Sensors and antenna components, wireless headphones

Abstract

The present application provides a wireless headset and its sensor and antenna assembly, the sensor and antenna assembly including an antenna and a sensor, and also including: a reused mainboard, the reused mainboard including a first circuit layer and a second circuit layer spaced apart along the thickness direction of the reused mainboard, the first circuit layer is provided with an antenna radiating body and a radio frequency circuit of the antenna, the antenna radiating body is used to send and receive electromagnetic waves, and the radio frequency circuit is used to transmit and process radio frequency signals; the second circuit layer is provided with a sensing element of the sensor, the sensing element is used to sense the operation, and a corresponding sensing signal is obtained according to the operation; the antenna radiating body and the sensing element at least partially overlap along the thickness direction of the reused mainboard, and the antenna radiating body serves as the ground layer of the sensor. In this way, the antenna and the sensor can reuse the space in the area where the antenna radiating body is located, saving the space occupied by the sensor and the antenna assembly.

Description

Technical Field

[0001] The present application relates to the technical field of electronic circuits, and in particular to a sensor and antenna assembly, and a wireless headset. Background Art

[0002] With the advancement of technology, the development of wireless Bluetooth headsets has exploded, and the market demand has increased rapidly. In order to meet the ever-increasing user experience needs, wireless Bluetooth headsets are gradually becoming smaller and more multifunctional, such as pressure sensing, active noise reduction, environmental noise reduction, bone voiceprint recognition, and voice recognition.

[0003] At present, among the main wireless Bluetooth headset products, the structural position of the Bluetooth headset's sensing element and the antenna is prone to conflict, that is, the Bluetooth headset's antenna needs to be placed on the surface of the ear handle, and the sensing element also needs to be placed on the surface of the ear handle. In order to achieve the miniaturization of the Bluetooth headset, the size of the ear handle is forcibly compressed, but the size space occupied by the antenna can only be sacrificed, which will also reduce the performance of the antenna. Therefore, when users use it, they may often experience freezes, disconnections, a short separation distance between the mobile phone and the headset, and unstable signals. The main way to solve this problem at this stage is to increase the length of the ear handle until the sensing element and the antenna can be placed at the same time, but this will result in a larger headset size and a poor user experience. Summary of the invention

[0004] In order to solve the existing technical problems, the present application provides a wireless headset and its sensor and antenna assembly, which can effectively ensure the original performance of the headset while reducing the overall size of the headset.

[0005] To achieve the above purpose, the technical solution of the embodiment of the present application is implemented as follows:

[0006] A sensor and antenna assembly, comprising an antenna and a sensor, further comprising:

[0007] A multiplexed mainboard, the multiplexed mainboard comprising a first circuit layer and a second circuit layer spaced apart along a thickness direction of the multiplexed mainboard, the first circuit layer being provided with an antenna radiation body and a radio frequency circuit of the antenna, the antenna radiation body being used to send and receive electromagnetic waves, the radio frequency circuit being used to transmit and process radio frequency signals; the second circuit layer being provided with a sensing element of the sensor, the sensing element being used to sense an operation, and obtaining a corresponding sensing signal according to the operation; the thickness direction of the multiplexed mainboard is the thickness direction of the multiplexed mainboard;

[0008] The antenna radiation body at least partially overlaps with the inductive element along the thickness direction of the reuse main board, and the antenna radiation body serves as a ground layer of the sensor.

[0009] Furthermore, the sensor and antenna assembly also includes a main circuit board that is parallel to and spaced apart from the reused main board, and the antenna also includes an antenna chip disposed on the main circuit board and an antenna spring foot connected between a feeding point on the antenna radiation body and the touch chip.

[0010] Furthermore, the radio frequency signal is a high-frequency signal, the radio frequency signal is a high-frequency signal, the antenna sends and receives electromagnetic waves through the antenna radiation body, and the radio frequency circuit transmits and processes radio frequency signals, including: the radio frequency circuit converts the electromagnetic waves into the radio frequency signal and transmits it to the antenna chip through the antenna spring pin, and the antenna chip processes the radio frequency signal; the induction signal is a low-frequency signal, and the sensor also includes a induction chip arranged on the second circuit layer; the induction element sends the induction signal to the induction chip; after the induction chip obtains the induction signal, the corresponding operation instruction is determined according to the induction signal.

[0011] Furthermore, the sensor is a touch sensor, and the sensing element includes two or more touch pads arranged on the second circuit layer and spaced apart in a direction parallel to the reused mainboard, and the direction parallel to the reused mainboard is arranged at an angle to the thickness direction of the reused mainboard.

[0012] Furthermore, the first circuit layer is arranged on a side close to the main circuit board, and the second circuit layer is arranged on a side far away from the main circuit board.

[0013] Furthermore, the sensor also includes a touch chip arranged on the second circuit layer, and the touch pad is electrically connected to the touch chip; or, it also includes a main circuit board arranged parallel to and spaced apart from the reused main board, and the main circuit board is provided with a touch chip, and the touch pad is electrically connected to the touch chip.

[0014] Furthermore, the sensor and antenna assembly further includes a touch isolation circuit connected to the touch pad, and the touch isolation circuit includes isolation inductors connected to the touch pads in a one-to-one correspondence.

[0015] Furthermore, the antenna is a planar inverted F-shaped antenna, and the planar inverted F-shaped antenna also includes an antenna feeding point arranged on the first circuit layer close to the antenna radiation body.

