Wafer metrology system

Abstract

The application describes a wafer measurement system, comprising a storage device, a positioning device, a detection device, and a carrying device for transferring wafers between the storage device, the positioning device, and the detection device, the storage device is used for placing wafers, the wafers have first positioning marks and second positioning marks; the carrying device carries the wafers to the positioning device, and the positioning device performs pose positioning on the wafers based on the first positioning marks; the carrying device transfers the pose-positioned wafers to the detection device, the detection device performs accurate positioning on the pose-positioned wafers based on the second positioning marks and performs measurement on the accurately-positioned wafers. Thus, the application can provide a wafer measurement system, which can quickly and accurately measure wafers.

Description

Technical Field

[0001] This disclosure generally relates to an intelligent manufacturing equipment industry, and more specifically to a wafer measurement system. Background Technology

[0002] Chip manufacturing, a crucial link in the semiconductor industry, can be broadly divided into front-end wafer fabrication processes (referred to as front-end processes) and back-end packaging and testing processes (referred to as back-end processes). Front-end processes mainly include complex processes such as oxidation diffusion, photolithography, etching, thin film deposition, ion implantation, mechanical polishing, and cleaning; back-end processes mainly include packaging and testing processes.

[0003] During the wafer fabrication process, measurement systems are needed to check whether the wafer processing parameters meet the design requirements to ensure that they comply with the parameter design requirements, and to check whether there are defects on the wafer surface that affect the yield, so as to ensure that the yield of the processing line is controlled above the specified level.

[0004] With the continuous development of semiconductor manufacturing processes, the market demand for microchips is also growing rapidly. The linewidth of chips is constantly decreasing, the complexity of manufacturing processes is gradually increasing, and the requirements for measurement equipment are becoming more and more demanding. Currently, among the equipment for wafer measurement, the lack of a precise wafer positioning step makes it impossible to guarantee measurement accuracy. Summary of the Invention

[0005] The present invention was made in view of the above-mentioned state of the prior art, and its purpose is to provide a wafer measurement system that can quickly and accurately measure wafers.

[0006] Therefore, this invention provides a wafer measurement system, which includes a storage device, a positioning device, a testing device, and a transport device for transferring wafers between the storage device, the positioning device, and the testing device. The storage device is used to place the wafer, and the wafer has a first positioning mark and a second positioning mark, with a preset relative position between the first positioning mark and the second positioning mark. The transport device transfers the wafer to the positioning device, and the positioning device performs attitude positioning on the wafer based on the first positioning mark. The transport device transports the attitude-positioned wafer to the testing device, and the testing device performs precise positioning on the attitude-positioned wafer based on the second positioning mark and measures the precisely positioned wafer.

[0007] In the wafer metrology system disclosed herein, the wafer metrology system can locate the first positioning marker of the wafer through a positioning device and quickly adjust the wafer's orientation according to preset requirements, thereby completing the wafer's orientation positioning, i.e., coarse positioning. Then, the transport device can transfer the wafer to the inspection device in the adjusted orientation. Subsequently, the inspection device can quickly locate the second positioning marker based on the relative position of the first and second positioning markers, and perform precise positioning on the wafer that has completed coarse positioning based on the second positioning marker, i.e., fine positioning. Thus, the inspection device can quickly locate the preset measurement points on the wafer based on the wafer's orientation after fine positioning. Therefore, the wafer metrology system can position the wafer step by step, which improves both positioning efficiency and positioning accuracy.

[0008] Additionally, in the wafer measurement system disclosed herein, optionally, the positioning device includes a first stage for supporting and fixing the wafer, a first vision device facing the first stage, and a first analysis device storing a first standard template. The first vision device acquires a first image of the wafer supported on the first stage, and the first analysis device compares the first image with the first standard template to perform orientation positioning of the wafer supported on the first stage. In this case, the first vision device can acquire an orientation image of the wafer, and the first analysis device can compare the image of the wafer acquired by the first vision device with a pre-stored first standard template. The first standard template can be an image of a wafer on the first stage that meets a preset orientation requirement. When the orientation of the wafer on the first stage matches the orientation of the wafer in the first standard template to a preset accuracy requirement, coarse positioning of the wafer is completed. Thus, the wafer can be transported to the inspection device by a handling device in the adjusted orientation.

[0009] Additionally, in the wafer measurement system disclosed herein, optionally, the positioning device moves the first stage to align the wafer mounted on the first stage with the first standard template. In this case, when the positioning device performs coarse positioning of the wafer, the first stage can continuously adjust the wafer's orientation, thereby enabling the first vision device to acquire images of the wafer in different orientations on the first stage. The first analysis device can compare these images with the first standard template to determine the matching status of the wafer's first positioning mark with the first positioning mark on the first standard template. This ensures that the wafer's orientation on the first stage matches the first standard template, meeting preset accuracy requirements.

[0010] Additionally, in the wafer measurement system disclosed herein, optionally, the positioning device includes a first driving mechanism that drives the first stage to move along a first direction and / or a second direction, or to rotate along a third direction. In this case, when the positioning device performs orientation positioning on the wafer, the first driving mechanism can drive the first stage to continuously adjust the wafer orientation, thereby enabling the first positioning mark on the wafer to match the first positioning mark on the first standard template. This ensures that the orientation of the wafer on the first stage matches the orientation of the wafer in the first standard template to a preset accuracy requirement.

[0011] Furthermore, in the wafer metrology system disclosed herein, optionally, the handling device uses negative pressure adsorption to fix the wafer during handling. This helps protect the wafer surface from damage, and fixing the wafer using negative pressure adsorption meets the cleanroom requirements of the wafer metrology system.

[0012] In addition, in the wafer measurement system disclosed herein, optionally, the first stage fixes the wafer by negative pressure adsorption, and during the process of the wafer being transferred to the positioning device, there is an overlap time between the negative pressure adsorption applied to the wafer by the transport device and the negative pressure adsorption applied to the wafer by the first stage. In this configuration, the first stage can fix the wafer using negative pressure adsorption, which helps protect the wafer surface from damage and meets the clean working environment requirements of the wafer measurement system. Simultaneously, through a preset mechanism, there is a preset overlap time between the negative pressure adsorption applied to the wafer by the transport equipment and the negative pressure adsorption applied to the wafer by the first stage. In other words, when the transport equipment transfers the wafer to the first stage, the first stage first adsorbs and fixes the wafer, and then the transport equipment releases the negative pressure to release the adsorption force on the wafer. Thus, the wafer is completely adsorbed and fixed by the negative pressure of the first stage. Therefore, when the transport equipment transfers the wafer and places it on the first stage, the wafer does not experience significant displacement deviation. This ensures that the wafer's position on the first stage meets the field of view requirements of the first vision device, facilitating the positioning device to quickly locate the first positioning marker and perform attitude positioning of the wafer based on the first positioning marker.

[0013] Additionally, in the wafer metrology system disclosed herein, optionally, the inspection equipment includes a second stage that carries and fixes the wafer, a second vision device facing the second stage, a second analysis device storing a second standard template, and a second drive mechanism. The second drive mechanism drives the second stage to move along a fourth and / or fifth direction, or to rotate along a sixth direction. In this case, when the handling equipment transfers the wafer, after coarse positioning, from the positioning equipment to the second stage, the wafer can be placed on the second stage in an adjusted coarse positioning posture. Considering that the handling equipment will produce certain deviations during the wafer transfer process, the inspection equipment can perform precise positioning of the wafer, i.e., fine positioning. The second vision device first acquires an image of the wafer on the second stage. Based on the relative positional relationship between the first and second positioning markers, it can quickly locate the second positioning marker. The second analysis device compares the wafer image acquired by the second vision device with a second standard template. The second standard template can be a pre-acquired image of a wafer on the second stage that meets preset positional requirements. Thus, by comparison, the second analysis device can determine the relative positional deviation between the second positioning marker on the wafer on the second stage and the second positioning marker on the second standard template. Based on the aforementioned relative positional deviation, the detection device can operate the second drive mechanism to drive the second stage along the first... The wafer can move in four and / or a fifth direction, or rotate along a sixth direction, thereby precisely adjusting the orientation of the wafer on the second stage. When the relative positional deviation between the second positioning mark of the wafer on the second stage and the second positioning mark on the second standard template meets the preset accuracy requirements, the inspection equipment completes the precise positioning of the wafer on the second stage. In the above-mentioned fine positioning process, the second positioning mark can be a symbol with extremely high precision on the wafer, so the fine positioning accuracy based on the second positioning mark is extremely high. Then, the second vision device can quickly and accurately find the preset measurement point on the wafer based on the first positioning mark, and thus the inspection equipment can quickly and accurately complete the measurement of the wafer.

