging layer 50 is greater than the distance (L1) between the outer periphery side of the glass powder packaging layer 50 and the inner periphery side of the glass powder packaging layer 50.

[0041] In some implementations, the distance between the inner periphery side of the first metal layer 20 and the inner periphery side of the glass powder packaging layer 50 can be greater than or equal to the distance between the outer periphery side of the glass powder packaging layer 50 and the inner periphery side of the glass powder packaging layer 50. The first metal layer 20 in the non-display area 200 is located outside the outer periphery of the glass powder packaging layer 50. During electrostatic testing, the electrostatic gun hits outside the outer periphery of the glass powder packaging layer 50, and the first metal layer 20 in the non-display area 200 attracts a large amount of static electricity, so that the second metal layer 40 attracts less static electricity, thereby reducing the electrical stress between the glass powder packaging layer 50 and the insulating layer 30, and preventing the glass powder packaging layer 50 and the insulating layer 30 from peeling off. At the same time, the reduction of the static electricity attracted by the second metal layer 40 can avoid thermal damage of the second metal layer 40, thereby avoiding peeling of the second metal layer 40 and the adjacent insulating layer 30, and improving the packaging effect of the OLED display panel.

[0042] Reference Figure 2 In some implementations, the distance between the inner periphery side of the first metal layer 20 and the inner periphery side of the glass powder packaging layer 50 can be greater than or equal to the distance between the outer periphery side of the glass powder packaging layer 50 and the inner periphery side of the glass powder packaging layer 50. The first metal layer 20 in the non-display area 200 is located outside the outer periphery of the glass powder packaging layer 50. During electrostatic testing, the electrostatic gun hits outside the outer periphery of the glass powder packaging layer 50, and the first metal layer 20 in the non-display area 200 attracts a large amount of static electricity, so that the second metal layer 40 attracts less static electricity, thereby reducing the electrical stress between the glass powder packaging layer 50 and the insulating layer 30, and preventing the glass powder packaging layer 50 and the insulating layer 30 from peeling off. At the same time, the reduction of the static electricity attracted by the second metal layer 40 can avoid thermal damage of the second metal layer 40, thereby avoiding peeling of the second metal layer 40 and the adjacent insulating layer 30, and improving the packaging effect of the OLED display panel.

[0043] refer to Figure 3 , Figure 3 This is a schematic diagram of the orthographic projection of the glass powder encapsulation layer and the first metal layer located in the non-display area of ​​the OLED display panel provided in this application embodiment onto the substrate. The first projection 110 and the overlapping projection 130 form the orthographic projection of the first metal layer 21 located in the non-display area 200 onto the substrate 10. The second projection 120 and the overlapping projection 130 form the orthographic projection of the glass powder encapsulation layer 50 onto the substrate. The orthographic projections of the first metal layer 21 in the non-display area 200 onto the substrate 10 and the glass powder encapsulation layer 50 onto the substrate overlap. In projection 130, when encapsulating the OLED display panel, when the glass powder encapsulation layer 50 is heated by a laser, part of the laser light is transmitted along the insulating layer 30 to the first metal layer 20 corresponding to the overlapping projection 130. The first metal layer 20 corresponding to the overlapping projection 130 blocks the laser light and reflects it, so that the laser energy is concentrated between the glass powder encapsulation layer 50 and the insulating layer 30, thereby improving the encapsulation effect of the glass powder encapsulation layer 50. In addition, the first metal layer 20 corresponding to the overlapping projection 130 can also make the laser energy self-uniform, thereby further improving the encapsulation effect of the glass powder encapsulation layer 50.

[0044] Furthermore, in an implementation where the distance between the inner peripheral side surface of the first metal layer 20 and the inner peripheral side surface of the glass powder encapsulation layer 50 is less than the distance between the outer peripheral side surface of the glass powder encapsulation layer 50 and the inner peripheral side surface of the glass powder encapsulation layer 50, refer to... Figure 2 In the non-display area 200, the distance (L4) between the inner peripheral side surface of the first metal layer 20 and the inner peripheral side surface of the glass powder encapsulation layer 50 can be greater than the distance (L2) between the outer peripheral side surface of the second metal layer 40 and the inner peripheral side surface of the glass powder encapsulation layer 50. That is, there is no overlapping area between the orthographic projection of the first metal layer 20 on the substrate 10 and the orthographic projection of the second metal layer 40 on the substrate 10. This increases the distance between the first metal layer 20 and the second metal layer 40, making it difficult for static charge to be conducted from the first metal layer 20 to the second metal layer 40. This further reduces the static charge attracted by the second metal layer 40, making it difficult for both the second metal layer 40 and the glass powder encapsulation layer 50 to peel off from the insulating layer 30, thereby improving the encapsulation effect of the OLED display panel.

