A method of avoiding position by combining cross-stitching

Abstract

The present invention discloses a position avoidance process for cross-assembly. The process comprises the following steps: 1) compounding a layer of low-viscosity protective film on the top surface of a thick PC film; 2) cutting halfway from the top surface of the protective film to the thick PC film, and cutting out each inner frame; 3) compounding a layer of main material double-sided adhesive and a layer of first release paper on the top surface of the thick PC film in sequence; 4) cutting halfway from the top surface of the first release paper to the thick PC film, and removing the first release paper, main material double-sided adhesive and protective film; 5) compounding a layer of second release paper on the top surface of the thick PC film; 6) cutting halfway from the top surface of the second release paper to the thick PC film, and cutting out each outer frame; 7) cutting a plurality of inner holes in the inner frame of the thick PC film. The position avoidance process for cross-assembly in the present invention sets a low-viscosity protective film and performs die-cutting and discharging, so that after the thick PC film and the adhesive are bonded, the excess waste can be removed, thereby smoothly realizing the assembly of products with adhesive on the thick PC film and improving assembly efficiency.

Description

Technical Field

[0001] The invention relates to the field of die cutting, and in particular to a position avoidance process for cross assembly. Background Art

[0002] Currently, in the die-cutting industry, for some complex, multi-layered products, it is generally necessary to first die-cut to produce multiple semi-finished products, then assemble these semi-finished products, and then cut the finished products. The assembly is generally done manually, which is extremely inefficient.

[0003] As for the process of assembling thick PC (polycarbonate) film by cross stamping, although the general assembly process method is already very mature, if the thick PC film and glue are compounded first, the thick PC film with glue cannot be cross stamped because residual glue will remain in the mold knife seam. Therefore, it is necessary to cut off the glue by die cutting at the place where the cross is stamped to avoid the cross stamping mold edge. If the glue is too firmly adhered, it is not easy to perform die cutting to remove waste. Summary of the Invention

[0004] In order to solve the above problems, the present invention provides a position avoidance process for cross assembly.

[0005] According to one aspect of the present invention, a process for avoiding a position in conjunction with a cross assembly is provided, comprising the following steps:

[0006] 1) Compound a low-viscosity protective film on the top surface of the thick PC film;

[0007] 2) Cut halfway from the top surface of the protective film to the thick PC film and cut out the inner frames;

[0008] 3) Laminating a layer of main material double-sided adhesive and a layer of first release paper on the top surface of the thick PC film in sequence;

[0009] 4) Cut halfway from the top surface of the first release paper to the thick PC film, and remove the first release paper, main material double-sided tape and protective film;

[0010] 5) Laminating a second release paper layer on the top surface of the thick PC film;

[0011] 6) Cut halfway from the top surface of the second release paper to the thick PC film to cut out the outer frame;

[0012] 7) Cut multiple inner holes in the inner frame of the thick PC film.

[0013] The present invention provides a cross-assembly avoidance process by setting a low-viscosity protective film and performing die-cutting and discharge, so that after the thick PC film and the glue are bonded, the excess waste can be discharged, thereby smoothly realizing the assembly of products with glue on the thick PC film and improving the assembly efficiency.

[0014] In some embodiments, in step 1), a layer of low-viscosity bottom film is further laminated on the bottom surface of the thick PC film. This is advantageous in that the low-viscosity bottom film is solidified to support the thick PC film, and the low-viscosity film can be easily removed.

[0015] In some embodiments, in step 2), the inner frame is expanded and cut out according to the shape of the processing hole of the stamping die. The benefit is that a specific method for cutting out the inner frame is described.

[0016] In some embodiments, the length of the expansion is 0.25 mm. The benefit is that the specific size of the expansion cut out of the inner frame is described, and the appropriate size can be selected according to needs.

[0017] In some embodiments, in step 2), after the inner frame is cut out, the waste on the protective film is removed. This is beneficial in that it describes a subsequent waste removal method after the inner frame is cut out, so as to facilitate the next step.

[0018] In some embodiments, in step 7), after each inner hole is cut out, the second release paper is discarded. This is beneficial in that it describes a subsequent waste disposal method after cutting out the inner frame, so as to facilitate the next step.

[0019] In some embodiments, in step 7), a clearance zone is formed between each outer frame. The benefit of this is that the provision of the clearance zone facilitates the subsequent smooth cross-assembly of the thick PC film.

[0020] In some embodiments, the width of the thick PC film is 55 mm. The advantage is that the partial width data of the thick PC film is set, wherein the width of the material strip used to pull the thick PC film is preferably 70 mm. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of a thick PC film in processing in accordance with an avoidance process of cross assembly according to an embodiment of the present invention. DETAILED DESCRIPTION

[0022] The present invention will be further described in detail below with reference to the accompanying drawings.

[0023] This process is used to produce thick PC films with avoidance areas without residual adhesive, thereby facilitating subsequent cross-lamination of the thick PC films.