[0014] Additionally, in the wafer measurement system disclosed herein, the detection equipment may optionally include a vibration damping device. In this case, the vibration damping device can reduce the impact of vibrations transmitted from the wafer measurement system itself or from the external environment on the measurement, thereby improving the measurement accuracy of the wafer measurement system.

[0015] Additionally, in the wafer metrology system disclosed herein, the system may optionally include a temperature and humidity sensor, an ion fan, and a dust removal device. In this case, the temperature and humidity sensor can monitor the temperature and humidity parameters of the wafer metrology system, the ion fan can reduce the impact of static electricity on the wafer metrology system, and the dust removal device can reduce the impact of dust on the wafer metrology system. This provides a better working environment for the wafer metrology system, thereby improving measurement accuracy.

[0016] In addition, in the wafer measurement system disclosed herein, optionally, the second stage fixes the wafer by negative pressure adsorption, and during the process of the wafer being transferred to the detection device, there is an overlap time between the negative pressure adsorption applied to the wafer by the transport device and the negative pressure adsorption applied to the wafer by the second stage. In this configuration, the second stage can fix the wafer using negative pressure adsorption, which helps protect the wafer surface from damage and meets the cleanliness requirements of the wafer measurement system. Simultaneously, through a preset mechanism, there is a pre-defined overlap time between the negative pressure adsorption applied to the wafer by the transport equipment and the negative pressure adsorption applied to the wafer by the second stage. In other words, when the transport equipment transfers the wafer to the second stage, the second stage first adsorbs and fixes the wafer, and then the transport equipment releases the negative pressure to exert adsorption force on the wafer. Thus, the wafer is completely adsorbed and fixed by the negative pressure of the second stage. Therefore, when the transport equipment transfers and places the wafer on the second stage, the wafer does not experience significant displacement deviation, allowing it to be placed in a pre-adjusted position on the second stage. This facilitates rapid and accurate positioning of the wafer by the testing equipment, enabling quick and precise location of the preset measurement points on the wafer for measurement.

[0017] In summary, the present invention provides a wafer measurement system that can quickly and accurately measure wafers. Attached Figure Description

[0018] Figure 1 This is a schematic diagram illustrating the wafer involved in this embodiment example.

[0019] Figure 2A This is a schematic diagram illustrating the wafer measurement system involved in this embodiment example.

[0020] Figure 2B This is a schematic diagram illustrating the wafer measurement system process involved in this embodiment example.

[0021] Figure 3A This is a schematic diagram illustrating the conveying equipment involved in this embodiment example.

[0022] Figure 3B This is a schematic diagram showing the end effector of the conveying device involved in this embodiment example.

[0023] Figure 4A This is a schematic diagram illustrating the storage device involved in this embodiment example.

[0024] Figure 4B This is a schematic diagram illustrating the storage platform involved in this embodiment example.

[0025] Figure 5A This is a schematic diagram illustrating the positioning device involved in this embodiment example.

[0026] Figure 5B This is a schematic diagram illustrating the process of the positioning device involved in this embodiment example.

[0027] Figure 5C This is a schematic diagram illustrating wafer misalignment as described in this embodiment example.

[0028] Figure 5D This is a schematic diagram showing the aligned wafer involved in this embodiment example.

[0029] Figure 6A This is a schematic diagram illustrating the detection device involved in this embodiment example.

[0030] Figure 6B This is a schematic diagram illustrating the process of the testing equipment involved in this embodiment example.

[0031] Figure 7 This is a schematic diagram showing the relative coordinates of the wafer that has completed coarse positioning and the wafer that has been transferred to the testing equipment, as described in this embodiment example. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] It should be noted that the terms "first," "second," "third," and "fourth," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices. In the following description, the same reference numerals are used for the same parts, and repeated descriptions are omitted. Additionally, the accompanying drawings are merely schematic diagrams, and the scale of the dimensions of the parts or the shape of the parts may differ from the actual figures.

[0034] The wafer measurement system described in this embodiment will now be described in detail with reference to the accompanying drawings.

[0035] Figure 1 This is a schematic diagram showing wafer 2 involved in this embodiment example. Figure 2A This is a schematic diagram showing the wafer measurement system 1 involved in this embodiment example.

[0036] In this embodiment, the wafer measurement system 1 can be used to measure the key dimensions and overlay offset of the wafer 2. It can also measure the 3D morphology and roughness of the surface of the wafer 2, as well as the dimensions such as the width and depth of the grooves cut by the laser on the wafer 2. It can be applied to measuring the wafer 2 in the front-end wafer manufacturing process and / or the wafer 2 in the back-end packaging and testing process.

[0037] In this embodiment, see Figure 2A The wafer measurement system 1 may include a handling device 11, a storage device 12, a positioning device 13, and a testing device 14. The storage device 12 can be used to place the wafer 2 to be measured and / or the wafer 2 that has been measured. The positioning device 13 can be used to perform orientation positioning on the wafer 2, which can be called coarse positioning, to facilitate the testing device 14 to quickly complete precise positioning, which can be called fine positioning. This enables the rapid and accurate measurement of the wafer 2. The handling device 11 can transfer the wafer 2 between the storage device 12, the positioning device 13, and the testing device 14.

[0038] To better illustrate the wafer measurement system 1 involved in this embodiment, the wafer 2 will be described first.

[0039] In some examples, wafer 2 may include a patternless wafer and a patterned wafer, wherein the surface of the patternless wafer may be unetched and without chip information, while the surface of the patterned wafer may have chip information.

[0040] In some examples, wafer 2 may include a wafer from a front-end wafer fabrication process or a wafer from a back-end packaging and testing process.

[0041] See in some examples Figure 1 The wafer 2 may have a first positioning mark 21. In some examples, the first positioning mark 21 may be at least one straight edge of the wafer 2. In some examples, the first positioning mark 21 may indicate the crystal orientation of the single crystal growth in the wafer 2. In this case, on the one hand, it can help the positioning device 13 of the wafer measurement system 1 to adjust and determine the orientation of the wafer 2 based on the first positioning mark 21 to complete coarse positioning; on the other hand, based on the crystal orientation of the single crystal growth in the wafer 2, it can facilitate the dicing of the wafer 2.

[0042] See in some examples Figure 1The wafer 2 may have a second positioning mark 22. In some examples, the second positioning mark 22 may be a highly precise symbol on the wafer 2. In some examples, the second positioning mark 22 may be an overlay mark, which may be a pattern on the wafer 2 specifically used to measure overlay errors. Thus, the inspection device 14 can perform precise positioning of the wafer 2 based on the second positioning mark 22.

[0043] See in some examples Figure 1 Wafer 2 may include preset measurement points 23, for example Figure 1 The measurement points a, b, c, d, and e are shown, and measurement point 23 has a preset relative position with the first positioning mark 21. Therefore, the inspection device 14 of the wafer measurement system 1 can locate measurement point 23 based on the first positioning mark 21, and thus measure measurement point 23.

[0044] In some examples, the first positioning marker 21 and the second positioning marker 22 may have a preset relative position. In this case, the positioning device 13 of the wafer measurement system 1 can determine the orientation of the wafer 2 based on the first positioning marker 22 to complete coarse positioning. When the transport device 11 of the wafer measurement system 1 transfers the wafer 2 to the inspection device 14, the inspection device 14 of the wafer measurement system 1 can quickly readjust the orientation of the wafer 2 based on the position of the second positioning marker 22 relative to the first positioning marker 21 to perform fine positioning of the wafer 2, so that the inspection device 14 can quickly and accurately find the preset measurement point 23 and complete the measurement of the wafer 2. Thus, the measurement efficiency and accuracy of the wafer measurement system 1 can be improved.

