Non-contact fingerprint recognition device

Abstract

This invention provides a contactless fingerprint recognition device. A fingerprint to be tested is placed on a sensing area, which is at least 5 mm away from the device. The device projects an infrared beam from at least one infrared emitting module. This beam is refracted through an outer cover to the air interface, with an incident angle of less than 41.5 degrees. The infrared beam travels through the air to the fingerprint, which then reflects it back to the fingerprint sensing module for identification. Therefore, the fingerprint does not need to directly contact the outer cover, reducing contact and preventing virus transmission.

Description

Technical Field

[0001] This invention relates to a fingerprint identification device, and more particularly to a non-contact fingerprint identification device. Background Technology

[0002] Everyone is born with unique fingerprints, making them highly recognizable. Furthermore, genuine fingerprints are virtually impossible to forge, thus fingerprints have become a popular encryption and unlocking tool. Fingerprint readers are increasingly being used in a wide variety of devices. For example, fingerprint readers are being added to electronic devices (such as personal computers) or replacing traditional switches to protect data and prevent unauthorized access. Fingerprint readers can also replace traditional door locks, addressing the drawbacks of traditional keys, such as easy forgetting or loss, easy duplication, and illegal use. Developing a more convenient and accurate contactless identification system has always been a goal of the industry. Summary of the Invention

[0003] The purpose of this invention is to provide a non-contact fingerprint recognition device, which projects infrared light onto the fingerprint to be tested using an infrared emitting device, and then uses a fingerprint sensing module to perform fingerprint authentication, thereby achieving non-contact recognition.

[0004] To achieve the above objectives, the present invention provides a contactless fingerprint recognition device, comprising: a middle frame, an outer cover, a panel module, at least one infrared emitting module, an ink layer, and a fingerprint sensing module. The middle frame has an open side and a closed side on its two sides, with a through hole on the closed side. The outer cover is connected to the open side, closing the middle frame, and has a contactable surface. The panel module is located within the middle frame, and has a backlight module and an optical adhesive layer on its two sides, respectively, and is connected to the outer cover via the optical adhesive layer. The infrared emitting module is connected to the outer cover via an adhesive and can project an infrared beam. The ink layer is disposed on the outer cover and is spaced apart from the infrared emitting module. The fingerprint sensing module is located on the through hole. When a fingerprint to be tested is located on a sensing area outside the contactable surface, the infrared beam enters the outer cover through the gap, is incident on the contactable surface at a predetermined angle, and is refracted onto the fingerprint to be tested, and the fingerprint to be tested is reflected onto the fingerprint sensing module.

[0005] In one preferred embodiment of the present invention, the predetermined angle is the angle between the infrared beam and the normal to the accessible surface, and the predetermined angle is less than 41.5 degrees.

[0006] In one preferred embodiment of the present invention, the colloid is a liquid optical adhesive (Optical Clear Resin; OCR) or an optical tape (Optical Clear Adhesive; OCA), the thickness of the colloid is between 0.01 mm and 0.5 mm, and the refractive index of the colloid material is between 1.4 and 1.6.

[0007] In one preferred embodiment of the present invention, the optical adhesive layer is an optical clear adhesive tape (OCA).

[0008] In one preferred embodiment of the present invention, the refractive index of the outer cover material is between 1.4 and 1.6, the ink layer is made of an opaque material, and the spacing is between 0.1 mm and 50 mm.

[0009] In one preferred embodiment of the present invention, the infrared beam has a divergence angle between 30 degrees and 140 degrees, and the wavelength of the infrared beam is between 800 nanometers (nm) and 1300 nanometers (nm). The backlight module further includes a polarizing plate, a diffuser plate, a light guide plate, and a reflector plate stacked sequentially on a metal frame. The metal frame has an opening area corresponding to the through hole, which allows the infrared beam to pass through. The polarizing plate has a haze of 50% ± 20% and a transmittance of 60% ± 20% for the infrared beam. The diffuser plate has a haze of 70% ± 20% and a transmittance of 60% ± 20% for the infrared beam. The reflector plate has a haze of 60% ± 20% and a transmittance of 75% ± 20% for the infrared beam.

