Mini LED display screen manufacturing process and mini LED display screen

Abstract

This invention discloses a Mini LED display manufacturing process and a Mini LED display screen. The process includes the following steps: fabricating a large-format Mini LED display glass substrate; cutting the large-format Mini LED display glass substrate into small pieces and attaching an ACF (Anti-Coating Fluid) to the copper pads on the glass substrate; bonding LED chips to the display glass substrate; wherein, after the metal pattern is fabricated, laser drilling is used to obtain hole patterns on the glass substrate, and copper is deposited within the hole patterns. By integrating LEDs, transistors, and energy storage capacitors together to fabricate circular LED chips, and using laser drilling to obtain hole patterns on the glass substrate and depositing copper within the hole patterns, a Mini LED display screen with better display performance can be obtained by fabricating simple metal lines on the glass substrate, without the need for a large-scale TFT (Thin-Film Transformer) production line for glass substrate fabrication, thus reducing production costs.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display screens, and in particular to a Mini LED display screen manufacturing process and a Mini LED display screen. BACKGROUND

[0002] TFT (Thin Film Transistor) liquid crystal display screen refers to a thin film transistor liquid crystal display screen. The so-called thin film transistor refers to the fact that each liquid crystal pixel point on the liquid crystal display is driven by a thin film transistor integrated behind it. Thus, high-speed, high-brightness, and high-contrast display screen information can be achieved. In the production of glass substrates for TFT liquid crystal display screens, as in Chinese patent application CN 113675222 A, transistors and energy storage capacitors need to be produced on the glass substrate, and the product process is complex, with huge investment costs.

[0003] Mini LED is an LED device with a chip size of 50-200 pm: a unit composed of a Mini LED pixel array and a driving circuit with a pixel center spacing of 0.3-1.5 mm. Due to its advantages of power saving, long service life, high brightness, and high contrast, Mini LED display screens have become feasible. SUMMARY

[0004] Existing TFT liquid crystal display screen products have complex processes and high investment costs.

[0005] To solve the above problems, a Mini LED display screen manufacturing process and a Mini LED display screen are proposed. By integrating and packaging LED lamps, transistors, and energy storage capacitors together to produce circular LED lamp crystals, laser drilling is used to obtain a hole pattern on the glass substrate, and metal copper is deposited in the hole pattern. Only a simple metal circuit needs to be produced on the glass substrate to obtain a Mini LED display screen with better display performance, without the need for a TFT factory line to produce glass substrates, thereby reducing the production cost.

[0006] In a first aspect, a Mini LED display screen manufacturing process includes:

[0007] Step 100, producing a large-plate Mini LED display screen glass substrate;

[0008] Step 200, cutting the large-plate Mini LED display screen glass substrate into small particles, and attaching ACF to the copper pad position of the glass substrate;

[0009] Step 300, binding the LED lamp crystal to the display screen glass substrate;

[0010] The step 100 comprises:

[0011] After the step 110, a hole pattern is obtained by laser drilling on the glass substrate, and the step of depositing copper is performed in the hole pattern.

[0012] In the first possible implementation of the Mini LED display screen manufacturing process, the step 110 comprises:

[0013] The step 111 comprises:

[0014] The step 112 comprises:

[0015] The step 113 comprises:

[0016] The diameter of the hole in the hole pattern is 0.03 mm, and the diameter of each copper pad is 0.3 mm.

[0017] In the second possible implementation of the first possible implementation of the present application, the step 100 further comprises:

[0018] The step 120 comprises:

[0019] The step 130 comprises:

[0020] The step 140 comprises:

[0021] In the third possible implementation of the second possible implementation of the present application, the step 100 further comprises:

[0022] The step 150 comprises:

[0023] In the fourth possible implementation of the third possible implementation of the present application, the step 200 comprises:

[0024] The step 210 comprises:

[0025] The step 220 comprises:

[0026] Step 230, replace the PE protective film on the back of the substrate with a high-temperature-resistant PET protective film, and remove the PE protective film on the front of the substrate;

[0027] Step 240, corresponding ACF is attached on the copper pad pattern on the front of the substrate.