[0045] In some examples, wafer 2 may have a barcode representing wafer 2's identity information, used to identify wafer 2's identity information in the measurement results, facilitating analysis and differentiation of wafer 2. In other examples, wafer 2 may also have identity character information, used to identify wafer 2's identity information in the measurement results, facilitating analysis and differentiation of wafer 2. In this case, after wafer measurement system 1 completes the measurement of wafer 2, it can generate a readable measurement record report. In the measurement report, the measurement results of each wafer 2 can be identified. Therefore, based on the measurement results of each wafer 2, unqualified wafer 2 can be eliminated, qualified wafer 2 can be retained, and directions for improvement of wafer 2's manufacturing process can be provided.

[0046] In some examples, wafer measurement system 1 can be used simultaneously to measure wafers 2 with diameters of 4 inches, 6 inches, 8 inches, 12 inches, or 16 inches. In particular, wafer measurement system 1 can be used simultaneously to measure wafers 2 with diameters of 4 inches and / or 6 inches. Thus, wafer measurement system 1 has high applicability and measurement efficiency.

[0047] In the wafer measurement system 1 of this embodiment, a storage device 12 is provided to place the wafer 2. The wafer 2 is transferred to the positioning device 13 by a transport device 11. The positioning device 13 can perform coarse positioning of the wafer 2 based on the first positioning mark 21. After the wafer 2 is coarsely positioned, the transport device 11 transfers the wafer 2 to the detection device 14 in the adjusted posture. Then, the detection device 14 receives the wafer 2 and can perform fine positioning of the wafer 2 after coarse positioning based on the second positioning mark 22 to compensate for the deviation generated during the transport device 11 transporting the wafer 2. In the above fine positioning process, the second positioning mark 22 can be a symbol with extremely high precision on the wafer 2, so the fine positioning accuracy based on the second positioning mark 22 is extremely high. Finally, the detection device 14 can measure the wafer 2 after fine positioning.

[0048] In some examples, the storage device 12 can be used to place the wafer 2. Thus, loading can be completed quickly by using the storage device 12, and the storage device 12 can protect the wafer 2 from damage.

[0049] In some examples, the positioning device 13 may include a preset orientation of the wafer 2 within the positioning device 13. In this case, the positioning device 13 can determine the matching status of the orientation of the wafer 2 within the positioning device 13 with the preset orientation of the wafer 2 within the positioning device 13 based on the first positioning identifier 21, so as to further adjust the orientation of the wafer 2 within the positioning device 13 until the matching status of the orientation of the wafer 2 within the positioning device 13 with the preset orientation of the wafer 2 within the positioning device 13 meets the preset accuracy requirements. Thus, the positioning device 13 can quickly complete the coarse positioning of the wafer 2 to obtain the orientation required by the detection device 14 for measuring the wafer 2.

[0050] In some examples, the inspection device 14 may include a preset orientation of the wafer 2 within the inspection device 14. Therefore, when the inspection device 14 measures the wafer 2, it can quickly and precisely locate the orientation of the wafer 2 within the inspection device 14 based on the preset orientation, thereby quickly and accurately finding the preset measurement point 23 of the wafer 2 to be measured within the inspection device 14, and thus completing the measurement quickly and accurately.

[0051] In some examples, the handling device 11 can transfer the wafer 2 to the positioning device 13, and the positioning device 13 can perform orientation positioning of the wafer 2 based on the first positioning identifier 21, that is, coarse positioning. In this case, the positioning device 13 can compare the orientation of the wafer 2 located in the positioning device 13 with the preset orientation of the wafer 2 in the positioning device 13 based on the first positioning identifier 21, thereby completing the coarse positioning of the wafer 2, so that the orientation of the wafer 2 conforms to the orientation required by the detection device 14 when measuring the wafer 2.

[0052] In some examples, the handling device 11 can transport the orientation-positioned wafer 2 to the inspection device 14, which can accurately position the orientation-positioned wafer 2 based on the second positioning mark 22, i.e., fine positioning, and can measure the accurately positioned wafer 2. In this scenario, the transport device 11 can transport the wafer 2 to the inspection device 14 after coarse positioning. Upon receiving the wafer 2 from the transport device 11, the inspection device 14 can quickly locate the second positioning marker 22 based on the preset relative position between the first positioning marker 21 and the second positioning marker 22. Based on the second positioning marker 22, the inspection device 14 can determine the deviation between the wafer 2's position in the inspection device 14 and the preset position required for measuring the wafer 2. Thus, the inspection device 14 can perform fine positioning of the wafer 2's position in the inspection device 14 again. Consequently, the inspection device 14 can quickly locate the preset measurement point 23 on the wafer 2 for accurate measurement. This method of first using the positioning device 13 for coarse positioning and then the inspection device 14 for fine positioning is also beneficial for the modular design of the wafer measurement system 1 and improves the stability of the wafer measurement system 1's operation.

[0053] In some examples, the wafer measurement system 1 may also include a barcode reader 15. This allows the reader to read the barcode on the wafer 2 that identifies the wafer 2, thereby generating a measurement record and facilitating the analysis of the measurement results of the wafer 2.

[0054] To better illustrate the process of wafer measurement system 1, Figure 2B This is a schematic diagram illustrating the wafer measurement system 1 process involved in this embodiment example.

[0055] See in some examples Figure 2BThe wafer measurement system 1 can include the following steps: the storage device 12 loads the wafer 2; the transport device 11 transfers the wafer 2 to the positioning device 13 (step S001); the positioning device 13 performs orientation positioning on the wafer 2 (step S003); the transport device 11 transfers the wafer 2 to the inspection device 14 (step S005); the inspection device 14 performs precise orientation positioning on the wafer 2 (step S007); the inspection device 14 performs measurement on the wafer 2 (step S009); after the measurement of the wafer 2 is completed, the transport device 11 transfers the wafer 2 to the storage device 12 (step S011).

[0056] In some examples, in step S001, the storage device 12 can load the wafer 2, and the conveying device 11 can transfer the wafer 2 to the positioning device 13. Thus, the positioning device 13 can perform coarse positioning on the wafer 2.

[0057] Figure 3A This is a schematic diagram showing the conveying device 11 according to the example of this embodiment. Figure 3B This is a schematic diagram showing the end effector 118 of the conveying device 11 according to the example of this embodiment.

[0058] In this embodiment, the wafer measurement system 1 can realize the transfer of wafer 2 between the storage device 12, the positioning device 13 and the testing device 14 through the handling device 11.

[0059] In some examples, the handling device 11 can be a robot for clean environments. In this case, by employing a negative pressure dust suppression structure and non-volatile grease, the wafer metrology system 1 can achieve environmental cleanliness without particulate contamination, thus meeting cleanliness requirements.

[0060] See in some examples Figure 3A The handling device 11 may include a base 111, a lifting shaft 112, a shoulder joint 113, an upper arm 114, an elbow joint 115, a forearm 116, a wrist joint 117, and a detachable end effector 118. In this case, the handling device 11 can have three degrees of freedom, that is, in the cylindrical 3D polar coordinates, the end effector 118 can have coordinates (R, θ, Z), that is, the end effector 118 can move freely in the radial direction R, can move freely in the vertical direction Z, and can rotate at any angle θ in the horizontal plane perpendicular to the vertical Z-axis. Thus, the handling device 11 has high precision and high flexibility, thereby enabling precise and fast gripping and transfer of the wafer 2.

[0061] In some examples, the handling device 11 can fix the wafer 2 by negative pressure adsorption when handling the wafer 2. This helps to protect the surface of the wafer 2 from damage, and fixing the wafer 2 by negative pressure adsorption can meet the clean environment requirements of the wafer measurement system 1.

[0062] See in some examples Figure 3B The end effector 118 of the handling equipment 11 may be provided with an air cavity 1181. In this case, a negative pressure can be formed on the end effector 118 through the air cavity 1181, so that the wafer 2 can be fixed on the end effector 118 by negative pressure adsorption. This helps to protect the surface of the wafer 2 from damage and can meet the clean environment requirements of the wafer measurement system 1.

[0063] In some examples, the handling equipment 11 also includes a wafer scanner 119 for scanning the placement of wafers 2 in wafer cassettes 121 (described later) or calibration cassettes 126 (described later). In this case, the wafer scanner 119 can sense whether there is a wafer 2 in the wafer cassette 121 or calibration cassette 126, or whether the wafer 2 is tilted in its slot in the wafer cassette 121 or calibration cassette 126. If the wafer scanner 119 finds that there is no wafer 2 in its slot in the wafer cassette 121 or calibration cassette 126, or that the wafer 2 is tilted, the handling equipment 11 can stop operating, and the alarm device of the wafer measurement system 1 can issue an alarm.