[0010] In one preferred embodiment of the present invention, the sensing area has a height and a length, wherein the height is the distance between the fingerprint to be tested and the contactable surface, and the length is the distance between the infrared emitting module and the fingerprint to be tested. The divergence angle is between 30 degrees and 90 degrees, the outer cover thickness is between 0.05 mm and 1 mm, the height is between 20 mm and 50 mm, and the length is between 10 mm and 50 mm.

[0011] In one preferred embodiment of the present invention, the divergence angle is between 30 degrees and 90 degrees, the thickness of the outer cover is between 1 mm and 10 mm, the height is between 5 mm and 20 mm, and the length is between 10 mm and 50 mm.

[0012] In one preferred embodiment of the present invention, the divergence angle is between 90 degrees and 140 degrees, the thickness of the outer cover is between 0.05 mm and 1 mm, the height is between 50 mm and 100 mm, and the length is between 5 mm and 30 mm.

[0013] In one preferred embodiment of the present invention, the divergence angle is between 90 degrees and 140 degrees, the thickness of the outer cover is between 1 mm and 10 mm, the height is between 20 mm and 50 mm, and the length is between 5 mm and 30 mm.

[0014] In one preferred embodiment of the present invention, the sensing area is defined as a region extending outward from a center with a radius between 0.05 mm and 15 mm. The sensing area is one of a circle, an ellipse, or an irregular shape. The size of the through hole is between 0.1 mm and 10 mm. The tangent of the angle between the infrared beam reflected from the fingerprint to be tested and the fingerprint sensing module and the center is defined as the ratio of the distance between the center and the center of the through hole to the distance between the accessible surface and the closed side. Attached Figure Description

[0015] Figure 1 This is a side view of a preferred embodiment of the non-contact fingerprint recognition device of the present invention.

[0016] Figure 2 This is a front view schematic diagram of a preferred embodiment of the non-contact fingerprint recognition device of the present invention.

[0017] Figure 3 This is a schematic diagram of the operating side structure of the first preferred embodiment of the non-contact fingerprint recognition device of the present invention.

[0018] Figure 4 This is a schematic diagram of the operating side structure of the second preferred embodiment of the non-contact fingerprint recognition device of the present invention.

[0019] Figure 5 This is a schematic diagram of the operating side structure of the third preferred embodiment of the non-contact fingerprint recognition device of the present invention.

[0020] Figure 6 This is a side view structural diagram of a preferred embodiment of the backlight module of the present invention.

[0021] The attached figures are labeled as follows:

[0022] 1: Middle frame L, L': Length

[0023] 11: Opening side T, T': Outer cover thickness

[0024] 12: Closed side P: Through hole size

[0025] 13: Through hole β: Included angle

[0026] 2: Outer cap tanβ: tangent

[0027] 21: Contact surface W: Distance between the axis center and the center of the through hole

[0028] 3: Panel module D: Distance between the accessible surface and the closed side