[0045] In another implementation where the distance between the inner peripheral side surface of the first metal layer 20 and the inner peripheral side surface of the glass powder encapsulation layer 50 is less than the distance between the outer peripheral side surface of the glass powder encapsulation layer 50 and the inner peripheral side surface of the glass powder encapsulation layer 50, refer to... Figure 4 , Figure 4 for Figure 1In another possible implementation of the A-A direction, in the non-display area 200, the distance (L4) between the inner circumferential side of the first metal layer 20 and the inner circumferential side of the glass powder packaging layer 50 can be less than the distance (L2) between the outer circumferential side of the second metal layer 40 and the inner circumferential side of the glass powder packaging layer 50, that is, the orthographic projection of the second metal layer 40 on the substrate 10 can partially overlap the orthographic projection of the first metal layer 20 on the substrate 10. Since there is an insulating layer 30 between the first metal layer 20 and the second metal layer 40 in the direction perpendicular to the substrate 10, a coupling capacitor is formed between the first metal layer 20 and the second metal layer 40.

[0046] In the electrostatic test, the electrostatic gun hits the outer periphery of the glass powder packaging layer 50, and the first metal layer 20 attracts a large amount of static electricity. The coupling capacitor formed by the first metal layer 20 and the second metal layer 40 can store the static electricity, thereby reducing the damage of the static electricity to the first metal layer 20 and the second metal layer 40, and improving the anti-static capability of the OLED display panel. In addition, the damage of the static electricity to the second metal layer 40 is reduced, which can avoid the failure of the glass powder packaging layer 50 and improve the packaging performance of the OLED display panel.

[0047] Compared with the implementation in which the distance (L4) between the inner circumferential side of the first metal layer 20 and the inner circumferential side of the glass powder packaging layer 50 is greater than the distance (L2) between the outer circumferential side of the second metal layer 40 and the inner circumferential side of the glass powder packaging layer 50, the distance (L4) between the inner circumferential side of the first metal layer 20 and the inner circumferential side of the glass powder packaging layer 50 is less than the distance (L2) between the outer circumferential side of the second metal layer 40 and the inner circumferential side of the glass powder packaging layer 50. The length of the first metal layer 20 in the direction parallel to the substrate 10 is increased, and the ability of the first metal layer 20 to attract static electricity is increased, so as to quickly lead away the static electricity.

[0048] In an implementation of the embodiment of the present application, the first metal layer 20 located in the non-display area 200 can be connected with a grounding trace. In the electrostatic test, the electrostatic gun hits the outer periphery of the glass powder packaging layer 50, and the first metal layer 20 in the non-display area 200 attracts a large amount of static electricity. The grounding trace can lead away the static electricity of the first metal layer 20, thereby further reducing the damage of the static electricity to the first metal layer 20 and the second metal layer 40 in the non-display area 200.

[0049] In another implementation form of the embodiment of the application, the second metal layer 40 in the non-display area 200 can be designed as a VSS wire, and the first metal layer 20 in the non-display area 200 can be electrically connected to the VSS wire. During the electrostatic test, the electrostatic gun is fired on the outer periphery of the glass powder packaging layer 50, and the first metal layer 20 in the non-display area 200 attracts a large amount of static electricity and guides the static electricity to the VSS wire. The VSS wire has strong anti-static ability, and the static electricity from the first metal layer 20 has little damage to the VSS wire. In this way, the static electricity in the first metal layer 20 in the non-display area 200 is reduced, the damage of the static electricity to the first metal layer 20 is reduced, the VSS wire is not damaged, and the anti-static ability of the OLED display panel is improved. The static electricity in the first metal layer 20 in the non-display area 200 is reduced, which indirectly reduces the static electricity attracted by the second metal layer 40, so that the second metal layer 40 and the glass powder packaging layer 50 are not easy to peel off from the insulating layer 30, thereby improving the packaging effect of the OLED display panel.

[0050] In some embodiments, the first metal layer 20 in the non-display area 200 can be patterned to form a plurality of first openings in the first metal layer 20, the first openings penetrating the first metal layer 20 in a direction perpendicular to the substrate 10.

[0051] During the preparation of the OLED display panel or the electrostatic test, the OLED display panel will deform to a certain extent. When the OLED display panel deforms, the first metal layer 20 and the insulating layer 30 bonded thereto will have different deformation amounts due to different materials. The difference in deformation amounts between the first metal layer 20 and the insulating layer 30 bonded thereto will cause an internal force to act between the first metal layer 20 and the insulating layer 30 to resist the deformation of the OLED display panel. When the acting force between the first metal layer 20 and the insulating layer 30 is too large, the first metal layer 20 and the insulating layer 30 are prone to peel off.

[0052] In the embodiment, the plurality of first openings in the first metal layer 20 can release the acting force between the first metal layer 20 and the insulating layer 30, avoid the accumulation of the acting force, and prevent the first metal layer 20 and the insulating layer 30 from peeling off.