[0064] In some examples, the travel of the Z-axis of the conveying device 11 can be between 0 and 300 mm.

[0065] In some examples, the Z-axis rotation angle range of the conveying device 11 can be between 0 and 360°, and preferably, the Z-axis rotation angle range of the conveying device 11 can be between 0 and 340°.

[0066] In some examples, the end effector 118 of the handling device 11 can be of various types and can be replaced according to the different types of wafers 2. In some examples, the end effector 118 can fix the wafer 2 by mechanical clamping. In this case, the handling device 11 can support different types of wafers 2, thereby assisting in the measurement of multiple types of wafers 2 in the wafer measurement system 1.

[0067] In some examples, the end effector 118 may have scale lines indicating the size of the wafer 2. In this case, when calibrating the motion accuracy of the handling device 11, the motion accuracy of the handling device 11 can be calibrated by comparing the scale lines on the end effector 118 at a preset position with a preset reference.

[0068] Figure 4A This is a schematic diagram showing the storage device 12 according to this embodiment example. Figure 4B This is a schematic diagram showing the storage platform 122 involved in this embodiment example.

[0069] In this embodiment, the wafer measurement system 1 can use the storage device 12 to place the wafer 2, and complete the loading of the wafer 2 to be measured and the unloading of the wafer 2 that has been measured.

[0070] See in some examples Figure 4A The storage device 12 may include a wafer cassette 121 for placing the wafer 2. Thus, the wafer 2 can be loaded or unloaded quickly by using the wafer cassette 121, which can protect the wafer 2 from damage.

[0071] In some examples, the wafer cassette 121 has characters identifying its identity. In some examples, the wafer metrology system 1 can be manually loaded; in others, it may have at least one scanning device that can scan the characters identifying the wafer cassette 121 during manual loading. Therefore, in the actual manufacturing process, the wafer metrology system 1 can record the identity information of the wafer cassette 121 and the hierarchical relationship between the wafer 2 within it and the cassette 121 itself. This allows for integration with production systems such as ERP (Enterprise Resource Planning) systems and facilitates the generation of measurement records for the wafer 2, enabling analysis.

[0072] In some examples, the wafer metrology system 1 can also automatically load wafers. In some examples, an Automated Guided Vehicle (AGV) can be used to interface with the wafer metrology system 1 for automated loading. The AGV can automatically transport the wafer cassette 121 to the wafer metrology system 1 via landmark navigation. In this case, during the actual manufacturing process, the wafer metrology system 1 can achieve automated interface with upstream and downstream processes, thereby automating the wafer 2 manufacturing and metrology processes, thus improving the metrology and manufacturing efficiency of wafer 2.

[0073] In some examples, the wafer cassette 121 may include multiple size types for holding wafers 2 of different sizes. For example, the wafer cassette 121 may include a wafer cassette 121 for holding 4-inch diameter wafers 2, a wafer cassette 121 for holding 6-inch diameter wafers 2, a wafer cassette 121 for holding 8-inch diameter wafers 2, or a wafer cassette 121 with a diameter of 12 inches. This improves the wafer metrology system 1's ability to measure multiple types of wafers 2.

[0074] In some examples, the wafer cassette 121 may include wafers 2 for placement in different manufacturing processes, including front-end and / or back-end processes. Thus, the wafer measurement system 1 is capable of measuring various types of wafers 2.

[0075] In some examples, the wafer cassette 121 can also support the placement of wafers 2 of mixed sizes, meaning that a wafer cassette 121 can hold wafers 2 of different sizes simultaneously. For example, the wafer cassette 121 may include a wafer cassette 121 that holds wafers 2 with diameters of 4 inches and 6 inches simultaneously, a wafer cassette 121 that holds wafers 2 with diameters of 6 inches and 8 inches simultaneously, or a wafer cassette 121 that holds wafers 2 with diameters of 8 inches and 12 inches simultaneously.

[0076] See in some examples Figure 4A and 4B The storage device 12 may include a storage platform 122 for fixing the wafer cassette 121. Thus, it is able to support and fix the wafer cassette 121.

[0077] See in some examples Figure 4B The storage platform 122 may be equipped with a sensing sensor 123 for sensing wafer cassettes 121. In this case, the wafer measurement system 1 can sense whether a wafer cassette 121 is installed on the storage platform 122. If the sensing sensor 123 senses that a wafer cassette 121 is installed on the storage platform 122, the wafer measurement system 1 can operate the handling device 11 to take a wafer 2 from the corresponding wafer cassette 121. If the sensing sensor 123 senses that no wafer cassette 121 is installed on the storage platform 122, the wafer measurement system 1 will not start working, or it can operate the handling device 11 to change its movement trajectory to avoid the position where no wafer cassette 121 is installed. Thus, through this foolproof design, the handling device 11 can avoid performing useless actions, thereby improving the working efficiency of the wafer measurement system 1.

[0078] In some examples, the storage platform 122 may also be provided with a positioning fixture 124 for positioning the wafer cassette 121. In this case, the position of the wafer cassette 121 on the storage platform 122 can be positioned by adjusting the position of the positioning fixture 124 according to the different types of wafer cassettes 121, thereby enabling the storage platform 122 to support different types of wafer cassettes 121.

[0079] In some examples, the storage platform 122 may also be provided with a locking device 125 for securing the wafer cassette 121 (see [reference]). Figure 4B In some examples, the locking device 125 can be a cylinder-locked clamping device. Thus, on the one hand, the locking device 125 can better secure the wafer cassette 121, thereby maintaining stability during operation; on the other hand, by using a cylinder-locked clamping device, the cleanroom requirements of the wafer metrology system 1 can also be better met.

[0080] In some examples, the wafer metrology system 1 may include at least four storage devices 12, which can simultaneously hold at least four wafer cassettes 121, and the wafer cassettes 121 may be of different types. In this case, the wafer metrology system 1 can simultaneously measure different types of wafers 2, thereby exhibiting high applicability and metrology efficiency.

[0081] In some examples, the wafer measurement system 1 may also include a calibration cassette 126 for holding calibration standard wafers. This allows for the calibration of the measurement accuracy of the wafer measurement system 1.

[0082] In some examples, step S003 may be performed after step S001.

[0083] In some examples, in step S003, the positioning device 13 can perform orientation positioning, i.e., coarse positioning, on the wafer 2. In this case, the positioning device 13 can compare the orientation of the wafer 2 located in the positioning device 13 with the preset orientation of the wafer 2 in the positioning device 13 based on the first positioning identifier 21, thereby completing the coarse positioning of the wafer 2, so that the orientation of the wafer 2 conforms to the orientation required by the detection device 14 when measuring the wafer 2.

[0084] The positioning device 13 involved in step S003 will be described in detail later.

[0085] In some examples, step S005 may be performed after step S003.

[0086] In some examples, in step S005, the transport device 11 can transfer the wafer 2 to the inspection device 14. In this case, the transport device 11 can transfer the wafer 2, which has been coarsely positioned in step S003, to the inspection device 14 in an adjusted orientation, thereby facilitating the inspection device 14 to quickly and precisely position and measure the wafer 2.

[0087] In some examples, step S007 may be performed after step S005.

[0088] In some examples, in step S007, the detection device 14 performs precise orientation positioning on the wafer 2, i.e., fine positioning. In this case, after receiving the coarsely positioned wafer 2 transferred by the transport device 11, the detection device 14 can quickly locate the second positioning mark 22 based on the preset relative position between the first positioning mark 21 and the second positioning mark 22. Based on the second positioning mark 22, the detection device 14 can determine the deviation between the orientation of the wafer 2 in the detection device 14 and the preset orientation required for measuring the wafer 2. Thus, the detection device 14 can perform fine positioning again on the orientation of the wafer 2 in the detection device 14. As mentioned above, in the above fine positioning process, the second positioning mark 22 can be a symbol with extremely high precision on the wafer 2, so the fine positioning accuracy completed based on the second positioning mark 22 is extremely high.

[0089] In some examples, step S009 may be performed after step S007.

[0090] In some examples, in step S009, the inspection device 14 measures the wafer 2. Thus, the inspection device 14 can complete the measurement of the precisely positioned wafer 2 according to measurement requirements and obtain the measurement result of the wafer 2.