[0016] Furthermore, the sensor is a pressure sensor, and the pressure sensor includes a pressure detection unit arranged on the second circuit layer.

[0017] Furthermore, the sensor and antenna assembly also includes a high-frequency filter circuit connected to the radio frequency circuit, and / or a low-frequency filter circuit connected to the sensing element.

[0018] Further, the sensor and antenna assembly further comprises a first isolation circuit connected to the radio frequency circuit, the first isolation circuit comprising a first capacitor and a second capacitor connected in series, and a common mode inductor connected between a node between the first capacitor and the second capacitor and ground; and / or,

[0019] It also includes a second isolation circuit connected to the inductive element, wherein the second isolation circuit includes a first inductor and a second inductor connected in series, and a filter capacitor connected between a node between the first inductor and the second inductor and ground.

[0020] Furthermore, the radio frequency circuit includes an antenna matching circuit and a filtering circuit, the antenna matching circuit includes a third inductor and a third capacitor and a fourth capacitor respectively connected between the opposite ends of the third inductor and the ground; the filtering circuit includes a fourth inductor connected in series with the third inductor and a fifth capacitor connected between one end of the fourth inductor and the ground.

[0021] Furthermore, the sensor and antenna assembly also includes a system ground return circuit, and the system ground return circuit includes an isolation capacitor connected between the antenna radiation body and the ground.

[0022] Furthermore, the multiplexed mainboard is a flexible circuit board, and the first circuit layer and the second circuit layer are respectively flexible circuit layers; or the multiplexed mainboard is a printed circuit board, and the first circuit layer and the second circuit layer are respectively arranged on opposite sides of the printed circuit board along the thickness direction of the multiplexed mainboard.

[0023] An embodiment of the present application also provides a wireless headset, including an earplug portion and an ear handle portion, the wireless headset includes a sensor and an antenna assembly as described in any one of the above embodiments, and the sensor and antenna assembly are arranged in the ear handle portion.

[0024] Further, the sensor is a touch sensor, the second circuit layer is arranged on the side of the ear handle part close to the outside, and the first circuit layer is arranged on the side facing the inside of the ear handle part; or, the sensor is a pressure sensor, one of the first circuit layer and the second circuit layer is arranged on the side of the ear handle part close to the outside, and the other is arranged on the side facing the inside of the ear handle part.

[0025] The wireless headset and its sensor and antenna assembly provided in the embodiment of the present application are provided with a reused mainboard composed of a double-layer circuit layer, and the antenna radiating body of the antenna and the sensing element of the sensor are respectively arranged on the first circuit layer and the second circuit layer of the reused mainboard in an upper and lower relative manner. The antenna radiating body can serve as the ground layer of the sensor. In this way, the antenna and the sensor can reuse the space in the area where the antenna radiating body is located, saving the overall occupied space of the sensor and the antenna, and can optimize the spatial layout inside the wireless headset including the sensor and the antenna assembly, so as to effectively reduce the overall size of the headset while ensuring the original performance of the wireless headset. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of a sensor and an antenna assembly in one embodiment of the present application;

[0027] Figure 2 A schematic diagram of the relative positions of the sensing element and the antenna radiation body in the sensor and antenna assembly in one embodiment of the present application;

[0028] Figure 3 A schematic diagram of a circuit of a sensor and an antenna assembly in one embodiment of the present application;

[0029] Figure 4 A schematic diagram of the relative positions of the sensing element and the antenna radiating body in the sensor and antenna assembly in another embodiment of the present application;

[0030] Figure 5 A circuit schematic diagram of a sensor and an antenna assembly in another embodiment of the present application;

[0031] Figure 6 is a circuit schematic diagram of a radio frequency circuit in an embodiment of the present application;

[0032] Figure 7 This is a schematic diagram of the structure of a wireless headset in an embodiment of the present application;

[0033] Figure 8 This is a schematic diagram of the structure of a wireless headset in another embodiment of the present application;

[0034] Fig. 9 FIG. 1 is a schematic diagram of a sensor and an antenna assembly in an embodiment of the present application. DETAILED DESCRIPTION

[0035] The technical solution of the present application is further elaborated in detail below in conjunction with the accompanying drawings and specific embodiments of the specification.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit the implementation of this application. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0037] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating positions or positional relationships, are based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In the description of the present application, unless otherwise specified, "multiple" means two or more.

[0038] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0039] See also Figure 1 , is a schematic diagram of a sensor and antenna assembly provided in an embodiment of the present application, the sensor and antenna assembly includes an antenna and a sensor, and also includes: a reused mainboard 13, the reused mainboard includes a first circuit layer 131 and a second circuit layer 132 spaced apart along the thickness direction of the reused mainboard, the first circuit layer 13 is provided with an antenna radiating body 111 and a radio frequency circuit 112 of the antenna, the antenna radiating body 111 is used to send and receive electromagnetic waves, and the radio frequency circuit 112 is used to transmit and process radio frequency signals; the second circuit layer 132 is provided with a sensing element 14 of the sensor, the sensing element 14 is used for sensing operation, and a corresponding sensing signal is obtained according to the operation; the antenna radiating body 111 and the sensing element 14 at least partially overlap along the thickness direction of the reused mainboard, and the antenna radiating body 111 serves as the ground layer of the sensor. Here, the antenna radiating body 111 and the sensing element 14 at least partially overlap along the thickness direction of the reused main board, which means that the area occupied by the sensing element 14 on the circuit layer 132 and the area occupied by the antenna radiating body 111 on the first circuit layer 131 are overlapped at least partially along the thickness direction of the reused circuit board.