[0053] Of course, the second metal layer 40 in the non-display area 200 can also be patterned to form a plurality of second openings in the second metal layer 40, the second openings penetrating the second metal layer 40 in a direction perpendicular to the substrate 10.

[0054] When the OLED display panel deforms, the deformation amount of the second metal layer 40 and the glass powder encapsulation layer 50 bonded therewith is different, resulting in an internal force between the second metal layer 40 and the glass powder encapsulation layer 50 bonded therewith to resist the deformation of the OLED display panel. When the force between the second metal layer 40 and the glass powder encapsulation layer 50 is too large, the second metal layer 40 and the glass powder encapsulation layer 50 are prone to peeling, thereby causing encapsulation failure.

[0055] The plurality of second openings on the second metal layer 40 can release the force between the second metal layer 40 and the glass powder encapsulation layer 50, avoid force accumulation, and prevent the second metal layer 40 and the glass powder encapsulation layer 50 from peeling, thereby improving the encapsulation effect of the OLED display panel.

[0056] The insulating layer 30 can include a first insulating layer 310 and a second insulating layer 320. The first insulating layer 310 can be bonded to the first metal layer 20, and the second insulating layer 320 can be bonded to the second metal layer 40. A third metal layer can be disposed between the first insulating layer 310 and the second insulating layer 320 in the display area 100. The third metal layer can be used to form one plate of a capacitor in a compensation circuit or a driving circuit.

[0057] The first insulating layer 310 can have a first extension in the first opening. The first extension is bonded to the first metal layer 20 to increase the pulling force between the first metal layer 20 and the first insulating layer 310, so that the first metal layer 20 and the first insulating layer 310 are more firmly connected.

[0058] The glass powder encapsulation layer 50 can have a second extension in the second opening. When the OLED display panel is encapsulated, the glass powder material is first printed on the encapsulation cover plate 60, and then the encapsulation cover plate 60 and the second metal layer 40 are bonded. The glass powder material is located between the encapsulation cover plate 60 and the second metal layer 40. The glass powder material is melted and bonded to the second metal layer 40 by laser heating. Part of the melted glass powder material can flow into the second opening to form the second extension. The second extension is bonded to the second metal layer 40, increasing the bonding force between the glass powder encapsulation layer 50 and the second metal layer 40, thereby enhancing the encapsulation effect of the OLED display panel.

[0059] With reference to Figure 1 and Figure 3 , the OLED display panel in the above embodiments can be a rectangular panel. The non-display area 200 can include a first area 201, a second area 202, a third area 203, and a fourth area 204. The first area 201, the second area 202, the third area 203, and the fourth area 204 form a rectangular frame. The first metal layer 20 located in the non-display area 200 is distributed in the first area 201, the second area 202, and the third area 203.

[0060] The fourth area 204 can be provided with a flexible printed circuit (FPC). During electrostatic testing, the electrostatic gun does not need to hit the fourth area 204, and only needs to hit and discharge at multiple points at the gaps outside the periphery of the first area 201, the second area 202 and the third area 203, so as to detect whether the OLED display panel has sufficient electrostatic protection at the first area 201, the second area 202 and the third area 203.

[0061] The first metal layer 20 of the non-display area 200 is distributed in the first area 201, the second area 202 and the third area 203. Referring to Figure 3 , the first metal layer 20 can be arranged as a long rectangular frame with an opening, so that the electrostatic protection at each position of the first area 201, the second area 202 and the third area 203 is improved, the electrostatic protection of the OLED display panel is improved, and the encapsulation effect of the glass powder encapsulation layer 50 at the first area 201, the second area 202 and the third area 203 is improved.

[0062] The display device can be a mobile terminal or a fixed terminal such as a mobile phone, a tablet computer, a notebook computer, a television, a display, a digital photo frame, a navigator, etc. The display device includes a driving circuit and the OLED display panel as described in the above embodiments. The specific structure, functions and working principles of the OLED display panel have been described in detail in the above embodiments. The display device provided in the embodiments has the beneficial effects of the OLED display panel, and thus will not be described here.

[0063] Each embodiment or implementation in the specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be mutually referred to.

[0064] It should be noted that the phrases "one embodiment", "an embodiment", "exemplary embodiment", "some embodiments", etc. in the specification mean that the described embodiments can include a specific feature, structure or property, but not necessarily every embodiment includes the specific feature, structure or property. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when a specific feature, structure or property is described in combination with an embodiment, it is within the knowledge of those skilled in the art to realize such feature, structure or property in combination with other embodiments that are explicitly or implicitly described.