[0091] The detection device 14 involved in steps S005, S007 and S009 will be described in detail later.

[0092] In some examples, step S011 may be performed after step S009.

[0093] In some examples, after the measurement of wafer 2 is completed in step S011, the transport device 11 transfers wafer 2 to the storage device 12. In this case, the transport device 11 can transfer the measured wafer 2 to the storage device 12, thereby enabling the start of the next measurement process for wafer 2.

[0094] In the wafer measurement system 1 of this embodiment, the wafer measurement system 1 can locate the first positioning mark 21 of the wafer 2 through the positioning device 13, and quickly adjust the orientation of the wafer 2 according to preset requirements, thereby completing the orientation positioning of the wafer 2, that is, coarse positioning. Then, the transport device 11 can transfer the wafer 2 to the detection device 14 in the adjusted orientation. Then, the detection device 14 can quickly locate the second positioning mark 22 based on the relative position of the second positioning mark 22 and the first positioning mark 21, and perform precise positioning of the wafer 2 that has completed coarse positioning based on the second positioning mark 22, that is, fine positioning. Thus, the detection device 14 can quickly find the preset measurement point 23 on the wafer 2 based on the orientation of the wafer 2 after fine positioning. Therefore, the wafer measurement system 1 can position the wafer 2 step by step, which improves the positioning efficiency and the positioning accuracy.

[0095] Figure 5A This is a schematic diagram showing the positioning device 13 involved in this embodiment example.

[0096] In this embodiment, before measuring the wafer 2, the inspection device 14 of the wafer measurement system 1 can use the positioning device 13 to position the wafer 2 based on the first positioning mark 21.

[0097] To better explain the positioning device 13 involved in this embodiment, this embodiment defines a first direction, a second direction, and a third direction. The first and second directions are parallel to the bearing surface of the first stage 131 (described later) on which the wafer 2 is placed. The movement of the first stage 131 along the first direction and / or the second direction means that the first stage 131 moves horizontally along the first direction and / or the second direction. The third direction can be a clockwise or counterclockwise direction located on the bearing surface of the first stage 131.

[0098] See Figure 5A The first direction can be a direction parallel to the X-axis as shown in the figure, the second direction can be a direction parallel to the Y-axis as shown in the figure, and the third direction can be a direction of rotation around the central axis Z-axis of the first stage 131 as shown in the figure, wherein the X-axis, Y-axis, and Z-axis are perpendicular to each other. It should be noted that the movement along the first direction described in this embodiment refers to the ability to move back and forth along the first direction, not specifically to move along only one direction. Similarly, movement along the second direction refers to the ability to move back and forth along the second direction, and rotation along the third direction refers to the ability to rotate bidirectionally around the central axis Z-axis of the first stage 131. This embodiment is not limited to the first and second directions. Figure 5A The X-axis and Y-axis directions shown may be interpreted differently by those skilled in the art, but the first and second directions need to be parallel to the bearing surface of the first stage 131 where the wafer 2 is placed.

[0099] In some examples, the positioning device 13 may have a first stage 131 that carries and fixes the wafer 2, a first vision device 132 facing the first stage 131, and a first analysis device storing a first standard template. The first vision device 132 acquires a first image of the wafer 2 carried on the first stage 131, and the first analysis device compares the first image with the first standard template to perform attitude positioning, i.e., coarse positioning, of the wafer 2 carried on the first stage 131. In this case, the first vision device 132 can acquire an attitude image of the wafer 2, and the first analysis device can compare the image of the wafer 2 acquired by the first vision device 132 with the pre-stored first standard template. The first standard template may be an image of the wafer 2 on the first stage 131 that meets the preset attitude requirements. When the attitude of the wafer 2 on the first stage 131 matches the attitude of the wafer 2 in the first standard template to a preset accuracy requirement, the coarse positioning of the wafer 2 is completed, and the wafer 2 can be transferred to the inspection device 14 by the handling device 11 in the adjusted attitude.

[0100] In some examples, during the coarse positioning process described above, the matching of the first positioning mark 21 on the wafer 2 on the first stage 131 with the first positioning mark 21 on the first standard template can be compared. Thus, the positioning device 13 can quickly position the wafer 2 based on the first positioning mark 21, and the transport device 11 can transfer the wafer 2 to the inspection device 14 in the coarsely positioned position. Therefore, the inspection device 14 can quickly complete the precise positioning of the wafer 2 in the inspection device 14 based on the second positioning mark 22, i.e., fine positioning, and perform accurate measurements on the wafer 2.

[0101] In some examples, the first analysis device and the first vision device 132 may be communicatively connected. Thus, the first analysis device is able to obtain the attitude image of the wafer 2 on the first stage 131 acquired by the first vision device 132.

[0102] To better illustrate the process of positioning device 13, Figure 5B This is a schematic diagram illustrating the process of the positioning device 13 according to this embodiment example. Figure 5C This is a schematic diagram illustrating the misalignment of wafer 2 in this embodiment example. Figure 5D This is a schematic diagram showing the aligned wafer 2 involved in this embodiment example.

[0103] See in some examples Figure 5BThe positioning device 13's processes may include: the transport device 11 transferring the wafer 2 to the first stage 131 (step T001); the first vision device 132 acquiring the orientation image of the wafer 2 on the first stage 131 (step T003); the first analysis device extracting the outline of the wafer 2 and comparing it with the first standard template (step T005); determining whether the first positioning mark 21 is within the field of view of the first vision device 132 (step T007); the first analysis device extracting the first positioning mark 21 and analyzing and calculating the relative deviation between the first positioning mark 21 and the first standard template, and the positioning device using the above relative error to... Move and / or rotate the first stage 131 to correct the orientation of the wafer 2 (step T009); the positioning device 13 completes the orientation positioning of the wafer 2, and the transport device 11 transfers the wafer 2 to the detection device 14 (step T011); adjust the orientation of the wafer 2 by moving and / or rotating the first stage 131 (step T013); determine whether the time taken for the first stage 131 to adjust the wafer 2 by rotation is within the preset value range (step T015); if the positioning device 13 fails to position the wafer 2, the transport device 11 transfers the wafer 2 to the storage device 12 and calibrates the transfer deviation of the transport device 11 (step T017).

[0104] In some examples, in step T001, the transport device 11 can transfer the wafer 2 to the first stage 131. Thus, the first stage 131 can support and fix the wafer 2, allowing the positioning device 13 to adjust the orientation of the wafer 2.

[0105] In some examples, the first stage 131 can fix the wafer 2 by negative pressure adsorption, and during the process of transferring the wafer 2 to the positioning device 13, there can be an overlap time between the negative pressure adsorption applied to the wafer 2 by the transport device 11 and the negative pressure adsorption applied to the wafer 2 by the first stage 131. In this case, the first stage 131 can fix the wafer 2 by negative pressure adsorption, which helps to protect the surface of the wafer 2 from damage and meets the clean working environment requirements of the wafer measurement system 1. At the same time, through a preset mechanism, there can be a preset overlap time between the negative pressure adsorption applied to the wafer 2 by the transport device 11 and the negative pressure adsorption applied to the wafer 2 by the first stage 131. In other words, when the transport device 11 transfers the wafer 2 to the first stage 131, the first stage 131 can first adsorb and fix the wafer 2. Then, the transport device 11 releases negative pressure to exert an adsorption force on the wafer 2, so that the wafer 2 is completely adsorbed and fixed by the negative pressure of the first stage 131. Thus, when the transport device 11 transfers the wafer 2 and places it on the first stage 131, the wafer 2 can be prevented from undergoing a large displacement deviation. This ensures that the position of the wafer 2 on the first stage 131 meets the field of view requirements of the first vision device 132, thereby facilitating the positioning device 13 to quickly find the first positioning mark 21 and perform attitude positioning of the wafer 2 based on the first positioning mark 21.

[0106] In some examples, the first stage 131 has a specific air cavity, thereby enabling the wafer 2 to be fixed by negative pressure adsorption.

[0107] In some examples, step T003 may be performed after step T001.

[0108] In some examples, in step T003, the first vision device 132 acquires an orientation image of the wafer 2 on the first stage 131. Thus, the first analysis device 132 is able to extract the contour of the wafer 2 on the first stage 131.