[0029] 31: Backlight Module

[0030] 311: Metal Frame

[0031] 312: Polarizing plate

[0032] 313: Diffuser plate

[0033] 314: Light guide plate

[0034] 315: Reflector

[0035] 316: Opening area

[0036] 32: Optical adhesive layer

[0037] 4: Infrared emitting module

[0038] 41: Colloid

[0039] 42: Infrared beam

[0040] 5: Ink layer

[0041] 6: Fingerprint sensing module

[0042] 61: Receiving surface

[0043] 7: Fingerprint to be tested

[0044] 9, 9': Sensing area

[0045] 91: Axis

[0046] 92: Radius

[0047] α, α': Divergence angle

[0048] s: Spacing

[0049] θ: Predetermined angle

[0050] H, H': Height Detailed Implementation

[0051] To achieve the aforementioned objectives and effects, the technical means and structures employed in this invention are described in detail below with reference to preferred embodiments, to facilitate a complete understanding. However, it should be noted that the content described does not constitute a limitation of this invention. Furthermore, in this specification, the numerical range indicated by "~" refers to the range encompassed by the values ​​recorded before and after "~" as the lower and upper limits. Also, in the numerical ranges described in stages in this specification, the upper or lower limit value recorded in a certain numerical range can be replaced by the upper or lower limit value of the numerical range recorded in other stages. Furthermore, in the numerical ranges described in this specification, the upper or lower limit value recorded in a certain numerical range can be replaced by the value shown in the embodiment. Moreover, the term "step" in this specification is not only an independent step, but also included in this terminology even when it is difficult to clearly distinguish it from other steps, as long as the desired purpose of the step can be achieved. Furthermore, although the terms “step” and / or “block” may be used in this document or in the accompanying drawings to refer to different elements of the method employed, unless the order of the individual steps is explicitly stated and otherwise, these terms should not be construed as implying any particular order of the various steps disclosed herein or between the various steps.

[0052] Please see Figure 1 as well as Figure 2 The diagram shown illustrates the side and front views of a preferred embodiment of the contactless fingerprint recognition device of the present invention. The present invention provides a contactless fingerprint recognition device comprising: a middle frame 1, an outer cover 2, a panel module 3, at least one infrared emitting module 4, an ink layer 5, and a fingerprint sensing module 6. The middle frame 1 is made of metal or plastic. The middle frame 1 has an open side 11 and a closed side 12 on its two sides. The closed side 12 has a through hole 13. The through hole 13 can be formed directly during the manufacturing of the middle frame 1, or it can be manufactured after the middle frame 1 is formed.

[0053] The outer cover 2 is a window cover of the touch panel (CG, or Cover Glass for short), located on the outermost layer of the Touch Display Module (TDM), which is the area that the user will directly touch. The outer cover 2 is connected to the opening side 11, closing the middle frame 1, and has a contactable surface 21. The main material of the outer cover 2 is glass, with a refractive index between 1.4 and 1.6.

[0054] The panel module 3 is located within the middle frame 1. On each side of the panel module 3 is a backlight module 31 and an optical adhesive layer 32, which connects it to the outer cover 2. The optical adhesive layer 32 is an optical clear adhesive tape (OCA). OCA optical adhesive tape is made by forming optical acrylic adhesive with or without a substrate, and then bonding a release film on the outside. It features colorless transparency, high light transmittance (total light transmittance >99%), high adhesion, high weather resistance, water resistance, high temperature resistance, UV resistance, and good bonding strength. It can cure at room temperature or medium temperature and has low curing shrinkage. Long-term use will not cause yellowing, peeling, or deterioration.

[0055] The infrared emitting module 4 is connected to the outer cover 2 via an adhesive 41 and can project an infrared beam 42. The infrared beam 42 has a divergence angle α, which is between 30 and 140 degrees, and the wavelength of the infrared beam 42 is between 800 nanometers (nm) and 1300 nanometers (nm). The adhesive 41 is a liquid optical clear resin (OCR), which is a liquid transparent optical resin (OCR) that is cured by UV irradiation. It has a refractive index and light transmittance similar to glass, is resistant to yellowing, and is flexible enough to withstand the expansion and contraction rates of various substrates, thus resisting the problems caused by harsh environments with high and low temperature changes during bonding. Of course, the adhesive 41 can also be an optical clear adhesive (OCA), with a thickness between 0.01 mm and 0.5 mm, and a refractive index between 1.4 and 1.6.

[0056] Please refer to the following: Figure 6 The diagram shown is a side view of a preferred embodiment of the backlight module of the present invention. The backlight module 31 further includes a polarizing plate 312, a diffuser plate 313, a light guide plate 314, and a reflector plate 315 stacked sequentially on a metal frame 311, and the metal frame 311 has an opening region 316 corresponding to the through hole 13, the opening region 316 providing passage for the infrared beam 42. The polarizing plate 312 provides a haze of 50% ± 20% and a transmittance of 60% ± 20% for the infrared beam 42; the diffuser 313 provides a haze of 70% ± 20% and a transmittance of 60% ± 20% for the infrared beam 42; and the reflector 315 provides a haze of 60% ± 20% and a transmittance of 75% ± 20% for the infrared beam 42.