[0040] The sensor and antenna assembly provided in the above embodiment, by setting a reused mainboard composed of a double-layer circuit layer, the antenna radiating body of the antenna and the sensing element of the sensor are at least partially overlapped on the first circuit layer and the second circuit layer of the reused mainboard along the thickness direction of the reused mainboard, and the antenna radiating body can serve as the ground layer of the sensor. In this way, the antenna and the sensor can reuse the space in the area where the antenna radiating body is located, saving the overall occupied space of the sensor and the antenna, and can optimize the spatial layout within the wireless headset containing the sensor and the antenna assembly, thereby effectively reducing the overall size of the headset while ensuring the original performance of the wireless headset.

[0041] The sensor and antenna assembly can be applied to various electronic devices that need to be equipped with sensors and antennas at the same time, such as computers, mobile phones, headphones, etc. The antenna can be a Bluetooth antenna, including a transmitting end and a receiving end, which are used to transmit and receive electromagnetic wave signals respectively. The sensor is a detection device that can detect the measured information and can convert the detected information into an electrical signal or other required form of information output according to a certain rule to meet the requirements of information transmission, processing, storage, display, recording and control. In the embodiment of the present application, the sensor can be various sensors used to sense user operations and convert the specified user operations into setting control instructions for electronic devices. Different sensors can be used to sense different external input signals, such as pressure, touch, etc., and can include a sensing element for obtaining the external input signal and a sensing chip for converting the external input signal obtained by the sensing element into a corresponding electrical signal. The reused mainboard is composed of a double-layer circuit layer. In some embodiments, the reused mainboard is a flexible circuit board, and the first circuit layer and the second circuit layer are flexible circuit layers respectively; in other embodiments, the reused mainboard is a printed circuit board, and the first circuit layer and the second circuit layer are respectively arranged on opposite sides of the printed circuit board. The reused mainboard serves as a common carrier of the antenna radiating body in the antenna and the sensing element in the sensor. The antenna radiating body can serve as the ground layer of the sensor, which can effectively reduce the overall occupied space of the sensor and the antenna.

[0042] Optionally, the sensor and antenna assembly further includes a main circuit board 15 which is parallel to and spaced from the reused main board 13, and the antenna further includes an antenna chip 114 disposed on the main circuit board 15 and an antenna spring pin 115 connected between a feeding point on the antenna radiating body 111 and the antenna chip 114. The antenna may refer to a monopole antenna or a PIFA antenna (Planar Inverted Antenna). Taking the antenna as a PIFA antenna as an example, the feeding point of the antenna is disposed on a side close to the antenna radiating body 111. In this way, the reused main board can use the original antenna spring pins in the antenna to form a support, thereby eliminating the need to set up an additional support structure for the antenna or sensor circuit layer, which can meet the performance requirements of the antenna and the sensor, simplify the overall structure integrating the antenna and the sensor, and facilitate the spatial reuse of the antenna, thereby reducing the area required for the antenna in the length direction.

[0043] Optionally, the radio frequency signal is a high-frequency signal, the antenna sends and receives electromagnetic waves through the antenna radiation body, and the radio frequency circuit transmits and processes radio frequency signals, including: the radio frequency circuit converts the electromagnetic waves into the radio frequency signals and transmits them to the antenna chip through the antenna spring pins, and the antenna chip processes the radio frequency signals; the induction signal is a low-frequency signal, and the sensor also includes an induction chip disposed on the second circuit layer; the induction element sends the induction signal to the induction chip; after the induction chip obtains the induction signal, the corresponding operation instruction is determined according to the induction signal. In this way, the specific implementation process of the antenna sending and receiving electromagnetic wave signals and the induction operation of the induction element is completed.

[0044] Optionally, the sensor is a touch sensor, and the sensing element 14 includes two or more touch pads arranged on the second circuit layer and spaced apart in a direction parallel to the reused mainboard. Figure 2 In an optional specific embodiment, the touch pad includes a first touch pad a, a second touch pad b and a third touch pad c which are arranged at equal intervals in a direction parallel to the reused mainboard.

[0045] Optionally, the first circuit layer 131 is disposed on a side close to the main circuit board 15, and the second circuit layer 132 is disposed on a side away from the main circuit board 15. When the sensor is a touch sensor, the second circuit layer 132 provided with the sensing element of the touch sensor is disposed on a side away from the main circuit board 15, so that the touch sensor can sense external input signals through multiple touch pads, thereby improving the sensing accuracy.

[0046] Optionally, the sensor further includes a touch chip disposed on the second circuit layer, and the touch pad is electrically connected to the touch chip. Wherein, taking the sensor as a touch sensor as an example, the touch chip (touch IC) is directly disposed on the second circuit layer, so as to facilitate the electrical connection between the touch pad and the touch chip, and the touch pad collects the touch operation signal generated corresponding to the user's touch operation on the sensing area and sends it to the touch chip to determine the different designated operation types accordingly. Here, the touch chip includes a plurality of touch output terminals, and the touch pads are respectively connected to the touch output terminals of the corresponding chips, and the touch pads are used to sense the user's touch input operation type. The plurality of touch pads are arranged at intervals, and different designated operation types can be determined accordingly according to the touch operation information sensed by each touch pad, such as sliding up operation, sliding down operation, single-point key operation, etc. Optionally, the touch chip of the sensor can also be disposed on the main circuit board 15, and the touch pad is electrically connected to the touch chip. Still taking the sensor as a touch sensor as an example, the touch chip is arranged on the main circuit board, and the touch pads are arranged on the second circuit layer 132 of the reused main board 13 at intervals in a direction parallel to the reused main board. The touch pads are electrically connected to the corresponding touch output terminals on the touch chip through lines. The touch pads send the collected user's touch operation information on the sensing area to the touch chip, and correspondingly determine different designated operation types. In this way, the size design of the reused main board 13 only needs to meet the size of the radiation area of ​​the antenna's radiation body, which can reduce the occupied area required by the overall structure formed by the sensor and antenna assembly in the length direction.