[0109] See in some examples Figure 5A The first vision device 132 may include a camera 1321 facing the wafer 2 and a dual telecentric lens 1322. In this case, by using the dual telecentric lens 1322, perspective error can be reduced, and it has high resolution, high contrast, large depth of field, and low distortion performance. It can maintain consistent magnification within the depth of field range, thereby improving the detection accuracy of wafer 2 attitude positioning, while the camera can acquire attitude images of the wafer 2.

[0110] In some examples, the positioning device 13 may include a surface light source 1323. The wafer 2 may be positioned between the dual telecentric lenses 1322 and the surface light source 1323. The surface light source 1323 may be located on the back of the wafer 2, providing backlight illumination to the wafer 2. Thus, the surface light source 1323 can clearly display the outline of the wafer 2, and the positioning device 13 can quickly and accurately identify the outline of the wafer 2 and the first positioning mark 21. Consequently, the positioning device 13 can quickly and accurately complete the orientation comparison of the wafer 2 and complete the orientation positioning of the wafer 2.

[0111] In some examples, step T005 may be performed after step T003.

[0112] In some examples, in step T005, the first analysis device extracts the outline of wafer 2 and compares it with the first standard template. In this case, the first analysis device can compare the outline of wafer 2 obtained by the first vision device 132 with the first standard template, thereby being able to locate the first positioning mark 21.

[0113] In some examples, step T007 may be performed after step T005.

[0114] In some examples, in step T007, it is determined whether the first positioning mark 21 is within the field of view of the first vision device 132. In this case, the first analysis device can determine whether the first positioning mark 21 is within the field of view of the first vision device 132. If the first analysis device determines that the first positioning mark 21 is not within the field of view of the first vision device 132, it means that the wafer 2 image acquired by the first vision device 132 does not meet the comparison requirements, and it is necessary to adjust the movement and / or rotation of the first stage 131 so that the first positioning mark 21 appears within the field of view of the first vision device 132, thereby enabling the first analysis device to obtain a contour image of the wafer 2 with the first positioning mark 21.

[0115] In some examples, the judgment conclusion of step T007 can be "yes", that is, the first positioning mark 21 can be within the field of view of the first vision device 132. After step T007, step T009 can be executed.

[0116] In some examples, in step T009, the first analysis device extracts the first positioning mark 21 and analyzes and calculates the relative deviation between the first positioning mark 21 and the first standard template. Based on the aforementioned relative deviation, the positioning device 13 corrects the orientation of the wafer 2 by moving and / or rotating the first stage 131. In this case, the positioning device 13 can move and / or rotate the first stage 131 based on the relative deviation between the first positioning mark 21 and the first standard template, thereby changing the orientation of the wafer 2 so that the relative deviation between the first positioning mark 21 and the first standard template meets the preset accuracy requirements, thus completing the orientation positioning of the wafer 2, i.e., coarse positioning.

[0117] In some examples, the process by which positioning device 13 performs coarse positioning of wafer 2 based on the first positioning identifier 21 and the first standard template can be found in [reference needed]. Figure 5C and 5D . Figure 5C and Figure 5D The solid line represents wafer 2a, which is the wafer 2 to be tested located on the first stage 131. The dashed line represents wafer 2b, which is the wafer 2 located in the first standard template in the first analysis device. Figure 5C As shown, the orientation of wafer 2a cannot yet match the first standard template. Positioning device 13 continues to move and / or rotate the first stage 131, enabling the orientation of wafer 2a to match the orientation of wafer 2a in the first standard template and meet preset accuracy requirements. Figure 5D As shown, this completes the coarse positioning. The details are for clarity and ease of representation in the diagram. Figure 5D The shape of wafer 2b, represented by the dashed line, is larger than that of wafer 2a, represented by the solid line. In fact, the size and shape of wafer 2a and wafer 2b can be the same.

[0118] In some examples, the positioning device 13 can move the first stage 131 to align the wafer 2 mounted on the first stage 131 with the first standard template. In this case, when the positioning device 13 performs coarse positioning on the wafer 2, the first stage 131 can continuously adjust the orientation of the wafer 2, so that the first vision device 132 can acquire images of the wafer 2 in different orientations on the first stage 131. The first analysis device can compare the images of the wafer 2 in different orientations with the first standard template to determine whether the first positioning mark 21 of the wafer 2 matches the first positioning mark 21 on the first standard template. Thus, the orientation of the wafer 2 on the first stage 131 can match the first standard template, meeting the preset accuracy requirements.

[0119] In some examples, the positioning device 13 may include a first drive mechanism 133, which can drive the first stage 131 to move along a first direction and / or a second direction, or rotate along a third direction. In this case, when the positioning device 13 performs orientation positioning on the wafer 2, the first drive mechanism 133 can drive the first stage 131 to continuously adjust the orientation of the wafer 2, thereby enabling the first positioning mark 21 of the wafer 2 to match with the first positioning mark 21 on the first standard template. Thus, the orientation of the wafer 2 on the first stage 131 and the orientation of the wafer 2 in the first standard template can meet the preset accuracy requirements.

[0120] In some examples, step T011 may be performed after step T009.

[0121] In some examples, in step T011, the positioning device 13 completes the orientation positioning of the wafer 2, and the transport device 11 transfers the wafer 2 to the inspection device 14. Thus, the transport device 11 is able to transfer the orientation-adjusted wafer 2 to the inspection device 14.

[0122] In some examples, the judgment conclusion of step T007 can be "no", that is, the first positioning mark 21 may not be within the field of view of the first vision device 132. After step T007, step T013 can be executed.

[0123] In some examples, in step T013, the orientation of the wafer 2 is adjusted by moving and / or rotating the first stage 131. This allows the first stage 131 to be continuously moved or rotated along the first and / or second directions, or along a third direction, so that the first positioning mark 21 of the wafer 2 is within the field of view of the first vision device 132, thereby enabling the action of step T009.

[0124] In some examples, step T015 may be performed after step T013.

[0125] In some examples, in step T015, it is determined whether the time for adjusting the orientation of wafer 2 is within a preset range. In this case, if the time for adjusting the orientation of wafer 2 exceeds the preset range, the wafer measurement system 1 may have a deviation. In particular, when the handling device 11 transfers wafer 2 to the positioning device 13, the position of wafer 2 placed on the first stage 131 by the handling device 11 may differ significantly from the preset position, exceeding the range that the first stage can move or rotate. Therefore, by setting step T015, the wafer measurement system 1 can determine whether it is necessary to check for system faults or perform calibration, thereby improving the efficiency and accuracy of the positioning device 13 in positioning the orientation of wafer 2.

[0126] In some examples, the judgment conclusion of step T015 can be "yes", and step T005 can be executed after step T015. In this case, if the time for adjusting the orientation of wafer 2 by moving and / or rotating the first stage 131 is within a preset value range, step T005 can continue to be executed so that the first analysis device can continue to extract the outline of wafer 2 and compare it with the first standard template.

[0127] In some examples, the judgment conclusion of step T015 can be "no", and step T017 can be executed after step T015. In this case, if the time for adjusting the attitude of the wafer 2 by moving and / or rotating the first stage 131 exceeds the preset value range, the wafer measurement system 1 executes step T017 according to the preset mechanism.

[0128] In some examples, in step T017, the positioning device 13 fails to position the wafer 2, and the transport device 11 transfers the wafer 2 to the storage device 12 to calibrate the transport device 11's transfer deviation. In this case, when the transport device 11 transfers the wafer 2 to the first stage 131 of the positioning device 13, a large deviation occurs, exceeding the range of motion of the first stage 131 that can move along the first direction and / or the second direction, or rotate along the third direction. By calibrating the movement deviation of the transport device 11, the transport device 11 can meet the preset accuracy requirements when transferring the wafer 2 to the first stage 131, thereby ensuring that the wafer 2 is within the field of view of the first vision device 132, thus quickly completing the coarse positioning of the wafer 2.

[0129] In some examples, the first analysis device may also have OCR (Optical Character Recognition) capabilities, which can identify the identity character information on wafer 2. Therefore, after measuring multiple wafers 2, a measurement record can be generated, facilitating the analysis of the measurement results for the corresponding wafer 2.