[0057] The ink layer 5 is disposed on the outer cover 2 and is separated from the infrared emitting module 4 by a distance s. The ink layer 5 must have sufficient light-blocking properties (i.e., an OD (Optical Density) value of 3.0 or higher), and is preferably made of an opaque material. The distance s is between 0.1 mm and 50 mm. The fingerprint sensing module 6 is located on the through hole 13, and its receiving surface 61 faces the outer cover 2.

[0058] In a preferred embodiment of the present invention, when a fingerprint to be tested 7 is located on a sensing area 9 outside the accessible surface 21, the infrared beam 42 enters the outer cover 2 through the gap s, and is incident on the accessible surface 21 at a predetermined angle θ. The beam is refracted by the outer cover 2 (first medium) into the second medium, air, until it reaches the fingerprint to be tested 7. The fingerprint to be tested 7 reflects the infrared beam 42 onto the fingerprint sensing module 6, which receives and compares the light to determine if it is a valid fingerprint for memory operation. The predetermined angle θ is the angle between the infrared beam 42 and the normal 211 of the accessible surface 21, and the predetermined angle θ should be less than 41.5 degrees to ensure that the infrared beam 42 is refracted into the air.

[0059] Please see Figure 3 The diagram shown is a side view of the operating structure of a first preferred embodiment of the non-contact fingerprint recognition device of the present invention. In the preferred embodiment of the present invention, the sensing area 9 has a height H and a length L. The height H is the distance between the fingerprint to be tested 7 and the contactable surface 21, and the length L is the distance between the infrared emitting module 4 and the fingerprint to be tested 7. The divergence angle α is between 30 degrees and 90 degrees, the outer cover thickness T is between 0.05 mm and 1 mm, the height H is between 20 mm and 50 mm, and the length L is between 10 mm and 50 mm. For example, when the outer cover thickness T is between 1 mm and 10 mm, the height H is between 5 mm and 20 mm, and the length L is between 10 mm and 50 mm.

[0060] Please see Figure 4The diagram shown is a side view of the operating structure of a second preferred embodiment of the non-contact fingerprint recognition device of the present invention. In the preferred embodiment of the present invention, the sensing area 9' has a height H' and a length L'. The height H' is the distance between the fingerprint to be tested 7 and the contactable surface 21, and the length L' is the distance between the infrared emitting module 4 and the fingerprint to be tested 7. The divergence angle α' is between 90 degrees and 140 degrees, the outer cover thickness T' is between 0.05 mm and 1 mm, the height H' is between 50 mm and 100 mm, and the length L' is between 5 mm and 30 mm. For example, when the outer cover thickness T' is between 1 mm and 10 mm, the height H' is between 20 mm and 50 mm, and the length L' is between 5 mm and 30 mm.

[0061] Please see Figure 5 The diagram shown is a schematic side view of the operating structure of the third preferred embodiment of the non-contact fingerprint recognition device of the present invention. In the preferred embodiment of the present invention, the sensing area 9 is defined as the area extending outward from a center 91 with a radius 92, the radius being between 0.05 mm and 15 mm. The sensing area 9 can be circular, elliptical, or irregular in shape. The size P of the through hole 13 is between 0.1 mm and 10 mm. The tangent tanβ of the angle β between the infrared beam 42 reflected by the fingerprint 7 to the fingerprint sensing module 6 and the center 91 is defined as the ratio of the distance W between the center 91 and the center of the through hole 13 to the distance D between the contactable surface 21 and the closed side 12 (tanβ = W / D).

[0062] The above detailed description fully demonstrates the progressiveness of this invention in terms of its purpose and effectiveness, its significant industrial applicability, and its complete compliance with the requirements for an invention patent. Therefore, this application is filed in accordance with the law. However, the above description is merely a preferred embodiment of this invention and does not limit the implementation methods and scope of protection of this invention. Those skilled in the art should recognize that all equivalent substitutions and obvious changes made based on the description and drawings of this invention should be included within the scope of protection of this invention.