[0047] Optionally, the sensor and antenna assembly further includes a touch isolation circuit connected to the touch pad, and the touch isolation circuit includes an isolation inductor connected to the touch pad in a one-to-one correspondence. The touch isolation circuit includes a plurality of inductors connected in parallel and corresponding to the touch pads, respectively, which can filter out or reduce the interference of the antenna to the sensor. In an optional specific embodiment, please refer to Figure 3 The touch pads include three, and the touch isolation circuit includes inductors L5, L6, and L7 respectively connected to the three touch pads a, b, and c in a one-to-one correspondence.

[0048] Optionally, the antenna is a planar inverted F-shaped antenna, and the planar inverted F-shaped antenna further includes an antenna feed point disposed on the first circuit layer close to the antenna radiation body. The antenna adopts a planar inverted F-shaped antenna to enhance the antenna's transceiver performance and improve the user experience.

[0049] In an optional embodiment, the sensor is a pressure sensor, and the pressure detection unit of the pressure sensor can be directly arranged in the second circuit layer as a sensing element. Pressure sensing is achieved by collecting the deformation of the pressure sensor. When it is subjected to elastic deformation or tensile deformation, its body resistance will change significantly. The pressure detection unit (sensor) is arranged in the second circuit layer, and can directly collect the pressure sensing signal corresponding to the user's touch operation on the sensing area, so as to determine different designated operation types accordingly, such as long press operation, short press operation, double-click operation, etc., which can improve the sensor detection accuracy. Among them, when the sensor adopts a pressure sensor, the upper and lower stacking order of the first circuit layer 131 and the second circuit layer 132 of the reused main board 13 can be arbitrarily interchanged. For example, the second circuit layer with a pressure detection unit can be arranged on the upper side of the reused main board 13 away from the main circuit board 15, and the first circuit layer with an antenna radiating body can be arranged on the lower side of the reused main board 13 close to the main circuit board 15; or, the second circuit layer with a pressure detection unit can be arranged on the lower side of the reused main board 13 close to the main circuit board 15, and the first circuit layer with an antenna radiating body can be arranged on the upper side of the reused main board 13 away from the main circuit board 15.

[0050] In this embodiment, the antenna radiating body 11 is provided with an antenna feeding point, and the antenna feeding point is provided on a side of the antenna radiating body relatively far away from the pressure sensing differential output end of the pressure detection unit. Figure 4 Taking the pressure sensor as an example, the pressure detection unit includes a pressure-sensitive power supply pin, a pressure-sensitive differential output positive electrode, a pressure-sensitive differential output negative electrode, and a pressure-sensitive ground electrode; the first circuit layer with the antenna radiating body 11 is opposite to the second circuit layer with the pressure detection unit, and the antenna feeding point is arranged on the side of the antenna radiating body 11 that is relatively far away from the pressure-sensitive differential output end of the pressure detection unit, which is more conducive to reducing the interference of the pressure sensor on the antenna's reception and transmission of electromagnetic waves.

[0051] Optionally, the sensor and antenna assembly also includes a high-frequency filtering circuit connected to the radio frequency circuit, and / or a low-frequency filtering circuit connected to the sensing element. The sensor uses the antenna radiation body as a reference ground, and the antenna and sensor reuse the area where the antenna radiation body is located. The antenna works in a high-frequency band, and the sensor works in a low-frequency band, so the two can work in different frequency bands respectively. The antenna is provided with a high-frequency filtering circuit connected to the radio frequency circuit, and the sensor is provided with a low-frequency filtering circuit connected to the sensing element, which can respectively eliminate or reduce the interference of low-frequency signals to the antenna and high-frequency signals to the sensor, thereby further ensuring the performance of the antenna and the sensor. Please refer to Figure 5 The high-frequency filter circuit may be a high-frequency filter patch HPF connected to the radio frequency circuit, and the low-frequency filter circuit may be a low-frequency filter patch LPF connected to the inductive element.