[0130] In some examples, the positioning device 13 may include a coaxial light source 1324, which may face the side of the wafer 2 containing the identification character information. In this case, the light from the coaxial light source 1324 is parallel to the optical axis of the camera 1321, reflecting the location of the identification character information back to obtain a bright feature. This contrast between light and dark highlights the features of the identification character information, thereby facilitating the camera 1321 to accurately locate and acquire the identification character information on the wafer 2. Consequently, the first analysis device can accurately identify the identification character information on the wafer 2.

[0131] Figure 6A This is a schematic diagram showing the detection device 14 involved in this embodiment example.

[0132] In this embodiment, after the positioning device 13 completes the orientation positioning of the wafer 2, the transport device 11 can transfer the wafer 2, which has completed the orientation positioning, to the testing device 14 in the adjusted orientation to complete the measurement of the wafer 2.

[0133] To better explain the detection device 14 involved in this embodiment, a fourth direction, a fifth direction, and a sixth direction are defined in this embodiment. The fourth and fifth directions are parallel to the bearing surface of the second stage 141 (described later) that carries the wafer 2. Movement of the second stage 141 along the fourth and / or fifth directions means that the second stage 141 moves horizontally along the fourth and / or fifth directions. The sixth direction can be a clockwise or counterclockwise direction located on the bearing surface of the second stage 141.

[0134] See Figure 6AThe fourth direction could be Figure 6A The fifth direction, as shown in the figure, can be parallel to the X-axis. The sixth direction can be a direction of rotation around the Z-axis, the central axis of the second stage 141, as shown in the figure. The X, Y, and Z axes are all perpendicular to each other. It should be noted that movement along the fourth direction described in this embodiment refers to reciprocating movement along the fourth direction, not specifically movement along only one direction. Similarly, movement along the fifth direction refers to reciprocating movement along the fifth direction, and rotation along the sixth direction refers to bidirectional rotation around the Z-axis, the central axis of the second stage 141. This embodiment is not limited to the fourth and fifth directions. Figure 6A The X and Y axes shown may be interpreted differently by those skilled in the art, but the fourth and fifth directions need to be parallel to the bearing surface on which the wafer 2 is placed on the second stage 141.

[0135] In some examples, the inspection device 14 may include a second stage 141 that carries and fixes the wafer 2, a second vision device 142 facing the second stage 141, a second analysis device storing a second standard template, and a second drive mechanism 143 that can drive the second stage 141 to move along a fourth and / or fifth direction, or rotate along a sixth direction. In this case, when the transport device 11 transfers the wafer 2, after coarse positioning, from the positioning device 13 to the second stage 141, the wafer 2 can be placed on the second stage 141 in an adjusted coarse positioning posture. Considering that the transport device 11 will have a certain deviation during the transfer of the wafer 2, the inspection device 14 can perform precise positioning of the wafer 2, that is, fine positioning. The second vision device 142 first acquires an image of the wafer 2 on the second stage 141. Based on the relative positional relationship between the first positioning mark 21 and the second positioning mark 22, it can quickly locate the second positioning mark 22. The second analysis device can compare the image of the wafer 2 acquired by the second vision device 142 with a second standard template. The second standard template can be an image of the wafer 2 on the second stage 141 that meets the preset positional requirements. Thus, by comparison, the second analysis device can determine the relative positional deviation between the second positioning mark 22 of the wafer 2 on the second stage 141 and the second positioning mark 22 on the second standard template. Based on the aforementioned relative positional deviation, the detection device 14 can operate the second drive mechanism 143 to drive the second stage 141 along... The wafer 2 can be moved in the fourth and / or fifth directions or rotated along the sixth direction to precisely adjust its orientation on the second stage 141. When the relative position deviation between the second positioning mark 22 of the wafer 2 on the second stage 141 and the second positioning mark 22 on the second standard template meets the preset accuracy requirements, the detection device 14 completes the precise positioning of the wafer 2 on the second stage 141. In the above-mentioned fine positioning process, the second positioning mark 22 can be a symbol with extremely high precision on the wafer 2, so the fine positioning accuracy based on the second positioning mark 22 is extremely high. Then, the second vision device 142 can quickly and accurately find the preset measurement point 23 on the wafer 2 based on the first positioning mark 21, and then the detection device 14 can quickly and accurately complete the measurement of the wafer 2.

[0136] In some examples, the second analysis device and the second vision device 142 may be communicatively connected. Thus, the second analysis device is able to obtain the attitude image of the wafer 2 on the second stage 141 acquired by the second vision device 142.

[0137] To better illustrate the procedures of testing equipment 14, Figure 6B This is a schematic diagram illustrating the process of the testing equipment 14 involved in this embodiment example.

[0138] See in some examples Figure 6B The process of the inspection equipment 14 may include: the transport equipment 11 transferring the wafer 2 to the second stage 141 (step Y001); the second vision device 142 acquiring the posture image of the wafer 2 on the second stage 141 (step Y003); the second analysis device extracting the second positioning mark 22 from the image of the wafer 2 and comparing it with the second positioning mark 22 in the second standard template (step Y005); the second analysis device analyzing and calculating the relative position deviation between the second positioning mark 22 of the wafer 2 on the second stage 141 and the second positioning mark 22 in the second standard template (step Y007); the second drive mechanism 143 moving and / or rotating the second stage 141 to correct the posture of the wafer 2 and complete the precise positioning of the wafer 2 on the second stage 141 (step Y009); the inspection equipment 14 measuring the preset measurement points 23 on the wafer 2, and after the measurement is completed, the transport equipment 11 transferring the wafer 2 to the storage device 12 (step Y011).

[0139] In some examples, in step Y001, the transport device 11 can transfer the wafer 2 to the second stage 141. Thus, the second stage 141 can support and fix the wafer 2, thereby changing the orientation of the wafer 2 to facilitate measurement of the wafer 2 by the inspection device 14.

[0140] Figure 7 This is a schematic diagram showing the relative coordinates of the wafer 2c, which has been coarsely positioned, and the wafer 2d, which has been transferred to the testing device 14, according to the example of this embodiment.

[0141] In some examples, the wafer 2c, which has already undergone coarse positioning, and the wafer 2d, which is transferred to the inspection device 14, have a predetermined relative position. See [link to relevant documentation]. Figure 7 For example, in a preset three-dimensional coordinate system, the coordinates of the wafer 2c that has completed coarse positioning can be (X, Y, Z), and the coordinates of the wafer 2d transferred to the inspection device 14 can be (X+Δx, Y+Δy, Z+Δz), where Δx, Δy, and Δz can be preset values. In this case, when transferring the wafer 2c that has completed coarse positioning from the positioning device 13 to the inspection device 14, the transport device 11 can accurately place the wafer 2c at a preset position on the second stage 141, i.e., the position of the wafer 2d, based on the preset relative position between the wafer 2c that has completed coarse positioning and the wafer 2d transferred to the inspection device 14. At the same time, it is also convenient to correct and compensate for the movement deviation of the transport device 11 based on the above-mentioned preset relative position. Thus, the transport device 11 can quickly and accurately transfer the wafer 2c from the positioning device 13 to the inspection device 14.

[0142] In some examples, the second stage 141 can fix the wafer 2 by negative pressure adsorption, and during the transfer of the wafer 2 to the inspection device 14, there is an overlap time between the negative pressure adsorption applied to the wafer 2 by the transport device 11 and the negative pressure adsorption applied to the wafer 2 by the second stage 141. In this case, the second stage 141 can fix the wafer 2 by negative pressure adsorption, which helps to protect the surface of the wafer 2 from damage and meets the cleanliness requirements of the wafer measurement system 1. At the same time, through a preset mechanism, there can be a preset overlap time between the negative pressure adsorption applied to the wafer 2 by the transport device 11 and the negative pressure adsorption applied to the wafer 2 by the second stage 141. In other words, when the transport device 11 transfers the wafer 2 to the second stage 141, the second stage 141 can first adsorb and fix the wafer 2. Then the transport device 11 releases negative pressure to exert an adsorption force on the wafer 2, so that the wafer 2 is completely adsorbed and fixed by the negative pressure of the second stage 141. Thus, when the transport device 11 transfers the wafer 2 and places it on the second stage 141, the wafer 2 can be prevented from undergoing a large displacement deviation, so that the wafer 2 can be placed on the second stage 141 in the adjusted posture. This makes it easier for the testing device 14 to quickly and accurately locate the wafer 2, and then quickly and accurately find the preset measurement point 23 on the wafer 2 for measurement.