[0028] In combination with the fourth possible embodiment of the present application, in the fifth possible embodiment, the step 300 comprises:

[0029] Step 310, integrate the LED lamp, transistor and energy storage capacitor together to make a circular LED lamp die;

[0030] Step 320, cut the circular LED lamp die into a square LED lamp die;

[0031] Step 330, splice the square LED lamp die to meet the substrate size;

[0032] Step 340, bind the spliced LED lamp die with the Mini LED display screen glass substrate.

[0033] In combination with the fifth possible embodiment of the present application, in the sixth possible embodiment, the step 300 further comprises:

[0034] Step 350, after binding, attach an optical film on the front of the Mini LED display screen glass substrate;

[0035] Step 360, remove the PET protective film on the back of the substrate and position and attach ACF for binding of the gate layer and IC.

[0036] In combination with the sixth possible embodiment of the present application, in the seventh possible embodiment, the method further comprises:

[0037] Step 400, glue the four corners of the LED lamp die and the Mini LED display screen glass substrate to seal.

[0038] Secondly, a Mini LED display screen is made by using the method of the first aspect, which comprises:

[0039] A glass substrate;

[0040] An LED lamp die;

[0041] The LED lamp die is bound on the glass substrate to obtain a Mini LED display screen;

[0042] The glass substrate comprises:

[0043] A molybdenum-aluminum-molybdenum metal pattern;

[0044] Hole pattern;

[0045] Copper pad pattern;

[0046] The molybdenum-aluminum-molybdenum metal pattern includes:

[0047] Metallic patterns for the GND and DATA layers made of molybdenum-aluminum-molybdenum materials;

[0048] Metallic patterns in the VLED and SIG layers made of molybdenum-aluminum-molybdenum materials;

[0049] The hole pattern is as follows:

[0050] The metal pattern was obtained by laser drilling on the glass substrate;

[0051] Patterns used for the deposition of metallic copper;

[0052] The pattern of the copper pad is as follows:

[0053] The hole pattern is disposed on the front side of the substrate;

[0054] And it is bonded to the copper metal in the hole pattern;

[0055] The LED chip is:

[0056] A circular LED chip is made by integrating LED light, transistor, and energy storage capacitor into a single package.

[0057] The circular LED chip is cut into square LED chips;

[0058] It is made up of multiple square LED chips spliced ​​together.

[0059] In conjunction with the Mini LED display described in the second aspect, in a first possible implementation, the aperture in the hole pattern is 0.03 mm, and the diameter of each copper pad is 0.3 mm.

[0060] The Mini LED display manufacturing process and Mini LED display described in this invention integrate LED lamps, transistors, and energy storage capacitors into a circular LED chip. A hole pattern is obtained by laser drilling on a glass substrate, and copper is deposited in the hole pattern. A Mini LED display with better display performance can be obtained by simply making metal lines on the glass substrate, without the need for a huge investment in TFT factory lines to make the glass substrate, thus reducing production costs. Attached Figure Description

[0061] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0062] Figure 1 This is a first schematic diagram of a Mini LED display manufacturing process according to the present invention;

[0063] Figure 2 This is a second schematic diagram of a Mini LED display manufacturing process according to the present invention;

[0064] Figure 3 This is a third schematic diagram of a Mini LED display manufacturing process in this invention;

[0065] Figure 4 This is a fourth schematic diagram of a Mini LED display manufacturing process in this invention;

[0066] Figure 5 This is the fifth schematic diagram of a Mini LED display manufacturing process in this invention;

[0067] Figure 6 This is the sixth schematic diagram of a Mini LED display manufacturing process in this invention;

[0068] Figure 7 This is a schematic diagram of a Mini LED display screen structure according to the present invention;

[0069] Figure 8 This is a schematic diagram of an LED chip in a Mini LED display screen according to the present invention. Detailed Implementation

[0070] The technical solutions of this invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are all within the scope of protection of this invention.