Claims

1. A contactless fingerprint identification device, characterized in that, Including: The middle frame has an open side and a closed side on two sides, and the closed side has a through hole; The outer cover is connected to the opening side and closes the middle frame; the outer cover has a contactable surface. A panel module is located within the middle frame. The two sides of the panel module are a backlight module and an optical adhesive layer, respectively, and are connected to the outer cover by the optical adhesive layer. At least one infrared emitting module is connected to the outer cover by a colloid and can project an infrared beam. The infrared beam has a divergence angle between 30 and 140 degrees and a wavelength between 800 nanometers and 1300 nanometers. The backlight module further includes a polarizing plate, a diffuser plate, a light guide plate, and a reflector plate stacked sequentially on a metal frame. The metal frame has an opening area corresponding to the through hole, which allows the infrared beam to pass through. The polarizing plate has a haze of 50% ± 20% and a transmittance of 60% ± 20% for the infrared beam. The diffuser plate has a haze of 70% ± 20% and a transmittance of 60% ± 20% for the infrared beam. The reflector plate has a haze of 60% ± 20% and a transmittance of 75% ± 20% for the infrared beam. An ink layer is disposed on the outer cover and is spaced apart from the infrared emitting module; The fingerprint sensing module is located on the through hole; When the fingerprint to be tested is located on the sensing area outside the contactable surface, the infrared beam enters the outer cover through the gap, is incident on the contactable surface at a predetermined angle, and is refracted onto the fingerprint to be tested. The fingerprint to be tested is then reflected onto the fingerprint sensing module. The sensing area has a height and a length. The height is the distance between the fingerprint to be tested and the contactable surface, and the length is the distance between the infrared emitting module and the fingerprint to be tested.

2. The contactless fingerprint recognition device as described in claim 1, characterized in that, The predetermined angle is the angle between the infrared beam and the normal to the accessible surface, and the predetermined angle is less than 41.5 degrees.

3. The non-contact fingerprint recognition device as described in claim 1, characterized in that, The colloid is a liquid optical adhesive or optical tape, the thickness of the colloid is between 0.01 mm and 0.5 mm, and the refractive index of the colloid material is between 1.4 and 1.

6.

4. The non-contact fingerprint recognition device as described in claim 1, characterized in that, The optical adhesive layer is an optical tape.

5. The non-contact fingerprint recognition device as described in claim 1, characterized in that, The outer cover material has a refractive index between 1.4 and 1.6, the ink layer is made of an opaque material, and the spacing is between 0.1 mm and 50 mm.

6. The non-contact fingerprint recognition device as described in claim 1, characterized in that, The divergence angle is between 30 and 90 degrees, the outer cover thickness is between 0.05 mm and 1 mm, the height is between 20 mm and 50 mm, and the length is between 10 mm and 50 mm.

7. The non-contact fingerprint recognition device as described in claim 1, characterized in that, The divergence angle is between 30 and 90 degrees, the outer cover thickness is between 1 mm and 10 mm, the height is between 5 mm and 20 mm, and the length is between 10 mm and 50 mm.

8. The non-contact fingerprint recognition device as described in claim 1, characterized in that, The divergence angle is between 90 degrees and 140 degrees, the outer cover thickness is between 0.05 mm and 1 mm, the height is between 50 mm and 100 mm, and the length is between 5 mm and 30 mm.

9. The non-contact fingerprint recognition device as described in claim 1, characterized in that, The divergence angle is between 90 degrees and 140 degrees, the outer cover thickness is between 1 mm and 10 mm, the height is between 20 mm and 50 mm, and the length is between 5 mm and 30 mm.

10. The non-contact fingerprint recognition device as described in claim 1, characterized in that, The sensing area is defined as a region extending outward from a center point with a radius between 0.05 mm and 15 mm. The sensing area can be circular, elliptical, or irregular in shape. The through-hole size is between 0.1 mm and 10 mm, and the tangent of the angle between the infrared beam reflected from the fingerprint to be tested and the fingerprint sensing module and the axis is defined as the ratio of the distance between the axis and the center of the through-hole to the distance between the accessible surface and the closed side.

Images