[0052] Optionally, the sensor and antenna assembly further comprises a first isolation circuit connected to the radio frequency circuit, the first isolation circuit comprising a first capacitor and a second capacitor connected in series, and a common mode inductor connected between a node between the first capacitor and the second capacitor and ground; and / or, the sensor and antenna assembly further comprises a second isolation circuit connected to the sensing element, the second isolation circuit comprising a first inductor and a second inductor connected in series, and a filter capacitor connected between a node between the first inductor and the second inductor and ground. Please refer again Figure 5 , taking the sensor as a pressure sensor and the sensing chip in the pressure sensor as a pressure-sensing signal processing chip as an example, the first isolation circuit includes a first capacitor C1 and a second capacitor C2 connected in series, and a common-mode inductor L8 connected between the node between the first capacitor C1 and the second capacitor C2 and the ground, using a series capacitor and a parallel inductor to the ground between the Bluetooth antenna and the Bluetooth chip radio frequency signal, the capacitance of the first capacitor C1 and the second capacitor C2 can be 10PF respectively, the first isolation circuit connects a capacitor that connects high frequency to low frequency in series on the radio frequency signal line, and then connects an inductor from low frequency to ground in parallel, providing a conduction path for the radio frequency signal and suppressing the pressure-sensing signal. The second isolation circuit includes a first inductor L1 and a second inductor L2 connected in series, and a filter capacitor C7 connected between the node between the first inductor L1 and the second inductor L2 and the ground, using a series inductor and a parallel capacitor to the ground between the pressure detection unit and the pressure-sensing signal processing chip, the isolation circuit connects a low frequency to high frequency in series on the pressure-sensing signal line, and then connects a capacitor from high frequency to ground in parallel, providing a conduction path for the pressure-sensing signal and suppressing the radio frequency signal. In this way, the interference between the antenna and the sensor can be eliminated or reduced, ensuring that the performance of the antenna and the sensor is maximized.

[0053] Optional, see Figure 6, the RF circuit includes an antenna matching circuit and a filter circuit, the antenna matching circuit includes a third inductor L3 and a third capacitor C3 and a fourth capacitor C4 respectively connected between the opposite ends of the third inductor L3 and the ground. Wherein, the antenna takes a Bluetooth antenna as an example, the antenna matching circuit includes a third inductor L3 and a third capacitor C3 and a fourth capacitor C4 respectively connected between the opposite ends of the third inductor L3 and the ground, the third inductor L3, the third capacitor C3 and the fourth capacitor C4 form a Π-type circuit, which is used to adjust the impedance matching between the antenna and the circuit on the mainboard. Optionally, the filter circuit includes a fourth inductor L4 connected in series with the third inductor L3 and a fifth capacitor C5 connected between one end of the fourth inductor L4 and the ground. Taking the Bluetooth antenna as an example, the filtering circuit includes a fourth inductor L4 connected in series with the third inductor L3 and a fifth capacitor C5 connected between one end of the fourth inductor L4 and the ground. The third inductor L3, the fourth inductor L4 and the fifth capacitor C5 form an L-shaped circuit for filtering out clutter or other high-order harmonics outside the BT frequency band from the main control touch chip. In this way, the RF circuit can ensure that the antenna radiating body accurately transmits and receives RF signals.

[0054] Optional, such as Figure 3 and Figure 6 As shown, the sensor and antenna assembly also includes a system return-to-ground circuit, and the system return-to-ground circuit includes an isolation capacitor C6 connected between the antenna radiation body 61 and the ground. The system return-to-ground circuit includes an isolation capacitor connected between the antenna radiation body and the ground, and the radiation body of the antenna can be used as the "ground" layer of the sensing element to connect with the "ground" on the main circuit board as a whole. By adding corresponding series potential components to the connected line, the purpose of reducing the influence and interference of the sensor on the antenna can be further achieved.

[0055] Optionally, in the sensor and antenna assembly provided by the embodiment of the present application, the reused mainboard 13 may be a flexible circuit board. When the reused mainboard is a flexible circuit board, the first circuit layer and the second circuit layer are flexible circuit layers, respectively. Since the flexible main circuit board has the characteristics of high wiring density, light weight, thin thickness, and good bendability, the reused mainboard can be ensured to have high reliability when realizing the reuse of antennas and sensors in a limited space.

[0056] Optionally, in the sensor and antenna assembly provided by the embodiment of the present application, the reused mainboard 13 may also be a main circuit board. When the reused mainboard 13 is a printed circuit board, the first circuit layer and the second circuit layer are respectively arranged on opposite sides of the printed circuit board.

[0057] In another aspect, the present application also provides a wireless headset. Figure 7The wireless headset 70 includes an earplug portion 701 and an ear handle portion 702, and the sensor and antenna assembly are arranged in the ear handle portion 702. It should be noted that the sensor and antenna assembly can be the sensor and antenna assembly described in any of the aforementioned embodiments of the present application, which will not be repeated here.

[0058] In order to have a more organized understanding of the wireless headset using the sensor and antenna assembly in the embodiment of the present application, the following is an example in which the antenna in the sensor and antenna assembly is a planar inverted F-shaped antenna, the sensor is a touch sensor, the reused main board 13 is a double-layer flexible circuit board, and the sensing element 14 is a touch pad 141.

[0059] like Figure 7 As shown, the planar inverted F-shaped antenna is configured to receive and send radio frequency signals; the touch sensor is configured to receive induction signals; the double-layer flexible circuit board includes a first circuit layer 131 and a second circuit layer 132 spaced apart along the thickness direction of the double-layer flexible circuit board, the second circuit layer 132 is arranged on the side of the ear handle portion 702 close to the outside, and the first circuit layer 131 is arranged on the side facing the inside of the ear handle portion 702; the first circuit layer 131 is provided with an antenna radiating body and a radio frequency circuit of the planar inverted F-shaped antenna, and the radio frequency circuit is used to control the radiating body of the planar inverted F-shaped antenna to receive and send radio frequency signals; the second circuit layer 132 is provided with a plurality of touch pads 141. In the embodiment of the present application, the plurality of touch pads 141 are taken as three touch pads as an example. Please refer again Figure 2 , the three touch pads are respectively the first touch pad a, the second touch pad b, and the third touch pad c. The three touch pads are used to sense the user's operation instructions for the touch area located directly above the first touch pad a, the second touch pad b, and the third touch pad c on the ear handle part 702, and obtain matching sensing signals according to the operation instructions. For example, the first touch pad a, the second touch pad b, and the third touch pad c can correspond to the volume control keys respectively. When the user continuously touches along the length direction of the ear handle part 202 and directly above the first touch pad a, the second touch pad b, and the third touch pad c, the volume can be increased or decreased. Here, the planar inverted F-shaped antenna radiation body is arranged relative to the first touch pad a, the second touch pad b, and the third touch pad c in an upper and lower manner, and the antenna radiation body of the planar inverted F-shaped antenna acts as the ground formation of the touch sensor.