[0071] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0072] ACF: Anisotropic conductive adhesive.

[0073] Existing TFT LCD screen products have complex manufacturing processes and high investment costs.

[0074] To address the above issues, a Mini LED display manufacturing process and a Mini LED display screen are proposed.

[0075] Example 1

[0076] Firstly, a Mini LED display manufacturing process, such as Figure 1 , Figure 1 This is a first schematic diagram of a Mini LED display manufacturing process according to the present invention; including: step 100, fabricating a large Mini LED display glass substrate; step 200, cutting the large Mini LED display glass substrate into small particles and attaching ACF to the copper pads of the glass substrate; step 300, bonding LED chips to the display glass substrate; wherein, step 100 includes: step 110, after the metal pattern is fabricated, laser drilling is used on the glass substrate to obtain a hole pattern, and copper is deposited in the hole pattern.

[0077] In the manufacturing process of Mini LED display glass substrates, large glass substrates can be made and then cut into smaller glass substrates.

[0078] In some implementations, small glass substrates can be fabricated directly without a cutting process.

[0079] Fabricating the glass substrate for a Mini LED display requires laser drilling to create a hole pattern corresponding to a metal design on the front side of the glass substrate. The holes in the hole pattern are primarily used for the deposition of copper.

[0080] Meanwhile, copper pad patterns corresponding to the hole patterns are also set on the front side of the glass substrate. The hole patterns and copper pad patterns are bound together, that is, each hole corresponds to one copper pad, and the copper pad is bound to the corresponding LED chip to realize the circuit connection. By integrating the LED, transistor, and energy storage capacitor together to produce a circular LED chip, and using laser drilling to obtain the hole patterns on the glass substrate, and then depositing metallic copper in the hole patterns, a Mini LED display with better display performance can be obtained by simply making metal lines on the glass substrate, without having to use the huge investment in TFT factory lines to produce the glass substrate, thus reducing the production cost.

[0081] Example 2

[0082] Before drilling, a metal pattern is created on the glass substrate. Specifically, this can be implemented as follows:Figure 2 , Figure 2 This is a second schematic diagram of a Mini LED display manufacturing process in this invention; Step 120: Use molybdenum-aluminum-molybdenum metal to create a pattern for the GND layer and DATA layer together; Step 130: Use molybdenum-aluminum-molybdenum metal to create a pattern for the VLED layer and SIG layer together; Step 140: After the metal pattern is created, a photoresist protective layer is set on the back and front of the glass substrate.

[0083] The metal patterns are all made of molybdenum-aluminum-molybdenum metal. The metal patterns are made on both the GND layer and the DATA layer, serving as a metal pattern layer on the glass substrate. The metal patterns are also made on both the VLED layer and the SIG layer, serving as another metal pattern layer.

[0084] An insulating layer is provided between the metal pattern layers for insulation.

[0085] After the metal patterns of the two layers are made, photoresist layers are applied to the front and back of the glass substrate for protection.

[0086] In this application, the front side refers to the side closest to the display surface of the screen, and the back side refers to the side closest to the non-display surface of the screen.

[0087] Example 3

[0088] After the two metal patterns mentioned above are set, holes need to be drilled in the glass substrate. Specifically,

[0089] like Figure 3 , Figure 3 This is a third schematic diagram of a Mini LED display manufacturing process in this invention; Step 110 includes: Step 111, making a hole pattern corresponding to the metal pattern on the glass substrate; Step 112, depositing metallic copper in the holes of the hole pattern; Step 113, bonding the deposited metallic copper to the copper pads on the front side; wherein, the hole diameter in the hole pattern is 0.03mm, and the diameter of each copper pad is 0.3mm.

[0090] The hole pattern is set to correspond to the metal pattern. Holes are set at the positions of the glass substrate where the circuit is connected in each metal pattern, so as to deposit copper metal. The deposited copper metal is bonded to the copper pads on the front side of the substrate.

[0091] The aperture is approximately 0.03 mm, and the metal pad is approximately 0.3 mm. Each hole corresponds to a copper pad, forming a copper pad pattern on the front side of the glass substrate.