[0065] In general, terminology can be understood at least in part from usage in context. For example, the term "one or more" as used herein, depending at least in part upon context, can be used to describe any feature, structure, or characteristic in a singular sense or can be used to describe combinations of features, structures or characteristics in a plural sense. Similarly, terms, such as "a" and "the", as used herein, depending at least in part upon context, can be understood to transmit singular usage or to transmit plural usage, unless otherwise indicated by the text.

[0066] It will be readily understood that the terms "on", "above", and "over", in the present disclosure, are to be interpreted in the broadest context, such that "on" means not only "directly on", but also includes the meaning of "on" with intervening features or layers therebetween, and "above" or "over" includes not only the meaning of "above" or "over", but also the meaning of "above" or "over" with no intervening features or layers therebetween (i.e., directly on).

[0067] In addition, spatially relative terms, such as "beneath", "below", "lower", "above", "upper", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0068] The term "substrate" as used herein refers to a material on which a subsequent layer of material is added. The substrate itself can be patterned. The material added on top of the substrate can be patterned or can remain unpatterned. In addition, the substrate can include a wide range of materials, such as silicon, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate can be made of a non-conductive material, such as glass, plastic, or sapphire wafer, etc.

[0069] As used herein, the term "layer" can refer to a portion of material that includes a region having a thickness. A layer can extend over an entire underlying or overlying structure, or can have a scope less than the scope of the underlying or overlying structure. Further, a layer can be a region of a continuous structure that is uniform or non-uniform in composition, having a thickness that is less than the thickness of the continuous structure. For example, a layer can be between, or at, any pair of lateral planes between a top surface and a bottom surface of the continuous structure. A layer can extend laterally, vertically, and / or along a tapered surface. A substrate can be a layer, can include one or more layers therein, and / or can have one or more layers thereon, thereabove, and / or therebelow. A layer can include multiple layers. For example, an interconnect layer can include one or more conductor and contact layers (within which contacts, interconnect lines, and / or vias are formed) and one or more dielectric layers.

[0070] Finally, it should be noted that the above-described embodiments are merely intended to illustrate the technical solutions of the present application, but not to limit the same; even though the present application has been described in detail with reference to the above-described embodiments, those skilled in the art should understand that the technical solutions recorded in the above-described embodiments can still be modified, or some or all of the technical features thereof can be replaced equivalently; and these modifications or replacements do not cause the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An OLED display panel, characterized in that, The OLED display panel has a display area and a non-display area surrounding the display area. The OLED display panel in the non-display area comprises a substrate, a first metal layer disposed on the substrate, an insulating layer disposed on the first metal layer, a second metal layer disposed on the insulating layer, a glass powder encapsulating layer disposed on the second metal layer and the insulating layer, and an encapsulating cover disposed on the glass powder encapsulating layer. In the non-display area, the outer circumferential side of the glass powder encapsulating layer protrudes from the outer circumferential side of the second metal layer, and the outer circumferential side of the first metal layer protrudes from the outer circumferential side of the glass powder encapsulating layer. In the non-display area, a plurality of first openings are formed in the first metal layer, and the first openings penetrate the first metal layer in a direction perpendicular to the substrate; and / or, In the non-display area, a plurality of second openings are formed in the second metal layer, and the second openings penetrate the second metal layer in a direction perpendicular to the substrate. In the non-display area, the distance between the inner circumferential side of the first metal layer and the inner circumferential side of the glass powder encapsulating layer is greater than the distance between the outer circumferential side of the second metal layer and the inner circumferential side of the glass powder encapsulating layer, and the orthographic projection of the first metal layer on the substrate and the orthographic projection of the second metal layer on the substrate do not have an overlapping area. Alternatively, In the non-display area, the orthographic projection of the second metal layer on the substrate partially overlaps the orthographic projection of the first metal layer on the substrate.

2. The OLED display panel of claim 1, wherein, The first metal layer in the non-display area is connected with a ground trace.

3. The OLED display panel of claim 1, wherein, In the non-display area, the first metal layer and the second metal layer are both electrically connected with a VSS trace.

4. The OLED display panel of claim 1, wherein, The insulating layer comprises a first insulating layer and a second insulating layer, the first insulating layer is attached to the first metal layer, the second insulating layer is attached to the second metal layer, and a third metal layer in the display area is disposed between the first insulating layer and the second insulating layer.

5. The OLED display panel of claim 4, wherein, The first insulating layer has a first extension in the first opening.

6. The OLED display panel of claim 5, wherein, The glass powder encapsulating layer has a second extension in the second opening.

7. The OLED display panel of claim 1, wherein, The OLED display panel is a rectangular panel, the non-display area comprises a first area, a second area and a third area, the first area, the second area and the third area are arranged to form a rectangular frame with an opening, and the first metal layer in the non-display area is distributed in the first area, the second area and the third area.

8. A display device, characterized by comprising: Comprise: The OLED display panel of any one of claims 1-7.

Images