[0143] In some examples, step Y003 may be performed after step Y001.

[0144] In some examples, in step Y003, the second vision device 142 can acquire an attitude image of the wafer 2 on the second stage 141. Therefore, the second analysis device 142 can quickly extract an image of the second positioning mark 22 of the wafer 2 based on the relative position of the first positioning mark 21 and the second positioning mark 22.

[0145] In some examples, step Y005 may be performed after step Y003.

[0146] In some examples, in step Y005, the second analysis device can extract the second positioning mark 22 from the wafer 2 image and compare it with the second positioning mark 22 in the second standard template. In this case, the second analysis device can analyze the wafer 2 image acquired by the second vision device 142, quickly locate the second positioning mark 22 based on the relative positions of the first positioning mark 21 and the second positioning mark 22, and compare the position of the second positioning mark 22 in the wafer 2 with the position of the second positioning mark 21 in the second standard template. Thus, the deviation between the relative position of the wafer 2 on the second stage 141 and the second standard template can be determined.

[0147] In some examples, step Y007 may be performed after step Y005.

[0148] In some examples, in step Y007, the second analysis device can analyze and calculate the relative positional deviation between the second positioning mark 22 of the wafer 2 on the second stage 141 and the second positioning mark 22 in the second standard template. Therefore, based on the obtained deviation, the second stage 141 can adjust the orientation and position of the wafer 2 on the second stage 141 to achieve precise positioning, ensuring that the relative position of the wafer 2 on the second stage 141 matches the preset accuracy requirements with the second standard template. This facilitates the detection device 14 in quickly and accurately locating the preset measurement point 23 on the wafer 2 and completing the measurement.

[0149] In some examples, step Y009 may be performed after step Y007.

[0150] In some examples, in step Y009, the second drive mechanism 143 moves and / or rotates the second stage 141 to correct the orientation of the wafer 2, completing the precise positioning of the wafer 2 on the second stage 141. In this case, the second stage 144 can adjust the orientation position of the wafer 2 on the second stage 141 based on the deviation obtained in step Y007, completing the precise positioning so that the relative position of the wafer 2 on the second stage 141 matches the second standard template to meet the preset accuracy requirements. This facilitates the detection device 14 to quickly and accurately find the preset measurement point 23 on the wafer 2 based on the first positioning mark 21 and complete the measurement.

[0151] In some examples, the second drive mechanism 143 can be a marble linear motor platform. Therefore, the second drive mechanism 144 can possess high stability, high reliability, and high response speed, thereby improving the measurement accuracy of the wafer measurement system 1.

[0152] In some examples, step Y011 may be performed after step Y009.

[0153] In some examples, in step Y011, the detection device 14 measures the preset measurement points 23 on the wafer 2. After the measurement is completed, the transport device 11 transfers the wafer 2 to the storage device 12. Thus, the measurement of the next wafer 2 can begin.

[0154] In some examples, the inspection device 14 may include a white light interferometer for measuring the critical dimensions and overlay dimensions of the wafer 2.

[0155] In some examples, the detection device 14 may include a vibration damping device 144. In some examples, the vibration damping device 144 may be an air-bearing vibration damper. In this case, the vibration damping device 145 can reduce the impact of vibrations transmitted from the wafer measurement system 1 itself or from the outside on the measurement, thereby improving the measurement accuracy of the wafer measurement system 1.

[0156] In some examples, the wafer metrology system 1 may also include a temperature and humidity sensor, an ion fan, and a dust removal device. In this case, the temperature and humidity sensor can monitor the temperature and humidity parameters of the wafer metrology system 1 during operation, the ion fan can reduce the impact of static electricity on the wafer metrology system 1, and the dust removal device can reduce the impact of dust on the wafer metrology system 1. Thus, a good working environment can be provided for the wafer metrology system 1 to improve measurement accuracy.

[0157] Various embodiments of the invention have been described above in detail. Although these descriptions directly depict the above embodiments, it should be understood that modifications and / or variations to the specific embodiments shown and described herein will occur to those skilled in the art. Any such modifications or variations falling within the scope of this specification are also intended to be included herein. Unless specifically indicated, the inventors intend that the words and phrases in the specification and claims be given the common and customary meaning to those skilled in the art.

[0158] The above description of various embodiments of the invention known to the applicant at the time of filing this application is intended for illustrative and descriptive purposes. This description is not intended to be exhaustive, nor does it limit the invention to the exact forms disclosed, and many modifications and variations can be made based on the foregoing teachings. The described embodiments are intended to explain the principles of the invention and its practical application, and to enable others skilled in the art to utilize the invention in various embodiments and with various modifications suitable for the intended particular use. Therefore, the invention is not intended to be limited to the specific embodiments disclosed for implementing the invention.

[0159] While specific embodiments of the invention have been shown and described, it will be apparent to those skilled in the art that variations and modifications can be made based on the teachings of the invention without departing from the invention and its broader aspects, and therefore the appended claims are intended to cover all such changes and modifications within the true spirit and scope of the invention. Those skilled in the art will understand that, in general, the terminology used in this invention is intended to be “open” terminology (e.g., the term “comprising” should be interpreted as “including but not limited to”, the term “having” should be interpreted as “at least having”, the term “comprising” should be interpreted as “including but not limited to”, etc.).

Claims

1. A wafer measurement system, characterized in that: It includes storage equipment, positioning equipment, testing equipment, and wafer handling equipment for transferring wafers between the storage equipment, the positioning equipment, and the testing equipment. The storage device is used to place the wafer, and the wafer has a first positioning mark and a second positioning mark, with a preset relative position between the first positioning mark and the second positioning mark; The transport device transfers the wafer to the positioning device, and the positioning device has a first vision device facing the wafer. The first vision device acquires a first image of the wafer. The positioning device performs attitude positioning on the wafer based on the first image and the first positioning mark. The attitude positioning includes comparing the attitude of the wafer located in the positioning device with a preset wafer attitude in the positioning device and ensuring that the matching between the wafer attitude and the preset wafer attitude meets a preset accuracy requirement. The transport device transports the wafer, which has been positioned according to its orientation, to the detection device. Based on the preset relative position between the first and second positioning markers, the second positioning marker is located. The detection device accurately positions the wafer after orientation positioning based on the second positioning marker and measures the accurately positioned wafer. The transport device, the positioning device, and the detection device all fix the wafer by negative pressure adsorption. During the transfer of the wafer, there is an overlap time between the negative pressure adsorption applied by the transport device and the negative pressure adsorption applied by the positioning device and the detection device.

2. The wafer measurement system according to claim 1, characterized in that: The positioning device includes a first stage for supporting and fixing the wafer, a first vision device facing the first stage, and a first analysis device storing a first standard template. The first vision device acquires a first image of the wafer supported on the first stage, and the first analysis device compares the first image with the first standard template to perform attitude positioning of the wafer supported on the first stage.

3. The wafer measurement system according to claim 2, characterized in that: The positioning device moves the first stage to align the wafer mounted on the first stage with the first standard template.

4. The wafer measurement system according to claim 2 or 3, characterized in that: The positioning device includes a first driving mechanism, which drives the first platform to move along a first direction and / or a second direction, or to rotate along a third direction.

5. The wafer measurement system according to claim 2, characterized in that: The first stage fixes the wafer by negative pressure adsorption, and during the process of the wafer being transferred to the positioning device, there is an overlap time between the negative pressure adsorption applied to the wafer by the handling device and the negative pressure adsorption applied to the wafer by the first stage.

6. The wafer measurement system according to claim 2, characterized in that: The detection equipment includes a second stage that supports and fixes the wafer, a second vision device facing the second stage, a second analysis device storing a second standard template, and a second drive mechanism that drives the second stage to move along a fourth and / or a fifth direction, or to rotate along a sixth direction.

7. The wafer measurement system according to claim 6, characterized in that: The testing equipment includes vibration damping devices.

8. The wafer measurement system according to claim 6, characterized in that: The wafer measurement system also includes temperature and humidity sensors, ion fans, and dust removal equipment.

9. The wafer measurement system according to claim 6, characterized in that: The second stage fixes the wafer by negative pressure adsorption, and during the process of the wafer being transferred to the detection device, there is an overlap time between the negative pressure adsorption applied to the wafer by the handling device and the negative pressure adsorption applied to the wafer by the second stage.

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