[0060] It is worth noting that the antenna in the embodiment of the present application can also be a monopole antenna. However, when the antenna is a planar inverted F-shaped antenna, please refer to Figure 2, the planar inverted F-shaped antenna needs to set a feeding point f at the position of the antenna feeding point e, and the feeding point f is used to connect to the ground wire led out from the main circuit board. Generally, when the antenna is designed as a planar inverted F-shaped antenna, the feeding point e of the planar inverted F-shaped antenna is designed to be closer to the antenna radiation body, so that the performance of the planar inverted F-shaped antenna in transmitting and receiving radio frequency signals is best. In other words, the monopole antenna has only one feeding point, while the planar inverted F-shaped antenna includes two feeding points, namely the feeding point e and the feeding point f. Here, whether it is a planar inverted F-shaped antenna or a monopole antenna, the structural multiplexing of the antenna and the sensor can be realized, and the independent use of the sliding touch sensor and the planar inverted F-shaped antenna can be satisfied.

[0061] Optionally, the main circuit board 15 is parallel to and spaced apart from the double-layer flexible main circuit board, the planar inverted F-shaped antenna also includes a planar inverted F-shaped antenna chip and an antenna spring foot 115 connected between a feeding point e on the antenna radiating body 111 of the planar inverted F-shaped antenna and the planar inverted F-shaped antenna chip, the antenna chip 114 and the antenna spring foot 115 of the planar inverted F-shaped antenna are both arranged on the main circuit board 15, a touch chip is also arranged on the main circuit board 15, and the touch pad 141 is electrically connected to the touch chip.

[0062] Please refer again Figure 3 , is a circuit schematic diagram of the sensor and antenna assembly, where the three touch pads a, b, c are respectively connected to the touch chip using three inductance elements L5, L6, and L7 to isolate high-frequency signals and ensure accurate transmission of touch sensor detection signals. Here, the radio frequency circuit 112 of the planar inverted F-shaped antenna includes an antenna matching circuit and a filter circuit, wherein the antenna matching circuit adopts a Π-type isolation circuit, and the filter circuit adopts an L-type isolation circuit, wherein the Π-type isolation circuit includes a third inductor L3 and a third capacitor C3 and a fourth capacitor C4 respectively connected between the opposite ends of the third inductor L3 and the ground, for adjusting the impedance matching between the planar inverted F-shaped antenna and the circuit on the reused mainboard 13; the L-type isolation circuit includes a fourth inductor L4 connected in series with the third inductor L3 and a fifth capacitor C5 connected between one end of the fourth inductor L4 and the ground, for filtering out clutter or other high-order harmonics outside the exclusive frequency band from the antenna chip. The inductance of the third inductor L3, the fourth inductor L4, the fifth inductor L5, the sixth inductor L6, and the seventh inductor L7 may be 1nH, and the capacitance of C3 and C4 may be 10pF. Here, the planar inverted F-shaped antenna and touch sensor composite structure also includes a system return circuit, and the system return circuit includes an isolation capacitor C6 connected between the antenna radiation body and the ground, and the capacitance value of the isolation capacitor C6 is in the range of 5pF-22pF.

[0063] In an embodiment of the present application, the antenna radiating body 111 of the planar inverted F-shaped antenna and the multiple touch pads 141 are integrated on both sides of the same double-layer flexible main circuit board. The antenna radiating body can be used as the ground layer of the sensor. In this way, the antenna and the sensor can reuse the space in the area where the antenna radiating body is located, saving the overall space occupied by the sensor and the antenna; moreover, by providing an isolation circuit and a filtering circuit between the antenna radiating body 111 of the planar inverted F-shaped antenna and the antenna chip 114 of the planar inverted F antenna, and providing an isolation inductor between the touch chip and the touch pad 141, it is possible to effectively ensure the performance of the antenna and meet the performance requirements of the corresponding functions of the sliding touch wireless headset.

[0064] In order to have a more comprehensive understanding of the wireless headset using the sensor and antenna assembly in the embodiment of the present application, please refer to Figure 8 , is a schematic diagram of a wireless headset 70 provided in another embodiment, the wireless headset includes an earplug portion 701 and an ear handle portion 702, and the sensor and antenna assembly is disposed in the ear handle portion 702. In this embodiment, the antenna in the sensor and antenna assembly is a Bluetooth antenna, the sensor is a pressure sensor as an example, the reused mainboard 13 is a double-layer flexible circuit board, the sensing element 14 is a pressure sensing detection unit 142, and the touch chip is a pressure sensing signal processing chip to constitute the sensor and antenna assembly for explanation.