[0024] Figure 1 The structure of a thick PC film in the process of avoiding position in a cross assembly process according to an embodiment of the present invention is schematically shown. Figure 1As shown, in this embodiment, a die-cutting device is used in conjunction with a corresponding stamping die to punch out multiple half-cut frames on a thick PC film. Each frame is composed of an inner frame and an outer frame, and multiple through-holes are cut into the inner frame of the frame. The frames are arranged in at least one row, and the inner holes are arranged in multiple rows and columns within each frame.

[0025] like Figure 1 As shown, during processing, a material strip is used to pull the thick PC film, and there is a row of positioning holes on both sides of the material strip.

[0026] The process has multiple steps, which are described below.

[0027] The first step is to compound a bottom low-viscosity film on the bottom surface of the thick PC film for supporting it, and then compound a protective film in the center of the top surface of the thick PC film, wherein the protective film is also a low-viscosity film so that it can be easily separated when removed.

[0028] The second step is to place the laminated thick PC film onto a strip of material, which is then passed through the die-cutting machine's stamping die. The die-cutting machine cuts through the top surface of the protective film, cutting halfway through the protective film onto the thick PC film. The inner frames of the cells are then cut out of the thick PC film, and this process is repeated until all the inner frames are cut.

[0029] In addition, the punching die is provided with processing holes corresponding to the respective grids, and the inner frames are sequentially cut out on the thick PC film according to the shapes of the processing holes.

[0030] Preferably, when the inner frame is cut out according to the shape of the processing hole of the stamping die, the inner frame is generally cut out by expanding the shape of the processing hole by 0.25 mm.

[0031] More preferably, the width of the thick PC film is 55 mm, and the width of the material strip for pulling the thick PC film is 70 mm.

[0032] After cutting out the inner frames, waste will be punched out of the product inside the protective film. At this time, the waste needs to be discharged before proceeding to the next step.

[0033] The third step is to laminate a layer of main material double-sided tape in the center of the top surface of the thick PC film, and then laminate a layer of release paper on the main material double-sided tape, which can be called the first release paper.

[0034] The fourth step is to continue die-cutting using the die-cutting equipment. The die-cutting equipment cuts from the top surface of the first release paper, passing through the first release paper and the main double-sided tape, and then cuts halfway onto the thick PC film (the half-cut height should not be lower than the inner frame). The first release paper, main double-sided tape, and protective film on the thick PC film can then be conveniently discarded, along with the waste material outside the inner frame.

[0035] Among them, since the protective film is a low-viscosity film, the protective film can be easily separated from the thick PC film.

[0036] The fifth step is to laminate a layer of release paper on the top surface of the thick PC film. This layer can be called the second release paper.

[0037] The sixth step is to continue using the die-cutting equipment for punching. The die-cutting equipment starts from the top surface of the second release paper, cuts through the second release paper, and cuts halfway onto the thick PC film (the half-cut height is not lower than the inner frame). If needed, the outer frame is cut out of the thick PC film, and this action is repeated until all the outer frames are cut out.

[0038] In the last step, the die-cutting equipment is used to punch out multiple inner holes in the inner frame of the thick PC film.

[0039] After cutting out the inner holes, the second release paper can be removed. At this point, there is no residual glue between the outer frames, which is the avoidance area for cross lamination. This avoidance area helps to smoothly cross lamination of thick PC films in the subsequent process.

[0040] In addition, multiple cutting dies can be set side by side on the die-cutting equipment to complete different operations on different cutting dies in the same punching operation, such as cutting the inner frame, cutting the outer frame, and cutting the inner hole.

[0041] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all fall within the scope of protection of the present invention.

Claims

1. A cross-stitch avoidance process, characterized by: The following steps are included 1) Compound a low-viscosity protective film on the top surface of the thick PC film; 2) Cut halfway from the top surface of the protective film to the thick PC film, expand and cut out the inner frames according to the shape of the processing hole of the stamping die; 3) Laminating a layer of main material double-sided adhesive and a layer of first release paper on the top surface of the thick PC film in sequence; 4) Cut halfway from the top surface of the first release paper to the thick PC film, and remove the first release paper, main material double-sided tape and protective film; 5) Laminating a second release paper layer on the top surface of the thick PC film; 6) Cut halfway from the top surface of the second release paper to the thick PC film to cut out the outer frames; 7) Cut multiple inner holes in the inner frame of the thick PC film, and the areas between the outer frames are avoidance areas where no residual glue exists.

2. The cross-stitch avoidance process according to claim 1, characterized in that: In step 1), a layer of bottom supporting low-viscosity film is compounded on the bottom surface of the thick PC film.

3. The avoidance process for cross-stitching according to claim 1, characterized in that: The expanded length is 0.25 mm.

4. The avoidance process for cross-stitching according to claim 1, characterized in that: In step 2), after the inner frame is cut out, waste material on the protective film is removed.

5. The avoidance process for cross-stitching according to claim 1, characterized in that: In step 7), after each inner hole is cut out, the second release paper is discarded.

6. The avoidance process for cross-stitching according to claim 1, characterized in that: The width of the thick PC film is 55 mm.

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