[0092] After the copper deposition is completed, that is, after the copper pad pattern is bonded to the corresponding hole pattern, the photoresist protective layer is removed.

[0093] Example 4

[0094] After the large glass substrate is fabricated, it enters the cutting process. Specifically...

[0095] like Figure 4 , Figure 4 This is a fourth schematic diagram of a Mini LED display manufacturing process in this invention; Step 200 includes: Step 210, attaching PE protective films to the front and back of the large Mini LED display glass substrate; Step 220, using a diamond cutting wheel to cut the large Mini LED display glass substrate into small particles; Step 230, replacing the PE protective film on the back of the substrate with a high-temperature resistant PET protective film, and removing the PE protective film on the front of the substrate; Step 240, attaching ACF to the copper pad pattern on the front of the substrate accordingly.

[0096] Example 5

[0097] After the cutting process is completed, the next step is to bond the glass substrate to the LED chip. Specifically,

[0098] like Figure 5 , Figure 5 This is a fifth schematic diagram of a Mini LED display manufacturing process in this invention; step 300 includes: step 310, integrating LEDs, transistors, and energy storage capacitors together to fabricate a circular LED chip; step 320, cutting the circular LED chip into square LED chips; step 330, splicing the square LED chips to conform to the substrate size; step 340, bonding the spliced ​​LED chips to the Mini LED display glass substrate.

[0099] Example 6

[0100] After binding, such as Figure 6 , Figure 6 This is a sixth schematic diagram of a Mini LED display manufacturing process in this invention; step 300 further includes: step 350, after bonding, attaching an optical film to the front side of the Mini LED display glass substrate; step 360, removing the PET protective film on the back side of the substrate and positioning and attaching ACF to bond the gate layer and IC.

[0101] Finally, adhesive needs to be applied around the LED chip and the Mini LED display glass substrate to seal them.

[0102] Secondly, such as Figure 7 and 8 , Figure 7 This is a schematic diagram of a Mini LED display screen structure according to the present invention. Figure 8This is a schematic diagram of an LED chip in a Mini LED display screen according to the present invention; a Mini LED display screen is manufactured using the method of the first aspect, comprising: a glass substrate and an LED chip; the LED chip is bonded to the glass substrate to obtain the Mini LED display screen; wherein the glass substrate includes a molybdenum-aluminum-molybdenum metal pattern, a hole pattern, and a copper pad pattern.

[0103] The molybdenum-aluminum-molybdenum metal patterns include: metal patterns for the GND and DATA layers made of molybdenum-aluminum-molybdenum materials, and metal patterns for the VLED and SIG layers made of molybdenum-aluminum-molybdenum materials.

[0104] The metal patterns are all made of molybdenum-aluminum-molybdenum metal. The metal patterns are made on both the GND layer and the DATA layer, serving as a metal pattern layer on the glass substrate. The metal patterns are also made on both the VLED layer and the SIG layer, serving as another metal pattern layer.

[0105] An insulating layer is provided between the metal pattern layers for insulation.

[0106] The hole pattern is a pattern obtained by laser drilling on a glass substrate corresponding to a metal pattern, used for the deposition of metallic copper.

[0107] The copper pad pattern corresponds to the hole pattern, is set on the front side of the substrate, and is bonded to the metallic copper in the hole pattern.

[0108] LED chips are made by integrating LEDs, transistors, and energy storage capacitors into a single package to create a circular LED chip. These circular chips are then cut into square LED chips, and multiple square LED chips are joined together. The aperture in the hole pattern is 0.03mm, and the diameter of each copper pad is 0.3mm.

[0109] The Mini LED display manufacturing process and Mini LED display of the present invention integrate LED lamps, transistors, and energy storage capacitors together to create a circular LED lamp chip. The process involves using laser drilling to obtain hole patterns on a glass substrate and depositing copper metal in the hole patterns. This method only requires the fabrication of simple metal lines on the glass substrate to obtain a Mini LED display with better display performance, without the need for a large-scale TFT factory line to manufacture the glass substrate, thus reducing production costs.