[0065] See also Figure 8, the Bluetooth antenna of the sensor and antenna assembly in the wireless headset in the embodiment of the present application is configured to send and receive radio frequency signals; the pressure sensor is configured to receive induction signals; the double-layer flexible circuit board includes a first circuit layer 131 and a second circuit layer 132 arranged at intervals along the thickness direction of the circuit board, the first circuit layer 131 is arranged on the side of the ear handle part 702 close to the outside, and the second circuit layer 132 is arranged on the side facing the inside of the ear handle part 702; the first circuit layer 131 is provided with an antenna radiating body 111 of the Bluetooth antenna and a radio frequency circuit 112, and the radio frequency circuit 112 is used to control the antenna radiating body 111 of the Bluetooth antenna to send and receive radio frequency signals; the second circuit layer 132 is provided with a pressure detection unit 142. The pressure detection unit 142 is used to detect the operation instruction corresponding to the position of the wireless headset 70, and obtain a matching induction signal according to the operation instruction; here, the antenna radiating body 111 of the Bluetooth antenna and the pressure detection unit 142 are arranged in an upper and lower relative manner, and the antenna radiating body 111 of the Bluetooth antenna is the ground layer of the pressure sensor. Similarly, the sensor and antenna assembly in the wireless headset in the embodiment of the present application also includes a main circuit board 15 that is parallel to and spaced apart from the double-layer flexible main circuit board, and the main circuit board 15 is provided with an antenna chip 111 of the Bluetooth antenna and an antenna spring foot 115 connected between a feeding point on the radiating body 111 of the Bluetooth antenna and the Bluetooth antenna chip, and the main circuit board 15 is also provided with a pressure sensing signal processing chip, and the pressure detection unit 142 is electrically connected to the pressure sensing signal processing chip.

[0066] See also Fig. 9 The antenna radiation body 111 of the Bluetooth antenna is connected to the antenna chip 114 of the Bluetooth antenna, and the pressure detection unit 142 is electrically connected to the pressure sensing signal processing chip.

[0067] Please refer again Figure 5 , the antenna radiating body 111 of the Bluetooth antenna is connected to the antenna chip 114 of the Bluetooth antenna, and the pressure detection unit 142 is electrically connected to the pressure sensing signal processing chip. Here, the antenna radiating body 111 of the Bluetooth antenna is connected to the antenna chip 114 of the Bluetooth antenna through the radio frequency circuit 112 and the first isolation circuit; please refer to Figure 6, the RF circuit 112 of the Bluetooth antenna includes an antenna matching circuit and a filter circuit, wherein the antenna matching circuit adopts a Π-type isolation circuit, and the filter circuit adopts an L-type isolation circuit, wherein the Π-type isolation circuit includes a third inductor L3 and a third capacitor C3 and a fourth capacitor C4 respectively connected between the opposite ends of the third inductor L3 and the ground; the "L"-type isolation circuit includes a fourth inductor L4 connected in series with the third inductor L3 and a fifth capacitor C5 connected between one end of the fourth inductor L4 and the ground. The inductance values ​​of the third inductor L3, the fourth inductor L4, the fifth inductor L5, the sixth inductor L6, and the seventh inductor L7 can be 1nH, and the capacitance values ​​of the third capacitor C3 and the fourth capacitor C4 can be 10pF. The first isolation circuit includes a first capacitor C1 and a second capacitor C2 connected in series, and a common mode inductor L8 connected between the node between the first capacitor C1 and the second capacitor C2 and the ground; wherein the optional range of the capacitance of the first capacitor C1 and the second capacitor C2 is 5pF-22pF, and the optional range of the common mode inductor is 8.2nH-72nH; preferably, the value of the first capacitor C1 can be selected as 10pF, the value of the second capacitor C2 can be selected as 18pF, and the value of the common mode inductor L8 can be selected as 22nH. Here, the pressure detection unit 142 is electrically connected to the pressure sensing signal processing chip through the second isolation circuit; the second isolation circuit includes a first inductor L1 and a second inductor L2 connected in series, and a filter capacitor C7 connected between the node between the first inductor L1 and the second inductor L2 and the ground. wherein, the optional range of the inductance of the first inductor L1 and the second inductor L2 is 8.2nH-72nH, and the optional range of the capacitance of the filter capacitor C7 is 5pF-22pF. Preferably, the value of the first inductor L1 is 72 nH, the value of the second inductor L2 is 72 nH, and the value of the filter capacitor C7 is 5 pF.

[0068] Here, please refer again Figure 6 The antenna and pressure sensor composite structure also includes a system ground return circuit, and the system ground return circuit includes an isolation capacitor C6 connected between the antenna radiation body 111 of the Bluetooth antenna and the ground, and the capacitance value range of C6 is 5pF-22pF.

[0069] In an embodiment of the present application, the antenna radiating body 111 of the Bluetooth antenna and the pressure sensing chip of the pressure sensor are integrated on opposite sides of the same double-layer flexible circuit board. The antenna radiating body 111 of the Bluetooth antenna can serve as the ground layer of the sensor. In this way, the antenna and the sensor can reuse the space in the area where the antenna radiating body 111 of the Bluetooth antenna is located, saving the overall space occupied by the sensor and the antenna; moreover, by setting an isolation circuit and a filtering circuit, it is possible to effectively ensure the normal transmitting and receiving performance of the antenna and effectively reduce the overall size of the headset.