[0110] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A manufacturing process of a Mini LED display screen, characterized in that, The process comprises the following steps: Step 100: manufacturing a large plate Mini LED display screen glass substrate; Step 200: cutting the large plate Mini LED display screen glass substrate into small particles, and attaching ACF to the copper pad position of the glass substrate; Step 300: binding LED lamp dies on the glass substrate, and binding the copper pad with the corresponding LED lamp dies; The step 100 comprises: Step 110: after the metal pattern is manufactured, laser drilling is used on the glass substrate to obtain a hole pattern, and metal copper is deposited in the hole pattern; The step 110 comprises: Step 111: manufacturing a hole pattern corresponding to the metal pattern on the glass substrate; Step 112: depositing metal copper in the holes of the hole pattern; Step 113: binding the deposited metal copper with the copper pad on the front surface of the glass substrate; The diameter of the hole in the hole pattern is 0.03 mm, and the diameter of each copper pad is 0.3 mm; The step 100 further comprises the following steps before the step 110: Step 120: using molybdenum-aluminum-molybdenum metal to pattern the GND layer and the DATA layer together; Step 130: using molybdenum-aluminum-molybdenum metal to pattern the VLED layer and the SIG layer together; Step 140: after the metal pattern is manufactured, a photoresist protection layer is arranged on the back surface and the front surface of the glass substrate; The step 100 comprises the following steps after the step 110: Step 150: after the metal copper deposition is completed, the photoresist protection layer is removed; The step 200 comprises: Step 210: attaching a PE protective film on the front surface and the back surface of the large plate Mini LED display screen glass substrate; Step 220: cutting the large plate Mini LED display screen glass substrate into small particles using a diamond wheel; Step 230: replacing the PE protective film on the back surface of the substrate with a high-temperature-resistant PET protective film, and removing the PE protective film on the front surface of the substrate; Step 240: attaching ACF on the copper pad pattern on the front surface of the substrate; The step 300 comprises: Step 310: integrating an LED lamp, a transistor, and an energy storage capacitor together to manufacture a circular LED lamp die; Step 320: cutting the circular LED lamp die into a square LED lamp die; Step 330: splicing the square LED lamp die to conform to the size of the glass substrate; Step 340: binding the spliced LED lamp die with the Mini LED display screen glass substrate; The step 300 further comprises: Step 350: after the binding is completed, attaching an optical film on the front surface of the Mini LED display screen glass substrate; Step 360: removing the PET protective film on the back surface of the substrate, and attaching ACF for binding the gate layer and the IC.

2. The manufacturing process of a Mini LED display panel according to claim 1, wherein, The process further comprises: Step 400: dispensing glue around the LED lamp die and the Mini LED display screen glass substrate to seal.

3. A Mini LED display screen, which is manufactured by using the manufacturing process of any one of claims 1-2. The process comprises the following steps: A glass substrate; An LED lamp die; Binding the LED lamp die on the glass substrate to obtain a Mini LED display screen; The glass substrate comprises: A molybdenum-aluminum-molybdenum metal pattern; Hole pattern; Copper pad pattern; The molybdenum-aluminum-molybdenum metal pattern comprises: Metal patterns of GND layer and DATA layer made of molybdenum-aluminum-molybdenum material; Metal patterns of VLED layer and SIG layer made of molybdenum-aluminum-molybdenum material; The hole pattern is: Obtained by laser drilling on the glass substrate corresponding to the metal pattern; Pattern for deposition of metal copper; The copper pad pattern is: Disposed on the front side of the substrate corresponding to the hole pattern; And bonded with the metal copper in the hole pattern; The LED lamp die is: A circular LED lamp die is made by integrating an LED lamp, a transistor and an energy storage capacitor together; The circular LED lamp die is cut into a square LED lamp die; A plurality of the square LED lamp dies are spliced together; The hole diameter in the hole pattern is 0.03 mm, and the diameter of each copper pad is 0.3 mm.

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