[0070] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A sensor and antenna assembly, comprising an antenna and a sensor, characterized in that: Also includes: A multiplexed mainboard, the multiplexed mainboard comprising a first circuit layer and a second circuit layer spaced apart in a thickness direction of the multiplexed mainboard, the first circuit layer being provided with an antenna radiating body and a radio frequency circuit of the antenna, the antenna radiating body being used to send and receive electromagnetic waves, the radio frequency circuit being used to transmit and process radio frequency signals; the second circuit layer being provided with a sensing element of the sensor, the sensing element being used to sense an operation, and obtaining a corresponding sensing signal according to the operation; The antenna radiation body of the first circuit layer and the inductive element of the second circuit layer at least partially overlap along the thickness direction of the reused main board, and the antenna radiation body serves as a ground layer of the sensor.

2. The sensor and antenna assembly according to claim 1, wherein: It also includes a main circuit board which is arranged parallel to and spaced apart from the reused main board, and the antenna also includes an antenna chip arranged on the main circuit board and an antenna spring foot connected between a feeding point on the antenna radiation body and the antenna chip.

3. The sensor and antenna assembly according to claim 2, characterized in that: The radio frequency signal is a high-frequency signal, the antenna sends and receives electromagnetic waves through the antenna radiation body, and the radio frequency circuit transmits and processes the radio frequency signal, including: the radio frequency circuit converts the electromagnetic wave into the radio frequency signal and transmits it to the antenna chip through the antenna spring pin, and the antenna chip processes the radio frequency signal; the induction signal is a low-frequency signal, and the sensor also includes a sensing chip arranged on the second circuit layer; the sensing element sends the sensing signal to the sensing chip; after the sensing chip obtains the sensing signal, the corresponding operation instruction is determined according to the sensing signal.

4. The sensor and antenna assembly according to claim 1, wherein: The sensor is a touch sensor, and the sensing element includes two or more touch pads arranged on the second circuit layer and spaced apart in a direction parallel to the reused mainboard.

5. The sensor and antenna assembly according to claim 2, wherein: The first circuit layer is arranged on a side close to the main circuit board, and the second circuit layer is arranged on a side far away from the main circuit board.

6. The sensor and antenna assembly according to claim 5, characterized in that: The sensor further includes a touch chip disposed on the second circuit layer, and the touch pad is electrically connected to the touch chip; or, It also includes a main circuit board which is arranged in parallel with and spaced apart from the reused main board. A touch chip is arranged on the main circuit board, and the touch pad is electrically connected to the touch chip.

7. The sensor and antenna assembly according to claim 6, characterized in that: It also includes a touch isolation circuit connected to the touch pads, and the touch isolation circuit includes isolation inductors connected to the touch pads in a one-to-one correspondence.

8. The sensor and antenna assembly according to claim 1, wherein: The antenna is a planar inverted F-shaped antenna, and the planar inverted F-shaped antenna also includes an antenna feeding point arranged on the first circuit layer close to the antenna radiation body.

9. The sensor and antenna assembly according to claim 1, wherein: The sensor is a pressure sensor, and the pressure sensor includes a pressure detection unit arranged on the second circuit layer.

10. The sensor and antenna assembly according to claim 9, wherein: It also includes a high-frequency filter circuit connected to the radio frequency circuit, and / or a low-frequency filter circuit connected to the inductive element.

11. The sensor and antenna assembly according to claim 9, wherein: Also includes a first isolation circuit connected to the radio frequency circuit, the first isolation circuit includes a first capacitor and a second capacitor connected in series, and a common mode inductor connected between a node between the first capacitor and the second capacitor and ground; and / or, It also includes a second isolation circuit connected to the inductive element, wherein the second isolation circuit includes a first inductor and a second inductor connected in series, and a filter capacitor connected between a node between the first coupling capacitor and the second coupling capacitor and ground.

12. The sensor and antenna assembly according to any one of claims 1 to 11, characterized in that: The radio frequency circuit includes an antenna matching circuit and a filtering circuit. The antenna matching circuit includes a third inductor and a third capacitor and a fourth capacitor respectively connected between the opposite ends of the third inductor and the ground; the filtering circuit includes a fourth inductor connected in series with the third inductor and a fifth capacitor connected between one end of the fourth inductor and the ground.

13. The sensor and antenna assembly according to any one of claims 1 to 11, characterized in that: It also includes a system ground return circuit, which includes an isolation capacitor connected between the antenna radiation body and the ground.

14. The sensor and antenna assembly according to any one of claims 1 to 11, characterized in that: The multiplexed mainboard is a flexible circuit board, and the first circuit layer and the second circuit layer are respectively flexible circuit layers; or the multiplexed mainboard is a printed circuit board, and the first circuit layer and the second circuit layer are respectively arranged on opposite sides of the printed circuit board along the thickness direction of the multiplexed mainboard.

15. A wireless headset, comprising an earplug portion and an ear handle portion, characterized in that: It also includes the sensor and antenna assembly as described in any one of claims 1 to 14, wherein the sensor and antenna assembly are arranged in the ear handle.

16. The wireless headset according to claim 15, characterized in that: The sensor is a touch sensor, the second circuit layer is arranged on a side of the ear handle portion close to the outside, and the first circuit layer is arranged on a side facing the inside of the ear handle portion; or, The sensor is a pressure sensor, and one of the first circuit layer and the second circuit layer is arranged on a side of the ear handle portion close to the outside, and the other is arranged on a side facing the inside of the ear handle portion.

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